LED light chain, process and plant for its manufacture

Abstract

LED light chain (140), characterized in that the LED light chain (140) comprises: a first wire (141), a second wire (142), and a third wire (143), wherein the first wire (141), the second wire (142), and the third wire (143) are arranged parallel to each other, the first wire (141), the second wire (142), and the third wire (143) each comprise a wire core and an insulating layer enclosing a surface of the wire core, wherein along an axial direction of the first wire (141), a portion of the insulating layer is removed from the first wire (141) at predetermined length intervals to form multiple first solder joints, along an axial direction of the second wire (142), a portion of the insulating layer is removed from the second wire (142) at predetermined length intervals to form multiple second solder joints, and positions of the multiple second solder joints correspond to positions of the multiple first solder joints to form multiple luminous soldering areas; several SMD LEDs (144), wherein the several SMD LEDs (144) are each arranged at the several light soldering areas and two solder joints of the SMD LED (144) are each soldered at the first soldering point and at the second soldering point in the corresponding light soldering area, and the several SMD LEDs (144) are connected in a mixed configuration; and several encapsulation colloids (145), wherein the several encapsulation colloids (145) each enclose surfaces of the several SMD LEDs (144) and parts of the third wire (143) corresponding to the positions of the several SMD LEDs (144) to form several light spheres, wherein at least every two adjacent SMD LEDs (144) form a light emission unit, positions of a positive electrode and a negative electrode of the two adjacent SMD LEDs (144) are designed in the same way in each light emission unit, positions of a positive electrode and a negative electrode in two adjacent light emission units are formed in opposite ways, and the first wire (141) and the second wire (142) between each two adjacent light emission units are cut off alternately such that the multiple SMD LEDs (144) are connected in a mixed configuration, and wire ends formed when the first wire (141) and the second wire (142) are cut off are encapsulated within the encapsulation colloids (145).

Description

[0001] The invention relates to lighting technology, and in particular to an LED light chain, a method for producing the LED light chain and a system for producing the LED light chain.

[0002] LED string lights are a type of decorative lighting device that includes luminous bulbs, wires, and the like. They are widely used in decoration, construction, and display areas. Due to their energy saving, environmental protection, aesthetic appearance, and low price, LED string lights are becoming increasingly popular. Common LED string lights generally consist of two wires arranged in parallel, multiple SMD LEDs arranged along the length of the wires at a certain distance, and encapsulation colloids encapsulating the SMD LEDs. Because the SMD LEDs in such twisted LED string lights are connected in parallel, the length of the strings is limited due to power supply limitations and voltage attenuation, resulting in poor productivity.Sometimes a string of LEDs connected in series is created by cutting one of the wires between two adjacent LEDs. However, the two wires can move relative to each other in such a way that the LEDs on the wires can easily fall off.

[0003] US 2019 / 0103736 A1 describes a light strip comprising: a plurality of wires, each comprising an insulating layer and a conductor, wherein the insulating layer has at least one through-hole, and the conductor is covered by portions of the insulating layer outside the through-hole; and a plurality of light-emitting elements, each having a positive pin and a negative pin connected to the two conductors of the two wires through the through-holes of the two wires. The positive pin of at least one of the plurality of light-emitting elements and the negative pin of at least one other of the plurality of light-emitting elements are connected to the conductor of the same wire via the two through-holes of the same wire, wherein the through-hole is formed by applying a stripping method.

[0004] US 2019 / 0234597 A1 describes a string of lights comprising at least two conductor wires, each covered with an insulating coating defining a plurality of holes acting as electrical bare spots, a control device having an input terminal connected to an external power supply and an output terminal electrically connected to the at least two conductor wires, and comprising a plurality of light sources. Each light source comprises one or more LEDs and a circuit board having a first surface for mounting the one or more LEDs and a second surface defining at least two conductive strips over the second surface. The at least two conductive strips are each electrically connected to the at least two conductor wires via the bare spots. Each connecting part between the conductive strips and the conductor wires is wrapped with a light-transmitting adhesive.Two conductive ends of each LED are electrically connected to two of the at least two conductive strips.

[0005] CN 204477773 U describes an SMD LED light string comprising first, second and third conductors, a plurality of SMD LED lamp bodies and start and end connectors, wherein two electrode ends of the plurality of SMD LED lamp bodies are electrically connected to the first and second conductors, respectively, and the positive and negative terminals of each two adjacent SMD LED lamp bodies are electrically connected to the first and second conductors in opposite polar directions, and all adjacent two SMD LED lamp bodies are electrically connected in opposite directions.The conductors between the lamp bodies from the positive pole of the first SMD LED lamp body to the negative pole of the second SMD LED lamp body are cut off, so that a plurality of SMD LED lamp bodies form a series light chain; the beginning and end of the series light chain together with the beginning and end of the third conductor are connected to the start and end connectors, respectively; the first, second, and third conductors are packaged in the same strip with a plurality of SMD LED lamp bodies inside an elongated colloid.

[0006] US 2019 / 0101254 A1 describes a method for manufacturing a light strip, comprising at least: winding a plurality of wires, removing an insulating layer, and attaching and fixing LED chips. The step of winding the wires includes providing a winding jig with a wire fixing portion at both ends of the winding jig, forming the winding jig with a hollow portion along a longitudinal direction, and winding the wires around the winding jig, each of the wires having an insulating layer, and the wires being repeatedly wound over the hollow portion. The step of removing the insulating layer includes removing a portion of the insulating layer from each of the wires to expose a core wire therein. The step of attaching and fixing the LED chips consists of attaching and fixing the LED chips onto the core wires of the wires.Accordingly, the LED chips are firmly and electrically connected to the wires.

[0007] In view of the above-mentioned prior art, the invention provides an LED light string with higher intensity, higher productivity, and higher product quality. Furthermore, the invention provides a method and system for manufacturing the above-mentioned LED light string.

