Machining device and method for machining a workpiece using a laser beam

Abstract

The invention relates to a machining device (10) and a method for machining a workpiece (20), in particular a workpiece equipped with cutting edges, by means of a high-energy machining beam (30) comprising: a machining device (40), a holder (50) and a base (60), wherein the holder (50) is arranged on the base (60) and the machining device (40) is mounted on the holder (50) so as to be pivotable and / or rotatable about a pivot axis (70);the processing device (40) comprising: a processing beam source (80) for generating and / or coupling the processing beam (30) into the processing device (10), a deflection device (90) by means of which the processing beam (30) can be deflected at different angles, and a beam path (100) of the processing beam (30) which runs between the processing beam source (80) and the deflection device (90), wherein the entire beam path (100) between the processing beam source (80) and the deflection device (90) is designed such that it moves with the processing device (10) when the processing device (10) is pivoted and / or rotated, and the distance and orientation of the entire beam path (100) between the processing beam source (80) and the deflection device (90) with respect to the pivot axis (70) remains constant.

Description

[0001] The invention relates to a machining device and a method for machining a workpiece using a high-energy machining beam, in particular for machining a workpiece equipped with cutting edges using a laser beam.

[0002] Such devices are known from the prior art and are used, for example, to create and / or—in the case of wear—to restore clearance and / or rake faces on workpieces. Primarily, such devices serve to manufacture cutting edges on cutting tools. A challenge in such workpiece machining lies in enabling a suitable relative movement between the workpiece and the high-energy machining jet, ensuring precise machining of the workpiece.

[0003] However, the kinematics and functional principles underlying known laser processing devices with regard to the relative displacement of the workpiece and the processing beam to each other are highly complex, which makes controlling the device components difficult and can impair processing precision.

[0004] A first way to reduce the complexity of these devices is shown in document WO 2019 / 166425 A1. This document discloses a device with a machining unit for machining a workpiece equipped with cutting edges using a high-energy machining beam and a workpiece carrier. The kinematics of the device are designed such that the workpiece carrier and the machining unit are rotatable relative to each other about an axis of rotation that runs transversely to an optical axis of the high-energy machining beam. For this purpose, the workpiece carrier is designed to rotate about the axis of rotation. The machining unit, on the other hand, is neither displaceable nor rotatable and therefore has a fixed beam guide.

[0005] Known devices of the type mentioned above do not have movable machining elements. One reason for this is that movement of suitable known machining elements would cause a change in the position of the current machining position, in particular a focal point, of the machining beam with respect to the axis of rotation between the machining element and the workpiece carrier. Furthermore, movement of the known machining elements would cause the path of the machining beam, which passes over mirrors of the machining element, to shift relative to the mirrors.

[0006] Therefore, in known devices of the type mentioned above, the use of fixed machining units with a fixed beam path is unavoidable. However, this only allows for relatively low relative speeds for movements between the machining unit and the workpiece carrier. This negatively impacts the machining efficiency achievable with known devices. Furthermore, the workpiece carriers must be complexly designed to allow for this movement. Another disadvantage of the prior art is that the workpiece carrier must rotate precisely around the axis of rotation to prevent the focal point of the machining beam from shifting relative to this axis. This significantly increases the manufacturing effort and setup times of the devices.

[0007] Taking into account the prior art described above, the inventors have recognized that a different design and correspondingly different kinematics are required to increase processing efficiency.

[0008] It is an object of the present invention to provide a machining device and a method of the type mentioned at the outset for the precise machining of workpieces, which overcomes the disadvantages mentioned in the description of the prior art. In particular, a machining device is to be provided that can be manufactured more cost-effectively and / or has an increased service life and / or delivers improved machining quality and / or requires a short machining time.

[0009] This problem is solved in particular by a processing device according to claim 1 and a method according to claim 22. Advantageous embodiments and further developments of the invention can be found in the dependent claims and the description.

[0010] The invention relates to a machining device for machining a workpiece, in particular a workpiece equipped with cutting edges, by means of a high-energy machining beam. The machining device comprises a machining unit, a holder, and a base. The holder is arranged on the base, and the machining unit is pivotably and / or rotatably mounted on the holder about a pivot axis. The machining unit comprises a machining beam source for generating and / or coupling the machining beam into the machining unit. The machining unit also comprises a deflection device by means of which the machining beam can be deflected at different angles. Furthermore, the machining device comprises a beam path for the machining beam that runs between the machining beam source and the deflection device.

[0011] The beam path of the processing device according to the invention is designed such that it moves with the processing device when the processing device is pivoted and / or rotated, in particular pivoting and / or rotating with it, while the distance and orientation of the beam path with respect to the pivot axis remain constant. In other words, the entire beam path between the processing beam source and the deflection device is designed such that it moves with the processing device when the processing device is pivoted and / or rotated, in particular pivoting and / or rotating with it, while the distance and orientation of the entire beam path between the processing beam source and the deflection device with respect to the pivot axis remain constant.

[0012] In particular, the entire beam path between the processing beam source and the deflection device can be designed in such a way that the position of the beam path of the processing device relative to the pivot axis does not change or remains constant when the processing device is pivoted and / or rotated about the pivot axis.

