Shielding assembly, inverter control module and energy storage device

Abstract

Shielding assembly used in an inverter control module, wherein the inverter control module comprises a printed circuit board, characterized in that the shielding assembly comprises the following: a carrier plate designed as a sheet metal part; a rectifier housing installed on the carrier board, wherein the rectifier housing and the carrier board together form a mounting space configured for the installation of the printed circuit board, the printed circuit board being located wholly or partially within the mounting space; wherein, within the mounting space, the rectifier housing is configured to form a heat dissipation channel in the space above the printed circuit board, the space above the printed circuit board referring to a space on a side of the printed circuit board facing away from the carrier board; a shielding cover with an opening, wherein the shielding cover covers the rectifier housing and is firmly connected to the rectifier housing, wherein the edge of the shielding cover at the opening is connected to the outer contour edge of the carrier plate, and wherein the shielding cover, the rectifier housing and the carrier plate form a cage-like structure.

Description

TECHNICAL AREA

[0001] The present application relates to the technical field of energy storage, in particular a shielding assembly, an inverter control module and an energy storage device. STATE OF THE ART

[0002] Energy storage devices are designed to store energy for later release. Some energy storage systems include an inverter control module to provide combined charging and inverter functionality. Existing shielding solutions typically involve constructing metal enclosures around these inverter control modules. However, such enclosures serve only a shielding function and offer limited overall functionality. DISCLOSURE OF THE USE PATTERN

[0003] Against this background, the present application provides a shielding assembly, an inverter control module and an energy storage device that can improve the functional diversity of the shielding cover.

[0004] An embodiment of the present application provides a shielding assembly. The shielding assembly is used in an inverter control module, the inverter control module comprising a printed circuit board. The shielding assembly comprises a carrier plate, a rectifier housing, and a shielding cover with an opening. The carrier plate is formed as a sheet metal part. The rectifier housing is mounted on the carrier plate, the rectifier housing and the carrier plate together forming a mounting space. The mounting space is configured for the installation of the printed circuit board. Within the mounting space, the rectifier housing is configured to form a heat dissipation channel in the space above the printed circuit board.The shielding cover covers the rectifier housing and is firmly connected to the rectifier housing, with the edge of the shielding cover at the opening being connected to the outer contour edge of the carrier plate.

[0005] The aforementioned shielding assembly not only provides electromagnetic shielding for the power component on the printed circuit board (PCB) via the shielding cover, but also supports the PCB via the carrier plate. Furthermore, it facilitates heat dissipation for the power component on the PCB via the heat dissipation channel formed in the space above the PCB. In addition, the shielding cover, rectifier housing, and carrier plate together form a cage-like structure in the present application, providing excellent structural strength. In the event of a collision or impact on the inverter control module, the cage-like shielding assembly effectively resists external forces, thereby protecting the PCB within the shielding assembly and improving both the stability of the PCB installation and its vibration resistance.

[0006] In some embodiments of the present application, the shielding assembly further comprises a support column, wherein one end of the support column is installed on the rectifier housing, while the other end of the support column is configured to penetrate the printed circuit board and is rigidly connected to the carrier board. When the two ends of the support column are connected to the rectifier housing and the carrier board, respectively, the support column is configured to press against the printed circuit board.

[0007] The support column not only provides structural support for the rectifier housing, thus reducing the risk of deformation due to external forces, but also exerts a compressive force on the printed circuit board (PCB) while the rectifier housing is connected to the mounting plate. This creates a preload on the PCB, significantly improving the stability of the PCB mounting and its vibration resistance.

[0008] In some embodiments of the present application, the rectifier housing is provided along the direction of penetration of the support column with a fastening element which is configured to be synchronously connected to the power component within the printed circuit board when the support column is firmly connected to the carrier board.

[0009] Since the mounting elements are aligned in the same direction as the support column, the mounting element can be synchronously connected to the power component within the printed circuit board (PCB) when the support column is firmly connected to the carrier board. This eliminates complex installation steps, improving assembly efficiency between the shielding assembly and the PCB. Furthermore, the mounting element arrangement allows for dual mounting of the PCB (specifically, mounting between the PCB and the carrier board, and mounting between the power component on the PCB and the rectifier housing). This enhances the locking effect of the shielding assembly on the PCB, thereby improving the stability of the PCB installation and reducing the risk of PCB detachment due to vibration or shock.

