MIPI test FPC and display module
By setting MIPI test points on the main screen FPC body and using copper leakage and EMI shielding layers for protection, the signal interference problem caused by the long distance between the MIPI interface test points and the driver IC is solved, achieving more accurate testing and more efficient assembly and maintenance.
Patent Information
- Application Number
- CN202521215079.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-13
- Publication Date
- 2026-11-03
- Estimated Expiration
- 2035-06-13
AI Technical Summary
In mobile devices such as smartphones, the test points of the MIPI interface are far from the display module driver IC, which causes the signal to be affected by the FPC during transmission, resulting in inaccurate test results and increasing development costs and time.
MIPI test points are directly set on the main screen FPC body to shorten the distance between the MIPI test points and the driver IC. Copper leakage setting and EMI shielding layer protection are adopted to reduce the impact of FPC transmission on the signal. Combined with the pluggable design of BTB connector to improve maintainability.
It improves the accuracy of MIPI performance testing, simplifies the assembly and maintenance process, reduces costs and time, and enhances the stability of signal transmission and the convenience of testing.
Smart Images

Figure CN224934489U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of display module technology, and more specifically, to a MIPI testing FPC and display module. Background Technology
[0002] In mobile devices such as smartphones, display modules mostly use the MIPI interface protocol for data transmission. During the whole machine testing process, in order to verify the performance of the MIPI interface, such as key indicators like eye diagrams, it is necessary to bring the MIPI test points out from the motherboard. However, the traditional method of bringing out test points from the motherboard has significant drawbacks: the test points are too far from the display module driver IC, causing the signal to be affected by the FPC during transmission, resulting in inaccurate test results. This inaccuracy seriously affects the efficiency of product development and testing, increasing development costs and time. Therefore, we have proposed an improvement, namely a MIPI test for the FPC and display module. Utility Model Content
[0003] The technical problem to be solved by this utility model embodiment is that the test point is far away from the display module driver IC, which causes the signal to be affected by the FPC during transmission.
[0004] To solve the above-mentioned technical problems, the present invention adopts the following technical solution: A MIPI testing FPC includes: a main screen FPC body, signal traces on the main screen FPC body including MIPI transmission signal lines, and MIPI test points connected to the MIPI transmission signal lines. This application, by directly setting the MIPI test points on the main screen FPC body, shortens the distance between the MIPI test points and the driver IC, reduces the impact of FPC transmission on the signal, and thus improves the accuracy of MIPI performance testing.
[0005] As an improvement of this utility model, one end of the main screen FPC body is set as the main screen FPC binding position, and the other end of the main screen FPC body is set with a BTB connector. The setting of the main screen FPC binding position makes the connection between the main screen FPC body and the display module body more convenient and quick, reducing assembly time and difficulty; the pluggable function of the BTB connector allows the FPC to be easily disassembled and replaced when the module malfunctions or needs to be upgraded, without the need for large-scale disassembly of the entire module, thereby improving maintainability.
[0006] As an improvement of this utility model, the signal routing also includes power signal lines and touch signal lines.
[0007] As an improvement of this utility model, the number of MIPI transmission signal lines is five pairs. The five pairs of MIPI transmission signal lines are divided into four groups of DATA signals and one group of clock CLKP / CLKN signals, which conforms to the signal grouping design of the MIPI standard, supports high-speed differential signal transmission, and meets the requirements of high-resolution display.
[0008] As an improvement of this utility model, the four sets of DATA signals include D0P / D0N, D1P / D1N, D2P / D2N, and D3P / D3N. The standardized signal naming and layout facilitate circuit design and testing verification in production and manufacturing, and improve compatibility.
[0009] As an improvement of this utility model, the number of MIPI test points is five pairs, and the five pairs of MIPI test points correspond to five pairs of MIPI transmission signal lines respectively.
[0010] As an improvement of this utility model, the trace width of the MIPI transmission signal line is 0.06mm, and the length of the MIPI transmission signal line is <0.7mm.
[0011] As an improvement of this utility model, the MIPI test point adopts a copper-spot setting. The copper-spot setting allows the MIPI test point to be directly connected to the test equipment without the need for additional soldering of test pins, reducing soldering procedures and material costs, and also shortening the test preparation time, making it more convenient and faster for testers to perform waveform tests.
[0012] As an improvement of this utility model, an EMI shielding layer is provided on the MIPI test point. The EMI shielding layer is used to protect the MIPI test point from external interference. When MIPI testing is required, the EMI shielding layer can be scraped off. The operation is simple and convenient and will not have too much impact on the testing process.
