Divider for plate-shaped object

Abstract

Divider (30) for dividing a plate-shaped object (11) of a plate-shaped object unit (U) along a division start point formed on the plate-shaped object (11), wherein the plate-shaped object unit (U) comprises the plate-shaped object (11), an expansion layer (T) and an annular frame (F), wherein the plate-shaped object (11) is attached to the expansion layer (T), an outer circumference of the expansion layer (T) is attached to the annular frame (F), a plate-shaped object side of the plate-shaped object unit (U) is a front side of the plate-shaped object unit (U), and an expansion layer side is a rear side thereof, wherein the divider (30) comprises: a mounting table (32) to which the annular frame (F) of the plate-shaped object unit (U) is attached, wherein the mounting table (32) supports the annular frame (F) in such a way that a region of the expansion layer (T),on which the plate-shaped object (11) is attached, is exposed; a frame fastening means configured to fasten the annular frame attached to the mounting table (32); a housing (36) which, together with the extension layer (T) of the plate-shaped object unit (U) having the annular frame (F) attached to the mounting table (32), defines an enclosed space (42) configured to receive the plate-shaped object (11) of the plate-shaped object unit (U) on the front of the plate-shaped object unit (U); a gas supply source (44) configured to supply a gas to the enclosed space (42) such that the extension layer (T) of the plate-shaped object unit (U) is stretched to the rear of the same unit (U); a convex element (55, 90) configuredto exert pressure on the plate-shaped object (11) on the rear side of the plate-shaped object unit (U) via the extension layer (T), with a gas supplied from the gas supply source (44) to the closed space (42), and the extension layer (T) extended towards the rear side thereof, so that the plate-shaped object (11) is divided; and a convex element movement means (60) which is configured to move the convex element (55, 90) in an area which is at least comparable to the plate-shaped object (11), wherein several tip areas (56) are provided in the configuration of the convex element (55), or wherein the convex element (90) comprises a rotary table (91) with several protrusions (92) on its upper surface.

Description

BACKGROUND OF THE INVENTION Technical field The present invention relates to a divider for dividing a plate-shaped object which has division start points formed on it, along the division start points. State of the art It is currently common practice to divide a large number of plate-shaped objects, made, for example, from a semiconductor wafer, an optical setup wafer, ceramic, glass, or resin, into individual products, such as chips, along planned division lines. For this division, it is known, as disclosed, for example, in the Japanese patent application JP 2007-123658A (hereafter referred to as patent document 1), that division start points are first formed on a plate-shaped object along planned division lines. Subsequently, a stretching layer (thermally shrinkable adhesive strip) to which the plate-shaped object is attached is radially stretched, thus applying an external force to the plate-shaped object, which causes the object to break at the division start points. Methods for forming the division start points include the formation of modified layers or laser grooves, from where a plate-shaped object is to break off, by emitting a laser beam onto the same object along the planned division lines (see, for example, Japanese patent JP 3 408 805 B2 and Japanese patent publication no. JP 2004 - 188 475 A) and the formation of a cutting groove by using a rapidly rotating cutting blade (see, for example, Japanese patent publication no. JP H03 - 83 613 A). JP S63-251203A relates to a method for dividing a semiconductor wafer. JP 2009-148982A relates to a device for breaking a wafer. PRESENTATION OF THE INVENTION However, if the size of the chips formed after the division is small, such as 1 mm or less, the radial stretching of a strain layer to divide a plate-shaped object as disclosed in patent document 1 creates an area in the plate-shaped object that is not divided, resulting in an improper division. In this light, it is an object of the present invention to provide a divider which can properly divide all areas of a plate-shaped object that has division start points formed on it, regardless of the chip size. According to one aspect of the present invention, a splitter is provided for dividing a plate-shaped object or a plate-shaped object unit along a dividing starting point formed