[0010] In some embodiments of the present application, the shielding cover is provided with a first snap-in section at the edge of the opening, wherein a second snap-in section is arranged at the outer contour edge of the carrier plate, which is configured to snap into the first snap-in section when the shielding cover covers the rectifier housing.

[0011] The arrangement of the first and second snap-in sections allows for a double fastening of the shield cover (specifically, a fixed connection between the shield cover and the housing, and a snap-in connection between the shield cover and the carrier board). This effectively reduces the risk of the shield cover detaching under external force, thereby improving the stability of the shield cover installation and ensuring that the shield assembly provides reliable electromagnetic shielding for the power component within the printed circuit board at all times.

[0012] In some embodiments of the present application, the rectifier housing is provided with a mounting section configured to accommodate an external cooling fan. The rectifier housing is further provided with a through-hole connected to the heat dissipation duct, the through-hole being configured to face the cooling fan so that, under the action of the cooling fan, outside air can enter or exit the heat dissipation duct through the through-hole.

[0013] Pre-configuring the mounting section and through-hole on the rectifier housing eliminates the need for complex drilling or cutting work by production and assembly personnel. The cooling fan can be directly aligned and mounted to the rectifier housing, reducing the complexity of its installation and improving assembly efficiency. When the cooling fan is operating, it draws in or expels outside air through the through-holes into the heat dissipation duct, thus circulating air within the duct and enhancing the heat dissipation effect of the PCB shielding assembly.

[0014] In some embodiments of the present application, the shielding assembly further comprises a lining which is installed in the mounting space and abuts the rectifier housing, wherein the lining and the rectifier housing together form the heat dissipation channel.

[0015] By arranging the lining and using it together with the rectifier housing to form the heat dissipation channel, the overall weight of the rectifier housing can be reduced. For example, the rectifier housing can be made of materials with high structural strength and deformation resistance (which are heavier), while the lining can be made of lightweight materials. This facilitates a lightweight design for the energy storage device.

[0016] In some embodiments of the present application, the rectifier housing in the heat dissipation channel is provided with a guide ramp configured to gradually approach the circuit board along the direction of flow of the outside air.

[0017] The arrangement of the guide slope can, on the one hand, reduce the flow velocity of the outside air, thus decreasing the risk of airflow separation and turbulence formation at the corners of the heat dissipation duct, which could lead to a loss of outside air; on the other hand, the outside air can be precisely guided to the power component on the circuit board, thus improving the heat dissipation effect of the shielding assembly.

[0018] In some embodiments of the present application, the rectifier housing in the heat dissipation channel is further provided with several distributor plates, wherein the several distributor plates are arranged at intervals on the guide slope, wherein a distributor channel is formed between two adjacent distributor plates, which is configured to direct the outside air to different locations on the circuit board.

[0019] The arrangement of the distribution plate allows the main airflow to be divided into several smaller streams, which are directed along the corresponding distribution channels to different locations on the circuit board in order to achieve heat dissipation for power components at different points on the circuit board, which reduces the risk of local overheating of the circuit board (which in particular means that some power components generate more heat than others) and thereby improves the heat dissipation effect of the shielding assembly.

[0020] One embodiment of the present application provides an inverter control module. The inverter control module comprises a printed circuit board and a shielding assembly in any of the above embodiments, wherein the printed circuit board is installed in the mounting space of the shielding assembly. One embodiment of the present application provides an energy storage device. The energy storage device comprises an outer casing, a battery pack, and an inverter control module as described above, wherein the battery pack and the inverter control module are each installed in the outer casing, and wherein the battery pack is connected to the inverter control module. Details of one or more embodiments of the present application are set forth in the accompanying drawings and the description below.Further features, objectives and advantages of the present application will become apparent from the description, the drawings and the claims. PRESENTATION OF THE REGISTRATION

