LASER ASSEMBLY AND ASSOCIATED METHODS

Abstract

Laser assembly (10) comprising the following: a heat sink assembly (20) with a footprint, at least one laser arrangement (40) which is arranged in contact with the heat sink assembly (20) and comprises several laser diode bars (42) and several fast-axis collimators (50), wherein the at least one laser arrangement (40) fits into the footprint of the heat sink assembly (20), wherein the fast-axis collimators (50) are arranged vertically above the laser diode bars (42), wherein a connection between the multiple laser diode bars (42) and the multiple fast-axis collimators (50) each comprises a soldered connection, wherein the soldered connection comprises two tabs (54) each with two holes (56A, 56B), wherein solder is applied within each of the two holes (56A, 56B); and at least one optical assembly (70) arranged in a light path of the at least one laser arrangement (40), wherein the at least one optical assembly (70) fits into the mounting surface of the heat sink assembly (20), wherein the laser assembly is epoxy-free.

Description

AREA OF REVELATION

[0001] The present disclosure relates generally to optical assemblies and specifically to laser assemblies and related methods. BACKGROUND OF THE REVELATION

[0002] Conventional laser assemblies are assembled using UV-curing epoxy. The components of the laser assembly, including lenses, collimators, and corrective optics, are positioned relative to each other at the desired location, and an epoxy adhesive is applied to the contact points between the components. For example, in conventional assemblies, epoxy can be used to attach wavelength stabilizing optics, such as bulk Bragg gratings (VBGs), typically starting from their side faces. Once the epoxy is applied and the component is correctly positioned, UV light is used to cure the epoxy at that point. After curing, the component is released, and the next epoxy bond is cured with UV light, and so on, until the entire assembly is complete. However, epoxy is not stable across the wide temperature range in which many laser assemblies must operate.Many laser assemblies are used in harsh environments subject to fluctuations between high and low temperatures. Over time, the epoxy can creep, causing lens displacement and movement, which in turn leads to optical misalignment. When the lens moves, the assembly's performance is severely impaired or lost, as the light no longer travels where it was initially intended to be focused.

[0003] Furthermore, differences in curing rates between epoxies at different locations can lead to optics misalignment. For example, when epoxy is applied to the side surfaces of the VBG, the epoxy on the upper part of the side surface may cure at a different rate than the epoxy on the lower part, or vice versa, causing the VBG to tilt or shift. This tilting or shifting of the VBG can result in a tilt angle that disrupts the intended angle of the VBG, again leading to optics misalignment.

[0004] Furthermore, epoxy is known to outgas. When the epoxy is in its liquid or viscous state, it contains certain types of volatile components. During the manufacturing of the laser assembly, manufacturers attempt to cure the epoxy quickly with UV light to prevent the release of these volatile components, but over time, even after the epoxy has cured, some of these volatile components remain. These volatile components eventually outgas, and the chemicals or vapors released from the epoxy can damage the laser assembly if they come into contact with the laser facet. Some manufacturers use a purge gas in the laser system to ensure that the chemicals and vapors outgassed from the epoxy are flushed out, thus reducing their volume.Other manufacturers may use thermally curing epoxies, which exhibit lower outgassing, although some outgassing still occurs. While these options can reduce the volume of residue contaminating the laser array, they significantly impact the production efficiency of the laser assemblies. Curing thermal epoxies can take anywhere from 20 minutes to over 24 hours. In a production environment, it is impractical to install one lens at a time, thermally cure it over that period, and then move on to the next lens. Accordingly, UV-curing epoxies are readily used due to their rapid curing time.

[0005] Therefore, there is a previously unaddressed need within the industry to address the aforementioned shortcomings and deficiencies.

[0006] US patent 2017 / 0288367A1 discloses a laser arrangement comprising a laser array and various optical components such as lenses and a reflection mirror, arranged in a plane.

[0007] US Patent 2009 / 0016398A1 describes an arrangement with collimator lenses mounted on laser diode bars. The collimator lenses are soldered to lateral bridge elements, which in turn are soldered to a support.