[0008] To achieve the above-mentioned object, the LED light chain according to the invention can comprise: a first wire, a second wire, and a third wire, wherein the first wire, the second wire, and the third wire are arranged parallel to each other, the first wire, the second wire, and the third wire each comprise a wire core and an insulating layer covering a surface of the wire core, wherein, along an axial direction of the first wire, a part of the insulating layer is spaced apart from the first wire at predetermined length intervals to form a plurality of first soldering points, along an axial direction of the second wire, a part of the insulating layer is spaced apart from the second wire at predetermined length intervals to form a plurality of second soldering points, and positions of the plurality of second soldering points respectively correspond to positions of the plurality of first soldering points to form a plurality of luminous soldering regions; a plurality of SMD LEDs, wherein the plurality of SMD LEDs are each arranged at the plurality of luminous soldering areas and two solder joints of the SMD LED are each soldered at the first soldering point and at the second soldering point in the corresponding luminous soldering area, and the plurality of SMD LEDs are connected in parallel, in series, or mixed; and a plurality of encapsulation colloids, wherein the plurality of encapsulation colloids each envelop surfaces of the plurality of SMD LEDs, and parts of the third wire corresponding to positions of the plurality of SMD LEDs, to form a plurality of luminous balls, wherein at least every two adjacent SMD LEDs form a light-emitting unit, positions of a positive electrode and a negative electrode of the two adjacent SMD LEDs are designed similarly in each light-emitting unit, positions of a positive electrode and a negative electrode in two adjacent light-emitting units are formed in an opposite manner, and the first wire and the second wire are alternately cut between every two adjacent light-emitting units such that the plurality of SMD LEDs are mixed-connected, and wire ends formed at the cut-off of the first wire and the second wire are encapsulated within the encapsulation colloids.

[0009] Since the LED string light according to the invention has three wires, if the LED string light is a series-connected LED string, the third wire can increase the strength of the LED string light to prevent the SMD LEDs from fading when the LED string light is pulled. And if the LED string light is a parallel-connected LED string light, the third wire can be connected in parallel with the first wire or the second wire, which contributes to reducing the voltage attenuation speed so that the LED string light is not limited by the power supply. Furthermore, this LED string light is suitable for automated production. This is beneficial for reducing labor costs and labor intensity, effectively increasing productivity, and improving product quality for the string light.

[0010] It is described that the positions of a positive electrode and a negative electrode in two adjacent SMD LEDs are formed in an opposite manner. The first wire and the second wire between each two adjacent SMD LEDs are alternately cut such that the plurality of SMD LEDs are connected in series. Wire ends formed at the cut-off of the first wire or the second wire are encapsulated within the encapsulation colloids.

[0011] It is described that the positions of the positive electrode and the negative electrode for the plurality of SMD LEDs are configured similarly such that the plurality of SMD LEDs are connected in parallel. The third wire is electrically connected to the first wire or to the second wire via at least one connecting wire connected between the third wire and the first wire, or between the third wire and the second wire.

[0012] In one embodiment, the first wire, the second wire and the third wire are an enameled wire or a rubber wire.

[0013] According to the invention, a method for producing the LED light chain is provided, which comprises the following steps: - Wiring a first wire and a second wire in parallel to each other by a wiring mechanism for the first and second wires; - Transferring the first wire and the second wire to a wire stripping working position by a wire transfer mechanism, and removing a part of an insulating layer of the first wire and a part of an insulating layer of the second wire at predetermined removal intervals by a wire stripping mechanism to form first soldering points and second soldering points, wherein positions of the first soldering points correspond to positions of the second soldering points, respectively; - Transferring the first soldering joint and the second soldering joint to a solder dropping working position by the wire transfer mechanism, and coating a surface of the first soldering joint and a surface of the second soldering joint with a solder by a solder dropping mechanism; - Transferring the first soldering point and the second soldering point, whose surfaces are coated with the solder, to an LED mounting work position by the wire transfer mechanism, and placing two solder joints of an SMD LED respectively at the first soldering point and the second soldering point by an LED placing mechanism; - Transferring the SMD LED placed at the first and second soldering points to a soldering working position by the wire transfer mechanism, and soldering the two solder joints of the SMD LED at the first soldering point and the second soldering point respectively by a soldering mechanism; - Transfer the soldered SMD LED to a soldering inspection work position through the wire transfer mechanism, and check a soldering quality for the SMD LED through a soldering inspection mechanism; - Wiring a third wire in parallel to the first wire and the second wire through a third wire wiring mechanism; - Transferring the inspected SMD LED and the third wire to a first encapsulation working position by the wire transfer mechanism, and encapsulating the SMD LED and a part of the third wire corresponding to a position of the SMD LED within an encapsulation colloid by a first encapsulation mechanism to form a luminous ball; - Transferring the flare to a wire cutting working position through the wire transfer mechanism, and determining through the wire cutting mechanism whether to cut the wire, if YES, cutting the first wire or the second wire between two adjacent flares, and if NO, not cutting the first wire or the second wire between the two adjacent flares; and - Transferring the flare to a second encapsulation working position by the wire transfer mechanism, and when the first wire or the second wire is cut off between two adjacent flares, encapsulating the flare and wire ends formed when the first wire or the second wire is cut off within the encapsulation colloid by a second encapsulation mechanism.

