Component composite made of optical components, method for manufacturing a component composite and component with an optical component

Abstract

Method for manufacturing a plurality of transferable optical components (10) on a common intermediate carrier (90), wherein the optical components are configured to shape a light beam and wherein a holding structure (3) with a plurality of holding elements (3A, 3B) forms a mechanical connection between the intermediate carrier and the optical components, comprising the following steps: - Attaching or forming a plurality of optical components on the intermediate support, wherein a sacrificial layer (4) is arranged in the vertical direction at least partially between the intermediate support and the optical components; and - Removal of the sacrificial layer, whereby the optical components are only mechanically connected to the intermediate support via the holding structure, wherein the holding elements release the optical components under mechanical load, so that the optical components are detachable from the intermediate support and thus transferable, wherein - the method for manufacturing a plurality of components is set up, wherein the retaining elements (3A, 3B) release the optical components under mechanical stress, so that the optical components are detached from the intermediate carrier (90) and printed onto a plurality of main bodies (2H), wherein the main bodies each have a semiconductor body (2) with an active zone (23) for generating or detecting electromagnetic radiation.

Description

[0001] A component assembly consisting of a plurality of optical components is described, wherein the optical components are particularly transferable and thus preferably printable. Furthermore, a method for manufacturing a component assembly, a method for manufacturing a component or a plurality of components, and a component with an optical component are described.

[0002] Optical components, such as optical structures, are often fabricated on a substrate and individually mounted onto electronic components, such as semiconductor chips. Attaching and fixing a large number of optical components to these components is time-consuming and expensive.

[0003] Publication US 2013 / 0 285 086 A1 describes a method for manufacturing a micro-LED device with a self-aligning metallization stack.

[0004] The publication DE 10 2015 103 571 A1 describes a method for manufacturing a large number of conversion elements, a conversion element and an optoelectronic component.

[0005] Publication US 2015 / 0 371 874 A1 describes systems and methods for controlling the release of transferable semiconductor structures.

[0006] Publication US 2018 / 0 006 186 A1 describes printable inorganic semiconductor structures.

[0007] The publication DE 10 2009 055 088 A1 describes a method for producing a structure, an optical component and an optical layer stack.

[0008] Document US 2017 / 0 133 818 A1 describes a laser array display.

[0009] Publication US 2005 / 0 174 767 A1 describes a lens molded onto a ladder frame and a method for molding a lens onto a ladder frame.

[0010] One task is to specify optical components that can be mounted quickly, reliably, and easily onto electronic components. Further tasks include specifying reliable and cost-effective methods for manufacturing a component assembly or a plurality of components incorporating such optical components.

[0011] These tasks are solved by the component assembly, the method, and the component according to the independent claims, as well as in connection with such a method or component assembly. Further embodiments and developments of the method, the component assembly, or the component are the subject of the further claims.

[0012] According to at least one embodiment of the method for manufacturing a component assembly, a plurality of optical components are formed on an intermediate carrier. The intermediate carrier can be made of a transparent material, such as glass, or of a semiconductor material, for example, silicon. In particular, the method is directed toward the production of a plurality of transferable and, especially, printable optical components on a common intermediate carrier, wherein the optical components are preferably designed to be detachable from the intermediate carrier. For example, the optical components can be printed individually one after the other or simultaneously in groups onto target mounting surfaces, such as onto a component or onto several components, using one or more dies.

[0013] The optical component described here is specifically designed for shaping a light beam. In particular, the optical component is an optical chip, for example, a diffractive optic, a refractive optic, a collimating optic, or a diffuser structure. The component, or the majority of components, can be used for generating or detecting electromagnetic radiation, for example, in the UV, IR, or visible spectral range.

[0014] According to at least one embodiment of the method, a sacrificial layer is arranged vertically between the intermediate substrate and the optical components. For example, the sacrificial layer is made of a material such as germanium or silicon. The sacrificial layer can be formed on the intermediate substrate before or during the fabrication of the optical components on the intermediate substrate. With respect to the intermediate substrate and the optical components, the sacrificial layer can be made of a selectively removable material. For example, the material of the sacrificial layer is selected such that it can be removed, for instance, by an etching process without damaging the intermediate substrate and / or the optical components.

[0015] A lateral direction is understood to be a direction that runs parallel to a principal extensional surface of the intermediate support and / or the optical component. For example, the lateral direction runs parallel to the sacrificial layer. A vertical direction is understood to be a direction that is perpendicular to the principal extensional surface of the intermediate support and / or the optical component. The vertical and lateral directions are, in particular, orthogonal to each other.

[0016] According to at least one embodiment of the method, a holding structure with a plurality of holding elements is produced. The holding structure is designed such that, particularly after the removal of the sacrificial layer, the optical components are mechanically connected to the intermediate support only via the holding structure. In other words, after the removal of the sacrificial layer, the optical components can be mechanically connected to the intermediate support exclusively via the holding structure, for example, exclusively via the holding elements of the holding structure. If the optical component is mechanically connected to the intermediate support only or exclusively via the holding elements, the mechanical connection between the intermediate support and the optical components can be interrupted if the holding elements are cut or detached from the intermediate support or from the optical components.

[0017] In at least one embodiment of a method, a plurality of optical components are mounted or formed on the intermediate carrier. The optical components can be produced directly on the intermediate carrier or manufactured in a separate process step and attached to the intermediate carrier. The optical components are configured, in particular, to shape a light beam. Specifically, a holding structure with a plurality of holding elements provides or forms a mechanical connection between the intermediate carrier and the optical components. A sacrificial layer is arranged, at least partially, in the vertical direction between the intermediate carrier and the optical components. To produce a plurality of transferable optical components on the common intermediate carrier, the optical components are preferably mechanically connected to the intermediate carrier only via the holding structure after the sacrificial layer has been removed.The retaining elements are suitably designed to release the optical components under mechanical stress, so that the optical components can be detached from the intermediate carrier and thus transferred.

