Substrate working device and component assembly device

Abstract

Substrate working device (100) comprising: a working unit (4) that performs work on a substrate (P) on which a component (31) is mounted; an image transmitter (7, 44) that is capable of imaging a correction mark (81, 82) for position correction; and a marker projector (8, 8a, 8b) that projects the correction marker (81, 82), wherein the correction marker (81, 82) comprises a first correction marker (81) and a second correction marker (82), the image transmitter (7, 44) comprises a first image transmitter (7) focused at a first height (H1, H11) and a second image transmitter (44) focused at a second height (H2, H12) different from the first height (H1, H11), the marker projector (8, 8a, 8b) projects the first correction marker (81) onto the first height (H1, H11) and projects the second correction marker (82) onto the second height (H2, H12), and the marker projector (8, 8a, 8b) has a first projection target (831,861), which is projected as the first correction mark (81), a second projection target (832, 871) which is projected as the second correction mark (82), and a lens unit (84) which projects the first projection target (831, 861) as the first correction mark (81) onto the first height (H1, H11) and projects the second projection target (832, 871) as the second correction mark (82) onto the second height (H2, H12).

Description

Technical FieldThe present invention relates to a substrate working device and a component mounting device, and more particularly, it relates to a substrate working device and a component mounting device including correction marks for position correction.General State of the ArtGenerally, a component mounting apparatus including correction marks for position correction is known. Such a component mounting device is disclosed, for example, in the international publication WO 2015 / 181 905 A1.International Publication WO 2015 / 181 905 A1 described above discloses a component mounting apparatus including a head unit that mounts components on a substrate, base cameras and a scanning camera capable of imaging correction marks for position correction, rod-like members on which the correction marks to be imaged by the base cameras are disposed, and mark projectors that project the correction marks to be imaged by the scanning camera. In this component mounting apparatus, the correction marks disposed on the rod-like members and the correction marks projected from the mark projectors are disposed at different heights from each other, corresponding to the focus heights of the base cameras and the focus height of the scanning camera.JP H04-144 300 A describes an apparatus and a method for position correction. A base plate is horizontally moved around an axis by a movable table and is stopped at the position below a machining head. At this time, the moving amount of the base plate is measured with a linear scale and is output to a control device. At the same time, a reference position mark is photographed by a second camera attached to the side surface of the machining head. At this time, the second camera also simultaneously photographs a second mark for alignment of a second reference position, which is attached to the surface of a transparent film or glass attached to the side surface of the processing head, and the photographed second mark is sent to the control device. JP 4 343 710 B2 describes a surface mounting machine. A suction nozzle for sucking a mounting part is provided. A reference mark is attached to a head unit. A camera is provided for photographing the mounting part and the reference mark. The focusing position of the camera is positioned at a height substantially flush with the mounting surface of a circuit board for mounting the mounting part. The reference mark is located at a higher position than the fixing member, where it is highest in its mounted state on the circuit board. An objective is provided for setting the focusing of the camera on the reference mark.JP 2005-11 950 A describes a surface mounting machine including a movable head unit provided with a mounting head for attracting components, and an imaging unit for obtaining the image of the state of attraction of the components. Before component mounting, the component to be attracted by the mounting head and the mark provided on the head unit are imaged simultaneously to recognize the image of the state of attraction of the component. The head unit is provided with illumination means for the mark for the backlight by radiating the light of the LED from the back side of the mark.JP 2008-227 400 A describes an electronic component mounting apparatus which holds the electronic component by means of a nozzle fixed to the tip of a shaft which is slidable forward and backward in the vertical direction on a transfer head to mount the electronic component at a target position. The apparatus comprises an imaging means for recognizing a specific position of a mounting object and a driving means for driving the imaging means forward and backward in the vertical direction. These two means are arranged on the transfer head. Further, the apparatus has means for maintaining the relative horizontal position displacement with respect to a vertical position of the imaging means obtained at the time when the imaging means is moved forward and backward in the vertical direction by the driving means.Summary of the InventionProblems to be Solved by the InventionIn the component mounting apparatus disclosed in the above-described International Publication WO 2015 / 181 905 A1, in order to arrange a plurality of correction marks at the different heights, it is necessary to provide the rod-like members and the mark projectors. Therefore, as the number of components increases, the structure of the component mounting device becomes complicated. In addition, spaces are provided in which both the rod-like members and the marker projectors are disposed, and thus the size of the component mounting apparatus increases. Therefore, it is desirable to simplify the structures of a substrate working device and a component mounting device in which a plurality of correction marks are arranged at different heights, and to miniaturize the substrate working device and the component mounting device.The present invention has been proposed to solve the aforementioned problems, and an object of the present invention is to provide a substrate working device and a component mounting device in which a plurality of correction marks are arranged at different heights, each having a simplified structure