[0014] A plant for producing an LED light chain is provided according to the invention, which comprises the following mechanisms: a first and second wire wiring mechanism configured to wire the first wire and the second wire in parallel with each other; a wire stripping mechanism configured to remove a portion of an insulating layer on a surface of the first wire and a portion of an insulating layer on a surface of the second wire to form a first solder joint and a second solder joint; a solder dropping mechanism configured to coat a surface of the first solder joint and a surface of the second solder joint with a solder; an LED placement mechanism configured to place two solder joints of an SMD LED at the first solder joint and at the second solder joint, respectively; a soldering mechanism configured to solder the two solder joints of the SMD LED at the first soldering point and at the second soldering point, respectively; a verification mechanism designed to verify a soldering quality for the SMD LED; a third wire wiring mechanism configured to wire the third wire in parallel with the first wire and the second wire; a first encapsulation mechanism configured to encapsulate the SMD LED and a portion of the third wire corresponding to a position of the SMD LED within an encapsulation colloid to form a luminous ball; a wire cutting mechanism configured to determine whether to cut the wire, if YES, cut the first wire or the second wire between two adjacent flares, and if NO, do not cut the first wire or the second wire between two adjacent flares; a second encapsulation mechanism configured, when the first wire or the second wire between two adjacent flares is cut, to encapsulate the flare and wire ends formed upon cutting of the first wire or the second wire within the encapsulation colloid; and a wire transmission mechanism configured to transmit the first wire, the second wire, and the third wire.

[0015] In one embodiment, the first encapsulation mechanism comprises a first colloid dropping mechanism configured to coat surfaces of the SMD LED and the portion of the third wire corresponding to the position of the SMD LED, and a first solidification mechanism configured to harden the colloid solution.

[0016] In one embodiment, the first solidification mechanism comprises a pre-solidification component and a post-solidification component, wherein the pre-solidification component comprises a blow-drying device configured to blow and dry the colloid solution and a pre-solidification ultraviolet lamp configured to pre-solidify the colloid solution, and the post-solidification component comprises a solidification ultraviolet lamp configured to solidify the dried and pre-solidified colloid solution.

[0017] In one embodiment, the wire cutting mechanism comprises four wire cutting devices arranged sequentially along a wire feed direction, wherein two of the wire cutting devices are configured to cut the first wire between two SMD LEDs and the other two of the wire cutting devices are configured to cut the second wire between two SMD LEDs.

[0018] The advantages provided by the additional features of the present invention are explained in more detail by way of example with reference to figures in the detailed description by means of embodiments. Fig. 1 shows a structural representation of a first embodiment of an LED light chain. Fig. 2 shows a circuit diagram of the design of the LED light chain according to Fig. 1. Fig. 3 shows a circuit diagram of an embodiment of the LED light chain according to the invention. Fig. 4 shows a structural representation of a third embodiment of the LED light chain. Fig. Figure 5 shows a circuit diagram of the third embodiment of the LED light chain. Fig. 6 shows a flowchart of an embodiment of a method according to the invention for producing the LED light chain. Fig. 7 shows an axonometric view, seen from front to back, of an embodiment of a system according to the invention for producing the LED light chain. Fig. Figure 8 shows an axonometric view, viewed from back to front, of the embodiment of the system according to the invention for producing the LED light chain. Fig. 9 shows, in a three-dimensional structural representation, an embodiment of a soldering mechanism of the embodiment of the system for producing the LED light chain according to the invention. Fig. 10 shows a three-dimensional representation of an embodiment of a wiring mechanism for a third wire of the system according to the invention for producing the LED light chain. Fig. 11 shows a three-dimensional representation of an embodiment of a wire cutting mechanism of the system according to the invention for producing the LED light chain.

[0019] The invention will be explained in more detail below with reference to the figures and embodiments. However, it should be clarified that the following embodiments and the features of the embodiments can be combined with one another in any way, provided there are no contradictions regarding the combinations.

[0020] In the embodiments, the terms "top," "bottom," "left," and "right" are intended solely for the purpose of describing them, rather than limiting the feasible scope of the invention. Changes or modifications regarding the relative orientations are to be considered within the feasible scope of the invention.

[0021] Fig. Figure 1 shows a structural diagram of an LED light chain. As shown in Fig. 1, the LED light string 140 includes a first wire 141, a second wire 142, a third wire 143, a plurality of SMD LEDs 144, and a plurality of encapsulating colloids 145. The first wire 141, the second wire 142, and the third wire 143 are arranged parallel to each other. The first wire, the second wire, and the third wire each include a wire core (not shown) and an insulating layer (not shown) covering the surface of the wire core. In this embodiment, the first wire, the second wire, and the third wire may each be a rubber wire or an enamel wire. A part of the insulating layer on the first wire 141 and a part of the insulating layer on the second wire 142 are removed along the axial direction of the wires at predetermined length intervals to form a plurality of first soldering points (not shown) and a plurality of second soldering points (not shown).The positions of the plurality of second soldering points correspond respectively to the positions of the plurality of first soldering points to form a plurality of luminous soldering areas. The SMD LEDs 144 are respectively arranged in the plurality of luminous soldering areas, and two solder joints of the SMD LEDs 144 are respectively soldered at the first soldering point and at the second soldering point in the corresponding luminous soldering area. Positions of a positive electrode and a negative electrode of every two adjacent SMD LEDs 144 are arranged relative to each other in an opposite manner. The first wire 141 and the second wire 142 between every two adjacent SMD LEDs 144 are alternately cut, i.e.When the first wire 141 between the front two adjacent SMD LEDs is cut, the second wire 142 therebetween is not cut, while the first wire 141 between the rear two adjacent SMD LEDs 144 is not cut, but the second wire 142 therebetween is cut, and furthermore, the plurality of SMD LEDs 144 can be connected in series. The plurality of encapsulation colloids 145 respectively enclose the surfaces of the plurality of SMD LEDs 144 and the surfaces of the portions of the third wire 143 corresponding to the plurality of SMD LEDs 144 to form a plurality of luminous balls.

[0022] Fig. 2 shows a circuit diagram of the design of the LED light chain according to Fig. 1. When actuated, one end of the first wire 141 is connected to one end of the third wire 143, and the other end of the first wire 141 and the other end of the third wire 143 are respectively connected to a negative electrode and a positive electrode of the drive power supply (not shown).

