Adjustable gap structure for mobile devices

Abstract

Mobile device (100, 300), comprehensive: a cover (350); a printed circuit board (110, 310) comprising a processing component (120, 320), wherein the printed circuit board (110, 310) is movable along a first axis towards or away from the cover to provide an adjustable air gap (380); one or more ferromagnetic elements (335) coupled to the circuit board (110, 310); one or more magnets (130, 330); and an internal thermal solution (325); wherein in the first mode the one or more magnets (130, 330) attract the one or more ferromagnetic elements (335) and the air gap (380) of a first distance between the internal thermal solution (325) and the cover (350) is maintained, and wherein in a second mode an external magnetic force pulls the ferromagnetic elements (335) away from the one or more magnets (130, 330) and reduces the air gap (380) between the internal thermal solution (325) and the cover (350).

Description

TECHNICAL AREA

[0001] The embodiments described herein relate generally to the field of electronic devices and in particular to an adjustable gap structure for mobile devices. GENERAL STATE OF THE ART

[0002] The processing power of mobile devices, such as phones and tablet computers, has increased dramatically, while their form factor has generally decreased in size. As a result, the processing elements (such as a processor or system-on-a-chip (SoC)) of these devices can generate a considerable amount of heat. Since such devices typically come into contact with a user's skin, excessive heat generation can significantly impact user comfort. Consequently, the power consumed by such devices may need to be limited when used in handheld mode, which in turn limits the performance of the mobile devices themselves.

[0003] Users of mobile devices can experience some improvements in user experience and performance when operating a mobile device in a docked mode, where the device is generally not in contact with the user, without requiring any modifications to the device's form factor. While it is possible to adjust a mobile device's power and heat generation depending on its use, the extent of the performance increase is limited, and adaptive performance does not address the core problem of excessive heat generation by the processing elements.

[0004] US 2012 / 0 326 819 A1 describes a shielded magnetic fastening device having engagement and non-engagement configurations, comprising: at least one magnet; a first housing comprising ferromagnetic material attached to one side of the at least one magnet; a second housing comprising ferromagnetic material that can be functionally magnetically attached to the at least one magnet; and a release mechanism attached to either the first or the second housing to transfer the shielded magnetic fastening device from the engaged to the disengaged configuration.wherein the shielded magnetic fastening device is in the inset configuration when the at least one magnet provides a magnetic force that acts to hold the shielded magnetic fastening device in the inset configuration, and the shielded magnetic fastening device is in the outset configuration when it is not in the inset position.

[0005] US 2016 / 0239056A1 describes an electronic device with a multilayer heat reduction component. The device includes a number of integrated circuits and a first layer that is in contact with at least one of the integrated circuits to dissipate heat from at least one integrated circuit. The device also includes a second layer that is separated from the first layer by an air gap to reduce heat transfer between the first and second layers. The second layer is retractable to expose the first layer when docked to a station. The electronic device operates in a first mode when docked to a station and in a second mode when not docked to the station.

[0006] DE 20 2014 101 726 U1 describes a cover device comprising: a first cover which includes a transparent window in a specific part of the first cover; and a connecting part which is attached to a lateral end of the first cover and connects the first cover to an electronic device or a second cover of the electronic device; wherein an object which is to be detected by a sensor of the electronic device is attached to a specific part of the first cover. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] The embodiments described herein are shown in the figures of the accompanying drawings as examples and are not limited, with similar reference numerals denoting similar elements. Fig. Figure 1 is a representation of a mobile device with an adaptable slit structure according to one embodiment; Fig.Figure 2 is a representation of a docking mechanism with an external thermal solution for a docked device according to one embodiment; Fig. Figure 3 is a representation of a mobile device with an adjustable air gap mechanism according to one embodiment; Fig. Figure 4 is a representation of a cross-sectional view of a mobile device according to one embodiment; Fig. Figure 5 is a representation of a cross-sectional view of a mobile device and a mobile device docking station according to one embodiment; Fig. 6 is a representation of an embodiment of a mobile device according to an embodiment; Fig. Figure 7 is a cross-sectional view of a mobile device according to one embodiment; and Fig. Figure 8 shows a cross-sectional view of a mobile device and a mobile device docking station according to one embodiment. DETAILED DESCRIPTION

[0008] The problem underlying the invention is solved by the subject matter of the independent claims. Further advantageous embodiments are specified in the dependent claims.

