System for intelligent power control in highly integrated electronic systems

Abstract

A system for intelligent power control in high-density integrated electronic systems, wherein the system comprises: a semiconductor substrate with a plurality of functional circuit areas; a plurality of sensor units physically distributed over the semiconductor substrate and electrically connected to the plurality of functional circuit areas, each sensor unit comprising at least one sensor element configured to measure electrical and thermal parameters such as voltage, current, switching activity, and temperature, and an analog-to-digital converter circuit configured to generate digitized parameter data;a processing unit that is operationally connected to the plurality of sensor units via a communication link, wherein the processing unit comprises at least one processor and a memory for storing executable instructions and is configured to receive the digitized parameter data, generate a multidimensional state representation of the power and thermal conditions, and determine control signals based on predictive estimation and adaptive optimization; a plurality of power control units distributed across the semiconductor substrate and each assigned to corresponding functional circuit areas, wherein each power control unit comprises a voltage control circuit, current control elements, and switching devices configured to selectively control the power supply depending on the control signals;and a communication network with signal paths and arbitration circuits that enables bidirectional data exchange between the sensor units, the processing unit and the power control units, the system being configured to dynamically adjust local voltage levels, power supply and power control states to achieve a balanced power distribution and thermal stability across the semiconductor substrate.

Description

AREA OF INVENTION The present invention relates to the field of electronic energy management and energy control in integrated circuits, in particular a system for dynamic control of energy distribution, power consumption and thermal behavior in high-density integrated electronic systems such as multi-core processors, system-on-chip architectures, embedded computer devices and high-performance computing platforms. BACKGROUND OF THE INVENTION With the continuous scaling of semiconductor technologies and the increasing integration density of electronic components, modern electronic systems are characterized by significant fluctuations in power consumption, local thermal hotspots, and uneven current distribution between functional units. Conventional power control methods are typically based on static voltage scaling, centralized power management units, or coarse-grained dynamic voltage and frequency scaling mechanisms. However, these are insufficient to handle rapid load fluctuations and finely graduated power requirements in high-density environments. These limitations often lead to inefficient power use, excessive thermal stress, reduced component lifetime, and performance degradation due to voltage dips and power noise.Furthermore, existing systems lack the ability to adaptively adjust power supply to real-time load characteristics, interconnect activity, and local thermal conditions. Therefore, there is a need for an intelligent and distributed power control system that enables real-time data acquisition, predictive analytics, and adaptive control to optimize energy efficiency, reliability, and performance in high-density integrated electronic systems. The rapid development of high-density integrated electronic systems, including multi-core processors, system-on-chip architectures, and heterogeneous computing platforms, has led to a significant increase in power density and operational complexity. With decreasing transistor size and increasing integration levels, power consumption no longer scales proportionally to performance gains. This results in increased heat dissipation and local hotspots on the semiconductor substrate. Conventional power management approaches attempt to address these problems through techniques such as static voltage scaling, centralized voltage regulators, and dynamic voltage and frequency scaling (DVFS). Static voltage scaling methods are based on predefined operating conditions and cannot adapt to load fluctuations in real time. This leads either to excessive power consumption during periods of low utilization or insufficient power supply during peak loads.Centralized voltage regulator architectures also cause latency and inefficiencies because they cannot respond quickly enough to spatially distributed and rapidly changing power requirements of multiple functional units. Dynamic voltage and frequency scaling (DVFS) has become widely adopted as a more flexible solution, as it allows systems to adjust their operating frequency and supply voltage to the workload. However, DVFS mechanisms typically operate at a coarse granular level, often at the level of entire processor cores or subsystems, and cannot adequately account for fine-grained fluctuations in power requirements within smaller functional areas. Furthermore, DVFS relies heavily on predictive heuristics or predefined guidelines, which may not accurately capture transient load profiles, leading to suboptimal trade-offs between power consumption and performance. Another limitation arises from the latency of frequency and voltage transitions, which can cause instability, timing violations, or performance degradation in time-critical applications. In addition to DVFS, power gating