Electric card module, temperature control device, vehicle-mounted display device and vehicle

Abstract

The utility model discloses a kind of electric card module, temperature control device, vehicle-mounted display device and vehicle, electric card module includes electric card core body, the electric card core body is based on electric card effect formation temperature variation, for generating cold or heat;Support frame, for fixing the electric card core body, and the support frame is formed with heat exchange medium passage, the heat exchange medium passage is used to export the cold or the heat, realize the switching of electric card module refrigeration and heating two functions, to facilitate the refrigeration to be cooled piece or the heating to be heated piece.

Description

Technical Field

[0001] This application relates to the field of electronic and thermal management technology, and in particular to an electronic card module, a temperature control device, an in-vehicle display device, and a vehicle. Background Technology

[0002] With the development of smart cockpits, the application of in-vehicle displays in modern automobiles is increasing. Although in-vehicle displays are generally designed to meet automotive-grade operating temperatures, extreme temperature conditions can still adversely affect their long-term stability, lifespan, and performance. Currently, most temperature control methods for displays rely on single-stage cooling technologies, which cannot heat the displays in cold weather, impacting their performance and lifespan. Utility Model Content

[0003] This utility model aims to solve at least one of the technical problems existing in the prior art. To this end, in a first aspect, this utility model proposes an electric card module, the electric card module including an electric card core, the electric card core generating temperature changes based on the electric card effect to generate cold or heat; a support frame for fixing the electric card core, and the support frame forming a heat exchange medium channel for discharging the cold or heat.

[0004] According to the electric card module in this embodiment, the electric card core generates temperature changes based on the electric card effect. When an electric field is applied, the electric card core undergoes a reversible adiabatic temperature change, releasing heat through the orderly arrangement of dipoles within the material. After the electric field is removed, the dipoles become disordered, absorbing heat and forming cold energy. The support frame not only provides a stable mounting structure for the electric card core but also constructs a heat exchange medium channel that runs through multiple layers, allowing the medium to flow along a set path through the surface of each core, achieving efficient heat or cold energy extraction. This enables free switching between cooling and heating functions within the same electric card module, facilitating cooling of components to be cooled or heating of components to be heated.

[0005] In conjunction with the first aspect above, in one possible implementation, the support frame includes a skeleton and a module partition, the skeleton being used to support the module partition, and the module partition being used to fix the card core.

[0006] In conjunction with the first aspect above, in one possible implementation, the module partition has at least one layer, and each module partition has mounting holes; the module partition includes at least an insulating material to prevent electrical interference between the card cores.

[0007] In conjunction with the first aspect above, in one possible implementation, the module partition has two or more layers, and the heat exchange medium channel includes channels between the gaps of the multiple module partitions.

[0008] In conjunction with the first aspect above, in one possible implementation, the overall structure of the electronic card module is an axisymmetric structure, which includes at least one of a cylinder and a regular polygonal prism.

[0009] In conjunction with the first aspect above, in one possible implementation, the card core includes at least one of a multilayer ceramic capacitor, a ceramic sheet, an organic dielectric, and an organic-inorganic composite dielectric.

[0010] Secondly, a temperature control device is proposed for use in a display screen, including the card module described in the first aspect above; and a temperature control component connected to the card module, wherein the card module transmits the cold or heat to the display screen through the temperature control component.

[0011] In conjunction with the second aspect above, in one possible implementation, the temperature control component includes a temperature control housing disposed on the back of the display screen, the temperature control housing containing a heat exchange medium, and the temperature control housing communicating with the electronic card module via a conduit; or,

[0012] The temperature control component includes a temperature control housing disposed on the back of the display screen. The temperature control housing contains a heat exchange medium. The temperature control housing is connected to the electronic card module through a conduit. The temperature control housing includes a heat-conducting layer for conducting the cold or heat.

[0013] In conjunction with the second aspect above, in one possible implementation, the temperature control housing further includes a liquid storage plate and a first liquid storage tank; the liquid storage plate is disposed between the heat-conducting layer and the first liquid storage tank, and the heat-conducting layer is disposed between the display screen and the liquid storage plate.

