Light-emitting substrate and manufacturing method therefor, backlight module and display device

Abstract

A light-emitting substrate comprising: a substrate, a plurality of light-emitting devices, and a reflective layer arranged on one side of the substrate; wherein the reflective layer has a plurality of openings, the plurality of openings comprising a plurality of first openings, and a light-emitting device is arranged in a first opening; and the reflective layer has a plurality of first reflective portions and a second reflective portion connecting any two adjacent first reflective portions; a first reflective portion is arranged on at least one side of the light-emitting device; a thickness of the first reflective portion is less than a thickness of the second reflective portion.

Description

TECHNICAL FIELDThe present disclosure relates to the field of display technologies, and more particularly, to a light emitting substrate and a manufacturing method thereof, a backlight module, and a display device.BACKGROUNDMini light emitting diodes (mini LEDs) and micro light emitting diodes (micro LEDs) are used on medium-size screens such as micro displays, mobile phones and televisions because of their advantages such as self-lighting, high efficiency, high luminance, high reliability, energy saving, fast response speed, etc.SUMMARYIn one aspect, a light emitting substrate is provided. A light emitting substrate includes a substrate, a plurality of light emitting devices, and a reflective layer disposed on one side of the substrate. The reflective layer has a plurality of openings, the plurality of openings including a plurality of first openings, and a light emitting device is located in a first opening. The reflective layer includes a plurality of first reflective portions and a second reflective portion connecting any two adjacent first reflective portions; a first reflective portion is located on at least one side of the light emitting device. The thickness of the first reflecting portion is less than the thickness of the second reflecting portion.In some embodiments, the first reflective portion is located on two opposite sides of the light emitting device, or the first reflective portion surrounds the corresponding light emitting device.In some embodiments, the first reflective portion is on the two opposite sides of the light emitting device, and an orthographic projection of the light emitting device on the substrate is in the shape of a rectangle, the first reflective portion is on the sides of the two long sides of the rectangle.In some embodiments, at least one sidewall of the light emitting device and the corresponding first reflective portion have a first gap therebetween.In some embodiments, the width of the first gap is less than or equal to 150 μm.In some embodiments, at least one sidewall of the light emitting device is in contact with the corresponding first reflective portion.In some embodiments, the thickness of the first reflective portion is positively correlated with the distance between the first reflective portion and the center of the light emitting device in a direction that passes through the center of the light emitting device and is perpendicular to a sidewall of the light emitting device; the first reflective portion includes a bottom surface and a top surface that are opposite to each other, the bottom surface is in contact with the substrate, and an angle between the top surface and a plane in which the substrate is located is an acute angle.In some embodiments, the minimum thickness of the first reflective portion is less than 60 μm.In some embodiments, the thickness of the first reflective portion is positively correlated with a distance between the first reflective portion and the center of the light emitting device in a direction that passes through the center of the light emitting device and is perpendicular to a sidewall of the light emitting device. The first reflecting portion includes a lower surface and an upper surface that are opposed to each other; at least a part of the lower surface is not in contact with the substrate, and an angle between the at least a part of the lower surface and a plane in which the substrate is located is an acute angle; the upper surface is parallel or substantially parallel to the substrate.In some embodiments, in the direction passing through the center of the light emitting device and perpendicular to the sidewall of the light emitting device, a dimension of a part of the first reflecting portion that is not in contact with the substrate is less than 20 μm.In some embodiments, the surface of the second reflective portion remote from the substrate is a planar or approximately planar surface.In some embodiments, the second reflective portion includes a plurality of protruding structures, and a protruding structure has a curved surface on a side opposite from the substrate.In some embodiments, the plurality of protruding structures includes a plurality of first protruding structures and a plurality of second protruding structures. The plurality of first protruding structures each extend in a first direction and are arranged in rows in a second direction. The plurality of second protruding structures each extend in the first direction and are arranged in rows in the second direction, or the plurality of second protruding structures each extend in the second direction and are arranged in rows in the first direction. The first direction intersects with the second direction. A dimension of a first protruding structure in the second direction is equal to a dimension of a second protruding structure in an arrangement direction of the plurality of second protruding structures.In some embodiments, the plurality of protruding structures further includes a third protruding structure located between two adjacent first protruding structures, the third protruding structure extending in the first direction. A dimension of the third protruding structure in the second direction is smaller than a dimension of the first protruding structure in the second direction.In some embodiments, when the first reflecting portion surrounds the light emitting device, the reflecting layer further includes a third reflecting portion disposed between the first reflecting portion and the second reflecting portion; the second reflecting portion is connected to the first reflecting portion through the third reflecting portion, the third reflecting portion surrounds the first reflecting portion, and a thickness of the third reflecting portion is less than the thickness of the first reflecting portion.In some embodiments, the plurality of light emitting devices are arranged in columns in a first direction and in rows in a second direction, wherein the first direction intersects with the second direction. In a case where the first reflecting portion surrounds the light emitting device and an orthographic projection of the light emitting device on the substrate is in the shape of a rectangle, the light emitting device includes a first side wall, a second side wall, a third side wall, and a fourth side wall which are connected in sequence; the first side wall faces the third side wall and extends in the first direction; the first side wall faces the third side wall and extends in the first direction; the second side wall faces the fourth side wall and extends in the second direction; the first reflecting portion includes a first reflecting subsection located on a side of the first side wall, a second reflecting subsection located on a side of the second side wall, a third reflecting subsection located on a side of the third side wall, and a fourth reflecting subsection located on a side of the fourth side wall. A plurality of first reflective sub-portions located on one side of first side walls of light emitting devices in a row are joined to form a one-piece structure. A plurality of second reflective sub-portions located on one side of second side walls of the light emitting devices in the row are joined to form a one-piece structure. A plurality of third reflective sub-portions located on one side of third sidewalls of the light emitting devices in the row are joined to form a one-piece structure. A plurality of fourth reflective sub-portions located on one side of fourth side walls of the light emitting devices in the row are joined to form a one-piece structure.In some embodiments, the light emitting substrate further includes a plurality of driver chips disposed on one side of the substrate and located on the same side of the substrate as the plurality of light emitting devices. A driver chip is electrically connected to at least one light emitting device, and the driver chip is configured to drive the at least one light emitting device to emit light. The plurality of apertures also includes a plurality of second apertures. The driver chip is located in a second opening, and a first reflective portion is located on at least one side of the driver chip.In some embodiments, at least one sidewall of the driver chip is in contact with the corresponding first reflective portion, and / or the at least one sidewall of the driver chip and the corresponding first reflective portion have a second gap therebetween.In some embodiments, the light emitting substrate further includes a plurality of driver chips disposed on one side of the substrate and located on the same side of the substrate as the plurality of light emitting devices. A driver chip is electrically connected to at least one light emitting device, and the driver chip is configured to drive the at least one light emitting device to emit light. An orthographic projection of at least one driver chip on the substrate is within an orthographic projection of the reflective layer on the substrate.In another aspect, a manufacturing method of a light emitting substrate includes: providing a substrate; mounting a plurality of light emitting devices on the substrate using a flux; cleaning a part of the substrate located around each light emitting device; forming a reflective layer on the substrate using a three-dimensional (3D) printing method. The reflective layer has a plurality of openings, the plurality of openings comprising a plurality of first openings, a light emitting device is disposed in a first opening; the reflective layer comprises a plurality of first reflective portions and a second reflective portion connecting any two adjacent first reflective portions; a first reflective portion is disposed on at least one side of the light emitting device; a thickness of the first reflective portion is less than a thickness of the second reflective portion.In some embodiments, the plurality of light emitting devices are arranged in columns in a first direction and in rows in a second direction. The substrate has a plurality of first print areas and a plurality of second print areas; at least one second print area is disposed between two adjacent first print areas, and a row of light emitting devices is in a first print area. The first printing region includes a plurality of first printing subregions arranged one after another at intervals in the first direction, and a first printing subregion is located on at least one side of a light emitting device. Forming the reflective layer on the substrate using the 3D printing method comprises: forming a first reflective pattern in each first print sub-region using an all-round printing method, the first reflective pattern forming a first reflective portion of the reflective layer; forming a second reflective pattern in a region in each first print region except the first print sub-regions using a slowline printing method; and forming a third reflective pattern in a second print region using a straightline printing method, a first reflective pattern, a second reflective pattern, and a third reflective pattern defining a first opening around each light emitting device; wherein at least one side wall of the light emitting device and the corresponding first reflecting portion have a first gap therebetween and / or at least one side wall of the light emitting device is in contact with the corresponding first reflecting portion.In some embodiments, forming the first reflective pattern in the first print region around the light emitting device includes: forming a plurality of first reflective sub-patterns in each first print sub-region sequentially using the all-round printing method. The plurality of first reflective sub-patterns are sequentially arranged in a direction away from the light emitting device, and two adjacent first reflective sub-patterns partially overlap; the plurality of first reflective sub-patterns constitute the first reflective pattern.In some embodiments, the substrate further includes a plurality of third pressure regions, and the third pressure regions are each between a first pressure region and a second pressure region. After forming the first reflective pattern in each first print area using the all-round printing method, the manufacturing method further includes: forming a fourth reflective pattern in a third print area using a straight line printing method, wherein second reflective patterns, third reflective patterns, and fourth reflective patterns form the second reflective portion of the reflective layer. The second reflective pattern, the third reflective pattern, and the fourth reflective pattern have the same thickness. The thickness of the first reflective pattern is less than the thickness of the second reflective pattern.In some embodiments, the plurality of light emitting devices are arranged in columns in a first direction and in rows in a second direction. The substrate has a plurality of fourth print regions each extending in the first direction, a plurality of fifth print regions each extending in the second direction, and a plurality of sixth print regions. Two opposite sides of each row of light emitting devices are each provided with a fourth print area; two opposite sides of each column of light emitting devices are each provided with a fifth print area; an area between any two adjacent light emitting devices except for fourth print areas and fifth print areas is provided with a sixth print area. Forming the reflective layer on the substrate using the 3D printing method comprises: printing a reflective material in each fourth printing region and printing a reflective material in each fifth printing region; performing a pre-cure process on the reflective material in each fourth printing region to form a fifth reflective pattern and performing a pre-cure process on the reflective material in each fifth printing region to form a sixth reflective pattern; fifth reflective patterns and sixth reflective patterns around each light emitting device defining a first opening and forming a first reflective portion; and forming a seventh reflective sub-pattern in each sixth printing region using a quantifying printing method, and performing a leveling process and a pre-cure process on the seventh reflective sub-pattern to form a seventh reflective pattern.In some embodiments, the plurality of light emitting devices are arranged in columns in a first direction and in rows in a second direction. The substrate has a plurality of seventh print regions and an eighth print region; a seventh print region surrounds a light emitting device, and the eighth print region is located between any two adjacent seventh print regions. Forming the reflective layer on the substrate using the 3D printing method comprises: printing a reflective material in each seventh print region using an all-round printing method, and performing a pre-hardening process on the reflective material in each seventh print region to form an eighth reflective pattern, the eighth reflective pattern forming a first reflective portion and a portion of a third reflective portion of the reflective layer; and quantitatively spraying a reflective material into the eighth print region using a quantitative spraying process and performing a leveling process and a pre-hardening process on the reflective material in the eighth print region to form a ninth reflective pattern, the ninth reflective pattern forming the second reflective portion and another portion of the third reflective portion of the reflective layer. The second reflecting portion is connected to the first reflecting portion through the third reflecting portion; the third reflecting portion surrounds the first reflecting portion, and the thickness of the third reflecting portion is less than the thickness of the first reflecting portion.In some embodiments, before forming the reflective layer on the substrate using the 3D printing method, the manufacturing method includes: forming a sacrificial layer on a side of the plurality of light emitting devices opposite from the substrate, wherein the sacrificial layer includes a plurality of sacrificial patterns, and a sacrificial pattern covers a sidewall and a top wall of a light emitting device. Forming the reflective layer on the substrate using the 3D printing method includes: forming a reflective film on the substrate using the 3D printing method, wherein the reflective film is in contact with sidewalls of the sacrificial patterns and an orthographic projection of the reflective film on the substrate does not overlap with orthographic projections of the light emitting devices on the substrate; performing a leveling process and a pre-hardening process on the reflective film to form the reflective layer; and removing the sacrificial layer.In some embodiments, before forming the reflective layer on the substrate using the 3D printing method, the manufacturing method further includes: forming a protective layer on a side of the light emitting devices opposite from the substrate using a dispensing method, wherein the protective layer includes a plurality of protective patterns, and a protective pattern covers a side wall and a top wall of a light emitting device. Forming the reflective layer on the substrate using the 3D printing method includes: forming a reflective film on the substrate using the 3D printing method, wherein the reflective film is in contact with sidewalls of the protection patterns and an orthographic projection of the reflective film on the substrate does not overlap with orthographic projections of the light emitting devices on the substrate; and performing a leveling process and a pre-hardening process on the reflective film to form the reflective layer.In another aspect, a backlight module is provided. The backlight module includes: the light emitting substrate according to any one of the above embodiments; and an optical film disposed on a light exit side of the light substrate.Another aspect is to provide a display device. The display device includes: the backlight module according to any one of the above embodiments, an array substrate located on a light exit side of the backlight module, and a color filter substrate located on a side of the array substrate remote from the backlight module.BRIEF DESCRIPTION OF THE DRAWINGSIn order to more clearly describe the technical solutions in the present disclosure, the accompanying drawings used in some embodiments of the present disclosure are briefly presented; of course, the accompanying drawings described below are only drawings of some embodiments of the present disclosure, and a person of ordinary skill in the art can obtain other drawings according to these drawings. Moreover, the accompanying drawings described below may be regarded as schematic diagrams, but do not represent limitations on the actual sizes of products and actual processes or methods to which the embodiments of the present disclosure relate. FIG. 1 is a structural diagram of a display device according to some embodiments of the present disclosure; FIG. 2 is a structural diagram of a backlight module according to some embodiments of the present disclosure; FIG. 3 is a structural diagram of a light emitting substrate according to some embodiments of the present disclosure; FIG. 4 is a structural diagram of another light emitting substrate according to some embodiments of the present disclosure; FIGS. 5 ato 5 bare each a schematic illustration of flux residues on a light emitting substrate according to another implementation; FIGS. 5 cand 5 dare each a schematic diagram of the repulsion phenomenon occurring on a light emitting substrate according to another implementation; FIG. 6 ais a diagram showing steps of a light emitting substrate manufacturing method according to some embodiments of the present disclosure; FIGS. 6 bto 6 eare diagrams illustrating a manufacturing method of a light emitting substrate according to some embodiments of the present disclosure; FIG. 7 is a schematic diagram illustrating operation of a three-dimensional (3D) printing device according to some embodiments of the present disclosure; FIG. 8 ais a structural diagram showing the light exit paths of a light emitting device in a light emitting device according to some embodiments of the present disclosure; FIG. 8 bis a structural diagram showing the light exit paths of another light emitting device in a light emitting device according to some embodiments of the present disclosure; FIG. 8 cis a structural diagram showing the light exit paths of another light emitting device in a light emitting device according to some embodiments of the present disclosure; FIG. 9 ais a diagram showing a relative positional relationship between various printing regions and light emitting devices on a substrate according to some embodiments of the present disclosure; FIG. 9 bis a diagram showing steps of a manufacturing method for another light emitting substrate according to some embodiments of the present disclosure; FIGS. 9 cto 9 eare diagrams illustrating a manufacturing method for another light emitting substrate according to some embodiments of the present disclosure; FIG. 9 fis an enlarged fragmentary view of the BB portion in FIG. 9 c; FIG. 9 g is another enlarged partial view of the BB portion in FIG. 9 c ; FIG. 10 ais a diagram illustrating a manufacturing method of another light emitting substrate according to some embodiments; FIG. 10 bis a diagram illustrating a manufacturing method for another light emitting substrate according to some embodiments of the present disclosure; FIG. 10 cis a diagram illustrating a manufacturing method for another light emitting substrate according to some embodiments of the present disclosure; FIG. 11 is a diagram showing the simulation results of luminance among different first columns and different thicknesses of a first reflecting portion of the light emitting substrate according to some embodiments of the present disclosure; FIG. 12 is a diagram showing the simulation results of luminance of the light emitting substrate at different first columns according to some embodiments of the present disclosure; FIG. 13 ais a structural diagram of a substrate and a reflective layer of a light emitting substrate according to some embodiments of the present disclosure; FIG. 13 bis a structural diagram of a substrate and a reflective layer of another light emitting substrate according to some embodiments of the present disclosure; FIG. 13 cis a structural diagram of a substrate and a reflective layer of another light emitting substrate according to some embodiments of the present disclosure; FIG. 13 dis a physical image showing a surface grain of a reflective layer according to some embodiments of the present disclosure; FIG. 13 eis a physical image showing a surface grain of another reflective layer according to some embodiments of the present disclosure; FIG. 13 fis a physical image showing surface grain of another reflective layer according to some embodiments of the present disclosure; FIG. 14 ais a diagram showing another relative positional relationship between different printing regions and light emitting devices on a substrate according to some embodiments of the present disclosure; FIG. 14 bis a diagram showing steps of a manufacturing method for another light emitting substrate according to some embodiments of the present disclosure; FIGS. 14 cand 14 dare diagrams each illustrating a manufacturing method for another light emitting substrate according to some embodiments of the present disclosure; FIG. 15 ais a diagram showing a relative relationship between a sacrificial layer and light emitting devices according to some embodiments of the present disclosure; FIG. 15b is a sectional view of a light emitting substrate taken along line F-F' in FIG. 15a; FIG. 15 cis a diagram showing steps of a manufacturing method for another light emitting substrate according to some embodiments of the present disclosure; FIG. 15 dis a diagram illustrating a manufacturing method for another light emitting substrate according to some embodiments of the present disclosure; FIG. 15e is a sectional view of a light emitting substrate taken along line G-G' in FIG. 15d; FIG. 15 fis a diagram illustrating a manufacturing method for another light emitting substrate according to some embodiments of the present disclosure; FIG. 15g is a sectional view of a light emitting substrate taken along line H-H' in FIG. 15f; FIG. 16 ais a diagram showing a relative relationship between a protection layer and light emitting devices according to some embodiments of the present disclosure; FIG. 16b is a sectional view of a light emitting substrate taken along line J-J' in FIG. 16a; FIG. 16 cis a diagram showing steps of a manufacturing method for another light emitting substrate according to some embodiments of the present disclosure; FIGS. 16 dto 16 eare diagrams illustrating a manufacturing method of another light emitting substrate according to some embodiments of the present disclosure; FIG. 17 ais a diagram showing an arrangement of light emitting devices according to some embodiments of the present disclosure; FIG. 17 bis a partial structure diagram of a light emitting device and a reflective layer in a light emitting substrate, according to some embodiments of the present disclosure; FIG. 17 cis a partial structure diagram of a light emitting device and a reflective layer in another light emitting substrate, according to some embodiments of the present disclosure; FIG. 17 dis a partial structure diagram of a light emitting device and a reflective layer in another light emitting substrate, according to some embodiments of the present disclosure; FIG. 18 ais a diagram showing another relative positional relationship between different printing regions and light emitting devices on a substrate according to some embodiments of the present disclosure; FIG. 18 bis a diagram showing steps of a manufacturing method for another light emitting substrate according to some embodiments of the present disclosure; FIGS. 18 cto 18 eare diagrams each showing a manufacturing method of another light emitting substrate according to some embodiments of the present disclosure; FIG. 18 fis a structural diagram of a "coffee ring" around a light emitting device, in accordance with some embodiments of the present disclosure; FIG. 18 g is a structural diagram of another "coffee ring" around a light emitting device, in accordance with some embodiments of the present disclosure; FIG. 19 ais a structural diagram showing a relative relationship between driver chips and light emitting devices according to some embodiments of the present disclosure; FIG. 19 bis a structural diagram of another light emitting substrate according to some embodiments of the present disclosure; FIG. 19 cis a structural diagram of another light emitting substrate according to some embodiments of the present disclosure; and FIG. 19 dis a structural diagram of another light emitting substrate according to some embodiments of the present disclosure.DETAILED DESCRIPTIONThe technical solutions in some embodiments of the present disclosure will be clearly and fully described with reference to the accompanying drawings; of course, the described embodiments are only some, but not all, embodiments of the present disclosure. All other embodiments obtained by a person skilled in the art based on embodiments of the present disclosure fall within the scope of protection of the present disclosure.Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and other forms thereof, such as the third party form "comprises" and the present particulate form "comprising" are understood in an open and broad meaning, i.e., "including, but not limited to.". In the specification description, terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples" are intended to indicate that certain features, structures, materials, or characteristics relating to the embodiment(s) or the example(s) are included in at least one embodiment or example of the present disclosure. Schematic representations of the above terms do not necessarily refer to the same embodiment(s) or example(s). Moreover, the specific features, structures, materials, or characteristics may be included in any suitable manner in one or more embodiments or examples.The terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative meaning or implicitly a number of technical features stated. Thus, a feature defined as "first" or "second" may explicitly or implicitly comprise one or more of the features. In the description of the embodiments of the present disclosure, the term "a plurality of" or "the plurality of" means two or more unless otherwise specified.In the description of some embodiments, the term "connected" and extensions thereof may be used. For example, the term "connected" may be used in the description of some embodiments to indicate that two or more components are in direct physical or electrical contact with each other. The embodiments disclosed herein are not necessarily limited to the content presented herein.The phrase "A and / or B" includes the following three combinations: only A, only B, and a combination of A and B.The term "when" used herein is optionally understood to mean "when" or "in a case where" or "in response to determining that" or "in response to detecting", depending on the context. Also, the phrase "when it is determined that" or "when [a specified condition or event] is detected" is optionally construed as "in a case where it is determined that" or "in response to the determination that" or "in a case where [the specified condition or event] is detected" or "in response to the determination [of the specified condition or event]", depending on the context.The use of the term "applicable to" or "configured to" herein means an open and broad term that does not exclude devices applicable or configured to perform additional tasks or steps.Moreover, the use of the term "based on" is open to and inclusive of meaning, as a process, step, calculation, or other action "based on" one or more of the stated conditions or values may, in practice, be based on additional conditions or values beyond those stated.As used herein, the terms such as "about", "substantially", and "about" include a specified value and an average value within an acceptable range of deviation from a certain value. The allowable deviation range is determined by a person skilled in the art in consideration of the measurement in question and the errors associated with the measurement of a certain quantity (i.e. the boundaries of a measurement system).The term "rectangular" or "equal" as used herein includes a particular case and a case similar to the particular case within an acceptable range of deviation determined by a person skilled in the art in consideration of the measurement in question and the errors associated with the measurement of a particular quantity (i.e. the boundaries of a measurement system). For example, the term "squareness" includes the absolute squareness and the approximate squareness, and an acceptable deviation range of the approximate squareness may also be, for example, a deviation within 5°; the term "equality" includes the absolute equality and the approximate equality, and an acceptable deviation range of the approximate equality may be a difference between two equations that is less than or equal to 5% of either of the two equations.When a layer or element is referred to as being on another layer or substrate, the layer or element may be directly on the other layer or substrate, or there may be one or more intermediate layers between the layer or element and the other layer or substrate.Example embodiments are described herein with reference to cross-sectional and / or plan views that are schematic representations of idealized embodiments. In the accompanying drawings, the thickness of layers and regions may be exaggerated for clarity. Therefore, dimensional deviations from the accompanying drawings, for example due to manufacturing technologies and / or tolerances, may be considered. Therefore, the exemplary embodiments should not be construed as being limited to the shapes of the ranges shown herein, but also include shape deviations caused by, for example, manufacturing. For example, an etched region shown as rectangular generally has a curved shape. Therefore, the regions shown in the accompanying drawings are schematic, and their shapes are not intended to show the actual shapes of the regions in a device, and are not intended to limit the scope of the exemplary embodiments.Some embodiments of the present disclosure provide a display device 1. The display device 1 may be any device that displays images, whether in motion (e.g., a video) or stationary (e.g., a still image) and independent of text or image. In particular, it is contemplated that the embodiments may be implemented in or connected to a variety of electronic devices. The plurality of electronic devices may include, for example, cellular phones, wireless devices, personal data assistants (PDAs), handheld or portable computers, GPS receivers / navigators, cameras, MP4 video players, video cameras, game consoles, watches, watches, calculators, TV monitors, flat screens, computer monitors, vehicle displays (e.g., odometer displays), navigation devices, cockpit controllers and / or displays, camera visual displays (e.g., rear camera displays in vehicles), electronic photos, electronic advertising panels or displays, projectors, building structures, as well as packages and aesthetic structures (e.g., a display for an image of a piece of ornament).For example, when the display device 1 is a large-sized display device, the display device 1 may include a plurality of sub-display devices, and the plurality of sub-display devices are tiled together to form a large-sized display device that satisfies the requirements for a large-sized display. This display device may be referred to as a tiled display device.In some examples, the display device 1 may be a liquid crystal display (LCD) device.In some examples, as illustrated in FIG. 1, the display device 1 includes a backlight module 10, an array substrate 20 located on a light output side of the backlight module 10, and a color filter substrate 30 located on a side of the array substrate 20 opposite from the backlight module 10.The backlight module 10 may be used as a light source for backlight, for example. The backlight of the backlight module 10 may be white or blue light, for example.The light exit side of the backlight module 10 refers to, for example, a side from which the backlight module 10 emits light.The array substrate 20 includes, for example, a plurality of pixel driving circuits and a plurality of pixel electrodes, and the plurality of pixel driving circuits may be arranged in an array, for example. The plurality of pixel driving circuits are electrically connected to the plurality of pixel electrodes in one-to-one correspondence, and the pixel driving circuit supplies a pixel voltage for each pixel electrode.The color filter substrate 30 may include, for example, a plurality of color filters. In a case where the backlight supplied from the backlight module 10 is white light, the color filters may include, for example, red filters, green filters, and cyan filters. For example, the red filter may transmit only red light in the incident light, the green filter may transmit only green light in the incident light, and the blue filter may transmit only blue light in the incident light. As another example, if the backlight provided by the backlight module 10 is blue light, the color filters may include red and green filters.The color filter substrate 30 also includes a common electrode, for example. The common electrode may be supplied with a common voltage. Alternatively, the common electrode may be disposed in the array substrate 20, which is not limited in the present disclosure.In some examples, as shown in FIG. 1, the display device 1 further includes a liquid crystal layer 40 disposed between the color filter substrate 30 and the array substrate 20.The liquid crystal layer 40 includes, for example, a plurality of liquid crystal molecules. For example, an electric field may be generated between the pixel electrode and the common electrode, and the liquid crystal molecules located between the pixel electrode and the common electrode may be deflected due to the action of the electric field.It should be understood that the backlight provided by the backlight module 10 may penetrate the array substrate 20 and be incident on the liquid crystal molecules of the liquid crystal layer 40. Due to the action of the electric field generated between the pixel electrode and the common electrode, the liquid crystal molecules are deflected, which changes the amount of light passing through the liquid crystal molecules, so that the light emitted by the liquid crystal molecules reaches a predetermined luminance. The light is emitted after passing through the filters of different colors in the color filter substrate 30. The emitted light includes light of different colors, such as red light, green light, and blue light, and the light of different colors interacts with each other to allow the display device 1 to reach the display.For example, there are many types of backlight modules 10 in the display device 1, which can be set according to actual conditions and are not limited in the present disclosure.For example, the backlight module 10 may be an edge-type backlight module, or the backlight module 10 may be a direct-type backlight module.For convenience of description, the following embodiments of the present disclosure will be presented by way of an example in which the backlight module 10 is a direct-type backlight module.In some embodiments, as shown in FIG. 2, the backlight module 10 includes a light substrate 100 and an optical film 200 disposed on a light exit side of the light substrate 100.The optical film 200 includes, for example, a diffusion plate 210, a quantum dot film 220, a diffusion sheet 230, and a composite film 240 stacked on the light-emitting substrate 100 light-emitting side.The diffusion plate 210 and the diffusion sheet 230 are used, for example, to eliminate shade of lamps and uniformize the light emitted from the light emitting substrate 100 to improve the uniformity of the light.For example, the quantum dot layer 220 is used to convert the light emitted from the light emitting substrate 100. When the light emitted from the light-emitting substrate 100 is blue light, the quantum dot layer 220 may convert the blue light into white light and improve the purity of the white light.The composite film 240 is used, for example, to increase the luminous power of the light emitted from the light-emitting substrate 100.It is understood that the light emitted from the light emitting substrate 100 is emitted after being incident on the optical film 200, and the luminance of the emitted light is increased, and the emitted light has high purity and good uniformity.The backlight module 10 may include a plurality of light emitting substrates 100 and corresponding optical films. The plurality of light emitting substrates 100 may be tiled together, and the corresponding optical films may also be tiled together, such that the backlight module 10 has a large size. In this case, the backlight module 10 may be referred to as a tiled display module, and may be used for the above-described tiled display device.In some examples, as shown in FIG. 2, the backlight module 10 further includes support pillars 201 disposed between the light emitting substrate 100 (e.g., a reflective layer 130 of the light emitting substrate 100) and the diffusion plate 210 of the optical film 200. With respect to the reflective layer 130, reference is made to the following description, which is not repeated here.The support pillars 201 may be fixed to the light emitting substrate 100 with an adhesive, for example. The support pillars 201 may be used to support the optical film 200 and allow the light emitted from the light emitting substrate 100 to achieve a certain optical distance, thereby further eliminating lamp shadows and improving the uniformity of the light.In some embodiments, as shown in FIG. 3, the light emitting substrate 100 includes a substrate 110 and a plurality of light emitting devices 130 and a reflective layer 130 disposed on one side of the third substrate 110.In some examples, the substrate 110 may be a flexible substrate. The flexible substrate may be, for example, a polyethylene terephthalate (PET) substrate, a polyethylene naphthalate-two-formic acid glycol ester (PEN) substrate, or a polyimide (PI) substrate.In some examples, the substrate 110 may be a rigid substrate. The substrate may be made of glass, for example. The substrate 110 may also be a printed circuit board (PCB), an aluminum substrate, or the like.In some examples, the plurality of light emitting devices 120 may be comprised of LEDs, mini-LEDs, or micro-LEDs.For example, as illustrated in FIG. 3, the plurality of light emitting devices 120 may be arranged in a plurality of columns in a first direction X and in a plurality of rows in a second direction Y.For example, the angle between the first direction X and the second direction Y may be 85°, 90°, 95° or the like. The present disclosure will be described with reference to an example in which the angle between the first direction X and the second direction Y is 90°.For example, the light emitting devices 120 may serve as a light source for the light emitting substrate 100.For example, the light emitting substrate 100 includes an alignment mark and a plate ID disposed on the substrate 110.The alignment mark is used, for example, to align the installation between the light emitting substrate 100 and the optical film 200, and the like. The substrate number is used to mark and identify a single light emitting substrate 100. Therefore, the alignment mark and the panel ID on the reflective layer 130 need to be exposed to facilitate alignment or identification.In some examples, the reflective layer 130 includes a plurality of openings 131.For example, the plurality of openings 131 of the reflective layer 130 are used to expose devices such as the light emitting devices 120 (or the alignment marks and panel ID) located on the substrate 110 from the surface of the reflective layer 130, thereby preventing the reflective layer 130 from covering the light emitting devices 120 to prevent the reflective layer 130 from blocking the light emitted from the light emitting devices 120, thereby preventing the light yield of the light emitting devices 120 from being impaired. As a result, the luminous efficiency of the light emitting substrate 100 is improved.The plurality of openings 131 includes, for example, a plurality of first openings 131 a. A light emitting device 120 is located in a first opening 131 a.For example, the plurality of first openings 131 amay be in one-to-one correspondence with the plurality of light emitting devices 120.In some examples, the reflective layer 130 has a certain reflectivity and may reflect the light emitted from the plurality of light emitting devices 120, thereby improving light utilization of the light emitting devices 120. Moreover, the reflective layer 130 may also protect the light emitting substrate 100 to prevent the light emitting substrate 100 from being corroded and scratched by moisture and oxygen.With such an arrangement, the light emitted from the light emitting devices 120 can be prevented from being blocked by the edges of the reflective layer 130 as much as possible, thereby improving the luminous efficiency of the light emitting substrate 100.In some examples, as shown in FIG. 4, a transition layer 101, a first conductive layer 102, a first passivation layer 103, an adhesive layer 104, a second passivation layer 105, and the second conductive layer 106 are included between the substrate 110 and the reflective layer 130.A material of the transition layer 101 may be silicon nitride, for example. The transition layer 101 may increase adhesion between the substrate 110 and the first conductive layer 102.For example, the first conductive layer 102 and the second conductive layer 106 may be made of the same material, and the material may be a metallic material such as copper. The conductive layer may include signal lines to provide signals to the light emitting devices 120.For example, the first passivation layer 103 and the second passivation layer 105 may consist of the same or different materials. The first passivation layer 103 may provide insulation protection for the first conductive layer 102 to protect the first conductive layer 102 from electromagnetic interference. The second passivation layer 105 may provide insulation protection for the second conductive layer 106 to protect the second conductive layer 106 from electromagnetic interference.The adhesive layer may be made of, for example, a transparent resin or the like. The adhesive layer is used to improve the attachment between the first passivation layer and the second passivation layer.In one application, the reflective layer is generally formed by applying a reflective material to the substrate and then curing the reflective material. The reflective material is composed of a solute having a high reflectivity and a solvent. During the curing process of the reflective material, the precipitates of the reflective material adhere to the pad connected to the light emitting device on the light emitting substrate to form a solder mask on the surface of the pad, which reduces the solderableness of the pad and reduces the welding reliability of the light emitting device. In some manufacturing methods of the light emitting substrate, a chemical nickel immersion gold process (electroless nickel gold process) is performed and a nickel-gold layer is deposited on the pad before the die bonding method to improve welding performance and anti-corrosion performance of the pad. After carrying out the chemical nickel immersion gold process, the reflective layer is produced. During the curing process of the reflective material, the precipitates of the reflective material adhere to the surface of the nickel-gold layer of the pad and form the solder mask, which deteriorates the soldering performance of the pad. Even if the electroless nickel dip gold process is performed after the formation of the reflective layer, the yield of the electroless nickel dip gold process is greatly reduced because the precipitates of the reflective material cannot be removed from the surface of the pad. Moreover, depending on the different size specifications of the light emitting substrate, different manufacturing methods may be used to manufacture the light emitting substrate. For example, in a large-sized light emitting substrate, the manufacturing method generally includes the following steps: material preparation → reflective layer formation by screen printing → automatic optical inspection (AOI) → die bonding → dot repair → AOI → encapsulation. In the manufacturing method, the shape accuracy of the reflective layer is low, and the gap between the light emitting device and the reflective layer may be as small as 0.3 mm±0.15 mm; in addition, the gap may scatter light, and it is difficult to reflect all the light emitted from the light emitting device, resulting in bright and dark optical stripes and regional display Mura phenomena occurring on the light emitting substrate and the display module. As another example of a medium-size light emitting substrate (a glass substrate) or a small to medium-size light emitting substrate (a PCB substrate), the manufacturing method generally includes the following steps: material preparation → reflective layer formation by screen printing → exposure → development → AOI → die bonding → encapsulation. In the manufacturing method, the accuracy of the reflective layer is improved, and the distance between the light emitting device and the reflective layer may be 0.05 mm±0.015 mm. However, it is necessary to take into account the accuracy of die bonding after the reflective layer is formed, and it is necessary to prevent the distance between the light emitting device and the reflective layer from being set to only 0.1 mm caused by the problem of errors in mounting of the light emitting device caused by the case that a plurality of light emitting devices can be mounted simultaneously because the reflective layer previously formed easily adheres to the light emitting devices during the process of mounting a single light emitting device in the die bonding method. The die bonding method includes reflow soldering. Due to the high temperature of the reflow soldering method, the reflow soldering method causes the material of the previously formed reflective layer to oxidize and yellow, resulting in a decrease in the reflectivity of the reflective layer (the reflectivity is attenuated by 1% to 2%) and a decrease in the luminance of the light emitting substrate by 3% to 5%, thereby decreasing the brightness of the light emitting module and the display device.In another embodiment, the reflective layer is formed by the die bonding method, i.e., the die bonding method is first performed to weld the light emitting devices to the light emitting substrate, and then the reflective layer is formed. However, after the die bonding process, a welding residue is on the substrate such as the flux used in the welding process, and the welding residue repels the reflective material in the subsequent manufacturing process for the reflective layer (e.g., FIG. 5 ashows the morphology of the welding residue that diffuses therearound, FIG. 5 bshows the morphology of the welding residue that diffuses along a line, FIG. 5 bshows the morphology of the welding residue that diffuses along a line, FIG. 5 cshows the repulsive morphology of the formed reflective layer that diffuses therearound, and FIG. 5 ddisplays the repulsive morphology of the formed reflective layer that diffuses along a line), resulting in a large gap between the light emitting device and the reflective layer, which impairs the shape accuracy of the reflective layer and reduces the brightness of the backlight module and the display device.Based on this, some embodiments of the present disclosure provide a manufacturing method of a light emitting substrate 100. As shown in FIG. 6 a, the manufacturing method includes S 100 to S 400.In S 100, as illustrated in FIG. 6 b, a substrate 110 is provided.In some examples, the substrate 110 may be a PET substrate, a PI substrate, a PEN substrate, a glass substrate, a PCB substrate, an aluminum substrate, or the like.In S 200, as shown in FIG. 6 c, a plurality of light emitting devices 120 are fixed on the substrate 110 by means of a flux.The flux may include, for example, rosin and resin.For example, corresponding pads are provided on the substrate 110 at the locations where the light emitting devices 120 are to be mounted. The method for attaching the light emitting device 120 may include, for example, dipping or printing solder and flux on the pad, then placing the corresponding light emitting device 120 on the pad, and then attaching the light emitting device 120 on the pad on the substrate 110 using a reflow