techniques have also been employed to reduce leakage current by selectively disabling inactive circuit blocks. While power gating effectively reduces static power consumption, it presents challenges regarding wake-up delay, state retention, and inrush current management. Frequent transitions between active and inactive states can lead to voltage fluctuations and reliability issues, particularly in systems with highly dynamic workloads. Furthermore, existing power gating implementations often lack coordination with thermal management mechanisms, which can result in uneven temperature distribution and a potential degradation of device reliability over time. Recent advances have introduced distributed power management systems and integrated voltage regulators, aiming for improved responsiveness and scalability. These approaches utilize multiple local controllers positioned closer to load circuits, thereby reducing voltage drop and improving transient response. However, such systems often operate based on limited local information and lack a comprehensive view of system-wide power and thermal conditions. This fragmented decision-making can lead to conflicting control actions, inefficient power distribution, and an inability to effectively prevent thermal hotspots. Thermal management solutions, including dynamic thermal throttling and heat-dependent task scheduling, have been integrated into modern systems to prevent overheating. These methods typically react to temperature thresholds rather than proactively preventing heat buildup, limiting their effectiveness in high-power scenarios. Furthermore, the lack of integration between power control and thermal control mechanisms leads to delayed responses and inefficient coordination between electrical and thermal domains. Overall, existing power control solutions for high-density integrated electronic systems exhibit limitations in terms of adaptability, granularity, coordination, and predictive capability. These shortcomings underscore the need for an intelligent, real-time, and distributed power control system capable of integrating electrical, thermal, and load-dependent information to optimize system performance, energy efficiency, and reliability. SUMMARY OF THE INVENTION The present invention relates to a system for intelligent power control in high-density integrated electronic systems. Several distributed sensor units monitor electrical and thermal parameters in different areas of an integrated electronic structure. A processing unit is connected to the sensor units and analyzes real-time data using predictive modeling and adaptive control algorithms to determine optimal power distribution strategies. The system also includes several controllable power control units distributed throughout the electronic system, each of which can independently adjust voltage levels, current flow, and power shutdown states in response to control signals generated by the processing unit.A communication network connects the sensor units, the processing unit, and the power control units to enable low-latency data exchange and coordinated control actions. The system also performs dynamic load balancing, thermally controlled power redistribution, and transient suppression to ensure stable operation under varying load conditions. The invention also includes a device integrated into a machine or assembly, in whose housing the intelligent power control system is embedded. This enables greater energy efficiency and operational reliability of the machine. The present invention aims to provide an intelligent power control system for high-density integrated electronic systems, enabling adaptive real-time control of power distribution based on dynamically varying electrical, thermal, and load conditions. The invention overcomes the limitations of conventional energy management methods through a coordinated and distributed control mechanism that allows for fine-tuned adjustment of voltage and current across multiple functional areas within an integrated electronic structure. A further objective of the present invention is to provide a predictive power control system through continuous acquisition and analytical processing of system parameters in order to anticipate future power requirements and thermal fluctuations. This predictive capability is intended to reduce the latency of the control response, minimize voltage fluctuations, and prevent the formation of thermal hotspots, thereby improving the operational stability and reliability of the device. A further objective of the invention is to provide a system that achieves higher energy efficiency by dynamically allocating power resources exclusively to active or high-demand areas and simultaneously reducing or switching off the power supply to underutilized areas of the electronic system. This selective power distribution is intended to minimize unnecessary energy consumption and leakage losses, thereby extending the service life of the device and reducing overall energy consumption. A further objective of the present invention is to provide a system that integrates electrical power control with thermal management in a unified control framework, thereby enabling synchronized decision-making that takes both power consumption and heat dissipation into account. This integrated approach ensures a uniform temperature distribution throughout the system and reduces performance losses due to thermal stress. A further objective of the invention is to provide a system that enables scalable implementation across various integration levels, including multi-core