Solder contacts for socket assemblies and methods for manufacturing an IC package assembly

Abstract

Package assembly (100, 300) for integrated circuits, IC package assembly comprising the following: several electrical contacts (330) configured to transmit electrical signals from an integrated circuit; and Several solder contacts (350) are coupled to the electrical contacts (330) and arranged to couple directly to pins (208) of a socket assembly (104) to provide an electrical connection between the pins (208) of the socket assembly (104) and the several electrical contacts (330), wherein the solder contacts have a melting point between 55-80°C, and wherein the solder contacts provide electrical coupling between the pins and the several electrical contacts at load forces of less than 0.25 N.

Description

Field of invention

[0001] Embodiments of the present disclosure relate generally to the field of integrated circuits and in particular to socket contact technologies and designs. General state of the art

[0002] As the complexity of high-performance architectures increases, so does the number of socket connections for these architectures. For example, the number of pins for socket assemblies for certain central processing units (CPUs) has increased 3.5-fold within just a few generations. Furthermore, socket pins typically require a certain amount of force to be applied to provide a proper electrical connection. For example, some Land Grid Array (LGA) assemblies may require a force of 0.25 N or higher to maintain proper contact with gold pins and pads. The total force required to insert a processor into a socket can increase linearly with the number of pins. As the number of pins increases, so too can the total force required to insert the processor package.Furthermore, the socket contacts and die housings may be fragile and susceptible to bending or other damage during handling or assembly. Thus, increasing the overall forces increases the likelihood of bending, breakage, or other mishaps.

[0003] US 2006 / 0078248A1 describes an LSI package with an optical interface mounted on the surface of a photoelectric wiring board. The photoelectric wiring board and the optical interface are optically connected with sufficient precision. A wiring board side guide element with socket pins and guide pins is soldered and attached to the photoelectric wiring board, which contains an optical transmission line, a guide pin, and a mirror. A guide element on the optical interface side, with a locating hole, is glued to the optical interface. The optical interface is mounted on an interposer of the LSI package. The guide pin of the photoelectric wiring board is inserted into the locating hole formed by the interposer. The guide pin of the guide element is inserted into the locating hole of the guide element.This achieves highly precise positional alignment between the optical interface and the photoelectric wiring board.

[0004] US 2005 / 0260868A1 describes a test device comprising a test slot with slot pins in a standard configuration. An intermediary board may be placed between the test slot and a housing with solder balls in a non-standard configuration. The intermediary board may have contact balls and contact pads. The contact balls may be arranged in a configuration compatible with the standard slot pin configuration, and the contact pads may be arranged in a configuration compatible with the non-standard solder ball configuration.

[0005] US 2007 / 0227627A1 describes a solder composition. The solder composition comprises a solder matrix material and dispersed particles within the solder matrix material. The solder matrix material has a relatively low melting point, and the dispersed particles have a relatively high melting point.

[0006] US 2003 / 0215981A1 describes a method for attaching a chip to a substrate. According to the method, a chip and a substrate are provided, which are to be joined together via a first and a second surface. The first and second surfaces are contacted with a liquid solder composition having a maximum melting temperature Tm1 of less than about 100 °C. The liquid solder composition is then contacted with a freezing agent, forming a second composition with a maximum melting temperature Tm2, ​​where T2-Tm1 is at least about 25 °C. Brief description of the drawings

[0007] The embodiments will be more easily understood by reading the following detailed description in conjunction with the accompanying drawings. To facilitate this description, identical structural elements are designated with the same reference numerals. The embodiments are illustrated as examples and not as limitations of the figures in the accompanying drawings; they show: Fig. 1 A schematic illustration of a perspective view of an exemplary package assembly of an integrated circuit (IC) according to some embodiments; Fig. 2 a schematic illustration of a side view of a cross-section of an exemplary bushing assembly according to some embodiments; Fig. 3 a schematic illustration of a side view of a cross-section of an exemplary socket assembly having a die housing having solder contacts according to some embodiments; Fig. 4 a schematic side view of a cross-section of an exemplary housing assembly comprising a die housing having solder contacts and a socket assembly according to some embodiments; Fig. 5 a schematic illustration of a bottom view of a die housing having solder contacts for coupling to pins of a socket assembly according to some embodiments; Fig. 6 a schematic illustration of a side view of a cross-section of an exemplary socket assembly comprising a socket housing with pins having solder contacts according to some embodiments; Fig. 7 a schematic illustration of a flowchart for a method for manufacturing an IC package assembly according to some embodiments; Fig. 8 A schematic illustration of a computing device comprising an IC package assembly as described herein, according to some embodiments. Detailed description

[0008] Embodiments of the present disclosure describe socket contact techniques and configurations that incorporate solder contacts. In various embodiments, solder contacts can be used to provide an electrical connection between the pins of a socket assembly and the electrical contacts of a die housing. In various embodiments, these solder contacts can consist of a soft solder that facilitates electrical conduction under lower stress forces than those used in other socket assemblies.

[0009] The following description presents various aspects of the illustrative statements using terms commonly used by those skilled in the art to convey the essence of their work to another skilled person. However, those skilled in the art will understand that embodiments of the present disclosure can be applied in practice with only some of the described aspects. For explanatory purposes, specific figures, materials, and configurations are presented to provide a thorough understanding of the illustrative statements. However, those skilled in the art will understand that embodiments of the present disclosure can be applied in practice without these specific details. In other cases, well-known features are omitted or simplified to avoid making the illustrative statements incomprehensible.

