Waveguide device and communication system

Abstract

The application belongs to the technical field of communication, and provides a guided wave device and a communication system. The guided wave device comprises: a middle metal strip, two shielding plates and two shielding assemblies. The two shielding plates are located on the two sides of the middle metal strip along a first direction and are both arranged to be spaced apart from the middle metal strip. The two shielding assemblies are located between the two shielding plates along the first direction and are arranged to be laminated with the two shielding plates along the first direction. The two shielding assemblies are located on the two sides of the middle metal strip along a second direction and are arranged to be spaced apart from the middle metal strip. The guided wave device provided by the application can have lower loss and lower cost.

Description

[0001] This application claims priority to Chinese Patent Application No. 202520519791.2, filed on March 21, 2025, entitled "Waveguide Device and Communication System", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of communication technology, and in particular to a waveguide device and a communication system. Background Technology

[0003] With the continuous development of millimeter-wave wireless systems, the requirements for low loss and low cost of waveguide devices are becoming increasingly stringent.

[0004] Metal rectangular waveguides offer the advantage of low loss, but they are costly to manufacture and bulky. Microstrip lines and striplines are less expensive to manufacture and easier to integrate, but they suffer from higher losses during transmission. Ridge-gap waveguides and slot-gap waveguides with metal pin EBG (Electromagnetic Band Gap) structures can also be used, avoiding the need for electrical contacts during waveguide assembly and offering lower losses due to the metal structure. However, metal pins are typically manufactured using CNC (Computer Numerical Control), resulting in higher manufacturing costs in the millimeter-wave band. Substrate-integrated ridge-gap waveguides and inverted microstrip-gap waveguides are also viable options, offering lower manufacturing costs, but requiring high-frequency substrates in the millimeter-wave band. High-frequency substrates are expensive, and electromagnetic waves still experience significant losses when propagating through them. Stacked mushroom-shaped electromagnetic bandgap packaging structures offer limited reductions in manufacturing costs and losses.

[0005] In related technologies, waveguide devices struggle to achieve both low loss and low cost. Utility Model Content

[0006] This application provides a waveguide device and a communication system, wherein the waveguide device can have both low loss and low cost.

[0007] This application provides a waveguide device, comprising: a middle metal strip, two shielding plates, and two shielding components. The two shielding plates are located on both sides of the middle metal strip along a first direction and are spaced apart from the middle metal strip. The two shielding components are located between the two shielding plates along the first direction and are stacked with the two shielding plates along the first direction. The two shielding components are located on both sides of the middle metal strip along a second direction and are spaced apart from the middle metal strip.

[0008] In one possible implementation, the waveguide device provided in this application has an intermediate metal strip connected to at least one shielding component.

[0009] In one possible implementation, the waveguide device provided in this application further includes a metal support structure, which connects the shielding assembly and the intermediate metal strip.

[0010] In one possible implementation, the waveguide device provided in this application has a metal support structure comprising a plurality of first metal support structures, which are spaced apart along a third direction. One end of each first metal support structure is connected to an intermediate metal strip, and the other end is connected to one of the shielding components.

[0011] In one possible implementation, the waveguide device provided in this application includes a plurality of second metal support structures in its metal support structure. The plurality of second metal support structures are spaced apart along a third direction. One end of each second metal support structure is connected to an intermediate metal strip, and the other end is connected to another shielding component.

[0012] In one possible implementation, the waveguide device provided in this application has multiple first metal support structures and multiple second metal support structures whose projections in a first direction are offset along a third direction.

[0013] In one possible implementation, the waveguide device provided in this application includes a shielding component comprising an intermediate metal plate and a first dielectric plate located on both sides of the intermediate metal plate along a first direction. The intermediate metal plate is connected to the intermediate metal strip through a metal support structure, and a plurality of shielding elements are disposed in the first dielectric plate.

[0014] In one possible implementation, the waveguide device provided in this application includes an upper first dielectric plate and a lower first dielectric plate located on both sides of the intermediate metal plate along a first direction.

[0015] In one possible implementation, the waveguide device provided in this application has an intermediate metal plate, a metal support structure, and an intermediate metal strip that are machined from a single piece of metal plate.

[0016] In one possible implementation, the waveguide device provided in this application includes a shielding component comprising a via and two patches. The via penetrates a first dielectric substrate, and the two patches are located on two surfaces of the first dielectric substrate and connected to the via.