and decreasing in size.means for achieving the objectsThe problem of the present invention is solved by a substrate working apparatus and a component mounting apparatus having the features disclosed in independent claims 1 and 10.Further embodiments are defined in the dependent claims. A substrate working apparatus according to a first aspect of the present invention includes a working unit that performs work on a substrate on which a component is mounted, an imager capable of imaging a correction mark for position correction, and a mark projector that projects the correction mark, wherein the correction mark includes a first correction mark and a second correction mark, the imager includes a first imager focused at a first height and a second imager focused at a second height different from the first height, and the mark projector projects the first correction mark to the first height and projects the second correction mark to the second height.As described above, the substrate working apparatus according to the first aspect of the present invention includes the mark projector that projects the first correction mark to the first height and projects the second correction mark to the second height different from the first height. Thus, an element arranging the first correction mark and an element arranging the second correction mark can be provided as a common mark projector, and thus an increase in the number of components can be substantially reduced or prevented. Consequently, it is possible to simplify the structure of the substrate working apparatus in which a plurality of correction marks are arranged at different heights, and to miniaturize the substrate working apparatus. Note that the mark projector is not limited to a structure that projects an image by emitting light from an illuminator, but the mark projector also includes a structure that projects an image without an illuminator that emits light.In the aforementioned substrate working apparatus according to the first aspect, the mark projector includes a first projection target projected as the first correction mark, a second projection target projected as the second correction mark, and a lens unit projecting the first projection target as the first correction mark to the first height and projecting the second projection target as the second correction mark to the second height. According to this structure, the lens unit projects the first projection target so that the first correction mark can be easily projected, and the lens unit projects the second projection target so that the second correction mark can be easily projected.In the aforementioned structure in which the mark projector includes the first projection target, the second projection target, and the lens unit, the first projection target is preferably disposed farther from the lens unit than the second projection target in an optical axis direction of the lens unit. According to this structure, the height of the first correction mark and the height of the second correction mark can be easily made different from each other.In this case, the mark projector preferably includes a transparent member having a flat plate shape and including a pair of flat surfaces facing each other in the optical axis direction of the lens unit, wherein the first projection target is preferably disposed on one of the flat surfaces of the transparent member, and the second projection target is preferably disposed on the other of the flat surfaces of the transparent member. According to this structure, the first projection target and the second projection target can be provided on a transparent member, and thus an increase in the number of components can be further significantly reduced or prevented. Consequently, it is possible to miniaturize the marker projector and simplify the structure thereof, and thus it is possible to further miniaturize the substrate working apparatus and simplify the structure thereof.In the aforementioned structure in which the mark projector includes the first projection target, the second projection target, and the lens unit, the first projection target is preferably disposed such that an optical axis of the lens unit passes substantially through a center of the first projection target, and the second projection target is preferably disposed such that the optical axis of the lens unit passes substantially through a center of the second projection target. According to this structure, distortion of the projected first correction mark and second correction mark can be substantially reduced or prevented, and thus accurate position correction can be performed using the first correction mark and the second correction mark.In the aforementioned structure in which the mark projector includes the first projection target, the second projection target, and the lens unit, the first projection target and the second projection target preferably do not overlap each other as viewed in an optical axis direction of the lens unit. According to this structure, the projection of the first correction mark and the second correction mark in an overlapping manner can be substantially reduced or prevented, and thus the first correction mark and the second correction mark can be accurately recognized based on the imaging result by the imager.In the aforementioned structure in which the marker projector includes the first projection target, the second projection target, and the lens unit, the first projection target and the second projection target preferably have planar shapes different from each other. According to this structure, erroneous recognition of the first correction mark and the second correction mark imaged by the imager can be substantially reduced or prevented, and thus the first correction mark and the second correction mark can be accurately recognized.In the aforementioned structure in which the marker projector includes the first projection target, the second projection target, and the lens unit, one of the first projection target and the second projection target is preferably disposed inside the other of the first projection target and the second projection target, as viewed in an optical axis direction of the lens unit. According to this structure, the first projection target and the second projection target can be arranged on the optical axis, and thus distortion of the projected first correction mark and second correction mark can be substantially reduced or prevented. Moreover, the first projection target and the second projection target can be made compact, and thus the marker projector