[0010] The following detailed description refers to the accompanying drawings, which form a part thereof, where identical reference numerals consistently denote identical parts, and in which embodiments are shown for illustration purposes with which the present disclosure can be applied in practice.

[0011] For the purposes of this disclosure, the expression “A and / or B” means (A), (B) or (A and B). For the purposes of this disclosure, the expression “A, B and / or C” means (A), (B), (C), (A and B), (A and C), (B and C) or (A, B and C).

[0012] The description may use perspective-based descriptions, such as top / bottom, in / out, above / below, and the like. Such descriptions are used solely to facilitate discussion and are not intended to restrict the application of the embodiments described herein to any particular orientation.

[0013] The description may use the expressions “in one embodiment” or “in embodiments”, each of which may refer to one or more of the same or different embodiments. Furthermore, the terms “comprise”, “include”, “have”, and the like, as used in relation to embodiments of the present disclosure, are synonymous.

[0014] Here, the term "coupled with" and its derivatives can be used. "Coupled" can mean one or more of the following: "Coupled" can mean that two or more elements are in direct physical or electrical contact. "Coupled" can also mean that two or more elements are indirectly touching but still interacting or working together, and can mean that one or more other elements are coupled or connected between the elements that are said to be coupled. The term "directly coupled" can mean that two or more elements are directly touching each other.

[0015] In various embodiments, the expression "a first feature formed, deposited or otherwise applied over a second feature" can mean that the first feature is formed, deposited or applied over the second feature and that at least part of the first feature can be in direct contact (e.g., direct physical and / or electrical contact) or indirect contact (e.g., with one or more features between the first feature and the second feature) with at least part of the second feature.

[0016] The term "module," as used herein, may refer to, be a part of, or include an Application Specific Integrated Circuit (ASIC), an electronic circuit, a System-on-Chip (SoC), a processor (shared, dedicated, or group processor), and / or memory (shared, dedicated, or group memory) that executes one or more software or firmware programs, a combinational logic circuit, and / or other suitable components that provide the described functionality.

[0017] Fig. Figure 1 schematically illustrates a perspective view of an exemplary package assembly of an integrated circuit (IC) 100 according to some embodiments. The IC package assembly 100 may include a socket assembly 104 coupled to a printed circuit board or other suitable electronic substrate (hereinafter referred to as "printed circuit board 102"). The IC package assembly 100 may further include a die or a die package (hereinafter referred to as "die package 106") electrically coupled to the printed circuit board 102 by the socket assembly 104.

[0018] The socket assembly 104 can, for example, comprise a Land Grid Array (LGA) socket having an array of electrical contacts, also referred to herein as "pins," configured to transmit electrical signals between the die package 106 and the printed circuit board 102. According to various embodiments, the socket assembly 104 can correspond to embodiments described herein. For example, in some embodiments, the die package 106 can correspond to embodiments that, in conjunction with Fig. 4 and Fig. 5 are described to provide solder contacts on the die housing 106 in order to provide electrical coupling between the die housing 106 and the socket assembly 104 under reduced load forces. In another example, in some embodiments, the socket assembly 104 may correspond to embodiments that, in conjunction with Fig. 6 are described to provide solder contacts on electrical contacts of the socket assembly 104, which provide electrical coupling between the die housing 106 and the socket assembly 104 under reduced load forces. Other embodiments may provide advantageous combinations of these embodiments.

[0019] In some embodiments, the circuit board 102 can be a printed circuit board (PCB) made of an electrically insulating material, such as an epoxy laminate. The PCB 102 can have electrically insulating layers made of materials such as polytetrafluoroethylene, phenol-cotton paper materials such as Flame Retardant 4 (FR-4), FR-1, cotton paper, and epoxy materials, including epoxy composite materials (CEM) such as CEM-1 or CEM-3, or glass fabric materials laminated together using epoxy resin prepreg material. Interconnection structures (not shown), such as traces, trenches, or vias, can be formed through the electrically insulating layers to transmit the electrical signals from the die package 106 through the PCB 102.The printed circuit board 102 can be made of other suitable materials in other embodiments. For example, in some embodiments, the printed circuit board 102 can be an epoxy-based laminate substrate having a core and / or build-up layers, such as an Ajinomoto Build-up Film (ABF) substrate. In some embodiments, the printed circuit board 102 is a mainboard (e.g., the mainboard 802 from [company name]). Fig. 8).

[0020] The die housing 106 can comprise one or more dies in any large variety of suitable configurations. For example, in various embodiments, the die housing 106 can be a housing for a central processing unit (CPU) or a graphics processing unit (GPU). The die housing 106 can comprise one or more dies that are at least partially encapsulated in a protective enclosure, such as a molding compound or other suitable protective housing. In some embodiments, the die housing 106 can have alignment features to facilitate the coupling of the die housing 106 with corresponding alignment features of the socket assembly 104.

[0021] The die package 106 can comprise one or more dies made of a semiconductor material (e.g., silicon) and containing circuits formed using semiconductor fabrication techniques such as thin-film deposition, lithography, etching, and the like, which are used in conjunction with the formation of complementary metal-oxide semiconductor (CMOS) devices. In some embodiments, the one or more dies of the die package 106 may include or be part of a processor, memory, SoC, or ASIC. The one or more dies in the die package 106 can have a wide variety of configurations, which include, for example, suitable combinations of flip-chip and / or wire-bond configurations, interposers, multi-chip package configurations, system-in-package (SiP) and / or package-on-package (PoP) configurations.

