Component assembly device, component assembly system and component assembly method

Abstract

Component assembly device (100), comprising: a head unit (6) which mounts components (E) on a three-dimensional assembly body (P2) on a transport path (5a), the assembly body having a horizontal mounting surface (P2a) and an inclined mounting surface (P2b) inclined with respect to the horizontal mounting surface (P2a), and a control section (10) which controls the head unit (6) such that it mounts components (E) on the horizontal mounting surface (P2a) of the three-dimensional assembly body (P2) in a first assembly area (1) which is provided on the transport path (5a) for transporting the assembly body (P2), and in a second assembly area (2) which is different from the first assembly area (1), it mounts components (E) on the inclined mounting surface (P2b) of the three-dimensional assembly body (P2).

Description

Technical field This invention relates to a component mounting device, a component mounting system and a component mounting method, and in particular relates to a component mounting device, a component mounting system and a component mounting method with which components are mounted on a mounting body which has a horizontal mounting surface and a mounting surface separate from the horizontal mounting surface. General state of the art Component mounting devices are known from the prior art that mount components onto a mounting body having a horizontal mounting surface and a separate mounting surface. Such a component mounting device is disclosed in publication JP 2012 - 119 643 A. Publication JP 2012 - 119 643 A discloses a mounting device for electronic circuit components (component mounting device) that mounts electronic circuit components onto a three-dimensional printed circuit board (component body). The three-dimensional printed circuit board has a horizontal mounting surface as its top surface and four side surfaces inclined relative to the top surface as separate mounting surfaces. This mounting device for electronic circuit components is designed such that it mounts components on the horizontal mounting surface (top surface) and the separate mounting surfaces (four side surfaces) in a single mounting area. The publication JP 2011 - 54 900 A describes a component assembly machine. The component assembly machine includes a first head unit for mounting components onto a substrate in a first assembly position, a second head unit for mounting components onto the substrate in a second assembly position, which is located downstream of the first assembly position in a substrate transport direction, and a decision device for determining whether the substrate can be transported from the first assembly position to the second assembly position. German patent application DE 11 2008 001 411 T5 describes a method for checking the assembly status of components mounted on a printed circuit board (PCB) by mounting fixtures. The PCB is transported from an upstream side to a downstream side through a plurality of mounting fixtures. The method includes checking the assembly status of a component at the position where the component is mounted by each mounting fixture. German patent application DE 11 2012 001 025 T5 describes a component assembly method in a component assembly device. The component assembly device comprises a circuit board holding device with a holding element, a circuit board transfer device, a component feeding device, and a component loading device that receives the component from the component feeding device and moves the component in two orthogonal directions within a horizontal plane and in a vertical direction to mount the component at a mounting section on a circuit board. The publication JP 2016 - 127 187 A describes a method for assembling chip components. The publication DE 101 08 762 A1 describes a method for the sequential mounting of components on a plurality of printed circuit board blocks formed on a continuous printed circuit board, in a plurality of mounting stages. Brief description of the invention Object of the invention However, the mounting device for electronic circuit components described in publication JP 2012 - 119 643 A presents a problem: while all mounting surfaces of the assembly body—that is, the horizontal mounting surface and the mounting surfaces separate from the horizontal mounting surface—can be populated with components in a single area, the horizontal mounting surface and the mounting surfaces separate from the horizontal mounting surface cannot be populated with components in different mounting areas. In this case, the degree of freedom for mounting on the assembly body is limited, resulting in the potential problem that the components cannot be mounted on the assembly body with high efficiency. The invention was made to solve the above-mentioned problem, and one of the objectives of the invention is to provide a component mounting device, a component mounting system and a component mounting method with which components can be mounted with high efficiency on a mounting body which has a horizontal mounting surface and a mounting surface separate from the horizontal mounting surface. Means of solving the task A component assembly device according to a first aspect of the invention comprises a head unit that mounts components on a three-dimensional assembly body along a transport path. The assembly body has a horizontal mounting surface and an inclined mounting surface that is inclined with respect to the horizontal mounting surface. The head unit also comprises a control section that controls the head unit such that, in a first mounting area provided along the transport path for transporting the assembly body, it mounts components on the horizontal mounting surface of the three-dimensional assembly body, and in a second mounting area, which is distinct from the first mounting area, it mounts components on the inclined mounting surface of the three-dimensional assembly body. The inclined mounting surface is hereinafter also referred to as a mounting surface separate from the horizontal mounting surface. In the component assembly device of the first aspect of the invention, the above configuration allows components to be mounted on the horizontal mounting surface of the assembly body in the first assembly area provided along the transport path. This mounting surface can be loaded in a state arranged along the transport path. In the second assembly area, which differs from the first assembly area, components can be mounted on the mounting surface of the assembly body that is separate from the horizontal mounting surface. This mounting surface cannot be loaded in the state arranged along the transport path. As a result, components can be mounted in different areas on the horizontal mounting surface and on the mounting surface of the assembly body that is separate from the horizontal mounting surface.This increases the degree of freedom when assembling a component carrier with a horizontal mounting surface and a separate mounting surface. This allows for the provision of a component mounting device that enables highly efficient component mounting on a component carrier featuring both a horizontal mounting surface and a separate mounting surface. In the component mounting device of the first aspect, the first mounting area is preferably an area in which components are mounted on a printed circuit board or a substrate in the form of a flat plate by the head unit. This design allows components to be mounted on the horizontal mounting surface of the assembly body by utilizing a mounting area for printed circuit boards or substrates that have the shape of a flat plate. In this way, it is not necessary to provide a separate mounting area for the horizontal mounting surface of the assembly body from the mounting area for printed circuit boards or substrates in the shape of a flat plate. Compared to providing a separate mounting area for the horizontal mounting surface of the assembly body from the mounting area for printed circuit boards or substrates, this design offers greater efficiency.Substrates in the form of a flat plate can thus reduce the number of components and simplify the structure. In the component assembly device of the first aspect, the control section is preferably designed to control the head unit in such a way that it successively mounts several components onto the horizontal mounting surfaces of multiple assembly bodies in the first assembly area. This design allows the assembly of components onto the horizontal mounting surfaces of multiple assembly bodies to be carried out simultaneously in the first assembly area. In this way, compared to performing the assembly of components onto the horizontal mounting surfaces of multiple assembly bodies individually for each assembly body in the second assembly area, the assembly of components onto the horizontal mounting surfaces of multiple assembly bodies can be carried out with high efficiency. In the component assembly device of the first aspect, the control section is preferably designed such that it controls the head unit to mount components in the second assembly area on the mounting surface of the assembly body that is separate from the horizontal mounting surface, and then to mount components in the first assembly area on the horizontal mounting surface of the assembly body. If production efficiency is higher or the timing for transferring the assembly body is more favorable when components are first mounted in the second assembly area on the mounting surface of the assembly body that is separate from the horizontal mounting surface, and then components are mounted in the first assembly area on the horizontal mounting surface of the assembly body, this design allows the components to be mounted efficiently on the assembly body at the appropriate time. In the component assembly device of the first aspect, the control section is preferably designed in such a way that it controls the head unit in such a way that in the first assembly area it only performs part of the assembly of components on the horizontal mounting surface of the assembly body, in the second assembly area it mounts components on the mounting surface of the assembly body that is separate from the horizontal mounting surface and then in the first assembly area it mounts components on the horizontal mounting surface of the assembly body.In the event that production efficiency is higher or the timing for transferring the assembly body is more favorable, if only part of the component assembly is carried out on the horizontal mounting surface of the assembly body in the first assembly area, then components are mounted on the mounting surface of the assembly body separate from the horizontal mounting surface in the second assembly area, and then components are mounted on the horizontal mounting surface of the assembly body in the first assembly area, this design allows the components to be mounted efficiently on the assembly body at the appropriate time. In the component assembly device of the first aspect, the control section is preferably designed such that it controls the head unit to mount