Fingerprint identification module and electronic device

Abstract

The present disclosure provides a kind of fingerprint identification module and electronic equipment, including fingerprint identification chip, circuit board, connecting line and insulating layer;The connecting line is respectively connected with the fingerprint identification chip and the circuit board signal;The insulating layer covers the connecting line and is attached on the circuit board.The fingerprint identification function of this fingerprint identification module is long-term stable and effective, and the service life is longer.

Description

Technical Field

[0001] This disclosure relates to the field of electronic device technology, and in particular to a fingerprint recognition module and electronic device. Background Technology

[0002] Currently, various electronic devices such as mobile phones, tablets, and computers are equipped with fingerprint recognition functionality. The hardware corresponding to fingerprint recognition is a fingerprint recognition chip. To make electronic devices thinner and lighter and to increase the screen-to-body ratio, the fingerprint recognition chip can be placed under the screen of the electronic device.

[0003] In order for the fingerprint recognition chip to receive fingerprint information from above the screen, the screen auxiliary material above the fingerprint recognition chip needs to be removed, thus exposing the connection between the fingerprint recognition chip and the circuit board to the air.

[0004] During long-term use, the connection between the fingerprint recognition chip and the circuit board is prone to oxidation, which can cause the fingerprint recognition function to fail. Utility Model Content

[0005] In view of this, the present disclosure provides a fingerprint recognition module and electronic device, whose fingerprint recognition function is stable and effective for a long time and has a long service life.

[0006] Specifically, the following technical solutions are included:

[0007] This disclosure provides a fingerprint recognition module, including a fingerprint recognition chip, a circuit board, a connecting wire, and an insulating layer;

[0008] The connecting lines are respectively connected to the fingerprint recognition chip and the circuit board signal;

[0009] The insulating layer covers the connecting wires and is attached to the circuit board.

[0010] Optionally, the circuit board includes a first conductive region, the connecting line is connected to the first conductive region, and the insulating layer at least covers the first conductive region.

[0011] Optionally, the fingerprint recognition chip includes a second conductive region, the connecting line is connected to the second conductive region, and the insulating layer at least covers the second conductive region.

[0012] Optionally, the insulating layer is made of a waterproof and insulating material.

[0013] Optionally, the insulating layer includes at least one of polyethylene terephthalate, polycarbonate, polyvinyl chloride, and polypropylene.

[0014] Optionally, the connecting wire is gold wire.

[0015] Optionally, the module further includes a sealing structure, which is at least partially formed on the insulating layer.

[0016] Optionally, the sealing structure includes at least one of foam, silicone, and rubber.

[0017] Optionally, the thickness of the insulating layer is between 0.01 and 0.03 mm.

[0018] Optionally, the circuit board is a flexible circuit board, and the module further includes a reinforcing sheet, which is attached to the flexible circuit board and / or the fingerprint recognition chip.

[0019] Optionally, the circuit board includes at least two parts located on opposite sides of the fingerprint recognition chip; the number of connecting lines is at least two, each connected to one of the two parts of the circuit board; the number of insulating layers is at least two, each correspondingly covering the connecting lines.

[0020] Secondly, embodiments of this disclosure provide an electronic device including any of the fingerprint recognition modules described above.

[0021] Optionally, the electronic device further includes a mid-frame and a screen, the mid-frame supporting the screen, the fingerprint recognition module being located between the screen and the mid-frame, the screen including a light-transmitting area, and the orthographic projection of the fingerprint recognition module on the screen at least partially overlapping the light-transmitting area.

[0022] Optionally, the mid-frame has a mounting position in which the fingerprint recognition module is mounted.

[0023] This disclosure provides a fingerprint recognition module and an electronic device. In the fingerprint recognition module, the connecting wires used to connect the fingerprint recognition chip to the circuit board are covered by an insulating layer, so that the connecting wires do not come into contact with air and are not easily oxidized, which helps to improve the working life of the fingerprint recognition module, thereby improving the service life of the electronic device and enhancing the user experience. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this disclosure, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 A partial cross-sectional view of a fingerprint recognition module installed in an electronic device, according to related technologies;

[0026] Figure 2This is a schematic diagram of the structure of a fingerprint recognition module provided in an embodiment of the present disclosure;

[0027] Figure 3 This is a schematic diagram of another fingerprint recognition module provided in an embodiment of the present disclosure;

[0028] Figure 4 This is a partial structural schematic diagram of an electronic device provided in an embodiment of the present disclosure.

