Sensor device, method for forming a sensor device, carrier tape, chip card and method for forming a chip card

Abstract

carrier tape (201) showing: a plurality of sensor devices (100), each of the sensor devices (100) comprising: • having a fingerprint sensor (109): ◯ a silicon-based area sensor; and ◯ a sensor area; a carrier strip body (220) on or in which a plurality of electrically conductive contact areas (142) and a plurality of antennas (154) are formed, each of the antennas being coupled to one of the fingerprint sensors (109) for inductive coupling of the fingerprint sensor (109) to a booster antenna (330); and a plurality of through-openings (170), wherein the carrier strip (201) is formed by connecting the carrier strip body (220) with the plurality of sensor devices (100), wherein one of the fingerprint sensors (100) is arranged in each of the through-openings (170), wherein the plurality of sensor devices (100) are connected to the carrier strip body such that one of the electrically conductive contact areas is laterally adjacent to one of the sensor surfaces and is configured to be touched when the contact surface is touched with a finger in order to bring the finger to a predetermined potential.

Description

[0001] The invention relates to a sensor device, a method for forming a sensor device, a carrier tape, a chip card and a method for forming a chip card.

[0002] Nowadays there is a clear trend towards chip cards or smart cards, e.g. for banking applications or access authorizations, which are equipped with biometric sensors for authentication, e.g. fingerprint sensors.

[0003] These cards, however, have a complex structure with several components that are galvanically connected. For example, the fingerprint sensor can be electrically connected to a chip (which can provide security-relevant functions and is then also called a secure element) and to an antenna.

[0004] For widespread acceptance, mass market applications, such as payment / banking applications, must be cost-effective on the one hand and meet prescribed reliability and security requirements on the other, e.g., the requirements of the CQM standard regarding mechanical reliability.

[0005] In the prior art, various fingerprint sensors have been proposed, which differ in terms of the type of sensor, the sensor material and the method of assembling the smartcard.

[0006] SE 175 836 A1 describes a fingerprint module that has a fingerprint sensor which is inserted into an opening in a substrate and is electrically connected to an RFID antenna which serves both for communication and for energy generation for the sensor.

[0007] According to a prior art assembly technology, a T-shaped chip module is used, which, however, is not designed for contactless use.

[0008] There is a need for a cost-effective, reliable and easy-to-install biometric sensor (e.g. a fingerprint sensor) for integration into a chip card, e.g. a so-called smart card.

[0009] This need exists both for silicon-based biometric sensors, which are described above, and for printed circuit board (PCB-based) biometric sensors for chip cards.

[0010] PCB substrate-based biometric fingerprint sensors are typically manufactured from PCB panels, which are then separated by processes such as punching, milling, or cutting. The resulting chip modules are individual units, which is not a standard manufacturing method for smartcards.

[0011] So far, PCB substrate-based biometric fingerprint sensors for biometric smart cards are not yet mass-produced, so there has been no need to revise the manufacturing concepts towards mass production.

[0012] For mass production, however, there is a need for suitable manufacturing processes for PCB substrate-based biometric fingerprint sensors. It could be useful to utilize assembly methods that are currently in use, such as implanting modules and sensors with standard chip card implantation equipment, for example, using hot-melt implantation.

[0013] In various embodiments, a sensor device, e.g. a chip module with a fingerprint sensor, is provided which can be easily and mass-producibly implanted into a chip card body.

[0014] US patent 2020 / 0051061A1 discloses a non-self-sufficient biometric authentication device comprising a far-field radio microwave antenna, an antenna tuner, an RF DC power rectifier, and power converter functions.

[0015] US patent 7,193,282 B2 discloses a contact sensor chip package comprising a substrate, a contact sensor chip, a grounding element, and an encapsulation.

[0016] US Patent 2012 / 0049309A1 discloses a smartcard comprising a core substrate equipped with a film substrate on which an IC chip of the fingerprint image capture sensor and an electrical circuit pattern are arranged, and a top sheet and a bottom sheet made of thermoplastic or paper enclosing the core substrate.

[0017] EP 3 543 897 A1 discloses a fingerprint detection device comprising a substrate, a fingerprint sensor arranged on one side of the substrate, and a coupling electrode arranged on another side of the substrate, wherein the coupling electrode is arranged to provide a coupling capacitance between a surface of a finger and a circuit ground of the fingerprint sensor.

[0018] A carrier tape according to claim 1, a chip card according to claim 6, a method for forming a carrier tape according to claim 7, and a method for forming a chip card according to claim 12 are provided. Further embodiments are described in the dependent claims.

[0019] In various embodiments, the sensor device can be composed of a first component and a second component, which are easily connectable. The first component can include the fingerprint sensor and is accordingly also referred to as the sensor component, while the second component can be a carrier with an opening in which the first component is arranged, and is therefore also referred to as the carrier component.

[0020] The carrier can be, in various embodiments, a standard 35 mm carrier strip for roll-to-roll production of chip modules. This enables the sensor assembly (chip module) to be implanted into the chip card body on standard machines, for example, at the end customer's site. During standard downstream processing, the sensor assembly can be separated from the carrier strip, e.g., by die-cutting, and implanted into the chip card body, for example, using a hot-melt process.

[0021] In other words, the standard 35 mm carrier strip represents the familiar form of provision for the chip modules and forms (e.g. after die-cutting) part of the sensor assembly.

[0022] In various embodiments, a (e.g. complex) sensor component is combined with a (simple) 35 mm carrier strip to add further functionality to the sensor component, e.g. providing a mounting area for mounting as a standard chip module, and thus to the sensor device formed thereby in a standard provision form.

[0023] In various embodiments, the sensor device (also referred to as sensor module) can include the sensor, e.g. a fingerprint sensor, and an integrated (coupling) antenna.

[0024] The sensor module can be integrated into a chip card (e.g., a smart card) in various embodiments, using coil-on-module (CoM) technology. In CoM technology, a large antenna (the so-called booster antenna) for communication with a smart card reader is located within the card body of the smart card and couples inductively to a (significantly smaller) antenna that is part of a chip card module.