[0022] Fig. Figure 2 schematically illustrates a side view of a cross-section of an example of a socket assembly 104, which schematically illustrates the socket housing 204 with electrically conductive pins 208 according to some embodiments. In some embodiments, the socket housing 204 (also referred to here as the "socket substrate") can have multiple openings 206 arranged between a first side S1 and an opposing second side S2 of the socket housing 204, as shown. The pins 208 can be physically coupled to the socket housing 204 in corresponding openings of the multiple openings 206. For example, the pins 208 can be physically coupled to the socket housing 204 using mechanical tack features. In some embodiments, the pins 208 can extend through the openings 206 to carry electrical signals, such as input / output (I / O) signals or power / ground of a die (e.g., a power supply).of the die housing 106 of . Fig. 1) to be forwarded through the socket housing 204.

[0023] The bushing housing 204 can be made of any of a wide variety of suitable materials, including, for example, polymers, ceramics, or semiconductor materials. In other embodiments, the housing bushing 204 can be made of other suitable materials.

[0024] In some embodiments, pins 208 can be leads of an LGA socket configuration. For example, pins 208 can be J-leads, so named because each J-lead, viewed from one side, can have a profile similar to the letter J, as shown. Pins 208 can be made of an electrically conductive material, such as metal.

[0025] In some embodiments, pins 208 may correspond to embodiments that are used in conjunction with Fig. 3, Fig. 4, Fig. 5, Fig. 6 to Fig. 7 are described, and vice versa. For example, pins 208, as in the examples of Fig. 3, Fig. 4 to Fig. 5, instead of having J-leads, profiles of different shapes, such as essentially straight profiles. Furthermore, in some embodiments, as in the examples of Fig. 3, Fig. 4 to Fig. 5, have a shape such that they penetrate into corresponding solder contacts of a die housing 106, as discussed below.

[0026] In some embodiments, each of the pins 208 can have a contact section 208a, a leg section 208b, and a foot section 208c, as shown. The contact section 208a can extend beyond a surface of the socket housing 204 to establish an electrical contact with corresponding interconnection features on a die housing (e.g., the die housing 106 of Fig. 1) The leg section 208b can extend through the openings 206. The foot section 208c (sometimes referred to as the "paddle") can have a surface designed to be directly coupled to the solderable material 210 (e.g., solder ball) to form a solder joint (e.g., between a socket assembly 104 and a printed circuit board 102). Fig. 1) to form.

[0027] In some embodiments, the leg section 208b can extend in a first direction indicated by the x-axis, and the foot section 208c can have a surface extending in a second direction indicated by the y-axis, which is perpendicular to the first direction, as can be seen. In various embodiments, the leg section 208b can extend from the surface of the foot section 208c at an angle that is substantially perpendicular (e.g., ±10° to the perpendicular) or angled (e.g., ±40° to the perpendicular). The profile shape of the pins 208 is merely an example and in other embodiments can have any of a large variety of other profile shapes.

[0028] Fig. Figure 3 schematically illustrates a side view of a cross-section of an exemplary housing assembly 300, which comprises a die housing 106 having solder contacts 350 according to some embodiments. The solder contacts 350 can be arranged in various embodiments on the lower surface of the die housing 106 such that the electrical contacts 330 of the die housing 106 are in conductive contact with the solder contacts 350. The solder contacts can also be arranged such that the solder contacts 350 are conductively coupled to one or more pins 208 of the socket assembly 104, for example, when the die housing 106 is coupled to the socket assembly 104. In various embodiments, the solder contacts 350 can provide an electrical connection between the electrical contacts 330 of the die housing 106 and the pins 208 of the socket assembly 104. As shown in Fig. As illustrated in Figure 3, the pins 208 can have a configuration used to penetrate the solder contacts 350, thereby providing improved electrical conductivity between the pins 208 and the solder contacts 350 (and then again between the pins 208 and the electrical contacts 330 of the die housing 106). Certain examples of pin configurations are described below.

[0029] In various embodiments, solder mask material 340 can be applied to the lower surface of the die housing 106. The solder mask material 340 can be applied to the lower surface of the die housing 106 prior to the application of the solder contacts 350 to facilitate their placement. Different types of solder mask material 340 can be used in various embodiments. In other embodiments, the solder mask material 340 can be applied to the lower surface of the die housing 106 such that voids are present on the lower surface over the areas where the electrical contacts 330 are located. These voids can then be filled with solder using known techniques for forming the solder contacts 350 into contact with the electrical contacts 330.For example, in some embodiments, injection molding can be used to inject liquid solder into the voids, thereby producing the solder contacts 350. In another example, the die housing can be attached using a bath of molten solder, wherein the lower surface of the die housing 106 (which has the solder mask material 340) is immersed or otherwise temporarily placed in the bath of molten solder. Since the solder mask material 340 cannot cause the solder to adhere, the molten solder from the bath can only adhere to the voids where the electrical contacts 330 of the die housing are located. In still other embodiments, solder balls can be applied directly to the lower surface of the die housing 106.