components on the horizontal mounting surface of the assembly body in the first assembly area and then, in the second assembly area, to mount components on the mounting surface of the assembly body that is separate from the horizontal mounting surface. If production efficiency is higher when components are first mounted on the horizontal mounting surface of the assembly body in the first assembly area and then, in the second assembly area, on the mounting surface of the assembly body that is separate from the horizontal mounting surface, this design allows the components to be mounted on the assembly body with high efficiency. In an embodiment where components are mounted on the assembly body's mounting surface, separate from the horizontal mounting surface, in the second assembly area, and then components are mounted on the assembly body's horizontal mounting surface in the first assembly area, the control section is preferably designed to control the head unit such that it holds the horizontal mounting surface of the assembly body and transfers the assembly body to the second assembly area, which is the transfer destination, or to a return position from the second assembly area. This design allows the horizontal mounting surface of the assembly body to be held in a state of incomplete component mounting on the head unit. In this way, a holding position of the head unit on the horizontal mounting surface of the assembly body can be easily ensured. In the component assembly device of the first aspect, the control section is preferably designed such that it controls the head unit in such a way that it performs the assembly of components on the horizontal mounting surface of the assembly body in the first assembly area and the assembly of components on the mounting surface of the assembly body separate from the horizontal mounting surface in the second assembly area in a sequence that is determined on the basis of information on an obstruction between the head unit and components on the assembly body during the transfer of the assembly body and / or information on production efficiency.If component placement is performed in a sequence determined based on information about potential obstruction between the head unit and components on the assembly body during assembly body transfer, the components can be placed in a way that avoids obstruction (collision) between the head unit and components on the assembly body during assembly body transfer. Since obstruction (collision) between the head unit and components on the assembly body is avoided during assembly body transfer, this prevents size limitations of the assembly body and components. If component placement is performed in a sequence determined based on production efficiency information, component placement on the assembly body can be carried out with high efficiency. In the component assembly device of the first aspect, the control section is preferably designed to control several head units such that they simultaneously mount components on the horizontal mounting surface of the assembly body in the first assembly area and on the mounting surface of the assembly body that is separate from the horizontal mounting surface in the second assembly area. Since this design allows components to be mounted simultaneously on the horizontal mounting surface of the assembly body in the first assembly area and on the mounting surface of the assembly body that is separate from the horizontal mounting surface in the second assembly area, the time required for component assembly can be reduced. In the component assembly device of the first aspect, the second assembly area is preferably located outside the transport route. Since this design allows the second assembly area to be positioned outside the transport route where the first assembly area is located, sufficient space for the second assembly area can easily be provided. Furthermore, more space is available along the transport route corresponding to the second assembly area not being located there, thus ensuring sufficient space for the first assembly area to be located along the transport route. A component assembly system according to a second aspect comprises a first component assembly device with a first head unit that mounts components on a three-dimensional assembly body along a transport path. The assembly body has a horizontal mounting surface and an inclined mounting surface that is inclined with respect to the horizontal mounting surface. The first head unit controls the first head unit in such a way that it mounts components on the horizontal mounting surface of the three-dimensional assembly body in a first mounting area provided along the transport path for transporting the assembly body. The second component assembly device has a second head unit for mounting components on the assembly body. The second head unit controls the second head unit in such a way that it mounts components on the inclined mounting surface of the three-dimensional assembly body in a second mounting area that is different from the first mounting area. The component mounting system of the second aspect, as described above, provides a component mounting system with which, as with the component mounting device of the first aspect, components can be mounted with high efficiency on a mounting body with a horizontal mounting surface and a mounting surface separate from the horizontal mounting surface. A component assembly method according to a third aspect is a component assembly method in which components are mounted on a three-dimensional assembly body along a transport path, the assembly body having a horizontal mounting surface and an inclined mounting surface inclined with respect to the horizontal mounting surface, wherein in a first assembly area provided along the transport path for transporting the assembly body, components are mounted on the horizontal mounting surface of the three-dimensional assembly body, and in a second assembly area, which is different from the first assembly area, components are mounted on the inclined mounting surface of the three-dimensional assembly body. In the component assembly method of the third aspect, a component assembly method can be provided with which, through the above design as well as with the component assembly device, components can be mounted with high efficiency on a mounting body which has a horizontal mounting surface and a mounting surface separate from the horizontal mounting surface. Effect of the invention According to the present invention, a component mounting device, a component mounting system and a component mounting method can be provided with which components can be mounted with high efficiency on a component body which has a horizontal mounting surface and a mounting surface separate from the horizontal mounting surface. Brief description of the characters The figures show: Fig. 1 a view of the overall structure of a component assembly device according to a first embodiment; Fig. 2 a perspective view of a printed circuit board according to the first embodiment; Fig. 3 a perspective view of a component placement body and a storage element for arranging the component placement body thereon according to the first embodiment; Fig. 4 a perspective view of the component placement body, the storage element, and a transport element for arranging the storage element thereon according to the first embodiment; Fig. 5 an illustrative view of a process in which a head unit according to the first embodiment holds the storage element and the component placement body is moved; Fig. 6 an illustrative view of a process in which the head unit holds a horizontal mounting surface of the component placement body and the component placement body is moved; Fig. 7 a side view of the printed circuit board or substrate according to the first embodiment; Fig.8 a side view of a component holding section according to the first embodiment; Fig. 9 an illustrative view of an obstruction between a component on the horizontal mounting surface of the component holding body and the head unit in the case that the head unit of the first embodiment holds the storage element and the component holding body is moved; Fig. 10 a flowchart illustrating a processing procedure for defining an assembly sequence by the component assembly device of the first embodiment; Fig. 11 a flowchart that follows the flowchart from Fig. 10; Fig. 12 a flowchart illustrating a first example of an assembly processing procedure by the component assembly device; Fig. 13 a flowchart illustrating a second example of an assembly processing procedure by the component assembly device; Fig.Figure 14 shows a flowchart illustrating a third example of assembly processing by the component assembly device; Figure 15 shows a view of the overall structure of a component assembly device according to a second embodiment; and Figure 16 shows a view of the overall structure of a component assembly system according to a third embodiment. Embodiments of the invention Specific embodiments of the present invention are described below with reference to the figures. In the following description, a direction along a transport direction of a component body P2 is referred to as the X-direction, a direction in the horizontal plane orthogonal to the X-direction as the Y-direction, and a direction that runs in the top-bottom direction orthogonal to both the X-direction and the Y-direction as the Z-direction. First embodiment Design of the component assembly device Referring to Fig. 1, Fig. 2, Fig. 3, Fig. 4, Fig. 5, Fig. 6, Fig. 7, Fig. 8 to Fig. 9, the design of a component assembly device 100 according to a first embodiment of the present invention is now described. As shown in Fig. 1, the component mounting device 100 is a device that mounts components E (surface-mount components) such as integrated circuits, transistors, capacitors, and resistors onto a printed circuit board or a substrate P1 in the form of a flat plate (see Fig. 2) or a mounting body P2 (workpiece) with a three-dimensional shape compared to the printed circuit board or substrate P1 (see Fig. 3 and Fig. 4). The component mounting device 100 has a first mounting area 1 in which components E are mounted onto the printed circuit board or substrate P1 by a head unit 6 described below, and a second mounting area 2 in which components E are mounted onto the mounting body P2 by the head unit 6. That is, the component mounting device 100 is a device that can be mounted both on the printed circuit board or substrate P1.Components E can be mounted on the substrate P1 as well as on the mounting body P2. The first assembly area 1 and the second assembly area 2 are arranged in different positions. They are positioned so that they do not overlap when viewed from above (in the Z-direction). The first assembly area 1 is located on a transport path 5a. The second assembly area 2 is located outside of transport path 5a. As shown in Fig. 2, the printed circuit board or substrate P1 is, for example, a single-area assembly body with only one assembly area P1a. Or, the printed circuit board or substrate P1 is a double-area assembly body with two assembly areas P1a, namely