RFID LABEL

Description

[0001] The invention relates to an environmentally friendly, self-adhesive, and flexible RFID tag for use, in particular, on curved metallic surfaces and on containers filled with liquids in the UHF frequency range (860–960 MHz), and to a method for its production. In the following description, this RFID tag is referred to as an on-metal tag or OM tag.

[0002] Passive RFID tags typically consist of a printed or printable cover material, an underlying inlay containing a chip and antenna on a PET substrate, and a suitable adhesive for bonding to the object's surface. The chip stores the data, such as a serial number, which is then read by a UHF reader via the antenna. A metallic environment or liquids in close proximity to the RFID tag can negatively impact its read range by disrupting the antenna's signal, potentially resulting in no reading at all if the tag is applied directly to an electrically conductive surface or to containers filled with liquids.

[0003] Several methods are already known for manufacturing RFID inlays for the UHF frequency range: In one method, the antenna is directly mounted onto the substrate. This means that the antenna is already present as a single, integrated component. Manufacturing can be done by etching, printing, or stamping. The chip is then placed at the designated location and bonded in place. This process requires very tight tolerances. Naturally, this leads to specific machine requirements and higher costs. The antenna as a whole, even though it is a single piece, typically consists of a loop—a smaller, centrally located antenna that is connected to the main components.At least in terms of radio communication, it uses a secondary antenna, which is larger and ensures that the RFID tag can be read from a greater range. In this first example, there is a galvanic connection between the loop and the secondary antenna; it is a single component, and the only separate component is the chip.

[0004] A second variant also uses a loop (primary antenna) and a secondary antenna, both of which are formed as a single unit, thus forming a galvanic connection. The difference from the first example is that the chip is not applied directly to the loop, but to an intermediate component called a strap, or sometimes a butterfly due to its design with two wing-like extensions. This strap is provided as a narrow strip, or in large numbers along a strip, and the chip is then applied to the strap with very high precision. The strap is then pressed onto the loop (primary antenna) like a sticker, creating a galvanic contact. With this technique, the accuracy of the strap's positioning on the primary antenna is crucial for the inlay's functionality.On the cost side, this embodiment, like the aforementioned first embodiment, costs approximately a few euro cents per unit, depending on the design and size of the secondary antenna, for a quantity on the order of millions.

[0005] In a third variant, the UHF loop, i.e., the primary antenna, is manufactured first. The chip is then precisely positioned at its designated location on the UHF loop. This serves as an intermediate component or intermediate product that can be stored in large quantities on a reel. The secondary antenna is then manufactured separately, and this can be produced using various methods such as etching, stamping, or printing. The key feature here is that the UHF loop is not galvanically connected to the secondary antenna during assembly, but rather coupled to it via electromagnetic coupling. Another special characteristic of this third embodiment is that, due to the lack of a galvanic connection between the UHF loop and the secondary antenna, the UHF loop can be positioned at a distance from the secondary antenna.This means, for example, that the secondary antenna is located on one side of a sheet of paper or a piece of cardboard, and the UHF loop on the other, allowing for a separation ranging from a few tenths of a millimeter down to 1 mm, and even up to a maximum of 10 mm. With the two previously mentioned designs, such separation is not possible due to the galvanic connection. Because of the separate construction, the costs for this technology are somewhat higher than for the two previous variants. However, the modular design offers significant advantages for design and manufacturing, such as the use of dual-frequency loops with a single chip that can operate in both the UHF (860–960 MHz) and RF (13.56 MHz) ranges.In addition to the UHF loop, the chip is also connected to an RF antenna and can be read by UHF or RF read / write devices, such as an NFC-enabled smartphone. The loop, referred to collectively as the UHF loop, can therefore also be implemented as a dual-frequency loop and is electromagnetically coupled to the secondary antenna in the UHF frequency band.

[0006] Various methods are known from the state of the art for attaching and reading an RFID label on a metallic surface or on containers filled with liquids: Create distance to the metallic surface using air (rigid OM tags), foam, or absorber materials; design the OM tag as a flag tag, i.e., the tag stands out from the surface like a flag; integrate the antenna into the metallic object as a slot antenna; design and layout of the UHF antenna as a PIFA antenna (Planar Inverted F Antenna) with a metallic substrate to shield the background.