[0014] In conjunction with the second aspect above, in one possible implementation, the temperature control device further includes a module housing, with the electronic card module disposed within the module housing; or, the temperature control device further includes a module housing and an insulation sleeve, with the electronic card module disposed within the insulation sleeve and the module housing disposed outside the insulation sleeve.

[0015] In conjunction with the second aspect above, in one possible implementation, the temperature control device further includes a temperature sensor for detecting the temperature of the display screen; and / or, it further includes a second liquid storage tank for storing the heat exchange medium.

[0016] In conjunction with the second aspect above, in one possible implementation, the temperature control device further includes a heat dissipation component for dissipating the heat generated by the card core; the heat dissipation component includes at least one of heat dissipation fins and a fan.

[0017] In conjunction with the second aspect above, in one possible implementation, the temperature control device further includes a flow control element for adjusting the flow direction of the heat exchange medium, the flow control element including, but not limited to, a movable valve or a bidirectional pump body.

[0018] Thirdly, an in-vehicle display device is proposed, including a display screen; and the temperature control device described in the second aspect above, wherein the display screen adjusts the temperature through the temperature control device.

[0019] Fourthly, a vehicle is proposed, comprising the electric card module described in the first aspect, or the temperature control device described in the second aspect, or the vehicle-mounted display device described in the third aspect.

[0020] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are merely some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. The following description will be conducted in conjunction with the accompanying drawings, wherein the same reference numerals denote the same parts in the following description.

[0022] Figure 1 This is an exploded side view of a card module structure according to an embodiment of this application;

[0023] Figure 2 This is a top view of a card module structure according to an embodiment of this application;

[0024] Figure 3 This is an exploded view of a temperature control device according to an embodiment of this application;

[0025] Figure 4 This is a schematic diagram of the structure and assembly of a temperature control device according to an embodiment of this application.

[0026] Figure label:

[0027] 1. Card core; 2. Module grid layer; 3. Inner module grid layer; 4. Outer module grid layer; 5. Temperature control shell; 6. Conduit; 7. Heat-conducting layer; 8. Liquid storage plate; 9. Card module; 10. First liquid storage tank; 11. Module shell; 12. Second liquid storage tank; 13. Temperature sensor; 14. Heat dissipation assembly; 15. Flow control component; 16. Display screen; 17. Detailed Implementation

[0028] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0029] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, features defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0030] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0031] The following description, with reference to the accompanying drawings, describes an embodiment of the present application that provides an electric card module 10. The electric card module 10 includes an electric card core 1, which generates a temperature change based on the electric card effect to produce cold or heat; a support frame for fixing the electric card core 1, and the support frame has a heat exchange medium channel for discharging cold or heat.

[0032] According to the electric card module 10 in this embodiment, the electric card core 1 generates temperature changes based on the electric card effect. When an electric field is applied, the electric card core 1 undergoes a reversible adiabatic temperature change, releasing heat through the orderly arrangement of dipoles within the material. After the electric field is removed, the dipoles become disordered and absorb heat, forming cold energy. The support frame not only provides a stable installation structure for the electric card core 1 but also constructs a heat exchange medium channel that runs through multiple layers, allowing the medium to flow along a set path through the surface of each core, achieving efficient heat or cold energy extraction. The same electric card module 10 allows for free switching between cooling and heating functions, facilitating cooling of components to be cooled or heating of components to be heated. Additionally, the flow direction of the heat exchange medium can be switched to cool or heat components to be heated, where the component to be cooled or heated can be the display screen 17.

[0033] Optionally, the card core 1 includes multiple units to generate more cooling or heating. The electrodes on both sides of each card core 1 are connected in parallel by conductive adhesive or other conductive materials, so that the power on and off can be controlled simultaneously.

[0034] Compared to related technologies that utilize thermoelectric modules for cooling and heating in temperature control devices, where thermoelectric modules use direct current to achieve cooling and heating through a series connection of two different semiconductor materials in a thermocouple, the cooling and heating effect of a thermoelectric module is directly related to the magnitude and direction of the current. In this solution, the electric card module 10 controls temperature based on the Electrocard effect, changing the arrangement of electric dipoles within the material through an electric field. The temperature control effect of the electric card module 10 mainly depends on parameters such as electric field strength and frequency. In contrast, the electric card module 10 does not involve Joule heat loss due to the resistance of semiconductor materials found in thermoelectric modules, resulting in higher energy conversion efficiency. Therefore, for the same output power, the electric card module 10 requires less energy, is more energy-efficient and environmentally friendly, and operates with lower noise, making it more environmentally friendly.