[0023] In this embodiment, the LED light string is a string of LEDs connected in series, which can be powered by a high-voltage power supply (such as a 220V power supply). It is advantageous if the third wire 143 is secured to the first wire 141 and the second wire 142 via the encapsulating colloid 145, thus increasing the strength of the LED light string 140 and preventing the SMD LEDs 144 from falling off when the LED light strings are pulled out.

[0024] Fig. Figure 3 shows a circuit diagram of an embodiment of the LED light chain according to the invention. The arrangement of the LED light chain in this embodiment is essentially the same as that shown in Fig. 1. The difference is that at least every two (but every three in this embodiment) adjacent SMD LEDs 144 form a light-emitting unit. The SMD LEDs 144 in each individual light-emitting unit are connected in parallel. The positions of the positive and negative electrodes of the two adjacent light-emitting units are arranged in an opposite manner, and the first wire 141 and the second wire 142 between every two adjacent light-emitting units are alternately cut so that the plurality of SMD LEDs 144 are connected in a mixed manner. In this way, the SMD LEDs 144 in each individual light-emitting unit are connected in parallel, and all the light-emitting units are in turn connected in series.

[0025] The LED light string according to the invention is a light string with mixed-connection LEDs that can be powered by a high-voltage power supply (such as a 110V power supply). It is advantageous if the third wire 143 is secured to the first wire 141 and the second wire 142 via the encapsulating colloid 145 to increase the strength of the LED light string 140 so that the SMD LEDs 144 are prevented from falling off when the LED light strings are pulled out.

[0026] Fig. 4 shows a structural diagram of another LED light chain. As in Fig. 4, the arrangement of the LED light chain is essentially the same as that in the embodiment according to Fig. 1. The difference is that the plurality of SMD LEDs 144 are connected in parallel via the first wire 141 and the second wire 142, and the third wire 143 is connected to the first wire 141 or the second wire 142 via at least one connecting wire 146.

[0027] Fig. 5 shows a circuit diagram of the design of the LED light chain according to Fig. 4. When actuated, the first wire 141 is connected to a negative electrode of the drive power supply, and the second wire 142 and the third wire 143 are connected to a positive electrode of the drive power supply.

[0028] The LED light string is a light string with parallel-connected LEDs that can be powered by a low-voltage power supply (such as a 3V power supply). Furthermore, connecting the third wire 143 in parallel with the second wire 142 increases the cross-sectional area of ​​the second wire 142, effectively reducing voltage attenuation and improving lighting efficiency. Furthermore, securing the third wire 143 to the first and second wires via the encapsulating colloid 145 is advantageous for increasing the strength of the LED light string and preventing the SMD LEDs 144 from falling off when the LED light strings are pulled out.

[0029] In another embodiment of the present invention, a method for manufacturing the LED light chain is provided. As in Fig. As shown in Figure 6, the manufacturing process includes the following steps.

[0030] In step S1, a first and second wire are wired. The first wire and the second wire are wired in parallel to each other by a first and second wire wiring mechanism.

[0031] In step S2, wire insulation stripping is performed. The first wire and the second wire are transferred to a wire stripping work position by a wire transfer mechanism, and a part of an insulating layer on a surface of the first wire 141 and a part of an insulating layer on a surface of the second wire 142 are removed by a wire stripping mechanism at predetermined removal intervals to form first solder joints and second solder joints. The positions of the first solder joints correspond to the positions of the second solder joints, respectively.

[0032] In step S3, solder is dripped. The first solder joint and the second solder joint are transferred to a solder dripping work position by the wire transfer mechanism, and the solder dripping mechanism coats the surfaces of the first solder joints of the first wire 141 and the surfaces of the second solder joints of the second wire 142 with solder. In this embodiment, the solder is tin paste.

[0033] In step S4, an SMD LED is mounted. The first and second solder joints, whose surfaces are coated with solder, are transferred to an LED mounting work position by the wire transfer mechanism, and two solder joints of an SMD LED are placed at the first solder joint and the second solder joint, respectively, by an LED placement mechanism.

[0034] In step S5, soldering is performed. The SMD LED placed at the first soldering point and the second soldering point is transferred to a soldering work position by the wire transfer mechanism, and two solder joints of the SMD LED 144 are soldered by a soldering mechanism, respectively, to the first soldering point of the first wire 141 and to the second soldering point of the second wire 142.

[0035] In step S6, a soldering inspection is performed. The soldered SMD LED is transferred to a soldering inspection work position by the wire transfer mechanism, and the soldering quality of the SMD LED is inspected by a soldering inspection mechanism.

[0036] In step S7, a third wire 143 is wired in parallel to the first wire 141 and the second wire 142 by a third wire wiring mechanism.

[0037] In step S8, a first encapsulation is performed. The third wire and the inspected SMD LED are transferred to a first encapsulation work position by the wire transfer mechanism, and the SMD LED 144 and a portion of the third wire 143 corresponding to the SMD LED 144 are encapsulated in an encapsulation colloid to form a light-emitting sphere.

[0038] In step S9, wire cutting occurs. The lamp is transferred to a wire cutting work position by the wire transfer mechanism, and the wire cutting mechanism determines whether to cut a wire: if YES, the first wire 141 or the second wire 142 between two adjacent SMD LEDs 144 is cut; if NO, the first wire 141 or the second wire 142 between two adjacent lamp beads is not cut.

[0039] In step S10, a second encapsulation is performed. The flare is transferred to a second encapsulation work position by the wire transfer mechanism. When the first wire or the second wire between two adjacent flares is cut, the encapsulation colloid 145 and wire ends formed when the first wire 141 or the second wire is cut are encapsulated within the encapsulation colloid.