soldering method.The light emitting device 120 may be, for example, an LED, a micro LED, or a mini LED.In an example where the light emitting device 120 is a mini LED, the structure of the mini LED may be a wire bond structure, a vertical structure, or a flip structure.For example, the plurality of light emitting devices 120 may be uniformly distributed on the substrate 110 so that the entire surface of the light emitting substrate 100 more uniformly radiates the light, thereby improving the display quality of the backlight module 10 and the display device 1.In S 300, a part of the substrate 110 located around each light emitting device 120 is cleaned.The cleaning process may include, for example, wet and dry cleaning.For example, wet cleaning means cleaning the vicinity of the light emitting device 120 with water-based rosin cleaner, ethanol, or ethyl acetate to remove the flux residues. Thus, it is possible to mitigate and eliminate the repulsion phenomenon in subsequent printing of the reflective material to improve the shape accuracy of the formed reflective layer 130, thereby enhancing the luminance of the light emitting substrate 100.Another example: dry cleaning means that the surface tension coefficient of the portion of the substrate 110 around the light emitting device 120 is changed by plasma treatment so as to increase the surface tension coefficient from less than 30 to a range of about 40 to about 60, thereby improving the wetting effect of the reflective material on the substrate 110. In this way, it is possible to reduce and eliminate the repulsion phenomenon in subsequent printing of the reflective material to improve the shape accuracy of the formed reflective layer 130, thereby enhancing the luminance of the light emitting substrate 100.In S 400, as shown in FIG. 6 d, the reflective layer 130 is formed on the substrate 110 by a 3D printing method. The reflective layer 130 has a plurality of openings 131. The plurality of openings 131 includes a plurality of first openings 131 a. A light emitting device 120 is located in a first opening 131 a. As shown in FIG. 6 e, the reflective layer 130 includes a plurality of first reflective portions 133 and a second reflective portion 134 connecting any two adjacent first reflective portions 133. The first reflecting portion 133 is located on at least one side of the light emitting device 120. The thickness of the first reflecting portion 133 is less than the thickness of the second reflecting portion 134.In some examples, the material of the reflective layer 130 may include epoxy resin, phenyl silicone resin, or polytetrafluoroethylene resin.In the embodiments of the present disclosure, for example, a 3D printer may be used to perform the 3D printing operation. As shown in FIG. 7, the 3D printing apparatus includes a plurality of print heads having the same function, and the print heads are each provided with a print nozzle. The material of the reflective layer 130 after a certain pretreatment is put in the 3D printing apparatus, and then the printing nozzle is moved by controlling the state of the printing nozzle on the substrate 110 according to the set printing path, so that the material of the reflective layer 130 is ejected in dots from the printing nozzle. The spots of the reflective layer material fall onto the substrate 110 and converge to form a print stripe that extends along the print path. All of the print stripes together form the reflective layer 130. In the regions of the substrate 110 corresponding to the plurality of openings 131 of the reflective layer 130, the printing nozzle is closed, thereby forming the plurality of openings 131.For example, the 3D printing has a high degree of freedom, the print head ejects the liquid onto the substrate 110 to be printed in a non-contact manner, and the dimensional accuracy of the reflective layer 130 and the dimensional accuracy of the opening 131 formed by the printing are relatively high. In this way, it is advantageous to increase the proportion of the area of the substrate 110 occupied by the reflective layer 130, thereby increasing the reflectance of the reflective layer 130 and improving the utilization rate of the light emitted from the light emitting device 120.For example, the first reflecting portion 133 is closer to the light emitting device 120 than the second reflecting portion 134.In some examples, in a case where the first reflecting portion 133 is disposed on at least one side of the light emitting device 120, various types of arrangements may be provided. For example, the first reflecting portion 133 may be disposed at a side of the light emitting device 120. In another example, the first reflective portion 133 may be disposed at two adjacent or opposite sides of the light emitting device 120. As another example, the first reflecting portion 133 may be disposed on three sides of the light emitting device 120. In another example, the first reflective portion 133 may surround the corresponding light emitting device 120.For example, an orthographic projection of the light emitting device 120 on the substrate 110 may have various shapes such as a circle or a rectangle.In the rectangular light emitting device 120, the shape accuracy of the portion of the first reflecting portion 133 corresponding to the short side has a greater influence on the luminous efficiency of the light emitting substrate 100 compared to the shape accuracy of the portion of the first reflecting portion 133 corresponding to the long side. Therefore, in a case where the first reflecting portion 133 is disposed on two opposite sides of the light emitting device 120 and the orthographic projection of the light emitting device 120 onto the substrate 110 has the shape of a rectangle, the first reflecting portion 133 is disposed on sides of two long sides of the rectangle. In this way, the luminous efficiency of the light emitting substrate 100 can be improved, the printing cost of the reflective layer 130 can be reduced, and the printing efficiency of the reflective layer 130 can be improved.It is understood that, as shown in FIG. 8 a, the luminous efficiency of the light emitting substrate is related to the light exit mode of the light emitting device. There are three paths for the light emitted from the light emitting device 120, namely, a path A, a path B, and a path C. The light emitted from the light emitting device 120 is emitted through the path A and the path B, i.e., the light is directly emitted from the top wall or the side wall of the light emitting device 120 without passing through the reflective layer 130, resulting in less light loss. The light emitted from the light emitting device 120 is emitted through the path C, i.e., the light is reflected by the first reflecting portion 133 and then emitted from the side wall of the light emitting device 120, resulting in a large light loss. The larger the proportion of the light emitted from the path C, the larger the light loss of the light emitting device and the lower the light extraction efficiency of the light emitting substrate. In the present disclosure, the thickness of the first reflecting portion 133 is less than the thickness of the second reflecting portion 134, which can improve the situation where light is reflected on the side walls of the first reflecting portion 133 and then emitted, so that the light emitted through the path C constitutes a small portion of the light emitted from the light emitting device 120. As a result, the light loss of the light emitting device 120 is low, which can improve the light extraction efficiency of the light emitting substrate 100, thereby improving the display brightness of the backlight module 10 and the display device 1, and reducing the power consumption of the backlight module 10 and the display device 1.In some of the embodiments of the present disclosure, the light emitting substrate 100 is manufactured using the method described above. The light emitting devices 120 are first mounted on the substrate 110, and then the reflective layer 130 (the first openings 131 corresponding to the light emitting devices 120 are provided in the reflective layer 130) is formed using a 3D printing method, so that the reflective layer 130 is formed by the die bonding method (herein, refers to the method of mounting the light emitting devices 120 on the substrate 110). In this way, the precipitates of the reflective material can be prevented from adhering to the pad, whereby formation of the solder mask on the surface of the pad can be prevented to prevent deterioration of the welding performance of the pad, thereby improving the yield of the light emitting substrate 100. In manufacturing the light emitting substrate 100 using the above method, it is possible to avoid the risk of reducing the reflectance of the reflective layer 130 due to the reflow soldering method in the die bonding method, which can improve the luminous efficiency of the light emitting substrate 100, thereby improving the display brightness of the backlight module 10 and the display device 1 and reducing the power consumption of the backlight module 10 and the display device 1. Moreover, in the manufacturing method provided by the present disclosure, the point repair process is eliminated, which reduces the number of high-temperature curing processes required for the light emitting substrate 100, thereby simplifying the manufacturing method of the light emitting substrate 100.In addition, in the reaction after the light emitting device is mounted, a large amount of residual flux accumulates around the light emitting device, and the surface tension coefficient of the flux is greatly different from the surface tension coefficient of the reflective material, which results in a repulsion phenomenon between the reflective material and the flux during the printing process of the reflective material, thereby lowering the shape accuracy of the reflective layer. However, in the present disclosure, before the reflective layer 130 is formed using the 3D printing method, the vicinity of the light emitting device 120 is cleaned to remove residual flux, or the surface tension coefficient of the part of the substrate 110 located around the light emitting device 120 is improved, which can reduce the repulsion phenomenon between the flux and the reflective material, thereby reducing the gap between the light emitting device 120 and the reflective layer 130, using the above method. As a result, it is possible to improve the shape accuracy of the reflective layer 130 and reduce the problem of the light and dark optical stripes and the regional display Mura phenomenon of the light emitting substrate and the display module, thereby improving the brightness and the display effect of the light emitting substrate 100 and the backlight module 10. In the present disclosure, the thickness of the first reflecting portion 133 is less than the thickness of the second reflecting portion 134, which can reduce the situation where light is emitted after being reflected on the side wall of the first reflecting portion 133, so that the light emitted through the path C constitutes a small portion of the light emitted from the light emitting device 120. As a result, the light loss of the light emitting device 120 is low, which can improve the light extraction efficiency of the light emitting substrate 100, thereby improving the display brightness of the backlight module 10 and the display device 1, and reducing the power consumption of the backlight module 10 and the display device 1.In some embodiments, as shown in FIG. 9 a, the substrate 110 includes a plurality of first printing regions P 1 and a plurality of second printing regions P 2. At least one second print area P 2 is disposed between two adjacent first print areas P 1, and one row of light emitting devices 120 is located in a first print area P 1.By way of example, a row of light emitting devices 120 corresponds to a first print area P 1. Here, the first pressure range P 1 extends in the first direction X, and the second pressure range P 2 located between two adjacent first pressure ranges P 1 extends in the first direction X.For example, a second pressure range P 2 is arranged between two adjacent first pressure ranges P 1, wherein the second pressure range P 2 extends in the first direction X.A further example: A plurality of second pressure regions P 2 are arranged between two adjacent first pressure regions P 1.Of course, it is possible to set a column of light emitting devices 120 to correspond to a printing range P 1. Here, the first pressure range P 1 extends in the second direction Y, and the second pressure range P 2 located between two adjacent first pressure ranges P 1 extends in the second direction Y.In some examples, as shown in FIG. 9 a, the first printing region P 1 includes a plurality of first printing subregions P 11 arranged at intervals one after the other in the first direction X; a first printing subregion P 11 is located on at least one side of a light emitting device 120.For example, a first print sub-region P 11 corresponds to one light emitting device 120, and the plurality of first print sub-regions P 11 correspond one-to-one to the plurality of light emitting devices 120.For example, a first print portion P 11 is located on a side of a light emitting device 120.Another example: a first print portion P 11 is located on two adjacent or opposite sides of a light emitting device 120.Another example: a first print portion P 11 is located on three sides of a light emitting device 120.Another example: A first print portion P 11 surrounds a light emitting device 120.In some embodiments, as shown in FIG. 9 b, the reflective layer 130 is formed on the substrate 110 by a 3D printing method including S410a to S430a.In S 410 a, as shown in FIG. 9 c, a first reflective pattern RP 1 is formed in each first print sub-region P 11 by using an all-round printing method, and the first reflective pattern RP 1 forms the first reflective portion 133 of the reflective layer 130.For example, the wrap around printing process means that the entire printing path of the 3D printing device is non-linear, and after completion of the printing process, the overall outline of the formed print pattern is in the form of a closed ring or a part of a ring. For the all-round printing method, the liquid ejection from the print head is less, which contributes to highly accurate control of the liquid ejection. In this way, the thickness of the printed pattern formed by printing is small, and the dimensional accuracy of the printed pattern can be improved.By using the all-round printing method to form the first reflecting portion 133, the distance between the first reflecting portion 133 and the light emitting device 120 can be accurately controlled, thereby achieving zero distance between the light emitting device 120 and the first reflecting portion 133, thereby improving the reflectance of the reflecting layer 130 and improving the brightness of the light emitting substrate 100.For example, when a first pressing portion P 11 surrounds a light emitting device 120, the overall outline of the first reflection pattern RP 1 is in the shape of a closed ring, and the first reflection pattern RP 1 defines the first opening 131 a.As another example, in a case where a first print portion P 11 is located on a light emitting device 120 side, the overall outline of the first reflective pattern RP 1 is in the form of a part of a ring. In this case, the first reflective pattern RP 1 forms a part of the side walls of the first opening 131 a.It is noted that the all-round printing method has a certain application range. The light emitting device 120 has a certain thickness, and a pad is provided between the light emitting device 120 and the substrate 110. As shown in FIG. 8 b, there is a certain distance T 3 between a light-emitting surface 120 aof the light-emitting device 120 and the substrate 110. The distance T 3 is, for example, 15 μm, and the light emission angle γ of the light emitting device 120 is 140°. In this case, the minimum thickness of the first reflective portion 133 of the reflective layer 130 is greater than the distance T 3, and the all-round printing method may be used to form the first reflective portion 133. In a case where the distance T 3 is larger than the thickness (60 μm) of the reflective layer, i.e., the distance between the light emitting surface 120 aand the substrate 110 is larger than the thickness of the reflective layer 130, as shown in FIG. 8 c, the thickness of the first reflective portion 133 may be the same as the thickness of the second reflective portion 134, and there is no need to use the all-round printing method to form the first reflective portion 133.In S 420 a, as shown in FIG. 9 d, a second reflective pattern RP 2 is formed in a region in each first print region P 1 except for the first print sub-regions P 11 by applying a pitch line printing method.For example, the fine line printing method means that the 3D printing apparatus moves along a predetermined printing path, and by controlling the printing nozzle to be intermittently turned on or off, a printing pattern is formed after completion of a single printing operation, which is a discontinuous and intermittent printing stripe having a shape similar to a dotted line.For example, the area in each first print area P 1 except for the first print subareas P 11 refers to an area between two adjacent light emitting devices 120 except for the first print subareas P 11, in the first print area P 1 in which a row of light emitting devices 120 is located when a first print area P 1 corresponds to a row of light emitting devices 120, or an area between two adjacent light emitting devices 120 except for the first print subareas P 11 in the first print area P 1 in which a column of light emitting devices 120 is located in a case where a first print area P 1 corresponds to a column of light emitting devices 120.Therefore, among the plurality of second reflection patterns RP 2, two adjacent second reflection patterns RP 2 are separated by one light emitting device 120, respectively.In this method, the first reflective pattern RP 1 formed by the all-round printing method defines or forms part or all of the side walls of the first opening 131 a. Therefore, it is possible to reduce the number of the side walls of the first opening 131 aformed by the second reflective pattern RP 2 formed by the pitch line printing method and reduce the restricting effect of the pitch line printing method, thereby improving the dimensional accuracy of the first opening 131 a.In S 430 a, as shown in FIG. 9 e, a third reflective pattern RP 3 is formed in the second printing region P 2 using a straight line printing method. The first reflection pattern RP 1, the second reflection pattern RP 2, and the third reflection pattern RP 3 around each light emitting device 120 define the first opening 131 a; at least one sidewall of the light emitting device 120 and the corresponding first reflective layer 133 have a first gap GP 1 therebetween, and / or at least one sidewall of the light emitting device 120 is in contact with the corresponding first reflective layer 133.For example, the straight line printing method means that the 3D printing apparatus moves along a fixed printing path and, after completion of a single printing operation, a printing pattern is formed which is a continuous and uninterrupted printing strip whose shape resembles a straight line.It is noted that, as shown in FIG. 13 b, a printing step size d 1 of the pitch line printing method is less than or equal to a printing step size d 2 of the straight line printing method. Here, the print pitch is a distance between the center lines of two adjacent print stripes, which is actually a distance by which the 3D printing apparatus moves in a direction perpendicular to the print path after printing a single print stripe, that is, a dimension of a protruding pattern 135 along an arrangement direction of the protruding patterns 135 described below. For example, the printing step size of the straight line printing method is in a range of 0.1 mm to 3.0 mm inclusive; and the printing step size of the straight line printing method is in a range of 0.1 mm to 1.5 mm inclusive. Therefore, the printing accuracy of the pitch line printing method is higher than the printing accuracy of the grade line printing method. The print pitch and liquid ejection of the printing method in a circumferential form are smaller than in the Striech line printing method. Therefore, the printing accuracy of the all-round printing method is higher than the printing accuracy of the fine line printing method.For example, the first opening 131 amay have various shapes in plan view, such as a rectangle or a circle. In an example in which the first opening 131 ahas the shape of a rectangle in plan view, the first opening 131 aincludes four side walls at least one of which is formed by the first reflective pattern RP 1.There are various positional relationships between the sidewalls of the light emitting device 120 and the corresponding first reflecting portion 133 that can be adjusted according to actual needs, and the present disclosure does not limit this.In a case where the light emitting device 120 includes a plurality of side walls, the relative positional relationship between each of the plurality of side walls of the light emitting device 120 and the corresponding first reflecting portion 133 may be the same or different.In some examples, as shown in FIG. 9 f, at least one sidewall of the light emitting device 120 and the corresponding first reflective portion 133 have a first gap GP 1 therebetween.For example, there is a first gap GP 1 between one side wall or each of a plurality of side walls of the light emitting device 120 and the corresponding first reflecting portion 133. FIG. 9 f shows that a first gap GP 1 is present between each of three sidewalls of the light emitting device 120 and the corresponding first reflective portion 133.In an example where the light emitting device 120 has the shape of a rectangle in plan view, there may be a first gap GP 1 between one side wall of the light emitting device 120 and the first reflecting portion 133, or there may be a first gap GP 1 between each of the four side walls of the light emitting device 120 and the first reflecting portion 133. The distance, i.e., the width of the first gap GP 1, between each of the four side walls and the first reflecting portion 133 may be the same or different.The width of the first gap GP 1 is, for example, less than or equal to 150 μm.For example, the width of the first gap GP 1 refers to a dimension of the first gap GP 1 in a direction perpendicular to the sidewall of the corresponding light emitting device 120.The width of the first gap GP 1 may be, for example, 150 μm, 100 μm, 50 μm, 25 μm, or 10 μm.In the present disclosure, the light emitting substrate 100 is manufactured by the above manufacturing method that can make the width of the first gap GP 1 between the side wall of the light emitting device 120 and the corresponding first reflecting portion 133 in the light emitting substrate 100 small, thereby improving the area ratio of the reflecting layer 130 in the light emitting substrate 100. As a result, it is possible to improve the luminous efficiency of the light emitting substrate 100, alleviate the problem of the light and dark optical stripes and Mura phenomenon of the light emitting substrate 100, and improve the luminance of the light emitting device 120, thereby improving the brightness of the backlight module 10 and the display device 1 and reducing the power consumption of the backlight module 10 and the display device 1.In some other examples, as shown in FIG. 9 f, at least one sidewall of the light emitting device 120 is in contact with the corresponding first reflective portion 133.For example, one side wall or each of a plurality of side walls of the light emitting device 120 is in contact with the corresponding first reflecting portion 133.In an example in which the light emitting device 120 forms a rectangle in plan view, one side wall of the light emitting device 120 may be in contact with the first reflecting portion 133 (a first gap GP 1 may be present between each of the remaining three side walls and the first reflecting portion 133); alternatively, all four side walls of the light emitting device 120 are in contact with the first reflecting portion 133, respectively.In the present disclosure, the light emitting substrate 100 is manufactured using the above manufacturing method, whereby the sidewall(s) of the light emitting device 120 in the light emitting substrate 100 can be brought into contact with the corresponding first reflecting portion 133, respectively, thereby improving the area ratio of the reflecting layer 130 in the light emitting substrate 100. As a result, it is possible to improve the luminous efficiency of the light emitting substrate 100, alleviate the problem of the light and dark optical stripes and the Mura phenomenon of the light emitting substrate 100, and thereby improve the luminance of the backlight module 10 and the display device 1 and reduce the power consumption of the backlight module 10 and the display device 1.In some other examples, as shown in FIG. 9 f, there is a first gap GP 1 between at least one sidewall of the light emitting device 120 and the corresponding first reflective portion 133, and at least one sidewall of the light emitting device 120 is in contact with the corresponding first reflective portion 133.For example, one side wall of the light emitting device 120 is in contact with the corresponding first reflecting portion 133, and there is a first gap GP 1 between each of the remaining side walls of the light emitting device 120 and the corresponding first reflecting portion 133.As another example, a first gap GP 1 is provided between a side wall of the light emitting device 120 and the corresponding first reflecting portion 133, and the remaining