[0035] In some embodiments, the support frame includes a skeleton 2 and a module compartment 3, wherein the skeleton 2 is used to support the module compartment and the module compartment is used to fix the card core 1.

[0036] Optionally, the inner wall of the frame 2 may be provided with positioning slots and bosses to ensure precise alignment of the module grid 3 during assembly and avoid displacement caused by vibration or thermal expansion and contraction. In addition, the module grid 3 and the frame 2 can be locked together by positioning pins and a snap-fit ​​structure to ensure that the core can maintain a stable position during operation and improve the long-term reliability of the system.

[0037] In some embodiments, the module grid layer 3 has at least one layer, and each module grid layer 3 has mounting holes; the module grid layer 3 includes at least an insulating material to avoid electrical interference between the card cores 1.

[0038] Specifically, the module grid layer 3 can be a multi-layer structure, with each layer having mounting holes that match the shape of the card core 1 for inserting the core layer by layer, further improving heat exchange efficiency. The module grid layer 3 includes at least insulating material to prevent electrical interference between the card cores 1, and can also effectively prevent arc breakdown or partial discharge between adjacent cores under high-voltage electric fields, avoiding thermal runaway caused by uneven electric field distribution, and improving the system's safe operation under high electric field conditions.

[0039] In some embodiments, the module grid layer 3 has two or more layers, and the heat exchange medium channel includes the channel between the gaps of the multiple module grid layers 3.

[0040] Specifically, the multi-layer module lattice 3 forms heat exchange medium channels within the frame 2. The heat exchange medium flows sequentially through the gaps between each layer along the axial direction, forming a multi-stage heat exchange path. This multi-layer channel structure ensures more uniform heat distribution within the module, avoids excessive local temperature differences, and guarantees stable and reliable transfer of hot and cold energy.

[0041] In some embodiments, the overall structure of the electronic card module 10 is an axisymmetric structure, which includes at least one of a cylinder and a regular polygonal prism.

[0042] Specifically, the overall structure of the card module is an axisymmetric structure. The axisymmetric structure has good thermal balance characteristics during operation, avoiding excessive local temperature differences.

[0043] In some optional embodiments, the card module 10 adopts a regular hexagonal prism shape, so that the card cores 1 are evenly distributed in a hexagonal array, maximizing space utilization and improving heat exchange efficiency. Heat exchange interfaces are provided on each of the six sides to achieve six-way symmetrical heat exchange and eliminate local hot spots. Optionally, the card module 10 utilizes an axisymmetric structure (such as a regular hexagonal prism) to set multiple inner and outer module grid layers 3, with a reasonably designed heat exchange medium channel in the middle, allowing for sufficient heat exchange between the heat exchange medium and the card cores 1 in the module grid layers 3. The card cores 1 are filled in the module grid layers 3 in an array, which allows for reasonable allocation of assembly points and reserved space for wiring circuit layout. This card module 10 is small in size, easy to hide, and does not affect the appearance.

[0044] In some optional embodiments, the support frame includes a skeleton 2 and a module grid layer 3. The skeleton 2 is a double-layered hexagonal prism, with outward openings on each side of the inner and outer hexagonal prisms for fixing the module grid layer 3 containing the MLCC chip 1. An inner module grid layer 4 is disposed on the side of the inner hexagonal prism of the skeleton 2, and an outer module grid layer 5 is disposed on the side of the outer hexagonal prism of the skeleton 2. Optionally, each side of the outer module grid layer 5 has holes, allowing for the array stacking of 44 MLCC chips 1 (4*1*11), and each side of the inner module grid layer 4 has holes, allowing for the array stacking of 12 MLCC chips 1 (1*12). A total of (44+12)*6 (336 MLCCs) are stacked on 12 sides.