[0008] DE 102 58 745 A1 discloses a collimation lens device with a support. The support causes the collimation lens device to extend beyond the base of a laser diode bar.

[0009] US 2009 / 0251697A1 describes a fast-axis collimator attached to an upper surface of an optical substrate. SUMMARY OF THE REVELATION

[0010] Embodiments of the present disclosure provide a system and a device for an epoxy-free laser assembly. Briefly described, one embodiment of the assembly can be implemented, among other things, as follows. A laser assembly comprises a heat sink assembly with a mounting surface and at least one laser array arranged in contact with the heat sink assembly, comprising multiple laser diode bars and multiple fast-axis collimators. At least one laser array fits into the mounting surface of the heat sink assembly, the fast-axis collimators being arranged vertically above the laser diode bars. A connection between the multiple laser diode bars and the multiple fast-axis collimators each comprises a soldered joint, the soldered joint comprising two tabs, each with two holes, and solder being applied within each of the two holes.At least one optical arrangement is arranged in a light path of the at least one laser arrangement, wherein the at least one optical assembly fits into the footprint of the heat sink assembly, and wherein the laser assembly is epoxy-free.

[0011] In this aspect, the ends of the multiple laser diode bars further comprise a metallized surface with spaced, non-metallized grooves formed therein, wherein the solder is applied within one of the two holes of the tab in a position above the metallized surface.

[0012] In another aspect, the at least one optical assembly further comprises several correction optics and several wavelength stabilization optics, wherein a connection between the several correction optics and the several wavelength stabilization optics also includes a soldered connection.

[0013] In this aspect, the soldered connection between the multiple correction optics and the wavelength stabilization optics further comprises at least one tab with two holes, with solder being applied inside each of the two holes.

[0014] In this aspect, the ends of the multiple correction optics further comprise a metallized surface with spaced, non-metallized grooves formed therein, wherein the solder is applied in a position above the metallized surface within one of the two holes of the tab comprising the solder joint between the multiple correction optics and the wavelength stabilization optics.

[0015] The present disclosure can also be considered as the provision of a system and a device for a laser assembly with at least one tab. In brief, one embodiment of the assembly can be implemented with respect to its structure, among other things, as follows. A laser assembly comprises at least one laser arrangement. An optical assembly is arranged in a light path of the at least one laser arrangement. The optical assembly includes at least one correction optic and at least one wavelength stabilization optic. The at least one wavelength stabilization optic is connected to the at least one correction optic by at least one tab.

[0016] In one aspect, the at least one wavelength stabilization optic also includes a VBG.

[0017] In another aspect, at least one tab is connected to one end of at least one wavelength stabilization optic.

[0018] In another aspect, the at least one tab comprising the soldered connection between the multiple correction optics and the wavelength stabilization optic is connected with epoxy to the at least one wavelength stabilization optic and the at least one correction optic.

[0019] In another aspect, the at least one tab is connected with a perpendicular to the at least one wavelength stabilization optic and the at least one correction optic.

[0020] In this aspect, the at least one tab therein further comprises at least two holes, with the plumb line being applied within the at least two holes.

[0021] The present disclosure can also be considered as the provision of a system and a device for a laser assembly with a controlled mounting surface. In short, one embodiment of the assembly can be implemented with respect to its structure as follows: A laser assembly comprises a heat sink assembly with a mounting surface. At least one laser arrangement is arranged in contact with the heat sink assembly. The at least one laser arrangement fits into the mounting surface of the heat sink assembly. At least two optical assemblies are arranged in a light path of the at least one laser arrangement. All optical assemblies fit into the mounting surface of the heat sink assembly.

[0022] In one aspect, the heat sink assembly further comprises two electrical contacts arranged on opposite sides of the heat sink assembly, wherein the at least two electrical contacts define two opposite edges of the mounting surface.

[0023] Another aspect of the laser assembly is that it is epoxy-free.

[0024] In another aspect, at least one ceramic layer is arranged for electrical insulation between the heat sink and the at least one laser arrangement.