side walls of the light emitting device 120 are each in contact with the corresponding first reflecting portion 133.In another example, as shown in FIG. 9 f, there is a first gap GP 1 between each of the three side walls of the light emitting device 120 and the corresponding first reflecting portion 133, and the remaining side wall of the light emitting device 120 is in contact with the corresponding first reflecting portion 133.In the present disclosure, the light emitting substrate 100 is manufactured using the above manufacturing method that may cause the sidewall(s) of the light emitting device 120 in the light emitting substrate 100 to be in contact with the corresponding first reflecting portion 133, respectively, or may cause each of the sidewall(s) of the light emitting device 120 in the light emitting substrate 100 and the corresponding first reflecting portion 133 to have a first gap GP 1, thereby improving the area ratio of the reflecting layer 130 in the light emitting substrate 100. As a result, it is possible to improve the luminous efficiency of the light emitting substrate 100, alleviate the problem of the light and dark optical stripes and the Mura phenomenon of the light emitting substrate 100, and thereby improve the luminance of the backlight module 10 and the display device 1 and reduce the power consumption of the backlight module 10 and the display device 1.For example, in a case where all the sidewalls of the light emitting device 120 are each in contact with the corresponding first reflecting portion 133, an area of an orthographic projection of the first opening 131 aon the substrate 110 may be substantially equal to an area of an orthographic projection from the corresponding light emitting device 120 on the substrate 110, and a center of the first opening 131 acoincides with a center of the corresponding light emitting device 120.In the case where all the sidewalls of the light emitting device 120 and the corresponding first reflecting portion 133 have a first gap GP 1 therebetween, the area of the orthographic projection of the first opening 131 aon the substrate 110 may be larger than the area of the orthographic projection of the corresponding light emitting device 120 on the substrate 110, and the center of the first opening 131 aand the center of the corresponding light emitting device 120 may or may not coincide with each other.In a case where at least one side wall of the light emitting device 120 is in contact with the corresponding first reflecting portion 133, the area of the orthographic projection of the first opening 131 aon the substrate 110 may be larger than the area of the orthographic projection of the corresponding light emitting device 120 on the substrate 110, and the center of the first opening 131 adoes not coincide with the center of the corresponding light emitting device 120.In some embodiments, as shown in FIG. 9 g, forming the first reflective pattern RP 1 in the first print region P 1 around the light emitting device 120 using the all-round printing method includes: forming a plurality of first reflective sub-patterns RP 11 in each first print sub-region P 11 sequentially using the all-round printing method. The plurality of first reflective sub-patterns RP 11 are sequentially arranged in a direction away from the light emitting device 120, and two adjacent first reflective sub-patterns RP 11 partially overlap. The plurality of first reflective partial patterns RP 11 constitute the first reflective pattern RP 1.In FIG. 9 g, in order to clarify the relative positional relationship (partial overlap) of the two first reflective sub-patterns RP 11, different kinds of filling patterns are performed on the two first reflective sub-patterns RP 11.For example, the first reflective pattern RP 1 is formed by sequentially stacking the plurality of first reflective sub-patterns RP 11 formed by a plurality of printing operations. The larger the number of the first reflective partial patterns RP 11, the larger the area of the first reflective pattern RP 1.For example, in a case where the first reflective pattern RP 11 surrounds the corresponding light emitting device 120, the first reflective pattern RP 11 is in the form of a ring surrounding the light emitting device 120, and the first reflective pattern RP 1 is composed of a plurality of first reflective patterns RP 11 that are annularly stacked.For example, two adjacent first reflective sub-patterns RP 11 partially overlap, which is advantageous for the thickness of the formed first reflective pattern RP 1 (or the first reflective portion 133), thereby ensuring the reflectivity of the reflective layer 130 at this location.With this arrangement, it is possible to improve the shape accuracy of the reflective layer 130, which facilitates the accurate control of the relative position between the first reflective pattern RP 1 and the light emitting device 120 that are in contact with each other or have a first gap GP 1, for example.In some embodiments, as shown in FIG. 10 a, the substrate 110 further includes a plurality of third pressure regions P 3, and the third pressure regions P 3 are respectively located between a first pressure region P 1 and a second pressure region P 2.For example, the extending direction of the third pressing portion P 3 is the same as the extending direction of the second pressing portion P 2.After the first reflective pattern RP 1 is formed in each first printing region P 1 by applying the all-round printing method, the manufacturing method further includes S 411 by way of example.In S 411 as shown in FIG. 10 b, a fourth reflective pattern RP 4 is formed in the third printing region P 3 by applying the straight line printing method.For example, the side wall(s) of the first reflective pattern RP 1 form one or more side walls of the first opening 131 a.When the side wall(s) of the first reflective pattern RP 1 form one side wall or two opposite side walls of the first opening 131 a, the fourth reflective patterns RP 4 may form one or two side walls of the first opening 131 a.For example, the fourth reflection pattern RP 4 may be formed in the third printing area P 3 by applying the straight line printing method after the second reflection pattern RP 2 is formed. Alternatively, the process of forming the fourth reflective pattern RP 4 may be set in the third print area P 3 before forming the second reflective pattern RP 2.In some embodiments, the second reflection patterns RP 2, the third reflection patterns RP 3, and the fourth reflection patterns RP 4 form the second reflective layer 134 of the reflective layer 130.In some examples, the second reflection pattern RP 2, the third reflection pattern RP 3, and the fourth reflection pattern RP 4 have the same thickness. As can be seen from the above, the second reflection pattern RP 2, the third reflection pattern RP 3, and the fourth reflection pattern RP 4 are formed by using the pitch line printing method or the straight line printing method. That is, the printing nozzles used in the pitch line printing method and the straight line printing method can spray substantially the same amount of reflective material. Therefore, the thickness of the second reflecting portion 134 formed by the connection of the second reflecting pattern RP2, the third reflecting pattern RP3 and the fourth reflecting pattern RP4 has little variation.In some examples, as shown in FIG. 8 a, the thickness of the first reflection pattern RP 1 is less than the thickness of the second reflection pattern RP 2. It is apparent from the above that the first reflective pattern RP 1 is formed using the all-round printing method; in a range within 100 μm from the light emitting device, a printing method may be performed in a thin-film manner (i.e., the printing method in a surrounding method) to improve the light interference problem of the light emitting device 120. The first reflection pattern RP 1 constitutes the first reflective layer 133. The thickness of the first reflection pattern RP 1 is less than the thickness of the second reflection pattern RP 2, and the thickness of the first reflective layer 133 is less than the thickness of the second reflective layer 134, so that the light consumption of the light emitting device 120 can be low and the light efficiency of the light emitting substrate 100 can be improved. As a result, the display brightness of the backlight module 10 and the display device 1 is improved, and power consumption of the backlight module 10 and the display device 1 is reduced.For example, the thickness of the reflective layer 130 may be in a range of 55 μm±5 μm. The thickness of the reflective layer 130 is, for example, 50 μm, 52 μm, 55 μm, 57 μm, or 60 μm.The thickness of the reflective layer 130 refers to an average thickness of the reflective layer 130.In an example in which the thickness of the reflective layer 130 is 60 μm, the thickness of the first reflective pattern RP 1 or the first reflective portion 133 may be less than 60 μm.In some embodiments, as shown in FIG. 8 a, the thickness of the first reflective portion 133 is positively correlated with a distance in a direction passing through a center of the light emitting device 120 and perpendicular to a sidewall of the light emitting device 120 between the first reflective portion 133 and the center of the light emitting device 120.For example, the thickness of the first reflecting portion 133 is not uniform, and the thicknesses of the first reflecting portion 133 are different at different positions.As shown in FIG. 8 a, the greater the distance between a part of the first reflecting portion 133 and the center of the light emitting device 120, the greater the thickness of the first reflecting portion 133. The smaller the distance between a part of the first reflecting portion 133 and the center of the light emitting device 120, the smaller the thickness of the part of the first reflecting portion 133. That is, toward the center of the light emitting device 120 in FIG. 8 a, the thickness of the first reflecting portion 133 gradually decreases and reaches the minimum thickness at the portion closest to the light emitting device 120.In some embodiments, the minimum thickness of the first reflective portion 133 is less than 60 μm.The minimum thickness of the first reflective portion 133 may be, for example, 59 μm, 55 μm, 50 μm, 45 μm, or 40 μm.With the above arrangement, in a case where the first reflecting portion 133 is in contact with one side of the light emitting device 120, the proportion of the light emitted from the path C can be reduced, thereby avoiding deterioration of the light extraction effect of the light emitting device 120.In the case where the minimum thicknesses of the first reflective portion 133 are 45 μm and 60 μm, respectively, and the widths of the first gaps GP 1 between the first reflective portion 133 and the corresponding light emitting device 120 are 200 μm, 150 μm, 100 μm, 50 μm, 25 μm, and 0 μm, respectively, and the first reflective portion 133 covers a part of the light emitting device 120 (taking an example in which the first reflective portion covers a part of the light emitting device 120 and the dimension of the covered portion in the first direction is 15 μm, the width of the first gap GP 1 is -15 μm) for convenience of description, the luminance of the light emitting substrates 100 is simulated, and the simulation results are shown in FIG. 11 The above-mentioned value "0 μm" means the case where the first reflecting portion 133 is in contact with the light emitting device 120. The case where the minimum thickness of the first reflecting portion 133 is 60 μm corresponds to an implementation in which there is no difference in thickness between the first reflecting portion and the second reflecting portion, and the thickness of the first reflecting portion is the same as the thickness of the second reflecting portion.As shown in FIG. 12, in an example in which the luminance of the light emitting substrate is 100%, when the thickness of the first reflecting portion 133 is 60 μm and the light emitting device 120 is in contact with the first reflecting portion 133, the luminance of the light emitting substrate is gradually increased as the width of the first gap GP 1 is decreased from 150 μm to 0 μm, and the variation of the luminance is less than 5%, which is within the acceptable variation range of the luminance; in a case in which the width of the first gap GP 1 is -15 μm, the luminance is decreased to about 90%, and the luminance varies by about 10%, which is within an unacceptable variation range of the luminance. In a case where the width of the first gap GP 1 is in the range of 0 μm to 150 μm and the minimum thickness of the first reflecting portion 133 is less than 60 μm, the variation in luminance of the light emitting substrate 100 is acceptable.Moreover, computer simulation of the luminance of the light emitting substrate is performed in a case where the width of the first gap GP 1 is changed stepwise from 300 μm to 0 μm, and FIG. 12 is obtained. In FIG. 12, the luminance is 100% in a case where the width of the first gap GP 1 is 0 μm; 100% in a case where the width of the first gap GP 1 is 50 μm, the luminance is 98.9%; 96.5% in a case where the width of the first gap GP 1 is 100 μm; 95.0% in a case where the width of the first gap GP 1 is 150 μm; 93.4% in a case where the width of the first gap GP 1 is 200 μm, the luminance is 91.6%; 91.6% in a case where the width of the first gap GP 1 is 250 μm; In a case where the width of the first gap GP 1 is 300 μm, the luminance is 89.7%. In the implementation described above, the large-sized light emitting substrate is manufactured by the method: material preparation → reflective layer formation by screen printing → automated optical inspection (AOI) → die bonding → point repair → AOI → encapsulation, it is possible to achieve that the gap between the reflective layer and the light emitting device is in a range of 0.3 mm±0.15 mm (corresponding to the case where the width of the first gap is 300 μm). However, in the present disclosure, the width of the first gap GP 1 may reach 0 μm; as compared to implementation, the luminance is increased from 89.7% to 100%, and the luminance gain is about 10%; moreover, in the light emitting substrate 100 formed by the manufacturing method in the above embodiments of the present disclosure, the width of the first gap between the reflective layer 130 and the light emitting device 120 may be controlled with an accuracy of 0.05 mm±0.05 mm, so that the luminance of the light emitting substrate 100 may be greatly increased and the power consumption of the backlight module 10 and the display device 1 may be reduced.In some examples, as shown in FIG. 6 e, the first reflecting portion 133 includes a lower surface 133 pand an upper surface 133 twhich are opposed to each other; the lower surface 133 pis in contact with the substrate 110, and an angle between the upper surface 133 tand a plane in which the substrate 110 is located is an acute angle.The angle α between the top surface 133 tand the substrate 110 may be 30°, 35°, 40°, 45°, or 50°, for example.With such an arrangement as above, as shown in FIG. 8 a, the proportion of light emitted along the path C may be small, and the loss of light emitted from the light emitting device 120 may be small, thereby increasing the reflectance of the reflective layer 130, improving the luminous efficiency of the light emitting substrate 100, and reducing the power consumption of the backlight module 10 and the display device.In some embodiments, the second reflective portion 134 includes a plurality of protruding structures 135, and the protruding structures 135 have a curved surface on a side opposite to the substrate 110.For example, the curved surface projects outward in a direction away from the substrate 110.With such an arrangement, the uniformity of the light radiated from the reflective layer 130 can be improved.It is understood that the plurality of protruding structures 135 are unique morphological features of the reflective layer 130 formed by the 3D printing. In using a 3D printing apparatus to print the reflective material to form the second reflective portion 134, multiple print stripes are printed and two adjacent print stripes partially overlap to form a print pattern. A part of each print stripe that does not overlap with the adjacent print stripe forms the protruding structure 135 (the protruding structure 135 does not include a third protruding structure 135 cdownside).Note that the extending direction and the arrangement of the protruding structures 135 are determined mainly by the printing path of the 3D printing method.For example, as shown in FIG. 13 a, in a case where the printing direction of the printing path of the 3D printing method is the first direction X, the plurality of protruding patterns 135 each extend in the first direction X and are arranged in multiple lines in the second direction Y.For example, when the printing direction of the printing path of the 3D printing method is the second direction Y, the plurality of protruding patterns 135 each extend in the second direction Y and are arranged in a plurality of columns in the first direction X.In some examples, the protruding structures 135 include a plurality of first protruding structures 135 aand a plurality of second protruding structures 135 b.For example, the plurality of first protruding structures 135 aand the plurality of second protruding structures 135 bmay extend and be arranged in different ways.For example, as illustrated in FIG. 13 b, the extending direction of the plurality of first protruding structures 135 aand the extending direction of the plurality of second protruding structures 135 bmay be the same. The plurality of first protruding structures 135 aextend in the first direction X, respectively, and are arranged in a plurality of rows in the second direction Y; the plurality of second protruding structures 135 bextend in the first direction X, respectively, and are arranged in a plurality of rows in the second direction Y.As another example, the extending direction of the plurality of first protruding structures 135 aand the extending direction of the plurality of second protruding structures 135 bmay be different. The plurality of first protruding structures 135 aextend in the first direction X, respectively, and are arranged in a plurality of rows in the second direction Y; the plurality of second protruding structures 135 bextend in the second direction Y, respectively, and are arranged in a plurality of rows in the first direction X.For example, the first protruding structure 135 amay be a protruding structure formed by a linear printing method, and the second protruding structure 135 bmay be a protruding structure formed by a dotted printing method.In some embodiments, the printing direction of the straight line printing method and the printing direction of the fine line printing method are the same as or perpendicular to each other.For example, as shown in FIG. 10 b, the printing direction of the straight line printing method is the first direction X, and the printing direction of the straight line printing method is also the first direction X, and the two directions are the same. Here, the extending direction of each of the plurality of first protruding structures 135 aand the extending direction of each of the plurality of second protruding structures 135 bare the same.For example, as shown in FIG. 10 c, the printing direction of the straight line printing method is the first direction X and the printing direction of the straight line printing method is the second direction Y; the two directions are perpendicular to each other. Here, the extending direction of each of the plurality of first protruding structures 135 aand the extending direction of each of the plurality of second protruding structures 135 bare different.For example, a dimension of the first protruding structure 135 ain the second direction Y is the same as a dimension of the second protruding structure 135 bin the arrangement direction of the plurality of second protruding structures 135 b. That is, a width of a portion of each print stripe formed by using the straight line printing method that does not overlap with the adjacent print stripe is the same as a width of a portion of each print stripe formed by using the fine line printing method that does not overlap with the adjacent print stripe.In some embodiments, as shown in FIG. 13 c, the plurality of protruding structures 135 further include third protruding structures 135 c, each located between two adjacent first protruding structures 135 a; the third protruding structure 135 cextends in the first direction X.By way of example, the plurality of third protruding structures 135 cis arranged in multiple rows in the second direction Y.For example, the extending direction of the third protruding structure 135 cis the same as the extending direction of the first protruding structure 135 aadjacent to the third protruding structure 135 c.In some examples, a dimension W 3 of the third protrusion structure 135 cin the second direction Y is less than a dimension W 1 of the first protrusion structure 135 ain the second direction YFor example, the third protruding structure 135 cis formed at the overlapping position of two adjacent print stripes. Therefore, the dimension W 3 of the third protruding structure 135 cin the second direction Y is much smaller than the dimension W 1 of the first protruding structure 135 ain the second direction YThe physical morphological features of the reflecting layer 130 are shown for example in FIGS. 13 d, 13 eand 13 f. The dotted circle enclosed portions in Figs. 13d and 13e are the morphology of the protruding structures. FIG. 13f shows a "fish scale-like" grain on a surface of the reflective layer, which grain is formed by a plurality of print stripes lying one above the other.In some embodiments, as shown in FIG. 14 a, the substrate 110 has a plurality of fourth printing regions P 4 each extending in the first direction X, a plurality of fifth printing regions P 5 each extending in the second direction Y, and a plurality of sixth printing regions P 6. Two opposite sides of each row of light emitting devices 120 are each provided with a fourth print area P 4; two opposite sides of each column of light emitting devices are each provided with a fifth print area P 5; an area between any two adjacent light emitting devices 120 except the fourth print areas P 4 and the fifth print areas P 5 is provided with a sixth print area P 6.For example, the extending direction of each of the plurality of fourth pressing regions P 4 and the extending direction of each of the plurality of fifth pressing regions P 5 are perpendicular to each other, and the plurality of fourth pressing regions P 4 and the plurality of fifth pressing regions P 5 form a net-like structure, and the net-like structure includes a plurality of meshes. The plurality of meshes are arranged in rows in the first direction X and in columns in the second direction Y. In every two lines of meshes, one line of meshes is provided with one line of light emitting devices 120, and the other line of meshes is provided with no light emitting device 120.In some examples, as shown in FIG. 14 b, forming the reflective layer 130 on the substrate 110 using a 3D printing method includes steps S 470 to S 480.In S 470, as in FIG. 14 c, using the straight line printing method, the reflective material is printed in each fourth print region P 4 and the reflective material is printed in each fifth print region P 5; a pre-hardening process is performed on the reflective material located in each fourth print region P 4 to form a fifth reflective pattern RP 5, and a pre-hardening process is performed on the reflective material located in each fifth print region P 5 to form a sixth reflective pattern RP 6; the fifth reflective patterns RP 5 and the sixth reflective patterns RP 6 around each light emitting device 120 define a first opening 131 aand form a first reflective portion 133.The pre-curing process may be, for example, a thermal curing.Since the plurality of fourth printing regions P 4 and the plurality of fifth printing regions P 5 form a mesh-like structure, the plurality of fifth reflective patterns and the plurality of sixth reflective patterns overlap each other to form a mesh-like structure.For example, the first opening 131 adefined by the fifth reflection pattern and the sixth reflection pattern around each light emitting device 120 has the shape of a rectangle. The first reflecting portion 133 around the light emitting device 120 is connected to the first reflecting portion 133 around the adjacent light emitting device 120.In S 480, as shown in FIG. 14 d, a seventh reflective pattern part is formed in each sixth printing region P 6 by applying a quantifying printing method, and a leveling process and a pre-hardening process are performed on the seventh reflective pattern part to form a seventh reflective pattern RP 7.The printing operation in quantitative manner means that a corresponding amount of reflective material is sprayed by quantitative spraying into the printing area corresponding to the area of the area to be printed. That is, the area of the region to be printed is proportional to the amount of the reflective material applied by quantitative spraying. If the areas of the areas to be printed are different, the amount of the reflective material to be sprayed must be adjusted. The amount of reflective material to be sprayed on may be the mass or volume of the reflective material.The reflective material to be printed has a certain viscosity, and a leveling process and a pre-hardening process are performed for the seventh reflective pattern. Therefore, the thickness of the formed seventh reflective pattern RP 7 is relatively uniform, so that a surface of the seventh reflective pattern RP 7 remote from the substrate 110 is relatively flat. Moreover, the seventh reflective pattern