[0007] The starting point of the invention is the flexible UHF on-metal tags described as prior art, with a directly contacted, etched aluminum UHF antenna on a PET substrate, folded as a PIFA antenna and with an approximately 2 mm thick foam layer between the conductive surfaces of the antenna, with the following disadvantages: OM tags are not flexible. Due to the external conductive antenna surfaces, when OM tags are applied to a curved surface, the internal stresses become so great that creases form in the tag. Over time, the material's restoring forces cause the tag to detach or straighten. OM tags are unprinted after production and are preferably printed and coded using a thermal transfer printer. Standard printers can only print on labels up to 0.3 mm thick; for 2 mm thick OM tags, the printers must be significantly modified. The print quality is usually poor. When coding OM tags in a thermal transfer printer, care must be taken to ensure that the lower part of the metallic OM antenna does not act as a shield and interfere with the coding process. The processes used to manufacture the antennas and the materials employed are not environmentally friendly.Due to the complex manufacturing and processing processes and the use of PET films, OM tags are relatively expensive.

[0008] An RFID label conforming to claims 7 and 8 is known from JP 2018 078525 A. An RFID label conforming to claim 9 is known from CN 110 110 833 A. Further RFID labels are known from CN 103 065 187 A, US 2011 / 017833 A1, JP 2020 046834 A, EP 2 535 849 A1 and EP 3 407 262 A1.

[0009] Based on this, the object of the invention is to provide an OM tag that is as environmentally friendly, cost-effective, thin and flexible as possible.

[0010] To solve this problem, the combinations of features specified in the independent claims are proposed. Advantageous embodiments and further developments of the invention are described in the dependent claims.

[0011] According to the invention, the manufacturing process in a first variant comprises the following steps: Punching out the secondary antenna from a conductive metallic layer, preferably a self-adhesive aluminum foil, and covering the secondary antenna with a preferably transparent self-adhesive film, in particular a polypropylene or polyethylene film; punching out a bridge from a self-adhesive foam film; applying the primary antenna to the covered secondary antenna at a designated position and laminating a self-adhesive covering material onto a portion of the top surface of the covered secondary antenna; and punching out a bridge from a self-adhesive foam film; applying the primary antenna to the covered secondary antenna at a designated position and laminating a self-adhesive covering material onto a portion of the top surface of the covered secondary antenna;and applying an adhesive to a section of the top of the covered secondary antenna, laminating the primary and secondary antenna unit onto the self-adhesive foam film, and punching out the OM tag intended for later folding.

[0012] According to a second variant of the invention, the manufacturing process comprises the following steps: Punching out the secondary antenna from a conductive metallic layer, preferably a self-adhesive aluminum foil, and covering the secondary antenna with a transparent self-adhesive film; in particular a polypropylene or polyethylene film; punching out a bridge from a self-adhesive foam film; laminating a self-adhesive cover material onto a portion of the top surface of the self-adhesive secondary antenna and applying an adhesive to a portion of the top surface of the self-adhesive secondary antenna, laminating onto the self-adhesive foam film and punching out the UHF decoupler intended for later folding; manufacturing a UHF loop label; and applying the UHF loop label to the UHF decoupler to form the RFID label intended for later folding.

[0013] According to a third variant of the invention, the manufacturing process comprises the following steps: Manufacturing a UHF inlay with chip as a single-piece component, wherein the UHF antenna is applied to a paper or foil substrate by etching, printing or die-cutting and the UHF chip or UHF strap is bonded directly to the UHF antenna, die-cutting a bridge from a self-adhesive foam sheet, laminating a self-adhesive cover material onto a portion of the top of the UHF inlay and laminating a transfer film onto the entire underside of the UHF inlay, and applying an adhesive to a portion of the top of the self-adhesive UHF inlay, laminating onto the self-adhesive foam sheet and die-cutting the OM tag intended for later folding.

[0014] The OM tag according to the first manufacturing variant is characterized by a layered structure, by a siliconized carrier material with a first adhesive layer, a foam film layer, advantageously with a centrally or off-center arranged groove as a subsequent folding aid, a second adhesive layer, a secondary antenna, a third adhesive layer, a film layer, a fourth adhesive layer with which a primary antenna with a chip is bonded to the film layer, a fifth adhesive layer with which the printable cover material is bonded to the film layer, at least partially overlapping the primary antenna, and a sixth adhesive layer with which the OM tag is to be attached to a surface, wherein the sixth adhesive layer is covered with a siliconized carrier material.