one assembly area P1a and another assembly area P1a located on the opposite side of the first assembly area P1a. As shown in Fig. 3, the component carrier P2 has, for example, a horizontal mounting surface P2a and mounting surfaces P2b separate from the horizontal mounting surface P2a. The horizontal mounting surface P2a is horizontal when the component carrier P2 is positioned on the transport path 5a. The mounting surfaces P2b, separate from the horizontal mounting surface, are inclined relative to the horizontal mounting surface P2a and are inclined relative to the horizontal when the component carrier P2 is positioned on the transport path 5a. The component carrier P2 can also have a shape other than the one shown in Fig. 3. For example, the component carrier P2 can be hemispherical. As shown in Figures 3 and 4, the component assembly P2 is transported into the device in a state of arrangement on a transport element 91. More precisely, the component assembly P2 is transported into the device in a state of arrangement on a storage element 92, which is detachably arranged on the transport element 91. The component assembly P2 is held and fixed on the storage element 92, for example, by a screw element, a clamping element, adhesive tape, or the like. Several storage elements 92 (six in Figure 4) are arranged on the transport element 91, and one component assembly P2 is arranged on each storage element 92. This allows several component assembly elements P2 (six in Figure 4) to be transported into the component assembly device 100 simultaneously. The storage element 92 has a storage section 92a on which the component carrier P2 is arranged, and a holding section 92b, which is provided on the lower section of the storage section 92a and holds a component carrier holding section 4 described below. As shown in Fig. 5, the component carrier P2 is transferred by the head unit 6 in a state in which the storage element 92 is held (suctioned). Alternatively, as shown in Fig. 6, the component carrier P2 is transferred by the head unit 6 in a state in which the horizontal mounting surface P2a of the component carrier P2 is held. If the transfer is carried out by holding the horizontal mounting surface P2a of the component carrier P2, the storage element 92 can be designed in a smaller size, thereby increasing the number of storage elements 92 on the transport element 91.Since the number of component bodies P2 on the transport element 91 can be increased in this way, production efficiency can be improved. As shown in Fig. 1, the component assembly device 100 has a printed circuit board holding section 3, a component holding section 4, a transport section 5, a head unit 6, a mechanism 7 for horizontal head movement, a component receiving section 8, a marking receiving section 9 and a control section 10. The first assembly area 1 is an area in which the printed circuit board holding section 3 is arranged, and the second assembly area 2 is an area in which the component holding section 4 is arranged. The PCB holding section 3 is arranged in the first mounting area 1 and holds the PCB P1 when components E are mounted on the PCB P1 in the first mounting area 1. As shown in Fig. 7, the PCB holding section 3 has a PCB fixing section 31 and a PCB support section 32. The PCB fixing section 31 is a clamping mechanism that fixes the PCB P1 when components E are mounted on the PCB P1 in the first mounting area. The PCB fixing section 31 has a pair of clamping sections 31a arranged apart in the Y-direction. The PCB fixing section 31 uses the clamping sections 31a to fix the two end sections of the PCB P1 in the Y-direction. The clamping sections 31a are designed to move between a retracted position, in which they do not fix the PCB P1, and a fixed position, in which they fix the PCB P1. The clamping sections 31a are in the retracted position when the PCB P1 or the assembly body P2 is being transported. The clamping sections 31a are in the fixed position when the PCB P1 is being fixed. The printed circuit board support section 32 is a securing unit that supports the printed circuit board P1 from below (from the Z2 direction) when components E are mounted on the printed circuit board P1 in the first mounting area. The printed circuit board support section 32 has several securing pins 32a and a securing pin assembly section 32b on which the securing pins 32a are arranged. The printed circuit board support section 32 supports the printed circuit board P1 from below on its underside surface by means of the securing pins 32a. The securing pins 32a and the securing pin assembly section 32b are designed such that they can move in the top-bottom direction (Z direction) between a retraction position, in which they do not support the printed circuit board P1, and a support position, in which they support the printed circuit board P1.The locking pins 32a and the locking pin assembly section 32b are in the retracted position when the printed circuit board P1 or the assembly body P2 is being transported. The locking pins 32a and the locking pin assembly section 32b are in the storage position when the printed circuit board P1 is being stored. As shown in Fig. 1, the component holding section 4 in the second assembly area 2 holds the component P2 by means of the support element 92 when components E are mounted on the component P2. Furthermore, the component holding section 4 is designed such that it can move, rotate, or tilt the held component P2 in the up-down direction (Z-direction). More precisely, the component holding section 4 has a lifting and lowering mechanism 41, a tilting mechanism 42, a rotational mechanism 43, and a holding section 44. In the component holding section 4, the holding section 44 is attached to the rotational mechanism 43, the rotational mechanism 43 is attached to the tilting mechanism 42, and the tilting mechanism 42 is attached to the lifting and lowering mechanism 41. The lifting and lowering mechanism 41 has a drive motor 41a and, by means of the drive force of the drive motor 41a, moves the component body P2, which is held by the holding section 44 via the storage element 92, in an up-down direction (Z-direction). The tilting mechanism 42 has a drive motor 42a and, by means of the drive force of the drive motor 42a, moves the component body P2, which is held by the holding section 44 via the storage element 92, about a rotational axis A1 that extends in a horizontal direction. In this way, the tilting mechanism 42 tilts the component body P2, which is held by the holding section 44 via the storage element 92. The rotary mechanism 43 has a drive motor 43a and, through the driving force of the drive motor 43a, rotates the component body P2, which is held by the holding section 44 via the storage element 92, about a rotational axis A2 which extends in one direction essentially orthogonal to the rotational axis A1.The holding section 44 holds the holding section 92b of the storage element 92. In this way, the holding section 44 holds the component P2 above the storage element 92 from below (from the Z2 direction). The holding section 44 has several claw sections 44a and uses these claw sections 44a to hold and secure the holding section 92b of the storage element 92. As shown in Fig. 1, the transport section 5 forms a single transport path 5a, which serves to bring the printed circuit board P1 or the assembly body P2 towards, transport it, and remove it from the transport. The transport section 5 has a pair of conveyor belts 51, which are spaced apart from each other in the Y direction. The transport section 5 uses the two conveyor belts 51 to position the transport object (the transport element 91, on which the printed circuit board P1 or the assembly body P2 is arranged) from below (from the Z2 direction) at both end sections in the Y direction and transports the transport object on the transport path 5a running in the X direction. The head unit 6 is a surface mount head unit for mounting components E onto the printed circuit board P1 or the component carrier P2. The head unit 6 has several (six) heads (mounting heads). The heads 61 are connected to a vacuum generating device (not shown). The heads 61 are designed such that, by means of a nozzle 61a (see Fig. 5 and Fig. 6) attached to their front end, they can draw in and hold (suction hold) the components E by means of negative pressure generated by the vacuum generating device. The heads 61 are further designed such that they can mount the components E onto the printed circuit board P1 or the component carrier P2 by releasing the suction hold. The heads 61 are designed to be movable in the up-down direction by means of an up-and-down movement mechanism (not shown), such as a spindle mechanism. Furthermore, on both sides of the component assembly device 100 in the Y direction (the Y1 side and the Y2 side), a component feeder 100a is arranged, which feeds components E for mounting on the printed circuit board P1 or the assembly body P2. The component feeder 100a is a belt feeder that feeds the components E by conveying a component feeder belt that holds the components E. The component feeder 100a can also be a pallet feeder that feeds the components E by feeding pallets in which the components E are held. The heads 61 of the head unit 6 hold the components E fed by the component feeder 100a at the nozzle 61a (thus suctioning them in). The horizontal head movement mechanism 7 is designed to move the head unit 6 above the printed circuit board P1 or the component body P2 (in the Z1 direction) in a horizontal direction (XY direction). The horizontal head movement mechanism 7 comprises an X-axis movement mechanism 71 and a Y-axis movement mechanism 72. The X-axis movement mechanism 71 is configured to move the head unit 6 in the transport direction (X-direction). The head unit 6 is attached to the X-axis movement mechanism 71. The X-axis movement mechanism 71 has a spindle mechanism 71a attached to the head unit 6 and a drive motor 71b that rotates the spindle of the spindle mechanism 71a. The Y-axis movement mechanism 72 is configured to move the X-axis movement mechanism 71 together with the head unit 6 in the Y-direction. The X-axis movement mechanism 71 is attached to the Y-axis movement mechanism 72. The Y-axis movement mechanism 72 has a spindle mechanism 72a attached to the X-axis movement mechanism 71 and a drive motor 72b that rotates the spindle of the spindle mechanism 72a.The head unit 6 is designed such that it can be moved horizontally by the mechanism 7 between the component feeder 100a and the first assembly area 1 or between the component feeder 100a and the second assembly area 2. Component detection section 8 is a camera for component recognition. Component detection section 8 captures the components E, which are held (and drawn in) by the nozzles 61a of the heads 61, before the components E are mounted. Component detection section 8 is fixed to the top surface of a frame of the component mounting device 100 and captures the components E, which are held (and drawn in) by the nozzles 61a of the heads 61, from the underside of the components E (from the Z2 direction). Based on the image of the