[0025] In various embodiments, a connection between the sensor module and a booster antenna arranged in a chip card body can be established by means of inductive coupling. The inductive coupling can be used for both data transmission and for supplying power to operate the sensor.

[0026] In various embodiments, a cost-effective, reliable, and easy-to-assemble sensor device, e.g., with a fingerprint sensor, is provided. In various embodiments, the sensor device can be integrated into a chip card, e.g., a smart card. Since the integration into the card is also simple and cost-effective, the chip card is also cost-effective according to various embodiments.

[0027] In various embodiments, a coil-on fingerprint sensor module is provided. This makes it possible to provide a complex sensor system as a single package composed of two components. Functionality can be improved by providing a standard booster antenna in a carrier into which the coil-on fingerprint sensor module can be embedded.

[0028] Exemplary embodiments of the invention are shown in the figures and are explained in more detail below.

[0029] They show Fig. 1A Schematic top views of the front and back of a sensor component of a sensor device according to various embodiments; Fig. 1B a schematic cross-sectional view of a sensor device according to various embodiments; Fig. 1C Schematic top views of the front and back of a support component of a sensor device according to various embodiments; Fig. 1D an illustration of a coupling process of a sensor component and a carrier component to form the sensor device according to various embodiments; Fig. 2 a schematic top view of a front and a back side of a carrier belt with a plurality of sensor devices according to various embodiments and a schematic top view of a front and a back side of a carrier belt in which the sensor components are not yet mounted; Fig. 3 a schematic perspective representation of a chip card according to various embodiments; Fig. 4 a schematic top view of a chip card according to various embodiments; Fig. 5 a schematic top view of a front and a back of a sensor device according to various embodiments; Fig. Figures 6A to 6C each show a schematic top view with a partial cross-sectional view of an embodiment of a sensor device according to various embodiments; Fig. Figures 7A to 7D each show a schematic perspective top view of the front of a sensor device, which is mounted in a carrier strip according to various embodiments. Fig. 8 is used; Fig. 8 a schematic top view of a front and a back of a carrier belt and a front view of a carrier belt with a plurality of sensor devices according to various embodiments; Fig. 9 schematic perspective top views of a front and a back of a sensor device (below) and a support component of the sensor device before coupling with the sensor component (above) to form a support band according to various embodiments; Fig. 10 a schematic top view of a chip card according to various embodiments with a cross-sectional view of a partial area and an illustration of an assembly process of the sensor device in the chip card body; Fig. 11A a perspective exploded view of a sensor device according to various embodiments together with bottom views of the elements to be joined; Fig. 11B a schematic representation of the antennas of the sensor device Fig. 11A; Fig. 12 a flowchart of a method for forming a sensor device according to various embodiments; and Fig. 13 a flowchart of a method for forming a sensor device according to various embodiments.

[0030] The following detailed description refers to the accompanying drawings, which form part thereof and illustrate specific embodiments in which the invention can be implemented. In this context, directional terminology such as "top," "bottom," "front," "back," "anterior," "rear," etc., is used with reference to the orientation of the described figure(s). Since components of embodiments can be positioned in a number of different orientations, the directional terminology serves only for illustration and is in no way limiting. It is understood that other embodiments may be used and structural or logical modifications may be made without deviating from the scope of protection of the present invention.It is understood that the features of the various exemplary embodiments described herein can be combined with one another, unless specifically stated otherwise. The following detailed description is therefore not to be interpreted in a limiting sense, and the scope of protection of the present invention is defined by the appended claims.

[0031] Within the scope of this description, the terms "connected," "attached," and "coupled" are used to describe both direct and indirect connections, direct or indirect links, and direct or indirect couplings. In the figures, identical or similar elements are labeled with identical reference symbols where appropriate.

[0032] To distinguish between embodiments, some devices, equipment, components, etc. may be provided with a reference numeral in addition to a generic reference numeral, which includes the generic reference numeral and a lowercase letter appended to it.

[0033] Fig. Figure 1A shows schematic top views of the front and back of a sensor component 101 of a sensor device 100 according to various embodiments. Fig. 1B a schematic cross-sectional view of a sensor device 100 according to various embodiments, Fig. 1C Schematic top views of the front and back of a carrier component 101 of a sensor device 100 according to various embodiments, and Fig. Figure 1D illustrates a coupling process of a sensor component 101 and a carrier component 156 to form the sensor device 100 according to various embodiments.

[0034] Furthermore, they show Fig. 3 a schematic perspective representation of a chip card 300 according to various embodiments, Fig. 4 a schematic top view of a chip card 400 according to various embodiments, and Fig. 5 A schematic top view of a front and a back of a sensor device according to various embodiments.

[0035] The sensor device 100 can include a fingerprint sensor 109. The fingerprint sensor 109 can be a silicon-based area sensor with a sensor area 101S and can accordingly also be referred to as a sensor chip 109. The sensor chip 109 can be part of a sensor component 101.

[0036] The fingerprint sensor 109 can be arranged on the top side of a printed circuit board (PCB) 105, which forms a substrate 105. The substrate 105 can be a multilayer substrate, for example, with a top metal layer, an (electrically insulating) substrate core, and a bottom metal layer. Optionally, the substrate can have additional solder mask layers.

[0037] In various embodiments, the sensor chip 109 can be electrically connected to the upper metal layer of the substrate 105 by means of wire bonding (e.g. by means of a wire 158).

[0038] The sensor chip 109 can be encapsulated with a cap made of encapsulation material 102, for example an epoxy-based potting compound.

[0039] A flat surface of the encapsulation material 102 can form a sensor area which a user touches with their finger to capture the fingerprint.

[0040] Accordingly, the sensor area of ​​the encapsulation material 102 can be exposed so that the fingerprint sensor 109 can be touched with a finger and is set up to capture fingerprint characteristics of the finger.