[0015] The OM tag according to the second manufacturing variant according to the invention is characterized by a siliconized carrier material, a first adhesive layer, a foam film layer, advantageously with a centrally or eccentrically arranged groove as a subsequent folding aid, a second adhesive layer, a secondary antenna, a third adhesive layer, a film layer, a fourth adhesive layer, a layer of cover material, a fifth adhesive layer with which the OM tag is to be attached to a surface, wherein the fifth adhesive layer is covered with a siliconized carrier material, and a UHF loop label.

[0016] The OM tag according to the third manufacturing variant of the invention is characterized by a siliconized carrier material, a first adhesive layer, a foam film layer, advantageously with a centrally or eccentrically arranged groove as a subsequent folding aid, a second adhesive layer, a UHF inlay as a one-piece component, a third adhesive layer, a layer of cover material, a fourth adhesive layer with which the OM tag is to be attached to a surface, wherein the fourth adhesive layer is covered with a siliconized carrier material.

[0017] The OM-Tag preferably consists of a small primary antenna with a galvanically connected UHF chip, the UHF loop, and a foldable secondary antenna. When folded, the secondary antenna acts as a λ / 4 radiator on the curved, metallic surface, providing the necessary range for the read or write function. The foldable secondary antenna, with the foam spacer, decouples from the metallic surface, similar to a PIFA (Planar Inverted F) antenna, and is hereinafter referred to as the OM antenna. The OM-Tag can only be used on metallic surfaces when folded, as this creates the necessary gap of approximately 2 mm between the antenna elements. The UHF loop and the OM antenna are not galvanically connected. The coupling between the UHF loop and the OM antenna is achieved via an electromagnetic field.

[0018] Providing an unfolded OM tag offers the user the advantage that the tag can be applied to both flat and curved surfaces without creating significant internal stresses in the material that could cause warping or unwanted detachment. For application to flat surfaces, it is recommended to remove the tag from its backing paper, fold it into its final shape, and then apply it to the surface. For application to curved surfaces, however, it is advantageous to first apply the adhesive side of the tag to the curved surface after removing it from its backing paper, and only then fold it.The section of the siliconized carrier film that covered the adhesive area for the surface can be used as an anti-adhesion barrier before folding to press down the first wing of the OM tag. This brings the material layers together without creating internal stresses.

[0019] In a further embodiment of the invention, two wings of the unfolded label formed by the groove have different lengths, such that when the label is applied to a curved surface, the longer wing is folded over the first applied shorter wing and covers it with a correspondingly larger radius of curvature without tension or distortion, whereby, due to the greater length of the second wing, the free wing ends of the label are flush with each other.

[0020] The primary and secondary antennas are preferably printed or die-cut and arranged on paper or a transparent film, preferably a PP or PE film made from recycled material. This makes the OM tag particularly sustainable and environmentally friendly.

[0021] The preferred two-part design, consisting of a UHF loop and an OM antenna, allows for the use of different OM antenna formats with the same UHF loop. The UHF loop can be mass-produced as a standard component. The OM antennas or decouplers can be manufactured on standard machines without special chip processing preparations. This results in particularly cost-effective production of the OM tags.

[0022] The self-adhesive top layer laminated in production step 3 can also be processed as a printed and serialized cover layer with barcodes, Data Matrix codes, or serial numbers. This eliminates the need for subsequent, time-consuming printing and serialization in a thermal transfer printer. The OM tags can be encoded contactlessly using a barcode scanner and UHF read / write unit in a simple roll-to-roll process. As a pre-printed cover layer on a digital printing press, the print quality is generally better than in a subsequent thermal transfer printer or other label printer.

[0023] Another way to manufacture the OM tags is to produce the UHF loops separately as small UHF loop labels with printed, serialized and coded chips, and to apply them to the die-cut and not yet folded OM antenna using a label dispenser in a roll-to-roll process.

