A small-size PCB heat dissipation structure

Abstract

The utility model discloses a small volume's PCB board heat radiation structure, including base material, the base material is opened with the installation site for installing bridge pile and MOS pipe, the base material avoids the position of installation site and is provided with a plurality of convex bridge heat dissipation tooth, the base material still is provided with the pin part, the pin part is used for with PCB board electricity is connected, through adopting inverted "L" character shape base material and utilize sheet metal bending and stamping process setting convex bridge heat dissipation tooth, effectively solved new energy charging equipment in aluminium sheet metal spare heat dissipation area is insufficient and aluminium profile spare structure flexibility problem, under the premise of not increasing heat radiation structure height or length makes heat dissipation area to improve 50% or more, significantly enhanced the convection and radiation heat dissipation capacity, satisfy bridge pile and MOS pipe etc. high heat component's high -efficient heat dissipation demand, keep small volume design to adapt compact space simultaneously.

Description

Technical Field

[0001] This utility model belongs to the technical field of PCB board heat dissipation structure, specifically a small-volume PCB board heat dissipation structure. Background Technology

[0002] With the development of new energy equipment, the requirements for new energy charging equipment are becoming increasingly stringent. Users want new energy charging equipment to simultaneously possess advantages such as small size, light weight, and aesthetically pleasing appearance; reliable electrical performance, good overall quality, and low cost. In the PCB board of new energy charging equipment, heat dissipation structures are inevitably used. Current technology typically involves directly mounting high-power bridge rectifiers or MOSFETs onto the heat dissipation structure and then connecting the heat dissipation mechanism to the PCB board. Currently, the heat sinks on the PCB board of new energy charging equipment generally use 1060 aluminum sheet metal parts. While aluminum sheet metal parts can be flexibly formed into various shapes, their heat dissipation area is mainly limited to the two sides, resulting in a small heat dissipation area that cannot meet the heat dissipation requirements. To increase heat dissipation efficiency, the aluminum sheet metal parts need to be heightened or lengthened. However, increasing the height or length of the aluminum sheet metal parts cannot meet users' requirements for small-volume charging equipment. Utility Model Content

[0003] The purpose of this invention is to provide a small-volume PCB heat dissipation structure to solve the problems mentioned in the background art.

[0004] To achieve the above objectives, this utility model provides the following technical solution: A small-volume PCB heat dissipation structure includes a substrate, on which mounting positions for mounting bridge rectifiers and MOSFETs are provided. The substrate has a plurality of raised bridge heat dissipation teeth in a position avoiding the mounting positions. The substrate also has a pin portion for electrical connection with the PCB.

[0005] In a further technical solution, the substrate includes a first sheet and a second sheet, wherein the first sheet and the second sheet are respectively provided with mounting hole one and mounting hole two, and the mounting hole one and the mounting hole two are respectively used to mount bridge rectifier and MOSFET.

[0006] A further technical solution is that the convex bridge heat dissipation tooth includes a heat dissipation tooth part and a heat dissipation tooth part. The heat dissipation tooth part is distributed on both sides of the mounting hole one, and the heat dissipation tooth part is distributed on the upper side and both sides of the mounting hole two.

[0007] In a further technical solution, the pin portion includes pin one and pin two. Pin one is connected to the first sheet, and pin two is connected to the second sheet. Both pin one and pin two are inserted into holes on the PCB board.

[0008] In a further technical solution, the length direction of the first sheet is perpendicular to the length direction of the second sheet, one end of the first sheet and one end of the second sheet are integrally formed, the protruding direction of one part of the heat dissipation tooth faces the second sheet, and the direction of the other part of the heat dissipation tooth is away from the first sheet.

[0009] In a further technical solution, the number of the first heat dissipation tooth is 14, and the number of the second heat dissipation tooth is 5.