[0029] The reference numerals in the figure indicate:

[0030] 01-Fingerprint chip; 02-Mid-frame; 03-Screen accessories; 04-OLED; 05-Glass cover; 06-OLED self-emissive light source; 07-Ink area; 08-Display area;

[0031] 1-Fingerprint recognition chip; 101-Second conductive area;

[0032] 2-Circuit board; 21-First conductive area;

[0033] 3-Connecting wire;

[0034] 4-Insulation layer;

[0035] 5-Sealed structure;

[0036] 6-Reinforcing film;

[0037] 10-Fingerprint recognition module; 11-Mid-frame; 111-Mounting position; 12-Screen; 121-Light-transmitting area.

[0038] The accompanying drawings have illustrated specific embodiments of this disclosure, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concepts of this disclosure to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0039] The technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. Based on the embodiments of this disclosure, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this disclosure.

[0040] The directional terms used in the embodiments of this disclosure, such as "up," "down," and "side," are generally based on the relative directional relationships between the structures shown in the figures. These directional terms are used merely to more clearly describe the relationships between the structures, not to describe absolute directions. When the electronic device is placed in different orientations, the orientation may change; for example, "up" and "down" may be interchanged.

[0041] Unless otherwise defined, all technical terms used in the embodiments of this disclosure have the same meaning as commonly understood by one of ordinary skill in the art.

[0042] To make the technical solutions and advantages of this disclosure clearer, the embodiments of this disclosure will be described in further detail below with reference to the accompanying drawings.

[0043] refer to Figure 1 In related technologies, to achieve ultra-thin optical fingerprint recognition, the fingerprint chip 01 is placed below the screen (e.g., including the glass cover 05 and OLED 04), and the screen auxiliary material 03 at the bottom of the screen needs to be removed at the corresponding position of the fingerprint chip 01. Thus, during fingerprint recognition, the light emitted by the OLED self-emissive light source 06, after being reflected by the fingerprint, carries the fingerprint information, penetrates the screen, and reaches the fingerprint chip 01. The orthographic projection of the fingerprint chip 01 on the screen can be positioned between the display area 08 and the ink area 07 of the screen to minimize the occupation of excessive screen operating space. The fingerprint chip 01 can be mounted on the mid-frame 02 to ensure its installation stability. Signal transmission is required between the fingerprint chip 01 and the device CPU. To achieve this signal transmission, the fingerprint chip 01 can be connected to the circuit board via a connecting cable. However, since this connecting cable is completely exposed to the air, corrosion will occur after prolonged operation, causing the fingerprint recognition function to fail.

[0044] In view of the above problems, the first aspect of the present disclosure provides a fingerprint recognition module.

[0045] refer to Figure 3 The fingerprint recognition module includes a fingerprint recognition chip 1, a circuit board 2, a connecting wire 3, and an insulating layer 4;

[0046] Connector 3 is connected to the fingerprint recognition chip 1 and the circuit board 2 respectively;

[0047] The insulating layer 4 covers the connecting wire 3 and is attached to the circuit board 2.

[0048] Combination Figure 2Without employing the solution of this disclosure embodiment, since the screen auxiliary material at the fingerprint recognition module is removed, the connecting wire 3 will be directly exposed to the air. Consequently, the connecting wire 3 may react with oxygen or moisture in the air, causing oxidation and failure. This will lead to the disconnection of communication between the fingerprint recognition chip 1 and the circuit board 2, thus rendering the fingerprint recognition function ineffective.