[0018] The holding structure keeps the optical components organized and sufficiently stable on the intermediate carrier, especially after the sacrificial layer has been removed, before they can be removed individually or in groups for further processing steps. The optical components are thus designed to be printable individually or in groups. In other words, the optical components can be removed individually or in groups from the intermediate carrier, particularly by breaking and / or detaching the holding elements, and then, in the same production step, transferred to a target mounting surface, for example, using one or more punches, and mechanically attached there. The target mounting surface can be the surface of an optoelectronic component, such as an optoelectronic semiconductor chip.

[0019] An optical component manufactured using this method has a particularly small vertical layer thickness. Specifically, the vertical layer thickness of the entire optical component is less than 40 µm, 30 µm, 20 µm, 10 µm, or less than 5 µm. For example, the vertical layer thickness of the entire optical component is between 1 µm and 10 µm (inclusive), between 1 µm and 10 µm (inclusive), between 1 µm and 5 µm (inclusive), and approximately 3 µm.

[0020] In at least one embodiment of a component assembly, the assembly comprises a plurality of optical components, a removable sacrificial layer, a retaining structure, and a common intermediate carrier. The optical components preferably each include an optical element for shaping a light beam. The sacrificial layer is arranged, at least partially, between the intermediate carrier and the optical components in the vertical direction. The retaining structure comprises a plurality of retaining elements, wherein the retaining structure and / or the sacrificial layer form a mechanical connection between the intermediate carrier and the optical components. Preferably, without the sacrificial layer, the optical components are mechanically connected to the intermediate carrier only via the retaining structure, and in particular exclusively via the retaining elements.Under mechanical stress, the retaining elements are preferably designed in such a way that they release the optical components, so that the optical components can be detached from the intermediate carrier and thus transferred.

[0021] Such a component assembly contains a plurality of detachable and therefore transferable and, in particular, printable optical components, whereby the sacrificial layer can be removed from the component assembly if necessary. In the presence of the sacrificial layer, however, the optical components remain mechanically stable on the intermediate substrate, so that the transport of such a component assembly can be carried out without a significant risk of breakage.

[0022] If the optical components are only mechanically connected to the intermediate support via the retaining elements, they can be detached from the intermediate support by breaking or removing these elements. The retaining elements may be directly or indirectly adjacent to the optical components and / or the intermediate support.

[0023] According to at least one embodiment of the method or the component assembly, the retaining elements are preferably designed with regard to their geometry and / or material composition such that they break off, tear off, or detach from the intermediate support or the optical components under mechanical stress, thereby releasing the components. The mechanical stress can be a tensile or compressive force exerted on the retaining structure and / or on the retaining elements. If the retaining elements are designed to be breakable under mechanical stress, they can break off or tear off when the associated component is removed. A mechanical fracture can be achieved, for example, within a layer of the same material.If the retaining elements are designed to be detachable, the detachment of the retaining elements from the optical component or from the intermediate support takes place at an interface between the retaining element and the optical component or at an interface between the retaining element and the intermediate support, i.e., usually at an interface between two layers of different materials.

[0024] According to at least one embodiment of the method or the component assembly, the support structure is contained at least partially within the sacrificial layer. The support structure can comprise support columns that are approximately fully enclosed by the sacrificial layer in lateral directions. In particular, the support columns are arranged below the optical components. In a top view of the intermediate support, the optical components can cover, and in particular completely cover, their associated support columns. The support columns are arranged approximately between the intermediate support and the optical components in the vertical direction.

[0025] Additionally or alternatively, the holding structure can include retaining straps. The retaining straps are arranged, in particular, laterally to the optical components. The retaining elements can be made of an electrically insulating material. Preferably, the retaining elements are designed to be breakable when the associated component is pressed towards the intermediate support. The retaining straps can be arranged on different side faces of the optical component or on different side faces of a base body of the optical component. The retaining straps can mechanically connect the optical component(s) to one or more retaining beams, wherein the retaining beam is spaced laterally from the optical components. In particular, the retaining beam is an integral part of the holding structure. The retaining beam can be directly adjacent to the intermediate support and / or directly adjacent to the retaining straps.The support beam and the support straps can be made of the same material or of different materials. The support structure can have multiple such support beams.

[0026] According to at least one embodiment of the method or the component assembly, the retaining straps are located exclusively laterally to the optical components and are designed to be breakable or detachable when the optical components are removed under mechanical stress. In particular, the retaining straps are designed, with regard to their geometries and / or materials, such that they break under pressure. For example, the retaining elements are made of an electrically insulating material, such as a polymer, a plastic material, silicon nitride, or silicon oxide.

[0027] According to at least one embodiment of the method or the component assembly, the retaining elements comprise retaining columns located below the optical components. The retaining columns are arranged vertically, in particular exclusively between the intermediate support and the optical components. The retaining column can be made of a material that is more corrosion-resistant than the sacrificial layer material. For example, the retaining columns are made of an electrically insulating material, such as silicon dioxide, plastic, or another type of polymer. It is also possible that the retaining elements, in particular the retaining straps and / or the retaining columns, are made of an electrically conductive material, such as a metal like copper, aluminum, nickel, chromium, platinum, or alloys thereof.

[0028] According to at least one embodiment of the method or component assembly, the retaining elements are preferably designed with regard to their geometry and / or material composition such that they are breakable when pressing or removing the associated optical component.

[0029] According to at least one embodiment of the method or the component assembly, the sacrificial layer forms a common boundary layer between the intermediate support and the components. In particular, the sacrificial layer borders directly on the intermediate support and / or directly on the support structure, especially directly on the retaining elements. Without the sacrificial layer, for example after its removal, a gap, such as a cavity, is formed between the intermediate support and the optical components. The retaining elements, such as the support columns and / or the retaining straps, can in some places border directly on the cavity or be arranged within the cavity. The retaining elements are preferably surrounded by the cavity so that they can be broken mechanically more easily under the influence of force or pressure.

[0030] According to at least one embodiment of the method or the component assembly, the optical components each have an optical element. In particular, the optical element is a diffractive optical element (DOE). The optical element(s) is / are configured to shape a light beam, such as a laser beam, in particular to expand and distribute the light beam. The optical component can be configured to distribute a light beam, such as a laser beam, over a larger solid angle or to direct or focus a light beam. In particular, the optical element forms an optically effective structure of the optical component that determines the path of the light beam within the optical component and / or after it exits the optical component.