processors, system-on-chip architectures, and large-scale computing systems, without significant performance degradation or increased control complexity. The system is designed to ensure efficient operation even with an increasing number of functional units and connections. Another objective of the present invention is to provide a system with improved fault tolerance and reliability by integrating mechanisms for detecting abnormal performance patterns, voltage instabilities and thermal anomalies, and by enabling automatic reconfiguration of power supply paths to maintain continuous operation under fault conditions. A further objective of the invention is to provide a device integrated into a machine or component group, in which the intelligent power control system is embedded in such a way as to improve the overall efficiency, stability, and service life of the machine. The invention aims to ensure seamless interaction between the power control system and external components, thereby enabling optimized performance in real-world operating environments. Another objective of the present invention is to provide a system that can learn and adapt over time by using historical operating data to refine the control strategies and thereby continuously improve the efficiency of the power control and the responsiveness of the system under different operating conditions. BRIEF DESCRIPTION OF THE DRAWING These and other features, aspects and advantages of the present invention will be better understood if the following detailed description is read with reference to the accompanying drawing, in which the same symbols represent the same parts: Fig. 1 shows a block diagram of a system for intelligent power control in high-density integrated electronic systems. Furthermore, those skilled in the art will recognize that the elements in the drawing are simplified and not necessarily drawn to scale. For example, the flowcharts illustrate the process by highlighting the main steps to facilitate understanding of the present disclosure. With regard to the construction of the device, one or more components may be represented in the drawing by conventional symbols. The drawing may show only those specific details relevant to understanding the embodiments of the present disclosure, so as not to clutter the drawing with details that are already apparent to those skilled in the art from the description contained herein. DETAILED DESCRIPTION OF THE INVENTION To facilitate understanding of the principles of the invention, reference is made below to the embodiment shown in the drawing, which is described using specific terms. It is understood, however, that this does not limit the scope of protection of the invention. Rather, modifications and further developments of the depicted system, as well as further applications of the inventive principles shown therein, are conceivable, insofar as they would normally occur to a person skilled in the art in the field of the invention. It will be clear to those skilled in the art that the foregoing general description and the following detailed description are exemplary and explanatory of the invention and are not to be understood as a limitation thereof. References to “an aspect”, “another aspect”, or similar phrases in this description mean that a particular feature, structure, or property described in connection with the embodiment is included in at least one embodiment of the present disclosure. Therefore, phrases such as “in one embodiment”, “in another embodiment”, and similar expressions in this description may, but do not necessarily, all refer to the same embodiment. The terms "includes," "comprehensive," or similar expressions denote non-exclusive inclusion. Thus, a procedure or method containing a list of steps does not only include those steps but may also include further steps not explicitly listed or inherent in the procedure or method. Likewise, the statement "includes..." for one or more devices, subsystems, elements, structures, or components, without further limitations, does not preclude the existence of other devices, subsystems, elements, structures, or components. Unless otherwise defined, all technical and scientific terms used herein have the same meanings generally known to those skilled in the art in the field to which this invention belongs. The systems, methods, and examples described herein serve only for illustration and are not to be understood as limiting. Embodiments of the present disclosure are described in detail below with reference to the attached drawing. Figure 1 shows a block diagram of a system for intelligent power control in high-density integrated electronic systems. The system comprises: a semiconductor substrate 102 with multiple functional circuit areas; multiple sensor units 104, which are physically distributed over the semiconductor substrate and electrically connected to the functional circuit areas, each sensor unit comprising at least one sensor element for measuring electrical and thermal parameters such as voltage, current, switching activity, and temperature, as well as an analog-to-digital converter circuit for generating digitized parameter data; a processing unit 106, which is connected to the sensor units via a communication link and comprises at least one processor and a memory for storing executable instructions.The processing unit receives the digitized parameter data, generates a multidimensional state representation of the power and temperature conditions, and determines control signals based on predictive estimation and adaptive optimization; several power control