[0049] In the embodiments disclosed herein, the fingerprint recognition module includes an insulating layer 4. The insulating layer 4 covers the connecting wires and is attached to the circuit board 2. The insulating layer 4 isolates the connecting wires 3 from the air, preventing them from being exposed to air and from being constantly in a high-temperature and high-humidity environment. This ensures that the connecting wires 3 are not easily oxidized and fail, maintains good communication between the fingerprint recognition chip 1 and the circuit board 2, ensures stable recognition function of the fingerprint recognition module, and extends the lifespan of the fingerprint recognition module.

[0050] It should be noted that the circuit board in this embodiment can be an adapter circuit board that connects the fingerprint recognition chip to the main circuit board of the device, or it can be the main circuit board of the device directly.

[0051] In summary, the present disclosure provides a fingerprint recognition module in which the connecting wires for connecting the fingerprint recognition chip to the circuit board are covered by an insulating layer, so that the connecting wires do not come into contact with air and are not easily oxidized, which helps to improve the working life of the fingerprint recognition module, thereby improving the service life of electronic devices and enhancing the user experience.

[0052] In some embodiments, reference Figure 3 The circuit board 2 includes a first conductive area 21, a connecting line 3 is connected to the first conductive area 21, and an insulating layer 4 at least covers the first conductive area 21.

[0053] Combination Figure 2 To facilitate the connection of the connecting wire 3 to the first conductive area 21 on the circuit board 2, at least a portion of the first conductive area 21 connected to the connecting wire 3 needs to be exposed to air along with the connecting wire 3. This makes the first conductive area 21 susceptible to oxidation or corrosion. If the first conductive area 21 oxidizes or corrodes, the communication between the circuit board 2 and the fingerprint recognition chip 1 will be interrupted.

[0054] In this embodiment, the insulating layer 4 also covers at least the first conductive region 21, thus isolating the first conductive region 21 from air and preventing it from being exposed to high temperature and humidity, making it less susceptible to oxidation or corrosion. This makes the fingerprint recognition function of the fingerprint recognition module more stable and effective.

[0055] It should be noted that the "conductive area" in this embodiment is an area used to connect with the connecting line. After being connected through the "conductive area", the connecting line can realize the function of transmitting signals between the fingerprint recognition chip and the circuit board.

[0056] In some embodiments, reference Figure 3 The fingerprint recognition chip 1 includes a second conductive area 101, a connecting line 3 is connected to the second conductive area 101, and an insulating layer 4 at least covers the second conductive area 101.

[0057] Combination Figure 2 To facilitate the connection of the connecting line 3 to the second conductive area 101 on the fingerprint recognition chip 1, at least a portion of the second conductive area 101 connected to the connecting line 3 needs to be exposed to air along with the connecting line 3, making it susceptible to oxidation or corrosion. If the second conductive area 101 oxidizes or corrodes, the communication between the circuit board 2 and the fingerprint recognition chip 1 will also be interrupted.

[0058] In this embodiment, the insulating layer 4 also covers at least the second conductive region 101, thus isolating the second conductive region 101 from air and preventing it from being exposed to high temperature and humidity, making it less susceptible to oxidation or corrosion. This results in a more stable and effective fingerprint recognition function for the fingerprint recognition module.

[0059] In some embodiments, the insulating layer 4 is made of a waterproof and insulating material.

[0060] Based on the above settings, it can be ensured that the connecting cable is isolated from moisture, and the insulating layer will not interfere with the signal of the connecting cable. In this way, the fingerprint signal transmission is not affected, and the fingerprint recognition function is more stable.

[0061] Optionally, the barrier layer 4 includes at least one of polyethylene terephthalate (PET), polycarbonate (PC), polyvinyl chloride (PVC), and polypropylene (PP).

[0062] The above provides some optional materials for the insulating layer, which can ensure good waterproof and insulating performance. Based on the ideas disclosed in the embodiments of this disclosure, those skilled in the art can also choose other materials to form the insulating layer 4, and no specific limitations are made here.

[0063] Optionally, connecting wire 3 is made of gold wire.

[0064] Using gold wire for connector 3 ensures more stable, reliable, and efficient signal transmission between fingerprint chip 1 and circuit board 2, thereby improving the performance of the fingerprint recognition module. Furthermore, the low hardness of gold wire allows it to adapt to different installation requirements.