components E captured by component detection section 8, the control section 10 detects (recognizes) the holding state of the components E (rotational position and holding position at the nozzles 61a of the heads 61). The marker acquisition section 9 is a camera for marker detection. The marker acquisition section 9 captures a position detection marker (not shown) that is applied to the printed circuit board P1 or the component body P2 before the assembly of the components E. The position detection marker is used to identify the position of the printed circuit board P1 or the component body P2. The control section 10 is designed such that, based on the position detection marker captured by the marker acquisition section 9, it detects the exact position and orientation of the printed circuit board P1 or the component body P2. The marker acquisition section 9 is attached to the head unit 6 and is designed to move horizontally (XY direction) above the printed circuit board P1 or the component body P2 (in the Z2 direction) together with the head unit 6. The control section 10 is a control circuit for controlling the operation of the component assembly device 100. The control section 10 includes a CPU (Central Processing Unit), ROM (Read Only Memory), RAM (Random Access Memory), and the like. The control section 10 is designed such that, by controlling the printed circuit board holding section 3, the component body holding section 4, the transport section 5, the head unit 6, the horizontal head movement mechanism 7, the component receiving section 8, and the marking receiving section 9, it performs the assembly of the components E onto the printed circuit board P1 or the component body P2 according to a production program. In the first embodiment, the control section 10 controls the head unit 6 such that it mounts 1 component E on the horizontal mounting surface P2a of the assembly body P2 in the first assembly area and 2 components E on the mounting surfaces P2b of the assembly body P2, which are separate from the horizontal mounting surface P2a, in the second assembly area. The control section 10 controls the head unit 6 such that it mounts 1 component E sequentially on the horizontal mounting surfaces P2a of several assembly bodies P2 in the first assembly area. By continuously mounting the same components E, it is possible to achieve a reduced replacement frequency of the nozzles 61a of the heads 61 and, at the same time, increased suction efficiency.Furthermore, the control section 10 controls the head unit 6 in such a way that it performs for each component P2 a transfer of the component P2 from the transport element 91 to the second assembly area 2 (component holding section 4), a mounting of components E on the mounting surfaces P2b of the component P2 which are separate from the horizontal mounting surface P2a and a transfer of the component P2 from the second assembly area 2 (component holding section 4) to the transport element 91. When the horizontal mounting surface P2a of the component body P2 is held and transferable, the control section 10 controls the head unit 6 in the present embodiment such that the component body P2 is transferred to the second mounting area 2 or a return position from the second mounting area 2 (a specific position on the transport element 91) in a state in which the horizontal mounting surface P2a of the component body P2 is held (suctioned) by the nozzle 61a of the head 61 (see Fig. 6).If the horizontal mounting surface P2a of the placement body P2 is not held and is transferable, the control section 10 controls the head unit 6 such that the placement body P2 is transferred to the second mounting area 2 or a return position from the second mounting area 2 (a specific position on the transport element 91) in a state in which the top surface of the storage element 92 is held (suctioned) by the nozzle 61a of the head 61 (see Fig. 5). For example, the control section 10 controls the head unit 6 in such a way that it does not perform any assembly of components E on the horizontal mounting surface P2a of the assembly body P2 in the first assembly area 1, but only performs the assembly of components E on the horizontal mounting surface P2a of the assembly body P2 in the first assembly area 1 after completion of the assembly on the mounting surfaces P2b of the assembly body P2, which are separate from the horizontal mounting surface P2a, in the second assembly area 2.For example, the control section 10 controls the head unit 6 such that in the first assembly area 1 it performs only part of the assembly of components E on the horizontal mounting surface P2a of the assembly body P2, then completes the assembly of components E on the mounting surfaces P2b of the assembly body P2, which are separate from the horizontal mounting surface P2a, in the second assembly area 2, and then completes the assembly of components E on the horizontal mounting surface P2a of the assembly body P2 in the first assembly area 1. The control section 10 also controls the head unit 6, for example, such that after completing the assembly of components E on the horizontal mounting surface P2a of the assembly body P2 in the first assembly area 1, it completes the assembly of the mounting surfaces P2b of the assembly body P2, which are separate from the horizontal mounting surface P2a, in the second assembly area 2.The control section 10 also controls the head unit 6, for example, such that while the position of a specific component P2 is being changed in the second assembly area 2, it mounts components E on the horizontal mounting surface P2a of a different component P2 in the first assembly area 1. "Completing the assembly of components on a mounting surface" means that the machine itself (component mounting device 100) has finished mounting components on the mounting surface. In other words, "Completing the assembly of components on a mounting surface" means that the machine has completed the assembly of components on a mounting surface designated for this purpose.This means that "completing the assembly of components on an assembly surface" refers not only to a state in which the assembly of components on the entire assembly surface has been completed and this machine has completed the assembly of components on the assembly surface, but also to a state in which the assembly of components at assembly positions on a part of the assembly surface has not yet been completed, but the assembly of components on the assembly surface has been completed by this machine. In the latter case, for example, a component assembly device downstream of the machine mounts components at a portion of the assembly positions on the assembly surface. Furthermore, in the present embodiment, the control section 10 controls the head unit 6 such that it performs the assembly of components E on the horizontal mounting surface P2a of the assembly body P2 in the first assembly area 1 and the assembly of components E on the mounting surfaces P2b of the assembly body P2, which are separate from the horizontal mounting surface, in the second assembly area 2, in a sequence that is determined based on information about any obstruction between the head unit 6 and the components E on the horizontal mounting surface P2a of the assembly body P2 during the transfer of the assembly body P2 and information about production efficiency. The obstruction information is information about whether, during the transfer of the assembly body P2, the nozzles 61a of the heads 61 of the head unit 6 and the components E on the horizontal mounting surface P2a of the assembly body P2 obstruct (collide) each other or not.Information regarding obstructions can be determined, for example, based on information about the shape of the assembly body P2, the shape of the head unit 6, and the shape of the components E on the horizontal mounting surface P2a of the assembly body P2. Production efficiency information indicates whether the efficiency of assembling components E on the horizontal mounting surface P2a of the assembly body P2 in the first assembly area 1 is better, or whether the efficiency of assembling components E on the separate mounting surfaces P2b of the assembly body P2 in the second assembly area 2 is better. Production efficiency information can be determined through simulation (cycle simulation). The control section 10 controls the head unit 6 in such a way that it performs the assembly of components E on the horizontal mounting surface P2a of the assembly body P2 in the first assembly area 1 and the assembly of components E on the mounting surfaces P2b of the assembly body P2, which are separate from the horizontal mounting surface, in the second assembly area 2 in a sequence which is defined on the basis of the obstruction information in such a way that the head unit 6 and the components E on the horizontal mounting surface P2a of the assembly body P2 do not obstruct (collide with) each other during the transfer of the assembly body P2.The control section 10 also controls the head unit 6 in such a way that it performs the assembly of components E on the horizontal mounting surface P2a of the assembly body P2 in the first assembly area 1 and the assembly of components E on the mounting surfaces P2b of the assembly body P2, which are separate from the horizontal mounting surface, in the second assembly area 2 in a sequence which is determined on the basis of the information on production efficiency in such a way that the production efficiency is improved (the production time is reduced). Processing to determine the assembly sequence With reference to Figures 10 and 11, a process for defining the assembly sequence of the component assembly device 100 is now described using a flowchart. This process is performed before the start of production of the component assembly body P2. The process can be performed by the component assembly device 100 or by an external device such as an administrative device. As shown in Fig. 10, step S1 first assesses whether it is possible to mount a component E on the horizontal mounting surface P2a of the component carrier P2 in the first mounting area 1. If it is determined that mounting is not possible (for example, because the component carrier P2 is hemispherical and therefore does not have a horizontal mounting surface P2a), the process proceeds to step S2. Step S2 determines whether the assembly of components E on all mounting surfaces of the assembly body P2 is completed in the second assembly area 2. The processing to define the assembly sequence then ends. If, in step S1, it is determined that assembly is possible, a transition to step S3 takes place. In step S3, it is determined whether the horizontal mounting surface P2a of the component body P2 is held and can be transferred. If it is determined that it can be transferred, the process proceeds to step S4. If it is determined that it can be transferred, it is determined that the horizontal mounting surface P2a of the component body P2 is held (suctioned) by the nozzle 61a of the head 61 and the component body P2 is transferred (see Fig. 6). In step S4, based on the production efficiency information, a decision is made