Mobile phone semiconductor heat sink (HY-605)

CN310002293SActive Publication Date: 2026-05-26王惠杰
View PDF 0 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Designs(China)
Current Assignee / Owner
王惠杰
Filing Date
2025-11-21
Publication Date
2026-05-26

Smart Images

  • Figure 000001_ABST
    Figure 000001_ABST
Patent Text Reader

Abstract

1. Name of the product in this design: Mobile phone semiconductor heat sink (HY-605). 2. Purpose of this product: This product is a radiator. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: the front view.
Need to check novelty before this filing date? Find Prior Art