Performance module

By integrating gate drivers and communication circuits within the power module and using wireless or powerline communication, the complexity of signal pin alignment is eliminated, simplifying signaling and improving thermal and electromagnetic compatibility.

DE102025101188B3Active Publication Date: 2026-05-28VOLKSWAGEN AG
View PDF 4 Cites 0 Cited by

Patent Information

Application Number
DE102025101188
Authority / Receiving Office
DE · DE
Patent Type
Patents
Current Assignee / Owner
Filing Date
2025-01-14
Publication Date
2026-05-28
Estimated Expiration
2045-01-14

AI Technical Summary

Technical Problem

Existing power modules require complex alignment and precise positioning of signal pins for communication with external circuit boards, complicating the signaling process.

Method used

Integrate gate drivers and communication circuits within the potting compound of the power module, enabling wireless or powerline communication with the external circuit board, eliminating the need for signal pins by modulating communication signals onto load terminals.

Benefits of technology

Simplifies signaling by eliminating the need for precise alignment of signal pins, reducing complexity and improving thermal connection of gate drivers while enhancing electromagnetic compatibility.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure 00000000_0000_ABST
    Figure 00000000_0000_ABST
Patent Text Reader

Abstract

The invention relates to a power module (1) comprising a carrier (2), at least one power semiconductor (6) and at least two power terminals (7), wherein the carrier (2) has at least one insulating layer (3) and at least one structured metallization (4), wherein the power module (1) is encapsulated with a potting compound (16), wherein at least one gate driver (8) for the at least one power semiconductor (6) and at least one communication circuit (9) are arranged at least partially in the potting compound (16).
Need to check novelty before this filing date? Find Prior Art

Citation Information

Patent Citations

  • Multi-environmental circuit devices

    US11670967B1

  • High power density switch module with improved thermal management and packaging

    US20080277687A1

  • Power semiconductor module, power electronic assembly including one or more power semiconductor modules, and power conversion control circuit for a power semiconductor module

    US20230155479A1

  • US000011670967B1