on the plate-shaped object. The plate-shaped object unit comprises the plate-shaped object, an expansion layer, and an annular frame. The plate-shaped object is attached to the expansion layer. An outer circumference of the expansion layer is attached to the annular frame. A plate-shaped object side of the plate-shaped object unit is its front side, and an expansion layer side is its rear side. The splitter comprises a mounting table, a frame mounting means, a housing, a gas supply source, a convex element, and a convex element movement means. The annular frame of the plate-shaped object unit is attached to the mounting table.The mounting table supports the annular frame in such a way that a portion of the expansion joint, to which the plate-shaped element is attached, is exposed. The frame fastener secures the annular frame, which is mounted on the mounting table. The housing, together with the expansion joint of the plate-shaped object unit, which encompasses the annular frame attached to the mounting table, defines an enclosed space designed to accommodate the plate-shaped object unit on its front side. The gas supply source introduces a gas into the enclosed space, thereby expanding the expansion joint of the plate-shaped object unit toward its rear side.The convex element exerts pressure on the rear side of the plate-shaped object unit via the extension layer, while gas is supplied to the enclosed space through the gas supply source, and the extension layer stretches towards the rear side, thereby dividing the plate-shaped object. The convex element's moving mechanism moves the convex element within a range that is at least comparable to the plate-shaped object. In the embodiment of the convex element, several pointed sections are provided, or the convex element comprises a rotary table with multiple protrusions on its upper surface. The convex element motion means should preferably move the convex element in one direction. The housing should preferably have a transparent section opposite the plate-shaped object of the plate-shaped object unit, which has the annular frame mounted on the mounting table. The splitter should preferably further comprise: an imaging means configured to capture an image of the plate-shaped object across the transparent section of the housing; and a mounting table rotation / motion means configured to rotate and move the mounting table, thereby aligning the splitter start point of the plate-shaped object unit with the convex element. The present invention provides a divider capable of precisely dividing all areas of a plate-shaped object with division starting points formed on it, regardless of the chip size. More precisely, the expansion layer is stretched towards the rear (side of the expansion layer) of the plate-shaped object unit as a result of gas injection onto the plate-shaped object, which is contained in the enclosed space. In this state, the plate-shaped object is supported by the convex element via the expansion layer from the rear of the plate-shaped object unit. The convex element is then moved to the rear of the plate-shaped object, thus enabling precise division of all areas of the plate-shaped object, even if the chip size is small, such as 1 mm or less. The above and other tasks, features and advantages of the present invention and the way in which they are implemented will become clearer and the invention itself will best be understood by studying the following description and the attached claims with reference to the accompanying drawings, which show some preferred embodiments of the invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective exploded view of a plate-shaped object unit; Fig. 2 is a perspective exploded view of a splitter; Fig. 3 is a perspective exploded view of the splitter; Fig. 4 is a perspective view of the splitter; Fig. 5 is a cross-sectional side view of the splitter; Fig. 6 is a perspective view of a convex element; Fig. 7 is a perspective view describing the relationship between a tip region of the convex element and a planned division line; Fig. 8 is a perspective view of a convex element according to a further embodiment; Fig. 9 is a cross-sectional side view of a splitter with the convex element according to the further embodiment; Fig. 10 is a perspective view of a convex element according to yet another embodiment; and Fig.Figure 11 is a cross-sectional side view of a divider with the convex element according to the further embodiment. DETAILED DESCRIPTION OF PREFERRED EXECUTION FORMS The present invention relates to a splitter used to produce individual chips (small components or products) by dividing a plate-shaped