units 108 are distributed over the semiconductor substrate and each is assigned to the corresponding functional circuit areas, with each power control unit comprising a voltage control circuit, current control elements, and switching elements for selective control of the power output depending on the control signals.and a communication structure 110 with signal paths and arbitration circuits configured to enable bidirectional data exchange between the numerous sensor units, the processing unit and the numerous power control units, the system being configured to dynamically adjust local voltage levels, power supply and power gating states to achieve a balanced power distribution and thermal stability across the semiconductor substrate. In one embodiment, each sensor unit 104 further comprises a calibration circuit 105 configured to compensate for process variations and sensor drift by applying correction coefficients to the measured electrical and thermal parameters prior to analog-to-digital conversion. In one embodiment, the processing unit 106 further comprises a prediction circuit 107 which is configured to perform a temporal correlation analysis of the digitized parameter data in order to predict the short-term power requirements for each functional circuit area and to generate predictive control signals. In one embodiment, each power control unit 108 further comprises a plurality of parallel voltage regulator stages configured to operate in a nested manner to reduce the residual ripple of the output voltage and improve the transient response. In one embodiment, the communication structure 110 further comprises a hierarchical bus architecture with a plurality of local connection segments and a global connection segment, wherein the hierarchical bus architecture is configured to reduce communication latency and conflicts between distributed components. In one embodiment, the processing unit 106 further comprises a circuit 112 for evaluating constraints, which is configured to enforce predefined limits such as the maximum permissible temperature, voltage stability margins and current thresholds when generating the control signals. In one embodiment, each power control unit 108 further comprises a power control circuit 114 with high-speed switching transistors configured to selectively interrupt the power supply to inactive functional circuit areas and restore the power supply based on the control signals. In one embodiment, the sensor units 104 are configured to operate at a sampling frequency that exceeds a predefined threshold in order to detect temporary fluctuations in electrical and thermal parameters, thus enabling high-resolution monitoring of system behavior. In one embodiment, the processing unit 106 further comprises a fault detection circuit which serves to detect abnormal patterns in the digitized parameter data that indicate voltage instability, excessive current consumption or thermal anomalies, and to generate correction control signals for reconfiguring the power supply paths. In one embodiment, the system further comprises a housing structure configured to enclose the semiconductor substrate, the plurality of sensor units, the processing unit, and the plurality of power control units. The housing structure includes heat dissipation elements and electrical interface connections configured to allow the system to be integrated into a machine or structural assembly to improve operational efficiency and reliability. The present invention describes an intelligent power control system implemented in a high-density integrated electronic system. This system comprises several interconnected functional units arranged on a semiconductor substrate or in a multilayer electronic structure. The system includes multiple sensor units physically distributed across different areas of the electronic system. Each sensor unit is configured to measure at least one parameter, selectable from voltage level, current, power consumption, switching activity, and temperature. The sensor units contain analog-to-digital converter circuits for generating digitized parameter data and are designed for operation at high sampling frequencies to detect transient changes in system behavior. A processing unit is operationally coupled to the sensor units via a communication link and configured to receive the digitized parameter data. The processing unit comprises one or more computational elements capable of executing adaptive control algorithms, predictive modeling routines, and optimization procedures. It generates a multidimensional performance state representation based on spatial and temporal correlations of the acquired parameters. This representation is then further processed using predictive estimation methods to forecast the future power requirements and thermal conditions of each functional unit. The processing unit also includes a mechanism for generating control signals, which determines optimal power distribution strategies based on predefined boundary conditions such as maximum permissible temperature thresholds, voltage stability margins, and power requirements. The control signals are transmitted to several distributed power control units, each assigned to a corresponding functional area of ​​the electronic system. Each power control unit comprises voltage regulation circuits, current limiting components, and switching elements that selectively activate or deactivate the power supply paths. In response to the control signals, the power control units are capable of finely graduated voltage scaling, local power shutdown, and dynamic