STABLE, THERMALLY CONDUCTIVE REACTIVE COMPOUNDS AND METHODS

Abstract

Filled compounds, including thermally conductive materials and compositions. The filled compounds include isocyanate-reactive resins, conductive fillers, and isocyanate resins. The filled compounds can have two components: one containing the isocyanate-reactive resin and the conductive filler, and a second containing the isocyanate resin.

Description

PRIORITY CLAIM

[0001] The present application claims priority over the preliminary US patent application number 63 / 470,363, filed on June 1, 2023, the disclosure of which is hereby incorporated in its entirety by reference. TECHNICAL AREA

[0002] The subject matter of the present disclosure relates to storage-stable, thermally conductive, reactive compounds and processes for their production. BACKGROUND

[0003] Thermally conductive compounds are frequently used in applications such as electronic devices and battery systems to regulate temperature for performance and reliability. Two-component (2K) thermally conductive urethanes represent a class of thermally conductive compounds. Urethane chemicals and their derivatives—that is, the class of materials that are the product of a reaction between an isocyanate-reactive compound and an isocyanate—are known for their reaction products, which exhibit a unique combination of properties such as adhesion, strength, stiffness, and ductility. The widespread commercial availability of a variety of isocyanate-reactive compounds and isocyanates makes them attractive to both urethane compound manufacturers and end users due to the affordability of the raw materials and the versatility of the formulations.

[0004] Despite their attractiveness, thermally conductive urethane compounds have numerous disadvantages due to the high reactivity of isocyanate with water present in / on the thermally conductive fillers. Manufacturers of these compounds are therefore forced to take extensive measures to remove the water before and / or during the incorporation of the filler into the isocyanate-containing component of two-component formulations. These measures can include the purchase of expensive, large drying ovens and associated handling equipment, the incorporation of molecular sieves for water absorption, and intensive mixing of the formulation over extended periods and at higher temperatures to allow the moisture remaining on the filler to react with that of the isocyanate.Even with these measures, it may be impossible to remove tightly bound adsorbed water, which eventually reacts with the isocyanate over the material's service life. The reaction between the water and the isocyanate leads to an unacceptable increase in viscosity, the formation of undesirable, higher molecular weight urea compounds, and impairs the final performance of the two-component system formed from the reaction of the isocyanate-containing component with the isocyanate-reactive component. Furthermore, additional measures must be taken to protect the isocyanate-containing component from the environment and prevent moisture ingress over time, especially if the material contains hygroscopic, thermally conductive fillers.

[0005] In addition to drying limitations, manufacturers of thermally conductive compounds are also restricted by the type and size of fillers used in the isocyanate-containing compound, as well as the type of isocyanate itself. For example, aluminum trihydrate (ATH) readily adsorbs large amounts of water due to its high polarity. The degree of water adsorption per gram is a function of particle size, particle shape, and total particle surface area. Smaller diameter particles and those with non-spherical shapes have a larger surface area and therefore adsorb more water than larger, more spherical particles. For these reasons, manufacturers must avoid such hygroscopic fillers to prevent the shelf-life issues mentioned above.

[0006] In the case of the isocyanate component of thermally conductive two-component systems, manufacturers are limited to using less reactive classes of isocyanates, such as aliphatic isocyanates instead of aromatic isocyanates. While this allows for the production of volumetrically balanced 1:1 two-component systems, such aliphatic isocyanates can significantly increase costs and often exhibit less desirable performance, for example, in terms of strength, modulus of elasticity, and glass transition temperature. Furthermore, as previously described, aliphatic isocyanates continue to be subject to limitations regarding their shelf life in the presence of hygroscopic fillers.

[0007] It is therefore desirable, and there remains a significant need, to develop highly storage-stable, thermally conductive 2K isocyanate-based compounds that enable the use of hygroscopic fillers, the use of more reactive isocyanates, and / or the reduction and / or elimination of filler drying processes. Such compounds are provided herein. BRIEF SUMMARY OF THE INVENTION

[0008] This summary describes several embodiments of the present subject matter and, in many cases, lists variations and permutations of these embodiments. This summary merely provides an example of the numerous and diverse embodiments. The listing of one or more representative features of a particular embodiment also serves only as an example. Such an embodiment may typically exist with or without the mentioned feature(s); likewise, these features may be applied to other embodiments of the present subject matter, whether or not they are described in this summary. To avoid excessive repetition, this summary does not list or suggest all possible combinations of such features.

[0009] Filled compounds (or filled formulations or filled compositions) are provided here, comprising an isocyanate-reactive resin, a conductive filler, and an isocyanate resin. In some embodiments, the isocyanate-reactive resin and the conductive filler are contained in a first component, and the isocyanate resin is contained in a second component. In some embodiments, the first and second components are configured to react upon mixing to form a thermally conductive compound, with the first and second components being mixed in a ratio of approximately 1:1 to approximately 50:1. In some embodiments, the first and second components are...The first component and the second component are mixed in a ratio of approximately 1:1, approximately 2:1, approximately 3:1, approximately 4:1, approximately 5:1, approximately 6:1, approximately 7:1, approximately 8:1, approximately 9:1, approximately 10:1, approximately 11:1, approximately 12:1, approximately 15:1, approximately 20:1, approximately 25:1, approximately 30:1, approximately 35:1, approximately 40:1, approximately 45:1 or approximately 50:1, preferably approximately 1:1.

[0010] In some embodiments, the isocyanate-reactive resin comprises a resin type selected from the group consisting of a polyether, a polyester, and an aliphatic hydrocarbon. In some embodiments, the isocyanate-reactive resin comprises at least two active hydrogen atoms selected from the group consisting of a hydroxyl group, a primary amine, a secondary amine, a thiol, a urethane, a urea, a carboxylic acid, an amide, and water. In some embodiments, the isocyanate-reactive resin comprises a polyethylene glycol, polypropylene glycol, polytetramethylene ether glycol, a castor oil-based polyester polyol, and / or an aliphatic polyol based on polybutadiene. In some embodiments, the isocyanate resin comprises an aromatic isocyanate, an aliphatic isocyanate, or an isocyanate prepolymer.In some embodiments, the aromatic isocyanate resin comprises a monomer or polyisocyanate based on methylenediphenyl diisocyanate (MDI) or toluene diisocyanate (TDI). In some embodiments, the aliphatic isocyanate resin comprises a monomeric isocyanate or polyisocyanate based on hexamethylene diisocyanate (HDI), hydrogenated MDI, or isophorone diisocyanate. In some embodiments, the isocyanate prepolymer comprises a reaction product of an isocyanate-reactive resin and an aromatic isocyanate resin. In some embodiments, the isocyanate prepolymer comprises a reaction product of a polyether polyol and an MDI-based resin. In some embodiments, the isocyanate prepolymer comprises a reaction product of an isocyanate-reactive resin and an aliphatic isocyanate resin. In some embodiments, the isocyanate prepolymer comprises a reaction product of a polyether polyol and an HDI-based resin.