[0017] In one possible implementation, the waveguide device provided in this application has two square patches located on both sides of the same via.

[0018] Alternatively, both patches located on either side of the same via can be circular in shape;

[0019] Alternatively, one of the two patches located on either side of the same via can be square in shape, while the other can be round.

[0020] In one possible implementation, the waveguide device provided in this application uses a metal plate as the shielding plate.

[0021] In one possible implementation, the waveguide device provided in this application includes a shielding plate comprising a second dielectric plate and a metal layer disposed on the second dielectric plate, the metal layer facing the shielding assembly.

[0022] This application also provides a communication system, including a transmitter, a receiver, and the aforementioned waveguide device, wherein electromagnetic waves are transmitted between the transmitter and the receiver via the waveguide device.

[0023] The waveguide device provided in this application uses a central metal strip as the inner conductor of a coaxial line, and a frame formed by two shielding plates and two shielding components as the outer conductor of the coaxial line. The inner and outer conductors form a propagation region. The propagation medium in this region is air. The propagation loss of electromagnetic waves in air is less than the propagation loss in the dielectric layer of a circuit board. Therefore, the propagation loss of electromagnetic waves in the waveguide device provided in this application is relatively low. Furthermore, the first dielectric plate of the shielding components does not use a high-cost high-frequency dielectric layer, and a first dielectric plate is not provided in the propagation region, resulting in lower material costs for the dielectric layer and further reducing the cost of the waveguide device. The waveguide device provided in this application can achieve low propagation loss while maintaining low cost. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of the waveguide device provided in the embodiments of this application;

[0026] Figure 2 An exploded view of the waveguide device provided in the embodiments of this application;

[0027] Figure 3 A cross-sectional view of the waveguide device provided in the embodiments of this application along a direction perpendicular to the propagation direction. Figure 1 ;

[0028] Figure 4 A schematic diagram showing the connection between the metal support structure, the shielding component, and the intermediate metal strip in the waveguide device provided in the embodiments of this application;

[0029] Figure 5 Schematic diagram of the shielding component in the waveguide device provided in the embodiments of this application Figure 1 ;

[0030] Figure 6 For along Figure 5 A cross-sectional view of the AA plane;

[0031] Figure 7 Schematic diagram of the shielding component in the waveguide device provided in the embodiments of this application Figure 2 ;

[0032] Figure 8 Schematic diagram of the shielding component in the waveguide device provided in the embodiments of this application Figure 3 ;

[0033] Figure 9 To and Figure 5 A schematic diagram of the dispersion curve of the shielding unit of the corresponding waveguide device;

[0034] Figure 10 To and Figure 5 A schematic diagram of the dispersion curve of the air coaxial transmission line of the corresponding waveguide device.

[0035] Figure 11 To and Figure 5 A schematic diagram of the S-parameter curves of the corresponding gap waveguide air coaxial transmission line of the waveguide device;

[0036] Figure 12 To and Figure 7 A schematic diagram of the dispersion curve of the shielding unit of the corresponding waveguide device;

[0037] Figure 13 To and Figure 7 A schematic diagram of the dispersion curve of the air coaxial transmission line of the corresponding waveguide device.

[0038] Figure 14 To and Figure 8 A schematic diagram of the dispersion curve of the shielding unit of the corresponding waveguide device;

[0039] Figure 15 To and Figure 8 A schematic diagram of the dispersion curve of the air coaxial transmission line of the corresponding waveguide device.

[0040] Figure 16 A cross-sectional view of the waveguide device provided in the embodiments of this application along a direction perpendicular to the propagation direction. Figure 2 ;

[0041] Figure 17 A cross-sectional view of the waveguide device provided in the embodiments of this application along a direction perpendicular to the propagation direction. Figure 3 ;

[0042] Figure 18 A cross-sectional view of the waveguide device provided in the embodiments of this application along a direction perpendicular to the propagation direction. Figure 4 .