[0030] In various embodiments, the solder contacts 350 can be made of a soft solder that facilitates electrical conduction under lower stress forces than those used in socket assemblies that do not use the solder contacts 350. For example, as mentioned previously, some LGA assemblies that use gold pins and pads may require a stress force of 0.25 N or higher to establish a necessary connection between the pins and pads of the die package. In contrast, using a soft solder, various embodiments can enable electrical connections between pins 208 and electrical contacts 330 of the die package 106 using stress forces below 0.25 N. In various embodiments, the solder contacts 350 can be made of a solder that provides an electrical connection with a resistance of less than 25 mΩ, or more precisely, between 20 and 25 mΩ.In various embodiments, to provide a desired electrical conductivity under lower load forces, solder contacts can have 350 connections that have a strain rate of 0.1 / second at a pressure of less than or equal to 70 megapascals (MPa), or connections that have a strain rate of 0.0001 / second at a pressure of less than or equal to 30 MPa.

[0031] In various embodiments, different compositions of soft solder can be used. Since the solder contacts 350 are located between the electrical contacts 330 of the die housing 106 and the pins 208 of the socket assembly 104, the solder contacts 350 can exhibit a contact resistance between these structures. This contact resistance can be related, in various embodiments, to the hardness of the solder used in the solder contact 350 and the load applied to the connection. Furthermore, since solder materials can form oxides on their surface, the contact resistance can also be related to the qualities of the oxides of the solder material used in the solder contacts 350. In various embodiments, the contact resistance between two materials can follow the following relationship: Rc=(ρ1+ρ2) / 2*(πH / 4F)1 / 2+ρoxidesdoxidesHoxides / FK, where R cthe contact resistance between pins 208 and electrical contacts 330, ρ1 and ρ2 are the corresponding specific electrical resistances of pins 208 and electrical contacts 330, H is the hardness of the solder used in the solder contact 350, F is the load applied to the connection, ρ oxides the electrical resistance of the oxides of the solder used in the solder contact 350 is, d oxides the thickness of the oxides of the solder used in the solder contact 350 is and H oxidesThe hardness of the oxides of the solder used in the solder contact 350 is also a factor. Furthermore, as used in the equation, K is a value related to whether the thin oxide layer on the solder contact 350 has been penetrated. Before penetration, K = 1; after penetration, K can be much greater than 1. As can be seen from the preceding equation, the contact resistance can be reduced by using one or more of the following: softer solder materials, solder materials with softer or thinner oxide layers, and / or combinations of solder materials and pins that facilitate penetration into the thin oxide layer of the solder material when the die housing 106 is loaded into the socket assembly 104.

[0032] In various embodiments, the solder contacts 350 can contain a solder containing indium. In some examples, the soft solder contacts can consist essentially of indium or can consist solely of pure indium. In other examples, "pure indium" can comprise compounds or mixtures consisting of 99% or more indium and less than 1% of other materials. In other examples, essentially indium-containing solders can be used because indium has a melting point (~157°C) that is higher than typical shipping temperatures for socket assemblies (~55°C). Furthermore, indium oxides are relatively soft compared to oxides of other solder materials, and the pins 208 thus penetrate them easily, providing the required electrical conductivity at lower stress forces.

[0033] In other embodiments, solders not composed of pure indium (or substantially pure indium) can be used. For example, Solder 350 contacts can incorporate solders with melting points between 55°C and 80°C, as these melting points are higher than likely shipping temperatures (~55°C) but lower than likely operating temperatures (~80°C). It is therefore likely that such solder joints will be stable during shipping but will still provide electrical conductivity during actual operation, since the solder can provide low contact resistance after reaching its melting point at operating temperatures. In various embodiments, Solder 350 contacts can be used that contain mixtures of tin, bismuth, and indium, which have melting points in these ranges.For example, one known eutectic tin-indium-bismuth alloy has a melting point of 55°C, and another has a melting point of 77°C. Additionally, a eutectic indium-bismuth alloy has a melting point of 72°C. Other alloys, such as those containing gallium, which can be liquid at operating temperatures or have low melting points, can also be used.

[0034] The following overview illustrates exemplary strain rates at various pressures for solders comprising essentially indium solder, essentially tin solder, and an indium-tin-bismuth alloy. It will be understood that, although data are shown for specific solders, solders with different properties may be used in various embodiments as described herein. The illustrated hardness values ​​were determined using a Berkovich tip, as the person skilled in the art will understand. Dehnungsgeschwindigkeit ( / sec) Material Härte Mittel (MPa) Härte Std.-Abw. (MPa) 0,0001 In 13,68 1,48 0,0001 Sn 60,08 4,78 0,0001 In-Sn-Bi 22,75 8,80 0,001 In 17,95 1,87 0,001 Sn 76,81 5,53 0,001 In-Sn-Bi 26,93 11,08 0,1 In 29,39 1,66 0,1 Sn 137,86 8,25 0,1 In-Sn-Bi 109,71 23,48 1 In 36,63 2,47 1 Sn 222,82 14,84 1 In-Sn-Bi 255,45 74,70

[0035] Fig. Figure 4 schematically illustrates a side view of a cross-section of an exemplary housing assembly 100, which includes the die housing 106, the solder contacts 350, and the socket assembly 104 according to some embodiments. The illustration shows a single pin 208, solder contact 350, and electrical contact 330; in various embodiments, additional pins, solder contacts, and electrical contacts may be used. If, as in Fig. Figure 4 illustrates that the die housing 106 is coupled to the socket assembly 104. In various embodiments, the pin 208 can be arranged to contact the solder contact 350 under a load force, thereby providing a conductive connection between the pin 208 and the electrical contact 330 of the die housing 106. This electrical connection can be established in various embodiments regardless of whether the pin 208 physically touches the electrical contact 330.