[0013] Starting from the prior art devices of the type described above, the inventors have recognized how the movable design of the device can be combined with all the advantages of a fixed beam path.

[0014] In the processing device according to the invention, the entire beam path is fixed with respect to the pivot axis. A movement of the processing device along the pivot axis therefore does not cause any change in the position of the processing beam relative to the pivot axis. Thus, the processing device, due to its design according to the invention, possesses all the advantages of a processing device with a fixed beam path, and it is ensured that the position of a processing point, in particular a focal point, of the processing beam remains constant during the rotation of the pivot axis.

[0015] In certain embodiments of such a device according to the invention, this eliminates the need for additional movable deflecting mirrors to redirect the high-energy processing beam. This can result in cost savings compared to conventional processing devices of the prior art.

[0016] Furthermore, in certain embodiments, the device according to the invention can enable, for example, in the case of machining large contour changes on the workpiece, e.g., a radius tool, essentially only a movement of the machining device about the pivot axis is required, while displacement along translational axes can be dispensed with. This allows for a high contour and machining quality to be achieved.

[0017] Furthermore, in certain embodiments of the device according to the invention, other movable beam guidance components can be dispensed with, since in particular readjustment of the focus point of the high-energy processing beam during processing is not necessary.

[0018] The machining device can be a device for creating and / or restoring clearance and / or chip surfaces on workpieces. In particular, the machining device can be a device for producing cutting edges on cutting tools.

[0019] The machining device can be at least partially integrated into the holder. In particular, the machining device can be at least partially integrated into the holder and / or surrounded by the holder in relation to its pivotable, and especially rotatable, mounting on the holder. Alternatively and / or additionally, it is possible for the machining device to be guided around the holder. In particular, in addition to its pivotable, and especially rotatable, mounting about the pivot axis, the machining device can at least partially surround the base.

[0020] The base can be, in particular, a surface on which the processing device is placed. Alternatively, the base can be positioned on the surface and supported against it. Furthermore, at least the support can be arranged adjacent to a surface of the upper side of the base and on the base in such a way that the support is spaced apart from the surface by the base.

[0021] The pivot axis can be the axis about which the machining device can be rotated and / or swiveled. In particular, the pivot axis can extend perpendicular to a top surface of the base. The pivot axis can also run parallel to a top surface of the base.

[0022] The processing beam source can be permanently connected to the processing device. This ensures that the processing beam source moves with the processing device when it is pivoted and / or rotated, specifically pivoting and / or rotating with it. Furthermore, the processing beam source can include a processing beam generator, in particular a moving, pivoting and / or rotating, laser beam source for generating the processing laser beam. The processing beam generator can be integrated into the processing device. Specifically, the processing beam generator can be housed within a casing of the processing device. Alternatively, the processing beam generator can also be attached to the casing of the processing device.As another alternative, the processing beam source can be coupled into the beam path by means of a fiber, in particular an optical fiber. For this purpose, the processing beam generator can be attached to the mount and / or to an additional element of the processing device.

[0023] The deflection device may include a collimation lens movable transversely to the optical axis of the high-energy processing beam, a scanner, a two-axis scanner system, in particular a galvanometer scanner pivotable about two pivot axes, a polygon mirror, a rotating optic and / or similar.

[0024] In one embodiment of the invention, the high-energy processing beam can, for example, be a laser beam. This beam is directed precisely onto the workpiece within a processing area to perform processing operations, such as laser beam welding or material removal using a laser beam. A process zone forms in the area where the high-energy processing beam strikes the workpiece, and in this zone, material from the workpiece is melted and / or removed.

[0025] For example, the current machining position of the machining beam during machining can be on or in close proximity to the swivel axis. The current machining position can be a focal point of the machining beam. The focal point of the machining beam can be located specifically on the swivel axis. For example, the focal point of the machining beam can remain on and / or close to the swivel axis throughout the entire machining process.

[0026] In particular, the center of a machining figure of the machining beam, especially the focal point of the machining beam, can lie on the pivot axis during machining. For example, the center of the machining figure of the machining beam, especially the focal point of the machining beam, can lie on the pivot axis throughout the entire machining process. The machining figure can be a circular path and / or a combination of circular paths and / or a spiral and / or a Lissajous figure.

[0027] In particular, the center of the machining shape of the machining beam can be less than 0.1 mm, less than 1 mm, or less than 10 mm away from the pivot axis during machining. Preferably, the center of the machining shape of the machining beam can be less than 1 mm away from the pivot axis during machining. Furthermore, the focal point of the machining beam can move along the center of the machining shape.

[0028] Because the current machining position lies on the swivel axis, the machining position remains unchanged when the machining unit is swiveled and / or rotated around the swivel axis. Furthermore, because the machining unit is located on or in close proximity to the swivel axis, readjusting the focus point of the high-energy machining beam during machining is unnecessary. This eliminates the need for movable beam guidance components.

[0029] For the precise machining of workpieces, in particular for the production of cutting edges on workpieces, in one embodiment of the invention the pivot axis can run at an angle, in particular essentially perpendicular to an optical axis of the machining beam.