current adjustment. The system also includes a communication infrastructure configured for bidirectional data exchange between the sensor units, the processing unit, and the power control units. This communication infrastructure incorporates low-latency signal paths and arbitration logic to ensure synchronized operation and minimal communication overhead. The system is designed to implement distributed decision amplification, coordinating local control measures with global optimization goals to achieve a uniform power distribution across the entire electronic system. During operation, the sensor units continuously monitor electrical and thermal parameters and transmit the digitized data to the processing unit. This unit analyzes the data to identify patterns indicating load changes, power spikes, or heat buildup. Based on this analysis, the processing unit generates control signals to adjust the operating states of the power controllers, thereby redistributing power to areas of high demand while simultaneously reducing the supply to underutilized areas. The system also incorporates overvoltage suppression mechanisms to minimize voltage fluctuations and current spikes through dynamic adjustment of capacitors and switching sequences. The invention further relates to a device integrated into a machine or a component group, the intelligent power control system of which is encapsulated in a housing with thermal management elements, electrical interfaces, and mechanical support structures. The device is designed for connection to external power sources and load components, thus enabling adaptive power control in real time within the machine. Integrating the system into the component group improves operational efficiency, reduces thermal stress, and extends the service life of the electronic components. The system is also configured for hierarchical energy management, where global control decisions are complemented by local control measures to ensure the scalability of large integrated systems. Furthermore, the processing unit can integrate learning-based adaptation mechanisms to optimize control strategies over time based on historical operating data. Additionally, the system supports fault detection and correction by identifying abnormal power patterns and reconfiguring power supply paths to maintain system integrity. Accordingly, the present invention offers a technically advanced and efficient solution for intelligent power control in high-density integrated electronic systems, thus enabling improved energy efficiency, thermal stability and operational safety in modern electronic devices and machines. The present invention relates to a system for intelligent power control in high-density integrated electronic systems. System operation is controlled by a coordinated algorithm for acquisition, analysis, prediction, and control, which is executed in a processing unit connected to distributed hardware components. The semiconductor substrate comprises several functional circuit areas with spatially and temporally varying power requirements. Multiple sensor units continuously acquire electrical and thermal parameters of these areas. Each sensor unit performs signal conditioning and analog-to-digital conversion to generate high-resolution, digitized parameter data streams, which are transmitted to the processing unit with minimal latency via the communication infrastructure. After receiving the digitized parameter data, the processing unit performs preprocessing steps such as normalization, calibration, and noise filtering to ensure the accuracy and consistency of the data acquired from heterogeneous sensors. The calibrated data is then organized into a multidimensional state matrix that maps instantaneous voltage levels, current consumption, switching activity, and temperature distribution across all functional areas of the circuit. The processing unit executes a temporal correlation algorithm that analyzes historical and real-time data sequences to identify trends, periodic patterns, and transient deviations.This temporal analysis is combined with a spatial correlation analysis, in which the interactions between adjacent or functionally related circuit areas are evaluated to determine the propagation of power requirements and thermal effects across the semiconductor substrate. Based on the correlated data, the processing unit uses a forecasting algorithm that considers weighted historical data, real-time trends, and boundary conditions to generate a prediction of future power requirements. The algorithm adaptively weights current measurements to prioritize rapidly changing conditions while preserving long-term behavioral patterns for stability. The predicted power requirements are then evaluated against predefined operating limits, such as maximum permissible temperature thresholds, voltage stability margins, and current limits. A boundary condition evaluation routine ensures that every calculated control decision remains within safe operating limits, thus preventing equipment malfunctions or failures. After predicting and validating the boundary conditions, the processing unit executes an optimization algorithm that determines the optimal power distribution across the circuit's various functional areas. The optimization process uses an objective function that minimizes overall power consumption while maintaining power requirements and thermal equilibrium. The algorithm iteratively fits different power distribution vectors and compares them to the multidimensional state representation until a convergent solution is reached. The resulting