[0009] The embodiments described herein generally relate to an adjustable gap structure for mobile devices.

[0010] For the purposes of this description, the following terms mean the following:

[0011] “Mobile electronic device” or “mobile device” means a smartphone, smartwatch, tablet computer, notebook or laptop, portable computer, mobile internet device, portable technology or other mobile electronic device that has processing capabilities.

[0012] In some embodiments, a device, system, or process provides an adjustable gap structure for mobile devices. In some embodiments, the adjustable gap structure adapts to the size of an air gap depending on the current mode or operating condition.

[0013] Since mobile devices can operate in, for example, a handheld mode (a primary mode) or a docking mode (a secondary mode when the device is in a docking mechanism), the operation of a mobile device in docking mode can be modified to provide additional power. However, to achieve a significant power increase in a mobile device during docking mode, an additional physical thermal solution is required in docking mode (where a thermal solution is any element to dissipate heat from a component).

[0014] In handheld operation, maintaining a sufficient air gap between the processing element and the back cover is crucial to prevent heat transfer directly to the back cover, which may be in contact with the user's skin. However, in docking mode, where an additional thermal solution dissipates heat from the back of the phone or tablet, the intended air gap in the mobile device becomes a critical resistance on the thermal path from a processing element (such as a SoC) to the additional external thermal solution. In this situation, if the power required for docking is increased, with the resulting increase in heat generated by the SoC, the SoC may reach a maximum junction temperature (the highest operating temperature for semiconductors within a device) before the mobile device can achieve a significant performance increase.

[0015] In some embodiments, a mobile device has an adjustable gap structure to provide both a sufficient air gap for ease of operation in a handheld mode or state, and to reduce (or eliminate) the air gap in a docking mode to allow increased heat transfer to an external thermal solution (e.g., a thermal solution of a device docking mechanism) and, as a result, provide improved performance in docking mode.

[0016] In some embodiments, a mobile device includes a force element or means for exerting a force to provide an adjustable air gap for a processing element. In some embodiments, the force element or means includes one or more magnets to provide an adjustable air gap for the processing element, the magnets operating such that they maintain a first air gap in a first state or mode (a handheld device mode) and allow reduction to a second air gap in a second state or mode (a docking mode).

[0017] In some embodiments, external magnetism, such as magnetism within a docking mechanism (using a permanent magnet) or generated by an electromagnet (using an electromagnet), can be used to overcome the magnetic force of one or more magnets of the mobile device, thereby reducing or eliminating the air gap in a docking mode. In other words, when a mobile device is detached from a docking mechanism containing an external magnetic source, the mobile device is in a first state or mode, and when the mobile device is brought into contact with the docking mechanism, it enters a second state or mode. In some embodiments, the magnets of a mobile device are smaller or less powerful than the magnet(s) of a docking mechanism.

[0018] In an alternative embodiment, a mobile device may include another or additional element or means for exerting a force to maintain an air gap within the mobile device. In some embodiments, the mobile device may include a spring or elastic mechanism in addition to, or as an alternative to, the one or more magnets. In some embodiments, the spring or elastic mechanism serves to provide, or assist in providing, the adjustable air gap for a processing element.

[0019] In some embodiments, a docking mechanism further includes a thermal solution (referred to here as an external thermal solution for the mobile device) to dissipate heat from the processing element of the mobile device through a cover or side of the mobile device.

[0020] In some embodiments, a docking mode further features a power increase through a mobile device. In some embodiments, a mobile device can detect the connection of the mobile device to a docking mechanism, and the mobile device can enable the power increase upon detection of such a connection. In an alternative embodiment, a mobile device can have one or more sensors to detect whether the processing element has been moved to reduce the air gap, and the mobile device can enable the power increase when the one or more sensors have indicated a successful reduction of the air gap. In some embodiments, a mobile device can operate in a first mode at a first power level and in a second mode at a second power level, the second power level being higher than the first power level.

