Modular electronic assembly assembly structure

Abstract

The utility model discloses a modular electronic assembly splicing structure belongs to modular electronic assembly technical field, including busbar, the top of busbar is equipped with rectangular groove, the inside bottom surface of rectangular groove is equipped with pinhole, and the both sides inner wall of rectangular groove is connected with the inside open baffle through the pivot, and the outer periphery of the end of pivot is equipped with the first torsional spring, and the top of busbar is equipped with the pin seat, and the inside of pin seat is inserted with the pin, and the outer periphery of the bottom of pin is equipped with the corrugated rubber cover, and the bottom of corrugated rubber cover is equipped with the conical sleeve ring, through utilizing the corrugated rubber cover of conical sleeve ring, cooperate spring and guide rod, make when not splice, realize the function of protecting pin, avoid the influence of external force and bend, and set up inside open baffle in the top rectangular groove of pinhole, cooperate pivot and first torsional spring, carry out dustproof to rectangular groove and pinhole inside, avoid the dirt and other sundries and enter, lead to the situation that pinhole inner wall and pin contact badly occur, play good dustproof effect.

Description

Technical Field

[0001] This utility model belongs to the field of modular electronic assembly technology, specifically relating to a modular electronic component splicing structure. Background Technology

[0002] Modular electronic component splicing is a technology that uses standardized interfaces and functional modules to build electronic systems. It is commonly used in fields such as power cabinets, sensors, and communication modules. In order to ensure the versatility of modular electronic components, busbars and pin headers are generally used for splicing.

[0003] Currently, the existing method of splicing busbars and pin headers still has certain defects in use. Since the top of the pin holes of the busbar is open when not spliced, small dust and other debris can easily fall in, leading to poor contact after insertion. Moreover, when not spliced, the pin headers are completely exposed to the outside and are easily bent by external forces, affecting the splicing efficiency. To address this, we propose a modular electronic component splicing structure. Utility Model Content

[0004] The purpose of this invention is to provide a modular electronic component splicing structure to solve the existing problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a modular electronic component splicing structure, including a busbar, an inner opening baffle, and a corrugated rubber sleeve for a pin header seat. A rectangular groove is formed at the top of the busbar, and a pinhole is formed at the center of the bottom surface of the rectangular groove. The pinhole is cylindrical and extends to the bottom of the busbar via a pin. An inner opening baffle is movably connected to the opposite sides of the top of the rectangular groove via a rotating shaft. A first torsion spring is fitted around the outer periphery of the end of the rotating shaft. The two ends of the first torsion spring are fixedly connected to the inner opening baffle and the rectangular groove, respectively. A pin header seat is provided at the top of the busbar, and pins are inserted into the pin header seat. A corrugated rubber sleeve is fitted around the bottom periphery of the pins. The top of the corrugated rubber sleeve is fixedly connected to the bottom of the pin header seat by adhesive bonding. A conical collar is provided at the bottom of the corrugated rubber sleeve, and the conical collar is fitted around the outer periphery of the pins and slidably connected to them.

[0006] Preferably, the corrugated rubber sleeve has a double-layer structure, with a guide rod provided between the inner and outer layers of the corrugated rubber sleeve, and a shrinkage groove provided at the bottom of the needle holder. The top of the guide rod extends into the interior of the shrinkage groove and is slidably connected to its inner wall.

[0007] Preferably, a spring is sleeved on the outer periphery of the guide rod, and the two ends of the spring are fixedly connected to the pin header and the tapered collar, respectively.

[0008] Preferably, the top ends of both ends of the busbar are provided with slots, the bottom ends of both ends of the pin header are movably connected to the buckle plates through the movable seat and the inner rotating shaft, the outer ends of both ends of the rotating shaft inside the movable seat are provided with second torsion springs, and the top of the buckle plates are connected to pressure plates.

[0009] Preferably, a rectangular baffle is provided at the inner top of the rectangular groove, and the rectangular baffle is fixedly installed on the inner wall of the inner top of the rectangular groove and located directly above the inner opening baffle.

[0010] Preferably, the top two ends of the busbar are provided with arc-shaped inclined surfaces, and the arc-shaped inclined surfaces are located directly above the rectangular grooves.