[0030] In this context, it may be provided that the machining device is pivotable and / or rotatable about the pivot axis within an angle between -45° and +225°. This angle may be defined, in particular, by the optical axis of the machining beam. The angle between the pivot axis and the machining device may, in particular, be the angle between the optical axis of the machining beam and a Y-axis of a rectangular XYZ coordinate system. The Z-axis of the XYZ coordinate system may, in particular, be collinear with the pivot axis. Furthermore, the Z-axis of the XYZ coordinate system may, in particular, be positively defined in a direction in which the height of the machining device decreases.The Y-axis of the rectangular XYZ coordinate system can point towards the workpiece, starting from the machining device, in particular from an exit opening of the machining beam from the machining device. The angle can be defined as positive, especially in the positive direction of rotation about the Z-axis.

[0031] The angle can be set relative to the workpiece surface being machined and can be changed by rotating the machining device around the pivot axis during and / or before machining. This allows the machining beam, particularly its central axis, to strike the workpiece at an angle between -45° and +225°, preferably at 0°, 90°, or 180°. In the 0° angle orientation, the machining beam, particularly its central axis, can strike the front of the workpiece. In the 90° angle orientation, the machining beam, particularly its central axis, can run parallel to the front of the workpiece. In the 180° angle orientation, the machining beam can strike the back of the workpiece. The back of the workpiece can be positioned opposite the front of the workpiece.

[0032] In one embodiment of the invention, the processing beam can enter the deflection device offset from, and in particular parallel to, the center of the pivot axis. Furthermore, the point where the processing beam enters the deflection device can be arranged radially at a distance from the pivot axis. This allows the deflection device to focus the processing beam onto the pivot axis or very close to it. Additionally, this ensures a sufficient distance from the pivot axis to focus the processing beam onto the pivot axis.

[0033] In a further development of the invention, at least one section of the beam path can run parallel, and in particular coaxially, to the pivot axis. This allows the beam path of the processing device to be guided along a vertical direction of the processing device without the alignment and orientation of the beam path relative to the pivot axis changing when the processing device is pivoted and / or rotated about the pivot axis. Alternatively or additionally, another section can run perpendicular to the pivot axis. This allows the processing beam source to be arranged at a distance from the deflection device and thus from the workpiece. As a result, the fiber and / or a power cable connected to the processing beam source can be guided along the processing device essentially independently of the workpiece.

[0034] According to one embodiment of the invention, the processing beam source can be arranged directly on the deflection device. This allows the processing device to have a compact design with a significantly reduced size. The compact design makes it considerably easier to integrate the processing device into production halls.

[0035] In a further embodiment of the invention, the processing beam source can be arranged at a distance along a vertical direction of the processing device or the deflection device. In particular, especially for shifting the beam path of the processing device along a vertical direction, the processing beam can pass over at least one mirror within the beam path. Furthermore, the point of impact of the processing beam on the at least one mirror cannot change or remain constant when the processing device is pivoted. In other words, in this embodiment, the at least one mirror moves with the processing device when the processing device is pivoted and / or rotated about the pivot axis. As a result, the point of impact of the processing beam on the at least one mirror does not change.This prevents the current processing position, particularly the focal point, of the processing beam from shifting. The mirrors can be low-transparency and / or partial-transparency mirrors, especially for beam splitting to perform measurement tasks, as well as beam deflection mirrors. For example, the processing device can comprise two mirrors, preferably three, by which the path of the processing beam is deflected. Alternatively, the processing device can comprise four mirrors, particularly three beam deflection mirrors and one low-transparency mirror. As a further alternative, the processing device can have five mirrors, particularly three beam deflection mirrors and two low-transparency mirrors.

[0036] For example, the length of the beam path along a linear axis can be variable. In particular, the distance between two mirrors can be changed. To change the vertical alignment of the processing position, the linear axis can be located in the section of the beam path that is parallel, and especially coaxial, to the pivot axis. To change the distance to the processing position in a horizontal plane, the linear axis can be located in the section of the beam path that is perpendicular to the pivot axis. This allows for easy adjustment of the vertical alignment of the processing position. Furthermore, it is possible to change the distance to the processing position in the horizontal plane.

[0037] This leads to greater variability during processing, so that, for example, the processing beam can be adjusted before the start of the processing process so that the focal point of the processing beam is on or in the immediate vicinity of the swivel axis.

[0038] In one possible implementation of the invention, the machining device can be mounted on the holder via a first slide arrangement with at least one linear slide. The machining device can be displaced relative to the base along at least one linear axis associated with the linear slide via the first slide arrangement, which runs parallel to the pivot axis. Alternatively, the linear axis can also run along, and in particular coaxially with, the pivot axis. This allows the entire machining device to be moved to change the vertical alignment of the machining position. The arrangement according to the invention ensures that when the machining device is moved relative to the holder via the first slide arrangement, the current machining position of the machining device remains on the pivot axis.

