Body of the sensing module
CN310017648SActive Publication Date: 2026-06-05TAIWAN ASIA SEMICONDUCTOR CORPORATION
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- TAIWAN ASIA SEMICONDUCTOR CORPORATION
- Filing Date
- 2025-12-03
- Publication Date
- 2026-06-05
Smart Images

Figure 000005_ABST
Abstract
1. The name of the design product: the main body of a sensing module. 2. The use of the design product: a sensing module installed on a wearable device to receive light and convert it into a current signal or a voltage signal. 3. The design points of the design product: the shape of the solid line part. 4. The picture or photo that best indicates the design points: perspective view. 5. The rear view is the same as the front view, and the right view is the same as the left view, so the rear view and the right view are omitted. 6. Other circumstances that need to be explained: the part depicted in solid lines in the view is the part claimed in the design.
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