RP 7 is formed by using the quantifying printing method, which can ensure uniformity of thickness in various regions of the reflective layer 130, thereby improving the reflectivity of the reflective layer 130.In some embodiments of the present disclosure, the reflective layer 130 is formed using the above method; first, a plurality of fifth reflective patterns RP 5 and a plurality of sixth reflective patterns RP 6 having a mesh-like structure are formed around each light emitting device 120, and a Chinese character protrusion " " is formed around each light emitting device 120; then, in a case where the quantifying printing method is used, during the leveling process performed on the seventh reflective sub-pattern in the sixth printing region P 6, the reflective material is blocked by the Chinese character-shaped bulge " " which prevents the reflective material from traversing the fifth reflective pattern RP 5 and the sixth reflective pattern RP 6 to reach the vicinity of the light emitting device 120, so that it is possible to avoid deterioration of the welding performance of the light emitting device 120 and improve the shape accuracy of the reflective layer 130.In some embodiments, as shown in FIG. 14 d, in a case where the first reflecting portion 133 surrounds the light emitting device 120 and the orthographic projection of the light emitting device 120 onto the substrate 110 has the shape of a rectangle, the light emitting device 120 includes a first side wall, a second side wall, a third side wall, and a fourth side wall connected in sequence; the first side wall and the third side wall are opposed to each other and each extend in the first direction X; the first side wall and the third side wall are opposed to each other and each extend in the first direction X; the second side wall and the fourth side wall are opposed to each other and each extend in the second direction Y; the first reflecting portion 133 includes a first reflecting subsection 133 alocated on a side of the first side wall, a second reflecting subsection 133 blocated on a side of the second side wall, and a third reflecting subsection 133 clocated on a side of the third side wall, and a fourth reflecting subsection 133 elocated on a side of the fourth side wall.For example, the first reflecting portion 133 has a shape of a rectangle in plan view. The center of the rectangle may or may not match the center of the orthographic projection of the light emitting device 120 on the substrate 110.For example, the first sidewall may be substantially parallel to the first reflective portion area 133 a; the second sidewall may be substantially parallel to the second reflective portion area 133 b; the third sidewall may be substantially parallel to the third reflective portion area 133 c; the fourth sidewall may be substantially parallel to the fourth reflective portion area 133 e.In some examples, a plurality of first reflective sub-portions 133 alocated on a side of the first side walls of the light emitting devices 120 in a row are joined to form a one-piece structure. The plurality of first reflecting sub-portions 133 aof the one-piece structure are formed by a fifth reflecting pattern RP 5.In some examples, a plurality of second reflective sub-portions 133 blocated on a side of the second side walls of the light emitting devices 120 in a pillar are joined to form a one-piece structure. The plurality of first reflecting sub-portions 133 aof the one-piece structure are formed by a sixth reflecting pattern RP 6.In some examples, a plurality of third reflective sub-portions 133 clocated on a side of the third side walls of the light emitting devices 120 in a row are joined to form a one-piece structure. The plurality of first reflecting sub-portions 133 aof the one-piece structure are formed by a fifth reflecting pattern RP 5.In some examples, a plurality of fourth reflective sub-portions 133 elocated on a side of the fourth side walls of the light emitting devices 120 in a pillar are joined to form a one-piece structure. The plurality of first reflecting sub-portions 133 aof the one-piece structure are formed by a sixth reflecting pattern RP 6.In some embodiments, the manufacturing method includes before forming the reflective layer 130 on the substrate 110 using a 3D printing method S 301 a.In S 301 a, as shown in FIGS. 15 aand 15 b, a sacrificial layer 140 is formed on a side of the plurality of light emitting devices 120 opposite to the substrate 110. The sacrificial layer 140 includes a plurality of sacrificial patterns 141, and a sacrificial pattern 141 covers a top wall and sidewalls of a light emitting device 120.The material of the sacrificial layer 140 may be selected from, for example, materials that do not react with the reflective material and may be removed by an oil-based or aqueous cleaning agent.For example, the plurality of sacrificial patterns 141 may be arranged in one-to-one correspondence with the plurality of light emitting devices 120.The sacrificial layer 140 may be formed by a 3D printing method, for example; a quantitative spraying operation is performed at the position corresponding to each light emitting device 120 to form the sacrificial pattern 141. The plurality of sacrificial patterns 141 are not connected to each other.The sacrificial pattern 141 may have a lens structure, for example. The morphology of the lens structure of the formed sacrificial pattern may be controlled by adjusting the thixotropy of the material of the sacrificial layer.As another example, after the sacrificial material is sprayed onto the top wall of the light emitting device 120, it has the shape of a hemisphere or substantially the shape of a hemisphere, such that the surface of the formed sacrificial pattern 141 facing away from the substrate 110 also substantially has the shape of a hemisphere.The sacrificial pattern 141 covers all sides of the light emitting device 120 except for the surface in contact with the substrate 110. In this way, it is possible to prevent the reflective material from overflowing onto the light emitting device 120 or the pad in the subsequent reflective film forming process, thereby preventing the luminous efficiency of the light emitting device 120 and the welding performance between the light emitting device 120 and the pad from being impaired.In some examples, as shown in FIG. 15 c, forming the reflective layer 130 on the substrate 110 using a 3D printing method includes steps S 401 ato S 403 a.In S 401, a reflective film 136 is formed on the substrate 110 using a 3D printing method, as shown in FIGS. 15 dand 15 e; the reflective film 136 is in contact with the sidewalls of the sacrificial patterns 141, and an orthographic projection of the reflective film 136 on the substrate 110 does not overlap with orthographic projections of the light emitting devices 120 on the substrate 110.The edges of the orthographic projection of the reflective film 136 on the substrate 110 do not intersect the edges of the orthographic projections of the light emitting devices 120 on the substrate 110.For example, the reflective material is quantitatively sprayed on the region of the substrate 110 except for the sacrificial structures 141 to form the reflective film 136.For example, since the sacrificial pattern 141 wraps around the light emitting device 120, the reflective layer 136 formed on the substrate 110 is separated from the light emitting device 120 by the sacrificial pattern 141, so that there is a small distance between the reflective layer 136 and the light emitting device 120.In S 402 a, a leveling process and a pre-hardening process are performed on the reflective film 136 to form the reflective layer 130.For example, the reflective material is quantitatively sprayed at a fixed position, and it is necessary to perform a leveling process on the reflective film 136 in order to allow the reflective material to gradually flow to a position in contact with the side wall of the sacrificial pattern 141, and then a thermal curing process is performed on the reflective film 136 to form the reflective layer 130, thereby ensuring that the reflective layer 130 has a relatively uniform thickness and ensuring uniformity of the reflectivity of the reflective layer 130.For example, the sacrificial layer 140 has a certain thickness that is much larger than the thickness of the reflective layer 130. In this way, the reflective material can be prevented from rising to the sidewall of the sacrificial layer 140 during the leveling process of the reflective sheet 136, thereby preventing the reflective layer 130 from blocking the light emitting devices 120.In S 403 a, as shown in FIGS. 15 fand 15 g, the sacrificial layer 140 is removed.The sacrificial layer 140 may be removed, for example, with a lipophilic remover or a hydrophilic lotion suitable for the material of the sacrificial layer 140 to form the first openings 131 a.Since the sacrificial layer 140 is formed in advance to cover the light emitting devices 120, the process of spraying the reflective material in the above manufacturing method is less limited. Therefore, the manufacturing efficiency of the reflective layer 130 can be improved, and the manufacturing efficiency of the light emitting substrate 100 can be improved.In some examples, the manufacturing method of the light emitting substrate 100 further includes S 500.In S 500, an encapsulation process for the light emitting devices 120 is performed.For example, as shown in FIG. 8 a, an encapsulation layer 160 is formed by using an encapsulation adhesive to encapsulate the light emitting device 120, thereby preventing moisture from entering the interior of the light emitting device 120 to prevent the light emission of the light emitting device 120 from being impaired.In some other embodiments, before forming the reflective layer 130 on the substrate 110 using a 3D printing method, the manufacturing method further includes S 301 b.In S 301 b, as shown in FIGS. 16 aand 16 b, a protection layer 150 is formed on the opposite side of the light emitting devices 120 from the substrate 110 using a dispensing method; the protection layer 150 includes a plurality of protection patterns 151, and a protection pattern 151 covers the side walls and a top wall of a light emitting device 120.The material of the protective film 150 may be, for example, a transparent material.For example, in the protection layer 150, the plurality of protection patterns 151 are not connected to each other, and the plurality of protection patterns 151 are independent of each other. The plurality of protection patterns 151 correspond to the plurality of light emitting devices 120.The protection pattern 151 may have the shape of a hemisphere or substantially the shape of a hemisphere, for example.The protection pattern 151 may be, for example, a lens structure.For example, the protection pattern 151 covers all sides of the light emitting device 120 except for the surface in contact with the substrate 110. In this way, it is possible to prevent the reflective material from overflowing onto the light emitting device 120 or the substrate in the subsequent reflective film forming process, thereby preventing deterioration of the luminous efficiency of the light emitting device 120 and the welding performance between the light emitting device 120 and the substrate. Moreover, the protection pattern 151 may protect the light emitting device 120 such that the light emitting device 120 is protected from erosion by moisture and oxygen. The light emitted from the light emitting device 120 passes through the protection pattern 151 and then exits. The hemispherical shape or lens structure of the protection pattern 151 may change the type of light of the light emitting device 120.In some examples, as shown in FIG. 16 c, forming the reflective layer on the substrate 110 using the 3D printing method includes S 401 bto S 402 b.In S 401, as shown in FIGS. 16 dand 16 e, a reflective film 136 is formed on the substrate 110 using the 3D printing method; the reflective film 136 is in contact with the sidewalls of the protection patterns 151, and an orthographic projection of the reflective film 136 on the substrate 110 does not overlap with the orthographic projections of the light emitting devices 120 on the substrate 110.The edges of the orthographic projection of the reflective film 136 on the substrate 110 do not intersect the edges of the orthographic projections of the light emitting devices 120 on the substrate 110.For example, the reflective material is quantitatively sprayed on the area of the substrate 110 except for the protection patterns 151 to form the reflective film 136.For example, since the protection pattern 151 wraps around the light emitting device 120, the reflective layer 136 formed on the substrate 110 is separated from the light emitting device 120 by the protection pattern 151 so that there is a small distance between the reflective layer 136 and the light emitting device 120.In S 402, as shown in FIGS. 16 dand 16 e, a leveling process and a pre-hardening process are performed on the reflective film 136 to form the reflective layer 130.For example, the reflective material is quantitatively sprayed at a fixed position, and it is necessary to perform a leveling process on the reflective film 136 in order to allow the reflective material to gradually flow to a position in contact with the side wall of the protection pattern 151, and then a thermal curing process is performed on the reflective film 136 to form the reflective layer 130, thereby ensuring that the reflective layer 130 has a relatively uniform thickness and ensuring uniformity of the reflectivity of the reflective layer 130.For example, the protective layer 150 has a certain thickness, and the thickness is much larger than the thickness of the reflective layer 130. In this way, the reflective material can be prevented from rising to the side wall of the protective layer 150 during the leveling process of the reflective film 136, thereby preventing the reflective layer 130 from blocking the light emitting devices 120.In the manufacturing method described above, the protection layer 150 may be reused as the encapsulation layer 160, thereby shortening the process flow of the light emitting substrate 100.It is understood that, for the light emitting substrates 100 formed by the manufacturing methods in the above two embodiments, there are no excessive restrictions on the arrangement of the light emitting devices 120. The light emitting devices 120 may be distributed in an irregular shape (as shown in FIG. 17 a ); that is, the light emitting devices 120 are arranged in a non-array manner. Therefore, the light emitting substrates 100 have a broad spectrum of application. The structures of the light emitting substrates 100 each formed by the manufacturing methods in the above two embodiments will be described in detail below.For example, a surface of the reflective layer 130 in contact with the sacrificial layer 140 forms a sidewall of the first reflective portion 133. Therefore, the shape of the sidewall of the sacrificial layer 140 determines the shape of the sidewall of the first reflecting portion 133. As can be seen from the above, the overall outline of the sacrificial pattern 141 has substantially the shape of a hemisphere. Therefore, the side wall of the first reflecting portion 133 that is in contact with the sacrificial pattern 141 has an approximately concave shape or a rectilinear shape in the sectional view.In some examples, as shown in FIG. 15 g, the thickness of the first reflective portion 133 is positively correlated with a distance in a direction passing through a center of the light emitting device 120 and perpendicular to a sidewall of the light emitting device 120 between the first reflective portion 133 and the center of the light emitting device 120.For example, in the sectional view (FIG. 15 g), along the direction passing through the center of the light emitting device 120 and perpendicular to the side wall of the light emitting device 120, the thickness of the first reflecting portion 133 is not uniform, and the thickness of the first reflecting portion 133 changes with the distance from the first reflecting portion 133 to the center of the light emitting device 120.The larger the distance between a part of the first reflecting portion 133 and the center of the light emitting device 120, the larger the thickness of the part of the first reflecting portion 133 is, as shown in FIG. 15 g. The smaller the distance between a part of the first reflecting portion 133 and the center of the light emitting device 120, the smaller the thickness of the part of the first reflecting portion 133. That is, in the direction shown in the figure, the thickness of the first reflecting portion 133 is gradually decreased and reaches the minimum thickness at the portion closest to the light emitting device 120.For example, the first reflecting portion 133 includes a lower surface 133 pand an upper surface 133 twhich are opposed to each other. At least a part of the bottom surface 133 pis not in contact with the substrate 110, and an angle between the at least a part of the bottom surface 133 pand a plane in which the substrate 110 is located is an acute angle. The top surface 133 tis parallel or substantially parallel to the substrate 110.For example, as shown in FIG. 15 g, in a case where a part of the bottom surface 133 pof the first reflecting portion 133 is not in contact with the substrate 110, the first reflecting portion 133 may have a shape of a trapezoid in the sectional view. The trapezoid is a not strictly defined trapezoid.As another example, in a case where the entire lower surface 133 pof the first reflecting portion 133 is not in contact with the substrate 110, the first reflecting portion 133 may have a shape of a triangle in the sectional view. In this case, the triangle is a non-strictly defined triangle.Here, the upper surface of the first reflecting portion 133 is parallel or substantially parallel to the substrate 110, which is a morphological feature of the reflecting layer 130 formed on the reflecting film 136 after a leveling process in the above manufacturing method. In this way, the reflectance of the upper surface of the first reflecting portion 133 can be improved.In some examples, as shown in FIG. 15 g, in the direction passing through the center of the light emitting device 120 and perpendicular to the sidewall of the light emitting device 120, a dimension W 4 of the part of the first reflecting portion 133 not in contact with the substrate 110 is less than 20 μm.For example, in the sectional view (FIG. 15 g) taken along the direction passing through the center of the light emitting device 120 and perpendicular to the sidewall of the light emitting device 120, the dimension W 4 of the part of the first reflective portion 133 not in contact with the substrate 11 may be 19 μm, 16 μm, 13 μm, 10 μm, or 5 μm.It has been experimentally proved that in a case where the dimension W 4 of the part of the first reflecting portion 133 not in contact with the substrate 11 is less than 20 μm, it can be ensured that the morphology of the reflecting layer 130 satisfies the optical requirements and the reflectance of the reflecting layer 130 is high.In some examples, a surface of the second reflective portion 134 remote from the substrate 110 may be a flat surface or substantially a flat surface.For example, the thickness of the second reflecting portion 134 is relatively uniform.The flat surface may improve the reflectance of the reflective layer 130, for example.As can be seen from the above embodiments, the top surface of the first reflecting portion 133 is parallel to the substrate 110. Therefore, the upper surface of the first reflecting portion 133 may be located on the same horizontal plane as the surface of the second reflecting portion 134 away from the substrate 110, so that the surface of the reflecting layer 130 away from the substrate 110 may be relatively flat, and the first reflecting portion 133 and the second reflecting portion 134 of the reflecting layer 130 may be formed in a single manufacturing process to simplify the manufacturing process of the reflecting layer 130.It is to be understood that in a case where the size of the light emitting device 120 is different, the reflective layer 130 is formed using another manufacturing method. For example, in FIG. 17 c, in a case where the light emitting device 120 has the shape of a square in plan view and the side length of the square is 0.45 mm, a condition that the distance between the side wall of the light emitting device and the reflective layer 130 is in the range of 0.1 mm may satisfy the optical requirements. Therefore, it is necessary to set the diameter of the protective layer (in an example in which the protective layer 150 has the shape of a hemisphere) to about 0.65 mm. In this case, the distance between each side of the square (i.e., each side wall of the light emitting device) and the reflective layer 130 is about 0.1 mm. Therefore, the light emitting substrate 100 in which the light emitting device 120 has the shape of a square having a side length of 0.45 mm in plan view can be formed by first forming the protective layer 150 and then forming the reflective layer 130. As another example in FIG. 17 d, when the light emitting device 120 has a shape of a rectangle in plan view, the length of the long side is 0.52 mm and the length of the short side is 0.15 mm, the diameter of the protection layer 150 needs to be set to 0.72 mm. In this case, the distance between the long side and the reflective layer 130 is 0.1 mm, while the distance between the short side and the reflective layer 130 is larger than 0.1 mm, resulting in a large distance between each of the two side walls of the light emitting device 120 and the reflective layer, easily leading to problems of light leakage and lowering of the reflectance. Therefore, the light emitting substrate 100 in which the light emitting device has the shape of a rectangle is not suitable for using the method in which the protection layer 150 is first formed and then the reflective layer 130 is formed, but is suitable for using the method in which the sacrificial layer 140 is first formed, a reflective film is formed and then the sacrificial layer 140 is removed (as shown in FIG. 17 b).In some embodiments, as shown in FIG. 18 a, the substrate 110 includes a plurality of seventh printing regions P 7 and an eighth printing region P 8. The seventh print range P 7 surrounds the light emitting device 120, and the eighth print range P 8 is located between any two adjacent seventh print ranges P 7.For example, the plurality of seventh print areas P 7 are in one-to-one correspondence with the plurality of light emitting devices 120, and a seventh print area P 7 corresponds to one light emitting device 120.For example, when the plurality of light emitting devices 120 are arrayed, the plurality of seventh print regions P 7 are arrayed, respectively.In some examples, as shown in FIG. 18 b, forming the reflective layer 130 on the substrate 110 using a 3D printing method includes steps S 410 bto S 420 b.In S 410 b, as shown in FIG. 18 c, a reflective material is printed in each seventh print region P 7 using an all-round printing method, and a pre-hardening process is performed on the reflective material in each seventh print region P 7 to form an eighth reflective pattern RP 8; the eighth reflective pattern RP 8 forms the first reflective portion 133 and a part of the third reflective portion 137 of the reflective layer 130.The eighth reflective pattern is formed by using the all-round printing method, the distance between the reflective layer 130 and the light emitting device 120 can be accurately controlled, thereby increasing the reflectance of the reflective layer 130 and improving the brightness of the light emitting substrate 100.In S 420 b, as shown in FIGS. 18 dand 18 e, a reflective material is quantitatively sprayed into the eighth printing region P 8 by using a quantitative spraying process, and a leveling process and a pre-hardening process are performed on the reflective material in the eighth printing region P 8 to form a ninth reflective pattern RP 9. The ninth reflection pattern RP 9 forms the second reflective layer 134 and another part of the third reflective layer 137 of the reflective layer 130.For example, the third reflective layer 137 is located between the first reflective layer 133 and the second reflective layer 134, and the second reflective layer 134 is connected to the first reflective layer 133 via the third reflective layer 137.For example, the first reflecting portion 133 surrounds the light emitting device 120, and the third reflecting portion 137 surrounds the first reflecting portion 133.A 3D printer may be equipped with two different printheads, for example. The first print head can achieve high-precision detailed printing and is used in the all-round printing method. The first print head may print a rectangular frame-shaped reflective material having a certain thickness into the seventh print area P 7 with high precision, and then a pre-hardening process is performed to form an eighth reflective pattern, so that the eighth reflective pattern may block the reflective material in the eighth print area P 8 to prevent the reflective material in the eighth print area P 8 from aligning in the vicinity of the seventh print area P 7 and the light emitting area 120. In this way, the shape accuracy of the reflective layer 130 can be secured. The second print head may perform quantitative spraying to spray the reflective material into the eighth print area P 8.In the reflective layer 130 formed by the above method, a "coffee ring" visible to the human eye is formed at the edge of the above-mentioned rectangular frame (as shown in Figs. 18f and 18g), for example. That is, the thickness of a part of the reflective layer 130 located in a certain area around the rectangular frame (about 1 mm away from