[0036] In various embodiments, to facilitate the electrical connection between pin 208 and electrical contact 330, pin 208 can be arranged to penetrate the solder contact 350 under the load applied to connect the die housing 106 and the socket assembly 104. In various embodiments, pin 208 can be configured to penetrate the solder contact 350 in order to reduce the resistive effects of any oxides that may be present on the surface of the solder contact 350. To facilitate penetration into the solder contact 350 by pin 208, pin 208 can be configured to have a penetrating edge 380. In various embodiments, the penetrating edge 380 can be designed to have a smaller surface area compared to the solder contact 350 when it is under a load force, thereby increasing the probability of penetration of the solder contact 350.In various embodiments, the pin 208 can taper to a point to form the penetrating edge 380 at its end. In some embodiments, the pin 208 can taper to a point at the penetrating end in a substantially perpendicular direction (e.g., + / - 10° to the perpendicular) from the socket assembly 104. In various embodiments, the penetrating edge 380 can have a substantially straight edge and / or a curved edge. In various embodiments, for example, when the pin 208 has a substantially circular cross-section, the penetrating edge 380 can have a ring along the edge of the pin 208. In various embodiments, in addition to or instead of using an edge 380, the pin 208 can have one or more pointed projections for penetrating the solder contact 350.

[0037] Fig. Figure 5 schematically illustrates a bottom view of a die housing 106, which has solder contacts 350 for coupling to pins 208 of a socket arrangement 104 according to some embodiments. As shown in Fig. As illustrated in Figure 5, the die housing 106 can have several solder contacts 350 as well as the solder mask material 340; however, in some embodiments, as discussed above, no solder mask material can be used. The solder contacts 350 can be arranged in one or more lines and in a grid in various embodiments, as in the example shown in Figure 5. Fig. Figure 5 illustrates this. In various embodiments, the solder contacts 350 can be arranged with sufficient spacing such that it is unlikely the pins 208 of the socket assembly 104 will contact more than one solder contact 350 when subjected to a load. In particular, in embodiments where the contact section 208a of the pins 208 is arranged at an angle to the lower surface of the die housing 106, the solder contacts 350 can be spaced apart such that it is unlikely the contact sections 208a will contact two or more solder contacts 350 when subjected to a load.

[0038] Fig. Figure 6 schematically illustrates a side view of a cross-section of an exemplary socket assembly 104, which has pins 208 having solder contacts, according to some embodiments. As in the example of Fig. As illustrated in Figure 6, in various embodiments, solder contacts can be arranged on the surface of one or more of the pins 208 of the socket assembly 104, in addition to or instead of the arrangement of solder contacts 350 on the lower surface of the die housing 106. Although different pins 208 in Fig. Figure 6 illustrates specific arrangements of solder. It is understood that in different embodiments the same type of solder contact can be arranged on different combinations of pins 208, including all pins 208, fewer than all pins 208, or no pins 208. Thus, as shown in Fig. Figure 6 illustrates how a solder bead 208m can be arranged on the contact section 208a of a pin 208. In various embodiments, the solder bead 208m can be arranged by immersion or by another arrangement of the pin 208 in molten solder. In another illustrated example, solder can be plated onto the contact section 208a of a pin 208 in various embodiments, resulting in a plated solder contact 208n. In various embodiments, the solder can be plated using any suitable technique, including, for example, electroless plating. In each embodiment (bead formation or plating), the solder can be arranged on the surface of the contact section 208a such that the solder formed by beads or plated is electrically coupled to the pin 208.

[0039] Fig. Figure 7 schematically illustrates a flowchart for a process 700 for manufacturing an IC package assembly (e.g., the IC package assembly 100 from Fig. 1) according to some embodiments. Method 700 may correspond to embodiments that are associated with Fig. 1, Fig. 2, Fig. 3, Fig. 4, Fig. 5 to Fig. 6 are described. In 702, the procedure 700 can provide a bushing assembly (e.g., bushing assembly 104 of Fig. 1, Fig. 2, Fig. 3 to Fig. 4) have multiple pins (e.g., pins 208 of Fig. 2, Fig. 3 to Fig. 4) features which are designed to accommodate multiple electrical surface contacts (e.g. the electrical contacts 330 of Fig. 3 and Fig. 4) to be coupled, which are located on a surface of a package assembly of an integrated circuit (e.g. the die package 106 of Fig. 1, Fig. 3 and Fig. 4) are arranged.

[0040] In the case of 704, the process can form multiple solder contacts (e.g., the solder contacts 350 of Fig. 3, Fig. 4, Fig. 5 to Fig. 6) to provide an electrical path between individual pins of the multiple pins and electrical surface contacts of the multiple electrical surface contacts. In various embodiments, such formation of multiple solder contacts may include the formation of beads or the plating of individual solder contacts of the multiple soft solder contacts on the surface of corresponding individual pins of the multiple pins (e.g., the solder contact bead 208m and / or the plated solder contact 208n of Fig. 6) In various embodiments, such a formation of multiple solder contacts can include the arrangement of individual solder contacts of the multiple solder contacts on corresponding electrical surface contacts of the IC package assembly.

[0041] Various work processes are described sequentially as several separate operations in a manner that is most helpful for understanding the claimed subject matter. However, the order of the description should not be interpreted in such a way that these work processes are necessarily dependent on a sequence.