[0045] Optionally, the array form and number of cores on the module grid layer 3 can be adjusted according to the actual thermal and circuit design. For example, the number of modules containing the card core 1 can be changed, such as three or four layers, and the diagonal surface of the skeleton 2 can also be hollowed out as the module grid layer 3.

[0046] In some optional embodiments, the inner grid layer 4 and the outer grid layer 5 of the module are connected by a transverse partition of the skeleton 2. Optionally, the transverse partition is the diagonal of the skeleton 2 in the hexagonal prism card module 10. The transverse partition can be designed to be in a blocking state, meaning that the working fluid of two adjacent heat exchange medium channels will not experience thermal crosstalk. Alternatively, depending on the actual system heat exchange design, the transverse partition can be adjusted to have a central opening to allow heat exchange between adjacent heat exchange mediums, thus optimizing the system's heat output performance. In addition, there is a gap between the array openings on the sides of the inner grid layer 4 and the outer grid layer 5 of the module. Circuits can be printed on the grid surface according to actual conditions, and the card core 1 can be connected to a designated potential application point through this circuit. Alternatively, other passive components can be arranged in non-perforated positions on the sides of the inner grid layer 4 and the outer grid layer 5 of the module as required, and configured together with the card core 1 into the entire circuit.

[0047] In some embodiments, the card core 1 includes at least one of a multilayer ceramic capacitor, a ceramic sheet, an organic dielectric, and an organic-inorganic composite dielectric. The card core 1 includes a material with an electrocarding effect, and optionally, the material needs to have a certain electrocarding adiabatic temperature change at room temperature, such as greater than 0.5K.

[0048] This application embodiment also provides a temperature control device applied to a display screen 17. The temperature control device includes the aforementioned card module 10 and a temperature control component. The temperature control component is connected to the card module 10, and the card module 10 transfers cold or heat to the display screen 17 through the temperature control component.

[0049] According to the temperature control device in this embodiment, the electric card core 1 generates temperature changes based on the electric card effect. When an electric field is applied, the electric card core 1 undergoes a reversible adiabatic temperature change, releasing heat through the orderly arrangement of dipoles within the material. After the electric field is removed, the dipoles become disordered and absorb heat, forming cold energy. Thus, the electric card module 10 can freely switch between cooling and heating functions to cool or heat the display screen 17. This design fundamentally solves the problem that traditional display screen temperature control technology can only cool and cannot provide heating capabilities in low-temperature environments. It enables the display screen to quickly recover its operating temperature in extremely cold environments, avoiding display abnormalities caused by slow screen response, liquid crystal viscosity, or OLED pixel aging, and significantly improving the usability and lifespan of the display screen in extreme climates.

[0050] Specifically, when the ambient temperature is low and the display screen 17 temperature is below a set threshold, an electric field is applied to the power card module 10 to raise its temperature and release heat. The heat exchange medium flows through the power card core 1, absorbs the heat, and then delivers it to the surface of the display screen 17, actively heating the screen and allowing it to quickly return to its normal operating temperature. This avoids response lag, color distortion, or pixel failure caused by low temperatures. When the temperature is too high, the electric field is removed from the power card module 10, which absorbs heat and generates cooling. The heat exchange medium flows through the power card module 10, absorbs the cooling, and then cools the screen, preventing brightness decay or screen burn-in caused by overheating. This bidirectional temperature control mechanism requires no additional heating elements and achieves full-temperature adaptability simply by switching the direction of the medium flow. It completely solves the problem that traditional technologies can only cool and cannot cope with cold environments, significantly improving the usability and lifespan of the display screen 17 in frigid regions.

[0051] Optionally, the temperature control component forms a closed loop with the power card module 10 via the flexible conduit 7 and is directly attached to the back of the display screen 17 to minimize the heat flow path. The power card module 10 can be a regular hexagonal prism to facilitate matching and installation with the back panel of the display screen 17, simplifying the overall layout and improving the integration of the appearance.

[0052] In some embodiments, the temperature control component includes a temperature control housing 6 disposed on the back of the display screen 17, the temperature control housing 6 containing a heat exchange medium, and the temperature control housing 6 communicating with the card module 10 via a conduit 7; or, the temperature control component includes a temperature control housing 6 disposed on the back of the display screen 17, the temperature control housing 6 containing a heat exchange medium, the temperature control housing 6 communicating with the card module 10 via a conduit 7, and the temperature control housing 6 including a heat-conducting layer 8 for conducting cold or heat.