[0024] The invention will now be explained in more detail with reference to exemplary embodiments shown schematically in the drawing. The drawing shows... Fig. 1 shows a first manufacturing step for producing the secondary antenna; Fig. 2 shows a second manufacturing step for preparing a foam film as a subsequent substrate for the primary and secondary antennas; Fig. 3 shows a third manufacturing step in which the primary antenna is applied to the secondary antenna; Fig. 4 shows a fourth manufacturing step in which the primary and secondary antennas are applied to the foam film substrate; Fig. 5 shows a cross-section through a foldable OM tag; Figs. 6 and 7 show alternative manufacturing steps to those shown in Fig. 3 and 4 steps shown; Fig. 8 a cross-section through a with the in Fig. 6 and 7The OM antenna produced in the steps shown; Figs. 9 and 10 show the manufacturing steps for producing a UHF loop label and applying it to the OM antenna according to the instructions. Fig. 8 for the formation of an OM tag; Fig. 11 shows a cross-section through the OM tag according to Fig. 10 Figs. 12 and 13 show alternative manufacturing steps to those described in Fig.3 and 4 steps shown; Fig. 14 a cross-section through a with the in Fig.12 and 13 The foldable OM tag produced in the steps shown; Figs. 15a to f the procedure for sticking the OM tag onto a flat surface; and Figs. 16a to j the procedure for sticking the OM tag onto a cylindrically curved surface.

[0025] In the Fig. 1 In the schematically depicted manufacturing step of an OM tag, which is particularly suitable for attachment to metallic objects, a self-adhesive aluminum foil 10 is first fed from a roll 12 to a printing station 14, where a print mark is printed onto the foil 10 at regular intervals as a later reference mark in subsequent manufacturing steps. The secondary antenna is then formed in a die-cutting station 16. The die-cut grid is removed from the foil 10 and wound onto a roll 18. A self-adhesive film made of environmentally friendly material, preferably polypropylene or polyethylene, is fed from another supply roll 20. After the removal of its backing substrate 22, the film is laminated onto the top surface of the secondary antennas via a deflection roller 24. This first intermediate product is stored on a roll 26 for later processing.

[0026] At the in Fig. 2 In the depicted manufacturing step, a self-adhesive foam film 28 is prefabricated as a subsequent substrate for the antennas. For this purpose, the foam film 28 is fed from a dispenser roll 30 through a punching station 32, in which a rib 34 is removed in the direction of travel of the foam film 28. This rib later acts as a hinge for folding the final product of this manufacturing process. The punched-out rib 34 is removed from the foam film 28 and wound onto a roll 36. Thus, two wide strips of foam material, typically with a thickness of approximately 0.5 mm to 2 mm, remain on the backing material of the foam film 28. This intermediate product is stored on a roll 38 for later processing.

[0027] The first and second manufacturing steps can be carried out independently of each other in terms of time and location, and in any order.

[0028] In the Fig. 3 In the illustrated manufacturing step, the self-adhesive primary antenna is applied to the designated position on the secondary antenna, and a printable or pre-printed cover material is applied to one half, the future visible side of the OM tag, of the antenna assembly. Three dispenser rolls are provided for this purpose: a roll 40 containing the cover material, a roll 42 containing the primary antennas, and the prepared roll 26 with the secondary antennas as an intermediate product from the first manufacturing step. A carrier film 44 with self-adhesive primary antennas mounted on it is fed to a peeling device 46, which also receives the film with the secondary antennas. The peeled-off primary antennas are then positioned at the designated location on the secondary antennas. The carrier film 44 of the primary antennas is wound onto a roll 48 as waste material.The primary and secondary antenna assembly is laminated in a lamination station 50 with the covering material 52 supplied from the roll 40. The resulting intermediate product is then wound onto a roll 54.

[0029] In the in Fig. 4 In the depicted manufacturing step, the intermediate products are produced according to Fig. 2 and 3 combined. The intermediate product stored on roll 38 serves as the basis according to Fig. 2 The antenna assembly 56, stored on roll 54, is laminated onto the backing material 58 in a laminating station 60 after being peeled off. The backing material 58 is wound onto a roll 62. Additionally, in the laminating station 60, a transfer film 66, stored on a roll 64, containing an adhesive that will later serve as the adhesive layer for affixing the OM tag to its designated location, is applied to the side of the antenna assembly 56 that is not covered with the printable top material 52. The backing film 68 of the transfer film 66 is wound onto a roll 70. After lamination, the final contours of the OM tag are produced in subsequent cutting and die-cutting stations 72 and 74. The edge trim 76 or a die-cut grid is wound onto a roll 78.If further processing takes place in a thermal transfer printer, the die-cut grid must not be completely removed so that the printer's printhead can operate at a consistent level. The foldable OM tags are then finished and wound onto a roll 80. In this form, the OM tags can be delivered to the end user, who can print information onto the top material 52 using a label printer.