[0043] Explanation of reference numerals in the attached figures:

[0044] 100 - Waveguide device;

[0045] 110 - Middle metal strip;

[0046] 120 - Shielding plate; 120a - First shielding plate; 120b - Second shielding plate; 121 - Second dielectric plate; 122 - Metal layer;

[0047] 130 - Shielding assembly; 130a - First shielding assembly; 130b - Second shielding assembly;

[0048] 131-Intermediate metal plate; 132-First dielectric plate; 132a-Upper first dielectric plate; 132b-Lower first dielectric plate; 133-Shielding component; 1331-Via; 1332-Patch;

[0049] 140 - Transmission Area;

[0050] 150 - Metal support structure; 151 - First metal support structure; 152 - Second metal support structure;

[0051] A - First shielding unit; B - Second shielding unit;

[0052] X - First direction; Y - Second direction; Z - Third direction. Detailed Implementation

[0053] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0054] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0055] In the description of this application, it should be understood that the terms "upper", "lower", "front", "back", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0056] The terms "first," "second," and "third" (if any) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a particular order or sequence. It should be understood that such terms can be used interchangeably where appropriate so that the embodiments of this application described herein can be implemented, for example, in orders other than those illustrated or described herein.

[0057] Furthermore, the terms “comprising” and “having”, and any variations thereof, are intended to cover non-exclusive inclusion, such as a process, method, system, product, or maintenance tool that includes a series of steps or units, not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, product, or maintenance tool.

[0058] With the continuous development of millimeter-wave wireless systems, the requirements for low loss and low cost of waveguide devices are becoming increasingly stringent.

[0059] Metal rectangular waveguides have the advantage of low loss, but their fabrication requires the preparation of multiple metal segments, which are then connected together, resulting in high costs. Furthermore, metal rectangular waveguides are relatively large. Microstrip lines and striplines have lower fabrication costs, but they suffer from higher ohmic losses, dielectric losses, and radiation losses during transmission, resulting in higher overall losses.

[0060] Ridge gap waveguides and slot gap waveguide transmission lines with metal pin EBG structure can also be used. This structure can prevent electromagnetic wave leakage at specific frequencies, thus avoiding the requirement for electrical contact during waveguide assembly. The metal structure has lower loss. However, metal pins are usually processed by CNC equipment, which makes the processing cost higher in the millimeter wave band.

[0061] Substrate-integrated ridge gap waveguides and inverted microstrip gap waveguides can also be used. They can be fabricated using circuit board processing technology, which has a lower processing cost. However, electromagnetic waves need to propagate in the dielectric layer of the circuit board, which requires high-frequency board material. High-frequency board material has a higher cost, and there is still loss when electromagnetic waves propagate in the dielectric layer.

[0062] While some types of stacked mushroom-shaped electromagnetic bandgap structures can reduce dielectric loss, the mushroom-shaped electromagnetic bandgap structures stacked on different layers need to be aligned, which requires high processing precision and results in high processing costs. In addition, some electromagnetic waves still need to be transmitted in the dielectric layer of the circuit board, so the reduction in loss is limited, and high-frequency boards are required, making it difficult to reduce processing costs.

[0063] In related technologies, waveguide devices struggle to achieve both low loss and low cost.

[0064] Based on this, embodiments of this application provide a waveguide device and a communication system, wherein the waveguide device can have both low loss and low cost.

[0065] Figure 1 This is a schematic diagram of the waveguide device provided in the embodiments of this application; Figure 2 An exploded view of the waveguide device provided in the embodiments of this application; Figure 3 A cross-sectional view of the waveguide device provided in the embodiments of this application along a direction perpendicular to the propagation direction. Figure 1 .

[0066] See Figures 1 to 3 As shown, the waveguide device 100 provided in this application embodiment includes: a middle metal strip 110, two shielding plates 120 and two shielding components 130. The two shielding plates 120 are located on both sides of the middle metal strip 110 along the first direction X and are spaced apart from the middle metal strip 110. The two shielding components 130 are located between the two shielding plates 120 along the first direction X and are stacked with the two shielding plates 120 along the first direction X. The two shielding components 130 are located on both sides of the middle metal strip 110 along the second direction Y and are spaced apart from the middle metal strip 110.

[0067] The waveguide device 100 comprises two shielding plates 120a and 120b, respectively, which are spaced apart in a first direction (X). Two shielding components 130 are also defined as shielding component 130a and 130b, respectively, which are spaced apart in a second direction (Y). A third direction (Z) forms an angle with both the first and second directions, and electromagnetic waves are transmitted along this third direction (Z) within the waveguide device 120a. The shielding plates 120a and 120b, as well as the shielding components 130a and 130b, can be connected externally to the waveguide device 120a using fasteners.