can be miniaturized.In the aforementioned structure in which the marker projector includes the first projection target, the second projection target, and the lens unit, the marker projector further includes an illuminator that emits light to the first projection target and the second projection target. According to this structure, the first correction mark and the second correction mark can be projected by emitting light to the first projection target and the second projection target, and thus the first correction mark and the second correction mark can be clearly projected.In the aforementioned substrate working apparatus according to the first aspect, preferably, the mark projector includes a pair of mark projectors provided at a predetermined interval in a horizontal direction. According to this structure, the correction marks may be disposed at two locations in the horizontal direction. Consequently, when distortion occurs in the working unit due to heat or the like, for example, a plurality of reference positions for the working unit can be recognized with the correction marks, and thus a positional deviation due to the distortion can be accurately corrected.In the aforementioned substrate working apparatus according to the first aspect, the imager includes the first imager focused at the first height and the second imager focused at the second height. Thus, the component or the like located at the first height is imaged by the first imager, so that position correction can be accurately performed, and the component or the like located at the second height different from the first height is imaged by the second imager, so that position correction can be accurately performed.A component mounting apparatus according to a second aspect of the present invention includes a mounting head unit mounting a component on a substrate, an imager capable of imaging a correction mark for position correction, and a mark projector projecting the correction mark, wherein the correction mark includes a first correction mark and a second correction mark, the imager includes a first imager focused at a first height and a second imager focused at a second height different from the first height, and the mark projector projects the first correction mark to the first height and projects the second correction mark to the second height. The mark projector includes a first projection target projected as the first correction mark, a second projection target projected as the second correction mark, and a lens unit projecting the first projection target as the first correction mark to the first height and projecting the second projection target as the second correction mark to the second height.As described above, the component mounting apparatus according to the second aspect of the present invention includes the mark projector that projects the first correction mark to the first height and projects the second correction mark to the second height different from the first height. Thus, an element arranging the first correction mark and an element arranging the second correction mark can be provided as a common mark projector, and thus an increase in the number of components can be substantially reduced or prevented. Consequently, it is possible to simplify the structure of the component mounting apparatus in which a plurality of correction marks are arranged at different heights, and to miniaturize the component mounting apparatus.In the aforementioned component mounting apparatus according to the second aspect, the mark projector is preferably provided on the mounting head unit, and preferably projects the first correction mark and the second correction mark downward. According to this structure, the component held by the mounting head unit can be imaged together with the first correction mark or the second correction mark, and thus the position of the component can be accurately corrected. Consequently, the component can be accurately mounted on the substrate.In this case, the first imager focused at the first height is preferably fixedly provided on a main body of the component mounting apparatus, and the second imager focused at the second height is preferably movably provided on the mounting head unit. According to this structure, the component located at the first height is imaged by the first imager, so that position correction can be accurately performed, and the component located at the second height different from the first height is imaged by the second imager, so that position correction can be accurately performed.Effect of the inventionAccording to the present invention, as described above, the substrate working device and the component mounting device in which the plurality of correction marks are arranged at the different heights may be provided, each having a simplified structure and decreasing in size.Brief Description of the DrawingsThe following are shown:[FIG. 1 ] A plan view schematically showing a component mounting device according to an embodiment of the present invention.[FIG. 2 ] A graph showing the heights of the correction marks of the component mounting device according to the embodiment of the present invention.[FIG. 3 ] A graph showing mark projectors of the component mounting device according to the embodiment of the present invention.[FIG. 4 ] A perspective view showing a transparent member of the component mounting device according to the embodiment of the present invention.[FIG. 5 ] A plan view showing the transparent member of the component mounting device according to the embodiment of the present invention.[FIG. 6 ] A diagram illustrating a marker projector of a component mounting device according to a first modified example of the embodiment of the present invention.[FIG. 7 ] A diagram illustrating a marker projector of a component mounting device according to a second modified example of the embodiment of the present invention.Embodiments of the InventionHereinafter, an embodiment embodying the present invention will be described based on the drawings.