object having dividing start points formed on it. A detailed description of embodiments of the present invention is given below with reference to the accompanying drawings. Fig. 1 shows a semiconductor wafer 11 (hereafter simply referred to as wafer 11), an embodiment of a plate-shaped object to be processed. The wafer 11 comprises, for example, a silicon wafer with a thickness of 700 µm. A plurality of planned dividing lines (roads) 13a and 13b, which intersect each other, are formed in a grid on a front face 11a of the wafer 11. A device 15 is formed in each of the plurality of areas subdivided by the plurality of planned dividing lines 13a and 13b. The wafer 11, configured as previously described, has a setup area 17 and an unused outer circumferential area 19. The features 15 are formed in the setup area 17. The unused outer circumferential area 19 surrounds the setup area 17. A notch 12 is formed on an outer circumference of the wafer 11 as a marker to indicate the crystal orientation of the silicon wafer. It should be noted that the wafer 11, the working part to be processed, is not limited to being disk-shaped, as shown in Fig. 1, but can also be rectangular, such as square or rectangle. Furthermore, the working part need not be a semiconductor wafer, but can also be a variety of plate-shaped objects formed from an optical setup wafer, ceramic, glass, or resin. The wafer 11 is attached to an annular frame F, the inner passage of which is blocked by a stretch layer T. A front face Ta of the stretch layer T comprises an adhesive surface, and a rear face 11b of the wafer 11 is adhered to the stretch layer T. An outer circumference of the front face Ta of the stretch layer T is attached to the rear face of the annular frame F, thus merging the stretch layer T and the annular frame F. As previously described, a plate-shaped object unit U is formed, comprising the wafer 11, a plate-shaped object, the stretch layer T to which the wafer 11 is attached, and the annular frame F to which the outer circumference of the stretch layer T is attached. In the plate-shaped object unit U, the side on which the wafer 11 is located is its front face, and the side opposite it, more precisely the side of the stretch layer T, is its rear face. The wafer 11, which is attached to the plate-shaped object unit U, is divided into individual chips (small components or products) by the splitter, which will be described in detail later. In a pre-splitting stage, splitting start points are formed. Splitting start points can be formed, for example, by creating a modified layer by emitting a laser beam along the planned splitting lines 13a and 13b using a well-known laser emission unit 20, as shown in Fig. 1. Alternatively, a laser groove (laser-cut groove) can be formed for use as a splitting start point, and a cutting groove formed by a rapidly rotating cutting blade can also be used as a splitting start point. To form deplication start points, the processing feed of the wafer 11 in an X-axis direction and its movement in a Y-direction relative to the stationary laser emission unit 20 are repeated alternately, as shown in Fig. 1. This creates a modified layer in each of the planned deplication lines 13a, which run in a first direction parallel to the X-axis direction shown in Fig. 1. The wafer 11 is then rotated by 90° so that a modified layer is formed in a similar manner in each of the planned deplication lines 13b, which run in a second direction. The wafer 11, with the deplication start points arranged in a grid as described above, is divided into individual chips from the deplication start points using a splitter 30, which is shown in Fig. 2. As shown in Figs. 2, 3, 4 to 5, the splitter 30 according to the present embodiment comprises a mounting table 32, clamps (frame mounting means) 34, 34, a housing 36, a gas supply source 44, a convex element 50, and a convex element movement mechanism (convex element movement means) 60. The annular frame F of the plate-shaped object unit U is attached to the mounting table 32. The mounting table 32 supports the annular frame F in such a way that a region of the elongation layer T, to which the wafer 11 is attached as a plate-shaped object, is exposed. The clamps 34, 34 secure the annular frame F, which is mounted on the mounting table 32. The housing 36, together with the expansion position T of the plate-shaped object unit U comprising the ring-shaped frame F, which is attached to the mounting table 32, defines a closed space 42 (Fig.5), which is configured to receive the wafer 11 of the plate-shaped object unit U on the front side of the plate-shaped object U. The gas supply