[0040] The LED string manufacturing process is capable of producing strings with LEDs connected in parallel, series, or mixed configurations. The LED strings can be switched between high and low voltage, broadening the power supply requirements and expanding the range of applications for strings.

[0041] In a further embodiment of the invention, a system for producing the LED light chain is to be provided. As in Fig. 7 and Fig. 8, the LED light string manufacturing apparatus includes a first and second wire wiring mechanism 20, a wire stripping mechanism 30, a solder dropping mechanism 50, an LED placing mechanism 60, a soldering mechanism 70, a verification mechanism 80, a third wire wiring mechanism 120, a first encapsulating mechanism 90, a wire cutting mechanism 100, a second encapsulating mechanism 110, and a wire transferring mechanism 40, which are linearly arranged in a conveyor line to form a fully automated LED production line.In one embodiment, the LED light string manufacturing system includes a support frame 10 configured to support the first and second wire wiring mechanism 20, the wire stripping mechanism 30, the solder dropping mechanism 50, the LED placement mechanism 60, the soldering mechanism 70, the inspection mechanism 80, the third wire wiring mechanism 120, the first encapsulation mechanism 90, the wire cutting mechanism 100, the second encapsulation mechanism 110, and the wire transfer mechanism 40.

[0042] In this embodiment, the system for manufacturing the LED light chain preferably comprises two automatic LED production lines arranged parallel to each other. This allows two LED light chains to be manufactured simultaneously, significantly increasing productivity.

[0043] The first and second wire wiring mechanism 20 is configured to wire the first wire 141 and the second wire 142. The first and second wire wiring mechanism 20 includes a winding support (not shown) configured to place a winding, and a tension controller configured to apply a counter-pulling force to the first wire 141 and the second wire 142 in the wire feed direction to bring the wires into a taut state in cooperation with a wire compression device.

[0044] The wire stripping mechanism 30 is configured to remove a portion of the insulating layer on the surface of the first wire 141 and a portion of the insulating layer on the surface of the second wire 142 to form a first solder joint and a second solder joint. In this embodiment, the wire stripping mechanism 30 includes the wire pressing component and a wire stripping blade component. The wire pressing component is configured to position and press the first wire 141 and the second wire 142 to provide a positioning base during wire stripping. In this embodiment, the wire pressing component includes a front wire pressing mechanism and a rear wire pressing mechanism, which are arranged at a certain distance from each other along a moving direction of the first wire 141 and the second wire 142.In one embodiment, each of the front wire pressing mechanism and the rear wire pressing mechanism includes a support piece, a pressing piece located above the support piece, and a cylinder configured to drive an up-and-down movement of the pressing piece relative to the support piece. Between the front wire pressing mechanism and the rear wire pressing mechanism is the wire stripping blade component configured to remove the insulating layer on the surface of the soldering position of the first wire 141 and the insulating layer on the surface of the soldering position of the second wire 142 to form the first solder joint and the second solder joint. Since the wire stripping blade component is related to the prior art, it will not be specifically described here.

[0045] The solder dripping mechanism 50 is configured to coat the first solder joint and the second solder joint with the solder. In this embodiment, the solder dripping mechanism 50 includes a visual positioning component, a wire positioning component, and a tin dripping component. The visual positioning component and the wire positioning component are configured to precisely position the first solder joint of the first wire 141 and the second solder joint of the second wire 142, and the tin dripping component is configured to coat the first solder joint of the first wire 141 and the second solder joint of the second wire 142 with the solder. In one embodiment, the tin dripping component includes a tin dripping syringe located above the first wire 141 and the second wire 142, and a tin dripping air supply device that supplies air to the tin dripping syringe.

[0046] The LED placement mechanism 60 is configured to place two solder joints of the SMD LED 144, respectively, onto the first and second solder-coated solder joints. In one embodiment, the LED placement mechanism 60 includes an SMD LED supply device, an SMD LED adsorbing / releasing device, and an SMD LED transport device. The SMD LED supply device is configured to precisely supply the SMD LED 144 to an SMD LED loading position. In this embodiment, the SMD LED supply device includes a flare feeder and a feeder positioning device. The SMD LED adsorbing / releasing device is configured to adsorb the SMD LED 144 at the SMD LED loading position and to discharge it at the LED unloading position.In this embodiment, the SMD LED adsorption / release device comprises an adsorption rod configured to adsorb the SMD LED 144 and a vacuum generation device connected to the adsorption rod. The SMD LED transport device is configured to drive the reciprocating movement of the SMD LED adsorption / release device between the SMD LED loading position 144 and the SMD LED unloading position 144. In this embodiment, the SMD LED transport device comprises a uniaxial manipulator.