[0065] It should be noted that, in the embodiments of this disclosure, since the connecting line 3 is covered or wrapped by the insulating layer 3, the material requirements for the connecting line 3 itself can be reduced. For example, even materials that are easily oxidized or not resistant to high humidity environments can be used as connecting lines, thereby reducing the cost of the fingerprint recognition module. The above-described setting of the connecting line 3 as a gold wire is merely an example. Those skilled in the art can also use other materials to prepare the connecting line, and this disclosure does not impose any further limitations on this.

[0066] In some embodiments, reference Figure 3 The module also includes a sealing structure 5, which is at least partially formed on the insulating layer 4.

[0067] Since the screen material at the location of the fingerprint recognition module is removed, without a sealing structure, the screen material in other locations may deteriorate due to air exposure. In this embodiment, the sealing structure 5 can be used to isolate the area where the fingerprint recognition module is located from other components inside the electronic device, thereby ensuring that the screen material in other locations is not affected. Furthermore, the sealing structure is at least partially formed on the isolation layer 4, which can further compress and fix the isolation layer, ensuring a better arrangement of the isolation layer.

[0068] Optionally, the sealing structure 5 includes at least one of foam, silicone, and rubber.

[0069] The aforementioned materials ensure that the sealing structure is waterproof and insulating, guaranteeing its sealing effect and preventing adverse effects on other structures. Those skilled in the art may also select other types of materials, which will not be elaborated upon in this disclosure.

[0070] Optionally, the thickness of the insulating layer 4 is between 0.01 and 0.03 mm. Optionally, the thickness of the insulating layer 4 can be 0.02 mm.

[0071] The aforementioned thickness limit ensures that the insulating layer occupies a small volume while maintaining stable and good waterproof and insulating performance.

[0072] In some embodiments, reference Figure 3 The circuit board 2 is a flexible circuit board, and the module also includes a reinforcing sheet 6, which is attached to the flexible circuit board and / or the fingerprint recognition chip 1. It should be noted that the reinforcing sheet is a high-strength sheet or plate structure. Optionally, the reinforcing sheet may include an epoxy fiberglass cloth laminate with a flame retardant rating of FR-4, a polyimide reinforcing plate, or a steel sheet reinforcing plate.

[0073] Based on the above settings, the overall strength of the flexible circuit board or fingerprint recognition chip can be reinforced by the reinforcing sheet 6 to ensure a more stable arrangement of the flexible circuit board or fingerprint recognition chip.

[0074] In some embodiments, reference Figure 3 The circuit board 2 includes at least two parts located on opposite sides of the fingerprint recognition chip 1; there are at least two connecting lines 3, which are connected to the two parts of the circuit board 2 respectively; there are at least two insulating layers 4, which cover the connecting lines 3 one by one.

[0075] In this embodiment, the circuit board 2 may include at least two parts, allowing for a more flexible arrangement that can be adjusted according to the space requirements of various components within the electronic device, thus improving space utilization efficiency. Simultaneously, at least two connecting lines 3 are included, which can be connected to the two parts of the circuit board 2 respectively. This dual signal transmission ensures the stability of fingerprint signal transmission. The insulating layer 4 covers the connecting lines 3 in a one-to-one correspondence, ensuring that each connecting line 3 is isolated from the air, thus guaranteeing stable and reliable performance of the fingerprint recognition module.

[0076] In summary, the present disclosure provides a fingerprint recognition module in which the connecting wires for connecting the fingerprint recognition chip and the circuit board, as well as the connection points between the connecting wires and the fingerprint recognition chip or the circuit board, are covered or wrapped with an insulating layer. This isolates the connecting wires from the air, making them less susceptible to corrosion and enabling them to work stably for a long time, thus extending the service life of the fingerprint recognition module.

[0077] Secondly, embodiments of this disclosure provide an electronic device including any of the fingerprint recognition modules described above.

[0078] This disclosure provides an electronic device in which the connecting wires for connecting the fingerprint recognition chip to the circuit board in the fingerprint recognition module are covered by an insulating layer. As a result, the connecting wires are not exposed to air and are not easily oxidized, which helps to improve the working life of the fingerprint recognition module, thereby improving the service life of the electronic device and enhancing the user experience.