(Structure of Component Mounting Device)The structure of a component mounting device 100 according to an embodiment of the present invention will be described below with reference to FIG. 1.As shown in FIG. 1, the component mounting apparatus 100 is a component mounting apparatus that conveys a substrate P in a direction X by a pair of conveying means 2 and mounts components 31 on the substrate P at a mounting operation position M. The component mounting device 100 is an example of a "substrate working device" in the claims.As shown in FIG. 1, the component mounting apparatus 100 includes a base 1, the pair of conveyance means 2, component conveyors 3, a head unit 4, a carrier 5, a pair of rails 6, base cameras 7, and marker projectors 8. the head unit 4 is an example of a "working unit" or a "mounting head unit" in the claims, and the base cameras 7 are examples of an "imager" or a "first imager" in the claims.The pair of conveying means 2 is installed on the base 1 and conveys the substrate P in the direction X. In addition, the pair of conveying means 2 holds the substrate P being conveyed in a stopped state at the mounting operation position M. In addition, an interval between the pair of conveying means 2 in a direction Y may be adjusted according to the dimensions of the substrate P.The component conveyors 3 are disposed outside (sides Y 1 and Y 2) of the pair of conveying means 32. A plurality of belt conveyors 3 aare disposed in the component conveyors 3.The belt conveyors 3a support drums (not shown) on which belts supporting a plurality of components 31 at a predetermined interval are wound. The belt conveyors 3 afeeding the components 31 from the tips of the belt conveyors 3 aby rotating the drums for feeding the belts holding the components 31. The components 31 include electronic components such as ICs, transistors, capacitors, and resistors.The head unit 4 performs work on the substrate P on which the components 31 are mounted. Specifically, the head unit 4 is disposed above (direction Z 1) the pair of conveying means 2 and the component conveyors 3. As shown in FIG. 2, the head unit 4 includes a plurality of (five) mounting heads 42 including nozzles 41 mounted at their lower ends, and a substrate recognition camera 43, and a scanning camera 44. the scanning camera 44 is an example of an "imager" or a "second imager" in the claims.The mounting heads 42 are movable upward and downward (movable in a Z direction), suck and hold the components 31 supplied from the belt conveyors 3 aby a negative pressure generated at the tips of the nozzles 41 by a negative pressure generator (not shown), and mount the components 31 at mounting positions (see FIG. 2 ) on the substrate P.The substrate recognition camera 43 images fiducial marks F of the substrate P to recognize the position of the substrate P. The positions of the reference marks F are imaged and recognized such that the mounting positions of the components 31 on the substrate P can be accurately detected. An illuminator (not shown) is provided in the vicinity of the substrate recognition camera 43. Visible light is emitted from the illuminator to the substrate P when the substrate recognition camera 43 captures an image, so that the substrate P can be imaged unambiguously by the substrate recognition camera 43.The scanning camera 44 can image the components 31 sucked by the mounting heads 42 (nozzles 41) from the lower side (Z 2 direction side). The scanning camera 44 is provided to detect the positions and orientations of the components 31 sucked by the mounting heads 42 (nozzles 41). Specifically, the scanning camera 44 is movable in an array direction (direction X) of the mounting heads 42 with respect to the head unit 4. Further, the scanning camera 44 images the components 31 sucked from the mounting heads 42 (nozzles 41) and a correction mark (second correction mark 82), which will be described later, while moving in the direction X. The scanning camera 44 images the components 31 each having a relatively small thickness (a size in the direction Z). An illuminator (not shown) is provided in the vicinity of the scanning camera 44. Visible light is emitted from the illuminator to the components 31 sucked by the nozzles 41 when the scanning camera 44 captures an image, so that the components 31 sucked by the nozzles 41 can be clearly imaged by the scanning camera 44.The carrier 5 includes a motor 51. the carrier 5 moves the head unit 4 along the carrier 5 by driving the motor 51 in the direction X. Both ends of the carrier 5 are supported by the pair of rails 6.The pair of rails 6 are fixed on the base 1. A rail 6 on the X1 side includes a motor 61. the pair of rails 6 supports the carrier 5 movably in the direction Y perpendicular to the direction X. Specifically, the rails 6 move the carrier 5 in the direction Y along the pair of rails 6 by driving the motor 61. The head unit 4 is movable in the direction X along the support 5, and the support 5 is movable in the direction Y along the rails 6 such that the head unit 4 is movable in the directions X and Y.The base cameras 7 are fixedly mounted on the upper surface of the base 1. The base cameras 7 can image the components. Specifically, the base cameras 7 are disposed outside (sides Y 1 and Y 2) of the pair of conveying means 2. The base cameras 7 image the components 31 sucked by the mounting heads 42 (nozzles 41) from the lower side (Z2 direction side) to detect the suction states (suction behaviors) of the components 31 before mounting the components 31. Thus, the suction states of the components 31 sucked by the mounting heads 42 (nozzles 41) can be detected. Illuminators (not shown) are provided in the vicinity of the base cameras 7. Visible light is emitted from the illuminators to the components 31 sucked from the nozzles 41 when the base cameras 7 capture images, so that the components 31 sucked from the nozzles 41 can be imaged clearly by the base cameras 7.The base cameras 7 image the components 31 sucked from the mounting heads 42 (nozzles 41) and a correction mark (first correction mark 81) described below. Specifically, when the components 31 are sucked by the mounting heads 42 (nozzles 41), the head unit 4 moves to pass over the base cameras 7. At this time, the base cameras 7 image the components 31 sucked from the mounting heads 42 (nozzles 41) and the correction mark (first correction mark 81). Further, the base cameras 7 image, for example, the components 31 each having a relatively large thickness (a size in the direction Z) and the components 31 each having a shape difficult for the scanning camera 44 to image.According to the present embodiment, as shown in FIGS. 2 and 3, the mark projectors 8 project the correction marks (the first correction mark 81 and the second correction mark 82). A pair of marker projectors 8 are provided at a predetermined interval in a horizontal direction. Specifically, the pair of marker projectors 8 are provided in the head unit 4. The marker projectors 8 stack the plurality of mounting heads 42 arranged in a row in the direction X. That is, the pair of marker projectors 8 are provided at the