[0010] The beneficial effects of this utility model are: This invention effectively solves the problems of insufficient heat dissipation area of ​​aluminum sheet metal parts and poor structural flexibility of aluminum profiles in new energy charging equipment by using an inverted "L"-shaped substrate and employing sheet metal bending and stamping processes to set convex bridge heat dissipation teeth. It increases the heat dissipation area by more than 50% without increasing the height or length of the heat dissipation structure, significantly enhancing convection and radiation heat dissipation capabilities, meeting the high-efficiency heat dissipation requirements of high-heat-generating components such as bridge rectifiers and MOSFETs, while maintaining a small volume design to fit compact spaces. The substrate is electrically connected to the PCB board through pins, and combined with high thermal conductivity aluminum material, it achieves rapid heat conduction. The flexible layout of the convex bridge heat dissipation teeth adapts to diverse PCB board design requirements. The processing technology is simple and cost-controllable, balancing mechanical strength and long-term reliability. Compared with traditional solutions, it achieves significant optimization in heat dissipation performance, space utilization, and production economy, making it particularly suitable for the stringent requirements of high-efficiency heat dissipation and compact layout in new energy charging equipment.

[0011] Other features and advantages of this invention will be described in detail in the following detailed description section. Attached Figure Description

[0012] Figure 1 : Structural diagram of a 1060 aluminum sheet metal part in the prior art.

[0013] Figure 2 : Structural diagram of aluminum profile parts in the prior art.

[0014] Figure 3 : Overall structural diagram of this utility model.

[0015] Figure 4 : A schematic diagram of the overall structure of this utility model and its connection with the PCB board.

[0016] Reference numerals: 1. Substrate; 11. First sheet; 12. Second sheet; 2. Bridge rectifier; 3. Mounting position; 4. Raised bridge heat dissipation fins; 41. Heat dissipation fin part 1; 42. Heat dissipation fin part 2; 5. Pin part; 51. Pin 1; 52. Pin 2; 6. PCB board; 13. Mounting hole 1; 14. Mounting hole 2; 15. 1060 aluminum sheet metal part; 16. Aluminum profile part; Detailed Implementation

[0017] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0018] Please refer to Figure 1-4 ; Currently, the heat sinks on the PCB board 6 of new energy charging equipment generally use 1060 aluminum sheet metal parts or aluminum profile parts 16 with heat dissipation teeth. Aluminum sheet metal parts can be formed into various shapes, which is flexible and versatile. However, the heat dissipation area is mainly limited to the two sides of the sheet metal, resulting in a small heat dissipation area. On the other hand, the aluminum profile parts 16 are extruded aluminum with a fixed shape, which is not convenient for flexible PCB heat dissipation layout. In order to solve the problem that the heat dissipation area of ​​aluminum sheet metal parts for the PCB board 6 of new energy charging equipment is small and the aluminum profile parts 16 cannot be flexibly laid out, this application proposes a new small-volume PCB board 6 heat dissipation structure.

[0019] Therefore, this embodiment discloses a small-volume PCB board 6 heat dissipation structure, including a substrate 1, which is in the shape of an inverted "L". The substrate 1 has mounting positions 3 for mounting bridge rectifier 2 and MOSFET. The substrate 1 has several raised bridge heat dissipation teeth 4 in a position away from the mounting positions 3. The substrate 1 also has pin portions 5, which are mounted on both sides of the substrate 1 and are located at the bottom of the substrate 1. The pin portions 5 are used for electrical connection with the PCB board 6.

[0020] More specifically, by adopting an inverted "L"-shaped substrate 1 and using sheet metal bending and stamping processes to set the convex bridge heat dissipation teeth 4, the problems of insufficient heat dissipation area of ​​aluminum sheet metal parts and poor structural flexibility of aluminum profile parts 16 in new energy charging equipment are effectively solved. Without increasing the height or length of the heat dissipation structure, the heat dissipation area is increased by more than 50%, significantly enhancing the convection and radiation heat dissipation capabilities, meeting the high-heat-generating component heat dissipation requirements of bridge rectifier 2 and MOSFET, while maintaining a small volume design to fit the compact space. The substrate 1 is electrically connected to the PCB board 6 through the pin part 5, and combined with the high thermal conductivity aluminum material to achieve rapid heat conduction. The flexible layout of the convex bridge heat dissipation teeth 4 adapts to the diverse design requirements of the PCB board 6. The processing technology is simple and cost-controllable, taking into account mechanical strength and long-term reliability. Compared with traditional solutions, it achieves significant optimization in heat dissipation performance, space utilization and production economy, and is particularly suitable for the stringent requirements of new energy charging equipment for high-efficiency heat dissipation and compact layout.