[0053] Specifically, the temperature control housing 6 contains a heat exchange medium within its inner cavity, and the electronic card module 10 is connected to it via a conduit 7. The temperature control housing 6 is positioned on the back of the display screen 17 to enhance heat exchange with it, or it can be connected to the electronic card module 10 via a heat-conducting layer 8 to achieve cooling or heating of the display screen 17. Additionally, the temperature control component may include the temperature control housing 6 and the heat-conducting layer 8. The heat-conducting layer 8 is positioned within the inner cavity of the temperature control housing 6, laid flat beneath it, ensuring a large heat-conducting area. This allows it to absorb or release latent heat during temperature fluctuations, buffering instantaneous thermal shocks and maintaining a uniform surface temperature of the display screen 17, preventing uneven display due to localized overheating or undercooling.

[0054] Optionally, the thermally conductive layer 8 is made of a material with good thermal conductivity, such as thermally conductive silicone material, which can be replaced by a thermally conductive film such as graphene film. The liquid heat exchange medium inside the temperature control housing 6 has the characteristics of high thermal conductivity and good insulation, such as silicone oil and deionized water.

[0055] Furthermore, the temperature control housing 6 is a cubic structure with an internal cavity, or it can be replaced by a row of conductive tubes. The contact surface between the conductive tubes and the display screen 17 is made of a material with high thermal conductivity.

[0056] In some embodiments, the temperature control housing 6 further includes a liquid storage plate 9 and a first liquid storage tank 11; the liquid storage plate 9 is disposed between the heat-conducting layer 8 and the first liquid storage tank 11, and the heat-conducting layer 8 is disposed between the display screen 17 and the liquid storage plate 9. Both the liquid storage plate 9 and the first liquid storage tank 11 are used to accommodate the volume fluctuation of the heat exchange medium caused by temperature changes. The liquid storage plate 9 can increase the heat exchange area with the heat-conducting layer 8 and improve the heat exchange efficiency. In addition, a first liquid storage end is provided above the heat-conducting layer 8, which simplifies the overall structure and optimizes the space arrangement.

[0057] Optionally, the liquid storage plate 9 is made of a material with good thermal insulation properties, such as polyurethane. The first liquid storage tank 11 is made of a softer material, such as PET, to facilitate the adjustment of the liquid flow direction during operation.

[0058] In some embodiments, the temperature control device further includes a module housing 12, with the card module 10 disposed inside the module housing 12; or, the temperature control device further includes a module housing 12 and an insulation sleeve, with the card module 10 disposed inside the insulation sleeve and the module housing 12 disposed outside the insulation sleeve.

[0059] Specifically, the inner cavity of the module housing 12 is equipped with an insulating sleeve, and the electrical card module 10 is placed in the center of the insulating sleeve. During operation, the liquid heat exchange medium fills the entire interior of the insulating sleeve and flows for heat exchange within the gaps of the electrical card module. The electrical card module 10 is encapsulated in the insulating sleeve, which effectively blocks the loss of heat or cold, ensures that the temperature difference remains stable when switching between heating and cooling modes, improves temperature control efficiency, and prevents the surface temperature of the housing from becoming too high and affecting surrounding components.

[0060] Optionally, the shape of the module housing 12 and the insulation sheath can be a cuboid or a prism.

[0061] In some embodiments, the temperature control device further includes a temperature sensor 14 for detecting the temperature of the display screen 17; and / or, it further includes a second liquid storage tank 13 for storing the heat exchange medium.

[0062] Specifically, the temperature sensor 14 can be directly mounted on a key area of ​​the back panel of the display screen 17 to collect temperature signals in real time, which is beneficial for timely feedback of the operating temperature. Based on the threshold set by the temperature sensor 14, the heating or cooling intensity can be dynamically adjusted to realize the automatic temperature control function of the display screen 17; at the same time, the system operating parameters can be dynamically adjusted and optimized to reduce operating energy consumption. The second liquid storage tank 13, as an expansion compensation unit, can be connected to the first liquid storage tank 11 to accommodate the volume fluctuation of the medium caused by temperature changes, prevent abnormal system pressure, and ensure long-term safe operation.