predetermined interval in the direction X. The mark projectors 8 project the first correction mark 81 and the second correction mark 82 downward.According to the present embodiment, the mark projectors 8 project the first correction mark 81 to a first height H 1 as shown in FIG. 3( a). Moreover, the mark projectors 8 project the second correction mark 82 to a second height H 2 different from the first height H 1, as shown in FIG. 3( b). The base cameras 7 are focused at the first height H 1. In other words, the base cameras 7 image the components 31 that are located at the first height H 1. On the other hand, the scanning camera 44 is focused at the second height H 2 different from the first height H 1. In other words, the scanning camera 44 images the components 31 located at the second height H 2. The first height H 1 is lower (direction Z 2) than the second height H 2. Although FIG. 3( a) shows a state in which the first correction mark 81 is projected and FIG. 3( b) shows a state in which the second correction mark 82 is projected, actually, the mark projectors 8 project both the first correction mark 81 and the second correction mark 82.The positions of the first correction mark 81 and the second correction mark 82 of the horizontal direction (directions X and Y) are known positions with respect to the head unit 4. Based on the detected positions of the components 31, positions for mounting the components 31 are corrected.As shown in FIG. 3, each of the mark projectors 8 includes a transparent member 83, a lens unit 84, and an illuminator 85. the transparent member 83 includes a first projection target 831 projected as the first correction mark 81 and a second projection target 832 projected as the second correction mark 82. Specifically, the transparent member 83 has a flat plate shape, and a pair of flat surfaces of the transparent member 83 face each other in the optical axis direction of the lens unit 84. The first projection target 831 is disposed on one of the flat surfaces of the transparent member 83, and the second projection target 832 is disposed on the other of the flat surfaces of the transparent member 83.The first projection target 831 is disposed such that the optical axis of the lens unit 84 passes substantially through the center of the first projection target 831. The second projection target 832 is arranged such that the optical axis of the lens unit 84 passes substantially through the center of the second projection target 832. The first projection target 831 is disposed farther from the lens unit 84 than the second projection target 832 in the optical axis direction of the lens unit 84. that is, as shown in FIG. 4, the first projection target 831 is disposed on the upper (Z 1 direction side) surface of the transparent member 83. The second projection target 832 is disposed on the lower (Z 2 direction side) surface of the transparent member 83.The first projection target 831 and the second projection target 832 are provided by applying a material on the surfaces of the transparent member 83. The first projection target 831 and the second projection target 832 are opaque. Specifically, the first projection target 831 and the second projection target 832 are colored. The first projection target 831 and the second projection target 832 are colored in black, for example. As shown in FIG. 3, the first projection target 831 and the second projection target 832 are spaced apart from each other in an up-down direction (direction Z) by the thickness of the transparent member 83. Specifically, the first projection target 831 and the second projection target 832 are spaced apart from each other by a distance d 1 in the up-down direction.As shown in FIG. 3, the first projection target 831 and the second projection target 832 are spaced apart from each other by the distance d 1 in the up-down direction, and thus the first correction mark 81 and the second correction mark 82 are projected (imaged) to different heights. Specifically, the first correction mark 81 is projected on the first height H 1. The second correction mark 82 is projected on the second height H2. The first height H 1 is lower (direction Z 2) than the second height H 2 by a distance d 2. That is, the first correction mark 81 projected by projecting the first projection target 831 located farther from the lens unit 84 is projected farther away from the lens unit 84. The second correction mark 82, which is projected by projecting the second projection target 832 disposed closer to the lens unit 84, is projected closer to the lens unit 84.The transparent member 83 is made of a transparent or light transmissive material. The transparent member 83 is made of a material having a high refractive index. The transparent member 83 is made of, for example, glass, resin, or the like. The transparent member 83 is made of a material having a refractive index higher than that of water. Preferably, the transparent member 83 is made of a material having a refractive index of 1.5 or more. Accordingly, an optical path length between the upper surface and the lower surface of the transparent member 83 can be increased, and thus the thickness of the transparent member 83 can be reduced. Thus, the mark projectors 8 can be miniaturized According to the present embodiment, the first projection target 831 and the second projection target 832 do not overlap each other as viewed in the optical axis direction of the lens unit 84. Specifically, as shown in FIG. 5, the first projection target 831 viewed in the optical axis direction of the lens unit 84 is disposed inside the second projection target 832. The first projection target 831 and the second projection target 832 have planar shapes different from each other. For example, the first projection target 831 has a circular shape as viewed in the optical axis direction. The second projection target 832 has a quadrangular frame shape as viewed in the optical axis direction.As shown in FIG. 3, the lens unit 84 is provided to project the first projection target 831 as the first correction mark 81 to the first height H 1, and projects the second projection target 832 as the second correction mark to the second height H 2. The lens unit 84 is disposed below (Z 2 direction side) the transparent member 83 (the first projection target 831 and the second projection target 832). The lens unit 84 includes, for example, three lenses. The position and the magnification of the lens unit 84 are adjusted such that the projection position of the first correction mark 81 is at the first height H 1. Further, the position and the magnification of the lens unit 84 are adjusted such that the projection position of the second correction mark 82 is at the second height H 2.The illuminator 85 emits light to the first projection target 831 and the second projection target 832. The illuminator 85 is disposed on the side (Z 1 direction side) opposite to the lens unit 84 with respect to the transparent member 83. The illuminator 85 emits visible light downward (Z 2 direction side). In addition, the illuminator 85 is turned on at least when the base cameras 7 or the scanning camera 44 capture / capture an image. That is, when the first correction mark 81 or the second correction mark 82 is imaged by the base cameras 7 or the scanning camera 44, light is emitted from the illuminator 85.