[0068] The first shielding plate 120a, the first shielding component 130a, and the second shielding plate 120b are stacked along the first direction X; the first shielding plate 120a, the second shielding component 130b, and the second shielding plate 120b are also stacked along the first direction X. Thus, the first shielding plate 120a, the second shielding plate 120b, the first shielding component 130a, and the second shielding component 130b form a frame, with the intermediate metal strip 110 located within this frame. The intermediate metal strip 110 and the two shielding plates 120 are spaced apart, and the intermediate metal strip 110 and the two shielding components 130 are also spaced apart. Electromagnetic waves propagate along the third direction Z in the propagation region 140 formed by the intermediate metal strip 110, the two shielding plates 120, and the two shielding components 130.

[0069] Two shielding components 130 are located between two shielding plates 120 along the first direction X. The area where the first shielding plate 120a and the intermediate metal strip 110 are aligned along the first direction X shields the propagation area 140 from one side of the first direction X. The area where the second shielding plate 120b and the intermediate metal strip 110 are aligned along the first direction X shields the propagation area 140 from the other side of the first direction X.

[0070] The two shielding plates 120 and the area where the two shielding plates 120 and the first shielding assembly 130a are aligned along the first direction shield the propagation area 140 from one side of the second direction Y. The area where the two shielding plates 120 and the second shielding assembly 130b are aligned along the first direction shields the propagation area 140 from the other side of the second direction Y.

[0071] The intermediate metal strip 110 is equivalent to the inner conductor of the coaxial line, and the frame formed by the two shielding plates 120 and the two shielding components 130 is equivalent to the outer conductor of the coaxial line. The inner conductor and the outer conductor form the propagation region 140. The propagation medium in the propagation region 140 is air. The propagation loss of electromagnetic waves in air is less than the propagation loss in the dielectric layer of the circuit board. Therefore, compared with the propagation loss of some electromagnetic waves in the dielectric layer of the circuit board in related technologies, the propagation loss of electromagnetic waves in the waveguide device 100 provided in this application embodiment is smaller.

[0072] The waveguide device 100 formed by the intermediate metal strip 110, two shielding plates 120, and two shielding components 130 is manufactured using existing circuit board manufacturing processes, resulting in lower manufacturing costs compared to metal rectangular waveguides and metal pin EBG structures. Furthermore, the first dielectric plate 132 of the shielding component 130 does not use a high-cost high-frequency dielectric layer, and the first dielectric plate 132 is not present in the propagation region 140, further reducing the material cost of the dielectric layer and thus lowering the overall cost of the waveguide device 100. The waveguide device 100 provided in this embodiment can achieve low propagation loss while maintaining a low cost.

[0073] In one possible implementation, the intermediate metal strip 110 is connected to at least one shielding component 130. Thus, the shielding component 130 can support the intermediate metal strip 110. In other implementations, the intermediate metal strip 110 can also be connected to a shielding plate 120, which can support the intermediate metal strip 110.

[0074] The following explanation uses the connection between the intermediate metal strip 110 and the shielding component 130 as an example.

[0075] For details, please continue reading. Figure 1 and Figure 2 As shown, the waveguide device 100 also includes a metal support structure 150, which is connected to the shielding assembly 130 and the intermediate metal strip 110.

[0076] The metal support structure 150 is used to connect the shielding component 130 and the intermediate metal strip 110 to support the intermediate metal strip 110. The metal support structure 150 is made of metal, so electromagnetic waves can be prevented from propagating in the medium of the circuit board. While supporting the intermediate metal strip 110, it can also reduce the loss of electromagnetic wave propagation.

[0077] Figure 4 This is a schematic diagram showing the connection between the metal support structure, the shielding component, and the intermediate metal strip in the waveguide device provided in the embodiments of this application.

[0078] See Figure 1 , Figure 2 and Figure 4 As shown, in one possible implementation, the metal support structure 150 includes a plurality of first metal support structures 151, which are spaced apart along a third direction Z. One end of each first metal support structure 151 is connected to the intermediate metal strip 110, and the other end is connected to one of the shielding components 130.

[0079] The first metal support structure 151 connects the intermediate metal strip 110 to the first shielding component 130a, thus supporting the intermediate metal strip 110 and simplifying the internal structure of the waveguide device 100. Furthermore, the first metal support structure 151 is spaced Z-axis along the third direction, ensuring reliable support for the intermediate metal strip 110 throughout the entire transmission path of the electromagnetic wave.