[0025] Other systems, methods, features, and advantages of the present disclosure are or will become apparent to the person skilled in the art upon consideration of the following drawings and the detailed description. All additional systems, methods, features, and advantages of this kind are to be included in this description, fall within the scope of the present disclosure, and be protected by the accompanying claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Many aspects of the revelation can be better understood with the help of the following drawings. The components in the drawings are not necessarily to scale; rather, the emphasis is placed on clearly illustrating the principles of the present revelation. Furthermore, the same reference symbols in the drawings denote corresponding parts in all different views. Fig. Figure 1A is an illustration of a laser assembly in an isometric view according to a first embodiment of the present disclosure. Fig. 1B is an illustration of the laser assembly of Fig. 1A in a front view according to the first embodiment example of the present disclosure. Fig. 1C is an illustration of the laser assembly of Fig. 1A in a side view according to the first embodiment of the present disclosure. Fig. 2A is an illustration of the laser assembly of Fig. 1A in a top view according to the first embodiment of the present disclosure. Fig. 2B is an illustration of the laser assembly of Fig. 1A in a bottom view according to the first embodiment of the present disclosure. Fig. 3A-3K are views of the laser assembly of Fig. 1A in various manufacturing stages and of individual components of the laser assembly from Fig. 1A according to the first embodiment of the present disclosure. Fig. 4A-4B are illustrations of the laser assembly of Fig. 1A in a front view according to the first embodiment example of the present disclosure, showing the tab and the solder joint. Fig. 5 is an illustration of the laser assembly of Fig. 1A according to the first embodiment example of the present disclosure, which shows the tab. Fig. Figure 6 is a schematic diagram of the laser assembly of Fig. 1A according to the first embodiment example of the present disclosure, which shows the directions of sensitivity of the tabs. Fig. Figure 7 is a flowchart illustrating a method for manufacturing a laser assembly according to the first embodiment of the present disclosure. DETAILED DESCRIPTION

[0027] Fig. Figure 1A is an illustration of a laser assembly 10 in an isometric view according to a first embodiment of the present disclosure. Fig. 1B is an illustration of laser assembly 10 of Fig. 1A in a front view, and Fig. 1C is an illustration of laser assembly 10 from Fig. 1A in a side view. Referring to the Fig. 1A-1C comprises the laser assembly 10, which may be referred to simply as "assembly 10," "system 10," or "device 10," a heat sink assembly 20, a laser array 40, and an optics assembly 70. Within assembly 10, the laser array 40 is in thermal contact with the heat sink assembly 20, and the optics assembly 70, which may include any number of corrective optics units, is positioned above the laser array 40 and within a light path of the laser array 40. Assembly 10 is an epoxy-free unit because it does not use any epoxy or epoxy-like adhesives to bond or join components of assembly 10. However, it is noted that various components of assembly 10, or its advantages, may also be used in assemblies that do employ epoxy.

[0028] The heat sink assembly comprises a heat sink 22 made of a material with high thermal conductivity, electrical mounting screws 24 for connection to a power source, and electrical contacts 26 for transferring electrical power to the laser assembly 40. The electrical contacts 26 make electrical contact with the electrical contact screws 24 and extend upwards to the laser assembly and the optics assembly. The laser assembly 40 is in thermal contact with the heat sink assembly 20, allowing heat generated in the laser assembly 40 to be transferred from the assembly. Generally, the laser assembly 40 is located on top of the heat sink 22. An electrical insulating material, such as an electrical insulating ceramic 28 or a similar material, can be placed at the interface between a lower part of the laser diode stack in the laser assembly 40 and the upper part of the heat sink 22.The optical assembly 70 is arranged above the laser arrangement 40.