[0031] The optical element of the optical component can be convex or concave, plano-convex, plano-concave, or convex-concave. The optical element can include diffraction elements or photonic crystals. It can also be a grating-like structure that acts similarly to a diffraction grating and / or a hologram for the light beam, such as laser radiation.

[0032] According to at least one embodiment of the method or the component assembly, the optical element of the optical component is formed from a III-V or a II-VI compound semiconductor material. In particular, the optical element comprises one or more different materials with a refractive index of at least 1.5, 1.6, 1.8, or at least 2.0, for example, between 1.5 and 3 inclusive, or between 1.8 and 2.5 inclusive. In case of doubt, the refractive index specified herein is referenced to a wavelength of 632.8 nm. The optical component or optical element may comprise SiO₂, SiN, ZnO, ZnS, ZnTe, Ga₂O₃, In₂O₃, ZnO, SnO₂, or Ta₂O₅. Further examples of materials for the optical element are, for example, aluminum oxides such as Al₂O₃, GaAs, or GaN.

[0033] According to at least one embodiment of the method or the component assembly, the optical components each have a base body. In particular, the optical element of the respective component is formed by the geometry of the associated base body. It is also possible that the optical element is arranged on the base body, embedded in the base body, or buried therein.

[0034] According to at least one embodiment of the method or the component assembly, the optical component or the base body is plano-convex or plano-concave. The components can each have a planar back surface facing the intermediate support. It is possible for the optical component or the base body to have a flat or planar back surface facing the intermediate support and a front surface that is at least flat and facing away from the intermediate support.

[0035] According to at least one embodiment of the method or the component assembly, the optical components each have a base body, wherein the optical element of the respective component is embedded in the associated base body. The optical element is, for example, a diffractive optical element.

[0036] According to at least one embodiment of the method or the component assembly, the optical components each have a transparent base body. The transparent base body can contain photonic crystals that form the optical element of the respective component.

[0037] According to at least one embodiment of the method or the component assembly, the optical element of the respective component is formed by an optical layer. The optical layer is arranged, in particular, on the associated substrate of the optical component. The optical layer can have substructures made of a material with a refractive index of at least 1.5 or 1.6. For example, the substructures are made of silicon nitride or Ta₂O₅. The substructures can be embedded in a matrix material with a lower refractive index, for example, less than 1.5 or less than 1.6. The matrix material can be made of silicon oxide, such as silicon dioxide.

[0038] According to at least one embodiment of the method or the component assembly, the optical component or the base body has a planar back surface facing the intermediate support and a front surface facing away from the intermediate support that is at least planar or flat. It is possible for the component to have a protective layer or a cover layer arranged between the base body and the intermediate support. The protective layer or the cover layer can be planarized so that it has a surface that forms a planar back surface of the optical component.

[0039] According to at least one embodiment of an optical component, which is manufactured in particular by a method described herein and / or detached from the common support of the component assembly described herein, this component is electrically insulating. In particular, the optical component is free of an optically active layer designed to generate or detect electromagnetic radiation. In other words, the optical component, which is designed to shape a light beam or light bundle, is not intended to generate or detect electromagnetic radiation. The component may exhibit remnants or separation marks from the retaining elements.

[0040] According to at least one embodiment of a method for manufacturing one or more components, in particular optoelectronic components, a component assembly as described herein is provided. In a subsequent process step, the sacrificial layer is removed. One or more of the optical components can be removed using one or more punches, wherein the retaining elements release the components under mechanical stress from the punch or punches, so that the components are detached from the intermediate carrier.

[0041] The optical component or components can be printed onto a target surface, such as the main body of the component or multiple main bodies. For example, the main body might have a semiconductor body with an active zone configured for generating or detecting electromagnetic radiation. The die or dies can then be separated from the optical component or components. The optical components can thus be transferred individually or in groups from the component assembly to one or more target surfaces, such as the surfaces of semiconductor chips.

[0042] According to at least one embodiment of the method for manufacturing one or more components, the optical component is attached to the associated main body of the component by means of a bonding layer. The bonding layer can be an adhesion promoter layer such as a solder layer or an adhesive layer.

[0043] Alternatively, the optical component and its associated main body can each have a planar surface and be mechanically bonded to each other at their planar surfaces using a direct bonding process. For example, the planar surfaces of the optical component and / or the main body are formed at least partially or completely by surfaces of electrically insulating layers, such as silicon nitride, and / or by surfaces of semiconductor layers. It is also possible that the planar surface of the main body is formed partially or completely by a surface of a transparent, electrically conductive layer, such as a TCO layer. The planar surface has a roughness that is preferably at most 50 nm, 20 nm, 10 nm, 5 nm, or at most 3 nm.

[0044] In a direct bonding process, planar or planarized surfaces are brought into physical contact. The basis of the mechanical bond consists primarily or exclusively of hydrogen bonds and / or van der Waals interactions in the immediate vicinity of a common interface between the planarized surfaces. To generate covalent bonds between atoms or molecules on the surfaces in physical contact, a thermal treatment can be applied to achieve increased bond strength.

[0045] In at least one embodiment of a component, it comprises a main body and an optical component. The main body includes a semiconductor body, in particular with an active zone configured for generating or detecting electromagnetic radiation. The optical component includes an optical element for shaping a light beam. For example, the optical component is printed onto the main body and contains, in particular, mechanical traces of detached or broken retaining elements. The mechanical traces can be remnants or traces of a mechanical breakage of one or more retaining elements.

[0046] According to at least one embodiment of the component, the optical component and the main body each have a planar surface. In particular, the planar surfaces are directly adjacent to one another and form a mechanical connection between the optical component and the main body based on van der Waals interactions. The optical component and the main body can have a common interface, which is in particular planar and free of any bonding material. The common interface is, for example, free of any solder or bonding agent. The common interface is, in particular, an overlapping surface between the planarized surfaces of the optical component and the main body of the component.

[0047] The processes described here are particularly suitable for the production of the optical component, component assembly, or component described herein. The characteristics described in connection with the component, component assembly, or component can therefore also be applied to the respective processes, and vice versa.