(Effects of Embodiment)According to the present embodiment, the following effects can be obtained.According to the present embodiment, as described above, the component mounting apparatus 100 includes the mark projectors 8 that project the first correction mark 81 to the first height H 1 and project the second correction mark 82 to the second height H 2. Thus, an element arranging the first correction mark 81 and an element arranging the second correction mark 82 can be provided as a common mark projector 8, and thus an increase in the number of components can be substantially reduced or prevented. Consequently, it is possible to simplify the structure of the component mounting device 100 in which a plurality of correction marks are arranged at different heights, and to miniaturize the component mounting device 100.According to the present embodiment, each of the mark projectors 8 preferably includes the first projection target 831 projected as the first correction mark 81, the second projection target 832 projected as the second correction mark 82, and the lens unit 84 projecting the first projection target 831 as the first correction mark 81 to the first height H 1 and projecting the second projection target 832 as the second correction mark 82 to the second height H 2. Thus, the lens unit 84 projects the first projection target 831 so that the first correction mark 81 can be easily projected, and the lens unit 84 projects the second projection target 832 so that the second correction mark 82 can be easily projected.According to the present embodiment, the first projection target 831 is disposed farther from the lens unit 84 than the second projection target 832 in the optical axis direction of the lens unit 84.According to the present embodiment, the first projection target 831 is disposed on one of the flat surfaces of the transparent member 83, and the second projection target 832 is disposed on the other of the flat surfaces of the transparent member 83. Thus, the first projection target 831 and the second projection target 832 may be provided on a transparent member 83, and thus an increase in the number of components may be further substantially reduced or prevented. Consequently, it is possible to miniaturize the marker projectors 8 and simplify the structure thereof, and thus it is possible to further miniaturize the component mounting apparatus 100 and simplify the structure thereof.According to the present embodiment, the first projection target 831 is arranged such that the optical axis of the lens unit 84 passes substantially through the center of the first projection target 831. Further, the second projection target 832 is arranged such that the optical axis of the lens unit 84 passes substantially through the center of the second projection target 832. Thus, distortion of the projected first correction mark 81 and second correction mark 82 can be substantially reduced or prevented, and thus accurate position correction can be performed using the first correction mark 81 and the second correction mark 82.According to the present embodiment, when viewed in the optical axis direction of the lens unit 84, the first projection target 831 and the second projection target 832 do not overlap each other. Thus, the projection of the first correction mark 81 and the second correction mark 82 in an overlapping manner can be substantially reduced or prevented, and thus the first correction mark 81 can be accurately recognized based on the imaging results from the base cameras 7. In addition, the second correction mark 82 can be accurately recognized based on the imaging result from the scanning camera 44.According to the present invention, the first projection target 831 and the second projection target 832 have planar shapes different from each other. Thus, erroneous detection of the first correction mark 81 and the second correction mark 82 imaged by the base cameras 7 or the scanning camera 44 can be substantially reduced or prevented, and thus the first correction mark 81 and the second correction mark 82 can be accurately detected.According to the present embodiment, the first projection target 831 is disposed inside the second projection target 832 as viewed in the optical axis direction of the lens unit 84. Thus, the first projection target 831 and the second projection target 832 may be arranged on the optical axis, and thus distortion of the projected first correction mark 81 and second correction mark 82 may be substantially reduced or prevented. Moreover, the first projection target 831 and the second projection target 832 can be made compact, and thus the marker projectors 8 can be miniaturized.According to the present embodiment, each of the marker projectors 8 includes the illuminator 85 that emits light to the first projection target 831 and the second projection target 832. Thus, the first correction mark 81 and the second correction mark 82 can be projected by emitting light to the first projection target 831 and the second projection target 832, and thus the first correction mark 81 and the second correction mark 82 can be clearly projected.According to the present embodiment, the pair of marker projectors 8 are provided at the predetermined interval in the horizontal direction (direction X). Thus, the correction marks may be disposed at two locations in the direction X. Consequently, when distortion occurs in the head unit 4 due to heat or the like, for example, a plurality of reference positions for the head unit 4 can be recognized with the correction marks, and thus a positional deviation due to the distortion can be accurately corrected.According to the present embodiment, the component mounting apparatus 100 includes the base cameras 7 fixedly provided on a main body of the component mounting apparatus and focused at the first height H 1, and the scanning camera 44 movably provided on the head unit 4 and focused at the second height H 2. Thus, the components 31 located at the first height H 1 are imaged by the base cameras 7 such that position correction can be accurately performed. Further, the components 31 located at the second height H 2 are imaged by the scanning camera 44 such that position correction can be accurately performed.According to the present embodiment, the mark projectors 8 are provided on the head unit 4 and project the first correction mark 81 and the second correction mark 82 downward (direction Z 2). Thus, the components 31 held by the mounting heads 42 can be imaged together with the first correction mark 81 or the second correction mark 82, and thus the positions of the components 31 can be accurately corrected. Consequently, the components 31 can be accurately mounted on the substrate P.