[0021] To more clearly explain the technical solution in the embodiments of the present application, the drawings in these embodiments are briefly presented below. It should be understood that the drawings described below represent only some embodiments of the present application and should not be considered as limiting the scope. Fig. Figure 1 shows a schematic diagram of the structure of an energy storage device provided by an embodiment of the present application. Fig. Figure 2 shows a schematic diagram of a disassembled structure of an energy storage device according to Fig. 1. Fig. Figure 3 shows a schematic diagram of the structure of an inverter control module in an energy storage device according to Fig. 2. Fig. Figure 4 shows a schematic diagram of a disassembled structure of an inverter control module according to Fig. 3. Fig. Figure 5 shows a schematic diagram of the structure of a carrier plate and a shielding cover according to their interaction. Fig. 4. Fig. Figure 6 shows a schematic diagram of the structure of an inverter control module according to Fig. 3 after cutting along line III-III. Fig. Figure 7 shows a partially enlarged view of location A according to Fig. 3. Fig. Figure 8 shows a schematic diagram of the structure of a rectifier housing according to Fig. 4. SPECIFIC EXECUTION FORMS

[0022] In conjunction with the accompanying drawings in the embodiment of the present application, the technical solutions in the embodiment of the present application are explained below. Obviously, the embodiments explained do not represent all embodiments, but only a subset of embodiments of the present application.

[0023] Unless otherwise stated, all technical and scientific terms used in the description have the same meanings as they would normally be understood by a person skilled in the art in the field of the present application. The terms used in the description of the present application serve only to explain the specific embodiments, rather than to limit the present application.

[0024] Energy storage devices are designed to store energy for later release. Some energy storage systems include an inverter control module to provide combined charging and inverter functionality. Existing shielding solutions typically involve constructing metal enclosures around these inverter control modules. However, such enclosures serve only a shielding function and offer limited overall functionality.

[0025] An embodiment of the present application provides a shielding assembly. The shielding assembly is used in an inverter control module, the inverter control module comprising a printed circuit board. The shielding assembly comprises a carrier plate, a rectifier housing, and a shielding cover with an opening. The carrier plate is formed as a sheet metal part. The rectifier housing is installed on the carrier plate, the rectifier housing and the carrier plate together forming a mounting space. The mounting space is configured for the installation of the printed circuit board. Within the mounting space, the rectifier housing is configured to form a heat dissipation channel in the upper area of ​​the printed circuit board. The shielding cover covers the rectifier housing and is firmly connected to the rectifier housing, with the edge of the shielding cover at the opening being connected to the outer contour edge of the carrier plate.

[0026] The aforementioned shielding assembly not only provides electromagnetic shielding for the power component on the printed circuit board via the shielding cover, but also supports the printed circuit board via the carrier plate. Furthermore, it facilitates heat dissipation for the power component on the printed circuit board via the heat dissipation channel formed in the space above the printed circuit board. Moreover, in the present application, the shielding cover, the rectifier housing, and the carrier plate together form a cage-like structure, namely a cage-like shielding assembly, which offers excellent structural strength.In the event of a collision or impact on the inverter control module, the cage-like shielding assembly effectively resists external forces, thereby protecting the circuit board within the shielding assembly and improving both the stability of the circuit board installation and its vibration resistance.

[0027] In conjunction with the accompanying drawings, some embodiments of the present application are explained in more detail below. The embodiments and the features in the embodiments can be combined without conflict.

[0028] Referring to Fig. 1 and Fig. Figure 2 provides an embodiment of the present application, an energy storage device 100. The energy storage device has both energy storage and discharge capabilities and is intended for emergency power supply in households, emergency power supply in industry, and applications such as outdoor operation and recreational activities. In some embodiments, the energy storage device 100 comprises an outer casing 10 and a battery pack 20. The battery pack 20 can be mounted inside the outer casing 10 and serves as the energy storage and power supply unit for the energy storage device 100.

[0029] With reference to Fig. 2 and Fig. In some embodiments, the energy storage device 100 further comprises an inverter control module 30. The inverter control module 30 is installed inside the outer casing 10 and electrically connected to the battery pack 20. The battery pack 20 can also function as a standalone device for DC output or be stacked in conjunction with the inverter control module 30.

[0030] In some embodiments, the inverter control module 30 comprises a printed circuit board 31 and a shielding assembly 32. The printed circuit board 31 is mounted inside the shielding assembly 32 and connected to the battery pack 20. The printed circuit board 31 controls the charging and discharging of the battery pack 20. The shielding assembly 32 is configured to shield electromagnetic interference from the power component 311 on the printed circuit board 31.