[0041] If there is still free space available in the encapsulated area on the top side of the substrate 105, further components, such as a sensor evaluation chip 110 and / or further circuit elements 130 (which may, for example, also include a second chip), can be arranged on the top side of the substrate 105. Otherwise, the second chip 130 or the circuit elements 130 can be arranged on the underside of the substrate 105. This is illustrated by the following example. Fig. 1A (below) is shown.

[0042] The sensor evaluation chip 110 and possibly other chips can be mounted using flip-chip mounting (FC mounting) (for example soldered as a so-called "Surface Mounted Device" SMD, glued on, etc.).

[0043] However, other or additional connection technologies such as wire bonding can also be used. The additional circuit elements 110, 130 can, for example, include a security chip (also referred to as a Secure Element (SE)) 110, a microcontroller unit (MCU), a power source (e.g., a voltage supply that provides energy received by means of a booster antenna from an electromagnetic field generated by an external reader), and / or additional active and / or passive components that, for example, facilitate or enable a function of the fingerprint sensor 101.

[0044] In addition, the sensor component can have 101 LEDs for communication with the user, for example to indicate by means of a green light that a chip card 300, in which the sensor device 100 can be integrated, is working (e.g. as intended).

[0045] The height of the additional components can be selected such that the total thickness of the sensor component 101 does not exceed approximately 550 µm, so that the sensor component 101 can be inserted into the smartcard 300 (i.e., implantable).

[0046] In various embodiments, the upper metal layer on the substrate 105 can further comprise exposed (i.e., unencapsulated) contacts 103, which are configured to form an electrically conductive connection to the carrier component 156, in particular to the corresponding contact pads 174. See, for example, Fig. 1A, Fig. 1C and Fig. 1D.

[0047] In various embodiments, such contacts can be formed as part of the lower metal layer of the substrate 105. An electrically conductive contact 148, 150 to the carrier component 156 can then be formed, for example, by means of wire bonding. This is exemplified in Fig. 1B is shown.

[0048] The cap made of encapsulation material 102 can be formed such that there is a border region with a width of approximately 200 µm to approximately 1000 µm, e.g. between 400 µm and 800 µm on the substrate, which is free of the encapsulation material 102. This (e.g. flat) border region on the top side of the sensor component 101 can be used to connect the sensor component 101 to the carrier component 156.

[0049] The sensor device 100 can further comprise an electrically conductive contact area 142 arranged laterally adjacent to the sensor surface 101S. The contact area 142 can, for example, be formed as a metal surface, such as a metal layer 142 on an electrically insulating substrate 152. The electrically insulating substrate 152 and the electrically conductive contact area 142 can be part of the carrier component 156.

[0050] The contact area 142 can be configured to also be touched when the contact surface 101S is touched by a finger, in order to bring the finger to a predetermined potential, for example, a ground potential. This may be necessary for the operation of the silicon-based, for example, capacitive fingerprint sensor 109.

[0051] The contact area 142 can be electrically connected to the sensor evaluation chip 110 or to a circuit connected thereto in various embodiments.

[0052] In various embodiments, the sensor device 100 can also include an antenna 154 coupled to the fingerprint sensor 109 for inductive coupling of the fingerprint sensor 109 with a booster antenna 330 (see Fig. 4) exhibit.

[0053] The contact area 142 and the antenna 154 can be arranged vertically one above the other in various embodiments, separated from each other by the electrically insulating substrate 152. In various embodiments, the contact area 142 and the antenna 154 can be arranged laterally offset from each other. An electrically conductive bridge 146 for connecting two ends of the antenna 154 can be arranged on the same side as the contact area 142. Fig. Figure 1C shows an exemplary embodiment of the carrier component 156 with the antenna 154 on the underside and the contact area 142 on the top side.

[0054] Antenna contact pads 174_1 for forming an electrically conductive contact between the sensor component 101 and the carrier component 156 can, in various embodiments, be part of the lower metallization layer of the carrier component 156. The antenna contact pads 174_1 can be contact pads for the antenna contacts LA / LB, and at least one contact pad 174_2 for each segment of the contact area 142.

[0055] Because of the antenna 154, which can be part of the carrier component 156 and thus part of the sensor device 100, the sensor device 100 can also be considered a coil-on-module device.

[0056] To avoid disruptive interaction between the contact area 142 and the antenna 154 (for example, if, according to one embodiment, the antenna 154 is arranged below the electrically conductive contact area 142), the electrically conductive contact area 142 can be formed as a broken ring or as a plurality of segments. In the exemplary embodiments from Fig. 1C and Fig. In 1D, the contact area 142 is formed from two segments. A gap 172 for interrupting or segmenting the contact area 142 can be formed, for example, by etching.

[0057] The carrier component 156 can be formed from a typical chip module substrate 152 with a two-layer metallization 142, 154 (e.g., on the top and bottom). A surface finish of the metal layers can, for example, correspond to that of typical chip card metallizations, such as with copper (Cu) as the base material with a top layer that has or consists of nickel (Ni), gold (Au), palladium (Pd), or, for example, a CuSnZn alloy (e.g., MIRALLOY®).

[0058] The thickness of the substrate 152 can be chosen such that the cap made of encapsulation material 102 does not protrude beyond the metallization of the top surface, i.e., beyond the contact area 142, after the sensor component 101 has been joined with the carrier component 156.

[0059] The fingerprint sensor 109 can have a sensor evaluation chip 110 which can be configured to process captured sensor signals, for example to generate an image of the fingerprint from the sensor signals or to perform other standardized processing of the captured sensor signals suitable for comparison with reference sensor signals.

[0060] The sensor evaluation chip 110 can be connected to the fingerprint sensor 109 by means of a circuit. In various embodiments, the sensor evaluation chip 110 can be arranged on a side of the sensor component 101 facing away from the sensor area 101S. Additionally, in various embodiments, further circuit elements 130 can be provided, for example, on the same side of the sensor component 101 as the sensor evaluation chip 110. The further circuit elements 130 can, for example, comprise a second chip, capacitors (for example, for tuning the antenna for inductive coupling; for this purpose, capacitors can be connected in parallel and / or in series with inductive sections of the antenna 154), diodes, etc. The antenna 154 can be tuned such that its operation is optimized for the standard frequency of 13.56 MHz required according to ISO 14443.