source 44 supplies a gas to the closed space 42, thereby stretching the extension position T of the plate-shaped object unit U towards the rear side of the same unit U. The convex element 50 exerts pressure on the wafer 11 via the extension layer T on the rear side of the plate-shaped object unit U, with gas supplied from the gas supply source 44 to the closed space 42, and the extension layer T being stretched towards the rear side, thereby splitting the wafer 11. The convex element movement mechanism 60 moves the convex element 50 in a region that is at least comparable to the wafer 11. The mounting table 32 comprises a cylindrical element and an opening region 32a, shown on a top side of the cylindrical element in Fig. 2, an opening region 32b, shown on a bottom side thereof, a continuous circumferential wall surface 32c, and a mounting front 32d, which surrounds the opening region 32a. The mounting table 32 is attached to a support table 61, which has a larger diameter than the mounting table 32. A circumferential section 32f, which forms an edge of the wall surface 32c of the mounting table 32, is inserted into an annular groove region 61m formed in the support table 61, thereby enabling the positioning of the mounting table 32 and the support table 61. Furthermore, the mounting table 32 is angled as described later. Therefore, the circumferential section 32f slides in the annular groove region 61m. The multiple clamps 34, 34 are arranged on the mounting front 32d of the mounting table 32 in such a way that they surround the opening area 32a. The clamps 34, 34 hold the annular frame F of the plate-shaped object unit U, which is attached to the mounting front 32d, thus enabling the plate-shaped object unit U to be supported by the mounting table 32. With the plate-shaped object unit U, which is supported by the mounting table 32, the opening area 32a of the mounting table 32 is blocked by the expansion layer T. Furthermore, the opening area 32a is larger in diameter than the wafer 11. As a result, the area of ​​the expansion layer T, to which the wafer 11 is attached, is exposed on one side of the convex element 50 via the opening area 32a. The housing 36 is attached to the mounting table 32, which is designed as described above, in such a way that the plate-shaped object unit U is received. The housing 36 comprises a cylindrical element with a continuous wall surface 36c. One end of the housing 36 along a cylindrical axis comprises an opening area 36b (Fig. 5), and another end comprises a closing area 35d. A circumferential region 36f, which forms an edge of the wall surface 36c of the housing 36, comes into close contact with the mounting front 32d of the mounting table 32 when attached to the mounting front 32d of the mounting table 32. As a result, the opening region 36b of the housing 36 is closed by the mounting front 36d of the expansion layer T of the plate-shaped object unit U, thereby forming a closed space 42 in the housing 36, as shown in Fig. 5. The closed space 42 is formed by the front of the expansion layer T, more precisely, the front of the plate-shaped object unit U, more precisely, the side on which the wafer 11 is arranged, as shown in Fig. 5, thus enabling the wafer 11 to be accommodated in the closed space 42. Ports 36m and 36n are formed in the housing 36 to allow a connection between spaces inside and outside the housing 36. One port 36m is connected to an external gas supply source 44 (Fig. 4), and the other port 36n is connected to an ejection path 45. A high-pressure gas is supplied to the enclosed space 42 through the gas supply source 44, thereby transferring the enclosed space 42 into a high-pressure atmosphere and pressing the wafer 11 and the strain layer T in Fig. 5 downwards. As a result, a load is applied to the same film T, which pushes the strain layer T downwards against the rear side of the plate-shaped object unit U, more precisely, against a side opposite the wafer 11 with the strain layer T in between (the load pushes the strain layer T downwards). The convex element 50 is positioned on the side opposite the wafer 11 with the expansion layer T between them. The same element 50 presses against the wafer 11 via the expansion layer T, thereby dividing the wafer 11 into individual chips. In the embodiment shown in Fig. 5, a tip area 52 of the convex element 50 is inserted into the opening area 32a of the mounting table 32, thereby pressing the rear side of the expansion layer T upwards. As a result, a load acts on the wafer 11, pushing it upwards and thus dividing the wafer 11 at the splitting start points. As shown in Fig. 6, the convex element 50 has a