Semiconductor package module
CN309729449SActive Publication Date: 2026-01-09WUXI QIANYE MICRO NANO TECH CO LTD
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Patent Information
- Application Number
- CN202530404220.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-10
- Publication Date
- 2026-01-09
- Estimated Expiration
- 2040-07-10
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Figure 000007_ABST
Abstract
1. Name of the designed product: semiconductor package module. 2. Use of the designed product: used as semiconductor power module package. 3. Design points of the designed product: in shape. 4. Picture or photo best indicating the design points: perspective view.
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