(Modified Examples)The embodiment disclosed herein is intended to be illustrative in all points and not limiting. The scope of the present invention is not given from the description of the embodiment set forth above, but is given by the scope of the claims, and moreover, all modifications (modified examples) within the meaning and the scope equivalent to the scope of the claims are included. For example, while the example has been shown in the aforementioned embodiment in which the present invention is applied to the component mounting apparatus as a substrate working apparatus, the present invention is not limited thereto. The present invention can be applied to a device other than the component mounting device. For example, the present invention can be applied to a test apparatus that inspects a substrate on which components are mounted. Alternatively, the present invention can be applied to a printer that prints a solder or the like on a substrate on which components are mounted. Alternatively, the present invention can be applied to a coating apparatus that applies a solder, adhesive, or the like to a substrate on which components are mounted. Additionally, the imagers may not image components based on visible light. For example, the imagers may image components based on infrared light, x-rays, or the like.While the example in which the two marker projectors are provided as shown in the aforementioned embodiment has been shown, the present invention is not limited thereto. According to the present invention, one marker projector may be provided or three or more marker projectors may be provided.While the example in which the first projection target and the second projection target are respectively disposed on the upper surface and the lower surface of a transparent member has been shown in the aforementioned embodiment, the present invention is not limited thereto. According to the present invention, as a marker projector 8 ain a first modified example shown in FIG. 6, a member 86 on which a first projection target 861 is disposed and a member 87 on which a second projection target 871 is disposed may be separately provided.While in the aforementioned embodiment, the example in which the first projection target is disposed inside the second projection target as viewed in the optical axis direction has been shown, the present invention is not limited thereto. According to the present invention, the second projection target may be disposed inside the first projection target as viewed in the optical axis direction. Alternatively, the first projection target and the second projection target may be arranged side by side in a direction perpendicular to the optical axis direction.While in the aforementioned embodiment, the example in which the first projection target has a circular shape and the second projection target has a quadrangular frame shape has been shown, the present invention is not limited thereto. According to the present invention, the first projection target may have a shape other than a circular shape. Further, the second projection target may have a shape other than a quadrangular frame shape. Alternatively, the first projection target and the second projection target may have the same shape. Alternatively, the size of the first projection target and the size of the second projection target may be equal to each other. While in the aforementioned embodiment, the example in which the correction marks are used to correct the positions and orientations of the components has been described, the present invention is not limited thereto. For example, according to the present invention, the correction marks may be used to correct the position of the working unit, or the correction marks may be used to correct the position of the substrate. Alternatively, the correction marks may be used to correct the positions of the imagers.While in the aforementioned embodiment, the example in which the marker projectors are disposed in the head unit as the working unit has been shown, the present invention is not limited thereto. According to the present invention, the marker projectors may be disposed in a portion other than the working unit. While in the aforementioned embodiment, the example in which the first correction mark and the second correction mark are projected downward from the mark projectors has been described, the present invention is not limited thereto. According to the present invention, as shown in FIG. 7, the first correction mark 81 and the second correction mark 82 may be projected upward by a mark projector 8 b. In this case, for example, the projected first correction mark 81 and the second correction mark 82 may be imaged by the substrate recognition camera 43. The substrate recognition camera 43 may include a camera that images a first height H 11 and a camera that images a second height H 12. In addition, the substrate recognition camera 43 may be movable in the up-down direction to a position where the first height H 11 is imaged and a position where the second height H 12 is imaged. Further, when the imager moves in the up-down direction, the correction marks are imaged at two locations, so that distortion of an up-down movement axis can be detected.While the example in which each of the marker projectors includes the illuminator has been shown as in the aforementioned embodiment, the present invention is not limited thereto. According to the present invention, the illuminator may not be provided in each of the mark projectors. For example, light may be emitted to the first projection target and the second projection target by illuminators provided in the vicinity of the imagers. In other words, light cannot be