[0030] Fig. 5 Figure 1 schematically shows the layer structure of the OM-Tag before it is removed from its siliconized carrier film 82 and folded into its final shape. The OM-Tag comprises a first adhesive layer 84, a foam film layer 86, a second adhesive layer 88, a secondary antenna 90, a third adhesive layer 92, a film layer 94, a fourth adhesive layer 96, by which a primary antenna 98 with a chip 100 is adhered to the film layer 94, a fifth adhesive layer 102, by which the printable cover material 52 is adhered to the film layer, at least partially overlapping the primary antenna, and a sixth adhesive layer 104, by which the OM-Tag is attached to its intended location. The adhesive layer 104 is initially covered by a siliconized carrier film 106.

[0031] According to a study in the Fig. 6 bis 11 In the illustrated variant of the invention, the mechanically and electrostatically sensitive UHF loop with primary antenna and chip is only arranged on the OM tag at the end of its manufacture. The [details of the following are missing from the original text] Fig. 3 and 4 The manufacturing steps shown are modified as follows: As in Fig. 6 As shown, the third manufacturing step is modified such that the self-adhesive primary antennas or UHF loops are not applied to the product from the first manufacturing step. In this step, the product from the first manufacturing step is simply unwound according to... Fig. 1 from a 26' roll and laminating the product with a 52' top layer material supplied from a 40' roll in a 50' laminating station. The product of this alternative third manufacturing step is wound onto a 54' roll.

[0032] The following alternative fourth manufacturing step according to Fig. 7 fully corresponds to the in Fig. 4 The manufacturing step shown, in which the product from the preceding, alternative third manufacturing step is now dispensed from roll 54'. Further details regarding the additional measures of this alternative fourth manufacturing step can be found in [reference to relevant section]. Fig. 4 be referred.

[0033] The product from the in Fig. 7 The manufacturing step shown is in Fig. 8 shown. Compared to the one in Fig. 5 The product shown includes the product according to Fig. 8 The secondary antenna 90 works, but not the primary antenna 98 with chip 100. The product according to Fig. 8 It can be referred to as a UHF decoupler or OM antenna. By omitting the mechanically and electrostatically sensitive chip 100 and the self-adhesive primary antenna 98, this product can be manufactured on normal processing machines without special provisions for chip or inlay processing.

[0034] The UHF loop labels with primary antenna and chip for the UHF decoupler or the OM antenna are further manufactured according to Fig. 9 Dry UHF loops with chips are dispensed without adhesive from a roll 110 and fed to a laminating station 112. There, a transfer film from a roll 114 is fed from below, and a self-adhesive, printed, or printable top layer from a roll 116 is fed from above. The backing material from the transfer film and top layer is collected on rolls 118 and 120, respectively. The final shape of the UHF loop labels is produced in a die-cutting station 122. The die-cut grid is wound onto a roll 124, and the UHF loop labels are stored on a roll 126.

[0035] The merging of the UHF decouplers according to Fig. 8 and the procedural step according to Fig. 9 The UHF loop labels produced are manufactured in the Fig. 10 the described process step, which is essentially the same as the process step according to Fig. 3 This corresponds to the process where the existing cover material no longer needs to be laminated on, thus eliminating the need for roll 40. UHF loop labels are fed from a roll 128 to a peeling device 130 and applied to the UHF decouplers or OM antennas fed from a roll 132, passed through a laminating station 134, and collected as a finished product on a roll 136.

[0036] The finished product according to Fig. 10 is in Fig. 11 Shown in cross-section. The OM tag according to Fig. 11 comprising siliconized carrier film 138, a first adhesive layer 140, a foam film layer 142 with an existing groove 144, a second adhesive layer 146, a secondary antenna 148, a third adhesive layer 150, a film layer 152, a fourth adhesive layer 154, a layer of cover material 156, a fifth adhesive layer 158 with which the OM tag is to be attached to a surface, wherein the fifth adhesive layer 158 is covered with a siliconized carrier material 160, and the UHF loop label designated 162 in its entirety.