[0029] The Fig. 2A-2B are illustrations of laser assembly 10 of Fig. 1A in a top view or bottom view according to the first embodiment of the present disclosure. Fig. Figures 2A-2B illustrate in particular the footprint of assembly 10, which is generally defined by the shape and size of the heat sink assembly 20, from a vertical or bird's-eye view of assembly 10, as shown in Fig. 2A is shown. Referring to the Fig. 1A-2B and as in the Fig. As shown in Figures 2A-2B, the laser assembly 40 and the corrective optics assembly 70 have dimensions such that they fit within the footprint of the heat sink assembly 20, in that the width and length dimensions of the laser assembly 40 and the optics assembly 70 are equal to or smaller than the width and length dimensions of the heat sink assembly. The ability to maintain the existing footprint of the heat sink assembly 20 allows the existing design of the heat sink assembly 20 to be used even with additional optics assemblies 70 added to the assembly 10. Accordingly, any number of optics assemblies 70 can be stacked and added to the assembly 10, which is attached directly to the laser assembly 40 or to other optics within the optics assembly 70, without affecting the design or dimensional constraints of the assembly 10.

[0030] In contrast, conventional state-of-the-art methods for manufacturing epoxy-free laser assemblies employ structures or systems to hold the lenses within the assemblies. However, these structures or systems extend beyond the footprint of the laser array and the heat sink. For example, mechanical holders may be used to hold the lenses of the optics, with the holders themselves located outside the defined footprint of the heat sink to which the laser array is attached. As more optics or lenses are added, more holders are required, causing the assembly to expand in size and potentially exceed its size constraints.Accordingly, the assembly 10 of the present disclosure can overcome this problem by both avoiding the use of epoxy in the structure of the assembly 10 and maintaining the existing footprint of the heat sink assembly 20 or the laser arrangement 40 when additional optics are included.

[0031] The Fig. 3A-3K are views of laser assembly 10 of Fig. 1A in various manufacturing stages and individual components of the laser assembly 10 of Fig. 1A according to the first embodiment of the present disclosure. The systems and components of assembly 10 are described with reference to the Fig. 1A-3K described.

[0032] Fig. Figure 3A shows the heat sink assembly 20 with the heat sink 22, electrical mounting screws 24, and electrical contacts 26 for transmitting electrical power to the laser assembly 40. As can be seen, the ceramic 28 for electrical insulation is arranged on the top of the heat sink 22 and between the electrical contacts 26 such that it forms an electrical barrier between the laser assembly 40 (in Fig. 3A not shown) and can form the heat sink 22.

[0033] In Fig. In 3B, the laser arrangement 40 was added to the heat sink 22. The laser arrangement 40 comprises a laser diode stack with a plurality of laser diode bars 42 arranged side by side, as shown in Fig. Figure 3B is shown in detail. The laser arrangement 40 has an outer surface or end 44 which is arranged along the side of the heat sink 22. The outer surface 44 of the laser arrangement 40 is coated with a metallized material to allow contact with the fast-axis collimator 50 by means of solder ( Fig. 3D-3E). However, in order to direct the solder to specific sections of the metallized outer surface 44 and to prevent the solder from flowing to an adjacent laser diode bar, spaced-apart areas or grooves were formed in the metallized outer surface 44. As, for example, in Fig. As shown in Figure 3B, the metallized outer surface 44 has metallized sections 44A, which are usually formed from gold or a similar metal to which solder adheres well, and non-metallized sections 44B. The non-metallized sections 44B can be created by removing the metal from the metallized outer surface 44 at a location where the non-metallized section 44B is desired. In a specific example, the outer surface 44 can be metallized with gold, and then a saw can be used to remove the gold-metallized material and form the non-metallized sections 44B. The non-metallized sections 44B are aligned with the spaces between the tabs ( Fig. 3D-3E), whereby the non-metallized sections 44B can be formed before the tabs are attached.

[0034] Next, we will illustrate Fig. 3C the assembly 10 with sockets 46 formed on the laser arrangement 40. The sockets 46 provide the distance for the slow-axis collimator, which is based on Fig. 3F is explained, or provides the appropriate distance for the next optical unit within the assembly, which may vary depending on the design.