[0048] Further preferred embodiments and developments of the optical component, component assembly, component, and the respective method result from the following in conjunction with the Fig. Examples of implementation are explained in sections 1A to 4D. They show: Fig. 1A, Fig. 1B, Fig. 1C and Fig. 1D schematic representations of various embodiments of a component assembly consisting of a plurality of optical components in sectional views, Fig. 2A, Fig. 2B, Fig. 2C, Fig. 2D, Fig. 2E, Fig. 2F, Fig. 2G, Fig. 2H, Fig. 2I and Fig. 2J Schematic representations of different embodiments of an optical component in sectional views, Fig. 3A, Fig. 3B and Fig. 3C Schematic representations of some process steps for the manufacture of a component or a plurality of components in sectional views, and Fig. 4A, Fig. 4B, Fig. 4C and Fig. 4D schematic representations of some exemplary embodiments of a building component in sectional views.

[0049] Identical, similar, or similarly functioning elements are marked with the same reference symbols in the figures. The figures are schematic representations and therefore not necessarily to scale. Rather, comparatively small elements, and especially layer thicknesses, may be exaggerated for clarity.

[0050] In Fig. 1A is a component assembly 100 with a plurality of optical components 10 on a common intermediate support 90, shown schematically. The intermediate support 90 can be a glass substrate or a substrate made of a semiconductor material, such as silicon. The optical components 10 are manufactured, in particular, on the intermediate support 90. In the lateral directions, the optical components 10 are spatially separated from one another, in particular by separation grooves 4T.

[0051] According to Fig. In 1A, the optical components 10 are mechanically connected to the intermediate carrier 90 via a sacrificial layer 4 and / or a holding structure 3, and thus mechanically fastened to the intermediate carrier 90. In particular, the sacrificial layer 4 borders directly on the intermediate carrier 90 and / or the holding structure 3. Preferably, the sacrificial layer 4 is made of a removable material, such as an etchable material. With respect to the materials of the optical components 10 and the intermediate carrier 90, the material of the sacrificial layer 4 is preferably selectively removable. For example, the material of the sacrificial layer 4 has a higher etch rate than a material of the intermediate carrier 90 and / or the holding structure 3, in particular an etch rate at least 5 times, 10 times, 20 times, or 100 times higher.

[0052] Along the vertical direction, the sacrificial layer 4 is arranged between the intermediate support 90 and the optical components 10. Each optical component 10 has a front face 10F facing away from the intermediate support 90 and a back face 10R facing the intermediate support 90. The back face 10R and / or the front face 10F of the respective optical component 10 can be planar or flat. The front face 10F is, in particular, free from any covering by the sacrificial layer 4. The back face 10R can be partially or completely covered by the sacrificial layer 4, in particular completely up to the supporting structure 3. Fig. 1A The optical components 10 have vertically extending side surfaces, which are in particular partially covered by the sacrificial layer 4.

[0053] According to Fig. 1A contains the support structure 3 a plurality of support elements 3A. The support structure 3 has a plurality of support beams 30, particularly in the areas of the separation trenches 4T. The support beams 30 can be directly or indirectly adjacent to the intermediate support 90. The support elements 3A are according to Fig. 1A are designed in particular as retaining straps 3A. The retaining straps 3A are arranged laterally to the optical components 10. An optical component 10 can have a plurality of retaining straps 3A, for example at least two, three, four, or at least six such retaining straps 3A. Compared to the retaining straps 3A, the retaining beams 30 can have larger geometric dimensions. For example, a retaining beam 30 has a lateral width or a vertical height that is at least 2, 3, 4, 5, or at least 10 times greater than a corresponding lateral width or vertical height of the retaining straps 3A.

[0054] In particular, the retaining straps 3A connect the optical components 10 to the retaining beams 30. The sacrificial layer 4 and / or retaining structure 3 with a plurality of retaining elements 3A and retaining beams 30 can form or mediate a mechanical connection between the intermediate support 90 and the optical components 10. The retaining straps 3A may be directly adjacent to the optical components 10 and / or the retaining beams 30. The retaining straps 3A and the retaining beams 30 may be made of the same material or of different materials. The retaining straps 3A and the retaining beams 30 may be manufactured in a single process step. For example, an anchoring layer is applied over a large area to the optical components 10 and / or to the intermediate support 90, and the anchoring layer is subsequently structured into a plurality of retaining beams 30 and retaining straps 3A.

[0055] Contrary to the Fig. 1A It is possible that the support structure 3 has no support beams 30, or that the support beams 30 themselves are designed as lateral support straps 3A. Along the vertical direction, such a support strap 3A can extend from a side face of the optical component 10 to the intermediate support 90.

[0056] It is possible that the optical components 10 are produced from a cohesive structure on the common intermediate support 90. Even after the optical components 10 are separated by forming the separation trenches 4T, the optical components 10 can still be mechanically attached to the same intermediate support 90.

[0057] After removal of the sacrificial layer 4, a gap 4H or a cavity 4H may be formed between the intermediate support 90 and the optical components 10. As in the Fig. As shown in Figure 1A, the cavity 4H can be located in the lateral direction in certain areas between the optical component 10 and the support structure 3, in particular between the optical component 10 and the support beam 30. For example, the sacrificial layer 4 can be selectively removed, in particular by etching. Specifically, after the removal of the sacrificial layer 4, the optical component(s) 10 are mechanically connected to the intermediate support 90 exclusively by the support structure 3, in this case by the support beams 30 and the support elements 3A. The optical components 10 are thus still arranged on the common intermediate support 90 via the support structure 3, whereby the optical components 10 can be detached from the intermediate support 90 individually or in groups, for example by breaking or detaching the support elements 3A.

[0058] The one in Fig. The embodiment shown in 1B essentially corresponds to the one described in the Fig. The embodiment of a component assembly 100 shown in Figure 1A is different. In contrast, the support structure 3 has a plurality of support columns 3B arranged along the vertical direction between the intermediate support 90 and the optical components 10. In a top view of the intermediate support 90, an optical component 10 can cover, and in particular completely cover, its associated support column 3B or columns 3B.