the rectangular frame) is less than the thickness of a part of the reflective layer 130 located in the rectangular frame, and the difference between the thicknesses is about 10 μm.For example, the relative position of the "coffee ring" and the light emitting device 120 as well as the thickness difference may be controlled by controlling the thickness of the printed rectangular frame, the printing time, the pre-cure conditions, etc., to increase the reflectivity of the reflective layer 130.For example, the reflective material is precured at the location of the rectangular frame to form the first reflective portion 133 of the reflective layer 130. A part of the ninth reflection pattern RP 9 that is in contact with the first reflective layer 133 forms the third reflective layer 137, and the remaining part forms the second reflective layer 134.For example, the thickness of the third reflecting portion 137 is less than the thickness of the first reflecting portion 133.For example, as shown in FIG. 18 e, the thickness of the first reflective portion 133 is 50 μm, the thickness of the third reflective portion 137 is 45 μm, and the thickness of the second reflective portion 134 is 55 μm.The thickness of the first reflecting portion 133 refers to the maximum thickness of the first reflecting portion 133.It should be appreciated that the morphological features of the "coffee ring" in the reflective layer 130 are the unique morphology of the reflective layer formed by the fabrication method in the embodiments of the present disclosure.It is understood that the light emitting substrate 100 also includes a plurality of driver chips 170.In some examples, a driver chip 170 is electrically connected to at least one light emitting device 120, and the driver chip 170 is configured to drive the at least one light emitting device 120 to emit light.For example, a driver chip 170 is electrically connected to a light emitting device 120 to drive the light emitting device 120 to emit light.For example, as illustrated in FIGS. 6 cand 19 a, a driver chip 170 may be electrically connected to four light emitting devices 120 to drive the four light emitting devices 120 to emit light.For example, a driver chip 170 may be electrically connected to nine light emitting devices 120 to drive the nine light emitting devices 120 to emit light.The description will be made with reference to an example in which a driver chip 170 drives four light emitting devices 120.The following description will be given by way of an example in which four light emitting devices driven by a driver chip 170 are arranged in two rows and two columns, and the driver chip 170 is arranged directly below the light emitting devices 120 in each column.There are two relative positional relationships between the driver chip 170 and the reflective layer 130, i.e., the driver chip(s) 170 are located in the respective openings 131, and the driver chip(s) 170 are covered by the reflective layer 130. The light emitting substrates 100 corresponding to the above two positional relationships are manufactured by various manufacturing methods, which will be separately described below.In the case where the driver chip 170 is located in the opening 131, the manufacturing method of the light emitting substrate 100 in the above manufacturing method before cleaning the portion of the substrate 110 located around each light emitting device 120 further includes S 210.In S 210, as illustrated in FIG. 19 a, a plurality of driver chips 170 are mounted on the substrate 110.Accordingly, the method of manufacturing the light emitting substrate 100 after cleaning the portion of the substrate 110 located around each light emitting device 120 further includes S 301.In S 301, the portion of the substrate 110 located around each driver chip 170 is cleaned.For example, for the cleaning process of cleaning the surrounding region of the driver chip 170, reference may be made to the above-mentioned cleaning process of cleaning the surrounding region of the light emitting device 120, which should not be repeated at this time.In some embodiments, as shown in FIG. 19 b, the plurality of openings 131 of the reflective layer 130 also include a plurality of second openings 131 b.In some examples, the plurality of driver chips 170 are in one-to-one correspondence with the plurality of second openings 131 b, and one driver chip 170 is in a second opening 131 b.The size of the first opening 131 arefers to the size of the light emitting device 120, and the size of the second opening 131 brefers to the size of the driver chip 170, for example. Therefore, the size of the first opening 131 aand the size of the second opening 131 bmay be the same or different. The shape of the first opening 131 ain plan view may be the same as or different from the shape of the second opening 131 bin plan view.For example, the first reflective portion 133 is located on at least one side of the driver chip 170.In some examples, the first reflective portion 133 is variously located on at least one side of the driver chip 170. For example, the first reflective portion 133 may be disposed on a side of the driver chip 170. Another example is that the first reflecting portion 133 is located on two adjacent sides or two opposite sides of the driver chip 170. Another example is that the first reflecting portion 133 surrounds the corresponding driver chip 170.In the above embodiment, as shown in FIG. 19 b, at least one sidewall of the driver chip 170 is in contact with the corresponding first reflective portion 133, and / or at least one sidewall of the driver chip 170 and the corresponding first reflective portion 133 have a second gap GP 2 therebetween.In some examples, at least one sidewall of the driver chip 170 is in contact with the corresponding first reflective portion 133.For example, one or more sidewalls of the driver chip 170 are each in contact with the corresponding first reflective portion 133.In an example in which the driver chip 170 has the shape of a rectangle in plan view, it is possible that one side wall of the driver chip 170 is in contact with the first reflecting portion 133 (each of the other three side walls and the first reflecting portion 133 may have a first gap therebetween); alternatively, it is possible that four side walls of the driver chip 170 are in contact with the first reflecting portion 133, respectively.In the present disclosure, the light emitting substrate 100 is manufactured using the above manufacturing method, wherein the part of the substrate 110 located around each driver chip 170 is cleaned, thereby mitigating the repulsion phenomenon occurring between the part of the substrate located around the driver chip 170 and the reflective material to be printed in the subsequent process, so that the sidewall of the driver chip 170 is in contact with the corresponding first reflective portion 133 in the light emitting substrate 100. As a result, it is possible to increase the area ratio of the reflective layer 130 in the light emitting substrate 100, which can improve the light efficiency of the light emitting substrate 100 and alleviate the problem of light loss, light and dark optical stripes, and mura phenomenon of the light emitting substrate 100, thereby improving the luminance of the backlight module 10 and the display device 1 and reducing the power consumption of the backlight module 10 and the display device 1.In some other examples, there is a second gap GP 2 between at least one sidewall of the driver chip 170 and the corresponding first reflective portion 133.For example, there is a second gap GP 2 between one sidewall or each of a plurality of sidewalls of the driver chip 170 and the corresponding first reflective portion 133.In an example where the driver chip 170 has the shape of a rectangle in plan view, there may be a second gap GP 2 between a side wall of the driver chip 170 and the first reflecting portion 133; alternatively, there may be a second gap GP 2 between each of the four side walls of the driver chip 170 and the first reflecting portion 133, and the distance between each of the four side walls and the first reflecting portion 133 is the same.The width of the second gap GP 2 is, for example, less than or equal to 150 μm.For example, the width of the second gap GP 2 refers to a dimension of the second gap GP 2 in a direction perpendicular to the sidewall of the corresponding light emitting device 120.The width of the second gap GP 2 may be, for example, 150 μm, 100 μm, 50 μm, 25 μm, or 10 μm.It is understood that the width of the second gap GP 2 and the width of the first gap GP 1 may be the same or different.In the present disclosure, the light emitting substrate 100 is manufactured using the above manufacturing method, wherein the part of the substrate 110 located around each driver chip 170 is cleaned, thereby reducing the repulsion phenomenon occurring between the part of the substrate located around the driver chip 170 and the reflective material to be printed in the subsequent process, so that the width of the first gap between the sidewall of the driver chip 170 and the corresponding first reflective portion 133 in the light emitting substrate 100 is small. As a result, it is possible to increase the area ratio of the reflective layer 130 in the light emitting substrate 100, which can improve the light efficiency of the light emitting substrate 100 and alleviate the problem of the light and dark optical stripes and the Mura phenomenon of the light emitting substrate 100, thereby improving the luminance of the backlight module 10 and the display device 1 and reducing the power consumption of the backlight module 10 and the display device 1.In some other examples, at least one sidewall of the driver chip 170 is in contact with the corresponding first reflective portion 133, and there is a second gap GP 2 between another at least one sidewall of the driver chip 170 and the corresponding first reflective portion 133.For example, a sidewall of the driver chip 170 is in contact with the corresponding first reflective portion 133, and there is a second gap GP 2 between each of the remaining sidewalls of the driver chip 170 and the corresponding first reflective portion 133.In another example, a second gap GP 2 is located between a sidewall of the driver chip 170 and the corresponding first reflective portion 133, and the remaining sidewalls of the driver chip 170 are each in contact with the corresponding first reflective portion 133.As another example, a second gap GP 2 is provided between each of two sidewalls of the driver chip 170 and the corresponding first reflecting portion 133, and the remaining sidewalls of the driver chip 170 are each in contact with the corresponding first reflecting portion 133.In the present disclosure, the light emitting substrate 100 is manufactured using the above manufacturing method, wherein the part of the substrate 110 located around each driver chip 170 is cleaned, thereby reducing the repulsion phenomenon occurring between the part of the substrate located around the driver chip 170 and the reflective material to be printed in the subsequent process, so that the sidewall(s) of the driver chip 170 in the light emitting substrate 100 are each in contact with the corresponding first reflective portion 133 or a second gap having a small width is present between each of the sidewall(s) of the driver chip 170 and the corresponding first reflective portion 133 in the light emitting substrate 100. As a result, it is possible to increase the area ratio of the reflective layer 130 in the light emitting substrate 100, which can improve the light efficiency of the light emitting substrate 100 and alleviate the problem of the light and dark optical stripes and the Mura phenomenon of the light emitting substrate 100, thereby improving the luminance of the backlight module 10 and the display device 1 and reducing the power consumption of the backlight module 10 and the display device 1.As shown in FIG. 19 c, in the case that the driver chip(s) 170 is / are covered by the reflective layer 130, an orthographic projection of at least one driver chip 170 on the substrate 110 may be arranged within the orthographic projection of the reflective layer 130 on the substrate 110. That is, at least one driver chip 170 is covered by the reflective layer 130, and the remaining driver chips 170 may be located in the respective second openings 131 bof the reflective layer 130.For example, a boundary of an orthographic projection of a driver chip 170 on the substrate 110 is within the boundary of the orthographic projection of the reflective layer 130 on the substrate 110.As another example, the boundaries of the orthographic projections of the plurality of driver chips 170 on the substrate 110 are all within the boundary of the orthographic projection of the reflective layer 130 on the substrate 110.With this arrangement, the area ratio of the reflective layer 130 in the light emitting substrate 100 can be increased, and the area of the reflective region of the light emitted from the light emitting device 120 can be increased, thereby improving the luminous efficiency of the light emitting substrate 100 and mitigating the problem of light loss of the light emitting substrate 100.It should be understood that, in a case where the driver chip 170 is disposed in the second opening 131 band the first reflecting portion 133 is disposed on at least one side of the driver chip 170, as in the manufacturing methods of the reflecting layer 130 and the light emitting substrate 100, the manufacturing method of the case where the first reflecting portion 133 is disposed on at least one side of the light emitting device 120 may be referred to, which is not repeated here.Some embodiments of the present disclosure provide a light emitting substrate 100, and the light emitting substrate 100 is a light emitting substrate manufactured by the manufacturing method as described in any of the above embodiments.The structure of the light emitting substrate 100 will be described below.In some examples, as illustrated in FIGS. 2 and 3, the light emitting substrate 100 includes a substrate 110, light emitting devices 120, and a reflective layer 130.In some examples, the plurality of light emitting devices 120 are disposed on one side of the substrate 110.In some examples, as shown in FIG. 6 e, the reflective layer 130 includes a plurality of first reflective portions 133 and a second reflective portion 134 connecting any two adjacent first reflective portions 133. The first reflecting portion 133 is located on at least one side of the light emitting device 120. The thickness of the first reflecting portion 133 is less than the thickness of the second reflecting portion 134.For example, the first reflecting portion 133 is closer to the light emitting device 120 than the second reflecting portion 134.In some examples, the first reflective portion 133 is located on at least one side of the light emitting device 120, where the arrangement may vary.For example, the first reflecting portion 133 may be disposed on a side of the light emitting device 120.Another example is that the first reflecting portion 133 may be disposed on two adjacent or opposite sides of the light emitting device 120.As another example, the first reflecting portion 133 may be disposed on three sides of the light emitting device 120.As another example, the first reflecting portion 133 may surround the corresponding light emitting device 120.For example, an orthographic projection of the light emitting device 120 onto the substrate 110 may have various shapes such as a circle or a rectangle.The thickness of the first reflective layer 133 is small, so that the dimensional accuracy of the first reflective layer is easily controlled. In the rectangular light emitting device 120, the shape accuracy of the portion of the first reflecting portion 133 corresponding to the short side has a greater influence on the luminous efficiency of the light emitting substrate 100 compared to the shape accuracy of the portion of the first reflecting portion 133 corresponding to the long side. Therefore, in a case where the first reflecting portion 133 is disposed on two opposite sides of the light emitting device 120 and the orthographic projection of the light emitting device 120 on the substrate 110 has the shape of a rectangle, the first reflecting portion 133 is disposed on the sides of the two long sides of the rectangle. In this way, the luminous efficiency of the light emitting substrate 100 can be improved, the printing cost of the reflective layer 130 can be reduced, and the printing efficiency of the reflective layer 130 can be improved.It is understood that, as shown in FIG. 8 a, the luminous efficiency of the light emitting substrate is related to the light exit mode of the light emitting device. There are three ways in which the light emitted from the light emitting device 120 can exit. The light emitted from the light emitting device 120 is emitted through the path A and the path B, i.e., the light is directly emitted from the top wall or the side wall of the light emitting device 120 without passing through the reflective layer 130, resulting in less light loss. The light emitted from the light emitting device 120 is emitted through the path C, i.e., the light is reflected by the side wall of the first reflecting portion 133 and then emitted by the side wall of the light emitting device 120, resulting in a large light loss. The larger the proportion of the light emitted from the path C, the larger the light loss of the light emitting device and the lower the light extraction efficiency of the light emitting substrate. In the present disclosure, the thickness of the first reflecting portion 133 is set to be less than the thickness of the second reflecting portion 134, which can improve the situation where light is reflected on the side walls of the first reflecting portion 133 and then emitted so that the light emitted through the path C makes up a small portion of the light emitted from the light emitting device 120. As a result, the light loss of the light emitting device 120 is low, which can improve the light extraction efficiency of the light emitting substrate 100, thereby improving the display brightness of the backlight module 10 and the display device 1, and reducing the power consumption of the backlight module 10 and the display device 1.There are various positional relationships between the sidewalls of the light emitting device 120 and the corresponding first reflecting portion 133, which can be adjusted according to actual needs and are not limited in the present disclosureIn a case where the light emitting device 120 includes a plurality of side walls, the relative positional relationship between each of the plurality of side walls of the light emitting device 120 and the corresponding first reflecting portion 133 may be the same or different.In some embodiments, as shown in FIG. 9 f, at least one sidewall of the light emitting device 120 and the corresponding first reflective portion 133 have a first gap GP 1 therebetween and / or at least one sidewall of the light emitting device 120 is in contact with the corresponding first reflective portion 133.In some examples, as shown in FIG. 9 f, there is a first gap GP 1 between at least one sidewall of the light emitting device 120 and the corresponding first reflective portion 133.For example, there is a first gap GP 1 between one side wall or each of the side walls of the light emitting device 120 and the corresponding first reflecting portion 133.In an example where the light emitting device 120 has the shape of a rectangle in plan view, there may be a first gap GP 1 between one side wall of the light emitting device 120 and the first reflecting portion 133, or there may be a first gap GP 1 between each of the four side walls of the light emitting device 120 and the first reflecting portion 133. The first gap GP 1 between each of the four side walls and the first reflecting portion 133, i.e., the width of the first gap GP 1, may be the same or different.The width of the first gap GP 1 is, for example, less than or equal to 150 μm.For example, the width of the first gap GP 1 refers to a dimension of the first gap GP 1 in a direction perpendicular to the sidewall of the corresponding light emitting device 120.The width of the first gap GP 1 may be, for example, 150 μm, 100 μm, 50 μm, 25 μm, or 10 μm.In the present disclosure, the light emitting substrate 100 is manufactured by the above manufacturing method, whereby the width of the first gap GP 1 between the side wall of the light emitting device 120 and the corresponding first reflecting portion 133 in the light emitting substrate 100 can be made small, thereby improving the area ratio of the reflecting layer 130 in the light emitting substrate 100. As a result, it is possible to improve the luminous efficiency of the light emitting substrate 100, alleviate the problem of the light and dark optical stripes and the Mura phenomenon of the light emitting substrate 100, and improve the luminance of the light emitting device 120, thereby improving the brightness of the backlight module 10 and the display device 1 and reducing the power consumption of the backlight module 10 and the display device 1.In some other examples, as shown in FIG. 9 f, at least one sidewall of the light emitting device 120 is in contact with the corresponding first reflective portion 133.For example, one side wall or each of a plurality of side walls of the light emitting device 120 is in contact with the corresponding first reflecting portion 133.In an example in which the light emitting device 120 forms a rectangle in plan view, one side wall of the light emitting device 120 may be in contact with the first reflecting portion 133 (a first gap GP 1 may be present between each of the remaining three side walls and the first reflecting portion 133); alternatively, all four side walls of the light emitting device 120 are in contact with the first reflecting portion 133, respectively.In the present disclosure, the light emitting substrate 100 is manufactured using the above manufacturing method, whereby the sidewall(s) of the light emitting device 120 in the light emitting substrate 100 can be brought into contact with the corresponding first reflecting portion 133, respectively, thereby improving the area ratio of the reflecting layer 130 in the light emitting substrate 100. As a result, it is possible to improve the luminous efficiency of the light emitting substrate 100, alleviate the problem of the light and dark optical stripes and the Mura phenomenon of the light emitting substrate 100, and thereby improve the luminance of the backlight module 10 and the display device 1 and reduce the power consumption of the backlight module 10 and the display device 1.In some other examples, as shown in FIG. 9 f, there is a first gap GP 1 between at least one sidewall of the light emitting device 120 and the corresponding first reflective portion 133, and at least one sidewall of the light emitting device 120 is in contact with the corresponding first reflective portion 133.For example, one side wall of the light emitting device 120 is in contact with the corresponding first reflecting portion 133, and there is a first gap GP 1 between each of the remaining side walls of the light emitting device 120 and the corresponding first reflecting portion 133.As another example, a first gap GP 1 is provided between a side wall of the light emitting device 120 and the corresponding first reflecting portion 133, and the remaining side walls of the light emitting device 120 are each in contact with the corresponding first reflecting portion 133.In another example, as shown in FIG. 9 f, there is a first gap GP 1 between each of the three side walls of the light emitting device 120 and the corresponding first reflecting portion 133, and the remaining side wall of the light emitting device 120 is in contact with the corresponding first reflecting portion 133.In the present disclosure, the light emitting substrate 100 is manufactured using the above manufacturing method, whereby the sidewall(s) of the light emitting device 120 in the light emitting substrate 100 are each in contact with the corresponding first reflecting portion 133, or each of the sidewall(s) of the light emitting device 120 in the light emitting substrate 100 and the corresponding first reflecting portion 133 have a first gap GP 1, thereby improving the area ratio of the reflecting layer 130 in the light emitting substrate 100. As a result, it is possible to improve the luminous efficiency of the light emitting substrate 100, alleviate the problem of the light and dark optical stripes and the Mura phenomenon of the light emitting substrate 100, and thereby improve the luminance of the backlight module 10 and the display device 1 and reduce the power consumption of the backlight module 10 and the display device 1.In some examples, as shown in FIG. 15 g, the thickness of the first reflective portion 133 is positively correlated with a distance, in a direction passing through a center of the light emitting device 120 and perpendicular to a sidewall of the light emitting device 120, between the first reflective portion 133 and the center of the light emitting device 120.For example, in the sectional view (FIG. 15 g) taken along the direction passing through the center of the light emitting device 120 and perpendicular to the side wall of the light emitting device 120, the thickness of the first reflecting portion 133 is not uniform, and the thickness of the first reflecting portion 133 changes with the distance from the first reflecting portion 133 to the center of the light emitting device 120.The larger the distance between a part of the first reflecting portion 133 and the center of the light emitting device 120, the larger the thickness of the part of the first reflecting portion 133 is, as shown in FIG. 15 g. The smaller the distance between a part of