[0035] Fig. The 3D illustration depicts the subassembly of the fast-axis collimator 50, which includes a fast-axis collimator lens 52 and two tabs 54 for holding the fast-axis collimator lens 52 on the laser assembly 40. The fast-axis collimators 50 are the first set of optics located upstream of the light path of the laser diode bars of the laser assembly 40. As is known in the field, fast-axis collimators can be aspherical cylindrical lenses designed for beam shaping or laser diode collimation. Each of the laser diode bars of the laser assembly 40 can correspond to a single fast-axis collimator 50 aligned with it. The tabs 54, which may be made of metal or another material, may be attached to the outer ends of the fast-axis collimator lens 52 and generally have two holes 56A, 56B. The holes 56A, 56B may preferably be cylindrical, although other shapes may be used in certain situations.The first hole 56A can be a small hole in the upper part of the tab 54, and the second hole 56B can be a larger hole in the lower part of the tab 54. Each subassembly of the fast-axis collimator 50 can be assembled with a fast-axis collimator lens 52 and two tabs 54, each with the two holes 56A and 56B.

[0036] Once the desired number of subassemblies for the Fast-Axis Collimator 50 is manufactured, generally corresponding to the number of laser diode bars, they can be assembled as described in Fig. Figure 3E shows the laser assembly 40 being added. In this example, 20 laser diode bars and 20 fast-axis collimators 50 are shown, but any number of laser diode bars and fast-axis collimators 50 can be used in the assembly 10, depending on the configuration and / or intended use of the assembly 10. As shown in Fig. As shown in Figure 3E, the fast-axis collimators 50 can be arranged vertically above the laser assembly 40, so that they are positioned in a light path of the laser assembly 40. In this position, the two tabs 54 of the fast-axis collimator 50 extend along the outer surface 44 of the laser assembly 40, e.g., along the ends of each laser diode bar. While the first hole 56A of the tab 54 is used to form a solder connection with the fast-axis collimator lens 52, the second holes 56B can be used to form a solder connection between the tabs 54 and the laser assembly 40. Further details regarding the solder connection with the tabs 54 are given in reference to the Fig. 4A-5 indicated.

[0037] Once the fast-axis collimators 50 are connected to the assembly 10, a slow-axis collimator 60 can be arranged vertically above the fast-axis collimator 50 and in its light path, as shown in Fig. Figure 3F shows that the slow-axis collimator 60 emits the light from the laser assembly 40 in a different direction than the fast-axis collimator 50. As shown, the slow-axis collimator 60 can be a monolithic lens consisting of a single piece of mirror glass. Other materials or structures, as well as other large optical devices, can also be used, such as a monolithic array of cylindrical lenses that collimate the individual emitters of the laser assembly 40. The slow-axis collimator 60 can be soldered to the base 46, which in turn is soldered to the laser assembly 40.

[0038] Accordingly, no epoxy is currently used in the assembly of component 10.

[0039] Next, we will illustrate Fig. 3G the corrective optics 72, also known as the advanced optics or AO (Advanced Optic) subassembly, and Fig. Figure 3H illustrates assembly 10 with the corrective optics 72, which is arranged above the slow-axis collimator 60. Each of the laser diode bars of the laser assembly 40 may have some orientation differences with respect to it. The corrective optics 72 can be used to diffract the light from the laser diode bars so that all laser diode bars now emit light in the desired direction. The corrective optics 72 can have one or more sockets 74 or spacers arranged on one of its undersides and contacting the slow-axis collimator 60. The sockets 74 can be connected to the slow-axis collimator 60 via a solder connection.

[0040] Similar to the laser arrangement 40, the correction optics 72 has an outer surface or end 76 which is arranged along the longitudinal side of the heat sink assembly 20, wherein the outer surface 76 is coated with a metallized material in order to make contact with the wavelength stabilization optics by means of solder ( Fig. 3I-3K). To guide the solder to specific sections of the metallized outer surface 76 and to prevent the solder from flowing beyond the desired application area, spaced-apart areas or grooves were formed in the metallized outer surface 76. As, for example, in Fig. As shown in Figure 3G, the metallized outer surface 76 comprises metallized sections 76A, typically made of gold or a similar metal to which solder adheres well, and non-metallized sections 76B. The non-metallized sections 76B can be created by removing the metal from the metallized outer surface 76 at a location where the non-metallized section 76B is desired. In a specific example, the outer surface 76 can be metallized with gold, and then a saw can be used to remove the gold-metallized material and form the non-metallized sections 76B. The non-metallized sections 76B are oriented to fill the spaces between the tabs, as shown in Figure 3G. Fig. 3I-3K is explained.