[0039] In order to position the processing beam source at a distance from the deflection device and / or to route the fiber and / or the power cable connected to the processing beam source at least as independently as possible from the workpiece at the processing device, the beam path can, in particular, comprise a first section, a second section, and a third section. The second section can be arranged between the first section and the third section and run at an angle, preferably an acute angle, to the pivot axis. In particular, the second section can run perpendicular to the pivot axis. Alternatively and / or additionally, the first section and / or the third section of the beam path can run parallel to the pivot axis. Furthermore, the first section can run coaxially to the pivot axis.For example, the beam path between the processing beam source and the first section can be angled, in particular perpendicular, to the pivot axis. Alternatively and / or additionally, the beam path between the processing beam source and the first section can be deflected by a first mirror, in particular by 90°, and / or the beam path between the first section and the second section can be deflected by a second mirror, in particular by 90°, and / or the beam path between the second section and the third section can be deflected by a third mirror, in particular by 90°.

[0040] To improve workpiece machining, the deflection device can be configured to deflect the machining beam, shifting its focal point along the swivel axis. Specifically, the deflection device can be configured to deflect the machining beam, shifting its focal point to a distance of less than 0.1 mm, less than 1 mm, and / or less than 10 mm from the swivel axis. This allows the machining beam's current position to be aligned along a vertical direction and / or perpendicular to the swivel axis.

[0041] Alternatively or additionally, the processing device can include a focusing device for focusing the processing beam. The focusing device can be arranged within the deflection device or in the beam path downstream of the deflection device. In particular, the processing beam can enter the focusing device after exiting the deflection device. The focusing device can include a focusing lens, especially an F-theta lens, which is arranged in the beam path of the processing beam and is movable along the optical axis of the processing beam to adjust the position of the focal point of the processing beam. The focusing lens can be in the form of a movable focusing lens and / or include a movable focusing element. This allows the processing beam to be flexibly focused on a desired processing position.

[0042] In this context, the machining device can also be configured to reposition the focusing lens such that the current machining position of the machining beam is on or in the immediate vicinity of the pivot axis during machining. This ensures that the machining position does not change when the machining device is rotated and / or pivoted about the pivot axis.

[0043] Furthermore, a beam expander with collimation can be arranged in the beam path. The beam expander with collimation allows the raw beam diameter and divergence of the processing beam to be set within the beam path. Additionally, a λ / 4 plate for manipulating the polarization direction of the processing beam can be arranged in the beam path. Finally, a rotating optic can be arranged in the beam path, which superimposes the figure generated by the deflection device, in particular by a scanner, with a further movement.

[0044] The machining device can have a workpiece carrier with a receiving device for receiving the workpiece.

[0045] To enable faster processing of the workpiece and to realize more complex geometries of the workpieces, the holding device with the workpiece held therein can be rotatable about the pivot axis and / or rotatable about a first rotation axis of the holding device, which runs transversely, in particular perpendicularly, to the pivot axis and transversely to an optical axis of the high-energy processing beam.

[0046] To ensure precise machining of the workpieces, the machining device can be set up to rotate the holding device around the first axis of rotation and / or to rotate the holding device around the pivot axis in such a way that, during machining, the current machining position of the machining beam is on or in the immediate vicinity of a surface of the workpiece to be machined and on or in the immediate vicinity of the pivot axis.

[0047] To increase the machining speed of the workpiece and to realize more complex workpiece geometries, the workpiece carrier can be arranged on a second slide assembly with at least one linear slide. Furthermore, the workpiece carrier can be displaced relative to the base along at least one linear axis associated with the linear slide via the second slide assembly.

[0048] To further increase the degrees of freedom of movement of the workpiece carrier for fast and precise machining of workpieces, the second slide arrangement can have two linear slides arranged essentially perpendicular to each other for moving the workpiece carrier along essentially perpendicular first and second linear axes. In particular, the first and second linear axes can be arranged in a cross-slide configuration.

[0049] The first linear axis can be arranged such that the workpiece carrier can be displaced along a longitudinal axis of the workpiece carrier. Furthermore, the second linear axis can be arranged such that a transverse axis extending perpendicular to the second linear axis preferably corresponds to the first axis of rotation of the holding device. The machining device can also be configured to additionally displace the workpiece carrier along the first and second linear axes such that the current machining position of the machining beam during machining lies on or in the immediate vicinity of the pivot axis.

[0050] Furthermore, in a further embodiment of the invention, the workpiece carrier and / or the machining device can each be displaced relative to each other along a further axis that extends essentially parallel to the pivot axis and is essentially perpendicular to the first and second linear axes. This further increases the degrees of freedom between the workpiece carrier and the machining device. This measure allows for the realization of even more complex workpiece geometries. If the workpiece carrier and the machining device are each displaceable relative to each other along this further axis, then both the workpiece carrier and the machining device can move relative to each other along this further axis. This enables faster machining of the workpieces. In addition, more complex geometries can be realized.

[0051] In this context, the holding device can be designed to pivot about a second pivot axis relative to the workpiece carrier. In particular, the second pivot axis can be at least substantially perpendicular to the first pivot axis. Furthermore, the second pivot axis can be arranged at least substantially perpendicular to the first axis of rotation.