emitted from the back side of the first projection target and the second projection target to the lens unit. While in the aforementioned embodiment, the example in which a mark projector projects the two correction marks (the first correction mark and the second correction mark) has been shown, the present invention is not limited thereto. According to the present invention, a marker projector may project three or more correction markers to heights different from each other.List of reference characters4 Head unit (process unit, mount head unit) 7 Basic camera (imager, first imager) 8, 8 a, 8 bMark projector 31 Component 43 Substrate recognition camera (imager) 44 Scanning camera (imager, second imager) 81 First correction mark (correction mark) 82 Second correction mark (correction mark) 83 Transparent member 84 Lens unit 85 Illuminator 100 Component mounting device (substrate process device) 831, 861 First projection target 832, 871 Second projection target H 1, H 11 First height H 2, H 12 Second height P Substrate

Claims

A substrate working apparatus (100) comprising: a working unit (4) that performs work on a substrate (P) on which a component (31) is mounted; an imager (7, 44) capable of imaging a correction mark (81, 82) for position correction; and a mark projector (8, 8a, 8b) that projects the correction mark (81, 82), wherein the correction mark (81, 82) includes a first correction mark (81) and a second correction mark (82), the imager (7, 44) includes a first imager (7) focused at a first height (H1, H11), and a second imager (44) focused at a second height (H2, H12) different from the first height (H1, H11), the mark projector (8, 8a, 8b) projects the first correction mark (81) onto the first height (H1, H11) and projects the second correction mark (82) onto the second height (H2, H12), and the mark projector (8, 8a, 8b) comprises a first projection target (831, 861) projected as the first correction mark (81), a second projection target (832, 871) projected as the second correction mark (82), and a lens unit (84) projecting the first projection target (831, 861) as the first correction mark (81) onto the first height (H1, H11) and projecting the second projection target (832, 871) as the second correction mark (82) onto the second height (H2, H12).The substrate working apparatus (100) according to claim 1, wherein the first projection target (831, 861) is disposed farther from the lens unit (84) than the second projection target (832, 871) in an optical axis direction of the lens unit (84).The substrate working apparatus (100) according to claim 2, wherein the mark projector (8, 8a, 8b) further comprises a transparent member (83) having a flat plate shape and comprising a pair of flat surfaces facing each other in the optical axis direction of the lens unit (84), and the first projection target (831, 861) is disposed on one of the flat surfaces of the transparent member (83), and the second projection target (832, 871) is disposed on the other of the flat surfaces of the transparent member (83).The substrate working apparatus (100) according to any one of claims 1 to 3, wherein the first projection target (831, 861) is arranged such that an optical axis of the lens unit (84) substantially passes through a center of the first projection target (831, 861), and the second projection target (832, 871) is arranged such that the optical axis of the lens unit (84) substantially passes through a center of the second projection target (832, 871).The substrate working device (100) according to any one of claims 1 to 4, wherein the first projection target (831, 861) and the second projection target (832, 871) do not overlap each other as viewed in an optical axis direction of the lens unit (84).The substrate working device (100) according to any one of claims 1 to 5, wherein the first projection target (831, 861) and the second projection target (832, 871) have planar shapes different from each other.The substrate working device (100) according to any one of claims 1 to 6, wherein one of the first projection target (831, 861) and the second projection target (832, 871) is disposed inside the other of the first projection target (831, 861) and the second projection target (832, 871) as viewed in an optical axis direction of the lens unit (84).The substrate working device (100) according to any one of claims 1 to 7, wherein the mark projector (8, 8a, 8b) further comprises an illuminator (85) that emits light to the first projection target (831, 861) and the second projection target (832, 871).The substrate working apparatus (100) according to any one of claims 1 to 8, wherein the mark projector (8, 8a, 8b) comprises a pair of mark projectors (8, 8a, 8b) provided at a predetermined interval in a horizontal direction (X).A component mounting apparatus (100) comprising: a mounting head unit (4) mounting a component (31) on a substrate (P); an imager (7, 44) capable of imaging a correction mark (81, 82) for position correction; and a mark projector (8, 8a, 8b) projecting the correction mark (81, 82), wherein the correction mark (81, 82) comprises a first correction mark (81) and a second correction mark (82), the imager (7, 44) comprises a first imager (7) focused at a first height (H1, H11), and a second imager (44) focused at a second height (H2, H12) different from the first height (H1, H11), the mark projector (8, 8a, In FIG. 8 b), the first correction mark ( 81) is projected on the first height (H 1, H 11) and the second correction mark ( 82) is projected on the second height (H 2, H 12), and the mark projector ( 8, 8 a, 8 b) includes a first projection target ( 831, 861) projected as the first correction mark ( 81), a second projection target ( 832, 871) projected as the second correction mark ( 82), and a lens unit ( 84) projecting the first projection target ( 831, 861) as the first correction mark ( 81) on the first height (H 1, H 11) and projecting the second projection target ( 832, 871) as the second correction mark ( 82) on the second height (H 2, H 12).The component mounting apparatus (100) according to claim 10, wherein the mark projector (8, 8a, 8b) is provided on the mounting head unit (4), and projects the first correction mark (81) and the second correction mark (82) downward.The component mounting apparatus (100) according to claim 11, wherein the first imager (7) focused at the first height (H1, H11) is fixedly provided on a main body of the component mounting apparatus (100), and the second imager (44) focused at the second height (H2, H12) is movably provided on the mounting head unit (4).

Images