width W1 that is approximately equal to or greater than the diameter 11L of the wafer 11, and the tip region 52 comprises a straight, elongated protrusion with width W1. This makes it possible for a locally upward-pressing load to act on the entire area of ​​the wafer 11 in the Y-direction in Fig. 6. As shown in Fig. 5, the convex element 50 is moved by the convex element movement mechanism 60 in an area that is approximately equal to or greater than the diameter 11L of the wafer 11, more precisely, in an area M that is at least comparable to the wafer 11. This makes it possible for a locally upward-pressing load to act on the entire area of ​​the wafer 11 in the X-axis direction in Fig. 6. As shown in Fig. 2 and Fig.As shown in Fig. 5, the convex element movement mechanism 60, according to the present embodiment, rotates and drives a ball screw spindle 62 with a motor 64, which is provided horizontally on the support table 61, thereby moving the convex element 50, which is screwed into the ball screw spindle 62 in the X-axis direction in Fig. 5. When the wafer 11 is split using the upper configuration, a high-pressure gas is first supplied from the gas supply source 44 into the enclosed space 42, thereby transforming the enclosed space 42 into a high-pressure atmosphere. As a result, the elongation layer T is pressed downwards (stretched) in Fig. 5. In this state, the convex element 50 moves within the area covering the length of the diameter 11L (Fig. 6) of the wafer 11, more precisely, within an area Mx from an endpoint M1 to an endpoint M2 in the X-axis direction. This causes the elongation layer T to be pressed upwards through the tip area 52 at all times, thus applying a load to the wafer 11 and splitting it from the splitting starting points. Furthermore, when the convex element 50 is moved in the X-axis direction, the strain position T is also in the area which corresponds to the length of the diameter 11L of the wafer 11 in the Y-axis direction in Fig.6, more precisely, an area My, covered, pushed upwards. The splitting of wafer 11, which occurs as described above, is achieved not only by the convex element 50 being pushed upwards, but also by the elongation layer T (wafer 11), which is forced by a high-pressure gas. As a result, a downward load (high-pressure gas) and an upward load (convex element 50) act on the splitting start points of wafer 11, causing it to break at these points. It should be noted that, in addition to the movement of the convex element 50 in the X-axis direction, the convex element 50 as a whole, or the tip region 52 of the convex element 50, can be moved vertically by a lifting mechanism (not shown), such as a pneumatic cylinder. This movement results in a greater load acting on wafer 11, causing it to break. As previously described, the wafer 11 is pressed upwards by the convex element 50 at all times, while simultaneously being pressed downwards by the high-pressure atmosphere, thus enabling the wafer 11 to be split at the splitting start points. Furthermore, as shown in Fig. 7, the orientation of the planned linear splitting line 13a should preferably correspond to the angle (orientation) of a linear imaginary line 52a of the tip area 52, so that the load pushing the splitting start point upwards acts on the wafer 11 in a proper manner to ensure that the splitting takes place correctly. In the present embodiment, the convex element movement mechanism (convex element movement means) 60 moves the convex element 50 in one direction (X-axis direction), as shown in Figs. 2, 3, 4 to 5. The housing 36 has a transparency section 32 opposite the wafer 11 of the plate-shaped object unit U, which comprises the annular frame M mounted on the mounting table 32. The divider 30 comprises an imaging unit (imaging means) 70 configured to capture an image of the wafer 11 through the transparency section 32 of the housing 36 and a mounting table rotation / movement mechanism (mounting table rotation / movement means) 80 configured to rotate the mounting table 32, thereby aligning the division start point of the plate-shaped object unit U with the convex element 50. More precisely, as shown in Fig. 5, the convex element movement mechanism 60 rotates and drives the ball screw 62, which is mounted horizontally on the support table 61, with the motor 64, thereby moving the convex element 50, which is screwed into the ball screw 62, in the X-axis direction in a horizontal plane. Furthermore, the housing 36 has an opening area 35k, which is formed within a closed area 35d, arranged so that it faces the plate-shaped object unit U, and the transparent section 37, which is formed from a