[0021] In some embodiments, a mobile device has one or more metal brackets or other ferromagnetic elements that are attracted by the one or more magnets of the mobile device. In some embodiments, the attraction between the one or more magnets and the one or more ferromagnetic elements serves to maintain the air gap in a first mode (a handheld device mode).In a particular embodiment, the one or more magnets are in contact with the one or more ferromagnetic elements when the mobile device is in the first state or mode, and the one or more magnets are separated from the one or more ferromagnetic elements when the mobile device is in the second state or mode, with the external magnetic force being applied to pull the one or more ferromagnetic elements away from the one or more magnets of the mobile device. However, embodiments are not limited to this particular physical implementation.

[0022] In some embodiments, a processing element (which in certain implementations may include an integrated thermal solution) is installed on a mainboard or other printed circuit board (PCB). The application may be driven by an external magnet to pull the brackets of the mainboard or other PCB toward an external cover or panel of the mobile device, thereby reducing the air gap and improving heat dissipation away from the processing component. In some embodiments, for example, the processing component is positioned closer to an LCD touchscreen when in handheld mode and closer to a rear cover of the mobile device when in docking mode.

[0023] In some embodiments, a mobile device has a guide pin or similar element to limit the movement of a mainboard or other printed circuit board to ensure that the mainboard or other PCB moves only along a z-axis (perpendicular to a surface of the mainboard or other structure).

[0024] In some embodiments, the mobile device has a simple and cost-effective structure that can maintain a substantial air gap in handheld mode and reduce or eliminate the air gap in docking mode to increase heat conduction and enable enhanced performance.

[0025] In some embodiments, adjustable gap elements can also be implemented in another embodiment, such as a snap-on mobile phone or tablet case that includes one or more magnets and an external thermal solution. With an embedded heat conductor and heat spreader in a case, the user can, for example, achieve higher performance and a better experience in a specific mode where the mobile device is used inside the case. In some embodiments, the cover or case can also provide insulation between the device cover and the user's skin.

[0026] Fig.Figure 1 is a representation of a mobile device with a customizable gap structure according to one embodiment. In some embodiments, the mobile device 100 has a mainboard or other structure 110 containing one or more processing components (such as a SoC). In some embodiments, the mobile device further comprises one or more magnets 130 (where the connection of the magnets in Fig. (not shown in Figure 1). In some embodiments, the main board has one or more brackets or other ferromagnetic elements, and the magnets maintain the air gap by attracting the ferromagnetic elements of the main board to the one or more magnets 130.

[0027] In some embodiments, the mainboard provides one degree of freedom within the mobile device 100, with the magnets 130 constraining and controlling the mainboard position. In some embodiments, one or more screws in the structure of a mobile device are replaced by one or more guide pins together with pairs of metal brackets and magnets to constrain the mainboard within the mobile device 100.

[0028] In some embodiments, the mobile device 100 may have another or additional element or means for exerting a force to maintain an air gap in the mobile device 100. In some embodiments, the mobile device 100 may have a spring or an elastic mechanism in addition to or as an alternative to the one or more magnets 130.

[0029] Fig.Figure 2 is a representation of a docking mechanism with an external thermal solution for a docked device according to one embodiment. In some embodiments, a mobile device docking station 200 has one or more magnets 230, wherein the magnets provide a stronger magnetic force than the magnets inside the mobile device. In some embodiments, the mobile device docking station further comprises an external thermal solution 225 for a docked mobile device. In some embodiments, the external thermal solution 225 may further comprise a fan to direct cooling air onto the mobile device. The docking station 200 may further comprise a docking base 280 or a similar element to hold a mobile device and simultaneously provide a power and signal interface, including a connection to a power source 285.However, the embodiments are not limited to this structure and can include a docking mechanism with, for example, an inductive charging station in which the mobile device can be charged when placed on a charging station.