[0041] Fig. Figure 3I illustrates the wavelength stabilization optics 80, also called VBG subassembly. Fig. 3J illustrates assembly 10 with one of the wavelength stabilization optics 80 in exploded view, while Fig. Figure 3K illustrates a side view of assembly 10 with a wavelength stabilization optic 80. The wavelength stabilization optic 80 can stabilize the wavelength. Depending on the selected VBG 82, it can hold the wavelength at the desired value and convert it back into the other wavelength colors generated by the laser diode bar. The wavelength stabilization optic 80 comprises a VBG 82 and two tabs 84 arranged at the ends of the VBG 82, as shown in Fig. Figure 3I shows. Each of the two tabs 84 has a first hole 86A, which is located in the upper part of the tab 84 and is used to control a solder joint with the VBG 82, and a second hole 86B, which is smaller than the first hole 86A, with the second hole 86B being located in the lower part of the tab 84 and being used to control a solder joint with the correction optics 72.

[0042] As in the Fig. As shown in Figure 3J-3K, the wavelength stabilizing optics 80 can be arranged vertically above the correction optics 72, such that each wavelength stabilizing optic 80 is positioned in a light path of the corresponding correction optic 72 below it. In this position, the two tabs 84 of the wavelength stabilizing optics 80 extend along the outer surface 76 of the correction optics 72, e.g., along their ends. The second holes 86B are then aligned with the outer surface 76 of the correction optics 72, so that a solder joint or junction can be formed between the tab 84 and the correction optics 72, the details of which are described in Figure 3J-3K. Fig. 4A-5 will be explained.

[0043] The Fig. 4A-4B are illustrations of laser assembly 10 of Fig. 1A in a front view according to the first embodiment of the present disclosure, showing the tabs and soldered joint. Fig. Figure 5 is an illustration of laser assembly 10. Fig. 1A according to the first embodiment of the present disclosure, which shows the tab. Referring to the Fig. 3H-5 allows the solder joint in assembly 10 to be used with the tabs as described for use between the fast-axis collimator 50 and the laser arrangement 40 and between the wavelength stabilization optics 80 and the correction optics 72. For clarity, the process for forming the solder joint is described with regard to the use of tab 84 between the wavelength stabilization optics 80 and the correction optics 72; however, the same process can also be used for tab 54 between the fast-axis collimator 50 and the laser arrangement 40.

[0044] As in Fig. As shown in Figure 4A, the tab 84 can accommodate a solder ball 12 in its second hole 86B, which is superimposed on the metallized section 76A of the outer surface 76 of the corrective optics 72. The solder ball 12 can contain an encapsulating material and / or a protective gas. Once the solder ball 12 is positioned in the second hole 86B, it is heated, for example, with a light, and the solder flows inside the second hole 86B and between the inner surface of the tab 84, which is also a metallized surface, and the contact surface of the metallized section 76A of the outer surface 76 of the corrective optics 72. Since the solder tends to flow only where there is a metallized surface on the metallized section 76A, it does not flow into the non-metallized sections 76B and is therefore retained in the metallized section 76A.Thus, the soldered connection maintains the desired contact between the tabs 84 and the designated sections of the outer surface 76 and does not migrate to undesired locations along the outer surface 76. Fig. 4B illustrates the flow plumb line 14 within the second hole 86B of tab 84.