[0059] As in the Fig. 1A and Fig. As shown in Figure 1B, the sacrificial layer 4 can have openings that are filled with a material from the support structure 3. The sacrificial layer 4 can be continuous or have a plurality of laterally spaced sublayers. The support structure 3 can have a plurality of support columns 3B and / or support beams 30 in the openings of the sacrificial layer 4. The support columns 3B connect the intermediate support 90 to the optical components 10, particularly at the rear faces 10R of the optical components 10. The support beams 30 and the support straps 3A connect the intermediate support 90 to the optical components 10, particularly at the side faces of the optical components 10.

[0060] With regard to their geometries and materials, the retaining elements 3A and / or 3B are preferably designed such that they are breakable or detachable under mechanical stress, particularly after the removal of the sacrificial layer 4. The retaining straps 3A or the retaining columns 3B can be made of an electrically insulating or electrically conductive material. In particular, the material of the retaining elements 3A and / or 3B has a lower etch rate than a material of the sacrificial layer 4, for example, an etch rate at least 5 times, 10 times, 20 times, or 100 times lower.

[0061] In particular, the retaining elements 3A and / or 3B are designed with such geometries and materials that they break mechanically when the associated optical component 10 is pressed and / or tear or detach from the optical component 10 or from the intermediate carrier 90 when the optical component 10 is lifted. In other words, the retaining elements 3A and / or 3B can be designed such that they release the optical components 10 under mechanical stress, allowing the optical components 10 to be detached individually or in groups from the intermediate carrier 90 and thus made transferable or printable. The retaining structure 3 has a plurality of predetermined breaking points, which are formed in particular by the retaining elements 3A and / or 3B.

[0062] The one in Fig. The embodiment shown in Figure 1C for a component assembly 100 essentially corresponds to the one described in the Fig. 2A and Fig. The embodiments of a component assembly 100 shown in Figure 2B are examples of this embodiment. In contrast, the component assembly 100 has a plurality of lateral retaining straps 3A and a plurality of retaining columns 3B as retaining elements. The retaining straps 3A can be formed laterally to the optical components 10 in the areas of the separation trenches 4T and connect the optical components 10 to the retaining beams 30. The lateral retaining straps 3A and / or the retaining beams 30 are manufactured, in particular, after the separation trenches 4T have been formed. The retaining columns 3B can be formed before the separation trenches 4T have been formed.

[0063] The one in Fig. The embodiment shown in 1D essentially corresponds to the one shown in the Fig. 1C illustrated embodiment for a component assembly 100. In the Fig. Figure 1D shows the component assembly 100 in a top view of the intermediate support 90. Each optical component 10 can be assigned a plurality of retaining elements 3A and / or 3B. The optical component 10 can have several or all of its side surfaces, which are partially covered by the retaining straps 3A. On the side surfaces of the optical component 10, the retaining straps 3A can be essentially point-like. For example, in a top view of a side surface of the optical component 10, the retaining straps 3A can cover between 0.1% and 1%, between 0.3% and 3%, between 0.5% and 5%, between 1% and 10%, or between 2% and 20% of the total area of ​​the associated side surface of the optical component 10.

[0064] The Fig. 2A, Fig. 2B, Fig. 2C, Fig. 2D, Fig. 2E, Fig. 2F, Fig. 2G, Fig. 2H, Fig. 2I and Fig. Figure 2J shows various embodiments of the optical component 10 in sectional views. The optical component 10 comprises an optical element 10E. In particular, the optical element 10E is configured to shape a light beam incident on the optical component 10. The optical element 10E can be a diffractive optical element. The component 10 comprises a base body 10G. The optical element 10E can be formed by the base body 10G, for example, solely by the geometry and / or material composition of the base body 10G. Alternatively, the optical element 10E can be arranged on the base body 10G or embedded or buried in the base body 10G.

[0065] According to the Fig. 2A and Fig. 2B, the optical element 10E is formed by the geometry of the base body 10G. In particular, the base body 10G forms an optical lens. The base body 10G can be a glass body. The base body 10G is according to Fig. 2A is designed to be plano-convex. Component 10 has a curved front surface 10F, which is formed in particular by the convex surface of the base body 10G. Component 10 has a flat or planar back surface 10R, which is formed in particular by the flat or planar surface of the base body 10G. The base body 10G is designed according to Fig. 2B is designed with a planar-concave surface. The curved front face 10F of component 10 is formed in particular by the concave surface of the base body 10G. In contrast to the Fig. 2A and Fig. 2B it is possible that the basic body 10G is biconvex, biconcave, convex-concave or concave-convex.

[0066] According to Fig. In 2C, the optical element 10E is enclosed by the base body 10G. The optical element 10E is located at least partially or completely within the base body 10G. In particular, the optical element 10E is an optical lens. The optical lens can assume conventional lens shapes, which are particularly relevant in connection with the [missing information]. Fig. 2A and Fig. The basic body 10G described in 2B is described in the Fig. 2C, the optical element 10E is designed plano-concave.

[0067] According to Fig. In section 2C, the front surface 10F and the back surface 10R of the optical component are planar. The front surface 10F and the back surface 10R can be formed by surfaces of the base body 10G. The base body 10G can be made of a radiolucent, in particular transparent, material. It is possible that the optical element 10E is a glass body. Furthermore, it is conceivable that the base body 10G and the optical element 10E are made of materials with different refractive indices. For example, the refractive index of the optical element 10E differs from the refractive index of the base body 10G by at least 0.2, 0.3, or 0.5. The optical element 10E can have a higher refractive index than the base body 10G. It is also conceivable that the optical element 10E and / or the base body 10G are made of a semiconductor material.

[0068] The in the Fig. 2D, Fig. 2E and Fig. The embodiments shown in 2F essentially correspond to those in the Fig. 2C shows an embodiment for an optical component 10. In contrast, the optical element 10E is located in the Fig. 2D, Fig. 2E and Fig. 2F plano-convex, biconvex or biconcave design.

[0069] The in the Fig. 2G and Fig. The embodiments shown in 2H essentially correspond to those in the Fig. 2C shows an embodiment for an optical component 10. In contrast, the optical element 10E is designed according to the Fig. 2G and Fig. 2H is implemented in particular as a diffractive optical element 10E. The optical element 10E can be implemented as a planar or curved layer within the base body 10G. The optical element 10E can be formed from photonic crystals or from high-refractive-index materials. The optical element 10E can also have diffraction elements or a grating-like structure that acts / acts similarly to a diffraction grating.