optimal control signals define specific voltage levels, power supply limits, and power shutdown states for each area. These control signals are transmitted to the respective power control units via the communication infrastructure. Each power control unit interprets the received control signals and performs local control through voltage adjustment, current modulation, and selective activation or deactivation of power shutdown circuits. The voltage regulation circuits within each unit operate in a nested configuration to reduce ripple and improve transient response, while high-speed switching elements enable rapid transitions between power states. The distributed arrangement of the power control units allows for fine-grained control at the level of individual functional areas, thus ensuring efficient energy utilization. The algorithm also includes a transient disturbance suppression mechanism that monitors rapid voltage and current fluctuations. Upon detecting transient spikes or dips, the processing unit dynamically adjusts the control signals to stabilize the system by coordinating switching sequences and, if necessary, activating decoupling capacitors. Simultaneously, a fault detection routine continuously evaluates incoming parameter data to identify anomalies indicative of faults such as short circuits, excessive leakage currents, or thermal runaway. When such anomalies are detected, the processing unit initiates a reconfiguration sequence that redistributes power supply paths, isolates affected areas, and maintains overall system functionality. The communication infrastructure plays a crucial role in the synchronized operation of the sensor, processing, and power control units. It utilizes hierarchical arbitration and prioritization procedures to ensure the timely transmission of critical data and control signals, thus enabling the algorithm's real-time capability. Furthermore, the processing unit features an adaptive learning mechanism that updates internal model parameters based on historical operational data, thereby continuously improving prediction accuracy and optimization efficiency. The system is encapsulated in a housing with integrated heat dissipation elements such as heat spreaders and conductive interfaces, enabling effective heat removal from high-density areas. Electrical interface connections facilitate the system's integration into larger machines or assemblies. The intelligent power control algorithm operates continuously to increase energy efficiency, ensure thermal stability, and extend the service life of the electronic system. Through the coordinated interaction of sensors, predictive analysis, boundary value evaluation, and distributed control, the invention achieves a highly responsive and efficient power control mechanism suitable for modern integrated electronics environments. The system is implemented using physically realizable electronic and electromechanical structures integrated into a semiconductor and component assembly. The semiconductor substrate comprises structured conductive layers, doped areas, and compound metallizations that form the multitude of functional circuit areas. The sensor units consist of discrete and integrated sensor elements such as voltage taps, current-sensing amplifiers, thermodiodes or resistive temperature sensors, and switching activity monitors. Each of these elements is coupled to analog input circuits and analog-to-digital converters, which consist of comparators, reference generators, and SAR or sigma-delta converter architectures.The processing unit is implemented by one or more microelectronic processors, logic arrays, and embedded memory elements, manufactured using standard semiconductor processes and interconnected via physical buses and clock distribution networks. The voltage regulators comprise hardware voltage regulators with inductors, capacitors, switching transistors, driver circuits, and current-limiting components to ensure controlled power supply. The communication infrastructure consists of conductive interconnects, routing switches, multiplexers, and arbitrator circuits that enable signal transmission between components. Calibration, prediction, constraint evaluation, and fault detection circuits are implemented using dedicated logic gates, arithmetic units, registers, and state machines, configured either within the processing unit or as auxiliary circuits.The power shutdown includes high-speed switching transistors and drivers that are directly connected to the power supply lines for selective isolation of circuit sections. The housing consists of mechanical enclosures, heat spreaders, thermal interface materials, and electrical connectors that physically support the electronic components and integrate them into a machine or assembly. This ensures that all elements function as fixed hardware components. The drawing and the preceding description illustrate embodiments. Those skilled in the art will recognize that one or more of the described elements can be combined to form a single functional element. Alternatively, certain elements can be divided into several functional elements. Elements of one embodiment can be added to another. For example, the process flows described here can be modified and are not limited to the manner described herein. Furthermore, the actions of a flowchart need not be performed in the sequence shown; nor do all actions necessarily need to be carried out. Actions that do not depend on other actions can be performed in parallel with the other actions. The scope of protection of the embodiments is in no way limited by these specific examples. Numerous variations, whether explicitly stated in the description or not, such as...Differences in structure, dimensions, and materials are possible. The scope of protection of the embodiments is at least as comprehensive as described by the following claims. The advantages, other benefits, and problem solutions have been described above with reference to specific embodiments. However, the advantages, benefits, problem solutions, and any components that can effect or enhance an advantage, benefit, or solution are not to be construed as critical, necessary, or essential features or components of the claims. REFERENCES 100 A system for intelligent power control in highly integrated electronic systems. 