as to whether it is more efficient to divide the assembly of components E on the horizontal mounting surface P2a of the assembly body P2 in the first assembly area 1 into two phases: before and after the assembly of components E on the separate mounting surfaces P2b of the assembly body P2 in the second assembly area 2. If it is determined that this is not more efficient, the process proceeds to step S5. In step S5, an assembly sequence is defined such that no assembly of components E is carried out on the horizontal mounting surface P2a of the assembly body P2 in the first assembly area 1. Instead, the assembly of components E on the horizontal mounting surface P2a of the assembly body P2 in the first assembly area 1 is only carried out after completion of the assembly on the mounting surfaces P2b of the assembly body P2, which are separate from the horizontal mounting surface P2a, in the second assembly area 2. The processing for defining the assembly sequence then ends. If step S4 determines that it is efficient, a transition to step S9 takes place (see Fig. 11). In step S9, an assembly sequence is defined such that in the first assembly area 1, only part of the assembly of components E is carried out on the horizontal mounting surface P2a of the assembly body P2. Then, in the second assembly area 2, components E are mounted on the mounting surfaces P2b of the assembly body P2, which are separate from the horizontal mounting surface P2a. Finally, in the first assembly area 1, components E are mounted on the horizontal mounting surface P2a of the assembly body P2. The processing to define the assembly sequence then ends. If in step S3 it is determined that transfer is not possible, the process proceeds to step S6. If it is determined that transfer is not possible, it is determined that the top surface of the storage element 92 is held (suctioned) by the nozzle 61a of the head 61 and the component body P2 is transferred (see Fig. 5). Then, in step S6, based on the information regarding obstruction, a decision is made as to whether, during the transfer of the assembly body P2, the head unit 6 and the components E on the horizontal mounting surface P2a of the assembly body P2 obstruct (collide) each other. If it is determined that the head unit 6 and the components E obstruct (collide) each other, the process proceeds to step S5. In step S5, an assembly sequence is defined such that no assembly of components E is carried out on the horizontal mounting surface P2a of the assembly body P2 in the first assembly area 1. Instead, the assembly of components E on the horizontal mounting surface P2a of the assembly body P2 in the first assembly area 1 is only carried out after completion of the assembly on the mounting surfaces P2b of the assembly body P2, which are separate from the horizontal mounting surface P2a, in the second assembly area 2. The processing for defining the assembly sequence then ends. If in step S6 it is determined that the head unit 6 and the components E do not obstruct each other (collide), a transition to step S7 takes place. As shown in Fig. 11, in step S7, based on the production efficiency information, a judgment is made as to whether it is more efficient to mount components E on the horizontal mounting surface P2a of the assembly body P2 in the first mounting area 1. If it is judged that this is not efficient, the process proceeds to step S2. Step S2 determines whether the assembly of components E on all mounting surfaces of the assembly body P2 is completed in the second assembly area 2. The processing to define the assembly sequence then ends. If step S7 determines that it is more efficient, a transition to step S8 takes place. In step S8, based on the production efficiency information, a decision is made as to whether it is more efficient to divide the assembly of components E on the horizontal mounting surface P2a of the assembly body P2 in the first assembly area 1 into two phases: before and after the assembly of components E on the separate mounting surfaces P2b of the assembly body P2 in the second assembly area 2. If this is deemed more efficient, the process proceeds to step S9. In step S9, an assembly sequence is defined such that in the first assembly area 1, only part of the assembly of components E is carried out on the horizontal mounting surface P2a of the assembly body P2. Then, in the second assembly area 2, components E are mounted on the mounting surfaces P2b of the assembly body P2, which are separate from the horizontal mounting surface P2a. Finally, in the first assembly area 1, components E are mounted on the horizontal mounting surface P2a of the assembly body P2. The processing to define the assembly sequence then ends. If step S8 determines that it is not more efficient, the process moves to step S10. In step S10, based on the production efficiency information, a judgment is made as to whether it is more efficient to mount components E on the horizontal mounting surface P2a of the assembly body P2 in the first assembly area 1 before mounting components E on the mounting surfaces P2b of the assembly body P2, which are separate from the horizontal mounting surface P2a, in the second assembly area 2. If it is judged that this is more efficient, the process proceeds to step S11. In step S11, an assembly sequence is defined such that, after the assembly of components E on the horizontal mounting surface P2a of the assembly body P2 in the first assembly area 1 is completed, the assembly of the mounting surfaces P2b of the assembly body P2, which are separate from the horizontal mounting surface P2a in the second assembly area 2, is completed. The processing for defining the assembly sequence then ends. If step S10 determines that it is not more efficient, the process moves to step S5. In step S5, an assembly sequence is defined such that no components E are mounted on the horizontal mounting surface P2a of the assembly body P2 in the first assembly area 1. Instead, the mounting of components E on the horizontal mounting surface P2a of the assembly body P2 in the first assembly area 1 only takes place after the mounting on the separate mounting surfaces P2b of the assembly body P2 in the second assembly area 2 is completed. The processing to define the assembly sequence then ends. The assembly of the assembly body P2 is then carried out according to the assembly sequence defined as described above. First example of assembly processing Next, with reference to Fig. 12, a first example of the assembly process by the component assembly device 100 is described. In this first example, no assembly of components E is carried out on the horizontal mounting surface P2a of the assembly body P2 in the first assembly area 1. Instead, the assembly of components E on the horizontal mounting surface P2a of the assembly body P2 in the first assembly area 1 is only carried out and completed after the assembly on the mounting surfaces P2b of the assembly body P2, which are separate from the horizontal mounting surface P2a, in the second assembly area 2. The individual processing steps in the flowchart are executed by the control section 10. As shown in Fig. 12, in step S21 several assembly bodies P2, which are arranged on the transport element 91 and the storage element 92, are first transported by the transport section 5. Then, in step S22, one of several component bodies P2 is transferred by the head unit 6 from the transport element 91 to the second assembly area 2 (component holding section 4). The component body P2 is transferred in step S22 according to the transfer method defined by the processing to determine the assembly sequence. Thus, the component body P2 is transferred by the head unit 6 in a state where the horizontal mounting surface P2a of the component body P2 is held (suctioned) by the nozzle 61a of a head 61, or the component body P2 is transferred by the head unit 6 in a state where the top surface of the storage element 92 is held (suctioned) by the nozzle 61a of a head 61. In step S23, the head unit 6 performs and completes the assembly of components E on the mounting surface P2b of the component carrier P2, which is separate from the horizontal mounting surface P2a and is held by the component carrier holding section 4, in the second assembly area 2. In step S23, the head unit 6 performs the assembly of components E on the mounting surface P2b of the component carrier P2, which is held by the component carrier holding section 4, in a state in which the component carrier holding section 4 is controlled such that the mounting surface P2b of the component carrier P2 is horizontal. In step S24, the component carrier P2 is transferred by the head unit 6 from the second assembly area 2 (component carrier holding section 4) to the transport element 91. The component carrier P2 is transferred in step S24, as in step S22, using the transfer method defined by the processing to determine the assembly sequence. In step S25, it is determined whether all of the multiple component bodies P2 have been transferred (i.e., whether the assembly of the individual mounting surfaces P2b of the multiple component bodies P2, separate from the horizontal mounting surface P2a, has been completed). If it is determined that one of the component bodies P2 among the multiple component bodies P2 has not been transferred, the process proceeds to step S22. Then, the operations of steps S22 to S24 are performed on the component body P2 that has not yet been transferred. If, in step S25, it is determined that all of the multiple component bodies P2 have been transferred, a transition to step S26 takes place. In step S26, the head unit 6 performs and completes the mounting of components E on the horizontal mounting surface P2a of the assembly body P2 on the transport element 91 in the first mounting area 1. In step S26, the head unit 6 sequentially mounts the components E on the horizontal mounting surfaces P2a of the several assembly bodies P2 on the transport element 91. In step S27, the multiple assembly bodies P2, on whose horizontal mounting surfaces P2a and mounting surfaces P2b separate from the horizontal mounting surfaces P2a, components E have been mounted, are transported away by transport section 5. The assembly process then ends. Second example of assembly processing Next, with reference to Fig. 13, a second example of assembly processing by the component assembly device 100 is described. In this second example, the assembly of only some of the components E onto the horizontal mounting surface P2a of the assembly body P2 is carried out in the first assembly area 1. Then, the assembly of components E onto the mounting surfaces P2b of the assembly body P2, which are separate from the horizontal mounting surface P2a, is completed in the second assembly area 2. Finally, the assembly of components E onto the horizontal mounting surface P2a of the assembly body P2 in the first assembly area 1 is completed. The individual processing steps in the flowchart are executed by the control section 10. Processes that are identical to those in the first example of assembly processing are indicated in the figure with the same reference numerals, and