[0052] Furthermore, the holder can be arranged on a third slide assembly with at least one linear slide. The holder can be displaceable relative to the base via the third slide assembly along at least one linear axis associated with the linear slide. In addition, the linear axis of the third slide assembly can be oriented substantially perpendicular to one of the linear axes and / or the linear axis of the second slide assembly. In other words, the linear axis of the third slide assembly can be arranged in a cross-slide arrangement relative to one of the linear axes and / or the linear axis of the second slide assembly. The arrangement according to the invention ensures that when the holder is displaced relative to the base via the third slide assembly, the current machining position of the machining device remains unchanged on the pivot axis.

[0053] Alternatively and / or additionally, the third slide arrangement can have two linear slides arranged essentially perpendicular to each other for moving the workpiece carrier along essentially perpendicular first and second linear axes. Alternatively and / or additionally, the holder can be designed to pivot and / or rotate about a second axis of rotation relative to the third slide arrangement. Even with these movements, the arrangement according to the invention ensures that, when the holder is moved and / or rotated with respect to the base, the current machining position of the machining device remains unchanged on the pivot axis.

[0054] The invention further relates to a method for laser processing of a workpiece by means of a high-energy processing beam, preferably of a workpiece equipped with cutting edges by means of a laser beam, which is carried out in particular with a processing device according to the invention.

[0055] The processing steps described above with regard to the device according to the invention can be applied analogously within the framework of the method according to the invention, so that the advantages also explained above can also be achieved with the method according to the invention.

[0056] The present invention is described below by way of example with reference to the accompanying figures. The figures, the description, and the claims contain numerous features in combination. A person skilled in the art will expediently consider the features individually and use them meaningfully in combination within the scope of the claims.

[0057] They show: Fig. Figure 1 shows a side view of a first embodiment of the machining device according to the invention; Fig. Figure 2 shows a side view of a second embodiment of the machining device according to the invention; Fig. Figure 3 shows another side view from a different perspective of the second embodiment of the machining device according to the invention, which is in Fig. 2 is shown; Fig. Figure 4 shows a top view of the second embodiment of the machining device according to the invention, which is in Fig. 2 is shown; Fig. Figure 5 shows a side view of a third embodiment of the machining device according to the invention; Fig. Figure 6 shows another side view from a different perspective of the third embodiment of the machining device according to the invention, which is shown in Fig. 5 is shown; Fig. Figure 7 shows a top view of the third embodiment of the machining device according to the invention, which is in Fig. 5 is shown; Fig. Figure 8 shows a side view of a fourth embodiment of the machining device according to the invention; Fig. Figure 9 shows another side view from a different perspective of the fourth embodiment of the machining device according to the invention, which is described in Fig. 8 is shown; and Fig. Figure 10 shows a top view of the fourth embodiment of the machining device according to the invention, which is in Fig. 8 is shown.

[0058] If more than one instance of a particular object is present in the figures and the subsequent description of an embodiment, for the sake of simplicity, only one of them may be labeled with a reference numeral in the figures and description. The description of this instance can be applied analogously to the other instances of the same object. If objects are named, in particular by means of numerical terms such as first, second, third object, etc., these serve to identify and / or assign objects. Thus, for example, a first object and a third object, but not a second object, may be included. However, a number and / or a sequence of objects could also be derived from numerical terms.

[0059] Fig. Figure 1 shows a schematic side view of an embodiment of the machining device 10 according to the invention, comprising a machining unit 40, a holder 50 for it, and a base 60 mounted on a substrate (not shown). The machining device 10 also includes a workpiece carrier 190 with a receiving device 200 for receiving a workpiece 20.

[0060] The processing device 10 comprises a processing beam generator 85 and a processing beam source 80, which are connected to each other via an optical fiber 87. The processing beam generator 85 is thus spaced apart from the processing beam source 80. For example, the processing beam generator 85 can be arranged on the mounting 50. The processing beam source 80 is arranged on a housing of the processing device 40 and therefore rotates with it when the processing device 40 is pivoted and / or rotated. The processing beam 30 is coupled into the processing device 40 via the processing beam source 80 and subsequently converted by a collimator, for example a collimator lens, into a preferably at least approximately parallel processing beam 30.

[0061] Furthermore, the processing device 40 comprises a first mirror 120, a second mirror 130, a third mirror 140, a deflection device 90, and a focusing device 150. The beam path 100 of the processing beam 30 runs from the processing beam source 80 to the first mirror 120. In the arrangement according to Fig. 1. The beam path 100 of the processing beam 30 is deflected by 90° by the first mirror 120 and then guided downwards coaxially to the swivel axis 70 in a vertical direction of the processing device 40. In other words, the beam path 100 of the processing beam 30 is deflected by 90° by the first mirror 120 and then guided coaxially to the swivel axis 70 in the negative Z-direction. However, the beam path 100 of the processing beam 30 can also be guided downwards parallel to the swivel axis 70 in the vertical direction of the processing device 40.

[0062] The beam path 100 of the processing beam 30 then hits the second mirror 130 and is deflected by it again by 90° and led away from the pivot axis 70 at an angle that runs perpendicular to the pivot axis 70.

[0063] The beam path 70 of the processing beam 30 then encounters the third mirror 140 and is deflected downwards by 90° by it. In this section, it thus runs parallel to the pivot axis 70 into the deflection device 90.

