Top-mounted heat dissipation power semiconductor module (small)

Abstract

1. Name of the product in this design: Top-Surface Heat Dissipation Power Semiconductor Module (Small). 2. Purpose of this design: This design is a small power semiconductor module, used as a power conversion unit for top surface heat dissipation design. 3. The key design feature of this product is its shape. 4. The picture or photo that best illustrates the key design points: Design 1 3D diagram 1. 5. Design 1 is designated as the basic design.

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