102 Semiconductor substrate 104 Multiple sensor units 106 Processing unit 108 Multiple power control units 110 Communication fabric 112 Constraint evaluation circuit 114 Power control circuit

Claims

A system for intelligent power control in high-density integrated electronic systems, wherein the system comprises: a semiconductor substrate with a plurality of functional circuit areas; a plurality of sensor units physically distributed over the semiconductor substrate and electrically connected to the plurality of functional circuit areas, each sensor unit comprising at least one sensor element configured to measure electrical and thermal parameters such as voltage, current, switching activity, and temperature, and an analog-to-digital converter circuit configured to generate digitized parameter data;a processing unit that is operationally connected to the plurality of sensor units via a communication link, wherein the processing unit comprises at least one processor and a memory for storing executable instructions and is configured to receive the digitized parameter data, generate a multidimensional state representation of the power and thermal conditions, and determine control signals based on predictive estimation and adaptive optimization; a plurality of power control units distributed across the semiconductor substrate and each assigned to corresponding functional circuit areas, wherein each power control unit comprises a voltage control circuit, current control elements, and switching devices configured to selectively control the power supply depending on the control signals;and a communication network with signal paths and arbitration circuits that enables bidirectional data exchange between the sensor units, the processing unit and the power control units, the system being configured to dynamically adjust local voltage levels, power supply and power control states to achieve a balanced power distribution and thermal stability across the semiconductor substrate. System according to claim 1, wherein each sensor unit further comprises a calibration circuit configured to compensate for process variations and sensor drift by applying correction coefficients to the measured electrical and thermal parameters prior to analog-to-digital conversion. System according to claim 1, wherein the processing unit further comprises a prediction circuit configured to perform a temporal correlation analysis of the digitized parameter data in order to predict the short-term power requirements for each functional circuit area and to generate predictive control signals. System according to claim 1, wherein each power control unit further comprises a plurality of parallel voltage regulator stages operating in a nested manner to reduce the residual ripple of the output voltage and improve the transient response. System according to claim 1, wherein the communication structure further comprises a hierarchical bus architecture with a plurality of local connection segments and a global connection segment, wherein the hierarchical bus architecture is configured to reduce communication latency and conflicts between distributed components. System according to claim 1, wherein the processing unit further comprises a circuit for evaluating constraints, configured to enforce predefined limits including maximum permissible temperature, voltage stability margins and current thresholds when generating the control signals. System according to claim 1, wherein each power control unit further comprises a power control circuit with high-speed switching transistors configured to selectively interrupt the power supply to inactive functional circuit areas and restore the power supply based on the control signals. System according to claim 1, wherein the sensor units are configured to operate at a sampling frequency that exceeds a predefined threshold in order to detect temporary fluctuations in electrical and thermal parameters and thereby enable high-resolution monitoring of the system behavior. System according to claim 1, wherein the processing unit further comprises a fault detection circuit configured to detect abnormal patterns in the digitized parameter data that indicate voltage instability, excessive current consumption or thermal anomalies, and to generate correction control signals to reconfigure the power supply paths. System according to claim 1, wherein the system further comprises a housing structure configured to enclose the semiconductor substrate, the plurality of sensor units, the processing unit and the plurality of power control units, wherein the housing structure comprises heat dissipation elements and electrical interface connections configured to allow the system to be integrated into a machine or structural assembly to improve operational efficiency and reliability.

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