[0079] Optional, see reference Figure 4 The electronic device also includes a mid-frame 11 and a screen 12. The mid-frame 11 supports the screen 12. The fingerprint recognition module 10 is located between the screen 12 and the mid-frame 11. The screen 12 includes a light-transmitting area 121. The orthographic projection of the fingerprint recognition module 10 on the screen 12 at least partially overlaps with the light-transmitting area 121.

[0080] Based on the above settings, it can be ensured that the fingerprint recognition module is placed at the bottom of the screen, which will not cause obvious inoperable areas on the screen and thus will not affect the overall aesthetics of the screen. At the same time, since there is no need to occupy screen area to set up the corresponding fingerprint recognition hardware, the operable area of ​​the screen is larger, which is conducive to improving the screen ratio of the device.

[0081] Optional, see reference Figure 4The mid-frame 11 has a mounting position 111 in which the fingerprint recognition module 10 is installed. The mounting position 111 ensures that the installation position of the fingerprint recognition module remains constant, ensuring better installation stability and a better overall user experience and lifespan of the device.

[0082] In summary, the electronic device provided in this disclosure, while ensuring that the fingerprint recognition module is not easily damaged by high temperature and high humidity environments, also makes it easy to achieve a higher screen ratio and a better device appearance.

[0083] In this disclosure, the terms “first” and “second” are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The term “multiple” means two or more, unless otherwise expressly defined.

[0084] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the disclosure herein. This disclosure is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only.

[0085] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. A fingerprint recognition module, characterized in that, It includes a fingerprint recognition chip (1), a circuit board (2), a connecting line (3), an insulating layer (4), and a sealing structure (5); The connecting line (3) is connected to the fingerprint recognition chip (1) and the circuit board (2) respectively; The insulating layer (4) covers the connecting line (3) and is attached to the circuit board (2); The insulating layer (4) is made of waterproof and insulating material, and the thickness of the insulating layer (4) is between 0.01 and 0.03 mm. The circuit board (2) includes at least two parts located on opposite sides of the fingerprint recognition chip (1); there are at least two connecting lines (3), which are connected to the two parts of the circuit board (2) respectively; there are at least two insulating layers (4), which cover the connecting lines (3) one by one. The sealing structure (5) is at least partially formed on the insulating layer (4), and the sealing structure (5) includes at least one of silicone and rubber.

2. The fingerprint recognition module according to claim 1, characterized in that, The circuit board (2) includes a first conductive area (21), the connecting line (3) is connected to the first conductive area (21), and the insulating layer (4) at least covers the first conductive area (21).

3. The fingerprint recognition module according to claim 1, characterized in that, The fingerprint recognition chip (1) includes a second conductive area (101), the connecting line (3) is connected to the second conductive area (101), and the insulating layer (4) at least covers the second conductive area (101).

4. The fingerprint recognition module according to claim 1, characterized in that, The connecting line (3) is a gold wire.

5. The fingerprint recognition module according to claim 1, characterized in that, The circuit board (2) is a flexible circuit board, and the module also includes a reinforcing sheet (6), which is attached to the flexible circuit board and / or the fingerprint recognition chip (1).

6. The fingerprint recognition module according to claim 1, characterized in that, The insulating layer (4) includes at least one of polyethylene terephthalate, polycarbonate, polyvinyl chloride and polypropylene.

7. An electronic device, characterized in that, Includes the fingerprint recognition module (10) as described in any one of claims 1-6.

8. The electronic device according to claim 7, characterized in that, The electronic device further includes a mid-frame (11) and a screen (12), the mid-frame (11) supporting the screen (12), the fingerprint recognition module (10) being located between the screen (12) and the mid-frame (11), the screen (12) including a light-transmitting area (121), and the orthographic projection of the fingerprint recognition module (10) on the screen (12) at least partially overlapping the light-transmitting area (121).

9. The electronic device according to claim 8, characterized in that, The middle frame (11) has a mounting position (111) in which the fingerprint recognition module (10) is mounted.

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