[0013] A display module, using MIPI to test FPC, includes a display module body, a driver IC mounted on the display module body, and a main screen FPC bonding strip attached to the display module body. Compared with the prior art, the embodiments of this utility model have the following main advantages: To address the problem in existing technologies where the test points are too far from the display module driver IC, causing signal transmission to be affected by the FPC, this application directly sets MIPI test points on the main screen FPC body, shortening the distance between the MIPI test points and the driver IC, reducing the impact of FPC transmission on the signal, and thus improving the accuracy of MIPI performance testing. Attached Figure Description
[0014] Figure 1A schematic diagram of the MIPI test structure provided in this application; Figure 2 Provided for this application Figure 1 Enlarged structural diagram at point A in the middle; Figure 3 This is a schematic diagram of the structure of the MIPI test FPC and display module provided in this application; Figure 4 Provided for this application Figure 3 A partial structural diagram.
[0015] The image shows: 1. Main screen FPC body; 102. Main screen FPC bonding position; 103. Backlight FPC pad; 104. Component area; 105. BTB connector; 106. MIPI transmission signal line; 2. MIPI test point; 3. Display module body; 301. Driver IC. Detailed Implementation
[0016] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs; the terminology used herein in the specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The reference herein to "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of the invention. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.
[0017] As described in the background section, the traditional method of bringing out test points on the motherboard has significant drawbacks: the test points are far from the display module driver IC, causing the signal to be affected by the FPC during transmission, resulting in inaccurate test results. This inaccuracy seriously affects the efficiency of product development and testing, and increases development costs and time.
[0018] To solve this technical problem, this utility model provides a MIPI testing FPC and display module.
[0019] For details, please refer to Figures 1-2 The MIPI test FPC specifically includes: The main screen FPC body 1 has signal traces, including MIPI transmission signal lines 106. The main screen FPC body 1 also has MIPI test points 2 connected to the MIPI transmission signal lines 106.
[0020] The MIPI test FPC and display module provided by this utility model shortens the distance between the MIPI test point 2 and the driver IC 301 by directly setting the MIPI test point 2 on the main screen FPC body 1, reducing the impact of FPC transmission on the signal, thereby improving the accuracy of MIPI performance testing.
[0021] To enable those skilled in the art to better understand the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings.
[0022] It should be noted that, unless otherwise specified, the embodiments and features and technical solutions in the present invention can be combined with each other.
[0023] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.
[0024] Example 1 Please refer to Figures 1-2 The present invention relates to a MIPI testing FPC, comprising: a main screen FPC body 1, on which signal traces are provided, including a MIPI transmission signal line 106, and a MIPI test point 2 connected to the MIPI transmission signal line 106. By directly setting the MIPI test point 2 on the main screen FPC body 1, the present application shortens the distance between the MIPI test point 2 and the driver IC 301, reduces the impact of FPC transmission on the signal, and thus improves the accuracy of MIPI performance testing.
[0025] Furthermore, one end of the main screen FPC body 1 is set as the main screen FPC binding position 102, and the other end of the main screen FPC body 1 is set with a BTB connector 105. The setting of the main screen FPC binding position 102 makes the connection between the main screen FPC body 1 and the display module body 3 more convenient and quick, reducing assembly time and difficulty. The pluggable function of the BTB connector 105 allows the FPC to be easily disassembled and replaced when the module fails or needs to be upgraded, without the need for large-scale disassembly of the entire module, thereby improving maintainability.
[0026] Furthermore, the signal routing also includes power signal lines and touch signal lines; integrating multiple signal lines into the same FPC reduces the number of external connection lines, thereby reducing the overall complexity and failure rate of the module.
[0027] Furthermore, the number of MIPI transmission signal lines 106 is five pairs. The five pairs of MIPI transmission signal lines 106 are divided into four groups of DATA signals and one group of clock CLKP / CLKN signals, which conforms to the MIPI standard signal grouping design, supports high-speed differential signal transmission, and meets the requirements of high-resolution display.
[0028] Furthermore, the four sets of DATA signals, including D0P / D0N, D1P / D1N, D2P / D2N, and D3P / D3N, feature standardized signal naming and layout, facilitating circuit design and testing verification during manufacturing and improving compatibility.
[0029] Furthermore, the number of MIPI test points 2 is five pairs, and the five pairs of MIPI test points 2 correspond to five pairs of MIPI transmission signal lines 106. For ease of understanding, this application... Figure 1 and Figure 2 The location of five pairs of MIPI test points 2 is marked with rectangles, and the rectangles are marked with B; the one-to-one test point design can independently monitor the quality of each pair of differential signals, making it easy to locate single-channel faults.