[0047] The soldering mechanism 70 is designed to solder the two solder joints of the SMD LED 144 at the first soldering point of the first wire 141 and at the second soldering point of the second wire 142, respectively. As shown in Fig. As shown in Figure 9, the soldering mechanism 70 in this embodiment includes an air supply system (not shown), a hot air component, a cold air component, and a soldering control system 74. The air supply system is configured to provide an air source. In this embodiment, the air supply system is a gas cylinder. The hot air component is configured to heat the gas output from the air supply system and blow the heated gas into the SMD LED 144 located at the first soldering point of the first wire 141 and the second soldering point of the second wire 142. In this embodiment, the hot air component includes a hot air blowing tube 71, a heating device (not shown), and a temperature controller 73. An inlet of the hot air blowing tube 71 is fluidly connected to an outlet of the air supply system via a hot air control valve 72 and a hot air supply tube 78.An outlet of the hot air blower tube 71 is directed toward the SMD LED 144 located at the first and second soldering points of the wires 120. The heating device is arranged in the hot air blower tube 71. The temperature controller 73 is connected to the heating device and is configured to precisely control the temperature of the heating device. In one embodiment, the hot air component also includes a hot air barometer 75 configured to detect an internal pressure value of the hot air blower tube 71. The cold air component is configured to blow the gas discharged from the air supply system into the SMD LED 144 located at the first and second soldering points of the wires 120. In this embodiment, the cold air component comprises a cold air blower pipe 76, the inlet of which is fluidly connected to the outlet of the air supply system via a cold air control valve 77 and a cold air supply pipe 79.An outlet of the cold air blower tube 76 is directed toward the SMD LED 144 located at the first and second soldering points of the wires 120. Preferably, the cold air component also includes a cold air barometer 710 configured to detect an internal pressure value within the cold air blower tube 76. A soldering control system 74 is connected to the temperature controller 73, the hot air control valve 72, the hot air barometer 75, the cold air control valve 77, and the cold air barometer 710. It is possible to realize the heat energy required for precise soldering control by controlling the temperature of the hot air with the temperature controller 73 and the exhaust volume of the hot air with the hot air barometer 75 and the hot air control valve 72.It is possible to realize the cooling energy required for precise soldering control by controlling the cold air exhaust volume through the cold air control valve 77 and the cold air barometer 710. In this embodiment, the LED soldering mechanism 70 has advantages such as precisely adjustable temperatures, energy saving and environmental protection, fast soldering speed, and a smaller mechanism size.

[0048] The inspection mechanism 80 is designed to verify the soldering quality of the SMD LED 144. The inspection mechanism 80 includes a power-on device and a light-detecting device. The power-on device is designed to provide a voltage between the first wire 141 and the second wire 142. The light-detecting device determines whether the product is qualified or not by light detection or visual inspection, and outputs an indication accordingly.

[0049] The third wire wiring mechanism 120 is configured to wire the third wire 143 in parallel with the first wire 141 and the second wire 142. As shown in Fig. As shown in Fig. 9, the third wire wiring mechanism 120 includes a third wire positioning member, a third wire guiding member, a height adjustment mechanism, and a first mounting plate 121, a support 123, and a mounting frame 1212 fixed to the support frame 10. The mounting frame 1212 is provided with a vertically arranged second mounting plate 122. The third wire positioning member is configured to position the third wire 143. In this embodiment, the third wire positioning member includes a first magnet hole 124 and a second magnet hole 125. The first magnet hole 124 and the second magnet hole 125 are respectively provided on the first mounting plate 121 and the second mounting plate 122. The third wire guiding member is configured to guide the third wire 143.In this embodiment, the third wire guide member includes a first guide roller 126, a second guide roller 127, a third guide roller 128, a fourth guide roller 129, a fifth guide roller 1210, and a sixth guide roller 1213. The first guide roller 126 and the second guide roller 127 are mounted on the first mounting plate 121. The third guide roller 128 and the fourth guide roller 129 are mounted on the support 123. The fifth guide roller 1210 and the sixth guide roller 1213 are mounted on the second mounting plate 122. The height adjustment mechanism is configured to adjust the height of the third wire 123. The height adjustment mechanism includes a wire merging device 1211 and an adjusting nut.A wire passage groove for the passage of the third wire 143 is formed at an upper end of the wire merging device 1211, and a lower end of the wire merging device 1211 is threadably connected to the adjusting nut through the mounting frame 1212. The height of the wire merging device 1211 is adjusted by the adjusting nut to adjust the height of the third wire 143. The third wire 143 passes through the first magnet hole 124, around the first guide roller 126 and the second guide roller 127 and then upwards, continues around the third guide roller 128 and the fourth guide roller 128 and then downwards, and then passes through the second magnet hole 125, around the fifth guide roller 1210 and the sixth guide roller 1213, and is thus wired in parallel to the first wire 141 and the second wire 142 via the wire merging device 1211.

[0050] The first encapsulation mechanism 90 is configured to encapsulate the SMD LED 144 and the portion of the third wire 143 corresponding to the SMD LED 144 in the encapsulation colloid 145. In this embodiment, the first encapsulation mechanism 90 includes a first colloid dropping mechanism 901 and a first solidification mechanism 902. The first colloid dropping mechanism 901 is configured to coat the surface of the SMD LED 144 and the surface of the portion of the third wire 143 corresponding to the SMD LED 144 with the encapsulation colloid. The first solidification mechanism 902 is configured to harden the surface of the SMD LED 144 and the surface of the portion corresponding to the SMD LED 144.

[0051] In this embodiment, the colloid solution quickly solidifies by the first solidification mechanism 902 based on the UV drying colloid principle. Preferably, the first solidification mechanism 902 includes a pre-solidification component and a post-solidification component arranged sequentially along the wire feed direction. The pre-solidification component includes a pre-solidification ultraviolet lamp and a blow-drying device arranged one above the other. The pre-solidification ultraviolet lamp is designed to illuminate the liquid colloid coated on the SMD LED 144. The blow-drying device discharges air to blow, dry, and pre-cure the liquid colloid, thus ensuring the solder strength of the wires for the light spheres and the insulation of the light spheres and the wires from the outside.The post-solidification device is designed to further harden the solidified and dried encapsulation colloid to ensure the solder strength between the SMD LEDs 144 and the wires. The post-solidification device includes a solidification ultraviolet lamp.

[0052] The wire cutting mechanism 100 is configured to determine whether to cut a wire. If YES, the first wire 141 or the second wire 142 between two adjacent SMD LEDs 144 is cut, and if NO, the first wire 141 or the second wire 142 between two adjacent light beads is not cut. As shown in Fig.10, the wire cutting mechanism 100 includes an upper punch blade assembly 101, an upper punch blade assembly driving device 102 configured to drive an up and down movement of the upper punch blade assembly 101, a lower punch blade assembly 103, and a lower punch blade assembly driving device 104 configured to drive an up and down movement of the lower punch blade assembly 103.