[0011] Compared with the prior art, the beneficial effects of this utility model are: 1. By setting a corrugated rubber sleeve with a conical collar on the outer periphery of the pin header and setting a spring inside the corrugated rubber sleeve, the pin header is protected when not spliced, in conjunction with the limiting of the guide rod, to prevent bending caused by external forces. An inward-opening baffle is set in the rectangular groove at the top of the pin hole. With the help of the rotating shaft and the first torsion spring, the inward-opening baffle is closed to prevent dust from entering the rectangular groove and the inside of the pin hole, thus preventing dust and other debris from entering and causing poor contact between the inner wall of the pin hole and the pin header, achieving a good dustproof effect.

[0012] 2. By opening slots and curved slopes at both ends of the busbar, and setting buckle plates at both ends of the pin header seat through movable seats and rotating shafts, and then cooperating with the second torsion spring, the buckle plates are driven to snap into the slots, thereby achieving the snap-fit ​​fixation between the busbar and the pin header seat, thus ensuring the stability of the two after splicing, and avoiding the influence of the spring, which could cause the pin header to detach from the pin hole. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a cross-sectional structural diagram of the present invention; Figure 3 This is a schematic diagram of the busbar structure of this utility model; Figure 4 This is a schematic diagram of the buckle structure of this utility model; Figure 5 This is a schematic diagram of the inward-opening baffle structure of this utility model.

[0014] In the diagram: 1. Busbar; 2. Slot; 3. Curved bevel; 4. Rectangular groove; 5. Pinhole; 6. Rectangular baffle; 7. Inward-opening baffle; 8. Rotating shaft; 9. First torsion spring; 10. Pin header seat; 11. Buckle plate; 12. Movable seat; 13. Second torsion spring; 14. Pressure plate; 15. Pin header; 16. Conical collar; 17. Corrugated rubber sleeve; 18. Shrinkage groove; 19. Guide rod; 20. Spring. Detailed Implementation

[0015] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0016] Please see Figure 1-5 This utility model provides a modular electronic component splicing structure technical solution: including a busbar 1, an inner opening baffle 7, a pin header seat 10, and a corrugated rubber sleeve 17. The top of the busbar 1 is provided with a rectangular groove 4, and a pin hole 5 is provided at the center of the bottom surface of the rectangular groove 4. The pin hole 5 is a cylindrical structure and extends to the bottom of the busbar 1 through a pin. The inner opening baffle 7 is movably connected to the opposite sides of the top of the rectangular groove 4 through a rotating shaft 8. A first torsion spring 9 is sleeved on the outer periphery of the end of the rotating shaft 8. The two ends of the first torsion spring 9 are fixedly connected to the inner opening baffle 7 and the rectangular groove 4, respectively. The top of the busbar 1 is provided with a pin header seat 10, and a pin header 15 is inserted into the pin header seat 10. A corrugated rubber sleeve 17 is sleeved on the outer periphery of the bottom end of the pin header 15. The top of the corrugated rubber sleeve 17 is fixedly connected to the bottom of the pin header seat 10 by gluing. A conical collar 16 is provided at the bottom of the corrugated rubber sleeve 17. The conical collar 16 is sleeved on the outer periphery of the pin header 15 and slidably connected to it.

[0017] Specifically, the corrugated rubber sleeve 17 has a double-layer structure. A guide rod 19 is provided between the inner and outer layers of the corrugated rubber sleeve 17. A shrinkage groove 18 is provided at the bottom of the needle holder 10. The top of the guide rod 19 extends into the interior of the shrinkage groove 18 and is slidably connected to its inner wall.

[0018] Specifically, a spring 20 is sleeved on the outer periphery of the guide rod 19, and the two ends of the spring 20 are fixedly connected to the pin header 10 and the tapered collar 16, respectively.

[0019] Specifically, slots 2 are provided at the top of both ends of the busbar 1, and buckles 11 are movably connected to the bottom ends of both ends of the pin header 10 through movable seats 12 and their inner rotating shafts 8. Second torsion springs 13 are sleeved on the outside of both ends of the rotating shafts 8 inside the movable seats 12, and pressure plates 14 are connected to the top of the buckles 11.

[0020] Specifically, a rectangular baffle 6 is provided at the top of the inner side of the rectangular groove 4. The rectangular baffle 6 is fixedly installed on the inner wall of the top of the rectangular groove 4 and is located directly above the inner opening baffle 7.

[0021] Specifically, the top two ends of the busbar 1 are provided with arc-shaped inclined surfaces 3, and the arc-shaped inclined surfaces 3 are located directly above the rectangular grooves 4.

