Wafer inspection apparatus
CN309866291SActive Publication Date: 2026-03-24QINGSOFT MICROVISION (HANGZHOU) TECH CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-15
- Publication Date
- 2026-03-24
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Figure 000007_ABST
Abstract
1. Name of the design product: wafer detection equipment. 2. Use of the design product: equipment for wafer detection in the semiconductor industry. 3. Design points of the design product: in shape. 4. Picture or photo that best shows the design points: design 1 perspective view 1. 5. Design 1 is designated as the basic design.
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