[0064] The deflection device 90 allows the processing beam 30 to be deflected at different angles. The processing beam 30 then strikes the focusing device 150 and is focused by it onto the current processing position 110 of the workpiece 20.

[0065] The machining device 40 is rotatably and / or pivotably mounted on the bracket 50 about the pivot axis 70. Furthermore, the machining device 40 is displaceably mounted relative to the bracket 50 via a first slide arrangement 180 and is displaceable along a linear axis belonging to the first slide arrangement 180, i.e., along a linear axis in the Z direction.

[0066] In the illustrated embodiment, the workpiece carrier 190 is fixedly mounted on the base 60 and comprises a receiving device 195 for receiving the workpiece 20. Furthermore, the receiving device 195 is rotatably mounted about a rotational axis 210, in particular in the direction of rotation A shown. The rotational axis 210 runs essentially perpendicular to the pivot axis 70.

[0067] The bracket 50 is mounted so as to be displaceable relative to the base 60 via a third slide arrangement 230. For example, the bracket 50 is displaceable via the third slide arrangement 230 along a linear axis belonging to the third slide arrangement 230, in particular along a linear axis in the Y direction.

[0068] To machine the workpiece 20, in this case a substantially cylindrical body, for example a milling cutter with cutting edges to be sharpened arranged on its circumferential surface, using the machining device 10, this workpiece 20 is clamped into the holding device 195. By rotating the workpiece 20 about the axis of rotation 210 in the direction of arrow A, different areas on the cylindrical circumferential surface of the workpiece 20 can be machined with the laser beam at the machining position 110.

[0069] Furthermore, by shifting the third slide arrangement 220, the holder 50 can be moved relative to the base 60, particularly in the Y direction. This changes the distance between the machining device 40 and the holding device (not shown) of the workpiece carrier 190, and thus the distance between the machining device 40 and the workpiece 20.

[0070] Additionally, by swiveling and / or rotating the machining device 40 about the swivel axis 70, the workpiece 20 can be machined from different sides.

[0071] The path of the beam 100 within the processing device 40 offers the following advantages. Because the beam 100 of the processing beam 30 moves with the processing device 40 during a pivoting and / or rotating movement about the pivot axis 70, the beam 100 does not shift on the mirrors 120, 130, and 140 over which it is guided during the pivoting and / or rotating movement. Therefore, the focal point of the processing beam 40 does not change with respect to the pivot axis 70 when the processing device 40 is pivoted and / or rotated.

[0072] Preferably, the current processing point 110 of the processing beam 30 is located as shown in Fig. Figure 1 shows the workpiece 20 on the pivot axis 70. This measure, along with the inventive design of the beam path 100, ensures that the current machining position 110 does not change during the pivoting and / or rotating of the machining device 40 about the pivot axis 70. This allows the workpiece 20 to be machined from different sides by the machining beam 30 of the machining device 40 without changing the machining position. As a result, geometries of the workpiece 20 that are not to be machined can be bypassed by pivoting and / or rotating the machining device 40 about the pivot axis 70 without changing the current machining position 110.

[0073] Fig. Figures 2 to 4 relate to a further (second) embodiment of a machining device 10' according to the invention. Thus, it shows Fig. 2 a schematic side view of this embodiment in a YZ plane. Fig. Figure 3 shows a schematic side view of this embodiment in an XZ plane. Fig. Figure 4 shows a top view of the machining device 10' according to the invention, which is in Fig. Figure 2 is shown. The top view is an example of a view of an XY plane.

[0074] The further embodiment of the processing device 10', which is described in the Fig. The device shown in Figures 2 to 4 is largely analogous to the processing device 10, which is shown in Fig. Figure 1 is shown. Therefore, only the differences between machining device 10' and machining device 10 are described below.

[0075] In contrast to the processing device 10, the processing device 10' has a processing beam source 80' in the form of a processing beam generator 85' for generating a processing beam 30 attached directly to the processing unit 40. Therefore, the processing beam generator 85' rotates with the processing unit 40 when it rotates. However, the processing device 10' can also include the processing beam generator 85 and the processing beam source 80 of the processing device 10. In other words, the processing beam sources 80 and 80', as well as the processing beam generators 85' and 85, are interchangeable. This also applies to all other described embodiments.

[0076] Furthermore, the machining device 10' according to the second embodiment has a workpiece carrier 190' that differs from that of the first embodiment. The workpiece carrier 190' comprises a workpiece holder 200 for receiving the workpiece 20. The workpiece holder 200 is slidably mounted relative to the base 60 via a second slide arrangement 220. In addition, the workpiece holder 200 is slidable via the second slide arrangement 220 along a linear axis belonging to the second slide arrangement 220, in particular along a linear axis in the X direction. This allows the distance between the workpiece holder 200 of the workpiece carrier 190' and the machining unit 40, and thus between the workpiece 20 and the machining unit 40, to be changed.In particular, the distance between the workpiece 20 and the machining device 40 is changed before the machining of the workpiece 20 with the machining beam 30 begins, for example to set a focus distance between the workpiece 20 and the machining beam 30.