[0061] The processed fingerprint signal can be provided for comparison with reference sensor signals (e.g., fingerprint signals) stored in the sensor unit 100 or provided by an external device, also known as an external reader. The reference fingerprint signals stored in the sensor unit 100 can, for example, be stored in a second chip (not shown), which can be configured as a Secure Element or a so-called Security Controller.

[0062] The second chip can be configured for contactless communication with the sensor device-external device, wherein the antenna 154 can be electrically connected to the second chip.

[0063] In various embodiments, the captured fingerprint can be compared with the reference sensor signals in the second chip, or, in other embodiments, in the external reader. If it is determined that the captured fingerprint matches a reference sensor signal, a requested action can be enabled, for example, a money transaction can be authorized or access granted.

[0064] In Fig. 1B and Fig. Figure 1D illustrates how a connection is formed between the carrier component 156 and the sensor component 101.

[0065] The support component 156 can be provided as part of a support strip 200 in various embodiments. See [reference]. Fig. 2, in which the carrier belt 200 is shown below without the sensor component 101, and above with the mounted sensor component 101, each as a top view from above (left) and from below (right).

[0066] The carrier tape can be a standard 35 mm carrier tape for roll-to-roll manufacturing of chip modules. This means that the carrier tape 200 meets the specifications required for its use with roll-to-roll manufacturing equipment currently employed in the production of chip modules. However, the carrier tape 200 can also be designed to provide the functionality described herein for the sensor device 100, for example, the metallization 142, the antenna 154, and optionally, vias for connecting the metallization 142 or the antenna 154, etc.

[0067] The carrier band 200 can have a carrier band body 220 with a plurality of (for example, punched) through-openings 170, wherein one of the fingerprint sensors 109, for example one of the sensor components 101, is arranged in each of the through-openings 170. A respective area around the through-openings 170 can form the carrier component 156, which, after the sensor device 100 has been separated, forms part of the sensor device 100.

[0068] In particular, for example, the antenna 154 of a respective sensor device 100 of the plurality of sensor devices 100 on the carrier strip body 200 can be formed in such a way that it surrounds the through-opening 170 in which the fingerprint sensor 109 is arranged.

[0069] The assembly of the sensor component 101 and the carrier component 156 to form the sensor assembly 100 thus takes place on the 35 mm carrier strip 200 according to various embodiments. However, for the sake of clarity, Fig. 1B and Fig. 1C shows 100 individual sensor devices.

[0070] The electrically conductive contact area 142 of a respective sensor device 100 of the plurality of sensor devices 100 can be formed on the carrier strip body 220 in such a way that it surrounds the through-opening 170 in which the fingerprint sensor 109 is arranged.

[0071] After the sensor components 101 are inserted into the carrier strip 200, the carrier strip 201 thus has a plurality of sensor devices 100, each of the sensor devices 100 having a fingerprint sensor 109 and an antenna 154 coupled to the fingerprint sensor 109 for inductively coupling the fingerprint sensor 109 with a booster antenna 330.

[0072] Fig. Figure 12 shows a flowchart 1200 of a method for forming a sensor device according to various embodiments.

[0073] The method comprises coupling a fingerprint sensor, which has a silicon-based area sensor, with an antenna for inductive coupling of the fingerprint sensor with a booster antenna (1210), and forming an electrically conductive contact area on the carrier body adjacent to the through-hole such that, after arranging the fingerprint sensor in the through-hole, the contact area is arranged laterally adjacent to the sensor surface and is configured to be touched when the contact surface is touched with a finger in order to bring the finger to a predetermined potential (1220).

[0074] The connection of the carrier component 156 with the sensor component 101 is carried out in various embodiments on a standard 35 mm carrier strip 200.

[0075] During connection, the contact pads 174 are brought into (electrically conductive) contact with the contacts 103.

[0076] Mounting the sensor component 101 onto the carrier component 156 (e.g., onto the carrier strip 200) can be done in one of several ways, several of which are described below by way of example.

[0077] The sensor component 101 can be mounted on the carrier component 156 using a non-conductive adhesive 153. The adhesive 153 can be applied to the carrier component, the sensor component 101, or both before mounting, for example, to the respective contact areas, such as an (e.g., outer) edge region of the sensor component 101 and / or an (e.g., inner) edge region of the carrier component 156.

[0078] To ensure good electrically conductive contact between the contact surfaces 174 and the contacts 103, an electrically conductive adhesive can be applied between each contacting contact surface / contact pair, for example a fully conductive adhesive or an anisotropic conductive adhesive.

[0079] The adhesive 153 can be cured in situ in various embodiments, for example as a so-called snap-cure process while the two components 101, 156 are pressed together in a laminating device. Alternatively, curing can take place, for example, in a box oven or in a reflow oven.

[0080] The sensor component 101 can be mounted on the carrier component 156 using a conductive adhesive (fully conductive adhesive or an anisotropic conductive adhesive) in a manner deviating from the adhesive method described above.

[0081] The adhesive can be applied to the carrier component, the sensor component 101 or both before assembly, for example on respective contact areas, such as an (e.g. outer) edge area of ​​the sensor component 101 and / or an (e.g. inner) edge area of ​​the carrier component 156, and also between the contacting contact surfaces / contact pairs.

[0082] It can be advantageous that only one type of adhesive is used to connect the components 101, 156 and the contact surface / contact pairs.

[0083] The sensor component 101 can be mounted on the carrier component 156 by means of a soldering process. The respective contact areas of components 101 and 156, for example, an outer edge area of ​​the sensor component 101 and / or an inner edge area of ​​the carrier component 156, can be designed as a solderable surface.