[0031] With reference to Fig. In some embodiments, the shielding assembly 32 comprises a carrier plate 321, a rectifier housing 322, and a shielding cover 325 with an opening (not shown). The carrier plate 321 is installed in the outer shell 10, and the carrier plate 321 is formed as a sheet metal part. In some embodiments, the rectifier housing 322 is installed on the carrier plate 321, with the rectifier housing 322 and the carrier plate 321 together forming a mounting space 323. The printed circuit board 31 is installed on the carrier plate 321 and is located in the mounting space 323. The carrier plate 321 can support the printed circuit board 31.

[0032] It should be noted that the printed circuit board 31 can be arranged wholly or partially within the mounting space 323, which is not restricted in the present application. Those skilled in the art can select the arrangement according to practical circumstances.

[0033] With reference to Fig. 5 and Fig. In some embodiments, the rectifier housing 322 is configured in the mounting space 323 such that it forms a heat dissipation channel 324 in the space above the printed circuit board 31. It should be noted that the space above the printed circuit board refers specifically to a space on the side of the printed circuit board 31 facing away from the support plate 321.

[0034] If the power component 311 inside the printed circuit board 31 generates heat due to prolonged operation, the air inside the heat dissipation channel 324 can absorb the heat from the power component 311 to lower its temperature. The arrangement of the heat dissipation channel 324 enables heat dissipation from the power component 311 on the printed circuit board 31 and ensures stable operation of the power component 311.

[0035] With further reference to Fig. In some embodiments, the shielding cover 325 covers the rectifier housing 322 and is firmly connected to it. The edge of the shielding cover 325 at the opening is connected to the outer contour edge of the support plate 321, allowing the shielding cover 325, the rectifier housing 322, and the support plate 321 to form a cage-like structure.

[0036] The shielding cover 325 provides electromagnetic shielding for the power component 311 within the printed circuit board 31. Furthermore, the shielding cover 325, the rectifier housing 322 and the carrier board 321 together form a cage-like structure, namely a cage-like shielding assembly 32, which provides excellent structural strength.

[0037] In the event of a collision or impact on the inverter control module 30, the cage-like shielding assembly 32 effectively resists external forces, thereby protecting the circuit board 31 inside the shielding assembly 32 and improving both the stability of the installation of the circuit board 31 and its vibration resistance.

[0038] The shielding assembly 32 provided by the present application not only offers electromagnetic shielding for the power component 311 on the printed circuit board 31 via the shielding cover 325, but also supports the printed circuit board 31 via the support plate 321. In addition, it facilitates heat dissipation for the power component on the printed circuit board 31 via the heat dissipation channel 324, which is formed in the space above the printed circuit board 31.

[0039] In summary, the shielding assembly 32 of the present application fulfills several functions, including electromagnetic shielding, support, and heat dissipation. This increases the functional versatility of the shielding assembly 32 and thus enables miniaturization of the product.

[0040] With reference to Fig. 5 and Fig. In some embodiments, the shielding assembly 32 further comprises a support column 326. One end of the support column 326 is installed on the rectifier housing 322, while the other end of the support column 326 penetrates the circuit board 31 and is rigidly connected to the carrier board 321. When the two ends of the support column 326 are connected to the rectifier housing 322 and the carrier board 321, respectively, the support column 326 is configured to press against the circuit board 31.

[0041] The support column 326 not only provides structural support for the rectifier housing 322, thus reducing the risk of deformation of the rectifier housing 322 due to external forces, but also exerts a compressive force on the printed circuit board 31 while the rectifier housing 322 is connected to the carrier plate 321. This achieves a preload on the printed circuit board 31, which significantly improves the stability of the mounting of the printed circuit board 31 and its vibration resistance.

[0042] In some embodiments, the rectifier housing 322 is provided along the direction of penetration of the support column 326 with a fastening element 3221 which is configured to be synchronously connected to the power component 311 inside the circuit board 31 when the support column 326 is firmly connected to the carrier board 321.

[0043] Since the fastening element 3221 is aligned in the same direction as the support column 326, the fastening element 3221 can be rigidly connected synchronously with the power component 311 within the printed circuit board 31 when the support column 326 is rigidly connected to the carrier plate 321. This eliminates complex installation steps, which improves the assembly efficiency between the shielding assembly 32 and the printed circuit board 31.