[0037] During the Fig. 12 and 13 The presented procedure variant is initially ( Fig. 12 A die-cut, printed, or etched UHF inlay is unwound as a single component from a roll 164 and fed to a laminating station 166. There, a cover material from a roll 168 is fed from above, and a transfer film, the width of the UHF inlay, from a roll 170 is fed from below. The product of this step is wound onto a roll 172 for use in the subsequent process step. The siliconized carrier material of the cover material and the transfer film, respectively, is wound onto rolls 174 and 176.

[0038] The in Fig. 13 The described process step corresponds to the one in Fig. 4 The laminated UHF inlay stored on roll 172 is separated from the siliconized carrier film in a preferential unit 178, which is collected as waste on a roll 180. In a laminating station 182, the UHF inlays are laminated from above with a transfer film from a roll 184 and from below with the foam film stored on roll 38 as a product of the process shown. Fig. 2 The process step shown is carried out. After lamination, the final contours of the OM tag are produced in subsequent cutting and die-cutting stations 186 and 188. The edge trim or a die-cut grid is wound onto a roll 190. The foldable OM tags are now complete and are wound onto a roll 192. In this form, the OM tags can be delivered to the end user, who can print information onto the cover material using a label printer.

[0039] Fig. 14 schematically shows the layer structure of the OM tag according to Fig. 12 and13 before removal from its siliconized carrier film 194 and folding into its final shape. The OM-Tag comprises a first adhesive layer 196, a foam film layer 198, a second adhesive layer 200, the UHF inlay consisting of a substrate 202 made of paper or plastic film, a third adhesive layer 204, a UHF antenna 206 and a chip 208, a fourth adhesive layer 210 with which the printable cover material 52 is adhered to the film layer, and a fifth adhesive layer 212 with which the OM-Tag is attached to its intended location. The adhesive layer 212 is initially covered with a siliconized carrier film 214.

[0040] The OM tag is used according to Fig. 5 (and accordingly the OM tags according to Fig. 8 , 11 and 14In a first application variant, the silicone-coated carrier film 82 is first removed. This exposes the adhesive layer 84. The OM-Tag is then folded in the direction of arrows 108, 108'. It is helpful that the foam film layer 86 has a recess or groove 144 in its central area, created in the second manufacturing step, which acts as a hinge. The silicone-coated carrier film 106 is then removed, exposing the sixth adhesive layer 104, which is used to attach the OM-Tag to its intended location. The printable cover material 52 then faces away from the attachment point and is legible to the user. This application variant is recommended for attaching the OM-Tag to flat surfaces, as in Fig. 15 As shown: First (a) the OM tag is removed from the backing. Then (b) the OM tag is rotated 180° around its longitudinal axis so that the surfaces labeled u1 and u2 face upwards. Next (c, d) the OM tag is folded so that surfaces u1 and u2 are bonded together. Then (e) the silicone film is removed and (f) the OM tag is adhered to the flat surface.

[0041] In a second application variant, recommended for curved surfaces, the OM-Tag is first removed from the siliconized carrier film 82, then the siliconized carrier film 106 is peeled off, and the unfolded OM-Tag is attached to its designated position with its first wing. The section of the siliconized carrier film 106 that covered the adhesive area for the surface can be used as an anti-adhesion barrier to press down the first wing of the OM-Tag before folding. The free wing of the OM-Tag is then folded in the direction of arrow 108. Since the first wing applied has a slightly smaller radius of curvature than the initially free wing after folding, this results in a stress-free and distortion-free bond between the two halves of the foam film layer 86.For practical reasons, the second wing is longer than the first due to its slightly larger radius when folded, so that the wingtips meet flush after folding. How... Fig 16 As shown, the OM tag is first (a, b) removed from the backing and rotated. Then (c, d) the OM tag is folded, but not closed, and the silicone film is removed. The silicone film is (e, f) placed on the adhesive surface u2 as a handling aid and pressed down. Then (g) the first wing can be placed against the curved surface and, since the upper adhesive surface is covered by the silicone film, pressed down. The silicone film is again removed from surface u2 (h) and the second wing is folded over the first and pressed down (i, j), without any tension or distortion occurring in the now fully adhered OM tag.