their detailed description is omitted. As shown in Fig. 13, in step S21 several assembly bodies P2, which are arranged on the transport element 91 and the storage element 92, are first transported by the transport section 5. In step S31, the head unit 6 performs only part of the assembly of components E on the horizontal mounting surface P2a of the assembly body P2 on the transport element 91 in the first assembly area 1. In step S31, the head unit 6 performs the assembly of the components E sequentially on part of the horizontal mounting surfaces P2a of the several assembly bodies P2 on the transport element 91. The processing steps S22 to S25 are carried out in the same way as in the first example of assembly processing. In step S26a, the head unit 6 performs and completes the mounting of components E on the horizontal mounting surface P2a of the assembly body P2 on the transport element 91 in the first mounting area 1. In step S26a, the head unit 6 sequentially mounts the components E on the portion of the horizontal mounting surfaces P2a of the multiple assembly bodies P2 on the transport element 91 that was not mounted in step S31. In step S27, the multiple assembly bodies P2, on whose horizontal mounting surfaces P2a and on separate mounting surfaces P2b components E have been mounted, are transported away by transport section 5. The assembly process then ends. Third example of assembly processing Next, with reference to Fig. 14, a third example of assembly processing by the component assembly device 100 is described. This third example describes a process in which, after the assembly of components E on the horizontal mounting surface P2a of the assembly body P2 in the first assembly area 1 is completed, the assembly of the mounting surfaces P2b of the assembly body P2, which are separate from the horizontal mounting surface P2a, is completed in the second assembly area 2. The individual processing steps in the flowchart are executed by the control section 10. Processes that are identical to those in the first example of assembly processing are indicated in the figure with the same reference numerals, and their detailed description is omitted. As shown in Fig. 14, in step S21 several assembly bodies P2, which are arranged on the transport element 91 and the storage element 92, are first transported by the transport section 5. In step S41, the head unit 6 performs and completes the mounting of components E on the horizontal mounting surface P2a of the assembly body P2 on the transport element 91 in the first assembly area 1. In step S41, the head unit 6 sequentially mounts the components E on the horizontal mounting surfaces P2a of the several assembly bodies P2 on the transport element 91. The processing steps S22 to S25 are carried out in the same way as in the first example of assembly processing. In step S27, the multiple assembly bodies P2, on whose horizontal mounting surfaces P2a and mounting surfaces P2b separate from the horizontal mounting surfaces P2a, components E have been mounted, are transported away by transport section 5. The assembly process then ends. Effect of the first embodiment The following effects can be achieved with the first embodiment. As described above, in the first embodiment the control section 10 is designed such that it controls the head unit 6 in such a way that it mounts components E on the horizontal mounting surface P2a of the assembly body P2 in the first assembly area 1, which is provided on the transport path 5a for transporting the assembly body P2, and in the second assembly area 2, which is different from the first assembly area 1, it mounts components E on the mounting surfaces P2b of the assembly body P2, which are separate from the horizontal mounting surface P2a.This allows components E to be mounted on the horizontal mounting surface P2a of the assembly body P2 in the first assembly area 1, located on transport path 5a. This mounting surface can be accessed in a state arranged on transport path 5a. In the second assembly area 2, which differs from the first assembly area 1, components E can be mounted on the mounting surfaces P2b of the assembly body P2, which are separate from the horizontal mounting surface P2a and cannot be accessed in the state arranged on transport path 5a. As a result, components E can be mounted in different areas on the horizontal mounting surface P2a and on the mounting surfaces P2b of the assembly body P2, which are separate from the horizontal mounting surface P2a. This increases the degree of freedom when assembling an assembly body P2 with a horizontal mounting surface P2a and mounting surfaces P2b that are separate from the horizontal mounting surface P2a.In this way, the component mounting device 100 can be provided, with which components E can be mounted with high efficiency on the assembly body P2, which has the horizontal mounting surface P2a and the mounting surfaces P2b separate from the horizontal mounting surface P2a. Furthermore, in the first embodiment, the first mounting area 1 is an area in which the components E are mounted by the head unit 6 onto a printed circuit board P1 in the form of a flat plate. This allows the components E to be mounted on the horizontal mounting surface P2a of the assembly body P2 using a mounting area for the printed circuit board P1, which has the shape of a flat plate. In this way, it is not necessary to provide a separate mounting area for the horizontal mounting surface P2a of the assembly body P2 from the mounting area for the printed circuit board P1, which has the shape of a flat plate. Compared to providing a separate mounting area for the horizontal mounting surface P2a of the assembly body P2 from the mounting area for the printed circuit board P1, this reduces the number of components E and simplifies the structure. As described above, in the first embodiment, the control section 10 is configured such that it controls the head unit 6 to mount components E sequentially onto the horizontal mounting surface P2a of several assembly bodies P2 in the first assembly area 1. This allows the mounting of components E onto the horizontal mounting surfaces P2a of several assembly bodies P2 to be carried out in a single operation in the first assembly area 1. In contrast to the second assembly area 2, where the mounting of components E onto the horizontal mounting surfaces P2a of several assembly bodies P2 is carried out individually for each assembly body P2, this method allows for highly efficient mounting of components E onto the horizontal mounting surfaces P2a of several assembly bodies P2. As described above, in the first embodiment, the control section 10 is configured to control the head unit 6 such that it mounts 2 components E on the mounting surfaces P2b of the assembly body P2 in the second assembly area, which are separate from the horizontal mounting surface P2a, and then mounts 1 component E on the horizontal mounting surface P2a of the assembly body P2 in the first assembly area. If production efficiency is higher or the timing for transferring the assembly body P2 is more favorable, the components E can thus be efficiently mounted on the assembly body P2 at the appropriate time if 2 components E are first mounted on the mounting surfaces P2b of the assembly body P2 in the second assembly area, which are separate from the horizontal mounting surface P2a, and then 1 component E is mounted on the horizontal mounting surface P2a of the assembly body P2 in the first assembly area.As described above, in the first embodiment the control section 10 is also designed such that it controls the head unit 6 in such a way that it performs only part of the assembly of components E on the horizontal mounting surface P2a of the assembly body P2 in the first assembly area 1, then performs the assembly of components E on the mounting surfaces P2b of the assembly body P2, which are separate from the horizontal mounting surface P2a, in the second assembly area 2, and then performs the assembly of components E on the horizontal mounting surface P2a of the assembly body P2 in the first assembly area 1.In the event that production efficiency is higher or the timing for a transfer of the assembly body P2 is more favorable, if only part of the assembly of components E is carried out on the horizontal mounting surface P2a of the assembly body P2 in the first assembly area 1, then in the second assembly area 2 components E are mounted on the mounting surfaces P2b of the assembly body P2, which are separate from the horizontal mounting surface P2a, and then in the first assembly area 1 components E are mounted on the horizontal mounting surface P2a of the assembly body P2, the components E can thus be mounted efficiently on the assembly body P2 at the appropriate time. As described above, in the first embodiment, the control section 10 is further configured such that it controls the head unit 6 so that, after mounting components E on the horizontal mounting surface P2a of the assembly body P2 in the first mounting area 1, it performs the mounting of components on the separate mounting surfaces P2b of the assembly body P2 in the second mounting area 2. This allows the components E to be mounted on the assembly body P2 with high efficiency if production efficiency is higher when components E are first mounted on the horizontal mounting surface P2a of the assembly body P2 in the first mounting area 1 and then mounted on the separate mounting surfaces P2b of the assembly body P2 in the second mounting area 2. As described above, in the first embodiment, the control section 10 is further configured such that it controls the head unit 6 to hold the horizontal mounting surface P2a of the component carrier P2 and thereby transfer the component carrier P2 to the second mounting area 2, which is the transfer target, or to a return position from the second mounting area 2. This allows the horizontal mounting surface P2a of the component carrier P2 to be held in a state of incomplete component assembly on the head unit 6. In this way, a holding position of the head unit 6 on the horizontal mounting surface P2a of the component carrier P2 can be easily ensured. Furthermore, in the first embodiment, the control section 10 is designed such that it controls the head unit 6 in such a way that it performs the assembly of components E on the horizontal mounting surface P2a of the assembly body P2 in the first assembly area 1 and the assembly of components E on the mounting surfaces P2b of the assembly body P2, which are separate from the horizontal mounting surface, in the second assembly area 2 in a sequence that is determined on the basis of information on an obstruction between the head unit 6 and components E on the assembly body P2 during the transfer of the assembly body P2 and information on production efficiency.If the assembly of components E is performed in a sequence determined based on information about a potential obstruction between the head unit 6 and components E on the assembly body P2 during the transfer of the assembly body P2, the assembly of components E can be carried out in such a way that an obstruction (a collision) between the head unit 