[0011] The conductive filler may comprise aluminum, aluminum trihydrate, aluminum oxide, silicon dioxide, calcium carbonate, magnesium oxide, and / or magnesium hydroxide, optionally having a thermal conductivity greater than or greater than approximately 5 W / m·K. In some embodiments, the first component comprises an undried thermally conductive filler and optionally a moisture scavenger. In some embodiments, the first component comprises a dried filler and no molecular sieves.

[0012] In some embodiments, the thermal conductivity is in the range of approximately 0.5 W / m·K to approximately 10 W / m·K or more, optionally approximately 1 W / m·K to approximately 4 W / m·K. In some embodiments, the filled compound is used as a thermal interface material. In some embodiments, the filled compound is used as an encapsulation or potting compound. In some embodiments, the thermal interface material is storage-stable. In some embodiments, the filled compound comprises a thermally conductive filler, a reinforcing filler, a cost-reducing filler, a surface-modifying filler, an electrically conductive filler, a magnetic filler, a density-reducing filler, and / or combinations thereof.

[0013] This document discloses methods for producing a storage-stable thermally conductive interface material, wherein the methods involve mixing the first component of the disclosed filled compounds with the second component of the disclosed filled compounds. In some aspects, the method includes ensuring that no thermally conductive filler is present in the second component.

[0014] In some embodiments, such methods include selecting a desired thermal conductivity; selecting isocyanate-reactive and isocyanate-containing compounds to be used in a first component and a second component, respectively; selecting a desired thermally conductive filler package; and determining the filler content by volume, φ. f_vermischt , in the mixed formulation to achieve the desired thermal conductivity; determining the maximum filler content by volume, φ f_max_1, which can be incorporated into the first component while the material remains fluid; calculating the minimum mixing ratio of the first component to the second component, using formula R min = φ f_gemischt / (φ f_max_1 - φ f_gemischt ); Selecting a material dispensing method, e.g., cartridge dosing, meter-mix-dispensing; Selecting a mixing ratio R of the first component to the second component (where R ≥ R min); and optimizing and / or adjusting the compositions of the first and second components to meet the overall performance requirements, optionally repeating the steps mentioned above. In some embodiments, the methods further include a step of adjusting the concentrations of the isocyanate-reactive and isocyanate-containing compounds in the first and second components, respectively, to achieve a desired NCO index, optionally following the step of selecting a discharge method.

[0015] These and other objectives are achieved wholly or partially by the subject matter of the present disclosure. Further objectives and advantages of the subject matter of the present disclosure will become clear to the person skilled in the art after reviewing the following description, drawings, and examples. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The subject matter of the present disclosure can be better understood with the aid of the following exemplary figures. The components in the figures are not necessarily to scale; rather, the focus is on illustrating the principles of the subject matter of the present disclosure (often schematically). In the figures, the same reference numerals denote corresponding parts in the different views. A further understanding of the subject matter of the present disclosure can be gained by referring to an embodiment depicted in the accompanying drawings.Although the embodiment(s) shown serve only as an example of the implementation of the subject matter of the present disclosure, the structure and function of the present disclosure, along with its further objectives and advantages, can be more easily understood with reference to the drawings and the following description. The drawings are not intended to limit the scope of the present disclosure, which is precisely described in the attached or subsequently amended claims, but merely to clarify the subject matter disclosed herein and to provide examples of the present disclosure.

[0017] For a better understanding of the present subject of disclosure, reference is now made to the following drawings, in which: Fig.1 is a graphical representation of the data from experiments illustrating the differences in viscosity as a function of storage time for aliphatic, isocyanate-based, thermally conductive reactive compounds, as explained in the examples. Fig. 2 is a graphical representation of the data from experiments illustrating the differences in viscosity as a function of storage time for aromatic, isocyanate-based, thermally conductive reactive compounds, as explained in the examples. Fig. 3 is a flowchart of a process for producing a storage-stable, thermally conductive reactive compound of the present subject matter of disclosure. DETAILED DESCRIPTION

[0018] The subject matter of this disclosure is described in more detail below, including some, but not all, embodiments. The subject matter of this disclosure can be implemented in many different forms and should not be considered limited to the embodiments set forth herein; rather, these embodiments are provided to ensure that this disclosure complies with applicable legal requirements. I. Definitions

[0019] The terminology used herein serves only to describe certain embodiments and is not intended to limit the subject matter of the present disclosure.

[0020] Although it is assumed that the following terms are well known to a person skilled in the art in this field, the following definitions are given to explain the subject matter of the present disclosure.

[0021] All technical and scientific terms used herein have, unless otherwise defined below, the same meanings as generally known to a person skilled in the art. References to techniques used herein refer to techniques generally known in the art, including variations of these techniques or substitutions by equivalent techniques known to a person skilled in the art. Although it is assumed that the following terms are well known to a person skilled in the art, the following definitions are given for the purpose of clarifying the subject matter of this disclosure.

[0022] In describing the subject matter of this disclosure, it should be noted that a number of techniques and steps are disclosed. Each of these has individual advantages and can also be used in conjunction with one or more, and in some cases even all, of the other disclosed techniques.

[0023] For the sake of clarity, this description therefore refrains from unnecessarily repeating every possible combination of the individual steps. Nevertheless, the description and the claims should be read with the understanding that such combinations are entirely within the scope of the invention and the claims.

[0024] In accordance with the usual conventions of patent law, the terms "a", "an", and "that" in this application, including the claims, refer to "one or more". For example, the term "a cell" encompasses a plurality of such cells, and so on.

[0025] Unless otherwise stated, all numbers expressing quantities of ingredients, reaction conditions, etc., in the description and claims are to be understood in all cases as modified by the term "approximately". Accordingly, the numerical parameters given in this description and the accompanying claims are, unless otherwise stated, approximate values ​​that may vary depending on the desired properties to be achieved with the subject matter disclosed herein.

[0026] As used herein, the term “approximately”, when referring to a value or quantity of a composition, dose, sequence identity (e.g., when comparing two or more nucleotide or amino acid sequences), mass, weight, temperature, time, volume, concentration, percentage, etc., shall in some embodiments include deviations of ±20%, in some embodiments of ±10%, in some embodiments of ±5%, in some embodiments of ±1%, in some embodiments of ±0.5%, and in some embodiments of ±0.1% from the specified quantity, since such deviations are reasonable for carrying out the disclosed processes or for using the disclosed compositions.