the first reflecting portion 133 and the center of the light emitting device 120, the smaller the thickness of the part of the first reflecting portion 133. That is, in the direction near the center of the light emitting device 120 shown in the figure, the thickness of the first reflecting portion 133 gradually decreases and reaches the minimum thickness at the portion closest to the light emitting device 120.For example, the first reflecting portion 133 includes a lower surface 133 pand an upper surface 133 twhich are opposed to each other. At least a part of the bottom surface 133 pis not in contact with the substrate 110, and an angle between the at least a part of the bottom surface 133 pand a plane in which the substrate 110 is located is an acute angle. The top surface 133 tis parallel or substantially parallel to the substrate 110.For example, an angle between the part of the lower surface 133 pof the first reflecting portion 133 that is not in contact with the substrate 110 and the plane in which the substrate 110 is located is an acute angle. In other words, the lower surface 133 pof the first reflecting portion 133 has a structure concave inwardly relative to the upper surface 133 t.In some examples, as shown in FIG. 15 g, in the direction passing through the center of the light emitting device 120 and perpendicular to the sidewall of the light emitting device 120, a dimension W 4 of the part of the first reflecting portion 133 not in contact with the substrate 110 is less than 20 μm.For example, in the sectional view (FIG. 15 g) taken along the direction passing through the center of the light emitting device 120 and perpendicular to the sidewall of the light emitting device 120, the dimension W 4 of the part of the first reflective portion 133 not in contact with the substrate 11 may be 19 μm, 16 μm, 13 μm, 10 μm, or 5 μm.It has been experimentally proved that in a case where the dimension W 4 of the part of the first reflecting portion 133 not in contact with the substrate 11 is less than 20 μm, it can be ensured that the morphology of the reflecting layer 130 satisfies the optical requirements and the reflectance of the reflecting layer 130 is high.In some embodiments, a surface of the second reflective portion 134 facing away from the substrate 110 may be a planar surface or substantially a planar surface.For example, the thickness of the second reflecting portion 134 is relatively uniform.The flat surface may improve the reflectance of the reflective layer 130, for example.As can be seen from the above, the upper surface of the first reflecting portion 133 is parallel to the substrate 110. Therefore, the upper surface of the first reflecting portion 133 may be located on the same horizontal plane as the surface of the second reflecting portion 134 away from the substrate 110, so that the surface of the reflecting layer 130 away from the substrate 110 may be relatively flat, and the first reflecting portion 133 and the second reflecting portion 134 of the reflecting layer 130 may be formed in a single manufacturing process to simplify the manufacturing process of the reflecting layer 130.For example, as shown in FIG. 15 g, in a case where a part of the bottom surface 133 pof the first reflecting portion 133 is not in contact with the substrate 110, the first reflecting portion 133 may have a shape of a trapezoid in the sectional view. The trapezoid is a not strictly defined trapezoid.As another example, in a case where the entire lower surface 133 pof the first reflecting portion 133 is not in contact with the substrate 110, the first reflecting portion 133 may have a shape of a triangle in the sectional view. In this case, the triangle is a non-strictly defined triangle.Here, the upper surface of the first reflecting portion 133 is parallel or substantially parallel to the substrate 110, which is a morphological feature of the reflecting layer 130 formed on the reflecting film 136 after a leveling process in the above manufacturing method. In this way, the reflectance of the upper surface of the first reflecting portion 133 can be improved.For example, the thickness of the reflective layer 130 may be in a range of 55 μm±5 μm. For example, the thickness of the reflective layer 130 is 50 μm, 52 μm, 55 μm, 57 μm, or 60 μm.In an example where the thickness of the reflective layer 130 is 60 μm, the thickness of the first reflective portion 133 may be less than 60 μm. The thickness refers to the average thickness.In some embodiments, the minimum thickness of the first reflective portion 133 is less than 60 μm.The minimum thickness of the first reflective portion 133 may be, for example, 59 μm, 55 μm, 50 μm, 45 μm, or 40 μm.With the above arrangement, in a case where the first reflecting portion 133 is in contact with a side wall of the light emitting device 120, the amount of light emitted from the path C can be reduced, thereby avoiding deterioration of the light extraction effect of the light emitting device 120.In cases where the minimum thicknesses of the first reflective portions 133 are 45 μm and 60 μm and the widths of the first gaps GP 1 between the first reflective portion 133 and the corresponding light emitting device 120 are 200 μm, 150 μm, 100 μm, 50 μm, 25 μm, 0 μm, and -15 μm, respectively, the luminances of the light emitting substrates 100 are simulated, and the simulation results are illustrated in FIG.. 11.The above-mentioned "0 μm" represents the case where the first reflecting portion 133 is in contact with the light emitting device 120. The above-mentioned "-15 μm" represents the case where the first reflective portion 133 is in contact with the light emitting device 120 and a dimension in the first direction X of the portion of the first reflective portion 133 covering the light emitting device 12 is -15 μm. The case where the minimum thickness of the first reflecting portion 133 is 60 μm corresponds to an implementation in which there is no difference in thickness between the first reflecting portion and the second reflecting portion, and the thickness of the first reflecting portion is equal to the thickness of the second reflecting portion.As shown in FIG. 11, in an example in which the luminance of the light emitting substrate is 100%, when the thickness of the first reflecting portion 133 is 60 μm and the light emitting device 120 is in contact with the first reflecting portion 133, the luminance is gradually increased as the width of the first gap GP 1 is decreased from 150 μm to 0 μm, and the variation of the luminance is less than 5%, which is within the acceptable variation range of the luminance; in a case in which the width of the first gap GP 1 is -15 μm, the luminance is reduced to about 90%, and the luminance varies by about 10%, which is within an unacceptable variation range of the luminance. In a case where the width of the first gap GP 1 is less than or equal to 150 μm and the minimum thickness of the first reflecting portion 133 is less than 60 μm, the variation in luminance of the light emitting substrate 100 is acceptable.In addition, computer simulation of luminance is performed in a case where the width of the first gap GP 1 is changed stepwise from 300 μm to 0 μm, and FIG. 12 is obtained. in FIG. 12, the luminance is 100% in a case where the width of the first gap GP 1 is 0 μm; in a case where the width of the first gap GP 1 is 50 μm, the luminance is 98.9%; in a case where the width of the first gap GP 1 is 100 μm, the luminance is 96.5%; in a case where the width of the first gap GP 1 is 150 μm, the luminance is 95.0%; In a case where the width of the first gap GP 1 is 200 μm, the luminance is 93.4%; in a case where the width of the first gap GP 1 is 250 μm, the luminance is 91.6%; in a case where the width of the first gap GP 1 is 300 μm, the luminance is 89.7%. In the implementation described above, the large-sized light emitting substrate is manufactured by the method: material preparation → reflective layer formation by screen printing → AOI → die bonding → dot repair → AOI → encapsulant, it is possible to achieve the gap between the reflective layer and the light emitting device to be in a range of 0.3 mm±0.15 mm (corresponding to the case where the width of the first gap is 300 μm). However, in the present disclosure, the width of the first gap GP 1 may reach 0 μm; as compared to implementation, the luminance is increased from 89.7% to 100%, and the luminance gain is about 10%; moreover, in the light emitting substrate 100 formed by the manufacturing method in the above embodiments of the present disclosure, the width of the first gap between the reflective layer 130 and the light emitting device 120 may be controlled with an accuracy of 0.05 mm±0.05 mm, so that the luminance of the light emitting substrate 100 may be greatly increased and the power consumption of the backlight module 10 and the display device 1 may be reduced.In some examples, as shown in FIG. 6 e, the first reflecting portion 133 includes a lower surface 133 pand an upper surface 133 twhich are opposed to each other; the lower surface 133 pis in contact with the substrate 110, and an angle between the upper surface 133 tand a plane in which the substrate 110 is located is an acute angle.For example, an angle between the part of the lower surface 133 pof the first reflecting portion 133 that is in contact with the substrate 110 and the plane in which the substrate 110 is located is an acute angle. That is, the lower surface 133 pof the first reflecting portion 133 has a structure protruding outward relative to the upper surface 133 t.The angle α between the top surface 133 tand the substrate 110 may be 30°, 35°, 40°, 45°, or 50°, for example.With the above arrangement, as shown in FIG. 8 a, the proportion of light emitted along the path C may be small, and the loss of light emitted from the light emitting device 120 may be small, thereby increasing the reflectance of the reflective layer 130, improving the luminous efficiency of the light emitting substrate 100, and reducing the power consumption of the backlight module 10 and the display device.In some embodiments, as shown in FIG. 13 a, the second reflective portion 134 includes a plurality of protruding structures 135, and the protruding structures 135 have a curved surface on a side opposite to the substrate 110.For example, the curved surface projects outward in a direction away from the substrate 110.With such an arrangement, the uniformity of the light radiated from the reflective layer 130 can be improved.It is understood that the plurality of protruding structures 135 are unique morphological features of the reflective layer 130 formed by the 3D printing. In using a 3D printing apparatus to print the reflective material to form the second reflective portion 134, multiple print stripes are printed and two adjacent print stripes partially overlap to form a print pattern. A part of each print stripe that does not overlap with the adjacent print stripe forms the protruding structure 135 (the protruding structure 135 does not include a third protruding structure 135 cdownside).Note that the extending direction and the arrangement of the protruding structures 135 are determined mainly by the printing path of the 3D printing method.For example, as shown in FIG. 13 a, in a case where the printing direction of the printing path of the 3D printing method in the above manufacturing method is the first direction X, the plurality of protruding patterns 135 are each in the first direction X and are arranged in multiple rows in the second direction Y.For example, when the printing direction of the printing path of the 3D printing method is the second direction Y, the plurality of protruding patterns 135 each extend in the second direction Y and are arranged in a plurality of columns in the first direction X.In some examples, as shown in FIG. 13 b, the protruding structures 135 include a plurality of first protruding structures 135 aand a plurality of second protruding structures 135 b.For example, the plurality of first protruding structures 135 aand the plurality of second protruding structures 135 bmay extend and be arranged in different ways.For example, as illustrated in FIG. 13 b, the extending direction of the plurality of first protruding structures 135 aand the extending direction of the plurality of second protruding structures 135 bmay be the same. The plurality of first protruding structures 135 aextend in the first direction X, respectively, and are arranged in a plurality of rows in the second direction Y; the plurality of second protruding structures 135 bextend in the first direction X, respectively, and are arranged in a plurality of rows in the second direction Y.As another example, the extending direction of the plurality of first protruding structures 135 aand the extending direction of the plurality of second protruding structures 135 bmay be different. The plurality of first protruding structures 135 aextend in the first direction X, respectively, and are arranged in a plurality of rows in the second direction Y; the plurality of second protruding structures 135 bextend in the second direction Y, respectively, and are arranged in a plurality of rows in the first direction X.For example, the first protruding structure 135 amay be a protruding structure formed by a straight line printing method, and the second protruding structure 135 bmay be a protruding structure formed by a dotted printing method.For example, a dimension of the first protruding structure 135 ain the second direction Y is the same as a dimension of the second protruding structure 135 bin the arrangement direction of the plurality of second protruding structures 135 b. That is, a width of a portion of each print stripe formed by using the straight line printing method that does not overlap with the adjacent print stripe is the same as a width of a portion of each print stripe formed by using the fine line printing method that does not overlap with the adjacent print stripe.In some embodiments, as shown in FIG. 13 c, the plurality of protruding structures 135 further include third protruding structures 135 c, each located between two adjacent first protruding structures 135 a; the third protruding structure 135 cextends in the first direction X.By way of example, the plurality of third protruding structures 135 cis arranged in multiple rows in the second direction Y.For example, the extending direction of the third protruding structure 135 cis the same as the extending direction of the first protruding structure 135 aadjacent to the third protruding structure 135 c.In some examples, a dimension W 3 of the third protruding structure 135 cin the second direction Y is less than a dimension W 1 of the first protruding structure 135 ain the second direction YFor example, the third protruding structure 135 cis formed at the overlapping position of two adjacent print stripes. Therefore, the dimension W 3 of the third protruding structure 135 cin the second direction Y is much smaller than the dimension W 1 of the first protruding structure 135 ain the second direction YIn some embodiments, as shown in FIG. 14 d, in a case where the first reflecting portion 133 surrounds the light emitting device 120 and the orthographic projection of the light emitting device 120 onto the substrate 110 has the shape of a rectangle, the light emitting device 120 includes a first side wall, a second side wall, a third side wall, and a fourth side wall connected in sequence; the first side wall and the third side wall are opposed to each other and each extend in the first direction X; the first side wall and the third side wall are opposed to each other and each extend in the first direction X; the second side wall and the fourth side wall are opposed to each other and each extend in the second direction Y; the first reflecting portion 133 includes a first reflecting subsection 133 alocated on a side of the first side wall, a second reflecting subsection 133 blocated on a side of the second side wall, and a third reflecting subsection 133 clocated on a side of the third side wall, and a fourth reflecting subsection 133 elocated on a side of the fourth side wall.For example, the first reflecting portion 133 has a shape of a rectangle in plan view. The center of the rectangle may or may not match the center of the orthographic projection of the light emitting device 120 on the substrate 110.For example, the first sidewall may be substantially parallel to the first reflective portion area 133 a; the second sidewall may be substantially parallel to the second reflective portion area 133 b; the third sidewall may be substantially parallel to the third reflective portion area 133 c; the fourth sidewall may be substantially parallel to the fourth reflective portion area 133 e.In some examples, a plurality of first reflective sub-portions 133 alocated on a side of the first side walls of the light emitting devices 120 in a row are joined to form a one-piece structure. The plurality of first reflecting sub-portions 133 aof the one-piece structure are formed by a fifth reflecting pattern RP 5. With such an arrangement above, the plurality of first reflective sub-portions 133 alocated on one side of the first side walls of the light emitting devices 120 in a row can be formed in a single manufacturing process, which is advantageous for simplifying the manufacturing process of the light emitting substrate 100.In some examples, a plurality of second reflective sub-portions 133 blocated on a side of the second side walls of the light emitting devices 120 in a pillar are joined to form a one-piece structure. The plurality of first reflecting sub-portions 133 aof the one-piece structure are formed by a sixth reflecting pattern RP 6. With such an arrangement above, the multiple second reflective sub-portions 133 blocated on one side of the second side walls of the light emitting devices 120 in a pillar can be formed in a single manufacturing process, which is advantageous for simplifying the manufacturing process of the light emitting substrate 100.In some examples, a plurality of third reflective sub-portions 133 clocated on a side of the third side walls of the light emitting devices 120 in a row are joined to form a one-piece structure. The plurality of first reflecting sub-portions 133 aof the one-piece structure are formed by a fifth reflecting pattern RP 5. With the above arrangement, the multiple third reflective sub-portions 133 clocated on one side of the third side walls of the light emitting devices 120 in a row can be formed in a single manufacturing process, which is advantageous for simplifying the manufacturing process of the light emitting substrate 100.In some examples, a plurality of fourth reflective sub-portions 133 elocated on a side of the fourth side walls of the light emitting devices 120 in a pillar are joined to form a one-piece structure. The plurality of first reflecting sub-portions 133 aof the one-piece structure are formed by a sixth reflecting pattern RP 6. With such an arrangement above, the plurality of fourth reflective sub-portions 133 elocated on one side of the fourth side walls of the light emitting devices 120 in a pillar can be formed in a single manufacturing process, which is advantageous for simplifying the manufacturing process of the light emitting substrate 100.In some embodiments, as shown in FIG. 18 e, in a case where the first reflecting portion 133 surrounds the light emitting device 120, the reflective layer 130 further includes third reflecting portions 137 each disposed between a first reflecting portion 133 and a second reflecting portion 134. The second reflecting portion 134 is connected to the first reflecting portion 133 through the third reflecting portion 137. The third reflecting portion 137 surrounds the first reflecting portion 133, and a thickness of the third reflecting portion 137 is less than a thickness of the first reflecting portion 133.For example, the thickness of the first reflective portion 133 may be 50 μm, the thickness of the third reflective portion 137 may be 45 μm, and the thickness of the second reflective portion 134 may be 55 μm.The thickness of the first reflecting portion 133 refers to the maximum thickness of the first reflecting portion 133.It should be understood that the thickness ratio between the first reflecting portion 133 and the morphological characteristic of the "coffee ring" in the reflecting layer 130 around the light emitting device 120 results, and the morphological characteristic of the "coffee ring" in the reflecting layer 130 is the unique morphology of the reflecting layer formed by the manufacturing method in the embodiments of the present disclosure.For example, a "coffee ring" visible to the human eye (as shown in FIG. 18 g) is formed at the edge (the region enclosed by the dotted circle in FIG. 18 f) of the first reflecting portion 133. That is, in the first reflective layer 130, the thickness of a part (i.e., the third reflective portion 137) in a certain range around the first reflective portion 133 is less than the thickness of the first reflective portion 133, and the difference between the thicknesses is about 10 μm.It is understood that the light emitting substrate 100 as shown in FIGS. 19 aand 19 bfurther includes a plurality of driver chips 170.In some examples, a driver chip 170 is electrically connected to at least one light emitting device 120, and the driver chip 170 is configured to drive the at least one light emitting device 120 to emit light.For example, a driver chip 170 is electrically connected to a light emitting device 120 to drive the light emitting device 120 to emit light.For example, a driver chip 170 is electrically connected to four light emitting devices 120 to drive the four light emitting devices 120 to emit light.For example, a driver chip 170 is electrically connected to nine light emitting devices 120 to drive the nine light emitting devices 120 to emit light.The description will be made with reference to an example in which a driver chip 170 drives four light emitting devices 120.There are two relative positional relationships between the driver chips 170 and the reflective layer 130, i.e., the driver chip(s) 170 are located in the respective openings 131, and the driver chip(s) 170 are covered by the reflective layer 130. The light emitting substrates 100 corresponding to the above two positional relationships are manufactured by various manufacturing methods, which will be separately described below.In some embodiments, as shown in FIG. 19 b, the plurality of openings 131 of the reflective layer 130 also include a plurality of second openings 131 b.In some examples, the plurality of driver chips 170 are in one-to-one correspondence with the plurality of second openings 131 b, and one driver chip 170 is in a second opening 131 b.The size of the first opening 131 arefers to the size of the light emitting device 120, and the size of the second opening 131 brefers to the size of the driver chip 170, for example. Therefore, the size of the first opening 131 aand the size of the second opening 131 bmay be the same or different. The shape of the first opening 131 ain plan view may be the same as or different from the shape of the second opening 131 bin plan view.The first reflective portion 133 is located on at least one side of the driver chip 170, for example.In some examples, the first reflective portion 133 is variously located on at least one side of the driver chip 170. For example, the first reflective portion 133 may be disposed on a side of the driver chip 170. Another example is that the first reflecting portion 133 is located on two adjacent sides or two opposite sides of the driver chip 170. Another example is that the first reflecting portion 133 surrounds the corresponding driver chip 170.In the above embodiment, as shown in FIG. 19 c, at least one sidewall of the driver chip 170 is in contact with the corresponding first reflective portion 133, and / or at least one sidewall of the driver chip 170 and the corresponding first reflective portion 133 have a second gap GP 2 therebetween.In some examples, at least one sidewall of the driver chip 170 is in contact with the corresponding first reflective portion 133.For example, one or more sidewalls of the driver chip 170 are each in contact with the corresponding first reflective portion 133.In an example in which the driver chip 170 has the shape of a rectangle in plan view, one side wall of the driver chip 170 is in contact with the first reflecting portion 133 (each of the other three side walls and the first reflecting portion 133 may have a first gap therebetween), or four side walls of the driver chip 170 are each in contact with the first reflecting portion 133.In the present disclosure, the light emitting substrate 100 is manufactured using the above manufacturing method, wherein the part of the substrate 110 located around each driver chip 170 is cleaned, thereby mitigating the repulsion phenomenon occurring between the part of the substrate located around the driver chip 170 and the reflective material to be printed in the subsequent process, so that the sidewall of the driver chip 170 is in contact with the corresponding first reflective portion 133 in the light emitting substrate 100. As a result, it is possible to increase the area ratio of the reflective layer 130 in the light emitting substrate 100, which can improve the light efficiency of the light emitting substrate 100 and alleviate the problem of light loss, light and dark optical stripes, and mura phenomenon of the light emitting substrate 100, thereby improving the luminance of the backlight module 10 and the display device 1 and reducing the power consumption of the backlight module 10 and the display device 1.In some other examples, there is a second gap GP 2 between at least one sidewall of the driver chip 170 and the corresponding first reflective portion 133.For example, there is a second gap GP 2 between one sidewall or each of a plurality of sidewalls