6 and components E on the assembly body P2 during the transfer of the assembly body P2 is avoided. Since an obstruction (a collision) between the head unit 6 and components E on the assembly body P2 during the transfer of the assembly body P2 is avoided, a size limitation of the assembly body P2 and the components E can be prevented in this way.If the assembly of the components E is carried out in a process that is determined on the basis of information on production efficiency, the assembly of the components E on the assembly body P2 can be carried out with high efficiency. In the first embodiment, the second assembly area 2 is located outside the transport path 5a. Since the second assembly area 2 can thus be located outside the transport path 5a where the first assembly area 1 is located, sufficient space for the second assembly area 2 can easily be provided. Furthermore, more space is available along the transport path 5a corresponding to the second assembly area 2, which is not located there. Therefore, sufficient space for the first assembly area 1 can easily be provided along the transport path 5a. Second embodiment With reference to Fig. 15, a second embodiment is now described. In this second embodiment, an example is described in which the component assembly device has several head units, thus differing from the first embodiment, in which the component assembly device has a single head unit. Identical assembly elements as in the first embodiment described above are provided with the same reference numerals, and their description is omitted. Design of the component assembly device A component assembly device 200 of the second embodiment of the present invention differs from the component assembly device 100 of the first embodiment described above in that, as shown in Fig. 15, it has several (two) head units 6 and a control section 110. The several head units 6 are designed to be movable independently of one another. In the second embodiment, the control section 110 controls the head units 6 in the same way as in the first embodiment, such that in the first assembly area 1 they mount components E on the horizontal mounting surface P2a of the assembly body P2 and in the second assembly area 2 they mount components E on the mounting surfaces P2b of the assembly body P2, which are separate from the horizontal mounting surface P2a. More precisely, the control section 110 controls the head units 6 such that they perform the mounting of components E on the horizontal mounting surface P2a of one assembly body P2 (a specific assembly body P2) in the first assembly area 1 and the mounting of components E on the mounting surfaces P2b of another assembly body P2 (a different assembly body P2 than the specific assembly body P2) in the second assembly area 2 simultaneously.The control section 110 controls the head units 6 even more precisely in such a way that they carry out the assembly of components E one after the other on the horizontal mounting surfaces P2a of several assembly bodies P2 in the first assembly area 1 and the assembly of components E on the mounting surfaces P2b of other assembly bodies P2 in the second assembly area 2, which are separate from the horizontal mounting surface P2a. The design of the second embodiment otherwise corresponds to that of the first embodiment. Effect of the second embodiment The second embodiment can achieve the following effects. In the second embodiment, the control section 110 is configured as described above such that it controls the head units 6 to perform the assembly of components E on the horizontal mounting surface P2a of a component carrier P2 in the first assembly area 1 and the assembly of components E on the separate mounting surfaces P2b of another component carrier P2 in the second assembly area 2 simultaneously. Since the assembly of components E on the horizontal mounting surface P2a of one component carrier P2 in the first assembly area 1 and the assembly of components E on the separate mounting surfaces P2b of another component carrier P2 in the second assembly area 2 can thus be performed simultaneously, the time required for assembling the components E can be reduced. The effects of the second embodiment are otherwise the same as those of the first embodiment. Third embodiment Next, a third embodiment is described with reference to Fig. 16. Unlike the first and second embodiments, the third embodiment describes an example of a component assembly system comprising several component assembly devices. The same components as in the first embodiment described above are identified by the same reference numerals, and their description is omitted. Design of the component assembly system A component assembly system 300 of the third embodiment of the present invention comprises, as shown in Fig. 16, several (three) component assembly devices 400, 500 and 600. The component assembly devices 400, 500 and 600 are arranged in the aforementioned order from the upstream side in the transport direction of the component carriers P2 to the downstream side (in the X1 direction). The component assembly device 400 (600) is located on the transport path 5a and has an assembly area 401 (601) in which a head unit 6 assembles components E onto a printed circuit board P1. However, the component assembly device 400 (600) does not have an assembly area in which the head unit 6 assembles components E onto a mounting body P2. The component assembly device 400 (600) is a device with which components E can be assembled exclusively onto a printed circuit board P1. The component assembly device 400 (600) has a printed circuit board holding section 3, a transport section 5, the head unit 6, a mechanism 7 for horizontal head movement, a component receiving section 8, a marking receiving section 9, and a control section 410 (610). The control section 410 (610) is a control circuit for controlling the operation of the component assembly device 400 (600).The control section 410 (610) comprises a CPU, ROM, RAM, and the like. The component mounting device 400 (600) is an example of the "first component mounting device" of the claims. The mounting area 401 (601) is an example of the "first mounting area" of the claims. The head unit 6 of the component mounting device 400 (600) is an example of the "first head unit" of the claims. The component mounting device 400 (600) can also have a mounting area in which the mounting of components E onto a component body P2 is carried out by the head unit 6. The component assembly device 500 has a similar design to the component assembly device 100 of the first embodiment. The component assembly device 500 comprises a first assembly area 1, a second assembly area 2, a printed circuit board holding section 3, a component holding section 4, a transport section 5, a head unit 6, a mechanism 7 for horizontal head movement, a component receiving section 8, a marking receiving section 9, and a control section 510. The control section 510 is a control circuit for controlling the operation of the component assembly device 500. The control section 510 includes a CPU, ROM, RAM, and the like. The component assembly device 500 is an example of the "second component assembly device" of the claims. The head unit 6 of the component assembly device 500 is an example of the "second head unit" of the claims.The component assembly device 500 does not need to have a first assembly area 1. In the third embodiment, the control section 410 (610) of the component assembly device 400 (600) controls its own head unit 6 such that components E are mounted on the horizontal mounting surface P2a of the assembly body P2 in its own assembly area 401 (601). The control section 410 (610) of the component assembly device 400 (600) controls its own head unit 6 such that it mounts components E successively on the horizontal mounting surfaces P2a of several assembly bodies P2. Furthermore, the control section 510 of the component assembly device 500 controls its own head unit 6 such that it mounts two components E on the mounting surfaces P2b of the assembly body P2 in the second assembly area, which are separate from the horizontal mounting surface P2a.When the horizontal mounting surface P2a of the component body P2 is held and transferable, the control section 510 controls the head unit 6 of the component assembly device 500 such that the component body P2 is transferred to the second assembly area 2 or a return position from the second assembly area 2 (a specific position on the transport element 91) in a state in which the horizontal mounting surface P2a of the component body P2 is held (suctioned) by the nozzle 61a of the head 61.If the horizontal mounting surface P2a of the component body P2 is not held and is transferable, the control section 510 of the component mounting device 500 controls the head unit 6 such that the component body P2 is transferred to the second mounting area 2 or a return position from the second mounting area 2 (a specific position on the transport element 91) in a state in which the top surface of the storage element 92 is held (suctioned) by the nozzle 61a of the head 61. The operation of the component assembly system 300 is, for example, as follows. First, the control section 410 of the upstream component assembly device 400 controls its own head unit 6 such that it mounts 1 component E on the horizontal mounting surface P2a of the assembly body P2 in the first assembly area. Then, the control section 510 of the component assembly device 500 controls its own head unit 6 such that it mounts 2 component E on the mounting surfaces P2b of the assembly body P2, which are separate from the horizontal mounting surface P2a, in the second assembly area. Subsequently, the control section 610 of the downstream component assembly device 600 controls its own head unit 6 such that it mounts component E on the horizontal mounting surface P2a of the assembly body P2. If the component assembly system 300 does not have an upstream component assembly device 400, the operation of the component assembly system 300 is as follows. First, the control section 510 of the component assembly device 500 controls its own head unit 6 such that it mounts 2 components E in the second assembly area on the mounting surfaces P2b of the assembly body P2, which are separate from the horizontal mounting surface P2a. Subsequently, the control section 610 of the downstream component assembly device 600 controls its own head unit 6 such that it mounts components E on the horizontal mounting surface P2a of the assembly body P2. If the component assembly system 300 does not have a downstream component assembly device 600, the operation of the component assembly system 300 is as follows. First, the control section 410 of the upstream component assembly device 400 controls its own head unit 6 such that it mounts 1 component E on the horizontal mounting surface P2a of the assembly body P2 in the first assembly area. Then, the control section 510 of the component assembly device 500 controls its own head unit 6 such that it mounts 2 component E on the mounting surfaces P2b of the assembly body P2, which are separate from the horizontal mounting