[0027] The term "indicating," which is synonymous with "including," "containing," or "characterized by," is inclusive or open-ended and does not exclude additional, unmentioned elements or process steps. "Indicating" is a technical term used in claim language and means that the mentioned elements are essential, but other elements can be added and still form a construct within the scope of the claim.

[0028] As used herein, the phrase "consisting of" excludes any elements, steps, or components not specified in the claim. If the phrase "consisting of" appears in a clause of the main body of a claim and does not immediately follow the preamble, it limits only the element mentioned in that clause; other elements are not excluded from the claim as a whole.

[0029] As used here, the expression “essentially consisting of” limits the scope of a claim to the specified materials or steps and to those which do not substantially affect the fundamental and novel characteristics of the claimed subject matter.

[0030] With regard to the terms “having”, “consisting of” and “essentially consisting of”, where / when any of these three terms are used herein, the subject matter disclosed and claimed herein may include the use of any of the other two terms.

[0031] As used herein, the term “and / or” in the context of a list of units refers to units that exist individually or in combination. For example, the expression “A, B, C and / or D” includes A, B, C and D individually, but also all combinations and subcombinations of A, B, C and D.

[0032] As used herein, the term "isocyanate" refers to a group of reactive, low-molecular-weight aromatic and aliphatic compounds containing the isocyanate group (-NCO). Organic compounds containing one isocyanate group are called isocyanates. Isocyanates containing more than one isocyanate group are known as polyisocyanates. Isocyanates and polyisocyanates can be used in the manufacture of polyurethanes.

[0033] Examples of polyisocyanates include ethylene diisocyanate, trimethylene diisocyanate, hexamethylene diisocyanate, propylene 1,2-diisocyanate, ethylidene diisocyanate, cyclopentylene 1,3-diisocyanate, the 1,2-, 1,3- and 1,4-cyclohexylene diisocyanates, the 1,3- and 1,4-phenylene diisocyanates, diphenylmethane diisocyanates, polymethylene diisocyanates, the 2,4- and 2,6-toluene diisocyanates, the 1,3- and 1,4-xylylene diisocyanates, bis(4-isocyanatoethyl) carbonate, 1,8-diisocyanato-p-methane, 1-methyl-2,4-diisocyanatocyclohexane, the chlorophenylene diisocyanates, naphthalene 1,5-diisocyanate, triphenylmethane 4,4'-diisocyanate, triisocyanate, and isopropylbenzene alpha-4-diisocyanate. 5,6-Bicyclo[2.2.1]hept-2-ene diisocyanate, 5,6-Diisocyanatobutylbicyclo[2.2.1]hept-2-ene.

[0034] Examples of alicyclic polyisocyanates are 1,3-cyclopentene diisocyanate, 1,4-cyclohexane diisocyanate, 1,3-cyclohexane diisocyanate, 1-isocyanato-3,3,5-trimethyl-5-isocyanatomethylcyclohexane (isophorone diisocyanate, IPDI), 4,4'-methylenebis(cyclohexyl isocyanate), methyl-2,4-cyclohexane diisocyanate, methyl-2,6-cyclohexane diisocyanate and 1,3- or 1,4-bis(isocyanatomethyl)cyclohexane) and polyisocyanates (e.g. 1,3,5-triisocyanatocyclohexane, 1,3,5-trimethylisocyanatocyclohexane, 2-(3-isocyanatopropyl)-2,5-di(isocyanatomethyl)-bicyclo(2,2,1)heptane). 2-(3-Isocyanatopropyl)-2,6-di(isocyanatomethyl)-bicyclo(2.2.1)heptane, 3-(3-isocyanatopropyl)-2,5-di(isocyanatomethyl)-bicyclo(2.2.1)heptane, 5-(2-Isocyanatoethyl)-2-isocyanatomethyl-3-(3-isocyanatopropyl)-bicyclo(2.2.1)heptane, 6-(2-Isocyanatoethyl)-2-isocyanatomethyl-3-(3-isocyanatopropyl)-bicyclo(2.2.1)heptane, 5-(2-Isocyanatoethyl)-2-isocyanatomethyl-2-(3-isocyanatopropyl)-bicyclo(2.2.1)-heptane and 6-(2-isocyanatoethyl)-2-isocyanatomethyl-2-(3-isocyanatopropyl)-bicyclo(2.2.1)heptane).

[0035] Polyisocyanates are also addressed in U.S. Patent No. 4,553,377, with reference to U.S. Patent Nos. 6,221,995, 6,201,060, 6,153,690, 6,143,132, 6,139,675, 6,126,777, 6,087,439, 6,080,812, 6,051,634, 6,034,169, 6,008,289, 6,007,619, and 5,998,539. The isocyanate-functional prepolymers suitable for the preparation of the olefinic urethane reaction product are known. Typically, such prepolymers are adducts or condensation products of polyisocyanate compounds with at least two free isocyanate groups and monomeric or polymeric polyols with at least two hydroxyl groups, including mixtures of such polyols. The reaction between the polyisocyanate and the polyols is carried out using an excess amount of polyisocyanate to ensure that the isocyanate-functional prepolymer contains at least two free, unreacted isocyanate groups.

[0036] Polyisocyanates that can react with polyols to form isocyanate-functional prepolymers can be any isocyanate compounds with at least two free isocyanate groups, including aliphatic, cycloaliphatic and aromatic compounds.

[0037] Representative isocyanates include, without limitation, 2,4-toluene diisocyanate, 2,6-toluene diisocyanate, methylenediphenyl diisocyanates such as 2,4'-diphenylmethane diisocyanate, 4,4'-diphenylmethane diisocyanate, m- and p-phenylene diisocyanate, polymethylenepoly(phenyl isocyanate), hexamethylene diisocyanate, 4,4'-methylenebis(cyclohexyl isocyanate), isophorone diisocyanate and other aliphatic, heterocyclic and aromatic polyisocyanates, including mixtures of such polyisocyanates.

[0038] Isocyanates react with a wide variety of nucleophiles, including alcohols, amines, and even water, exhibiting higher reactivity than structurally analogous isothiocyanates. As explained herein, "isocyanate-reactive compounds" or "isocyanate-reactive resins" include components that react with isocyanates and are selected for their reactivity with them. Examples include, but are not limited to, one type of "isocyanate-reactive resin" selected from the group consisting of a polyether, polyester, and aliphatic hydrocarbon. Additionally, isocyanate-reactive resins may include those with at least two active hydrogen atoms selected from the group consisting of a hydroxyl group, a primary amine, a secondary amine, a thiol, urethane, urea, a carboxylic acid, an amide, and water.Finally, an isocyanate-reactive resin may include polyethylene glycol, polypropylene glycol, polytetramethylene ether glycol, a castor oil-based polyester polyol, and / or an aliphatic polyol based on polybutadiene.