of the driver chip 170 and the corresponding first reflective portion 133.In an example where the driver chip 170 has the shape of a rectangle in plan view, there may be a second gap GP 2 between a side wall of the driver chip 170 and the first reflecting portion 133; alternatively, there may be a second gap GP 2 between each of the four side walls of the driver chip 170 and the first reflecting portion 133, and the distance between each of the four side walls and the first reflecting portion 133 is the same.The width of the second gap GP 2 is, for example, less than or equal to 150 μm.For example, the width of the second gap GP 2 refers to a dimension of the second gap GP 2 in a direction perpendicular to the sidewall of the corresponding light emitting device 120.The width of the second gap GP 2 may be, for example, 150 μm, 100 μm, 50 μm, 25 μm, or 10 μm.It is understood that the width of the second gap GP 2 and the width of the first gap GP 1 may be the same or different.In the present disclosure, the light emitting substrate 100 is manufactured using the above manufacturing method, wherein the part of the substrate 110 located around each driver chip 170 is cleaned, which reduces the repulsion phenomenon occurring between the part of the substrate located around the driver chip 170 and the reflective material to be printed in the subsequent process, so that the width of the first gap between the sidewall of the driver chip 170 and the corresponding first reflective portion 133 in the light emitting substrate 100 is small. As a result, it is possible to increase the area ratio of the reflective layer 130 in the light emitting substrate 100, which can improve the light efficiency of the light emitting substrate 100 and alleviate the problem of the light and dark optical stripes and the Mura phenomenon of the light emitting substrate 100, thereby improving the luminance of the backlight module 10 and the display device 1 and reducing the power consumption of the backlight module 10 and the display device 1.In some other examples, at least one sidewall of the driver chip 170 is in contact with the corresponding first reflective portion 133, and there is a second gap GP 2 between another at least one sidewall of the driver chip 170 and the corresponding first reflective portion 133.For example, a sidewall of the driver chip 170 is in contact with the corresponding first reflective portion 133, and there is a second gap GP 2 between each of the remaining sidewalls of the driver chip 170 and the corresponding first reflective portion 133.As another example, a second gap GP 2 is provided between a side wall of the driver chip 170 and the corresponding first reflecting portion 133, and the remaining side walls of the driver chip 170 are each in contact with the corresponding first reflecting portion 133.As another example, a second gap GP 2 is provided between each of two sidewalls of the driver chip 170 and the corresponding first reflecting portion 133, and the remaining sidewalls of the driver chip 170 are each in contact with the corresponding first reflecting portion 133.In the present disclosure, the light emitting substrate 100 is manufactured using the above manufacturing method, wherein the part of the substrate 110 located around each driver chip 170 is cleaned, thereby reducing the repulsion phenomenon occurring between the part of the substrate located around the driver chip 170 and the reflective material to be printed in the subsequent process, so that the sidewall(s) of the driver chip 170 in the light emitting substrate 100 are each in contact with the corresponding first reflective portion 133 or a second gap having a small width is present between each of the sidewall(s) of the driver chip 170 and the corresponding first reflective portion 133 in the light emitting substrate 100. As a result, it is possible to increase the area ratio of the reflective layer 130 in the light emitting substrate 100, which can improve the light efficiency of the light emitting substrate 100 and alleviate the problem of the light and dark optical stripes and the Mura phenomenon of the light emitting substrate 100, thereby improving the luminance of the backlight module 10 and the display device 1 and reducing the power consumption of the backlight module 10 and the display device 1.As shown in FIG. 19 d, in the case that the driver chip(s) 170 is / are covered by the reflective layer 130, which may include the case in which an orthographic projection of at least one driver chip 170 on the substrate 110 is arranged within the orthographic projection of the reflective layer 130 on the substrate 110. That is, at least one driver chip 170 is covered by the reflective layer 130, and the remaining driver chips 170 may be disposed in the respective second openings 131 bof the reflective layer 130.For example, a boundary of an orthographic projection of a driver chip 170 on the substrate 110 is within the boundary of the orthographic projection of the reflective layer 130 on the substrate 110.As another example, the boundaries of the orthographic projections of the plurality of driver chips 170 on the substrate 110 are all within the boundary of the orthographic projection of the reflective layer 130 on the substrate 110.With the above arrangement, the area ratio of the reflective layer 130 in the light emitting substrate 100 can be increased, and the area of the reflective region of the light emitted from the light emitting device 120 can be increased, thereby improving the light efficiency of the light emitting substrate 100 and alleviating the problem of light loss of the light emitting substrate 100.It should be understood that, regarding the structural features of the reflective layer 130 and the light emitting substrate 100, in the case where the driver chip 170 is disposed in the second opening 131 band the first reflective portion 133 is disposed on at least one side of the driver chip 170, the structural features are referred to that the first reflective portion 133 is disposed on at least one side of the light emitting device 120, which are not repeated thereby.In some embodiments, as shown in FIG. 3, the light emitting substrate 100 further includes connection structures 180. The contact structure 180 is electrically connected to the driver chip 170, for example.For example, the connection structures 180 are located in a region of the light-emitting substrate 100 in the vicinity of the edge of the light-emitting substrate 100. The interconnect structure 180 is used to transmit different types of working signals to the driver chip 170 such that the driver chip 170 generates a driver signal corresponding to the different types of working signals and transmits the driver signal to the corresponding light emitting device(s) 120.For example, the region in which the connection structure 180 is located is not covered by the reflective layer 130.The bonding structure 180 may be connected to a printed circuit board or a flexible printed circuit (FPC) by chip-on-film (COF), for example.The above descriptions merely represent specific embodiments of the present disclosure, but the scope of the present disclosure is not limited thereto. Changes or substitutions that any person skilled in the art can present within the technical scope of the present disclosure are included in the scope of the present disclosure. Therefore, the scope of the present disclosure is subject to the scope of the claims.

Claims

A light emitting substrate, comprising: a substrate, a plurality of light emitting devices, and a reflective layer disposed on one side of the substrate; wherein the reflective layer has a plurality of openings, the plurality of openings comprise a plurality of first openings, and a light emitting device is disposed in a first opening; and the reflective layer has a plurality of first reflective portions and a second reflective portion connecting any two adjacent first reflective portions; a first reflective portion is disposed on at least one side of the light emitting device; a thickness of the first reflective portion is less than a thickness of the second reflective portion.The light emitting substrate of claim 1, wherein the first reflecting portion is disposed on two opposite sides of the light emitting device, or the first reflecting portion surrounds the corresponding light emitting device.The light emitting substrate according to claim 2, wherein in a case where the first reflecting portion is disposed on the two opposite sides of the light emitting device and an orthographic projection of the light emitting device on the substrate has a shape of a rectangle, the first reflecting portion is disposed on sides of two long sides of the rectangle.The light emitting substrate according to any one of claims 1 to 3, wherein at least one side wall of the light emitting device and the corresponding first reflecting portion have a first gap therebetween.The light emitting substrate of claim 4, wherein a width of the first gap is less than or equal to 150 μm.The light emitting substrate according to any one of claims 1 to 3, wherein at least one side wall of the light emitting device is in contact with the corresponding first reflecting portion.The light emitting substrate according to any one of claims 1 to 6, wherein the thickness of the first reflecting portion is positively correlated with a distance between the first reflecting portion and a center of the light emitting device in a direction passing through the center of the light emitting device and perpendicular to a side wall of the light emitting device; and the first reflecting portion has a lower surface and an upper surface that are opposed to each other, the lower surface is in contact with the substrate, and an angle between the upper surface and a plane in which the substrate is located is an acute angle.The light emitting substrate of claim 7, wherein a minimum thickness of the first reflective portion is less than 60 μm.The light emitting substrate according to any one of claims 1 to 5, wherein the thickness of the first reflecting portion is positively correlated with a distance between the first reflecting portion and a center of the light emitting device in a direction passing through the center of the light emitting device and perpendicular to a side wall of the light emitting device; and the first reflecting portion has a lower surface and an upper surface that are opposed to each other; at least a part of the lower surface is not in contact with the substrate, and an angle between the at least a part of the lower surface and a plane in which the substrate is located is an acute angle; the upper surface is parallel or substantially parallel to the substrate.The light emitting substrate according to claim 9, wherein in the direction passing through the center of the light emitting device and perpendicular to the side wall of the light emitting device, a dimension of a part of the first reflecting portion that is not in contact with the substrate is less than 20 μm.The light emitting substrate according to claim 9 or 10, wherein a surface of the second reflecting portion facing away from the substrate is a planar or nearly planar surface.The light emitting substrate according to any one of claims 1 to 8, wherein the second reflecting portion has a plurality of protruding structures, and a protruding structure has a curved surface on a side opposite to the substrate.The light emitting substrate of claim 12, wherein the plurality of protruding structures include a plurality of first protruding structures and a plurality of second protruding structures; wherein the plurality of first protruding structures each extend in a first direction and are arranged in lines in a second direction; the plurality of second protruding structures each extend in the first direction and are arranged in lines in the second direction, or the plurality of second protruding structures each extend in the second direction and are arranged in lines in the first direction; the first direction intersects the second direction; and a dimension of a first protruding structure in the second direction is the same as a dimension of a second protruding structure in an arrangement direction of the plurality of second protruding structures.The light emitting substrate of claim 13, wherein the plurality of protruding structures further comprise a third protruding structure located between two adjacent first protruding structures, the third protruding structure extending in the first direction; wherein a dimension of the third protruding structure in the second direction is smaller than a dimension of the first protruding structure in the second direction.The light emitting substrate according to any one of claims 1 to 8, wherein in a case where the first reflecting portion surrounds the light emitting device, the reflecting layer further comprises a third reflecting portion disposed between the first reflecting portion and the second reflecting portion; the second reflecting portion is connected to the first reflecting portion through the third reflecting portion, the third reflecting portion surrounds the first reflecting portion, and a thickness of the third reflecting portion is less than the thickness of the first reflecting portion.The light emitting substrate according to any one of claims 1 to 8, wherein the plurality of light emitting devices are arranged in columns in a first direction and in rows in a second direction, the first direction intersects the second direction; in a case where the first reflecting portion surrounds the light emitting device and an orthographic projection of the light emitting device on the substrate has a shape of a rectangle, the light emitting device comprises a first side wall, a second side wall, a third side wall, and a fourth side wall that are sequentially connected; the first side wall is opposed to the third side wall and extends in the first direction; the second side wall is opposed to the fourth side wall and extends in the second direction; the first reflecting portion comprises a first reflecting subsection located on a side of the first side wall, a second reflecting subsection located on a side of the second side wall, a third reflecting subsection located on a side of the third side wall, and a fourth reflecting subsection located on a side of the fourth side wall; wherein a plurality of first reflecting subsections located on a side of first side walls of light emitting devices in a row are joined to form a one-piece structure; a plurality of second reflecting subsections located on a side of second side walls of the light emitting devices in the row are joined to form a one-piece structure; a plurality of third reflective sub-portions located on a side of third side walls of the light emitting devices in the row are joined to form an integral structure; and a plurality of fourth reflective sub-portions located on a side of fourth side walls of the light emitting devices in the row are joined to form an integral structure.The light emitting substrate of any one of claims 1 to 16, further comprising: a plurality of driver chips disposed on one side of the substrate and located on the same side of the substrate as the plurality of light emitting devices; wherein a driver chip is electrically connected to at least one light emitting device, and the driver chip is configured to drive the at least one light emitting device to emit light; wherein the plurality of openings further comprise a plurality of second openings; the driver chip is located in a second opening, and a first reflective portion is located on at least one side of the driver chip.The light emitting substrate of claim 17, wherein at least one sidewall of the driver chip is in contact with the corresponding first reflective portion, and / or the at least one sidewall of the driver chip and the corresponding first reflective portion have a second gap therebetween.The light emitting substrate of any of claims 1 to 16, further comprising: a plurality of driver chips disposed on one side of the substrate and located on the same side of the substrate as the plurality of light emitting devices; wherein a driver chip is electrically connected to at least one light emitting device, and the driver chip is configured to drive the at least one light emitting device to emit light; an orthographic projection of at least one driver chip on the substrate is within an orthographic projection of the reflective layer on the substrate.A manufacturing method of a light emitting substrate, comprising: providing a substrate; mounting a plurality of light emitting devices on the substrate using a flux; cleaning a part of the substrate located around each light emitting device; and forming a reflective layer on the substrate using a three-dimensional (3D) printing method; wherein the reflective layer has a plurality of openings, the plurality of openings include a plurality of first openings, a light emitting device is disposed in a first opening; the reflective layer includes a plurality of first reflective portions and a second reflective portion connecting any two adjacent first reflective portions; a first reflective portion is disposed on at least one side of the light emitting device; a thickness of the first reflective portion is less than a thickness of the second reflective portion.The manufacturing method according to claim 20, wherein the plurality of light emitting devices are arranged in columns in a first direction and in rows in a second direction; the substrate has a plurality of first print areas and a plurality of second print areas; at least one second print area is arranged between two adjacent first print areas, and one row of light emitting devices is arranged in a first print area; the first print area comprises a plurality of first print subareas arranged at intervals in the first direction, and a first print subareas is arranged on at least one side of a light emitting device; forming the reflective layer on the substrate using the 3D printing method comprises: forming a first reflective pattern in each first print sub-region using an all-round printing process, the first reflective pattern forming a first reflective portion of the reflective layer; forming a second reflective pattern in a region in each first print region except the first print sub-regions using a slowline printing process; and forming a third reflective pattern in a second print region using a straight line printing process, a first reflective pattern, a second reflective pattern, and a third reflective pattern defining a first opening around each light emitting device; wherein at least one side wall of the light emitting device and the corresponding first reflecting portion have a first gap therebetween, and / or at least one side wall of the light emitting device is in contact with the corresponding first reflecting portion.The manufacturing method according to claim 21, wherein the forming the first reflective pattern in the first print region around the light emitting device comprises: forming a plurality of first reflective sub-patterns in each first print sub-region sequentially using the all-round printing process, wherein the plurality of first reflective sub-patterns are sequentially arranged in a direction away from the light emitting device, and two adjacent first reflective sub-patterns partially overlap; the plurality of first reflective sub-patterns form the first reflective pattern.The manufacturing method according to claim 21 or 22, wherein the substrate further has a plurality of third printing regions, and the third printing regions are respectively disposed between a first printing region and a second printing region; after forming the first reflective pattern in each first printing region using the all-round printing process, the manufacturing method further comprises: forming a fourth reflective pattern in a third printing region using a straight line printing process, wherein second reflective patterns, third reflective patterns, and fourth reflective patterns form the second reflective portion of the reflective layer; wherein the second reflective pattern, the third reflective pattern, and the fourth reflective pattern have the same thickness; and a thickness of the first reflective pattern is less than a thickness of the second reflective pattern.The manufacturing method according to claim 20, wherein the plurality of light emitting devices are arranged in columns in a first direction and in rows in a second direction; wherein the substrate has a plurality of fourth printing regions each extending in the first direction, a plurality of fifth printing regions each extending in the second direction, and a plurality of sixth printing regions; two opposite sides of each row of light emitting devices are each provided with a fourth printing region; two opposite sides of each column of light emitting devices are each provided with a fifth printing region; a region between any two adjacent light emitting devices except for fourth printing regions and fifth printing regions is provided with a sixth printing region; forming the reflective layer on the substrate using the 3D printing method comprises: printing a reflective material in each fourth print region and printing a reflective material in each fifth print region using a printing process; performing a pre-cure process on the reflective material in each fourth print region to form a fifth reflective pattern and performing a pre-cure process on the reflective material in each fifth print region to form a sixth reflective pattern; wherein fifth reflective patterns and sixth reflective patterns around each light emitting device define a first opening and form a first reflective portion; and forming a seventh reflective sub-pattern in each sixth print region using a quantifying printing process, and performing a leveling process and a pre-cure process on the seventh reflective sub-pattern to form a seventh reflective pattern.The manufacturing method according to claim 20, wherein the plurality of light emitting devices are arranged in columns in a first direction and in rows in a second direction; the substrate has a plurality of seventh print areas and an eighth print area; a seventh print area surrounds a light emitting device, and the eighth print area is located between any two adjacent seventh print areas; the forming of the reflective layer on the substrate using the 3D printing method comprises: printing a reflective material in each seventh print area using an all-round printing method; and performing a pre-cure process on the reflective material in each seventh print area to form an eighth reflective pattern, wherein the eighth reflective pattern forms a first reflective portion and a portion of a third reflective portion of the reflective layer; and quantitatively spraying a reflective material in the eighth print area using a quantitative spraying process, and performing a leveling process and a pre-hardening process on the reflective material in the eighth print area to form a ninth reflective pattern, the ninth reflective pattern forming the second reflective portion and another portion of the third reflective portion of the reflective layer; wherein the second reflective portion is connected to the first reflective portion through the third reflective portion; the third reflective portion surrounds the first reflective portion, and a thickness of the third reflective portion is less than the thickness of the first reflective portion.The manufacturing method according to claim 20, wherein before forming the reflective layer on the substrate using the 3D printing process, the manufacturing method comprises: forming a sacrificial layer on a side of the plurality of light emitting devices opposite from the substrate, the sacrificial layer comprising a plurality of sacrificial patterns, and a sacrificial pattern covering a side wall and a top wall of a light emitting device; wherein forming the reflective layer on the substrate using the 3D printing process comprises: forming a reflective film on the substrate using the 3D printing process, wherein the reflective film is in contact with side walls of the sacrificial patterns, and an orthographic projection of the reflective film on the substrate does not overlap with orthographic projections of the light emitting devices on the substrate; performing a leveling process and a pre-hardening process on the reflective film to form the reflective layer; and removing the sacrificial layer.The manufacturing method according to claim 20, wherein before forming the reflective layer on the substrate using the 3D printing process, the manufacturing method further comprises: forming a protective layer on a side of the light emitting devices opposite from the substrate using a dispensing process, wherein the protective layer comprises a plurality of protective patterns, and a protective pattern covers a side wall and a top wall of a light emitting device; wherein forming the reflective layer on the substrate using the 3D printing process comprises: forming a reflective film on the substrate using the 3D printing process, wherein the reflective film is in contact with side walls of the protective patterns, and an orthographic projection of the reflective film on the substrate does not overlap with orthographic projections of the light emitting devices on the substrate; and performing a leveling process and a pre-hardening process on the reflective film to form the reflective layer.A backlight module comprising: the light emitting substrate according to any one of claims 1 to 19, and an optical film disposed on a light exit side of the light substrate.A display device, comprising: the backlight module of claim 28; an array substrate located on a light output side of the backlight module; and a color filter substrate located on a side of the array substrate opposite to the backlight module.

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