[0077] The X-linear axis belonging to the second slide arrangement 220 and the Y-linear axis belonging to the third slide arrangement 230 are, as shown in the Fig. 3 and Fig. As shown in Figure 4, the slides are essentially aligned perpendicular to each other. In other words, the X-axis belonging to the second slide arrangement 220 is configured in a cross-slide arrangement with the Y-axis belonging to the third slide arrangement 230. This also makes it possible to change the distance between the workpiece 20 and the machining unit 40, for example, to set a focal distance between the workpiece 20 and the machining beam 30. The cross-slide arrangement allows the distance between the workpiece 40 and the machining unit 30 to be changed in two different spatial directions.

[0078] Furthermore, the receiving device 200 is rotatable about a first axis of rotation 210' according to the directions of rotation A, i.e., the receiving device 200 is, as in Fig. Figure 1 shows that the slide assembly is rotatable in the directions A indicated. The axis of rotation 210' is parallel to the linear axis of the second slide assembly 220. The axis of rotation 210' runs essentially perpendicular to the pivot axis 70.

[0079] Fig. Figure 4 shows the rotational movement of the machining device 40 about the swivel axis 70. The machining device 40 is particularly along in Fig. The machining device 40 is rotatable in the four directions C shown. Preferably, the machining device 40 is rotatable about the pivot axis 70 in an angle α from -45° to 225°. In the position shown with solid lines, the machining device 40 has an angle α of 0° with respect to the Y-axis of a rectangular XYZ coordinate system. The Z-axis of the XYZ coordinate system is collinear with the pivot axis 70 and points into the top view shown. The two machining devices 40a and 40b, each shown with dashed lines, represent the machining device 40 in an orientation rotated relative to the initial position shown with solid lines. The state according to machining device 40a corresponds to an orientation at an angle α of 45°, and the state according to machining device 40b corresponds to an orientation at an angle α of -45°.

[0080] The Fig. 5, Fig. 6 and Fig. Figure 7 shows a further embodiment of a machining device 10'' according to the invention. Fig. 5 and Fig. Figure 6 shows a side view of the machining device 10'' and Fig. Figure 7 shows a top view of the machining device 10''. An example is shown. Fig. 5 a view of a YZ plane, Fig. 6. A view of an XZ plane and Fig. 7 a view of an XY plane.

[0081] The machining device 10'', which is in the Fig. 5, Fig. 6 and Fig. Figure 7 is essentially analogous to the machining device 10' shown in the Fig. 2, Fig. 3 and Fig. The structure is shown in section 4.

[0082] In contrast to machining device 10', machining device 10'' has a differently designed holder 50' and a differently designed workpiece carrier 190''. Machining device 10'' could also have the holder 50 or the workpiece carrier 190 and 190' of machining devices 10 or 10'.

[0083] The 50' bracket, which is in the Fig. 5, Fig. 6 and Fig. The bracket shown in 7 differs from the bracket 50, which is shown in the Fig. 1, Fig. 2, Fig. 3 and Fig. 4 is shown, firmly attached to the base 60.

[0084] The workpiece carrier 190'' comprises a holding device 200'' for receiving the workpiece 20 and a second slide assembly 220''. The holding device 200'' is slidably mounted on the second slide assembly 220'' with respect to the base 60. For this purpose, the second slide assembly 220'' has first and second linear axes along which the holding device 200'' is slidable with respect to the base 60. The holding device 200'' is, for example, slidable in the X-direction via the first linear axis of the second slide assembly 220''. Furthermore, the holding device 200'' is, for example, slidable in the Y-direction via the second linear axis of the second slide assembly 220''. The first and second linear axes of the second slide assembly 220'' are arranged essentially perpendicular to each other.In other words, the first and second X and Y linear axes of the second slide arrangement 220'' are configured as a cross slide arrangement relative to each other. This allows the distance between the workpiece holder 200'' of the workpiece carrier 190'' and the machining unit 40, and thus between the workpiece 20 and the machining unit 40, to be changed in two spatial directions.

[0085] Using the second slide assembly 220'' to change the distance between the machining unit 40 and the workpiece 20 in the two spatial directions means that only components of the second slide assembly 220'' need to be aligned to achieve precise movement in these two directions. The components of the second slide assembly 220'' are located close together, and there are no large components between the first X-axis and the second Y-axis of the second slide assembly 220''. Therefore, deviations in the alignment between the first X-axis and the second Y-axis of the second slide assembly 220'' have a less significant impact.In particular, the distance between the workpiece 20 and the machining device 40 is changed before the machining of the workpiece 20 with the machining beam 30 begins, for example to set a focus distance between the workpiece 20 and the machining beam 30.

[0086] Furthermore, the receiving device 200'' is rotatable about a first axis of rotation 210''. In particular, the receiving device 200'' is, as in Fig. Figure 5 shows a rotational element along the indicated directions A. The first axis of rotation 210'' is parallel to the first linear axis of the second slide arrangement 220, which runs in the X direction. The first axis of rotation 210'' is at least substantially perpendicular to the pivot axis 70.