[0070] According to Fig. 2I The optical element 10E is formed by an optical layer arranged on the associated base body 10G. The optical layer can have substructures 10E2, for example, micro- or nanostructures. The substructures 10E2 can be made of a material with a refractive index of at least 1.5, 1.6, or 2.0. The substructures 10E2 can be embedded in a matrix material 10E1, in particular with a lower refractive index, for example, with a refractive index at least 0.2, 0.3, or 0.5 lower. The front face 10F of the optical component 10 can be formed by a surface of the optical layer. The optical layer is, in particular, a separate layer of the optical component 10.

[0071] The one in Fig. The embodiment shown in section 2J essentially corresponds to the one described in the Fig. The embodiment of an optical component 10 shown in Figure 2I is different. In contrast, the optical component 10 has a cover layer 10S, which is designed in particular as a protective layer for the optical component 10. The cover layer 10S can be directly or indirectly adjacent to the base body 10G. In particular, the back side 10R of the optical component 10 is formed by a surface of the cover layer 10S. The cover layer 10S can be made of an electrically insulating material, such as silicon nitride or silicon oxide. The Fig. 2A, Fig. 2B, Fig. 2C, Fig. 2D, Fig. 2E, Fig. 2F, Fig. 2G and Fig. The optical components 10 shown in Figure 2H can also have such a cover layer 10S. Such a cover layer 10S can be planarized and is particularly suitable for a direct bonding process in which the optical component 10 is attached to a target surface.

[0072] According to Fig. 3A A plurality of components 1 or a plurality of main bodies 2H of the components 1 are provided on a common support 9G. The common support 9G and the main bodies 2H form approximately a semiconductor wafer. The components 1 or the main bodies 2H can each have a sequence of semiconductor layers which, in the operation of the respective component 1, is configured to generate or detect electromagnetic radiation R. The component 1 or the main body 2H can have a radiation transmission area 6, for example, on a front face 1F of the component 1 or the main body 2H. The radiation transmission area 6 can have an aperture 60 of the component 1 or the main body 2H.

[0073] The carrier 9G can be a growth substrate on which the semiconductor layer sequence is grown, particularly epitaxially. However, the carrier 9G can also be different from such a growth substrate. It is possible that the carrier 9G contains conductive traces, IC chips, or transistors. The respective main body 2H can contain a semiconductor body 2 ( Fig. 4A to 4D). On the common support 9, in particular at the wafer level, the main bodies 2H or the semiconductor bodies 2 can be formed as components of a semiconductor structure 20, in particular a continuous semiconductor structure 20. The semiconductor structure 20 can, for example, be separated into a plurality of semiconductor bodies 2 along a plurality of separation lines 1T or mesa trenches 1T.

[0074] The semiconductor structure 20 can comprise a first semiconductor layer 21, a second semiconductor layer 22, and an active zone 23 arranged between the semiconductor layers 21 and 22, wherein the active zone 23 is configured, in particular, for the emission or detection of electromagnetic radiation. In particular, the active zone 23 is a pn junction zone. The semiconductor structure 20 can be based on a group III-V or a group II-VI semiconductor compound material. The semiconductor structure 20 is based on a group III-V compound semiconductor material if, in particular, it comprises at least one element from group III, such as Al, Ga, In, and one element from group V, such as N, P, As.In particular, the term “III-V semiconductor compound material” encompasses the group of binary, tertiary, and quaternary compounds containing at least one element from main group III and at least one element from main group V, for example, nitride and phosphide compound semiconductors. Analogously, the same applies to a semiconductor structure based on the group II-VI compound semiconductor material.

[0075] It will be according to Fig. 3A A plurality of optical components 10 are applied to the main body 2H or to the semiconductor structure 20. In particular, the optical components 10 can be removed from the component assembly 100 and printed and attached individually or in groups to the main body 2H or to the semiconductor structure 20. In a top view, the optical component 10 can cover, in particular completely cover, a radiation transmission area 6 or an aperture 60 of the associated main body 2H. The number of optical components 10 applied to the main body 2H or to the semiconductor structure 20 in a single process step can be at least 4, 10, 100 or 1000.

[0076] The attachment and fixing of the optical components 10 on the main bodies 2H or on the semiconductor structure 20 can be carried out before the formation of the mesa trenches 1T ( Fig. 3A) or after forming the mesa trenches 1T ( Fig. 3B) will be carried out. According to the Fig. 3A and Fig. 3B The optical components 10 and the main bodies 2H or the semiconductor structure 20 can have planar surfaces 1F and 10R and are preferably mechanically joined to one another at their planar surfaces by means of a direct bonding process. A common bonding surface 5G, which is defined, for example, by overlapping areas of the planar surfaces 1F and 10R, is in this case free of a bonding material, such as a bonding agent like solder or adhesive. The bonding surface 5G of the respective component 1 is also, in particular, planar. Layers of different materials can directly abut each other at the bonding surface 5G.

[0077] According to Fig. 3A The optical components 10 may exhibit mechanical traces of detached or broken retaining elements 3A. The mechanical traces may be remnants or traces of a mechanical breakage of one or more retaining straps 3A, particularly on the side surfaces of the optical components 10. Alternatively or additionally, such mechanical traces may be found on the back 10R of an optical component 10 ( Fig. 3C).

[0078] The one in Fig. The embodiment shown in 3C essentially corresponds to the one described in the Fig. Figure 3A illustrates an embodiment of a process step for manufacturing a plurality of components 1. In contrast, the optical component 10 can be attached to the associated main body 2H or to the semiconductor structure 20 by means of a bonding layer 5. The bonding layer 5 can comprise an adhesion promoter, a solder, or an adhesive. In particular, the bonding layer 5 can be formed from metallic layers. The retaining pillars 3B arranged on the back side 10R of the optical component 10, or remnants or traces of the retaining pillars 3B, can be located partially or completely within the bonding layer 5.

