Image sensor chip package
CN310018989SActive Publication Date: 2026-06-05CHONGQING ZHONGSHUN MICROELECTRONICS CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- CHONGQING ZHONGSHUN MICROELECTRONICS CO LTD
- Filing Date
- 2025-09-30
- Publication Date
- 2026-06-05
Smart Images
Figure 000007_ABST
Abstract
1. The name of the design product: image sensor chip package. 2. The use of the design product: for camera. 3. The design points of the design product: in the combination of shape and pattern. 4. The picture or photo that best shows the design points: perspective view 1. 5. Other circumstances that need to be explained: the transparent part A of the design.
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