[0080] Please continue reading Figure 1 , Figure 2 and Figure 4 As shown, in another possible implementation, the metal support structure 150 includes a plurality of second metal support structures 152, which are spaced apart along a third direction Z. One end of each second metal support structure 152 is connected to the intermediate metal strip 110, and the other end is connected to another shielding component 130.

[0081] In other words, metal support structures 150 are provided on both sides of the middle metal strip 110 along the second direction Y, and the second metal support structure 152 and the first metal support structure 151 are connected to different shielding components 130, so that the force on both ends of the middle metal strip 110 along the second direction Y is more uniform. In addition, the second metal support structure 152 is also spaced along the third direction Z so that the middle metal strip 110 can be reliably supported throughout the entire transmission path of the electromagnetic wave.

[0082] Please continue reading Figure 1 , Figure 2 and Figure 4 As shown, the projections of multiple first metal support structures 151 and multiple second metal support structures 152 in the first direction X are staggered along the third direction Z.

[0083] The first metal support structure 151 and the second metal support structure 152 reflect electromagnetic waves. By offsetting the projections of the first metal support structure 151 and the second metal support structure 152 in the first direction X along the third direction Z, the electromagnetic waves reflected by the first metal support structure 151 and the electromagnetic waves reflected by the second metal support structure 152 can be partially canceled out, thereby reducing the loss of electromagnetic waves.

[0084] The specific structure of the shielding component 130 will be described below.

[0085] Please continue reading Figures 1 to 3 As shown, the shielding assembly 130 includes an intermediate metal plate 131 and a first dielectric plate 132 located on both sides of the intermediate metal plate 131 along the first direction X. The intermediate metal plate 131 is connected to the intermediate metal strip 110 through a metal support structure 150. A plurality of shielding elements 133 are provided in the first dielectric plate 132.

[0086] The substrates of the first dielectric plates 132 located on both sides of the intermediate metal plate 131 can be the same or different. The first dielectric plates 132 are used to support the shielding members 133 and also provide the basic strength of the waveguide device 100, giving the waveguide device 100 good structural stability. Multiple shielding members 133 are evenly spaced on the first dielectric plates 132. Among them, two rows of shielding members 133 are arranged along the second direction Y to provide better shielding for the propagation area 140; along the third direction Z, the number of shielding members 133 is set according to the size of the waveguide device 100.

[0087] Please continue reading Figure 3 As shown, the two first dielectric substrates 132 in the shielding assembly 130 are the upper first dielectric substrate 132a and the lower first dielectric substrate 132b, respectively, and the intermediate metal plate 131 is located between the upper first dielectric substrate 132a and the lower first dielectric substrate 132b. Taking the first shielding assembly 130a as an example, the function of the intermediate metal plate 131 will be explained.

[0088] On one side of the first shielding assembly 130a, the portion of the first shielding plate 120a, the shielding element 133 located in the upper first dielectric plate 132a, and the intermediate metal plate 131 facing the first shielding plate 120a forms a first shielding unit A; the portion of the second shielding plate 120b, the shielding element 133 located in the lower first dielectric plate 132b, and the intermediate metal plate 131 facing the second shielding plate 120b forms a second shielding unit B. The first shielding unit A and the second shielding unit B form two relatively independent shielding units, thereby reducing the alignment accuracy requirements for the shielding element 133 located in the first shielding unit A and the shielding element 133 located in the second shielding unit B.

[0089] By setting an intermediate metal plate 131, the alignment accuracy requirement of the shield 133 located in the two layers of first dielectric plates 132 is lower, thereby further reducing the processing cost of the waveguide device 100.

[0090] In one possible implementation, the intermediate metal plate 131, the metal support structure 150, and the intermediate metal strip 110 are machined from a single piece of metal plate.

[0091] The intermediate metal plate 131, metal support structure 150, and intermediate metal strip 110 can be formed by etching on a single metal plate. This simplifies the manufacturing process of the waveguide device 100, further reducing its manufacturing cost. Furthermore, the intermediate metal plate 131, metal support structure 150, and intermediate metal strip 110 are integrally formed, resulting in a high connection strength between the metal support structure 150 and the intermediate metal strip 110.

[0092] The specific structure of the shielding component 133 will be described below.

[0093] Figure 5 Schematic diagram of the shielding component in the waveguide device provided in the embodiments of this application Figure 1 ; Figure 6 For along Figure 5 A cross-sectional view of the AA plane; Figure 7 Schematic diagram of the shielding component in the waveguide device provided in the embodiments of this application Figure 2 ; Figure 8 Schematic diagram of the shielding component in the waveguide device provided in the embodiments of this application Figure 3 .