[0039] The term "thermally conductive filler" refers to compositions added to improve the thermal conductivity of one or more components. Therefore, a thermally conductive filler can be selected from a wide variety of thermally conductive particle compositions, including aluminum, aluminum nitride, aluminum oxide, aluminum trihydrate (ATH), beryllium oxide, boron nitride, carbon black, calcium carbonate, graphite, magnesium oxide (or magnesium oxide), magnesium hydroxide, silicon carbide, silicon dioxide (or silica), talc, titanium dioxide, zinc oxide, and other minerals. Preferred thermally conductive fillers include aluminum, aluminum trihydrate, aluminum oxide, silica, calcium carbonate, magnesium oxide, and / or magnesium, as well as any combination thereof.Typically, the thermally conductive filler is a microparticulate powder with an average particle size in the range of about 0.1 to about 300 micrometers and preferably from about 0.3 to about 80 micrometers.

[0040] As disclosed herein, components are frequently separated in a two-part form, i.e., 2K, particularly when the components can react with each other, for example, when an isocyanate is used. In such embodiments, the isocyanate is typically separated from components other than the carrier solvent or at least from other components that can react under ambient (storage) conditions.

[0041] As used herein, the term “NCO index” refers to the ratio of the total NCO equivalents within the isocyanate component (component 2) to the total reactive equivalents within the isocyanate-reactive component (component 1). In another embodiment, the NCO index can also be expressed as the NCO / OH ratio for 2K systems based on isocyanates and polyols.

[0042] Catalysts can be used to control the curing rate of isocyanate-reactive and isocyanate species disclosed in the described compositions. Catalysts are mostly of the nucleophilic type, mainly represented by bases such as tertiary amines and salts of weak acids, or of the electrophilic type, mainly represented by organometallic compounds. Specific examples include, but are not limited to, trialkylamines, peralkylated aliphatic polyamines, diazabicyclooctane, tin dioctoate, dibutyltin dilaurate, and N-alkylmorpholine.

[0043] Although not essential to the core aspect of the subject matter disclosed herein, the following substances are common components used in two-component formulations to control properties such as color, rheology, flammability, adhesion improvement, mechanical properties, foaming, and others. Such common components may include, but are not limited to, pigments, viscosity-reducing additives, shear-thinning additives, flame retardants, adhesion promoters, plasticizers, foam stabilizers, and surfactants. Since these materials are not essential to the disclosed and claimed subject matter, they are referred to herein as the "additive package."

[0044] As used herein, 'monomer' refers to a molecule that can polymerize, thereby contributing structural units, i.e., an atom or a group of atoms, to the essential structure of a macromolecule.

[0045] As used here, “macromolecule” refers to a molecule with a high relative molecular mass whose structure comprises multiple repetitions of units derived from molecules with a low relative molecular mass, e.g., monomers and / or oligomers.

[0046] An “oligomer” is a molecule with medium relative molecular mass whose structure consists of a small number (e.g. 2-10) of repeating units derived from molecules with lower relative molecular mass.

[0047] A “polymer” is a substance that comprises macromolecules. In some embodiments, the term “polymer” can refer to both oligomeric molecules and molecules with a larger number (e.g., > 10, > 20, > 50, > 100) of repeating units. In some embodiments, “polymer” refers to macromolecules with at least 10 repeating units.

[0048] A “copolymer” refers to a polymer that is derived from more than one monomer species.

[0049] As used herein, the term “room temperature” is understood to mean any temperature between approximately 15°C and approximately 25°C (i.e., approximately 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, or approximately 25°C). In some embodiments, the term “room temperature” means a temperature between approximately 18°C ​​and approximately 24°C, or between approximately 20°C and approximately 25°C.

[0050] The term "storage-stable" here refers to a component whose composition and morphology are not significantly altered, such that its physical and chemical properties (e.g., viscosity, reaction equivalence) are not affected, and the material is no longer dosable and can no longer cure sufficiently with the first (isocyanate-reactive) component, which is necessary to meet the performance expectations of the unstored version of the cured formulation. Storage stability can be of particular importance when high concentrations and / or particles with a high surface area, e.g., ATH, are incorporated into isocyanate resins. ATH is highly hygroscopic and can lead to water-isocyanate reactions over time, which affect the percentage of reactive isocyanate groups ("NCO content") and thus result in an increase in molecular weight, crosslinking, increased viscosity, and the like.Furthermore, the isocyanate component with lower NCO content and potentially higher viscosity, when mixed with the polyol component, can impair the properties of the cured urethane material. II. Storage-stable, thermally conductive reaction compounds and processes

[0051] This document discloses filled compounds comprising an isocyanate-reactive resin, a conductive filler, and an isocyanate resin. In some embodiments, the isocyanate-reactive resin and the conductive filler are contained in a first component, while the isocyanate resin is contained in a second component. In some aspects, the first and second components are configured to be mixed to react and form a thermally conductive compound, with the first and second components being mixed in a ratio of approximately 1:1 to approximately 50:1. Optionally, the first component and the second component are mixed in a ratio of approximately 1:1, approximately 2:1, approximately 3:1, approximately 4:1, approximately 5:1, approximately 6:1, approximately 7:1, approximately 8:1, approximately 9:1, approximately 10:1, approximately 11:1, approximately 12:1, approximately 15:1, approximately 20:1, approximately 25:1, approximately 30:1, approximately 35:1, approximately 40:1, approximately 45:1 or approximately 50:1, preferably approximately 1:1.

[0052] In some aspects, the isocyanate-reactive resin features a resin type selected from the group consisting of a polyether, a polyester, and an aliphatic hydrocarbon. In some aspects, the isocyanate-reactive resin features at least two active hydrogen atoms selected from the group consisting of a hydroxyl group, a primary amine, a secondary amine, a thiol, a urethane, a urea, a carboxylic acid, an amide, and water. In some aspects, the isocyanate-reactive resin features a polyethylene glycol, polypropylene glycol, polytetramethylene ether glycol, a castor oil-based polyester polyol, and / or an aliphatic polybutadiene-based polyol. In some aspects, the isocyanate resin features an aromatic isocyanate, an aliphatic isocyanate, or an isocyanate prepolymer.