[0063] In some embodiments, the temperature control device further includes a heat dissipation component 15 for dissipating the heat generated by the card core 1; the heat dissipation component 15 includes at least one of heat dissipation fins and a fan.

[0064] Specifically, the heat dissipation component 15 is installed on the hot end outlet side of the temperature control device to dissipate the heat generated by the card core 1, thereby improving heat exchange efficiency. The heat dissipation component 15 can be at least one of heat dissipation fins and a fan, or it can be composed of heat dissipation fins and a low-noise fan, forming an efficient heat dissipation path from the hot end to the environment, quickly dissipating waste heat, avoiding heat accumulation, and improving the overall thermal management efficiency of the system. Optionally, the heat dissipation fins are set on the outside of the second liquid storage tank 13, which reduces the overall size of the temperature control device through integration, making it easier to arrange and install.

[0065] In some embodiments, the temperature control device further includes a flow control element 16 for adjusting the flow direction of the heat exchange medium, the flow control element 16 including, but not limited to, a movable valve or a bidirectional pump body.

[0066] Specifically, when the display screen 17 switches between heating and cooling modes, the flow control component 16 can control the flow direction of the medium, enabling bidirectional operation of a single electric card module 10. The temperature control device is a regenerative electric card structure or a heat storage electric card structure. The cooling / heating principle of the heat storage or regenerative electric card is mainly as follows: When the electric card core 1 is powered on, the temperature of the entire core module rises, and the flow control component 16 pushes the liquid heat exchange medium towards the hot end of the temperature control device; when the power is off, the temperature of the core module drops, and the flow control component 16 pushes the liquid medium towards the cold end of the temperature control device. By drawing in and out the liquid heat exchange medium, a temperature difference is created and maintained between the cold and hot ends of the temperature control device, thereby achieving cooling and heating of the display screen 17.

[0067] Optionally, the movable valve can adjust the flow direction of the liquid medium by pushing and pulling its lever. The movable valve can be configured as a unidirectional translational piston structure, or it can be replaced with other mechanical structures that support vertical movement, such as injection pumps, peristaltic pumps, screw pumps, hydraulic pumps, gear pumps, etc., depending on the configuration. It is controlled by an electrical signal.

[0068] In some optional embodiments, a temperature-controlled housing 6 with adjustable temperature is placed behind the display screen 17. The temperature-controlled housing 6 consists of a liquid storage plate 9, a heat-conducting layer 8, and a first liquid storage tank 11. The temperature control device also includes a module housing 12, an insulating sleeve, heat dissipation fins, a temperature sensor 14, a second liquid storage tank 13, and a movable valve. The module housing 12 is located outside the insulating sleeve, the heat dissipation fins are located outside the second liquid storage tank 13, the movable valve is located inside the second liquid storage tank 13, and the temperature sensor 14 is located on the back of the display screen 17. The temperature-controlled housing 6 is connected to the module housing 12 via three conduits 7. The electronic card module 10 is placed inside the insulating sleeve within the module housing 12, and the other end of the module housing 12 is connected to the second liquid storage tank 13 with heat dissipation fins. The second liquid storage tank 13 contains a movable valve, and the flow direction of the liquid medium can be adjusted by pushing and pulling the lever of the movable valve. Temperature sensor 14 can detect the temperature of display screen 17 in real time. When the temperature of display screen 17 is higher than a certain threshold, the cooling mode is turned on. When the temperature of display screen 17 is lower than a certain threshold, the heating mode is turned on.