[0022] In this embodiment, when two modular electronic components equipped with busbars 1 and pin headers 15 are being assembled, the inner opening baffle 7 in the rectangular groove 4 at the top of the pinhole 5 is closed under the action of the first torsion spring 9, sealing the top opening of the rectangular groove 4. This prevents external dust and other debris from falling into the groove and affecting the contact between the pinhole 5 and the pin header 15. The rectangular baffle 6 also prevents the inner opening baffle 7 from over-rotating and opening in the opposite direction. Simultaneously, the corrugated rubber sleeve 17 at the bottom of the pin header seat 10 and its conical collar 16 completely block the pin header 15. Furthermore, the guide rod 19 limits the position of the corrugated rubber sleeve 17 and the conical collar 16, ensuring their stability and preventing the pin header 15 from being connected. 5. The pin header 15 is bent due to external force, thus protecting the pin header 15. When splicing two modular electronic components equipped with the busbar 1 and the pin header 15, the pin header 15 at the bottom of the pin header seat 10 is inserted into the rectangular groove 4. The pin header 15 pushes open the inner opening baffle 7, and under the pressure of the conical collar 16, it flips into place. At this time, the pin header 15 is inserted deep into the needle hole 5. The conical collar 16 moves to the upper end of the pin header 15 and is inside the rectangular groove 4. The guide rod 19 enters the shrink groove 18 and the spring 20 is in a compressed state. At the same time, the buckle plate 11 is inserted into the slot 2 under the guidance of the arc-shaped inclined surface 3, so that the busbar 1 and the pin header seat 10 form an effective snap-fit ​​positioning, thereby ensuring the stability of the splicing.

[0023] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, the phrase "comprising an element defined as..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0024] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A modular electronic component splicing structure, comprising a busbar (1), an inner baffle (7), a pin header seat (10), and a corrugated rubber sleeve (17), characterized in that: A rectangular groove (4) is provided on the top of the busbar (1). A pinhole (5) is provided at the center of the bottom surface of the rectangular groove (4). The pinhole (5) is a cylindrical structure and extends to the bottom of the busbar (1) through a pin. An inner baffle (7) is movably connected to the opposite sides of the top of the inner end of the rectangular groove (4) through a rotating shaft (8). A first torsion spring (9) is sleeved on the outer periphery of the end of the rotating shaft (8). The two ends of the first torsion spring (9) are respectively connected to the inner baffle (7) and the rectangular groove (1). 4) Internal fixed connection, the top of the busbar (1) is provided with a pin seat (10), the pin seat (10) is inserted with a pin (15), the bottom of the pin (15) is fitted with a corrugated rubber sleeve (17), the top of the corrugated rubber sleeve (17) is fixedly connected to the bottom of the pin seat (10) by gluing, the bottom of the corrugated rubber sleeve (17) is provided with a conical collar (16), the conical collar (16) is fitted on the outer periphery of the pin (15) and slidably connected to it.

2. The modular electronic component splicing structure according to claim 1, characterized in that: The corrugated rubber sleeve (17) has a double-layer structure. A guide rod (19) is provided between the inner and outer layers of the corrugated rubber sleeve (17). A shrinkage groove (18) is provided at the bottom of the needle seat (10). The top of the guide rod (19) extends into the interior of the shrinkage groove (18) and is slidably connected to its inner wall.

3. The modular electronic component splicing structure according to claim 2, characterized in that: A spring (20) is fitted around the outer periphery of the guide rod (19), and the two ends of the spring (20) are fixedly connected to the needle seat (10) and the conical collar (16), respectively.

4. The modular electronic component splicing structure according to claim 1, characterized in that: The top ends of both ends of the busbar (1) are provided with slots (2). The bottom ends of both ends of the pin header (10) are connected to the buckle plate (11) through the movable seat (12) and the rotating shaft (8) inside. The two ends of the rotating shaft (8) inside the movable seat (12) are fitted with second torsion springs (13). The top of the buckle plate (11) is connected to a pressure plate (14).

5. The modular electronic component splicing structure according to claim 1, characterized in that: The rectangular groove (4) has a rectangular baffle (6) at its inner top. The rectangular baffle (6) is fixedly installed on the inner wall of the inner top of the rectangular groove (4) and is located directly above the inner opening baffle (7).

6. The modular electronic component splicing structure according to claim 1, characterized in that: The top two ends of the busbar (1) are provided with arc-shaped inclined surfaces (3), and the arc-shaped inclined surfaces (3) are located directly above the rectangular groove (4).

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