[0084] It can be advantageous that only one type of material is used for fastening and electrically connecting the components 101, 156 and the contact surface / contact pairs.

[0085] Soldering can be performed in-situ, for example in a soldering and laminating unit. Alternatively, soldering can be performed in a reflow oven, which, however, can have the disadvantage that other solder joints on the sensor assembly may also be remelted.

[0086] In various embodiments, the processes described above can be combined. For example, an adhesive for attaching the sensor component 101 to the carrier component 156 can be combined with soldering for electrically connecting the contact surface / contact pairs.

[0087] After connecting the sensor component 101 to the carrier component 156, the resulting sensor assembly 100 can be embedded in a chip card body 332 to form a chip card 300. This is in Fig. 3 illustrated.

[0088] The antenna 154 of the sensor unit 100 and the booster antenna 330, more precisely a coupling area 330K of the booster antenna 330, can be aligned with each other in the chip card 300 in such a way that a coupling strength necessary for operating the sensor unit 100 as part of the chip card 300 is achieved. See also Fig. 4.

[0089] As in Fig. 3 and Fig. As shown in Figure 4, the chip card 300 can, in various embodiments, further comprise a contact-based chip module 440. The contact-based chip module 440 can have its own secure element for contact-based operation of the card. The secure element of the contact-based chip module 440 can be independent of the secure element 110 of the sensor device 100.

[0090] Fig. Figure 5 shows a schematic top view of a front and a back side of the sensor device 100, 100b according to various embodiments. As in Fig. As shown in Figure 5, the sensor device 100, 100b can, in addition to the sensor component 101, have a contact-based interface 440 for contact-based communication, which can be formed integrally with the sensor device 100, for example by forming the carrier component 156 in such a way that it accommodates both the sensor component 101 and the contact-based interface 440.

[0091] In this case, antenna 154 can be designed to extend to the edge region below the contact-based interface. This increases the antenna area, which can improve the quality of the contactless transmission.

[0092] In various embodiments, a sensor device 100 is provided, which is formed as an assembly of two different components, a sensor component 101 and a carrier component 156.

[0093] A cost optimization is advantageous with this type of assembly. For example, higher densities can be achieved when manufacturing the sensor component 101 if it is mounted on a PCB substrate (e.g., panel or strip) than if it had to be mounted directly on the carrier strip 200.

[0094] Fig. Figures 6A to 6C each show a schematic top view with a partial cross-sectional view of a sensor device 600, which is inserted into a carrier belt according to various embodiments. Fig. Figures 7A to 7D each show a schematic perspective top view of the front of a sensor device 600 according to various embodiments, wherein in Fig. Figure 7D additionally shows a schematic perspective top view of the back of sensor component 601 and an enlarged representation of a sub-area. Fig. Figure 8 shows a schematic top view of a front and a back of a carrier belt 800 (above) and a front view of a carrier belt 801 with a plurality of sensor devices 600 according to various embodiments (below). Fig. Figure 9 shows schematic perspective top views of a front and a back of a sensor device 600 (below) and a carrier component 656 before coupling with the sensor component 601 to form a carrier band 801 according to various embodiments. Fig. Figure 10 shows a schematic top view of a chip card 1000 according to various embodiments with a cross-sectional view of a partial area and an illustration of a mounting process of the sensor device 600 in the chip card body 332.

[0095] In various embodiments, a carrier belt 801 is provided. The carrier belt 801 has a plurality of sensor devices 600.

[0096] Without the sensor devices, the carrier belt is designated with the reference numeral 800 and corresponds, as above in connection with Fig. Section 2 explains a standard 35 mm carrier tape for roll-to-roll production of chip card modules. Differences between the sensor-less carrier tapes 800 and 201, and the carrier tapes 200 and 801 equipped with sensor devices 100 and 600 respectively, are explained below.

[0097] Even in the exemplary embodiments according to Fig. 7A to 10 the sensor device 600 is formed by coupling a carrier component (the carrier belt 800) and a sensor component 601 and is made available for easy further processing with currently used roll-to-roll devices.

[0098] Apart from the differences explained, the properties, materials, etc. of the sensor devices 100 and 600, the carrier tapes 800 and 201, and the chip cards 300 and 1000 may be essentially the same or similar.

[0099] Each of the sensor devices 600 can have a fingerprint sensor 609 and an antenna 672 coupled to the fingerprint sensor 609 for inductive coupling of the fingerprint sensor 609 with a booster antenna 330.

[0100] The fingerprint sensor 609 can have a sensor area with a plurality of sensor pads. This is a key difference between the fingerprint sensor 609 described in the embodiments of the Fig. 7A to 10 is used, and the fingerprint sensor 109 of the Fig. 1A to 6C.

[0101] The 609 fingerprint sensor can have a sensor area with a multitude of sensor pads, which can be arranged in rows and columns. The sensor pads can thus form an X*Y sensor array for capturing fingerprints.

[0102] The fingerprint sensor 609 can be arranged on a PCB substrate 662.

[0103] In Fig. 7D illustrates a layered structure of the fingerprint component 601.

[0104] Below the fingerprint sensor 609, which may be provided with a thin protective layer, (for example in this order) an upper solder mask 670, an upper metal layer 674, a substrate 662 (e.g. a PCB substrate) and a lower solder mask 676 may be arranged.

[0105] The corners of sensor component 601 may be rounded. This can simplify the insertion of sensor component 601 into a milled opening in a chip card 1000.

[0106] The (PCB) substrate 662 may include additional metal layers, grounding and power supply lines or areas. Furthermore, active and passive circuit elements may be embedded in the substrate 662, which are not shown here.

[0107] Unlike sensor component 101, sensor component 601 itself can be equipped with antenna 672 for coupling to a coupling area 330K of a booster antenna 330, which can be arranged in a chip card body 332. The antenna can, for example, be formed on a side of sensor component 601 facing away from the sensor area, for example in an edge region. See, for example, Fig. 7D.