[0030] Fig. Figure 3 is a representation of a mobile device with an adjustable air gap mechanism according to one embodiment. As shown, a mobile device 300 can have a mainboard 310 with a system-on-chip 320. In some embodiments, the system-on-chip optionally includes a thermal solution 325. An air gap for the mainboard 310 is maintained by one or more pairs of brackets and magnets 330. The mobile device 300 further includes, for example, a second circuit board 340 and a battery 345. Fig. Figure 3 shows a cross-section through the mobile device (A) that is in Fig. 4 and Fig. 5 is shown.

[0031] Fig.Figure 4 is a cross-sectional view of a mobile device according to one embodiment. In some embodiments, a mobile device 300 has a mainboard 310 having a plurality of ferromagnetic brackets 335, the brackets being held by magnets 330 to maintain an air gap between an optional thermal solution 325 of a system-on-chip 320 and a rear cover 350 of the mobile device 300. (The illustration of the mobile device without the thermal solution is shown in Figure 4.) Fig.7 provided). In some embodiments, the mobile device 300 further comprises one or more guide pins 355 to control movement of the mainboard 310 in a single degree of freedom along a z-axis. An LCD touchscreen 370 is also shown, in which the mainboard 310 is held near the touchscreen 370 in handheld mode. In certain embodiments, the rear cover 350 may have a porous cover to allow cooling by airflow.

[0032] Table 1 shows example values ​​for the in Fig. 5 provided representations: Table 1 Handheld mode SoC magnet rear cover 0,8 rear cover 0,8 gap 0,8 gap 0 Iron 0,5 Thermal L. 0,3 gap 0,8 gap 0,5 Inner frame 0,9 SoC 1,4 magnet 2,5 PCB 0,6 gap 1,1 gap 1,4 Inner frame 0,8 LCD with touchscreen 2,2 Front lens 0,6 IN TOTAL 8 IN TOTAL

[0033] Fig.Figure 5 shows a cross-sectional view of a mobile device and a mobile device docking station according to one embodiment. As shown, the mobile device 300 has a mainboard 310 which has a plurality of ferromagnetic brackets 335. In this illustration, the brackets are no longer constrained by the magnets 330, the air gap between the thermal solution 325 of the system-on-chip 320 and the rear cover 350 of the mobile device 300 is now reduced or eliminated, and the mainboard moves away from the LCD touchscreen 370 and toward the rear cover 350 following the path enabled by the one or more guide pins 355.

[0034] In some embodiments, a docking station 400 includes a thermal solution 425 to provide additional cooling for the SoC 320 of the mobile device 300. In some embodiments, the docking station further includes one or more magnets (permanent or electromagnets) 430, the magnets serving to overcome the magnetic attraction of the magnets 330 and to draw the brackets 335 and the mainboard to the rear cover 350 of the mobile device. In some embodiments, the thermal solution 425 may further include a fan to direct cooling air onto the mobile device.

[0035] Table 2 shows example values ​​for the in Fig. 5 provided representations: Table 2 Docking mode SoC magnet rear cover 0,8 rear cover 0,8 gap 0 gap 0,8 Iron 0,5 Thermal L. 0,3 gap 0 gap 0,5 Inner frame 0,9 SoC 1,4 magnet 2,5 PCB 0,6 gap 1,1 gap 2,2 Inner frame 0,8 LCD with touchscreen 2,2 Front lens 0,6 IN TOTAL 8 IN TOTAL

[0036] Comparing the phone mode and docking mode stacks, the gap between the rear cover and the thermal solution is reduced from 0.8 mm to 0 mm, and the gap between the LCD touchscreen and the PCB (mainboard) is increased from 1.4 mm to 2.2 mm. Changing the gap distances between phone mode and docking mode can provide at least two advantages: (1) The eliminated gap between the rear cover and the thermal solution can significantly reduce the thermal resistance between the SoC and the rear cover and thermal solution in the docking station to remove additional heat from the SoC at high power. (2) The larger gap between the LCD touchscreen and the PCB may increase the thermal resistance between these elements and reduce the impact on the LCD screen temperature while the SoC is operating in a high-performance state.

[0037] Fig.Figure 6 is a representation of an embodiment of a mobile device according to an embodiment. Certain standard and technically known components that are not relevant to the present description are not shown in this representation. Elements shown as separate elements can be combined, including, for example, a system-on-chip (SoC) that combines a multitude of elements on a single chip.

