Infrared photon temperature sensor device TO package shell
CN309454992SActive Publication Date: 2025-08-22SHANGHAI HARVECK OPTOELECTRONIC TECH CO LTD
View PDF 0 Cites 0 Cited by
Patent Information
- Application Number
- CN202430837583.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-30
- Publication Date
- 2025-08-22
- Estimated Expiration
- 2039-12-30
Smart Images
Figure 000008_ABST
Abstract
1. The name of this design product: infrared photon temperature sensor device TO package shell. 2. Purpose of this design product: This design product is used for airtight packaging of infrared photon temperature sensor devices. 3. The key point of the design of this product lies in its shape. 4. The picture or photo that best illustrates the design points: reference diagram of the assembly state. 5. Other situations that require explanation Component description: Component 1 is a TO cap, and component 2 is a TO base.
Need to check novelty before this filing date? Find Prior Art