[0108] Furthermore, with the PCB-based fingerprint sensor 601, it is generally not necessary to apply a grounding potential to the finger with the majority of sensor pads.

[0109] The carrier component 656 can have a metal surface 142 on its upper side, similar to the carrier component 156, which does not require it to be connected to the sensor component 601 by means of an electrically conductive connection.

[0110] The metal surface 142 can serve, for example, as a mounting surface, as a definition of where the sensor device 600 to be separated from the carrier strip 801 ends, and / or for mechanical stabilization. Optionally, for example to protect against electrostatic discharge, the metal surface 142 can be connected to ground potential.

[0111] The carrier component 656, which can be formed, for example, as the carrier strip 800, can have a substrate 152, for example, a reinforced epoxy strip or a polyimide strip, which can be provided with an upper metallization 142 and a lower metallization 661. The upper metallization 142 and the lower metallization 661 can, for example, consist of copper (Cu), which can be coated with, for example, nickel (Ni), gold (Au), palladium (Pd), or, for example, a CuSnZn alloy (e.g., MIRALLOY®) or other alloys thereof. The metallization can consist of the same materials or different materials on the top and bottom surfaces.

[0112] In Fig. Figure 9 shows the support component 656 as a single support component 656 for better clarity, although it actually forms part of the support band 800.

[0113] Here too, as described above for the carrier component 156, care must be taken to ensure that the metallizations 142, 661 on the carrier component 656 do not form closed rings, but rather an open ring or ring segments. Gap 172 can be created for this purpose, for example by etching or other suitable methods used to structure the metallization.

[0114] In the bottom row of the Fig. Figure 9 shows the sensor device 600, which is formed by joining the sensor component 601 with the carrier component 656.

[0115] A fastening material 153 is used to attach them together. This is in Fig. 6A to 6C illustrated.

[0116] Depending on the method used to attach the sensor component 601 to the carrier component 656, the fastening material 153 can vary and may, for example, include non-conductive adhesives, conductive adhesives (isotropic or anisotropic), solder alloys and / or hot melt materials.

[0117] An outer edge region of the sensor component 601 can be attached to an inner edge region that defines a through-opening 170 of a carrier strip body 220. The width of each attached region can be, for example, between 0.2 mm and 1.2 mm.

[0118] In Fig. 7A the edge area of ​​the sensor component 601 is completely covered with a solder mask material 670.

[0119] In Fig. 6C shows a connection between such a sensor component and a carrier component 656, in which the substrate 152 is exposed and connected to the solder mask 670.

[0120] In Fig. In 7B, the edge region of the sensor component 601 has metal structures in the upper metal layer 674. The edge region is free of solder mask material 670. This embodiment can be used to form an electrically conductive connection between the sensor component 601 and the carrier component 656. To ensure that the inductive coupling of the antenna 672 is not disturbed by the metal structures 674, the metal structures should not be formed as a closed ring, as explained above.

[0121] In various embodiments, as in Fig. As shown in 6A, metal structures may also be formed in the edge area of ​​the support component 656.

[0122] In Fig. In step 7C, the edge region of the sensor component 601 is free of the upper solder mask 670 and also free of the upper metal layer. Accordingly, the substrate 662 is exposed in the edge region. The area of ​​the carrier component 656 to be coupled to this can either have metal structures, for example to form an electrically conductive connection between the sensor component 601 and the carrier component 656, or be free of metal. An adhesive (conductive or insulating) can be used for fastening, for example.

[0123] In Fig. 6B shows a substrate-to-substrate connection. For this purpose, for example, an adhesive 153 can be used.

[0124] The types of coating used for the contact surfaces and the fastening material used can influence the in Fig. 6A to 6C each have a marked offset between a surface of the fingerprint sensor 609 and a surface of the carrier component 656. The offset is further influenced by the thickness of the metal layers 142, 661 of the carrier component 656 and the thickness of its substrate 152.

[0125] The assembled sensor unit 600 can be implanted into the chip card body 332 after the sensor unit 600 has been separated from the carrier strip 801, for example (as explained above for the carrier strip 200) by means of punching, milling, cutting or similar processes.

[0126] Embedding the sensor unit 600 into the chip card, which is in Fig. As illustrated in Figure 10, this can be achieved, for example, using a hot-melt process. The hot-melt implantation process is a standard process in chip card manufacturing and is therefore generally available and suitable for high-volume production.

[0127] An opening 1010, 1012, into which the sensor unit 600 is inserted, can have a shallower opening 1012 and a deeper opening 1010, wherein the (thicker) sensor component 601 is inserted into the deeper opening 1010, and the carrier component 656 is attached with its underside to the bottom of the shallower opening 1010 by means of an adhesive 1014, for example by means of the hot melt process. This is shown in the cross-sectional view of the Fig. 10 illustrated.

[0128] Other features of the Chipcard 1000 correspond to those explained in connection with the Chipcard 300.

[0129] Fig. Figure 13 shows a flowchart 1300 of a method for forming a sensor device according to various embodiments.

[0130] The method can include coupling a fingerprint sensor, which has a sensor area with a plurality of sensor pads, with an antenna (1310), wherein inductive coupling of the fingerprint sensor with a booster antenna takes place (1320).

[0131] The method may further include forming a through-opening in a carrier body and arranging the fingerprint sensor in the through-opening.

[0132] The carrier body can be a carrier band body (for example, a standard 35 mm carrier band body) that has the through-hole in which the fingerprint sensor is arranged, and at least one further through-hole in which at least one further fingerprint sensor is arranged.

[0133] The method can further include singulating the sensor device by cutting through the carrier belt body.

[0134] Fig. Figure 11A shows a perspective exploded view of a sensor device 1100 according to various embodiments.

[0135] In sensor device 1100, the sensor component 601, which has the integrated antenna 672, is combined with the carrier component 156, which has the antenna 154. This is illustrated in views showing the two components 601 and 156 from below.