[0079] In particular, after the optical components 10 have been fixed, the common support 9G can be divided into a plurality of supports 9 of the components 1. On each divided support 9, a main body 2H, in particular a single main body 2H with a single optical component 10 or with a plurality of optical components 10, can be arranged. Such a component 1 is, for example, in the Fig. 4A, Fig. 4B, Fig. 4C and Fig. 4D schematic representation. It is also possible that a plurality of main bodies 2H, in particular with a plurality of optical components 10, are arranged on a single support 9. Such a component 1 can be a laser bar.

[0080] In the Fig. 4A is a schematic representation of a component 1. The component 1 comprises a support 9, a main body 2H, and an optical component 10. The optical component 10 is arranged on a front surface 1F of the main body 2H or of the component 1. The optical component 10 has side surfaces with remnants and / or traces of retaining straps 3A. The optical component 10 has a back surface 1R formed by a surface of the support 9.

[0081] The main body 2H comprises a semiconductor body 2 with a first semiconductor layer 21, a second semiconductor layer 22, and an active zone 23 arranged between the semiconductor layers 21 and 22. Furthermore, the main body 2H includes a first contact layer 61 and a second contact layer 62 for electrically contacting the semiconductor body 2. In particular, the device 1 is designed as a surface-emitting laser diode or VCSEL (vertical-cavity surface-emitting laser). The semiconductor body 2 can be arranged between a first mirror arrangement 71 and a second mirror arrangement 72. The mirror arrangements 71 and 72 form, in particular, a laser resonator 7. The mirror arrangements 71 and 72 can be Bragg mirrors, in particular electrically conductive Bragg mirrors made of semiconductor materials.

[0082] In plan view, the first contact layer 61 only partially covers the semiconductor body 2 or the active zone 23. The first contact layer 61 can be passivated laterally by a first insulating layer 81. A first contact layer 61 formed in this way ensures that electrical charge carriers are imprinted into the semiconductor body 2 only in the area of ​​the semiconductor body that overlaps with the first contact layer 61. Such a configuration of the first contact layer 61 can lead to the formation of an aperture 60 of the device 1. The first contact layer 61 can be made of a transparent and electrically conductive material.

[0083] In particular, the optical component 10 and the main body 2H have planar surfaces 1F and 10R, respectively, wherein the planar surfaces 1F and 10R are directly adjacent to each other and can form a mechanical connection between the optical component 10 and the main body 2H based on van der Waals interactions. The Fig. The component 1 shown in 4A can be replaced by a component as shown in the Fig. 3A or Fig. The optical component 10 is produced in the process step shown in Figure 3B. The planar surface of the optical component 10 is, in particular, the back side 10R of the optical component 10. The planar surface 1F of the main body 2H can be formed by the surface of a cover layer 1S of the component 1 or by surfaces of the first contact layer 61 and the first insulating layer 81.

[0084] It is possible that the optical component 10 and the main body 2H are mechanically connected to each other by means of a bonding layer 5. Such a bonding layer 5 is, for example, in the Fig. 4B is shown. Fig. The component 1 shown in 4B can be replaced by a component as shown in the Fig. The process step shown in 3C is produced.

[0085] The one in Fig. The embodiment shown in 4B essentially corresponds to the one described in the Fig. 4A shows an embodiment of a component 1. In further contrast to this, the second mirror arrangement 72 can be electrically insulating. The second mirror arrangement 72 can form a cover layer 1S of the main body 2H. A surface of the second mirror arrangement 72 or of the cover layer 1S facing the optical component 10 can be flat or planar. In contrast to the Fig. 4B The optical component 10 can be mechanically connected to the main body 2H using a direct bonding process.

[0086] According to Fig. 4B The main body 2H has a second insulating layer 82 with an opening. The semiconductor body 2, in particular the second semiconductor layer 22, may be partially exposed in the opening. For electrical contact with the second semiconductor layer 22 or the semiconductor body 2, the main body 2H has a second contact layer 62, which extends in particular into the opening of the second insulating layer 82. Outside the opening, the second contact layer 62 may cover the second insulating layer 82, in particular completely. In the region of the opening of the second insulating layer 82, the second contact layer 62 may be in direct or indirect electrical contact with the semiconductor body 2 or with the second semiconductor layer 22. The opening of the second insulating layer 82 can thus define an aperture 60 of the device 1.The second contact layer 62 is preferably formed from a radiation-transparent and electrically conductive material.

[0087] The in the Fig. 4C and Fig. The 4D illustrations essentially correspond to those in the Fig. 4A and Fig. The embodiments of a component 1 shown in Figure 4B are examples. In contrast, the component 1 or the main body 2H can be designed as a surface-mountable component or as a surface-mountable main body. The component 1 is, in particular, an optoelectronic semiconductor chip, such as an LED.

[0088] According to Fig. 4C, the main body 2H can have the form of a flip chip or a semiconductor chip with backside contacts. The first contact layer 61 can be configured as a via extending through the second semiconductor layer 22 and the active zone 23 into the first semiconductor layer 21. The via is fully surrounded laterally by the semiconductor body 2. The via can be electrically insulated from the second semiconductor layer 22 and the active zone 23 by an insulating layer 80.

[0089] The top layer 1S can be made of an electrically insulating material. It is also possible that the top layer 1S is a growth substrate on which the semiconductor body 2 has been epitaxially grown. The support 9 can have electrical conductors that are in electrical contact with the contact layers 61 and 62 of the main body 2H.

