Surface-mountable narrow-angle component

Abstract

Metallization structures for surface-mountable packages characterized in that the centrally oppositely arranged metallized surfaces which are both formed with two or more symmetrically and centrally arranged non-metallized regions with an H-shaped structure, wherein the width of the metallized regions lying therebetween is determined by the chip size.

Description

[0001] Utility model application 20 2022 002 470 describes various metallization structures for surface mountable component bodies (1) which are specifically designed for multiple placement of chips of different sizes and contact configurations.

[0002] However, due to the chip arrangement, only limited small symmetrical viewing angles are possible.

[0003] To achieve a very narrow viewing angle, a very precise placement of the semiconductor chip is necessary, which in the geometric and thus optical axis with a correspondingly focusing optical unit, for example an optical lens (28), makes the desired narrow viewing angle in the range of less than 10 degrees full angle achievable.

[0004] The Fig. Figure 1 shows two centrally arranged metallized surfaces (17) and (18), each of which is formed with two symmetrically arranged non-metallized areas (2) with an H-shaped structure. The metallized surface (17) is connected to the via (32), and the metallized surface (18) to the via (16). In this arrangement, the metallized surfaces (15) are arranged symmetrically to the metallized surfaces (3) with locally fixed vias (7) and (30) and have locally variable vias (4), (14), (29), and (31).

[0005] The elongated surfaces (17) and (18) are formed by an insulating area (2) with an H-shaped overall structure located symmetrically in the center of the housing to accommodate chips with single-sided contacts, such as flip chips. The H-shaped design of the surface boundary created by the insulating areas (2) of (17) and (18) prevents the flip chips from floating asymmetrically during the soldering process and enables chip bonders using adhesive bonding techniques to precisely detect and position the chips.

[0006] The vias (6), (8), (10), (12), (7), (9), (11), (13), (4), (14), (29), (31), (5), (30) and (32) serve for the electrically conductive passage of the housing base plate (21) and connection to the solderable contact surfaces (19) and (20) located on the underside of the housing, as shown in Fig. Figure 2 is shown as an example. For local assignment and component orientation, a solderable contact (20) is shaped differently, as shown in the example. Its position, shape, length, and width are arbitrary. The eight contact surfaces located on the underside of the housing are arranged in two rows of three contact surfaces each, with two contact surfaces in the center rotated 90 degrees relative to the housing edge. A cavity (22) made of non-conductive materials, such as ceramic or printed circuit board material, or electrically conductive materials, such as copper, is applied above the upper metallization. Electrically conductive materials must be applied to the metallization structure by means of a non-conductive insulating layer (23). Fig. 3) For the airtight sealing of the housing, potting materials or metallized glass parts to be soldered onto an existing metallization layer (24) can be used ( Fig. 3) The high-precision integrated chip (27) can be a light-emitting diode, a photodiode, or a phototransistor. A narrow viewing angle is achieved by mounting a lens on top of it, with the height of the lens shaft (26) and the curvature of the lens (28) being crucial.

[0007] In Fig. Figure 4 shows a top view of the surface-mountable, narrow-angle component. The chip position (27) is located in the center and on the optical axis of the lens (28), which is held at a defined distance from the chip (27) by a base (25) with variable thickness and a lens shaft (26). The lens (28), the lens shaft (26), and the variable base (25), as an optically active unit, are mounted in a highly centered position within a tightly toleranced cavity (22). List of designations 1 surface mountable components 2 insulating areas with an H-shaped structure 3 metallized surfaces 4. Through-hole plating 5. Through-hole plating 6. Through-hole plating 7. Through-hole plating 8 Via 9. Through-hole plating 10 Through-hole plating 11. Through-hole plating 12 Through-hole plating 13. Through-hole plating 14 Through-hole plating 15 contact surfaces 16 Through-hole plating 17 contact surfaces 18 contact surfaces 19 contact surfaces 20 contact surfaces 21 Housing base plate 22 Cavity 23 non-conductive insulation layer 24 Metallization layer 25 sockets 26 lens shaft 27 Chip 28 optical lenses 29 Through-hole plating 30 Through-hole plating 31 Through-hole plating 32 vias

Claims

[1] Metallization structures for surface-mountable housings characterized in that the centrally opposite metallized surfaces, each of which is formed with two or more symmetrically and centrally arranged non-metallized areas with an H-shaped structure, the width of the metallized areas between them being determined by the chip size. [2] Metallization structures for surface-mountable housings according to claim (1) characterized in that the metallization structure has up to eight metallized surfaces which are arranged symmetrically in the X and Y axes and are used for bonding wires, and further metallized surfaces which are arranged symmetrically in at least one orientation with up to eight vias to the eight contact surfaces located on the underside of the housing are electrically connected, wherein a further metallized surface formed centrally with any shape may be insulated and without vias. [3] Metallization structures for surface mountable housings according to claim (1) and claim (2) characterized in that the centrally arranged metallized area is present in its entirety or is separated into two parts by an insulating area to accommodate different chip designs and chip sizes. [4] Metallization structures for surface-mountable housings according to claims (1) to (3) characterized in that the cavity consists of non-conductive materials or electrically conductive materials, wherein electrically conductive materials are applied over the metallization structure by means of a non-conductive insulating layer. [5] Metallization structures for surface-mountable housings according to claims (1) to (4) characterized in that a metallization layer is present on the cavity surface for the airtight or vacuum-sealed closure of the housing. [6] Metallisation structures for surface mountable housings according to claims (1) to (5) characterized in that the eight contact surfaces located on the underside of the housing are arranged in two rows of three contact surfaces each, with two contact surfaces in the middle rotated by 90 degrees to the edge of the housing.

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