[0069] Specifically, in the heating mode of the display screen 17: an electric field is applied to the card module 10, causing it to heat up instantly. This heat is transferred to the liquid heat exchange medium in the module housing 12, causing the liquid heat exchange medium to heat up. The flow control component 16 pushes the liquid heat exchange medium through the conduit 7 on the left side of the module housing 12 towards the liquid storage plate 9 in the temperature control housing 6. Excess liquid heat exchange medium is stored in the first liquid storage tank 11, and heat is transferred to the display screen 17 through the heat-conducting layer 8. The first liquid storage tank 11 then becomes the hot end, and the card module 10 in the module housing 12 returns to room temperature. When the electric field is removed, the card module 10 cools down instantly, absorbing the heat from the liquid medium in the module shell 12. As the liquid medium cools down, the flow control device 16 pushes the liquid to the second storage tank 13 on the right. The low-temperature liquid exchanges heat with the environment through the heat dissipation fins. The second storage tank 13 is the cold end. At this time, the liquid temperature in the display device has formed a gradient distribution, with the first storage tank 11 being the high-temperature end and the second storage tank 13 being the low-temperature end. By repeating the above steps of applying and removing the electric field, the temperature difference between the left and right ends of the display device can be amplified, thus achieving the heating effect of the display screen 17.

[0070] Cooling mode of display screen 17: When an electric field is applied to the card module 10, the card module 10 heats up instantly. The heat is transferred to the liquid heat exchange medium in the module housing 12, causing the liquid heat exchange medium to heat up. The flow control component 16 pushes the liquid to the second liquid storage tank 13 on the right. The high-temperature liquid transfers heat to the heat dissipation fins, and the card module 10 in the module housing 12 returns to room temperature. When the electric field is removed, the card module 10 cools down instantly, absorbing the heat from the liquid medium in the module housing 12. The liquid medium cools down, and the flow control component 16 pushes the liquid... The liquid heat exchange medium is pushed through the conduit 7 on the left side of the module housing 12 to the liquid storage plate 9 in the temperature control housing 6. Excess liquid heat exchange medium will be stored in the first liquid storage tank 11 and the cooling capacity will be transferred to the display screen 17 through the heat conduction layer 8. At this time, the liquid temperature in the display device has been distributed in a gradient. The second liquid storage tank 13 is the high temperature end and the first liquid storage tank 11 is the low temperature end. By repeating the above steps of applying and removing the electric field, the temperature difference between the left and right ends of the display device can be amplified, and the cooling effect of the display screen 17 can be achieved.

[0071] Optionally, the positions of the cold and hot ends of the temperature control device can be reversed by adjusting the direction of the heat exchange medium flow or the sequence of power-on and power-off of the electric card module 10. Specifically, when an electric field is applied to the electric card module 10, the module heats up, and the liquid is pushed to the left, making the left end the hot end; if the liquid is pushed to the right, the right end is the hot end. When the electric field is disconnected from the electric card module 10, the module cools down, and the liquid is pushed to the left, making the left end the cold end; if the liquid is pushed to the right, the right end is the cold end. Thus, the positions of the cold and hot ends can be changed by adjusting the direction of the liquid flow. Furthermore, this design results in a greater distance between the cold and hot ends of the temperature control device, improving heat dissipation efficiency and optimizing space arrangement.

[0072] This application embodiment also provides an in-vehicle display device, which includes a display screen 17 and the aforementioned temperature control device, wherein the display screen 17 is temperature-regulated by the temperature control device.

[0073] Specifically, in low-temperature environments, the temperature control device activates the heating mode, allowing the screen to quickly return to a suitable operating temperature, eliminating display delays, color distortion, or touch malfunctions caused by cold. In high-temperature environments, the temperature control device switches to cooling mode to suppress screen overheating, prevent brightness decay and permanent pixel damage, achieve high-precision control, reduce overall energy consumption, and improve display quality and user experience. Furthermore, the power card module 10 is small in size, making it easy to hide within the support structure of the display screen 17 without affecting aesthetics. The power card cooling core can be connected to a liquid cooling circuit, eliminating the need for an additional water tank, thus achieving miniaturization and weight reduction of the device structure.

[0074] This application also provides a vehicle, including the above-mentioned electronic card module 10, temperature control device or vehicle display device.

[0075] The vehicle is equipped with multiple displays 17, including a central control screen, an instrument panel, and a passenger entertainment screen. All displays 17 utilize the temperature control device described in this patent, sharing a central control unit and a heat exchange medium circulation system. The electrical card module 10 is distributed on the back of each screen, achieving coordinated temperature control through a shared liquid storage tank and flow control component 16. This technical solution significantly reduces the energy consumption of the vehicle's thermal management system, improves driving range, and meets stringent automotive-grade reliability requirements, providing an efficient, reliable, and lightweight temperature control solution for the intelligent cockpit.