[0045] As in Fig. As shown in Figure 5, the specific shape and materials of the tab 84 can be used to control the solder joint. Here, the second hole 86B of the tab 84 can have an inner side wall 88, which is also designed to have a metallized surface. The inner side wall 88 of the second hole 86B can, for example, be coated with gold. When the solder ball (not shown) is positioned and melted inside the second hole 86B, the solder is attracted to form a connection between the inner side wall 88 of the second hole 86B and the metallized surface 76B of the outer surface 76. The outer surface of the tab 84 can be made of a non-attractive material for soldering, such as titanium or glass, causing the solder to migrate into the second hole 86B and to the metallized surface 76B. After cooling, the solder dries through the second hole 86B on the inner side wall 88 of the second hole 86B and on the inner surface of the tab 84, e.g.on the surface facing the metallized surface 76A of the outer surface 76.

[0046] The same soldering technique can be used with the other solder joints formed with tabs. Furthermore, optical structures can also be gold-metallized to guide the solder to the desired areas, while undesired areas can be coated with solder-resistant materials such as titanium. In this way, assembly 10 as a whole can be designed as an epoxy-free assembly, since epoxy adhesives or similar bonding agents are not required to create or maintain connections between components. Accordingly, assembly 10 can improve upon the prior art shortcomings discussed in the background, as assembly 10 does not experience any creep or displacement of components due to epoxy curing or the long-term use of epoxy resin.

[0047] Fig. Figure 6 is a schematic representation of laser assembly 10. Fig. 1A according to the first embodiment of the present disclosure, which shows the sensitivity directions of the tabs. As shown, shows Fig. 6 the tabs 54 between the fast-axis collimator 50 and the laser assembly 40, and between the wavelength stabilization optics 80 and the correction optics 72. Apart from the fact that the assembly 10 is constructed as an epoxy-free structure, the use of the tabs 54 / 84 can offer significant improvements with respect to the misalignments that commonly occur in laser assemblies, partly due to the use of the tabs 54 / 84, which allow for better alignment of the optics and mounting of the optics in a manner that compensates for sensitivity directions. In conventional assemblies, for example, the optics are mounted using their side faces 90, e.g., the longitudinal side faces or bottom faces of the optics, as in Fig. 6 shown, attached. When attached to these surfaces, any movement in the connection formed on these surfaces can cause the optics to tilt or become misaligned about their longitudinal axis. It is not uncommon for movement to occur due to slight changes or forces in the environment in which the assembly is used. The optics are very sensitive to misalignment in this direction, i.e., in the sensitive direction, as shown in Fig. 6 is marked. Accordingly, a misalignment of the optics in this direction can lead to problems and / or failures in the assembly.

[0048] In contrast, in assembly 10 of the present disclosure, the optics are mounted using the tabs 54 / 84 arranged at the ends of the optics, so that misalignments in the connections formed against the tabs 54 / 84 do not cause misalignments of the optics in the sensitive direction. Rather, movements in the connections formed against the tabs 54 / 84 would lead to misalignments in the insensitive direction, as shown in Fig. 6 is characterized so that the optics can move in the vertical direction and angular or tilting movements are greatly minimized. Since the angle of the optical units, and especially the angle of the wavelength stabilization optics, is very critical, mounting the optics with the tabs 54 / 84 eliminates the criticality of tilting. This results in more accurate positioning of the optics during manufacturing and more precise retention of the optics in this position throughout the entire service life of the assembly 10 than is conventionally possible. When this structural difference from the prior art is combined with an epoxy-free assembly where the joints and connections are formed with solder or a similar material, the quality of the resulting assembly can be significantly improved compared to what is conventionally available.

[0049] Fig.Figure 7 is a flowchart 100 illustrating a method for manufacturing a laser assembly according to the first embodiment of the present disclosure. It should be noted that process descriptions or blocks in flowcharts are to be understood as representing modules, segments, code components, or steps comprising one or more instructions for implementing certain logical functions in the process, and that alternative implementations fall within the scope of the present disclosure in which functions may be performed in a different order than that shown or explained, including essentially in a simultaneous or reverse order, depending on the functionality concerned, as can be understood by a person skilled in the art with sufficient knowledge in the field of the present disclosure.