[0042] Embodiments of the present disclosure can be implemented in a system that uses any suitable hardware and / or software, which can be configured as desired. Fig. Figure 8 schematically illustrates a computing device 800, which includes an IC package assembly (e.g., the IC package assembly 100 from Fig. 1) has, as described herein, according to some embodiments. The computing device 800 can accommodate a printed circuit board, such as the mainboard 802 (e.g., in the housing 808). The mainboard 802 can have, but is not limited to, a number of components, including a processor 804 and at least one communication chip 806. The processor 804 can be physically and electrically coupled to the mainboard 802. In some embodiments, the at least one communication chip 806 can also be physically and electrically coupled to the mainboard 802. In other embodiments, the communication chip 806 can be part of the processor 804.

[0043] Depending on its applications, the 800 computing device may include other components that may or may not be physically and electrically coupled to the 802 mainboard. These other components may include volatile memory (e.g., DRAM), non-volatile memory (e.g., memory), or other storage devices.ROM), a flash memory, a graphics processor, a digital signal processor, an encryption processor, a chipset, an antenna, a display, a touchscreen display, a touchscreen control unit, a battery, an audio codec, a video codec, a power amplifier, a global positioning system (GPS) device, a compass, a Geiger counter, an accelerometer, a gyroscope, a loudspeaker, a camera and mass storage (such as a hard disk, compact disk (CD), digital versatile disk (DVD) and so on), but are not limited to.

[0044] The 806 communication chip can enable wireless communication for the transmission of data to and from the 800 computing device. The term "wireless" and its derivatives can be used to describe circuits, devices, systems, methods, techniques, communication channels, etc., that can communicate data through a non-solid medium by using modulated electromagnetic radiation. The term does not imply that the associated devices do not contain wires, although this may be the case in some embodiments. The 806 communication chip can implement a number of wireless standards or protocols, including Institute for Electrical and Electronics Engineers (IEEE) standards, including Wi-Fi (IEEE 802.11 family), IEEE 802.16 standards (e.g., IEEE 802.16-2005 Amendment), and the Long-Term Evolution (LTE) project with modifications, updates, and / or revisions (e.g., IEEE 802.16-2005 Amendment).The 806 communication chip can operate according to, but is not limited to, the Advanced LTE Project, Ultra Mobile Broadband (UMB) Project (also known as "3GPP2"), etc. IEEE 802.16 compliant BWA networks are commonly referred to as WiMAX networks, an acronym for Worldwide Interoperability for Microwave Access, which is a mark of approval for products that pass the conformance and interoperability tests for the IEEE 802.16 standards. The 806 communication chip can operate according to a Global System for Mobile Communication (GSM), General Packet Radio Service (GPRS), Universal Mobile Telecommunications System (UMTS), High Speed ​​Packet Access (HSPA), Evolved HSPA (E-HSPA), or LTE network. The 806 communication chip can operate according to Enhanced Data for GSM Evolution (EDGE), GSM EDGE Radio Access Network (GERAN), Universal Terrestrial Radio Access Network (UTRAN), or Evolved UTRAN (E-UTRAN).The 806 communication chip can operate according to Code Division Multiple Access (CDMA), Time Division Multiple Access (TDMA), Digital Enhanced Cordless Telecommunications (DECT), Evolution-Data Optimized (EV-DO), derivatives thereof, and other wireless protocols designated 3G, 4G, 5G, and higher. The 806 communication chip can also operate according to other wireless protocols in other embodiments.

[0045] The 800 communication device can have multiple 806 communication chips. For example, a first 806 communication chip can be dedicated to shorter-range wireless communications, such as Wi-Fi and Bluetooth, and a second 806 communication chip can be dedicated to longer-range wireless communications, such as GPS, EDGE, GPRS, CDMA, WiMAX, LTE, EV-DO, and others.

[0046] The 804 processor of the 800 communication device can be housed in an IC package assembly (e.g., the IC package assembly 100 from Fig. 1) be integrated, as described here. For example, circuit board 102 of Fig. 1. A mainboard 802 and the processor 804 can be a die of the die package 106 coupled to the socket assembly 104 mounted on the circuit board 102 according to techniques and configurations described here (e.g. using the solder contacts 350 of Fig. 3, Fig. 4, Fig. 5 to Fig. 6) Other suitable embodiments may be implemented according to the embodiments described herein. The term “processor” may refer to any device or section of a device that processes electronic data from registers and / or memory in order to convert such electronic data into other electronic data that can be stored in registers and / or memory.

[0047] The 806 communication chip can also have a die that is housed in an IC package assembly (e.g., the IC package assembly 100 from Fig. 1) is integrated, as described here. In further embodiments, another component (e.g., a storage device or integrated circuit device) housed within the computing device 800 may have a die that is integrated into an IC package assembly (e.g., the IC package assembly 100 of Fig. 1) is integrated, as described here.

[0048] In various configurations, the Computing Device 800 can be a laptop, netbook, notebook, ultrabook, smartphone, tablet, personal digital assistant (PDA), ultra-mobile PC, mobile phone, desktop computer, server, printer, scanner, monitor, set-top box, entertainment control device, digital camera, portable music player, or digital video recorder. In some configurations, the Computing Device 800 can be a mobile computing device. In other configurations, the Computing Device 800 can be an electronic device that processes data. Examples

[0049] Example 1 can be an integrated circuit (IC) package assembly. The IC package assembly can have multiple electrical contacts configured to transmit electrical signals from the integrated circuit. The IC package assembly can also have multiple solder contacts coupled to the electrical contacts and arranged to directly couple to pins of a socket assembly, providing an electrical connection between the socket assembly pins and the multiple electrical contacts.