[0094] See Figures 5 to 8 As shown, the shielding component 133 includes a via 1331 and two patches 1332. The via 1331 penetrates the first dielectric substrate 132, and the two patches 1332 are located on two surfaces of the first dielectric substrate 132 and are connected to the via 1331.

[0095] The shielding component 130 can be fabricated using existing circuit board manufacturing processes. Two layers of copper foil can be laminated on both sides of the first dielectric substrate 132, and patches 1332 can be etched onto the copper foil. Then, holes are drilled at positions corresponding to the patches 1332, and copper is plated into the holes to form vias 1331 and two patches 1332 connected to the vias 1331. Using existing circuit board manufacturing processes is less costly.

[0096] The shapes of the two patches 1332 located on both sides of the same via 1331 can be the same or different.

[0097] For example, Figure 5 The two patches 1332 located on either side of the same via 1331 can both be square. Figure 7 The two patches 1332 located on either side of the same via 1331 can both be circular; Figure 8 One patch 1332 located on either side of the same via 1331 can be square, and the other can be circular. The different shapes of the patches 1332 result in different parameters of the waveguide device 100, such as the complete bandgap dispersion range, single-mode transmission range, and reflection coefficient. Therefore, the shape of the patches can be adjusted according to the required parameters of the waveguide device 100, making the design of the waveguide device 100 more flexible.

[0098] In the waveguide device 100, the spacing between the closest vias 1331 in the first shielding assembly 130a and the second shielding assembly 130b located on both sides of the intermediate metal strip 110 should be less than half the minimum operating wavelength of the electromagnetic wave; the spacing between the first shielding plate 120a and the second shielding plate 120b should also be less than half the minimum operating wavelength of the electromagnetic wave, thereby avoiding the occurrence of higher-order modes in the operating frequency band. Based on this, the dimensions of the shielding plate 120, the parameters and dimensions of each component in the shielding assembly 130, and the dimensions of the intermediate metal strip 110 can all be flexibly set according to requirements. The description is based on the operating frequency band of the electromagnetic waves transmitted by the waveguide device 100 being 76GHz to 81GHz.

[0099] Figure 9 To and Figure 5 A schematic diagram of the dispersion curve of the shielding unit of the corresponding waveguide device.

[0100] In the first embodiment, the dimensions of the first shielding plate 120a, the second shielding plate 120b, the intermediate metal strip 110, and the intermediate metal plate 131 along the first direction X are all 0.15 mm; the upper first dielectric plate 132a and the lower first dielectric plate 132b use dielectric plates with a relative permittivity of 3.66, a loss tangent of 0.004, and a dimension of 0.25 mm along the first direction X; the dimensions of the copper foil in the upper first dielectric plate 132a and the lower first dielectric plate 132b along the first direction X are both 0.028 mm; the air gap between the first dielectric plate 132 and the shielding plate 120 adjacent to it due to the rough surface is 0.02 mm in this embodiment. The intermediate metal strip 110 has a dimension of 0.68 mm along the second direction Y, and its dimension along the third direction Z is set according to the transmission length, for example, the transmission length can be 7.5 mm; the intermediate metal plate 131 has a dimension of 7.5 mm along the third direction Z; the spacing between the intermediate metal plates 131 in the two shielding assemblies 130 is 1.1 mm. The metal support structure 150 has a dimension of 0.21 mm along the second direction Y, and a dimension of 0.2 mm along the third direction Z; the arrangement period of the first metal support structure 151 (or the second metal support structure 152) along the third direction Z is 3.59 mm, and the spacing between the first metal support structure 151 and the second metal support structure 152 along the third direction Z along their projections on the intermediate metal strip 110 is 1.31 mm. The spacing between the first dielectric plate 132 in the first shielding assembly 130a and the first dielectric plate 132 in the second shielding assembly 130b along the second direction Y is 1.1 mm, and the dimension of the first dielectric plate 132 along the third direction Z is 7.5 mm. The shielding components 133 in the shielding assembly 130 are arranged periodically in a square grid pattern, with two columns along the second direction Y and ten columns along the third direction Z. The side length of the patch 1332 in the shielding component 133 is 0.65 mm, and the diameter of the via 1331 connecting two patches 1332 is 0.25 mm. The distance between the via 1331 of the row of shielding components 133 closest to the center of the central metal strip 110 and the center of the central metal strip 110 is 0.925 mm.