[0038] In some embodiments, the mobile device 605 has a mainboard or other structure 675 that provides an adjustable gap, as in Fig. 1, 3 to 5 and 7 to 8 are shown.

[0039] In some embodiments, the mobile device 605 includes processing means, such as one or more processors or a SoC 610, coupled to one or more buses or intermediate connections, generally shown as bus 665. In some embodiments, the processors may include one or more general-purpose or specialized processors. Bus 665 may be a communication means for transmitting data. For simplicity, bus 665 is shown as a single bus, but it can represent numerous different intermediate connections or buses, and the component connections to such intermediate connections or buses may vary. The in Fig. The bus 665 shown in Figure 6 is an abstraction representing one or more separate physical buses, point-to-point connections, or both, connected by appropriate bridges, adapters, or controllers.

[0040] In some embodiments, the mobile device 605 further comprises random-access memory (RAM) or other dynamic storage device or element as a main working memory 615 for storing information and instructions to be executed by the processors 610. The main working memory 615 may, but is not limited to, dynamic random-access memory (DRAM). The mobile device 605 may also include non-volatile memory (NVM) 620; a storage device such as a solid-state drive (SSD) 625; and read-only memory (ROM) 630 or other static storage device for storing static information and instructions for the processors 610.

[0041] In some embodiments, the mobile device 605 has one or more transmitters or receivers 640 coupled to the bus 665 to provide wired or wireless communications. In some embodiments, the mobile device 605 may have one or more antennas 644, such as dipole or monopole antennas, for transmitting and receiving data via wireless communication using a wireless transmitter, receiver, or both, and one or more connectors 642 for transmitting and receiving data via wired communication. Wireless communication includes, but is not limited to, WLAN, Bluetooth™, near field communication, and other wireless communication standards.

[0042] In some embodiments, the mobile device 605 has one or more input devices 650 for inputting data, including hard and soft buttons, a joystick, a mouse or other pointing device, a keyboard, a voice command system or a gesture recognition system.

[0043] In some embodiments, the mobile device 605 includes an output display 655, wherein the display 655 may be a liquid crystal display (LCD) or any other display technology for showing information or content to a user. In some environments, the display 655 may include a touchscreen, which may also be used as at least part of an input device 650. The output display 655 may further include an audio output, comprising one or more speakers, audio output jacks, or other audio and other output to the user.

[0044] The mobile device 605 can also include a battery or other energy source 660, which may comprise a solar cell, a fuel cell, a charged capacitor, an inductive near-field coupling, or another system or device for providing or generating energy in the mobile device 605. The energy provided by the energy source 660 can be distributed to elements of the mobile device 605 as needed.

[0045] Fig. Figure 7 is a cross-sectional view of a mobile device according to one embodiment. In contrast to the illustration from Fig. 4 delivers Fig. 7 a representation without internal thermal solution.

[0046] In some embodiments, a mobile device 300 has a mainboard 310 having a plurality of ferromagnetic brackets 335, the brackets being held by magnets 330 to maintain an air gap between a system-on-chip 320 and a rear cover 350 of the mobile device 300. In some embodiments, the mobile device 300 further has one or more guide pins 355 to control movement of the mainboard 310 in a single degree of freedom along a z-axis. An LCD touchscreen 370 is also shown, in which the mainboard 310 is held near the touchscreen 370 in handheld mode. In certain embodiments, the rear cover 350 may have a porous surface to allow cooling by airflow.

[0047] Fig.Figure 8 shows a cross-sectional view of a mobile device and a mobile device docking station according to one embodiment. In contrast to the illustration from Fig. 5 delivers Fig. 8 a representation without internal thermal solution.

[0048] As shown, the mobile device 300 has a mainboard 310 which has the plurality of ferromagnetic brackets 335. In this illustration, the brackets are no longer limited by the magnets 330, the air gap between the system-on-chip 320 and the rear cover 350 of the mobile device 300 is now reduced or eliminated, and the mainboard moves away from the LCD touchscreen 370 and towards the rear cover 350, following the path enabled by the one or more guide pins 355.

