Heat dissipating back brace and body thereof
CN310019510SActive Publication Date: 2026-06-05BEIJING XIAOMI MOBILE SOFTWARE CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- BEIJING XIAOMI MOBILE SOFTWARE CO LTD
- Filing Date
- 2023-11-22
- Publication Date
- 2026-06-05
Smart Images

Figure 000007_ABST
Abstract
1. The name of the design product: heat dissipation back clamps and its main body. 2. The use of the design product: the product is used for heat dissipation of electronic products. 3. The design points of the design product: in shape. 4. The picture or photo that best indicates the design points: design 1 perspective view 1. 5. Design 1 is designated as the basic design. 6. Other circumstances that need to be explained: designs 2 to 10 request to protect the local appearance of the product, where the dotted line part in designs 2 to 10 does not form part of the design claimed.
Need to check novelty before this filing date? Find Prior Art