[0053] Aromatic isocyanate resins can contain a monomer or polyisocyanate based on methylene diphenyl diisocyanate (MDI) or toluene diisocyanate (TDI). Aliphatic isocyanate resins can contain monomeric isocyanate or polyisocyanate based on hexamethylene diisocyanate (HDI), hydrogenated MDI, or isophorone diisocyanate.

[0054] In some embodiments where an isocyanate prepolymer is used in the disclosed filled compounds, the isocyanate prepolymer can include a reaction product of an isocyanate-reactive resin and an aromatic isocyanate resin. The isocyanate prepolymer may also include a reaction product of a polyether polyol and an MDI-based resin. Optionally, the isocyanate prepolymer may include a reaction product of an isocyanate-reactive resin and an aliphatic isocyanate resin. In some aspects, the isocyanate prepolymer may include a reaction product of a polyether polyol and an HDI-based resin.

[0055] In some aspects, the conductive filler contains aluminium, aluminium trihydrate, aluminium oxide, silicon dioxide, calcium carbonate, magnesium oxide and / or magnesium hydroxide, with the conductive filler optionally having a thermal conductivity greater than about 5 W / m·K.

[0056] In some embodiments, the first component comprises an undried thermally conductive filler and optionally a moisture scavenger. In some embodiments, the first component comprises a dried filler and no molecular sieves.

[0057] The thermal conductivity of the disclosed filled compounds can be in the range of about 0.5 W / m·K to about 10 W / m·K or more, optionally about 1 W / m·K to about 4 W / m·K, optionally 0.5 W / m·K, 1 W / m·K, 1.5 W / m·K, 2 W / m·K, 2.5 W / m·K, 3 W / m·K, 3.5 W / m·K, 4 W / m·K, 4.5 W / m·K, 5 W / m·K, 5.5 W / m·K, 6 W / m·K, 6.5 W / m·K, 7 W / m·K, 7.5 W / m·K, 8 W / m·K, 8.5 W / m·K, 9 W / m·K, 9.5 W / m·K, or 10 W / m·K.

[0058] As described herein, the filled compound can be used as a thermal interface material. Optionally, the filled compound is used as an encapsulation or potting compound. Advantageously, the thermal interface material is designed to be stable over time. The thermal interface material can be prepared by mixing the first component with the second component as described herein. Additionally, the filled compound comprises a thermally conductive filler, a reinforcing filler, a cost-reducing filler, a surface-modifying filler, an electrically conductive filler, a magnetic filler, a density-reducing filler, and / or combinations thereof.

[0059] In a further embodiment, the present invention enables the use of an undried thermally conductive filler if the moisture inherent in the filler can be removed during the manufacture of the first component by high-temperature processing and vacuum. In a still further embodiment, the present invention provides for the use of an undried thermally conductive filler, wherein the moisture inherent in the filler can be removed by incorporating a moisture binder present in the first component. Examples of moisture scavengers include, but are not limited to, molecular sieves, p-toluenesulfonyl isocyanate, and oxazolidine compounds.In another embodiment, water is intentionally added to the first component, which has an undried or dried thermally conductive filler, in order to create a thermally conductive foam formed by mixing the first component with the second component.

[0060] In a further embodiment, the disclosed article may be suitable for use as a thermally conductive compound for applications that, for safety and reliability reasons, must be kept within a desired operating temperature range. Such applications may include, but are not limited to, batteries, battery modules, battery packs, electric vehicle assemblies, power conversion systems, inductors, transformers, inverters, electrical chokes, AC filters, thermistors, transistors, microprocessor chips, heat spreaders, heat sinks, thermally conductive underfills for flip-chip applications, chargers, control modules, printed circuit boards, electrical switches, and electric motors.

[0061] In some embodiments, the subject matter of the disclosure may be in the form and / or in the preparation of a potting compound, an encapsulation, a gap filler, an adhesive, an adhesive tape, a pad, a coating, which is applied to a substrate (e.g. a dielectric coating) which is subsequently to be joined to another substrate by means of another TIM or a conventional adhesive.

[0062] This document also describes methods for producing a storage-stable, thermally conductive reactive compound according to the present disclosure. Exemplary steps of such a method are shown in Fig.Figure 3 illustrates this. More precisely, such a process 100 may include a first step 101, which involves selecting a desired thermal conductivity (TC); a step 102 for selecting an isocyanate-reactive and isocyanate-containing compound to be used in a first component and a second component, respectively, taking into account the overall performance requirements; step 103, which involves selecting a desired filler package with thermal conductivity; and step 104, which involves determining a filler content by volume, φf. _verhmischt , in the mixed formulation, to achieve the desired TC (thermal conductivity). Step 105 shows how to determine the maximum filler content by volume, φf _max_1Step 106 involves calculating the minimum mixing ratio of the first component to the second component using formula R. This ratio can be added to the isocyanate-reactive component (first component) while the material remains fluid. min = φ f_mixed / (φf _max_1 - φf_mixed In step 107, a dispensing method is selected, e.g., cartridge dispensing, meter-mix dispensing, etc. The selection of a mixing ratio R of the first component to the second component (where R ≥ R) min) is completed in step 108. Step 109, which is optional in some embodiments, involves adjusting the concentrations of the isocyanate-reactive compounds and isocyanates in the first and second components, respectively, to achieve the desired NCO index. In step 110, the compositions of the first and second components are adjusted and / or optimized to meet the overall performance requirements, which may involve repeating steps 102 to 108. In some embodiments, steps 101 to 110 may be omitted in the Fig. The steps are carried out in the sequence shown in 3, while in other embodiments the sequence of these steps can be changed as required. EXAMPLES

[0063] The following examples serve to further illustrate various embodiments of the subject matter of the present disclosure. However, those skilled in the art should recognize, in light of the present disclosure, that many modifications can be made to the specific embodiments disclosed without departing from the spirit and scope of the subject matter of the present disclosure, and yet the same or a similar result can be achieved. Example 1: Storage-stable reactive compound - Comparison example / Control 1

[0064] Table 1 lists the ingredients of an isocyanate-containing composition for use in one component of a two-component thermally conductive adhesive composition comprising an aromatic isocyanate compound, i.e., polymeric MDI, an additive package, and an ATH thermally conductive filler in its supplied (undried) state. The blended composition was prepared by first combining the polymeric MDI and the additive package in a Hauschild mixing vessel and then mixing for 60 seconds at 1000 rpm without vacuum using a DAC 800.2 VAC Hauschild mixer. The ATH in its supplied (undried) state was then added and mixed for 60 seconds at 1000 rpm without vacuum. The sides of the vessel were then scraped with a spatula, and finally, the mixture was blended for 180 seconds at 1200 rpm under vacuum. Table 1. ingredient % by weight Vol. Polymeric MDI (129 g / equiv. NCO) 25.1 39.2 Additive package 0.7 1.4 Aluminum trihydrate, how obtained 74.2 59.4 In total 100 100