[0049] In some embodiments, a docking station 400 includes a thermal solution 425 to provide additional cooling for the SoC 320 of the mobile device 300. In some embodiments, the docking station further includes one or more magnets (permanent or electromagnets) 430, the magnets serving to overcome the magnetic attraction of the magnets 330 and to draw the brackets 335 and the mainboard to the rear cover 350 of the mobile device. In some embodiments, the thermal solution 425 may further include a fan to direct cooling air onto the mobile device.

[0050] The above description presents numerous specific details for explanatory purposes, in order to provide a thorough understanding of the described embodiments. However, it will be obvious to those skilled in the art that the embodiments can be implemented in practice without some of these specific details. In other cases, well-known structures and devices are presented in block diagram form. An intermediate structure may exist between the components shown. The components described or illustrated here may have additional inputs or outputs that are not shown or described.

[0051] Different embodiments can feature different processes. These processes can be carried out by hardware components or can be embodied in computer programs or machine-executable instructions that can be used to instruct a general-purpose or special-purpose processor or logic circuits programmed with the instructions to perform the processes. Alternatively, the processes can be carried out by a combination of hardware and software.

[0052] Components of various embodiments may be provided as a computer program product, which may include a computer-readable medium on which computer program instructions are stored. These instructions can be used to program a computer (or other electronic devices) to execute, by one or more processors, a process according to certain embodiments. The computer-readable medium may include, but is not limited to, magnetic drives, optical disks, compact disk read-only memory (CD-ROM) and magneto-optical drives, read-only memory (ROM), random access memory (RAM), erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), magnetic cards or optical cards, flash memory, or other types of computer-readable media suitable for storing electronic instructions.Furthermore, embodiments can also be downloaded as a computer program product, whereby the program can be transferred from a remote computer to a retrieving computer.

[0053] Many of the methods are described in their most basic form, but processes can be added to or removed from any of the methods, and information can be added to or subtracted from any of the described messages without departing from the basic scope of the present embodiments. It is apparent to the person skilled in the art that many further modifications and variations are possible. The specific embodiments are provided not to limit the concept, but to illustrate it. The scope of the embodiments is not determined by the specific examples provided above, but solely by the claims below.

[0054] If an element "A" is coupled to or associated with an element "B", element A can be directly coupled to element B or indirectly, for example, through element C. If the specification or claims state that a component, function, structure, process, or feature A "causes / results in / causes" a component, function, structure, process, or feature B, this means that "A" is at least a partial cause of "B," but that at least one other component, function, structure, process, or feature may also contribute to causing / resulting in / causing "B." If the specification states that a component, function, structure, process, or feature "may" or "could" be included, this specific component, function, structure, or feature is not necessarily included.If the specification or claim refers to "one" element, this does not mean that there is only one of the described elements.

[0055] An embodiment is an implementation or an example. A reference in the description to "an embodiment," "some embodiments," or "other embodiments" means that a particular feature, structure, or property described in connection with the embodiment is included in at least some, but not necessarily all, embodiments. The various manifestations of "an embodiment" or "some embodiments" do not necessarily all refer to the same embodiments. It should be appreciated that in the preceding description of embodiments, various features are sometimes grouped in a single embodiment, figure, or description thereof in order to keep the disclosure concise and to contribute to a better understanding of one or more of the various novel aspects.This method of disclosure, however, should not be interpreted as reflecting a purpose that the claimed embodiments require more features than those expressly cited in each claim. Rather, the novel aspects, as reflected in the following claims, lie in fewer than all the features of a single embodiment disclosed above. Therefore, the following claims are hereby expressly included in the detailed description, each claim representing a separate embodiment.

[0056] In some embodiments, a mobile device comprises: a cover; a printed circuit board (PCB) having a processing component, wherein the PCB is movable along a first axis toward or away from the cover to provide an adjustable air gap; one or more ferromagnetic elements coupled to the PCB; and one or more magnets. In some embodiments, in the first mode, the one or more magnets attract the one or more ferromagnetic elements, maintaining an air gap of a first distance between the thermal solution and the cover, and in a second mode, an external magnetic force pulls the ferromagnetic elements away from the one or more magnets, reducing the air gap between the thermal solution and the cover.