[0053] The second encapsulation mechanism 110 is configured to encapsulate the flare and wire ends formed when the first wire or the second wire is cut between two adjacent flares within the encapsulation colloid when the first wire or the second wire is cut. In this embodiment, the second encapsulation mechanism 110 includes a second colloid dropping mechanism 111 and a second solidification mechanism 112. The second solidification mechanism 111 is configured to coat the surface of the encapsulation colloid 145 with the encapsulation colloid. The structure of the second colloid dropping mechanism 111 is the same as that of the first colloid dropping mechanism 901, which will not be described specifically here. The second solidification mechanism 112 is configured to harden the colloid solution on the surface of the encapsulation colloid 145.The structure of the second solidification mechanism 112 is the same as that of the first solidification mechanism 902, which will not be described in detail here.

[0054] The wire transmission mechanism 40 is designed to provide a driving force for feeding the wires. In this embodiment, the wire transmission mechanism 40 includes a plurality of linear uniaxial manipulators and a plurality of pneumatic devices. The plurality of linear uniaxial manipulators are spaced apart along the wire feed direction to provide a driving force for pulling the wire in a straight line, and a mounting platform for the pneumatic devices. The plurality of pneumatic devices responsible for positioning and pressure are each attached to the plurality of linear uniaxial manipulators.

[0055] In one embodiment, the system for manufacturing the LED light string also includes a finishing mechanism 130 configured to subsequently process the processed SMD LEDs 144. In this embodiment, the finishing mechanism 130 includes a wire gathering device including a wire gathering reel 131 and a wire gathering motor 132 for driving the rotation of the wire gathering reel 131. The processed LED light string is wound around the wire gathering reel 131 to form a coil. In addition to the wire gathering device, the finishing mechanism 130 also includes a wire twisting device, a wire cutting device, and others. The wire twisting device can be used to produce a twisted LED light string. The wire cutting device can be used to produce an LED light string of any desired length.

[0056] The LED string light manufacturing system can produce string lights with LEDs connected in series, parallel, or mixed configurations, reducing labor costs and labor intensity, effectively increasing productivity, and improving the quality of the string lights. Furthermore, the manufactured string lights can be operated at high or low voltage, broadening the power supply requirements and expanding the application areas of the string lights.

[0057] The above embodiments merely illustrate some of the embodiments of the present invention, and their description is relatively specific and detailed, but should not be construed as limitations on the scope of the invention. It should be understood, however, that various variations or modifications may be made by one skilled in the art, provided they do not depart from the spirit and scope of the invention. List of reference symbols 10 support frames; 20 Wiring mechanism for the first wire and the second wire; 30 Wire stripping mechanism; 40 wire transmission mechanism; 50 solder drip mechanism; 60 LED placement mechanism; 70 soldering mechanism; 71 hot air blowpipe; 72 hot air control valve; 73 temperature controllers; 74 Soldering control system; 75 hot air barometers; 76 cold air blowpipe; 77 cold air control valve; 78 Hot air supply pipe; 79 Cold air supply pipe; 710 cold air barometer; 80 review mechanism; 90 first encapsulation mechanism; 901 first colloid dropping mechanism; 902 first solidification mechanism; 100 wire cutting mechanism; 101 upper punching knife component; 102 Drive device for upper punching knife components; 103 punching knife component; 104 Drive device for punching knife components; 110 second encapsulation mechanism; 111 second colloid dropping mechanism; 112 second solidification mechanism; 120 Wiring mechanism for the third wire; 121 first mounting plate; 122 second mounting plate; 123 support; 124 first magnet hole; 125 second magnet hole; 126 first leadership role; 127 second leadership role; 128 third leadership role; 129 fourth leadership role; 1210 fifth leadership role; 1211 Wire combining device; 1212 mounting frame; 1213 sixth leadership role; 130 Final treatment mechanism; 131 Wire collection roll; 132 Wire collection motor; 140 LED light chain; 141 first wire; 142 second wire; 143 third wire; 144 SMD LEDs; 145 encapsulation colloid; 146 connecting wire.