[0090] The one in Fig. The embodiment shown in 4D essentially corresponds to the one described in the Fig. 4C illustrated embodiment for a component 1. In contrast, the carrier 9 can have through-contacts, wherein the through-contacts are in electrical contact in particular with the contact layers 61 and 62, so that the contact layers 61 and 62 can be electrically contacted approximately on the back side 1R of the component 1. Reference symbol list 100 component composite 10 optical component 10G base body of the optical component 10E optical element 10E1 Matrix material of the optical element 10E2 Substructures of the optical element 10F Front of the optical component 10R Back of optical component 10S Top layer / protective layer of the optical component 1 component 1F Front side of the component 1R Back of the component 1S Topcoat 1T Dividing Line, Mesa Trench 2H Main body of the component 2 Semiconductor bodies 20 Semiconductor structure 21 first semiconductor layer 22 second semiconductor layer 23 active zones 3 Support structure 30 retaining bars 3A Retaining element, retaining strap 3B Holding element, holding column 4. Victimhood layer 4H cavity 4T Separation Trench 5. Compound layer 5G common interface 6. Radiation transmission range 60 aperture 61 first contact layer 62 second contact layer 7 Laser resonator 71 first mirror arrangement 72 second mirror arrangement 80 Insulation layer 81 first insulation layer 82 second insulation layer 9 carriers 9G common carrier / common growth substrate 90 intermediate beams R radiation

Claims

Method for producing a plurality of transferable optical components (10) on a common intermediate carrier (90), wherein the optical components are configured to shape a light beam and wherein a holding structure (3) with a plurality of holding elements (3A, 3B) forms a mechanical connection between the intermediate carrier and the optical components, comprising the following steps: - Attaching or forming a plurality of optical components on the intermediate carrier, wherein a sacrificial layer (4) is arranged in the vertical direction at least partially between the intermediate carrier and the optical components;and- removal of the sacrificial layer, whereby the optical components are only mechanically connected to the intermediate carrier via the holding structure, wherein the holding elements release the optical components under mechanical stress, so that the optical components are detachable from the intermediate carrier and thus transferable, wherein- the method for manufacturing a plurality of components is set up, wherein the holding elements (3A, 3B) release the optical components under mechanical stress, so that the optical components are detached from the intermediate carrier (90) and printed onto a plurality of main bodies (2H), wherein the main bodies each have a semiconductor body (2) with an active zone (23) for generating or detecting electromagnetic radiation.; Component assembly (100) comprising a plurality of optical components (10), a removable sacrificial layer (4), a retaining structure (3), and a common intermediate carrier (90), wherein: - the optical components each have an optical element (10E) for shaping a light beam; - the sacrificial layer is arranged at least partially in the vertical direction between the intermediate carrier and the optical components; - the retaining structure comprises a plurality of retaining elements (3A, 3B), wherein the retaining structure and the sacrificial layer form a mechanical connection between the intermediate carrier and the optical components; and - without the sacrificial layer, the optical components are mechanically connected to the intermediate carrier only via the retaining structure, wherein the retaining elements are designed under mechanical load such that they release the optical components, allowing the optical components to be detached from the intermediate carrier and thus transferable.wherein- the optical components (10) are free of an optically active layer configured for generating or detecting electromagnetic radiation. Method or component assembly according to claim 1 or 2, wherein the optical components (10) each have a base body (10G), the optical element (10E) of the respective component being formed by the geometry of the associated base body. Method or component assembly according to the preceding claim, wherein the base body (10G) is plano-convex or plano-concave and wherein the components (10) each have a planar rear side (10R) facing the intermediate support (90). Method or component assembly according to claim 1 or 2, wherein the optical components (10) each have a base body (10G), wherein the optical element (10E) of the respective component is embedded in the associated base body. Method or component assembly according to claim 1 or 2, wherein the optical components (10) each have a transparent base body (10G) containing photonic crystals that form the optical element (10E) of the respective component. Method or component assembly according to claim 1 or 2, wherein the optical components (10) each have a base body (10G), wherein the optical element (10E) of the respective component is formed by an optical layer arranged on the associated base body. Method or component assembly according to one of claims 5 to 7, wherein the component (10) has a planar rear side (10R) facing the intermediate support (90) and a front side (10F) facing away from the intermediate support that is at least planar. Method or component assembly according to one of the preceding claims, wherein the retaining elements (3A, 3B) comprise retaining straps (3A) which are located laterally to the optical components (10) and are designed to be breakable or detachable when the optical components are removed under mechanical stress. Method or component assembly according to one of the preceding claims, wherein the retaining elements (3A, 3B) comprise retaining columns (3B) located below the optical components (10), arranged in a vertical direction exclusively between the intermediate support (90) and the optical components (10), and designed to be breakable or detachable when the optical components are removed under mechanical stress. Method or component assembly according to one of the preceding claims, wherein the retaining elements (3A, 3B) are designed with regard to their geometry and / or material composition such that they are designed to be breakable when pressing or removing the associated optical component (10). Method or component assembly according to one of the preceding claims, wherein- the sacrificial layer (4) forms a common boundary layer between the intermediate support (90) and the optical components (10), and- without the sacrificial layer a cavity (4H) is formed between the intermediate support and the optical components or between the optical components, wherein the retaining elements (3A, 3B) are located directly adjacent to the cavity or are arranged in the cavity. A method for manufacturing one or more components (1) comprising the following steps: - providing the component assembly (100) according to any one of claims 2 to 11; - removing the sacrificial layer (4); - removing one or more optical components (10) using a punch or a plurality of punches, wherein the retaining elements (3A, 3B) release the optical components under mechanical stress on the punch or punches, so that the optical components are detached from the intermediate carrier (90); - printing the component or the plurality of components (10) onto a main body (2H) of the component or onto a plurality of main bodies (2H) of the components, wherein the main body has a semiconductor body (2) with an active zone (23) configured for generating or detecting electromagnetic radiation; and - separating the punch or punches from the optical component or components. Method according to the preceding claim, wherein the optical component (10) is attached to the associated main body (2H) of the component (1) by means of a bonding layer (5). Method according to claim 13, wherein the optical component (10) and the main body (2H) associated with it each have a planar surface and are mechanically connected to each other at the planar surfaces by means of a direct bonding process. Component (1) comprising a main body (2H) and an optical component (10), wherein the main body comprises a semiconductor body (2) with an active zone (23) configured for generating or detecting electromagnetic radiation, the optical component comprises an optical element (10E) for shaping a light beam, and the optical component is printed on the main body and contains mechanical traces of detached or broken retaining elements (3A, 3B), wherein the optical component (10) and the main body (2H) each have a planar surface, the planar surfaces being directly adjacent to each other and forming a mechanical connection between the optical component and the main body based on van der Waals interactions. Component according to claim 16, wherein the main body (2H) is a surface-emitting laser diode and the optical component (10) is configured to shape a light beam generated during operation of the laser diode.

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