[0076] Other components and operations of the vehicle according to embodiments of the present invention are known to those skilled in the art and will not be described in detail here.

[0077] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example.

[0078] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. An electronic card module (10), characterized in that, include: The card core (1) generates temperature changes based on the card effect, which is used to generate cold or heat. A support frame is used to fix the card core (1), and the support frame forms a heat exchange medium channel for exporting the cold or heat.

2. The electronic card module (10) according to claim 1, characterized in that, The support frame includes a skeleton (2) and a module grid layer (3). The skeleton (2) is used to support the module grid layer, and the module grid layer is used to fix the card core (1).

3. The electronic card module (10) according to claim 2, characterized in that, The module grid layer (3) has at least one layer, and each module grid layer (3) has an installation hole; the module grid layer (3) includes at least an insulating material to avoid electrical interference between the card cores (1).

4. The electronic card module (10) according to claim 3, characterized in that, The module grid layer (3) has two or more layers, and the heat exchange medium channel includes the channel between the gaps of the multiple module grid layers (3).

5. The electronic card module (10) according to claim 1, characterized in that, The overall structure of the electronic card module (10) is an axisymmetric structure, which includes at least one of a cylinder and a regular polygonal prism.

6. The electronic card module (10) according to any one of claims 1-5, characterized in that, The card core (1) includes at least one of the following: multilayer ceramic capacitor, ceramic sheet, organic dielectric, and organic-inorganic composite dielectric.

7. A temperature control device, characterized in that, Applied to the display screen (17), including: The electronic card module (10) according to any one of claims 1-6; The temperature control component is connected to the card module (10), and the card module (10) transmits the cold or heat to the display screen (17) through the temperature control component.

8. The temperature control device according to claim 7, characterized in that, The temperature control component includes a temperature control housing (6), which is disposed on the back of the display screen (17). The temperature control housing (6) contains a heat exchange medium, and the temperature control housing (6) is connected to the electronic card module (10) through a conduit (7); or, The temperature control component includes a temperature control housing (6), which is disposed on the back of the display screen (17). The temperature control housing (6) contains a heat exchange medium. The temperature control housing (6) is connected to the electronic card module (10) through a conduit (7). The temperature control housing (6) includes a heat-conducting layer (8), which is used to conduct the cold or heat.

9. The temperature control device according to claim 8, characterized in that, The temperature control housing (6) also includes a liquid storage plate (9) and a first liquid storage tank (11); the liquid storage plate (9) is disposed between the heat-conducting layer (8) and the first liquid storage tank (11), and the heat-conducting layer (8) is disposed between the display screen (17) and the liquid storage plate (9).

10. The temperature control device according to claim 7, characterized in that, It also includes a module housing (12), wherein the electronic card module (10) is disposed within the module housing (12); or, The temperature control device also includes a module housing (12) and an insulation sleeve. The electric card module (10) is located inside the insulation sleeve, and the module housing (12) is located outside the insulation sleeve.

11. The temperature control device according to claim 7, characterized in that, It also includes a temperature sensor (14) for detecting the temperature of the display screen (17); and / or, It also includes a second liquid storage tank (13) for storing the heat exchange medium.

12. The temperature control device according to claim 7, characterized in that, It also includes a heat dissipation component (15) for dissipating the heat generated by the card core (1); the heat dissipation component (15) includes at least one of heat dissipation fins and a fan.

13. The temperature control device according to any one of claims 7-12, characterized in that, It also includes a flow control element (16) for adjusting the flow direction of the heat exchange medium, the flow control element (16) including but not limited to a movable valve or a bidirectional pump body.

14. A vehicle-mounted display device, characterized in that, include: Display screen (17); The temperature control device according to any one of claims 7-13, wherein the display screen (17) adjusts the temperature through the temperature control device.

15. A vehicle, characterized in that, It includes the electric card module (10) according to any one of claims 1-6, or the temperature control device according to any one of claims 7-13, or the vehicle display device according to claim 14.

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