transparent element, such as glass, is arranged within the opening area 35k. The closed area 35d and the transparent section 37 also serve as a wall area, forming the enclosed space 42. The imaging unit 70, which is configured to capture an image of the wafer 11 across the transparency section 37, is located on the outer surface of the housing 36 opposite the transparency section 37. The imaging unit 70 captures an image of a grid pattern formed on the surface of the wafer 11. The linear planned division line 13a (Fig. 7) is detected based on the pattern, so that the orientation (angle) of the wafer 11 can be determined, for example, from the angle of the planned division line 13a. The imaging unit 70 is connected to a controller (not shown). The controller changes the angle of the mounting table 32 by using the mounting table rotation / movement mechanism 80, thereby correcting the orientation of the wafer 11, which is mounted on the mounting table 32. This correction is performed such that the angle of the linear imaginary line 52a (Fig. 7) of the tip area 52, which was previously stored in the controller, coincides with the angle of the planned split line 13a, which is detected by the imaging unit 70. It should be noted that this correction can be performed such that the angle of the planned split line 13b, which is orthogonal to the planned split line 13a, corresponds to the angle of the imaginary line 52a. As shown in Fig. 3, the mounting table rotation / movement mechanism 80, which is configured to rotate the mounting table 32, can include a motor 81 and a connecting element 82. The connecting element 82 comprises, for example, a belt which is wound around an output shaft 81a of the motor 81 and the wall surface 32c of the mounting table 32. The output shaft 81a should preferably be smaller in diameter than the mounting table 32 to allow fine adjustments of the angle of the mounting table 32 by rotating the output shaft 81a in a normal and reverse direction. Subsequently, after achieving an alignment at the angle between the imaginary line 52a and the peak region 52 of the planned division line 13a, a high-pressure gas is supplied from the gas supply source 44, as shown in Fig. 5, thereby transforming the enclosed space 42 into a high-pressure atmosphere. The convex element 50 is then moved from endpoint M1 to endpoint M2 in the X-axis direction, orthogonal to the imaginary line 52a. During this movement, every point of the planned division line 13a, which runs in the first direction, is subjected to pressure. The wafer 11 fractures at the division start point, which is formed on the planned division line 13a, due to the applied load. After the convex element 50 reaches endpoint M2, the supply of high-pressure gas from the gas supply source 44 is stopped, and the ejection path 45 is opened. This brings the enclosed space 42 to atmospheric pressure, thereby relieving the strain T, which was stretched by the high-pressure gas. The mounting table 32 is then rotated by 90°, resulting in an angular alignment between the imaginary line 52a of the tip area 52 and the planned splitting line 13b in Fig. 7. High-pressure gas is then supplied again from the gas supply source 44, transforming the enclosed space 42 into a high-pressure atmosphere. The convex element 50 is then moved from endpoint M2 to endpoint M1. This allows each point of the planned splitting line 13b, which runs in the second direction, to be pressed. The wafer 11 breaks cleanly at the splitting start point formed in the planned splitting line 13b due to the applied load. As previously described, the wafer 11 breaks at the splitting start points of the planned splitting lines 13a and 13b, which run in the first and second directions respectively, thus splitting the entire wafer 11 cleanly. Fig. 8 is a diagram illustrating a convex element 55 according to a further embodiment. A plurality of (five in the present embodiment) tip areas 56, 56 are provided in the configuration of the convex element 55, whereby the wafer 11 can be pushed upwards by each of the tip areas 56, 56. As a result, in the embodiment shown in Fig. 9, the tip area 56 at one edge of the convex element 55 reaches the endpoint M2 sooner than the other tip areas 56, 56. This contributes to a shorter time required to split the wafer 11 by moving the convex element 55 from endpoint M1 to endpoint M2 than if the convex element 55 were used with a single tip area 52, thus enabling faster splitting. Figures 10 and 11 are diagrams illustrating a convex element 90 according to yet another embodiment. The convex element 90 comprises a rotary table 91 with a plurality of projections 