[0042] The OM-Tag, in its unfolded delivery state, is easier for the user to handle, particularly with regard to roll handling, printing, and encoding in standard label printers. Furthermore, the modular design of the OM-Tag allows for a wide range of material and design options tailored to specific needs. Bezugszeichenliste

[0043] 10Aluminium foil / foil 12roll 14printing station 16punching station 18roll 20supply roll 22carrier substrate 24deflection roller 26, 26'roll 28foam film 30dispenser roll 32punching station 34web 36roll 38roll 40, 40'roll 42roll 44carrier film 46Peel device 48Roll 50, 50'Laminating station 52, 52'Cover material 54, 54'Roll 56Antenna composite 58Carrier material 60Laminating station 62Roll 64Roll 66Transfer film 68Carrier film 70Roll 72Cutting station 74Punching station 76Edge trimming 78Roll 80Roll 82Siliconised Carrier film 84 first adhesive layer 86 foam film layer 88 second adhesive layer 90 secondary antenna 92 ​​third adhesive layer 94 film layer 96 fourth adhesive layer 98 primary antenna 100 chip 102 fifth adhesive layer 104 sixth adhesive layer 106 silicone-coated carrier film 108108 Arrow 110 Roll 112 Laminating station 114 Roll 116 Roll 118 Roll 120 Roll 122 Punching station 124 Roll 126 Roll 128 Roll 130 Peel-off device 132 Roll 134 Laminating station 136 Roll 138 Silicone-coated carrier film 140 First adhesive layer 142 Foam film layer 144 Groove 146 Second adhesive layer 148 Secondary antenna 150 Third adhesive layer 152 Film layer 154 Fourth adhesive layer 156 Top layer 158 Fifth adhesive layer 160 Silicone-coated carrier material 162 UHF loop label 164 Roll 166 Laminating station 168 Roll 170 Roll 172 Roll 174 Roll 176 Roll 178 Preferred unit 180 Roll 182 Laminating station 184 Roll 186 Cutting station 188 Punching station 190 Roll 192 Roll 194 Silicone-coated carrier film 196 First adhesive layer 198 Foam film layer 200 Second adhesive layer 202 Substrate 204 Third adhesive layer 206 Antenna 208 Chip 210 Fourth adhesive layer 212 Fifth adhesive layer 214 Silicone-coated carrier film

Claims

1. Method for manufacturing an RFID label for the UHF frequency range according to claim 7, comprising a substrate on which an electronic storage and transmission device designed as a microchip, a primary antenna galvanically connected to the microchip, and a secondary antenna coupled to the primary antenna are arranged, wherein the substrate is designed as a machine-processable continuous strip in roll form having a plurality of secondary antennas arranged thereon, characterized by the following steps: - punching the secondary antenna from a conductive metal layer and covering the secondary antenna with a transparent self-adhesive film; - punching a web from a self-adhesive foam film; - applying the primary antenna to the covered secondary antenna at a designated position and laminating a self-adhesive top material; and - applying an adhesive to a portion of the upper face of the covered secondary antenna, laminating the unit consisting of primary and secondary antennas onto the self-adhesive foam film, and punching the RFID label intended for later folding.

2. Method for manufacturing an RFID label for the UHF frequency range according to claim 8, comprising a substrate on which an electronic storage and transmission device designed as a microchip, a primary antenna galvanically connected to the microchip, and a secondary antenna coupled to the primary antenna are arranged, wherein the substrate is designed as a machine-processable continuous strip in roll form having a plurality of secondary antennas arranged thereon, characterized by the following steps: - punching the secondary antenna from a conductive metal layer and covering the secondary antenna with a transparent self-adhesive film; - punching a web from a self-adhesive foam film; - laminating a self-adhesive top material onto a portion of the upper face of the self-adhesive secondary antenna, and - applying an adhesive to a portion of the upper face of the self-adhesive secondary antenna, laminating it onto the self-adhesive foam film, and punching the UHF antenna intended for later folding; - manufacturing an UHF loop label; and - applying the UHF loop label to the UHF antenna to form the RFID label intended for later folding.

3. Method according to claim 1 or claim 2, characterized in that the conductive metal layer is a self-adhesive aluminum film.