[0101] See Figure 9 As shown, in the first embodiment, the complete bandgap dispersion range of the first shielding unit A and the second shielding unit B is 56.9 GHz to 118.4 GHz, which can cover the operating frequency band of 76 GHz to 81 GHz.

[0102] Figure 10 To and Figure 5 A schematic diagram of the dispersion curve of the air coaxial transmission line of the corresponding waveguide device.

[0103] See Figure 10As shown, in the first embodiment, the single-mode transmission range of the gap waveguide air coaxial transmission line of the waveguide device 100 is 58.6GHz to 88.6GHz, which can cover the operating frequency band of 76GHz to 81GHz.

[0104] Figure 11 To and Figure 5 A schematic diagram of the S-parameter curves of the corresponding gap waveguide air coaxial transmission line of the waveguide device.

[0105] See Figure 11 As shown, the gap waveguide air coaxial transmission line of the waveguide device 100 has a reflection coefficient of less than -23dB and a transmission coefficient of greater than -0.13dB in the range of 70GHz to 86GHz, which can cover the operating frequency band of 76GHz to 81GHz.

[0106] Please continue reading Figure 7 As shown, in the second embodiment, patch 1332 is a circular patch with a radius of 0.325 mm. Other parameters in the waveguide device 100 are the same as those in the first embodiment.

[0107] Figure 12 To and Figure 7 A schematic diagram of the dispersion curve of the shielding unit of the corresponding waveguide device.

[0108] See Figure 12 As shown, in the second embodiment, the complete bandgap dispersion range of the first shielding unit A and the second shielding unit B is 66.7GHz to 132.4GHz, which can cover the operating frequency band of 76GHz to 81GHz.

[0109] Figure 13 To and Figure 7 A schematic diagram of the dispersion curve of the air coaxial transmission line of the corresponding waveguide device.

[0110] See Figure 13 As shown, in the second embodiment, the single-mode transmission range of the gap waveguide air coaxial transmission line of the waveguide device 100 is 66.9GHz to 90.9GHz, which can cover the operating frequency band of 76GHz to 81GHz.

[0111] Please continue reading Figure 8 As shown, in the third embodiment, one patch 1332 on each side of the via 1331 is a circular patch with a radius of 0.325 mm, and the other patch is a square patch with a side length of 0.65 mm. Other parameters in the waveguide device 100 are the same as those in the first embodiment.

[0112] Figure 14 To and Figure 8 A schematic diagram of the dispersion curve of the shielding unit of the corresponding waveguide device.

[0113] See Figure 14 As shown, in the third embodiment, the complete bandgap dispersion range of the first shielding unit A and the second shielding unit B is 62GHz to 125.7GHz, which can cover the operating frequency band of 76GHz to 81GHz.

[0114] Figure 15 To and Figure 8 A schematic diagram of the dispersion curve of the air coaxial transmission line of the corresponding waveguide device.

[0115] See Figure 15 As shown, in the third embodiment, the single-mode transmission range of the gap waveguide air coaxial transmission line of the waveguide device 100 is 62.8GHz to 89.5GHz, which can cover the operating frequency band of 76GHz to 81GHz.

[0116] The specific structure of the shielding plate 120 will be described below.

[0117] Please continue reading Figure 3 As shown, in one possible implementation, the shielding plate 120 can be a metal plate. Metal plates have a better shielding effect.

[0118] Figure 16 A cross-sectional view of the waveguide device provided in the embodiments of this application along a direction perpendicular to the propagation direction. Figure 2 ; Figure 17 A cross-sectional view of the waveguide device provided in the embodiments of this application along a direction perpendicular to the propagation direction. Figure 3 ; Figure 18 A cross-sectional view of the waveguide device provided in the embodiments of this application along a direction perpendicular to the propagation direction. Figure 4 .

[0119] See Figures 16 to 18 As shown, in other embodiments, the shielding plate 120 includes a second dielectric plate 121 and a metal layer 122 disposed on the second dielectric plate 121, with the metal layer 122 facing the shielding assembly 130. The composite structure of the second dielectric plate 121 and the metal layer 122 can reduce the weight of the shielding plate 120, thereby reducing the weight of the waveguide device 100.