[0050] Example 2 may include the IC package assembly of Example 1, wherein the solder contacts may have a solder having a strain rate of 0.1 / second at a pressure of less than or equal to 70 megapascals (MPa), or a solder having a strain rate of 0.0001 / second at a pressure of less than or equal to 30 MPa.

[0051] Example 3 may have the IC package assembly of Example 1, wherein the solder contacts may have a solder containing indium.

[0052] Example 4 can feature the IC package assembly of Example 3, where the solder can be a pure indium solder.

[0053] Example 5 may feature the IC package assembly of Example 3, where the solder may be a tin indium bismuth solder.

[0054] Example 6 may include the IC package assembly of any of Examples 1 to 6, wherein the solder contacts may have a solder with a melting point above a shipping temperature.

[0055] Example 7 may have the IC package assembly of Example 6, where the shipping temperature may be above 55°C.

[0056] Example 8 may comprise the IC package assembly of any of Examples 1 to 6, wherein the solder contacts may have a solder having one or more compounds whose oxides have a substantially low resistance.

[0057] Example 9 can include the IC package assembly of any of Examples 1 to 6, which further includes the socket assembly, wherein the socket assembly is a Land Grid Array (LGA) socket assembly.

[0058] Example 10 can include the IC package assembly of any of Examples 1 to 6, wherein the solder contacts can provide electrical coupling between the pins and the multiple electrical contacts at load forces lower than 0.25 N.

[0059] Example 11 may include the IC package assembly of Example 1, wherein the solder contacts may have a solder containing gallium.

[0060] Example 12 can include a socket assembly. The socket assembly can have multiple pins configured to couple multiple electrical surface contacts arranged on a surface of a die package. The multiple solder contacts can provide an electrical path between individual pins of the multiple pins and between the electrical surface contacts of the multiple electrical surface contacts.

[0061] Example 13 can have the socket assembly of Example 12, wherein individual solder contacts are arranged from the multiple solder contacts on the surface of the corresponding individual pins of the multiple pins.

[0062] Example 14 can have the socket assembly of Example 13, wherein the individual solder contacts can be plated from the multiple soft solder contacts onto the corresponding individual pins of the multiple pins.

[0063] Example 15 can have the socket assembly of Example 13, wherein the individual solder contacts of the soft solder contacts can be formed by beads on the corresponding individual pins of the multiple pins.

[0064] Example 16 can include the socket assembly of Example 12, wherein individual solder contacts can be arranged from the multiple soft solder contacts onto corresponding electrical surface contacts of the housing.

[0065] Example 17 may include the socket assembly of Example 16, wherein each of the individual pins may have one or more pointed sections designed to penetrate the solder contact during coupling of the die housing to the socket assembly.

[0066] Example 18 can include the socket assembly of any of Examples 12 to 17, wherein the socket assembly is a land grid array socket assembly.

[0067] Example 19 can include a calculating device. The calculating device can include a printed circuit board. The calculating device can include a socket assembly coupled to the printed circuit board, wherein the socket assembly can have multiple pins configured to be electrically coupled to multiple of the electrical surface contacts arranged on a surface of a die package. The calculating device can also include the die package. The die package can include multiple electrical contacts configured to transmit electrical signals from a die of the die package and multiple solder contacts arranged to provide an electrical connection between the pins of the socket assembly and the multiple electrical contacts.

[0068] Example 20 can include the computing device of Example 19, wherein: the circuit board can be a mainboard and the computing device can be a mobile computing device, which may be one or more of a display, a touchscreen display, a touchscreen control device, a battery, an audio codec, a video codec, a power amplifier, a global positioning system (GPS) device, a compass, a Geiger counter, an accelerometer, a gyroscope, a loudspeaker or a camera coupled to a circuit board.

[0069] Example 21 may include the calculating device according to one of Examples 19 or 20, wherein the solder contacts may include a solder having a strain rate of 0.1 / second at a pressure of less than or equal to 70 MPa, or a solder having a strain rate of 0.0001 / second at a pressure of less than or equal to 30 MPa.

[0070] Example 22 may include a method. The method may include providing a socket assembly having multiple pins configured to be coupled to multiple electrical surface contacts arranged on a surface of an integrated circuit (IC) package assembly. The method may also include forming multiple solder contacts to provide an electrical path between individual pins of the multiple pins and between the electrical surface contacts of the multiple electrical surface contacts.

[0071] Example 23 may include the method of Example 22, wherein the formation of multiple solder contacts may include the formation of beads or the plating of individual solder contacts of the multiple solder contacts on the surface of corresponding individual pins of the multiple pins.

[0072] Example 24 may include the method of Example 22, wherein the formation of multiple solder contacts may include the application of individual solder contacts from the multiple solder contacts onto corresponding electrical surface contacts of the IC package assembly.

[0073] Example 25 may include the method of Example 24, wherein: The individual pins each have one or more pointed sections and the method further includes penetration into one or more corresponding solder contacts with one or more of the individual pins for coupling the IC package assembly to the socket assembly.

[0074] Various embodiments may include any suitable combination of the embodiments described above, including alternatives or embodiments of embodiments that are jointly and previously described (e.g., the "and" may be "and / or"). Furthermore, some embodiments may include one or more products (e.g., a non-volatile machine-readable medium) containing instructions stored thereon that, when executed, result in operations of one of the embodiments described above. Additionally, some embodiments may include devices or systems that provide any suitable means for performing the various operations of the embodiments described above.