4. Method for manufacturing an RFID label for the UHF frequency range according to claim 9, comprising a substrate on which an electronic storage and transmission device designed as a microchip and a UHF antenna galvanically connected to the microchip are arranged, wherein the substrate is designed as a machine-processable continuous strip in roll form having a plurality of UHF inlays arranged thereon, characterized by the following steps: - manufacturing a UHF inlay comprising a chip as a single-piece component, wherein the UHF antenna is applied to a paper or film substrate by etching, printing or stamping, and the UHF chip or UHF strap is connected directly to the UHF antenna in an electrically conductive manner, - punching a web from a self-adhesive foam film, - laminating a self-adhesive top material onto a portion of the upper face of the UHF inlay and laminating a transfer film onto the entire lower face of the UHF inlay, and - applying an adhesive to a portion of the upper face of the self-adhesive UHF inlay, laminating it onto the self-adhesive foam film, and punching the RFID label intended for later folding.

5. Method according to any of claims 1 to 4, characterized in that, by punching a web centrally or off-center from the self-adhesive foam film, a folding aid is provided to facilitate folding of the RFID label prior to application or during application at its intended location.

6. Method according to any of claims 1 to 5, characterized in that the RFID label is not yet folded after punching, and in that the form fitting-connection to planar or curved metal surfaces or containers filled with liquid is established only during the folding and application to planar surfaces or the folding and application to curved surfaces.

7. RFID label comprising a UHF loop, characterized by a siliconized carrier film (82) as a substrate, wherein a first adhesive layer (84), a foam film layer (86), a second adhesive layer (88), a secondary antenna (90), a third adhesive layer (92), a film layer (94), a fourth adhesive layer (96), by means of which a primary antenna (98) having a chip (100) is adhered to the film layer (94), a fifth adhesive layer (102), by means of which the printable or printed top material (52) is adhered to the film layer so as to cover the primary antenna, and a sixth adhesive layer (104), by means of which the RFID label is fastened at its intended location, are applied to this substrate in sequence, wherein the sixth adhesive layer (104) is covered with a siliconized carrier film (106).

8. RFID label comprising a UHF loop label, characterized by a siliconized carrier film (138) as a substrate, wherein a first adhesive layer (140), a foam film layer (142), a second adhesive layer (146), a secondary antenna (148), a third adhesive layer (150), a film layer (152), a fourth adhesive layer (154), a layer of top material (156), and a fifth adhesive layer (158), by means of which the RFID label is fastened at its intended location, are applied to this substrate in sequence, wherein the fifth adhesive layer (158) is covered with a siliconized carrier film (160), and by a UHF loop label (162).

9. RFID label comprising a UHF inlay, characterized by a siliconized carrier film (194) as a substrate, wherein a first adhesive layer (196), a foam film layer (198), a second adhesive layer (200), a UHF inlay as a single-piece component (202, 204, 206, 208), a third adhesive layer (210), a layer of top material (52), and a fourth adhesive layer (212), by means of which the RFID label is fastened at its intended location, are applied to this substrate in sequence, wherein the fourth adhesive layer (212) is covered with a siliconized carrier film (214).

10. RFID label according to any of claims 7 to 9, characterized in that two wings of the unfolded RFID label, formed by a groove (144) in the foam film layer (86, 142, 198), have equal lengths for application to a planar surface and have different lengths for application to curved surfaces or over an edge.

11. Use of an RFID label according to claim 10, characterized in that, when the RFID label is adhered to a curved surface, the shorter wing is adhered first and then the longer wing is folded over the shorter wing and adhered to the shorter wing without tension or distortion, wherein the free wing ends of the label are flush with one another due to the greater length of the second wing.

12. Use of an RFID label according to any of claims 7 to 9, characterized in that, when the RFID label is applied to a planar surface, the RFID label is removed from the siliconized carrier film (82, 138, 194) and folded through 180° with the aid of a groove (144) in the foam film layer (86, 142, 198); in this case, two wings of equal length, formed by the groove, are adhered to one another without tension or distortion, and then the siliconized carrier film (106, 160, 214) is pulled off and the RFID label is adhered to the planar surface at its intended location.

13. Use of an RFID label according to claim 10, characterized in that, when the RFID label is applied to a curved surface or over an edge, the RFID label is removed from the siliconized carrier film (82, 138, 194) and pre-folded through 90° with the aid of the groove (144) in the foam film layer (86, 142, 198), such that the siliconized carrier film (106, 160, 214) is removable and is used as an operating aid or anti-adhesion barrier for pressing on the shorter wing of the RFID label during adhesion to the curved surface or over the edge at its intended location, and in that the operating aid or anti-adhesion barrier is removed again prior to the folding and adhesion of the longer wing over the shorter wing.