92, 93 on its upper surface. The rotary table 91 is rotated and driven by a motor 93. Furthermore, a shaft 94, which preferably connects the rotary table 91 and the motor 93, should be moved vertically by a lifting mechanism (not shown), such as a pneumatic cylinder, so that the rotary table 91 can move vertically. Although not specifically restricted in shape or arrangement, the protrusions 92, 92 should preferably be designed to suit the chip size (distance between the planned split lines) so that a pointed end region of each of the protrusions 92, 92 can press against the split start point. The convex element 90, which is designed as described above, is rotated by 90°, allowing the protrusions 92, 92 to periodically push the wafer 11 upwards (pushing the wafer 11 upwards) over the strain layer T, causing the wafer 11 to break at the split start points. Simultaneously, the convex element 90 is moved vertically, stretching the strain layer T. This results in a load that expands in an in-plane direction along the wafer 11, causing the wafer 11 to break more uniformly at the split start points. The rotary table 91 has a diameter identical to or larger than the setup area 17 of the wafer 11. If, on the other hand, the rotary table 91 has a diameter identical to the wafer 11, it is possible to ensure that the footprint of the convex element 90, which incorporates the rotary table 91, is the same as the area of ​​the wafer 11. This contributes to a compact size of the convex element 90 as a whole, thereby making the overall size of the divider 30 compact.

Claims

Divider (30) for dividing a plate-shaped object (11) of a plate-shaped object unit (U) along a division start point formed on the plate-shaped object (11), wherein the plate-shaped object unit (U) comprises the plate-shaped object (11), an expansion layer (T) and an annular frame (F), wherein the plate-shaped object (11) is attached to the expansion layer (T), an outer circumference of the expansion layer (T) is attached to the annular frame (F), a plate-shaped object side of the plate-shaped object unit (U) is a front side of the plate-shaped object unit (U), and an expansion layer side is a rear side thereof, wherein the divider (30) comprises: a mounting table (32) to which the annular frame (F) of the plate-shaped object unit (U) is attached, wherein the mounting table (32) supports the annular frame (F) in such a way that a region of the expansion layer (T),on which the plate-shaped object (11) is attached, is exposed; a frame fastening means configured to fasten the annular frame attached to the mounting table (32); a housing (36) which, together with the extension layer (T) of the plate-shaped object unit (U) having the annular frame (F) attached to the mounting table (32), defines an enclosed space (42) configured to receive the plate-shaped object (11) of the plate-shaped object unit (U) on the front of the plate-shaped object unit (U); a gas supply source (44) configured to supply a gas to the enclosed space (42) such that the extension layer (T) of the plate-shaped object unit (U) is stretched to the rear of the same unit (U); a convex element (55, 90) configuredto exert pressure on the plate-shaped object (11) on the rear side of the plate-shaped object unit (U) via the extension layer (T), with a gas supplied from the gas supply source (44) to the closed space (42), and the extension layer (T) extended towards the rear side thereof, so that the plate-shaped object (11) is divided; and a convex element movement means (60) which is configured to move the convex element (55, 90) in an area which is at least comparable to the plate-shaped object (11), wherein several tip areas (56) are provided in the configuration of the convex element (55), or wherein the convex element (90) comprises a rotary table (91) with several protrusions (92) on its upper surface. Divider (30) according to claim 1, wherein the convex element movement means (60) moves the convex element (55, 90) in a direction, the housing (36) has a transparency section opposite the plate-shaped object (11) of the plate-shaped object unit (U), which has the annular frame (F) attached to the mounting table (32), wherein the divider (30) further comprises: an imaging means (70) configured to capture an image of the plate-shaped object (11) via the transparency section of the housing (36); and a mounting table rotation / movement means (80) configured to rotate and move the mounting table (32), wherein the divider (30) aligns the division start point of the plate-shaped object unit (U) with the convex element (55, 90).

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