[0120] For example, in Figure 16 In this design, the first shielding plate 120a is a metal plate, and the second shielding plate 120b includes a metal layer 122 and a second dielectric plate 121. Figure 17 In this configuration, the second shielding plate 120b is a metal plate, and the first shielding plate 120a includes a metal layer 122 and a second dielectric plate 121. Figure 18 In the first shielding plate 120a and the second shielding plate 120b, both include a metal layer 122 and a second dielectric plate 121.

[0121] This application also provides a communication system, which includes a transmitter, a receiver, and a waveguide device 100 provided in the above embodiments. Electromagnetic waves are transmitted between the transmitter and the receiver through the waveguide device 100.

[0122] The specific structure of the waveguide device 100 has been described in detail in the above embodiments, and will not be repeated here.

[0123] The communication system can be a filter, power divider, combiner, coupler, or antenna, etc. Communication includes a transmitter and a receiver, with electromagnetic waves transmitted between them via a waveguide device 100. The waveguide device 100 has low cost, resulting in a lower overall cost for the communication system. The waveguide device 100 also has low transmission loss, leading to better communication quality.

[0124] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A waveguide device, characterized in that, include: Intermediate metal strip (110); Two shielding plates (120) are located on both sides of the intermediate metal strip (110) along a first direction and are spaced apart from the intermediate metal strip (110); Two shielding components (130) are located between the two shielding plates (120) along the first direction and are stacked with the two shielding plates (120) along the first direction. The two shielding components (130) are located on both sides of the intermediate metal strip (110) along the second direction and are spaced apart from the intermediate metal strip (110).

2. The waveguide device according to claim 1, characterized in that, The intermediate metal strip (110) is connected to at least one of the shielding components (130).

3. The waveguide device according to claim 2, characterized in that, It also includes a metal support structure (150) that connects the shielding assembly (130) and the intermediate metal strip (110).

4. The waveguide device according to claim 3, characterized in that, The metal support structure (150) includes a plurality of first metal support structures (151), which are spaced apart along a third direction. One end of each first metal support structure (151) is connected to the intermediate metal strip (110), and the other end is connected to one of the shielding components (130).

5. The waveguide device according to claim 4, characterized in that, The metal support structure (150) includes a plurality of second metal support structures (152), which are spaced apart along the third direction. One end of each second metal support structure (152) is connected to the intermediate metal strip (110), and the other end is connected to another shielding component (130).

6. The waveguide device according to claim 5, characterized in that, The projections of the plurality of first metal support structures (151) and the plurality of second metal support structures (152) in the first direction are offset along the third direction.

7. The waveguide device according to any one of claims 3 to 6, characterized in that, The shielding assembly (130) includes an intermediate metal plate (131) and a first dielectric plate (132) located on both sides of the intermediate metal plate (131) along the first direction. The intermediate metal plate (131) is connected to the intermediate metal strip (110) through the metal support structure (150). A plurality of shielding elements (133) are provided in the first dielectric plate (132).

8. The waveguide device according to claim 7, characterized in that, The first dielectric plate (132) located on both sides of the intermediate metal plate (131) along the first direction includes an upper first dielectric plate (132a) and a lower first dielectric plate (132b).

9. The waveguide device according to claim 7, characterized in that, The intermediate metal plate (131), the metal support structure (150), and the intermediate metal strip (110) are all made from a single piece of metal plate.

10. The waveguide device according to claim 7, characterized in that, The shielding component (133) includes a via (1331) and two patches (1332). The via (1331) penetrates the first dielectric substrate (132), and the two patches (1332) are located on two surfaces of the first dielectric substrate (132) and connected to the via (1331).

11. The waveguide device according to claim 10, characterized in that, The two patches (1332) located on both sides of the same via (1331) are both square in shape; Alternatively, the two patches (1332) located on both sides of the same via (1331) may both be circular in shape; Alternatively, one of the two patches (1332) located on both sides of the same via (1331) may be square in shape and the other may be circular in shape.

12. The waveguide device according to any one of claims 1 to 6, characterized in that, The shielding plate (120) is a metal plate.

13. The waveguide device according to any one of claims 1 to 6, characterized in that, The shielding plate (120) includes a second dielectric plate (121) and a metal layer (122) disposed on the second dielectric plate (121), the metal layer (122) facing the shielding assembly (130).

14. A communication system, characterized in that, It includes a transmitter, a receiver, and a waveguide device (100) as described in any one of claims 1 to 13, wherein electromagnetic waves are transmitted between the transmitter and the receiver via the waveguide device (100).

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