[0030] Furthermore, the trace width of the MIPI transmission signal line 106 is 0.06mm, and the length of the MIPI transmission signal line 106 is <0.7mm. Reasonable trace width and length can control the impedance and transmission delay of the signal, reduce signal loss and reflection during transmission, and also reduce mutual interference between signals.
[0031] Furthermore, MIPI test point 2 adopts a copper-spotting configuration, which allows MIPI test point 2 to be directly connected to the test equipment without the need for additional soldering of test pins. This reduces soldering steps and material costs, while also shortening test preparation time, making it easier and faster for testers to perform waveform tests.
[0032] Furthermore, an EMI shielding layer is installed on MIPI test point 2. The EMI shielding layer is used to protect MIPI test point 2 from external interference. When MIPI testing is required, the EMI shielding layer can be simply scraped off. The operation is simple and convenient and will not have too much impact on the testing process.
[0033] The main screen FPC body 1 has a component area 104, and a component protective paper is attached above the component area 104. The component protective paper prevents the component area 104 from being scratched or contaminated during the assembly process, thereby improving the production yield.
[0034] The main screen FPC body 1 is also provided with a backlight FPC pad 103. The backlight FPC pad 103 enables the backlight FPC to be easily connected to the main screen FPC body 1, ensuring the normal implementation of the backlight function, and also facilitating assembly and debugging during the production process.
[0035] A reinforcing plate is glued to the back of the BTB connector 105 on the main screen FPC body 1. The reinforcing plate is made of FR4, PI or stainless steel. The outer surface of the reinforcing plate is provided with diamond knurling. The reinforcing plate enhances the mechanical strength of the area of BTB connector 105, and the diamond knurling improves the adhesion of the glue and improves the firmness of the connection.
[0036] Example 2 Please refer to Figures 3-4 The present invention relates to a display module that uses MIPI testing of the FPC. It includes a display module body 3, on which a driver IC 301 is provided, and the main screen FPC binding position 102 is attached to the display module body 3. The shortened MIPI signal path reduces signal distortion, and the design of MIPI test point 2 accelerates fault diagnosis. Together, they improve the yield rate and performance stability of the module.
[0037] Obviously, the embodiments described above are only some embodiments of this utility model, not all embodiments. The accompanying drawings show preferred embodiments of this utility model, but do not limit the patent scope of this utility model. This utility model can be implemented in many different forms; rather, the purpose of providing these embodiments is to provide a more thorough and comprehensive understanding of the disclosure of this utility model. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing specific embodiments, or make equivalent substitutions for some of the technical features. Any equivalent structures made using the content of this utility model specification and drawings, directly or indirectly applied to other related technical fields, are similarly within the patent protection scope of this utility model.
Claims
1. A MIPI testing FPC, characterized in that, include: The main screen FPC body (1) is provided with signal traces, including MIPI transmission signal lines (106). The main screen FPC body (1) is also provided with MIPI test points (2) connected to the MIPI transmission signal lines (106).
2. The MIPI test FPC according to claim 1, characterized in that, One end of the main screen FPC body (1) is set as the main screen FPC binding position (102), and the other end of the main screen FPC body (1) is set with a BTB connector (105).
3. The MIPI test FPC according to claim 2, characterized in that, The signal traces also include power signal lines and touch signal lines.
4. The MIPI test FPC according to claim 2, characterized in that, The number of MIPI transmission signal lines (106) is five pairs, and the five pairs of MIPI transmission signal lines (106) are divided into four groups of DATA signals and one group of clock CLKP / CLKN signals.
5. The MIPI test FPC according to claim 4, characterized in that, The four DATA signals include D0P / D0N, D1P / D1N, D2P / D2N, and D3P / D3N.
6. The MIPI test FPC according to claim 5, characterized in that, The number of MIPI test points (2) is five pairs, and the five pairs of MIPI test points (2) correspond to five pairs of MIPI transmission signal lines (106).
7. The MIPI test FPC according to claim 2, characterized in that, The trace width of the MIPI transmission signal line (106) is 0.06 mm, and the length of the MIPI transmission signal line (106) is < 0.7 mm.
8. The MIPI test FPC according to claim 2, characterized in that, The MIPI test point (2) is set with copper leakage.
9. The MIPI test FPC according to claim 8, characterized in that, An EMI shielding layer is provided on the MIPI test point (2).
10. A display module, using the MIPI test FPC as described in any one of claims 2-9, characterized in that, The display module body (3) includes a driver IC (301) on the display module body (3) and a main screen FPC binding position (102) on the display module body (3).