[0044] On the other hand, the arrangement of the fastening element 3221 enables a double fastening of the printed circuit board 31 (in particular, fastening between the printed circuit board 31 and the carrier board 321, and fastening between the power component 311 on the printed circuit board 31 and the rectifier housing 322). This improves the locking effect of the shielding assembly 32 on the printed circuit board 31, thereby improving the stability of the installation of the printed circuit board 31 and reducing the risk of the printed circuit board 31 detaching due to vibrations or shocks.

[0045] With reference to Fig. 5 and Fig. 7 In some embodiments, the shielding cover 325 is provided with a first snap-in section 3251 at the edge of the opening, wherein a second snap-in section 3211 is arranged at the outer contour edge of the carrier plate 321. The second snap-in section 3211 is snapped into the first snap-in section 3251 when the shielding cover 325 covers the rectifier housing 322.

[0046] The arrangement of the first snap-in section 3251 and the second snap-in section 3211 enables a double fastening of the shielding cover 325 (in particular, a fixed connection between the shielding cover 325 and the housing and a snap-in connection between the shielding cover 325 and the carrier plate 321). This effectively reduces the risk of the shielding cover 325 detaching under external force, thereby improving the stability of the shielding cover 325 installation and ensuring that the shielding assembly 32 provides reliable electromagnetic shielding for the power component 311 within the printed circuit board 31 at all times.

[0047] In other embodiments, other joining methods such as magnetic attraction or gluing can be used, which is not limited in the present application, and those skilled in the art can select the arrangement according to practical circumstances.

[0048] With reference to Fig. 3, Fig. 6 and Fig. 8 The rectifier housing 322 is provided with a mounting section 3222 configured to accommodate an external cooling fan 200. The rectifier housing 322 is further provided with a through-hole 3223 that is connected to the heat dissipation duct 324, the through-hole 3223 being configured to face the cooling fan 200, so that, under the action of the cooling fan 200, outside air can enter or exit the heat dissipation duct 324 along the through-hole 3223.

[0049] The pre-configuration of the mounting section 3222 and the through-hole 3223 on the rectifier housing 322 saves production and assembly personnel complex drilling or cutting work. The cooling fan 200 can be directly aligned and mounted on the rectifier housing 322, thus reducing the complexity of installing the cooling fan 200 and improving assembly efficiency.

[0050] It is understood that when the cooling fan 200 is operating, external cooling air can enter the heat dissipation duct 324 through the through-hole 3223 under the action of the cooling fan 200. Simultaneously, warmer air within the heat dissipation duct 324 is expelled from the heat dissipation duct 324 through the through-hole 3223 under the action of the cooling fan 200, thereby achieving air circulation within the heat dissipation duct 324.

[0051] This significantly improves the heat dissipation effect of the shielding assembly 32 for the printed circuit board 31, thereby extending the service life of the printed circuit board 31.

[0052] With reference to Fig. 3 and Fig. 5 The shielding assembly 32 further comprises a lining 327, which is installed in the mounting space 323 and abuts the rectifier housing 322, the lining 327 and the rectifier housing 322 together forming the heat dissipation channel 324.

[0053] By using the lining 327 and the rectifier housing 322 together to form the heat dissipation channel 324, the overall weight of the rectifier housing 322 can be reduced. This facilitates the lightweight design of the energy storage device 100. For example, the rectifier housing 322 can be made of materials with high structural strength and resistance to deformation (which are heavier), while the lining 327 can be made of lightweight materials.

[0054] With reference to Fig. 6 and Fig. In some embodiments, the rectifier housing 322 in the heat dissipation channel 324 is provided with a guide ramp 3224 which is configured to gradually approach the circuit board 31 along the direction of flow of the outside air.

[0055] The arrangement of the guide slope 3224 allows, on the one hand, the flow velocity of the outside air to be reduced in order to decrease the risk of airflow separation and turbulence formation at the corners of the heat dissipation channel 324, which could lead to a loss of outside air; on the other hand, the outside air can be guided precisely to the power component 311 on the circuit board 31 in order to improve the heat dissipation effect of the shielding assembly 32.