[0050] As shown in block 102, at least one laser arrangement is in thermal contact with a heat sink. At least one optical assembly is arranged in a light path of the at least one laser arrangement, wherein the at least one laser arrangement and the at least one optical assembly are epoxy-free (block 104). The method may include any number of additional steps, features, or structures, including those disclosed with respect to another figure of this disclosure. For example, several optical assemblies may be arranged in the light path of the at least one laser arrangement, wherein the at least one laser arrangement and all of the several optical assemblies fit into a footprint of the heat sink (block 106).Additionally, the optical assembly may include at least one correction optic and at least one wavelength stabilization optic, wherein the at least one wavelength stabilization optic is connected to the at least one correction optic by at least one tab and one perpendicular (Block 108).

[0051] It should be emphasized that the embodiments of the present disclosure described above, in particular the "preferred" embodiments, are merely possible examples of implementations presented solely for the purpose of better understanding the principles of the disclosure. Many modifications and alterations to the embodiment(s) of the disclosure described above can be made without substantially departing from the concept and principles of the disclosure. All such modifications and alterations are hereby included within the scope of this disclosure and the present disclosure and are protected by the following claims.

Claims

[1] Laser assembly (10) comprising the following: a heat sink assembly (20) with a footprint, at least one laser arrangement (40) which is arranged in contact with the heat sink assembly (20) and comprises several laser diode bars (42) and several fast-axis collimators (50), wherein the at least one laser arrangement (40) fits into the footprint of the heat sink assembly (20), wherein the fast-axis collimators (50) are arranged vertically above the laser diode bars (42), wherein a connection between the multiple laser diode bars (42) and the multiple fast-axis collimators (50) each comprises a soldered connection, wherein the soldered connection comprises two tabs (54) each with two holes (56A, 56B), wherein solder is applied within each of the two holes (56A, 56B); and at least one optical assembly (70) which is arranged in a light path of the at least one laser arrangement (40), wherein the at least one optical assembly (70) fits into the mounting surface of the heat sink assembly (20), wherein the laser assembly is epoxy-free. [2] Laser assembly (10) according to claim 1, wherein the ends of the multiple laser diode bars (42) further comprise a metallized surface (44A) with spaced-apart, non-metallized grooves (44B) formed therein, wherein the solder is applied within one of the two holes (56A, 56B) of the tabs (54) in a position above the metallized surface (44A). [3] Laser assembly (10) according to one of claims 1 to 2, wherein the at least one optical assembly (70) further comprises several correction optics (72) and several wavelength stabilization optics (80), wherein a connection between the several correction optics (72) and the several wavelength stabilization optics (80) each further comprises a soldered connection. [4] Laser assembly according to claim 3, wherein the soldered connection between the multiple correction optics (72) and the wavelength stabilization optics (80) further comprises at least one tab (84) with two holes (86A, 86B), wherein solder is applied inside each of the two holes (86A, 86B). [5] Laser assembly (10) according to claim 4, wherein the ends of the multiple correction optics (72) further comprise a metallized surface (76) with spaced-apart, non-metallized grooves (76B) formed therein, wherein the solder is applied within one of the two holes (86A, 86B) of the tab (84) comprising the solder joint between the multiple correction optics (72) and the wavelength stabilization optics in a position above the metallized surface. [6] Laser assembly (10) according to one of claims 3 to 5, wherein the at least one wavelength stabilization optic (80) further comprises a volume Bragg grating (VBG) (82). [7] Laser assembly according to claim 4, wherein the at least one tab (84) comprising the soldered connection between the multiple correction optics (72) and the wavelength stabilization optic is connected to one end of one of the multiple wavelength stabilization optics (80). [8] Laser assembly (10) according to one of the preceding claims, wherein the heat sink assembly (20) further comprises two electrical contacts (26) arranged on opposite sides of the heat sink assembly (20), wherein the at least two electrical contacts (26) define two opposite edges of the mounting surface. [9] Laser assembly according to one of claims 7 to 8, which further comprises at least one ceramic layer (28) for electrical insulation, arranged between the heat sink assembly (20) and the at least one laser arrangement (40).

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