Thin-film platinum heat-sensitive chip
CN310022716SActive Publication Date: 2026-06-09CHENGDU CORE INTELLIGENT TECHNOLOGY CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- CHENGDU CORE INTELLIGENT TECHNOLOGY CO LTD
- Filing Date
- 2025-12-17
- Publication Date
- 2026-06-09
Smart Images
Figure 000003_ABST
Abstract
1. The name of the design product: thin film platinum heat sensitive chip. 2. The use of the design product: for thin film platinum heat sensitive chip. 3. The design points of the design product: in the combination of shape and color. 4. The picture or photo that best shows the design points: perspective view. 5. The design claimed contains color.
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