[0021] Furthermore, the substrate 1 includes a first sheet 11 and a second sheet 12. The first sheet 11 and the second sheet 12 are respectively provided with mounting holes 13 and 14. The mounting holes 13 and 14 are used to mount the bridge rectifier 2 and the MOSFET, respectively. The heat dissipation teeth 4 of the convex bridge include a heat dissipation tooth part 41 and a heat dissipation tooth part 42. The heat dissipation tooth part 41 is distributed on both sides of the mounting hole 13, and the heat dissipation tooth part 42 is distributed on the upper side and both sides of the mounting hole 14.

[0022] By using the first sheet 11 and the second sheet 12 on the inverted "L"-shaped substrate 1, and respectively opening mounting holes 13 and 24 for precise mounting of the bridge rectifier 2 and the MOSFET, and by distributing heat dissipation teeth 1 part 41 on both sides of mounting hole 13 and heat dissipation teeth 2 part 42 on the upper side and both sides of mounting hole 2, the heat dissipation performance and layout flexibility of the heat dissipation structure of the PCB board 6 of the new energy charging equipment are further optimized. The targeted distribution design of heat dissipation teeth 1 part 41 and heat dissipation teeth 2 part 42 closely fits the heat-generating areas of the bridge rectifier 2 and the MOSFET, improving heat conduction efficiency.

[0023] In this embodiment, the pin section 5 includes pin 1 51 and pin 2 52. Pin 1 51 is connected to the first sheet 11, and pin 2 52 is connected to the second sheet 12. Both pin 1 51 and pin 2 52 are inserted into the holes on the PCB board 6. The method of inserting the pin section 5 into the PCB board 6 is simple to operate, the connection is stable, and it is convenient to disassemble the bridge rectifier 2 and the MOSFET.

[0024] In this embodiment, the length direction of the first sheet 11 is perpendicular to the length direction of the second sheet 12. One end of the first sheet 11 and one end of the second sheet 12 are integrally formed. The protruding direction of the first heat dissipation tooth 41 is towards the second sheet 12, and the direction of the second heat dissipation tooth 42 is away from the first sheet 11. Furthermore, there are 14 first heat dissipation teeth 41 and 5 second heat dissipation teeth 42.

[0025] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0026] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style of the specification is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A small-volume PCB heat dissipation structure, characterized in that, The substrate (1) includes a mounting position (3) for mounting a bridge rectifier (2) and a MOSFET. The substrate (1) has several raised bridge heat dissipation teeth (4) in a position away from the mounting position (3). The substrate (1) also has a pin portion (5) for electrical connection with a PCB board (6).

2. The small-volume PCB heat dissipation structure according to claim 1, characterized in that, The substrate (1) includes a first sheet (11) and a second sheet (12). The first sheet (11) and the second sheet (12) are respectively provided with mounting hole one (13) and mounting hole two (14). The mounting hole one (13) and the mounting hole two (14) are respectively used to mount the bridge rectifier (2) and the MOS transistor.

3. The small-volume PCB heat dissipation structure according to claim 2, characterized in that, The convex bridge heat dissipation tooth (4) includes a heat dissipation tooth part (41) and a heat dissipation tooth part (42). The heat dissipation tooth part (41) is distributed on both sides of the mounting hole one (13), and the heat dissipation tooth part (42) is distributed on the upper side and both sides of the mounting hole two (14).

4. The small-volume PCB heat dissipation structure according to claim 2, characterized in that, The pin section (5) includes pin one (51) and pin two (52). Pin one (51) is connected to the first sheet (11), and pin two (52) is connected to the second sheet (12). Both pin one (51) and pin two (52) are inserted into holes on the PCB board (6).

5. A small-volume PCB heat dissipation structure according to claim 2, characterized in that, The length direction of the first sheet (11) is perpendicular to the length direction of the second sheet (12). One end of the first sheet (11) and one end of the second sheet (12) are integrally formed. The protruding direction of the first heat dissipation tooth (41) is towards the second sheet (12), and the direction of the second heat dissipation tooth (42) is away from the first sheet (11).

6. The small-volume PCB heat dissipation structure according to claim 3, characterized in that, The number of the first heat dissipation tooth (41) is 14, and the number of the second heat dissipation tooth (42) is 5.

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