[0075] It is not intended that the preceding description of illustrated embodiments, including the description of the summary, should be exhaustive or limit the embodiments of the present disclosure to the exact forms disclosed.

Claims

A package assembly (100, 300) for integrated circuits, an IC package assembly comprising: several electrical contacts (330) configured to transmit electrical signals of an integrated circuit; and several solder contacts (350) coupled to the electrical contacts (330) and arranged to couple directly to pins (208) of a socket assembly (104) to provide an electrical connection between the pins (208) of the socket assembly (104) and the several electrical contacts (330), wherein the solder contacts have a melting point between 55-80°C, and wherein the solder contacts provide electrical coupling between the pins and the several electrical contacts at load forces of less than 0.25 N. IC package assembly (100, 300) according to claim 1, wherein the solder contacts (350) comprise a solder having a strain rate of 0.1 / second at a pressure of less than or equal to 70 megapascals, MPa, or a solder having a strain rate of 0.0001 / second at a pressure of less than or equal to 30 MPa. IC package assembly (100, 300) according to claim 1, wherein the solder contacts have a solder comprising indium. IC package assembly according to claim 3, wherein the solder is a tin-indium-bismuth solder. IC package assembly (100, 300) according to claim 1, wherein the solder contacts (350) have a solder having one or more compounds whose oxides have a substantially low resistance. IC package assembly according to claim 1, further comprising the socket assembly, wherein the socket assembly is a Land Grid Array (LGA) socket assembly. IC package assembly according to claim 1, wherein the solder contacts comprise a solder containing gallium. A socket assembly (104) comprising several pins (208) configured to couple several electrical surface contacts (330) arranged on a surface of a die housing, wherein several solder contacts (350) provide an electrical path between individual pins (208) of the several pins and electrical surface contacts (330) of the several electrical surface contacts, wherein the solder contacts have a melting point between 55-80°C, and wherein the solder contacts provide electrical coupling between the pins and the several electrical surface contacts (330) at load forces of less than 0.25 N. Bushing assembly (104) according to claim 8, wherein individual solder contacts (350) of the multiple solder contacts are arranged on the surface of corresponding individual pins (208) of the multiple pins. Bushing assembly (104) according to claim 9, wherein the individual solder contacts (350) of the multiple solder contacts (350) are plated onto the corresponding individual pins (208) of the multiple pins. Bushing assembly (104) according to claim 9, wherein the individual solder contacts of the solder contacts (350) are formed by beads on the corresponding individual pins (208) of the multiple pins. Bushing assembly (104) according to claim 8, wherein the individual solder contacts (350) are arranged from the multiple solder contacts on corresponding electrical surface contacts of the electrical surface contacts of the die housing (100). Socket assembly (104) according to claim 12, wherein the individual pins (208) each have one or more pointed sections designed to penetrate the solder contact during coupling of the die housing with the socket assembly. Bushing assembly according to claim 8, wherein the bushing assembly is a land grid array bushing assembly. Computing device (800) comprising: a printed circuit board; a socket assembly coupled to the printed circuit board, the socket assembly having multiple pins configured to be electrically coupled to multiple electrical plane contacts arranged on a plane of a die housing, the socket assembly being a land-grid array socket assembly; and the die housing comprising: the multiple electrical plane contacts configured to transmit electrical signals from a die of the die housing, and multiple solder contacts arranged to provide an electrical connection between the pins of the socket assembly and the multiple electrical plane contacts, the solder contacts having a melting point between 55-80°C, and the solder contacts providing electrical coupling between the pins and the multiple electrical plane contacts at load forces of less than 0.25 N. Computing device (800) according to claim 15, wherein: the circuit board is a main board (802); and the computing device is a mobile computing device which may include one or more of a display, a touch-sensitive screen display, a touch-sensitive screen control device, a battery, a power amplifier, a global positioning system device, GPS, a compass, a Geiger counter, an accelerometer, a gyroscope, a loudspeaker or a camera coupled to the circuit board. Computing device (800) according to claim 15, wherein the solder contacts have a solder having a strain rate of 0.1 / second at a pressure of less than or equal to 70 MPa, or have a solder having a strain rate of 0.0001 / second at a pressure of less than or equal to 30 MPa. Method (700) comprising: providing (702) a socket assembly (104) having multiple pins configured to be coupled to multiple electrical surface contacts arranged on a surface of a package assembly of an integrated circuit (IC); forming (704) multiple solder contacts to provide an electrical path between individual pins of the multiple pins and electrical surface contacts of the multiple electrical surface contacts, wherein the solder contacts have a melting point between 55-80°C, and wherein the solder contacts provide electrical coupling between the pins and the multiple electrical surface contacts at load forces of less than 0.25 N. Method (700) according to claim 18, wherein forming multiple solder contacts (350) comprises forming beads or plating individual solder contacts of the multiple solder contacts on the surface of corresponding individual pins of the multiple of the pins. Method (700) according to claim 18, wherein forming multiple solder contacts comprises arranging individual solder contacts of the multiple solder contacts on corresponding electrical surface contacts of the IC package assembly. Method (700) according to claim 20, wherein: the individual pins each have one or more pointed sections; and the method further comprises penetrating one or more corresponding solder contacts with one or more of the individual pins (208) for coupling the IC package assembly with the socket assembly (104).

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