[0057] In some embodiments, one or more ferromagnetic elements have metal brackets.

[0058] In some embodiments, the mobile device further includes one or more guide pins for limiting the movement of the circuit board to movement along the first axis.

[0059] In some embodiments, the first mode is a handheld mode and the second mode is a docking mode.

[0060] In some embodiments, the mobile device can be operated in the first mode at a first power level and in the second mode at a second power level, the second power level being higher than the first power level.

[0061] In some embodiments, the air gap is eliminated in the second mode.

[0062] In some embodiments, the mobile device also features an internal thermal solution coupled with the processing component.

[0063] In some versions, the mobile device is a smartphone.

[0064] In some embodiments, the mobile device switches to the second mode when it comes into contact with a docking mechanism.

[0065] In some embodiments, the docking mechanism includes an external thermal solution for the mobile device; and one or more magnets to provide the external magnetic force to overcome a magnetic force provided by the one or more magnets of the mobile device.

[0066] In some embodiments, the method involves operating a mobile device in a first mode, wherein the mobile device has one or more magnets to maintain an air gap of a first distance in the mobile device; and transitioning the mobile device into a second mode in response to an external magnetic field that overcomes a magnetic force of the one or more magnets and reduces the air gap to a second distance.

[0067] In some embodiments, the method involves operating the mobile device at a first power level in the first mode; and operating the mobile device at a second power level in the second mode, wherein the second power level is higher than the first power level.

[0068] In some embodiments, the air gap is eliminated in the second mode.

[0069] In some embodiments, reducing the air gap to the second distance allows for improved cooling of the mobile device through an external thermal solution.

[0070] In some embodiments, the mobile device further comprises a printed circuit board and one or more ferromagnetic elements coupled to the printed circuit board, wherein the printed circuit board is movable along a first axis in the direction of or away from the cover to provide an adjustable air gap; and maintaining the air gap of the first distance in the mobile device involves exerting a magnetic force on the one or more ferromagnetic elements by the one or more magnets.

[0071] In some embodiments, the first mode is a handheld mode and the second mode is a docking mode.

[0072] In some embodiments, a smartphone has a cover comprising: a rear cover on a first side; a touchscreen display on a second side, the second side being opposite the first side; a printed circuit board comprising a processing component, the printed circuit board being movable along a first axis towards or away from the rear cover to provide an adjustable air gap; one or more ferromagnetic elements coupled to the printed circuit board; and a force element to exert a force on the printed circuit board to pull the printed circuit away from the rear cover.In some embodiments, in the first mode the force element maintains an air gap of a first distance between the thermal solution and the cover, and in a second mode an external magnetic force pulls the ferromagnetic elements away from the one or more magnets and reduces the air gap between the thermal solution and the cover.

[0073] In some embodiments, the force element has one or more magnets for providing a magnetic force to the one or more ferromagnetic elements.

[0074] In some embodiments, the force element includes a spring or an elastic element for exerting a physical force on the circuit board.

[0075] In some embodiments, the smartphone can be operated in the first mode at a first performance level and in the second mode at a second performance level, with the second performance level being higher than the first performance level.

[0076] In some embodiments, the first mode is a handheld mode and the second mode is a docking mode.