[0065] The resulting composition was stored at room temperature in a Hauschild mixing vessel, purged with nitrogen before sealing, and heat-sealed in a Mylar foil bag to prevent atmospheric moisture ingress. After storage at room temperature, the containers were briefly removed from the foil bags at defined intervals, remixed under vacuum in the Hauschild mixer for 60 seconds at 1600 rpm, and their viscosity was tested. Viscosity was measured at 25 °C and 0.1 s -1 for 60 seconds, 0.5 s -1 for 30 seconds, 1 s -1 for 30 seconds and 5 seconds -1Viscosity was measured for 30 seconds using a Discovery DHR-2 rheometer equipped with a 20 mm parallel plate configuration. The average of the last 5 viscosity data points was taken at each shear rate. Samples were re-nitrogen-encapsulated, heat-sealed, further aged at room temperature, and re-viscosity tested at a later predetermined time.

[0066] Table 2 shows viscosity measurements of the composition as a function of storage time at room temperature. The viscosity increased rapidly after 7 days, reaching a level corresponding to a solid paste consistency, so that the product no longer flowed easily. Such poor storage stability makes its use impractical. Table 2. Storage time at room temperature (days) Viscosity at different shear rates (Pa·s) 0.1 s -1 0.5 s -1 1 s -1 5 s -1 0 1336 1047 686 174 7 9263 3583 2056 547 14 7592 3554 2048 520 28 7952 3851 2300 580 Example 2: Storage-stable reactive compound - Comparison example / Control 2

[0067] Table 3 lists the ingredients of an isocyanate-containing, thermally conductive adhesive composition, which includes an aromatic isocyanate compound, i.e., polymeric MDI, an additive package, molecular sieve powder (oven-dried overnight at 315°C), and undried (as obtained) ATH, silicon dioxide, calcium carbonate, and titanium dioxide as thermally conductive fillers. The resulting composition was prepared as previously described in Example 1 and its viscosity was tested. Table 3. ingredient % by weight Vol. Polymeric MDI (129 g / equiv. NCO) 24.6 37.5 Additive package 0.3 0.6 Molecular sieve powder, oven-dried 3.0 3.6 Aluminum oxide trihydrate, how obtained 31.5 24.7 Silica, how it is obtained 31.7 27.7 Calcium carbonate, how it is obtained 7.9 5.5 Titanium dioxide, as obtained 1.0 0.4 In total 100 100

[0068] Table 4 shows viscosity measurements of the composition as a function of storage time at room temperature. Although the composition contains molecular sieve powder, its viscosity increased by a factor of 2 and 4, respectively, after 7 and 28 days of storage at room temperature. Such poor storage stability renders its use impractical. Table 4. Storage time at room temperature (days) Viscosity at different shear rates (Pa·s) 0.1 s -1 0.5 s -1 1 s -1 5 s -1 0 60 25 18 11 7 141 58 39 19 14 110 52 38 20 28 242 135 92 41 Example 3: Storage-stable reactive compound - Comparison example / Control 3

[0069] Table 5A lists the ingredients for each component of a two-component formulation based on an isocyanate-reactive composition (Component 1) and an isocyanate-containing composition (Component 2) featuring an aliphatic HDI trimer. The ingredients of the two components were configured to achieve similar concentrations of thermally conductive filler and an NCO / OH ratio of 0.35, as well as a volumetric thermal conductivity of 2.0, when the two components are mixed in a 1:1 volume ratio and cured and tested at room temperature. Table 5B shows the complete mixed formulation for reference. Table 5A. Isocyanate-reactive composition (component 1) ingredient % by weight Vol. Polyester polyol (342 g / equiv. OH) 17.0 41.8 catalyst 0.06 0.14 Additive package 1.9 2.8 Molecular sieve powder, oven-dried 1.0 1.5 Kiln-dried aluminum oxide 65.5 39.6 Aluminum trihydrate, oven dried 14.6 14.2 In total 100 100 Isocyanate-containing composition (component 2) ingredient % by weight Vol. HDI trimer isocyanate (193 g / equiv.NCO) 2.7 6.8 Additive package 11.6 28.6 Kiln-dried aluminum oxide 75.7 57.2 Titanium dioxide, oven-dried 10.0 7.4 In total 100 100 Table 5B. Mixed Table 5A formulations in a volume ratio of 1:1 Details % by weight Vol. Polyester polyol (342 g / equiv. OH) 7.6 20.9 HDI trimer isocyanate (193 g / equiv. NCO) 1.50 3.40 catalyst 0.03 0.07 Additive package 7.3 15.7 Molecular sieve powder 0.4 0.8 Aluminum powder, oven-dried 71.16 48.39 Aluminum trihydrate, oven dried 6.5 7.1 Titanium dioxide, oven-dried 5.6 3.7 In total 100.0 100.0

[0070] All thermally conductive fillers, i.e., aluminum oxide, ATH, and titanium dioxide, were dried for at least 16 hours at 125 °C in a convection oven. The individual components were prepared as previously described in Example 1. Thermal conductivity measurements were performed on cured samples prepared by dispensing the two components from a 50 cc cartridge at a volumetric mixing ratio of 1:1 using a static mixing nozzle to form samples with a diameter of 3.2 cm and a thickness of approximately 1.0 cm. The sample was cured for 24 hours at room temperature and then tested for thermal conductivity according to ISO 22007-2 using a hot-disk transient plane source (Model 2500 S). The reported conductivity value is the average of three measurements.