surface P2a, in the second assembly area. The design of the third embodiment otherwise corresponds to that of the first embodiment. Effect of the third embodiment The third embodiment can achieve the following effects. In the third embodiment, the component assembly system 300 is designed as described above such that it comprises the component assembly device 400 (600), which controls its own head unit 6 in such a way that it mounts components E on the horizontal mounting surface P2a of the assembly body P2 in the assembly area 401 (601), which is provided on the transport path for transporting the assembly body P2, and the component assembly device 500, which controls its own head unit 6 in such a way that it mounts components E on the mounting surfaces P2b of the assembly body P2 in the second assembly area 2, which is different from the first assembly area 401 (601), which is separate from the horizontal mounting surface P2a.In this way, the component mounting system 300 can be provided, with which, as with the component mounting device 100 of the first embodiment, components E can be mounted with high efficiency on the assembly body P2, which has the horizontal mounting surface P2a and the mounting surfaces P2b separate from the horizontal mounting surface P2a. The effects of the third embodiment are otherwise the same as those of the first embodiment. Examples of variations The disclosed embodiments are to be understood in every respect as exemplary and not limiting. The scope of the present invention is not set out in the preceding description of the embodiments, but in the claims, and also includes all equivalents and modifications within the claims (examples of modifications). The head unit in the first to third embodiments is shown as an example of a head unit for surface mounting, but the present invention is not limited thereto. In the present invention, the head unit can also be a head unit for through-hole mounting of components, which guides through-hole components (conductor components and the like) into through-holes formed in a mounting body. In the first to third embodiments, the first mounting area is shown by way of example as an area in which components are mounted on a printed circuit board by a head unit, but the present invention is not limited thereto. For example, the first mounting area can also be an area in which components are mounted on the horizontal mounting surface of a component carrier by a head unit. In the first to third embodiments, the second assembly area is shown by way of example as being provided outside the transport path, but the present invention is not limited thereto. The second assembly area can, for example, also be provided on the transport path. In the first to third embodiments, it is shown by way of example that the component is transported in a state arranged on the transport element (storage element), but the present invention is not limited thereto. For example, the component can also be transported directly without being arranged on the transport element (storage element). The first to third embodiments show by way of example that several component carriers are transported at once, but the present invention is not limited thereto. For example, only one component carrier can also be transported at a time. In the first and second embodiments, it is shown by way of example that the assembly sequence is determined based on information about hindrances and production efficiency, but the present invention is not limited thereto. In the present invention, the assembly sequence can also be determined based solely on information about hindrances or solely on information about production efficiency. Furthermore, the assembly sequence can be determined based on information other than information about hindrances and production efficiency. In the first embodiment, the processing operation was described for simplicity using flowcharts based on a sequence, whereby processing operations are carried out sequentially according to a processing sequence. However, the present invention is not limited to this. The processing operation can also be carried out in event-based processing, in which the processing operations are executed event by event. This can involve purely event-based control or control that is partly event-based and partly sequence-based.

Claims

Component assembly device (100), comprising: a head unit (6) which mounts components (E) on a three-dimensional assembly body (P2) on a transport path (5a), the assembly body having a horizontal mounting surface (P2a) and an inclined mounting surface (P2b) inclined with respect to the horizontal mounting surface (P2a), and a control section (10) which controls the head unit (6) such that it mounts components (E) on the horizontal mounting surface (P2a) of the three-dimensional assembly body (P2) in a first assembly area (1) which is provided on the transport path (5a) for transporting the assembly body (P2), and in a second assembly area (2) which is different from the first assembly area (1), it mounts components (E) on the inclined mounting surface (P2b) of the three-dimensional assembly body (P2). Component assembly device (100) according to claim 1, wherein the first assembly area (1) is an area in which components (E) are mounted on a printed circuit board or on a substrate in the form of a flat plate by the head unit (6). Component assembly device (100) according to claim 1 or 2, wherein the control section (10) is configured such that it controls the head unit (6) in such a way that it successively mounts components (E) onto the horizontal mounting surfaces (P2a) of several assembly bodies (P2) in the first assembly area (1). Component assembly device (100) according to one of claims 1 to 3, wherein the control section (10) is designed such that it controls the head unit (6) in such a way that it mounts components (E) on the inclined mounting surface (P2b) of the assembly body (P2) in the second assembly area (2) and then mounts components (E) on the horizontal mounting surface (P2a) of the assembly body (P2) in the first assembly area (1). Component assembly device (100) according to one of claims 1 to 4, wherein the control section (10) is designed such that it controls the head unit (6) in such a way that it performs only part of the assembly of components (E) on the horizontal mounting surface (P2a) of the assembly body (P2) in the first assembly area (1), mounts components (E) on the inclined mounting surface (P2b) of the assembly body (P2) in the second assembly area (2) and then mounts components (E) on the horizontal mounting surface (P2a) of the assembly body (P2) in the first assembly area (1). Component assembly device (100) according to one of claims 1 to 5, wherein the control section (10) is designed such that it controls the head unit (6) in such a way that it mounts components (E) on the horizontal mounting surface (P2a) of the assembly body (P2) in the first assembly area (1) and then mounts components (E) on the inclined mounting surface (P2b) of the assembly body (P2) in the second assembly area (2). Component assembly device (100) according to one of claims 5 and 6, wherein the control section (10) is configured such that it controls the head unit (6) in such a way that it holds the horizontal mounting surface (P2a) of the component body (P2) and thereby transfers the component body (P2) to the second assembly area (2), which is the transfer destination, or to a return position from the second assembly area (2). Component assembly device (100) according to one of claims 1 to 7, wherein the control section (10) is configured such that it controls the head unit (6) to perform the assembly of components (E) on the horizontal mounting surface (P2a) of the assembly body (P2) in the first assembly area (1) and the assembly of components (E) on the inclined mounting surface (P2b) of the assembly body (P2) in the second assembly area (2) in a sequence which is determined on the basis of information on an obstruction between the head unit (6) and components (E) on the assembly body (P2) during the transfer of the assembly body (P2) and / or information on production efficiency. Component assembly device (100) according to one of claims 1 to 8, wherein the control section (10) is configured such that it controls several head units (6) in such a way that they perform the assembly of components (E) on the horizontal mounting surface (P2a) of a component body (P2) in the first assembly area (1) and the assembly of components (E) on the inclined mounting surface (P2b) of another component body (P2) in the second assembly area (2) in parallel. Component assembly device (100) according to one of claims 1 to 9, wherein the second assembly area (2) is provided outside the transport path (5a). Component assembly system (300), comprising: a first component assembly device (400, 600) with a first head unit (6) that mounts components (E) on a three-dimensional assembly body (P2) along a transport path (5a), the assembly body having a horizontal mounting surface (P2a) and an inclined mounting surface (P2b) inclined with respect to the horizontal mounting surface (P2a), and controlling the first head unit (6) such that it mounts components (E) on the horizontal mounting surface (P2a) of the three-dimensional assembly body (P2) in a first assembly area (401, 601) provided along the transport path (5a) for transporting the assembly body (P2), and a second component assembly device (500) with a second head unit (6) for mounting components (E) on the assembly body (P2), controlling the second head unit (6) such that it mounts components (E) on the horizontal mounting surface (P2a) of the three-dimensional assembly body (P2) in a second assembly area (401, 601) provided along the transport path (5a) for transporting the assembly body (P2), and a second component assembly device (500) with a second head unit (6) for mounting components (E) on the assembly body (P2), which controls the second head unit (6) such that it mounts components (E) on the horizontal mounting surface (P2a) of the three-dimensional assembly body (P2) in a second assembly area (401, 601) provided along the transport path (5a) for transporting the assembly body (P2) Assembly area (2), which is different from the first assembly area (1),Components (E) are mounted on the inclined mounting surface (P2b) of the three-dimensional assembly body (P2). Component assembly method, wherein components (E) are mounted on a three-dimensional assembly body (P2) on a transport path (5a), the assembly body having a horizontal mounting surface (P2a) and an inclined mounting surface (P2b) inclined with respect to the horizontal mounting surface (P2a), wherein in a first assembly area (1) provided on the transport path (5a) for transporting the assembly body (P2), components (E) are mounted on the horizontal mounting surface (P2a) of the three-dimensional assembly body (P2), and in a second assembly area (2) different from the first assembly area (1), components (E) are mounted on the inclined mounting surface (P2b) of the three-dimensional assembly body (P2).

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