Claims

[1] LED light chain (140), characterized by that the LED light chain (140) includes: a first wire (141), a second wire (142), and a third wire (143), wherein the first wire (141), the second wire (142), and the third wire (143) are arranged parallel to one another, the first wire (141), the second wire (142), and the third wire (143) each comprise a wire core and an insulating layer surrounding a surface of the wire core, wherein, along an axial direction of the first wire (141), a part of the insulating layer is spaced apart from the first wire (141) at predetermined length intervals to form a plurality of first soldering points, along an axial direction of the second wire (142), a part of the insulating layer is spaced apart from the second wire (142) at predetermined length intervals to form a plurality of second soldering points, and positions of the plurality of second soldering points respectively correspond to positions of the plurality of first soldering points to form a plurality of luminous soldering areas; a plurality of SMD LEDs (144), wherein the plurality of SMD LEDs (144) are each arranged at the plurality of luminous soldering areas and two solder joints of the SMD LED (144) are each soldered at the first soldering point and at the second soldering point in the corresponding luminous soldering area, and the plurality of SMD LEDs (144) are mixed-connected; and a plurality of encapsulation colloids (145), wherein the plurality of encapsulation colloids (145) each envelop surfaces of the plurality of SMD LEDs (144) and parts of the third wire (143) corresponding to positions of the plurality of SMD LEDs (144) to form a plurality of luminous balls, wherein at least every two adjacent SMD LEDs (144) form a light-emitting unit, positions of a positive electrode and a negative electrode of the two adjacent SMD LEDs (144) are designed similarly in each light-emitting unit, positions of a positive electrode and a negative electrode in two adjacent light-emitting units are formed in an opposite manner, and the first wire (141) and the second wire (142) are alternately cut between every two adjacent light-emitting units such that the plurality of SMD LEDs (144) are mixedly connected, and wire ends formed at the cut-off of the first wire (141) and the second wire (142) are encapsulated within the encapsulation colloids (145). [2] The LED light string (140) according to claim 1, wherein the first wire (141), the second wire (142) and the third wire (143) are each an enamel wire or a rubber wire. [3] A method for producing an LED light chain (140) according to claim 1 or 2, characterized by that the procedure includes the following steps: - wiring a first wire (141) and a second wire (142) in parallel to each other by a wiring mechanism (20) for the first and second wires (141, 142); - transferring the first wire (141) and the second wire (142) to a wire stripping work position by a wire transfer mechanism (40), and removing a part of an insulating layer of the first wire (141) and a part of an insulating layer of the second wire (142) at predetermined distances by a wire stripping mechanism (30) to form first soldering points and second soldering points, wherein positions of the first soldering points correspond to positions of the second soldering points, respectively; - transferring the first soldering point and the second soldering point to a solder dropping working position by the wire transfer mechanism (40), and coating a surface of the first soldering point and a surface of the second soldering point with a solder by a solder dropping mechanism (50); - transferring the first soldering point and the second soldering point, the surfaces of which are coated with the solder, to an LED mounting work position by the wire transfer mechanism (40), and placing two solder joints of an SMD LED (144) at the first soldering point and the second soldering point, respectively, by an LED placing mechanism (60); - transferring the SMD LED (144) placed at the first and second soldering points to a soldering work position by the wire transfer mechanism (40), and soldering the two solder joints of the SMD LED (144) at the first soldering point and the second soldering point, respectively, by a soldering mechanism (70); - transferring the soldered SMD LED (144) to a soldering inspection work position by the wire transfer mechanism (40), and inspecting a soldering quality for the SMD LED (144) by an inspection mechanism (80); - wiring a third wire (143) in parallel to the first wire (141) and the second wire (142) by a wiring mechanism (120) for the third wire (143); - transferring the inspected SMD LED (144) and the third wire (143) to a first encapsulation working position by the wire transfer mechanism (40), and encapsulating the SMD LED and a part of the third wire (143) corresponding to a position of the SMD LED (144) within an encapsulation colloid by a first encapsulation mechanism (90) to form a luminous ball; - transferring the flare to a wire cutting working position by the wire transfer mechanism (40), and determining by the wire cutting mechanism (100) whether to cut the wire, if YES, cutting the first wire (141) or the second wire (142) between two adjacent flares, and if NO, not cutting the first wire (141) or the second wire (142) between the two adjacent flares; and - Transferring the flare to a second encapsulation working position by the wire transfer mechanism (40), and when the first wire (141) or the second wire (142) is cut off between two adjacent flares, encapsulating the flare and wire ends formed when the first wire (141) or the second wire (142) is cut off within the encapsulation colloid by a second encapsulation mechanism (110). [4] Plant for producing an LED light chain (140) according to claim 1 or 2, characterized by that the system includes the following mechanisms: a wiring mechanism (20) for a first and second wire (141, 142) which is designed to wire the first wire (141) and the second wire (142) in parallel with each other; a wire stripping mechanism (30) configured to remove a part of an insulating layer on a surface of the first wire (141) and a part of an insulating layer on a surface of the second wire (142) to form a first solder joint and a second solder joint; a solder dropping mechanism (50) configured to coat a surface of the first solder joint and a surface of the second solder joint with a solder; an LED placement mechanism (60) configured to place two solder joints of an SMD LED (144) at each of the first solder joint and the second solder joint; a soldering mechanism (70) configured to solder the two solder joints of the SMD LED (144) at the first soldering point and at the second soldering point, respectively; a verification mechanism (80) configured to verify a soldering quality for the SMD LED (144); a wiring mechanism (120) for a third wire (143) configured to wire the third wire (143) in parallel with the first wire (141) and the second wire (142); a first encapsulation mechanism (90) configured to encapsulate the SMD LED (144) and a portion of the third wire (143) corresponding to a position of the SMD LED (144) within an encapsulation colloid to form a luminous sphere; a wire cutting mechanism (100) configured to determine whether to cut the wire, if YES, cut the first wire (141) or the second wire (142) between two adjacent flares, and if NO, do not cut the first wire (141) or the second wire (142) between two adjacent flares; a second encapsulation mechanism (110) configured, when the first wire (141) or the second wire (142) is cut between two adjacent flares, to encapsulate the flare and wire ends formed upon cutting of the first wire (141) or the second wire (142) within the encapsulation colloid; and a wire transmission mechanism (40) configured to transmit the first wire (141), the second wire (142) and the third wire (143). [5] The plant for manufacturing the LED light string (140) according to claim 4, wherein the first encapsulation mechanism (90) comprises a first colloid dropping mechanism (901) configured to coat surfaces of the SMD LED (144) and a part of the third wire (143) corresponding to the position of the SMD LED (144) with a colloid solution, and a first solidification mechanism (902) configured to solidify the colloid solution. [6] The plant for manufacturing the LED light string (140) according to claim 5, wherein the first solidification mechanism (902) comprises a pre-solidification member and a post-solidification member, wherein the pre-solidification member comprises a blow-drying device configured to blow and dry the colloid solution and a pre-solidification ultraviolet lamp configured to pre-solidify the colloid solution, and the post-solidification member comprises a solidification ultraviolet lamp configured to harden the dried and pre-solidified colloid solution. [7] The LED light string manufacturing plant (140) according to claim 4, wherein the wire cutting mechanism (100) comprises four wire cutting devices arranged sequentially along a wire feeding direction, two of the wire cutting devices being configured to cut the first wire (141) between two SMD LEDs (144), and the other two of the wire cutting devices being configured to cut the second wire (142) between two SMD LEDs (144).

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