[0056] In some embodiments, the rectifier housing 322 in the heat dissipation channel 324 is further provided with several distributor plates 3225. The multiple distributor plates 3225 are arranged at intervals on the guide slope 3224, with a distributor channel 3226 formed between two adjacent distributor plates 3225, which is configured to direct the outside air to various locations on the circuit board 31.

[0057] By arranging the distributor plate 3225, the main airflow can be divided into several smaller flows, which are directed along the corresponding distributor channels 3226 to different locations on the printed circuit board 31 in order to achieve heat dissipation for power components 311 at different locations on the printed circuit board 31, which reduces the risk of local overheating of the printed circuit board 31 (which in particular means that some power components 311 generate more heat than others) and thereby improves the heat dissipation effect of the shielding assembly 32.

[0058] Furthermore, the person skilled in the art in this technical field should understand that the above-mentioned embodiments serve only to illustrate the present application and are not intended to limit its scope. Any suitable modifications or variations of the above-mentioned embodiments that remain within the meaning and scope of the present application also fall within the scope of disclosure of the present application.

Claims

[1] Shielding assembly used in an inverter control module, wherein the inverter control module comprises a printed circuit board, characterized by , that the shielding assembly includes the following: a carrier plate designed as a sheet metal part; a rectifier housing installed on the carrier board, wherein the rectifier housing and the carrier board together form a mounting space configured for the installation of the printed circuit board, the printed circuit board being located wholly or partially within the mounting space; wherein, within the mounting space, the rectifier housing is configured to form a heat dissipation channel in the space above the printed circuit board, the space above the printed circuit board referring to a space on a side of the printed circuit board facing away from the carrier board; a shielding cover with an opening, wherein the shielding cover covers the rectifier housing and is firmly connected to the rectifier housing, wherein the edge of the shielding cover at the opening is connected to the outer contour edge of the carrier plate, and wherein the shielding cover, the rectifier housing and the carrier plate form a cage-like structure. [2] Shielding assembly according to claim 1, characterized by , that the shielding cover is provided with a first snap-in section at the edge of the opening, wherein a second snap-in section is arranged at the outer contour edge of the carrier plate, which is configured to snap into the first snap-in section when the shielding cover covers the rectifier housing. [3] Shielding assembly according to claim 1 or 2, characterized bythat the shielding assembly further comprises a support column, wherein one end of the support column is installed on the rectifier housing, while the other end of the support column is configured to penetrate the printed circuit board and is firmly connected to the carrier board; wherein, when the two ends of the support column are connected to the rectifier housing and the carrier board respectively, the support column is configured to press against the printed circuit board. [4] Shielding assembly according to claim 3, characterized by , that the rectifier housing is provided along the penetration direction of the support column with a fastening element configured to be synchronously connected to the power component within the printed circuit board when the support column is firmly connected to the carrier board. [5] Shielding assembly according to one of claims 1 to 3, characterized by, that the rectifier housing is provided with a mounting section configured to accommodate an external cooling fan; wherein the rectifier housing is further provided with a through-hole which is connected to the heat dissipation duct, wherein the through-hole is configured to be opposite the cooling fan, so that under the action of the cooling fan the outside air can enter or exit the heat dissipation duct along the through-hole. [6] Shielding assembly according to claim 5, characterized by that the shielding assembly further comprises a lining which is installed in the mounting space and rests against the rectifier housing, the lining and the rectifier housing together forming the heat dissipation channel. [7] Shielding assembly according to claim 5 or 6, characterized by, that the rectifier housing in the heat dissipation duct is provided with a guide ramp configured to gradually approach the circuit board along the direction of flow of the outside air. [8] Shielding assembly according to claim 7, characterized by , that in the heat dissipation channel the rectifier housing is further provided with several distributor plates, wherein the several distributor plates are arranged at intervals on the guide slope, wherein a distributor channel is formed between two adjacent distributor plates, which is configured to direct the outside air to different locations on the circuit board. [9] Inverter control module, characterized by , comprising a printed circuit board and a shielding assembly according to any one of claims 1 to 8, wherein the printed circuit board is installed in the mounting space in the shielding assembly. [10] Energy storage device, characterized by, that the energy storage device comprises an outer shell, a battery pack and an inverter control module according to claim 9, wherein the battery pack and the inverter control module are each installed in the outer shell, and wherein the battery pack is connected to the inverter control module.

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