[0136] The antenna 672 of the sensor component 601 and the antenna 154 of the carrier component 156 are electrically connected to each other in various embodiments. Fig. Figure 11B schematically shows only the antennas 154, 672, which form a common antenna 1110, as an exploded view including the connections between the antennas 154, 672 (the bridge 146, the contact pads 174, the contacts 103 and vias that connect them and are indicated as broken lines).

[0137] In various embodiments, the antenna 1110 can exhibit better transmission characteristics than either of the antennas 154, 672 alone.

[0138] Other properties, manufacturing processes, etc. correspond to those explained above for the other exemplary embodiments, so a repetition is omitted here.

[0139] The following is a summary of some examples.

[0140] Exemplary embodiment 1 is a sensor device. The sensor device comprises a fingerprint sensor, which includes a silicon-based area sensor, a sensor surface, and an electrically conductive contact area arranged laterally adjacent to the sensor surface, which is configured to be touched when the contact surface is touched by a finger in order to bring the finger to a predetermined potential, and an antenna coupled to the fingerprint sensor for inductively coupling the fingerprint sensor to a booster antenna.

[0141] Exemplary embodiment 2 is a sensor device according to exemplary embodiment 1, wherein the fingerprint sensor is a capacitive sensor.

[0142] Exemplary embodiment 3 is a sensor device according to exemplary embodiment 2, wherein the electrically conductive contact area is formed as an interrupted ring or as a plurality of segments.

[0143] Exemplary embodiment 4 is a sensor device according to exemplary embodiment 2 or 3, wherein the antenna is arranged below the electrically conductive contact area.

[0144] Exemplary embodiment 5 is a sensor device according to one of the exemplary embodiments 1 to 4, wherein the fingerprint sensor has a sensor chip configured to process detected sensor signals.

[0145] Exemplary embodiment 6 is a sensor device according to one of the exemplary embodiments 1 to 5, which further comprises a second chip, wherein the second chip is configured for communication with a sensor device-external device, wherein the antenna is electrically connected to the second chip.

[0146] Exemplary embodiment 7 is a sensor device according to exemplary embodiment 6, wherein the second chip is configured as a secure element.

[0147] Exemplary embodiment 8 is a sensor device according to one of the exemplary embodiments 1 to 7, which is configured as a coil-on-module device.

[0148] Exemplary embodiment 9 is a sensor device according to one of the exemplary embodiments 1 to 8, which furthermore has a contact-based interface for contact-based communication.

[0149] Exemplary embodiment 10 is a carrier belt which has a plurality of sensor devices according to one of the exemplary embodiments 1 to 3.

[0150] Exemplary embodiment 11 is a carrier tape according to exemplary embodiment 10, wherein the carrier tape is a standard 35 mm carrier tape for roll-to-roll manufacturing of chip modules.

[0151] Exemplary embodiment 12 is a carrier band according to exemplary embodiment 11, which further comprises a carrier band body with a plurality of through-openings, wherein one of the fingerprint sensors is arranged in each of the through-openings.

[0152] Exemplary embodiment 13 is a carrier tape according to exemplary embodiment 12, wherein the antenna of a respective sensor device of the plurality of sensor devices on the carrier tape body is formed in such a way that it surrounds the through-opening in which the fingerprint sensor is arranged.

[0153] Exemplary embodiment 14 is a carrier tape according to exemplary embodiment 12 or 13, wherein the sensor device has the electrically conductive contact area according to exemplary embodiments 2 to 9, and wherein the electrically conductive contact area of ​​a respective sensor device of the plurality of sensor devices on the carrier tape body is formed such that it surrounds the through-opening in which the fingerprint sensor is arranged.

[0154] Exemplary embodiment 15 is a carrier belt. The carrier belt has a plurality of sensor devices, each of which has a fingerprint sensor and an antenna coupled to the fingerprint sensor for inductively coupling the fingerprint sensor to a booster antenna, wherein the fingerprint sensor has a sensor area with a plurality of sensor pads.

[0155] Exemplary embodiment 16 is a chip card. The chip card comprises a chip card body, a sensor device embedded in the chip card body according to one of exemplary embodiments 1 to 10, and a booster antenna embedded in the chip card body with a coupling area for inductive coupling with the antenna of the sensor device.

[0156] Exemplary embodiment 17 is a chip card according to exemplary embodiment 16, wherein the coupling area is arranged around the sensor device.

[0157] Exemplary embodiment 18 is a chip card according to exemplary embodiment 16, wherein the coupling area is arranged below the antenna of the sensor device.

[0158] Exemplary embodiment 19 is a chip card according to one of the exemplary embodiments 16 to 18, wherein the sensor device is formed according to exemplary embodiment 9, and wherein the chip card further comprises a further chip arranged in the chip card body and electrically coupled to the contact-based interface.

[0159] Exemplary embodiment 20 is a method for forming a sensor device. The method comprises coupling a fingerprint sensor, which has a silicon-based area sensor, with an antenna for inductively coupling the fingerprint sensor with a booster antenna, and forming an electrically conductive contact area on the carrier body adjacent to the through-hole such that, after the fingerprint sensor has been arranged in the through-hole, the contact area is arranged laterally adjacent to the sensor surface and is configured to be touched when the contact surface is touched with a finger in order to bring the finger to a predetermined potential.

[0160] Exemplary embodiment 21 is a method according to exemplary embodiment 20, which further comprises forming a through-opening in a carrier body, forming the antenna surrounding the through-opening on or in the carrier body and arranging the fingerprint sensor in the through-opening.

[0161] Embodiment 22 is a method according to embodiment 21, wherein the electrically conductive contact area is formed as an interrupted ring or as a plurality of segments.

[0162] Embodiment 23 is a method according to embodiment 21 or 22, wherein the antenna is arranged below the electrically conductive contact area.

[0163] Exemplary embodiment 24 is a method according to one of the exemplary embodiments 20 to 23, which further comprises an electrically conductive connection of a second chip to the antenna, wherein the second chip is configured for communication with a sensor device-external device.