[0087] The Fig. 8, Fig. 9 and Fig. Figure 10 shows a further embodiment of a machining device 10''' according to the invention. Fig. Figure 8 shows a side view of the machining device 10''' on a YZ plane. Fig. Figure 9 shows another side view of the machining device 10''' on an XZ plane and Fig. Figure 10 shows a top view of the machining device 10''' in the Z direction onto an XY plane.

[0088] The machining device 10''', which is located in the Fig. 8, Fig. 9 and Fig. Figure 10 is essentially analogous to the machining device 10'' shown in the Fig. 5, Fig. 6 and Fig. Figure 7 is shown. In contrast to the machining device 10'', the machining device 10''' has a different workpiece carrier 190'''.

[0089] The workpiece carrier 190''' comprises a holding device 200''' for receiving the workpiece 20 and a second slide assembly 220'''. The holding device 200''' is slidably mounted on the second slide assembly 220''' with respect to the base 60. For this purpose, the second slide assembly 220''' has first and second X and Y linear axes along which the holding device 20''' is slidable with respect to the base 60. The holding device 200''' is slidable in the X direction via the first linear axis of the second slide assembly 220'''. Furthermore, the holding device 200''' is slidable in the Y direction via the second linear axis of the second slide assembly 220'''. The first and second linear axes of the second slide assembly 220''' are thus arranged at least substantially perpendicular to each other and are therefore configured in a cross-slide arrangement.The use of the second slide assembly 220''' to change the distance between the machining unit 40 and the workpiece 20 in the two spatial directions means that only components of the second slide assembly 220''' need to be aligned to achieve precise movement in these two directions. The components of the second slide assembly 220''' are located close together, and no large components are positioned between the first X-axis and the second Y-axis of the second slide assembly 220'''. Therefore, deviations in the alignment between the first X-axis and the second Y-axis of the second slide assembly 220''' are less significant.In particular, the distance between the workpiece 20 and the machining device 40 is changed before the machining of the workpiece 20 with the machining beam 30 begins, for example to set a focus distance between the workpiece 20 and the machining beam 30.

[0090] Furthermore, the holding device 200''' is pivotable about a second pivot axis 215. The second pivot axis 215 is parallel to the second linear axis of the second slide arrangement 220''', which runs in the Y direction. The second pivot axis 215 runs at least substantially perpendicular to the pivot axis 70. The second pivot axis 215 is also spaced apart from the pivot axis 70. The holding device 200''', as shown in Fig.Figure 9 shows that the workpiece 20 can be swivelled along the indicated directions B. By swivelling the holding device 200'' in the indicated direction B, the angle between the workpiece 20 and the machining unit 40 can be changed. This allows for the realization of even more complex workpiece geometries.

[0091] Due to the operating principle described above of the various embodiments of the machining devices 10, 10', 10'' and 10''' according to the invention, the embodiments shown in the figures do not require additional movable deflecting mirrors or other displaceable optical components in the beam path 100 of the machining beam 30. This can result in cost savings compared to conventional machining devices according to the prior art. Furthermore, this ensures that the position of the current machining position 110 of the machining beam 30, in particular a focal point of the machining beam 30, remains constant during the rotational movement of the pivot axis 70 along the linear axis.

[0092] Furthermore, due to the described functional principle of the machining devices 10, 10', 10'' and 10''' according to the invention, it can be ensured that the current machining position 110 of the machining beam 40 remains on the pivot axis 70 when the machining device is displaced by at least one linear axis of the first slide arrangement 110 and / or at least one linear axis of the second slide arrangement 120.

[0093] In particular, due to the described functional principles of the processing devices 10, 10', 10'' and 10''' according to the invention, the entire beam path 100 is fixed with respect to the pivot axis 70. A movement of the processing device 40 about the pivot axis 70 therefore does not cause any displacement of the current processing position 110 of the processing beam 30 with respect to the pivot axis 70.

[0094] It is understood that in further alternative embodiments, additional movable optical components may be provided for repositioning the processing beam 30. These can serve to adjust the processing beam 30 before the start of the processing process such that the current processing position 110 of the processing beam 30 lies on or in the immediate vicinity of the pivot axis 70. In alternative embodiments, such additional movable optical components can also serve to reposition the processing beam 30 during processing along the pivot axis 70 in the vertical direction of the processing device 40. Reference symbol list 10, 10', 10'', 10''' Machining device 20 workpieces 30 processing beam 40 processing equipment 50 bracket 60 base 70° swivel axis 80, 80' Processing beam source 85, 85' Processing beam generator 87 Optical fiber 90 Deflection device 100 beam path 110 current processing positions 120 first mirror 130 second mirror 140 third mirror 150 focusing device 180 first sled arrangement 190, 190', 190'', 190''' Workpiece carrier 200, 200'', 200''' Recording device 210, 210', 210'' first axis of rotation 215 second pivot axis 220, 220'', 220''' second sled arrangement 230 third slide arrangement QUOTES INCLUDED IN THE DESCRIPTION

[0000] This list of documents cited by the applicant was automatically generated and is included solely for the reader's convenience. The list is not part of the German patent or utility model application. The DPMA accepts no liability for any errors or omissions. Cited patent literature

[0000] WO 2019 / 166425 A1

[0004]

Images