[0071] Table 6 shows viscosity measurements of the isocyanate-containing composition (component 2) as a function of storage time at room temperature, tested according to the procedure described in Example 1. Although the composition contained oven-dried filler, its viscosity still increased by a factor of 2 and a factor of 6 after 60 and 365 days, respectively, thus impairing its storage stability. Table 6. Storage time at room temperature (days) Viscosity of component 2 from comparison example 3 (Table 5A) at different shear rates (Pa·s) 0.1 s -1 0.5 s -1 1 s -1 5 s -1 0 816 422 313 170 14 1018 545 406 207 32 1357 695 515 249 60 1588 852 635 290 119 1997 1009 746 333 273 3108 1630 1213 526 365 4505 2451 1829 773 730 Too viscous - test not possible Example 4: Illustrative example - Storage-stable, thermally conductive, reactive composition

[0072] Table 7A lists the ingredients for each component of a 2K formulation based on the same ingredients as those listed in the 2K formulation of Example 3, but configured to have a volume mixing ratio of 10:1, no thermally conductive filler in the isocyanate-containing composition (component 2), the same NCO / OH ratio of 0.35, and the same overall thermal conductivity of 2.0 when the two components are mixed at a volume mixing ratio of 10:1 and cured and tested at room temperature. Table 7B shows the complete mixture, which is identical to the mixture shown previously in Table 5B. All thermally conductive fillers were dried under the same conditions as in Example 3. The preparation and testing of the thermal conductivity samples were also performed according to Example 3. Table 7A. Isocyanate-reactive composition (component 1) ingredient % by weight Vol. Polyester polyol (342 g / equiv. OH) 7.9 23.0 catalyst 0.03 0.08 Additive package 4.7 11.0 Molecular sieve powder 0.5 0.8 Aluminum powder, oven-dried 74.3 53.2 Aluminum trihydrate, oven-dried 6.8 7.8 Oven-dried titanium dioxide 5.8 4.1 In total 100 100 Isocyanate-containing composition (component 2) ingredient wt. % Vol. HDI trimer isocyanate (193 g / equiv.NCO) 35.4 37.4 Additive package 64.6 62.6 In total 100 100 Table 7B. mixed Table 7A formulations in a volume ratio of 10:1 Details % by weight Vol. Polyester polyol (342 g / equiv. OH) 7.6 20.9 HDI trimer isocyanate (193 g / equiv.NCO) 1.50 3.40 catalyst 0.03 0.07 Additive package 7.3 15.7 Molecular sieve powder 0.4 0.8 Aluminum powder, oven-dried 71.16 48.39 Aluminum trihydrate, oven-dried 6.5 7.1 Oven-dried titanium dioxide 5.6 3.7 In total 100.0 100.0

[0073] Table 8 shows viscosity measurements of the isocyanate-containing composition (component 2) as a function of storage time at room temperature, tested according to the procedure described in Example 1. In contrast to the results for Example 3, the viscosity of Example 4 is stable over a period of 730 days. Fig. illustrates the differences in viscosity as a function of storage time for the two examples. Table 8. Storage time at room temperature (days) Viscosity of component 2 from example 4 (Table 7A) at different shear rates (Pa·s) 0.1 s -1 0.5 s -1 1 s -1 5 s -1 0 1404 732 572 155 14 1366 727 536 146 32 1181 770 546 148 60 1164 868 576 156 119 1056 870 555 149 182 1290 807 515 139 273 1215 931 569 152 365 1170 981 573 152 730 1203 946 553 147 Example 5: Illustrative example - Storage-stable, thermally conductive, reactive composition

[0074] Table 9 lists the components of a 2K formulation based on an isocyanate-reactive composition (component 1) containing only ATH thermally conductive filler, and an isocyanate-containing composition (component 2) containing an aromatic polymeric MDI and no thermally conductive filler. The components were designed to exhibit an NCO / OH ratio of 1.1 and a thermal conductivity of 2.0 W / m·K at a volume mixing ratio of 10:1 and curing and testing at room temperature. Table 9. Isocyanate-reactive composition (component 1) ingredient % by weight Vol. Polyether polyol (303 g / equiv.OH) 12.7 24.7 Additive package 1.4 2.6 catalyst 0.01 0.02 Molecular sieve powder, oven-dried 3.0 3.9 Aluminum oxide trihydrate, as preserved 82.9 68.8 In total 100 100 Isocyanate-containing composition (component 2) ingredient % by weight Vol. Polymeric MDI (129 g / equiv .NCO) 93.0 96.2 Additive package 7.0 3.8 In total 100 100

[0075] The ATH filler was used as supplied (undried). Sample preparation and testing for thermal conductivity were carried out according to Example 3.

[0076] Table 10 shows the viscosity measurements of the isocyanate-containing composition (component 2) as a function of storage time at room temperature, tested according to the procedure described in Example 1. The viscosity remains stable over the entire test period of 183 days. For comparison, this behavior is shown in Fig. shown, in contrast to the behavior observed in Example 1, whose composition contains a hygroscopic, thermally conductive filler. Table 10. Storage time at room temperature (days) Viscosity of component 2 from illustrative example 5 (Table 9) at different shear rates (Pa·s) 0.1 s -1 0.5 s -1 1 s -1 5 s -1 0 1866 498 281 66 7 1806 529 286 64 14 1880 528 282 63 28 1657 478 265 59 59 1632 485 265 59 88 1666 513 290 64 122 1645 462 252 56 183 1584 431 234 51 Example 6

[0077] Illustrative Example – Storage-Stable, Thermally Conductive, Reactive Composition. Table 11 lists the components of a 2K formulation based on an isocyanate-reactive composition (Component 1) containing only the thermally conductive filler ATH, and an isocyanate-containing composition (Component 2) comprising an MDI-based prepolymer without a thermally conductive filler. The components were designed to react with each other at an NCO / OH ratio of 1.1 and a filler thermal conductivity of 1.5 W / m·K when mixed in a volumetric ratio of 4:1, cured at room temperature, and tested. The ATH filler was used as supplied (undried). Sample preparation and thermal conductivity testing were performed according to Example 3. Table 11. Isocyanate-reactive composition (component 1) ingredient Wt% Vol. % Polyether polyol (213 g / equiv.OH) 12.3 24.4 Additive package 1.5 2.9 catalyst 0.01 0.02 Molecular sieve powder, oven-dried 3.0 3.9 Aluminum oxide trihydrate, as preserved 83.2 68.8 In total 100 100 Isocyanate-containing composition (component 2) ingredient % by weight Vol. MDI-based polyether prepolymer (222 g / equiv. NCO) 93.0 96.4 Additive package 7.0 3.6 In total 100 100 Example 7 Illustrative example - Storage-stable, thermally conductive reactive composition

[0078] Table 12 lists the components of a two-component formulation based on an isocyanate-reactive composition (component 1) containing only the thermally conductive filler ATH, and an isocyanate-containing composition (component 2) comprising an MDI-based prepolymer without a thermally conductive filler. The components were designed to react with each other at an NCO / OH ratio of 1.1 and a filler thermal conductivity of 0.94 W / m·K when mixed in a volumetric ratio of 2:1, cured at room temperature, and tested. The ATH filler was used as supplied (undried). Sample preparation and thermal conductivity testing were performed according to Example 3. Table 12. Isocyanate-reactive composition (component 1) ingredient % by weight Vol. Polyether polyol (213 g / equiv.OH) 14.8 28.5 catalyst 0.01 0.03 Additive package 1.8 3.3 Molecular sieve powder, oven-dried 2.9 3.7 Aluminum oxide trihydrate, as preserved 80.5 64.5 Total 100 100 ingredient % by weight Vol. Isocyanate-containing composition (component 2) MDI-based prepolymer (371 g / equiv. NCO) 96.6 98.3 Additive package 3.4 1.7 In total 100 100 QUOTES INCLUDED IN THE DESCRIPTION