[0164] Exemplary embodiment 25 is a method according to one of the exemplary embodiments 20 to 24, which further comprises arranging the fingerprint sensor on a sensor carrier such that the sensor carrier has an edge region that extends laterally beyond the fingerprint sensor, wherein arranging the fingerprint sensor in the through-opening comprises connecting the edge region of the sensor carrier to the carrier body.

[0165] Embodiment 26 is a method according to embodiment 25, wherein the joining involves soldering or gluing using an electrically conductive and / or electrically insulating adhesive.

[0166] Embodiment 27 is a method according to embodiment 26, wherein the joining comprises soldering or gluing using the electrically conductive adhesive, and wherein the coupling of the fingerprint sensor to the antenna is carried out by means of the joining.

[0167] Exemplary embodiment 28 is a method according to exemplary embodiment 26, wherein the joining comprises gluing by means of the electrically insulating adhesive, and wherein the coupling of the fingerprint sensor to the antenna further comprises an electrically conductive connection of the fingerprint sensor and the antenna by means of an electrically conductive connecting element.

[0168] Exemplary embodiment 29 is a method for forming a sensor device. The method comprises coupling a fingerprint sensor, which has a sensor area with a plurality of sensor pads, with an antenna for inductively coupling the fingerprint sensor with a booster antenna.

[0169] Exemplary embodiment 30 is a method according to exemplary embodiment 29, which further comprises forming a through-opening in a carrier body and arranging the fingerprint sensor in the through-opening.

[0170] Exemplary embodiment 31 is a method according to one of the exemplary embodiments 20 to 30, wherein the carrier body is a carrier band body having the through-opening in which the fingerprint sensor is arranged, and at least one further through-opening in which at least one further fingerprint sensor is arranged, wherein the method further comprises singulating the sensor device by cutting the carrier band body.

[0171] Embodiment 32 is a method according to embodiment 31, wherein the cutting includes punching.

[0172] Embodiment 33 is a method for forming a chip card. The method comprises arranging a booster antenna with a coupling area for inductive coupling with an antenna of a sensor device in a chip card body and inserting a sensor device according to one of embodiments 1 to 9 into the chip card body.

[0173] Further advantageous embodiments of the device will result from the description of the method and vice versa.

Claims

[1] Carrier tape (201) having: a plurality of sensor devices (100), each of the sensor devices (100) comprising: • having a fingerprint sensor (109): ◯ a silicon-based area sensor; and ◯ a sensor area; a carrier strip body (220) on or in which a plurality of electrically conductive contact areas (142) and a plurality of antennas (154) are formed, wherein one of the antennas is coupled to one of the fingerprint sensors (109) for inductive coupling of the fingerprint sensor (109) to a booster antenna (330); and a plurality of through-openings (170), wherein the carrier strip (201) is formed by connecting the carrier strip body (220) with the plurality of sensor devices (100), wherein one of the fingerprint sensors (100) is arranged in each of the through-openings (170), wherein the plurality of sensor devices (100) are connected to the carrier strip body such that one of the electrically conductive contact areas is laterally adjacent to one of the sensor surfaces and is configured to be touched when the contact surface is touched with a finger in order to bring the finger to a predetermined potential. [2] Carrier tape (201) according to claim 1, wherein the electrically conductive contact area (142) is formed as an interrupted ring or as a plurality of segments. [3] Carrier tape (201) according to claim 1 or 2, wherein the antenna (154) is arranged below the electrically conductive contact area (142). [4] Carrier tape (201) according to one of claims 1 to 3, wherein the antenna of a respective sensor device of the plurality of sensor devices on the carrier tape body is formed such that it surrounds the through-hole in which the fingerprint sensor is arranged. [5] Carrier tape (201) according to one of claims 1 to 4, wherein the electrically conductive contact area (142) of a respective sensor device (100) of the plurality of sensor devices (100) on the carrier tape body (220) is formed such that it surrounds the through-opening (170) in which the fingerprint sensor (109) is arranged. [6] Chip card (400), comprising: • a chip card body (332), • a sensor device (100) embedded in the chip card body (332), which is taken from a carrier tape (201) according to one of claims 1 to 5; and • a booster antenna (330) embedded in the chip card body (332) with a coupling area (330K) for inductive coupling with the antenna (672) of the sensor device (100). [7] Method for forming a carrier band, comprising: • Forming a through-opening in a carrier body; • Forming a plurality of antennas and a plurality of electrically conductive contact areas on or in a carrier tape body; • Connecting a plurality of sensor devices, each comprising a silicon-based fingerprint sensor and area sensor, to the carrier strip, wherein each sensor device is arranged in one of the through-holes and is connected to one of the antennas for inductive coupling of the fingerprint sensor to a booster antenna, and wherein the electrically conductive contact area is arranged adjacent to the area sensor and is configured to be touched when the contact area is touched with a finger in order to bring the finger to a predetermined potential. [8] Method according to claim 7, further comprising: • Form the antenna's through-hole on or in the support body. [9] Method according to claim 7 or 8, further comprising • Arranging the fingerprint sensor on a sensor carrier such that the sensor carrier has a border area that extends laterally beyond the fingerprint sensor; • wherein connecting the fingerprint sensor to the carrier body involves connecting the edge area of ​​the sensor carrier to the carrier body. [10] Method according to claim 9, wherein the joining comprises soldering or gluing using an electrically conductive and / or electrically insulating adhesive. [11] Method according to claim 9, • wherein the joining involves gluing using the electrically insulating adhesive, and • wherein the coupling of the fingerprint sensor with the antenna further comprises an electrically conductive connection of the fingerprint sensor and the antenna by means of an electrically conductive connecting element. [12] Method for forming a chip card, comprising: • Arranging a booster antenna with a coupling area for inductive coupling with an antenna of a sensor device in a chip card body; • Cutting the carrier tape body of a carrier tape formed according to one of claims 7 to 11 for separating one of the sensor devices together with the antenna associated therewith; • Inserting the sensor device into the chip card body.

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