Claims

Mobile device (100, 300) comprising: a cover (350); a printed circuit board (110, 310) having a processing component (120, 320), wherein the printed circuit board (110, 310) is movable along a first axis towards or away from the cover to provide an adjustable air gap (380); one or more ferromagnetic elements (335) coupled to the printed circuit board (110, 310); one or more magnets (130, 330); and an internal thermal solution (325);wherein in the first mode the one or more magnets (130, 330) attract the one or more ferromagnetic elements (335) and the air gap (380) of a first distance between the internal thermal solution (325) and the cover (350) is maintained, and wherein in a second mode an external magnetic force pulls the ferromagnetic elements (335) away from the one or more magnets (130, 330) and reduces the air gap (380) between the internal thermal solution (325) and the cover (350). Mobile device (100, 300) according to claim 1, wherein one or more ferromagnetic elements (335) comprise metal brackets (335). Mobile device (100, 300) according to claim 1, further comprising one or more guide pins (355) for limiting the movement of the circuit board (110, 310) to a movement along the first axis. Mobile device (100, 300) according to claim 1, wherein the first mode is a handheld mode and the second mode is a docking mode. Mobile device (100, 300) according to claim 1, wherein the mobile device (100, 300) is operated in the first mode with a first power level and in the second mode with a second power level, wherein the second power level is higher than the first power level. Mobile device (100, 300) according to claim 1, wherein the air gap (380) is eliminated in the second mode. Mobile device (100, 300) according to claim 1, wherein the mobile device (100, 300) is a smartphone (100, 300). Mobile device (100, 300) according to claim 1, wherein the mobile device (100, 300) enters the second mode when the mobile device (100, 300) is in contact with a docking mechanism (200). Mobile device (100, 300) according to claim 8, wherein the docking mechanism (200) comprises: an external thermal solution (225) for the mobile device (100, 300); and one or more magnets (230) to provide the external magnetic force to overcome a magnetic force provided by the one or more magnets (230) of the mobile device (100, 300). Method comprising: operating a mobile device (100, 300) in a first mode, wherein the mobile device (100, 300) has one or more magnets (130, 330) to maintain an air gap (380) of a first distance in the mobile device; and transitioning the mobile device (100, 300) into a second mode in response to an external magnetic field which overcomes a magnetic force of the one or more magnets (130, 330) and reduces the air gap (380) to a second distance. The method according to claim 10, further comprising: operating the mobile device (100, 300) at a first power level in the first mode; and operating the mobile device (100, 300) at a second power level in the second mode, wherein the second power level is higher than the first power level. Method according to claim 10, wherein the air gap (380) is eliminated in the second mode. Method according to claim 10, wherein reducing the air gap (380) to the second distance enables improved cooling of the mobile device (100, 300) by an external thermal solution (225). Method according to claim 10, wherein: the mobile device (100, 300) further comprises a printed circuit board (110, 310) and one or more ferromagnetic elements (335) coupled to the printed circuit board (110, 310), the printed circuit board (110, 310) being movable along a first axis towards or away from a cover (350) to provide the adjustable air gap (380); and maintaining the air gap (380) of the first distance in the mobile device (100, 300) involves exerting a magnetic force on the one or more ferromagnetic elements (335) by the one or more magnets (130, 330). Method according to claim 10, wherein the first mode is a handheld device mode and wherein the second mode is a docking mode. Smartphone (100, 300), comprising: a cover with a rear cover (350) on a first side; a display screen (370) with touch operation on a second side, the second side being opposite the first side; a printed circuit board (110, 310) having a processing component (120, 320), the printed circuit board (110, 310) being movable along a first axis towards or away from the rear cover (350) to provide an adjustable air gap (380); one or more ferromagnetic elements (335) coupled to the printed circuit board (110, 310); a force element (130, 330) for exerting a force on the printed circuit board (110, 310) to pull the printed circuit board (110, 310) away from the rear cover; and an internal thermal solution (325);wherein in the first mode the force element (130, 330) maintains an air gap of a first distance between the internal thermal solution (325) and the rear cover (350) and wherein in a second mode an external magnetic force pulls the ferromagnetic elements (335) away from the force element (130, 330) and reduces the air gap (380) between the internal thermal solution (325) and the rear cover (350). Smartphone (100, 300) according to claim 16, wherein the force element (130, 330) has one or more magnets (130, 330) for exerting a magnetic force on the one or more ferromagnetic elements (335). Smartphone (100, 300) according to claim 16, wherein the force element comprises a spring or an elastic element for exerting a physical force on the circuit board (110, 310). Smartphone (100, 300) according to claim 16, wherein the smartphone (100, 300) is operated in the first mode with a first power level and in the second mode with a second power level, wherein the second power level is higher than the first power level. Smartphone (100, 300) according to claim 16, wherein the first mode is a handheld mode and the second mode is a docking mode.

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