Semiconductor storage device and circuit board unit
The semiconductor storage device addresses connectivity and inspection challenges by using a split circuit board structure with optimized materials and connections, ensuring reliable and cost-effective signal transmission through visual and electrical testing.
DE102025131384A1Pending Publication Date: 2026-06-18KIOXIA CORP
Patent Information
- Application Number
- DE102025131384
- Authority / Receiving Office
- DE · DE
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-12-18
- Filing Date
- 2025-08-07
- Publication Date
- 2026-06-18
AI Technical Summary
Technical Problem
Existing semiconductor storage devices face challenges in efficiently connecting and testing the electrical integrity of multiple circuit boards while maintaining cost-effectiveness and signal transmission efficiency.
Method used
The semiconductor storage device employs a split circuit board structure with different materials for high-speed and non-high-speed signal transmission, utilizing a solder joint connection between conductive sections of the boards, and includes a visual and electrical inspection method for ensuring proper connectivity.
Benefits of technology
This approach enhances the reliability and efficiency of signal transmission while reducing costs by optimizing the circuit board design and providing effective inspection methods.
✦ Generated by Eureka AI based on patent content.
Smart Images
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Abstract
A semiconductor storage device according to one embodiment comprises a first circuit board and a second circuit board. The first circuit board includes a first section, a second section that is thinner than the first section, and a plurality of first conductive sections on the second section. The second circuit board includes a plurality of second conductive sections. The plurality of second conductive sections overlaps the plurality of first conductive sections when viewed from a first direction, which is a thickness direction of the first circuit board. The plurality of second conductive sections are connected to the plurality of first conductive sections by solder in a one-to-one correspondence.
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Citation Information
Patent Citations
JP2024221349A
JP2024-221349