[0000] This list of documents cited by the applicant was automatically generated and is included solely for the reader's convenience. The list is not part of the German patent or utility model application. The DPMA accepts no liability for any errors or omissions. Cited patent literature

[0000] US 63 / 470,363

[0001] US 4,553,377

[0035] US 6,221,995

[0035] US 6,201,060

[0035] US 6,153,690

[0035] US 6,143,132

[0035] US 6,139,675

[0035] US 6,126,777

[0035] US 6,087,439

[0035] US 6,080,812

[0035] US 6,051,634

[0035] US 6,034,169

[0035] US 6,008,289

[0035] US 6,007,619

[0035] US 5,998,539

[0035]

Claims

[1] Filled compound, having: an isocyanate-reactive resin; a conductive filler; and an isocyanate resin wherein the isocyanate-reactive resin and the conductive filler are contained in a first component, wherein the isocyanate resin is contained in a second component, and wherein the first and second components are designed to react when mixed to form a thermally conductive compound, wherein the first component and the second component are mixed together in a ratio of about 1:1 to about 50:

1. [2] Filled compound according to claim 1, wherein the first component and the second component are mixed in a ratio of about 1:1, about 2:1, about 3:1, about 4:1, about 5:1, about 6:1, about 7:1, about 8:1, about 9:1, about 10:1, about 11:1, about 12:1, about 15:1, about 20:1, about 25:1, about 30:1, about 35:1, about 40:1, about 45:1 or about 50:1 or about 1:

1. [3] Filled compound according to one of claims 1 to 2, wherein the isocyanate-reactive resin comprises a resin type selected from the group consisting of a polyether, a polyester and an aliphatic hydrocarbon. [4] Filled compound according to claim 3, wherein the isocyanate-reactive resin has at least two active hydrogen atoms selected from the group consisting of a hydroxyl group, a primary amine, a secondary amine, a thiol, a urethane, urea, a carboxylic acid, an amide and water. [5] Filled compound according to claim 3, wherein the isocyanate-reactive resin comprises a polyethylene glycol, polypropylene glycol, polytetramethylene ether glycol, a castor oil-based polyester polyol and / or an aliphatic polyol based on polybutadiene. [6] Filled compound according to any one of claims 1 to 5, wherein the isocyanate resin comprises an aromatic isocyanate, an aliphatic isocyanate or an isocyanate prepolymer. [7] Filled compound according to claim 6, wherein the aromatic isocyanate resin comprises a monomer or polyisocyanate based on methylene diphenyl diisocyanate (MDI) or toluene diisocyanate (TDI). [8] Filled compound according to claim 6, wherein the aliphatic isocyanate resin comprises a monomeric isocyanate or polyisocyanate based on hexamethylene diisocyanate (HDI), hydrogenated MDI or isophorone diisocyanate. [9] Filled compound according to claim 6, wherein the isocyanate prepolymer comprises a reaction product of an isocyanate-reactive resin and an aromatic isocyanate resin. [10] Filled compound according to claim 9, wherein the isocyanate prepolymer comprises a reaction product of a polyether polyol and an MDI-based resin. [11] Filled compound according to claim 6, wherein the isocyanate prepolymer comprises a reaction product of an isocyanate-reactive resin and an aliphatic isocyanate resin. [12] Filled compound according to claim 6, wherein the isocyanate prepolymer comprises a reaction product of a polyether polyol and an HDI-based resin. [13] Filled compound according to any one of claims 1 to 5 W12, wherein the conductive filler comprises aluminium, aluminium trihydrate, aluminium oxide, silicon dioxide, calcium carbonate, magnesium oxide and / or magnesium hydroxide, wherein the conductive filler optionally has a thermal conductivity greater than about 5 W / m·K. [14] Filled compound according to any one of claims 1 to 13, wherein the first component comprises an undried thermally conductive filler and optionally a moisture absorber. [15] Filled compound according to any one of claims 1 to 13, wherein the first component comprises a dried filler and no molecular sieves. [16] Filled compound according to any one of claims 1 to 15, wherein the thermal conductivity is in the range of about 0.5 W / m·K to about 10 W / m·K or more, optionally about 1 W / m·K to about 4 W / m·K. [17] Filled compound according to any one of claims 1 to 16, wherein the filled compound is used as a thermal interface material. [18] Filled compound according to any one of claims 1 to 17, wherein the filled compound is used as an encapsulation or potting compound. [19] Filled compound according to claim 17, wherein the thermal interface material is storage stable. [20] Filled compound according to any one of claims 1 to 18, wherein the filled compound comprises a thermally conductive filler, a reinforcing filler, a cost-reducing filler, a surface-modifying filler, an electrically conductive filler, a magnetic filler, a density-reducing filler and / or combinations thereof. [21] Thermal interface material formed from the compounds of any one of claims 1 to 20, wherein the thermal interface material is formed by mixing the first component with the second component. [22] Method for producing a storage-stable thermal interface material, wherein the method comprises mixing the first component with the second component from any one of claims 1 to 20. [23] Method according to claim 22, wherein the method comprises ensuring that no thermally conductive filler is present in the second component. [24] Method for producing a storage-stable thermal interface material, wherein the method comprises: Selecting a desired thermal conductivity; Selecting isocyanate-reactive and isocyanate-containing compounds to be used in a first component and a second component, respectively; Selecting a desired thermally conductive filler package; Determining filler content by volume, φf _vermischt , in a mixed formulation to achieve the desired thermal conductivity; Determining the maximum filler content by volume, φ f_max_1 , which can be added to the first component while the material is still fluid; Calculating the minimum mixing ratio of the first component to the second component using the formula R min = φ f_vermischt / (φ f_max_1 - φ f_vermischt ); Selecting a material discharge method, for example cartridge dosing or dosing and mixing using a mixing and dosing system; Selecting a mixing ratio R of the first component to the second component (where R ≥ R) min ); and Optimize and / or adjust the compositions of the first and second components to meet the overall performance requirements, if necessary by repeating the steps mentioned above. [25] The method of claim 24, further comprising a step of adjusting the concentrations of the isocyanate-reactive compounds and the isocyanates in the first and second components, respectively, to achieve a desired NCO index, optionally following the step of selecting a discharge method.

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