Card-shaped data carrier with a back-injection layer and method for producing a card-shaped data carrier

Description

[0001] The present invention relates to a card-shaped data carrier, in particular a smart card, and a method for manufacturing a card-shaped data carrier.

[0002] A variety of card-shaped data carriers are known from the prior art, for example, smart cards, chip cards, integrated circuit cards, dual-interface cards, access cards, or identification cards. The use of smart cards, such as credit cards or payment cards, has become particularly established for executing financial transactions. Such a card-shaped data carrier comprises a card body and an integrated circuit embedded in the card body, for example, in the form of a chip module containing a chip. The chip module is typically arranged or inserted into a module opening in the card body.

[0003] Furthermore, it is known to use different components for contact-based and / or contactless data transmission in the manufacture of card-shaped data carriers, such as the chip module with a chip and a contact structure for contact-based data transmission and / or other components, such as an antenna or a capacitor for contactless data transmission.

[0004] The following section considers chip modules with integrated or coupled antennas, which enable both contact-based and contactless data transmission or communication. For example, this allows for the provision of card-shaped data carriers with RFID (Radio Frequency Identification) functionality.

[0005] Card-shaped data carriers with a metallic surface or core layer are particularly robust and considered high-quality. Therefore, card-shaped data carriers with an inner or outer metal layer are becoming increasingly common.

[0006] The operating principle of such a card-shaped data carrier involves the use of a chip module that itself incorporates a coupled antenna, specifically a coil (coil-on module). This coil couples to the card body, which has a metal layer. However, this metal layer can interfere with or completely block communication or data transmission. Therefore, this coupling only works if unwanted magnetic flux loops can be prevented. In other words, disruptive capacitive influences from the metal layer must be avoided.

[0007] It is known to provide a slot to interrupt ring circuits in the metal layer or to prevent short-circuit currents. However, the slot in the metal layer represents a mechanical instability. In particular, the card-shaped data carriers can break under external stress in the area of ​​the slot. Plastic films attached to the metal layer can also tear in the area of ​​the slot.

[0008] Card-shaped data carriers are known by example from US 2018 / 339503 A1, US 2020 / 257953 A1 or US 2021 / 110231 A1.

[0009] The object of the present invention is therefore to provide a card-shaped data carrier, in particular a smart card, in which improved mechanical stabilization of the card-shaped data carrier can be provided. Furthermore, it is an object of the present invention to provide a method for manufacturing a card-shaped data carrier.

[0010] This problem is solved by a card-shaped data carrier having the features of independent claim 1. Furthermore, the problem is solved by a method having the features of claim 11.

[0011] Embodiments and further developments of the invention are specified in the dependent claims and disclosed with reference to the description and the figures. Features and details described in connection with the card-shaped data carrier according to the invention also apply in connection with the method according to the invention, and vice versa, so that the disclosure of the individual aspects of the invention can always be made reciprocally.

[0012] Within the scope of the application, the invention can preferably be used for smart cards, in particular for credit cards and payment cards. Use is preferably intended for metal cards, especially for all-metal cards, hybrid metal cards with a metallic layer and a plastic layer, as well as for metal cards that are coated or printed on one or both sides with plastic or lacquer. However, use for other RFID devices, such as key cards, access cards, tokens, wearables, or security badges, is also possible.

[0013] According to one aspect of the invention, a card-shaped data carrier, in particular a smart card, is provided, comprising the following components: a card body with at least one arrangement area for receiving a chip module, wherein the chip module is arranged in the arrangement area of ​​the card body, and wherein the chip module comprises at least one chip, a contact structure, and at least one antenna. The card body is formed from at least two layers, wherein a first layer is designed as a metal layer with at least one slot extending from a circumferential surface of the metal layer into the area of ​​the arrangement for the chip module and extending through the entire thickness of the metal layer.A second layer is formed as a back injection layer by means of an injection molding process, which comprises a back injection material, wherein the back injection layer is arranged on the metal layer in such a way that the slot of the metal layer is at least partially filled with the back injection material.

[0014] In the application, the metal layer is designed discontinuously, with the metal layer having at least one slot. This slot can be interpreted as an electrical and / or mechanical discontinuity. In particular, the slot can provide further possibilities for interrupting ring circuits in the metal layer or for preventing short-circuit currents. For example, the slot can also be designed as a recess, gap, or hole in the metal layer.

[0015] Furthermore, the application provides that the chip module comprises at least one chip, a contact structure, and at least one antenna. In particular, the chip is connected to contacts of the contact structure via wires. In other words, the chip is coupled to the contact structure. The number, size, and position of the contacts of the contact structure can be defined by international standards to ensure the functionality of the smart card in any reader. Advantageously, the chip module, and especially the contact structure, enables contact-based data transmission between the smart card and a reader.

[0016] Furthermore, the chip module includes an antenna (in the form of a coil) for inductive, contactless data transmission. The antenna is coupled to the chip, or the chip is connected to the antenna. A contactless smart card can communicate with a reader via electromagnetic waves, with the smart card functioning similarly to a transmitter and receiver. Specifically, electromagnetic waves emitted by the reader generate an oscillating electromagnetic field, which, for example, induces an oscillating electrical voltage in the coil or antenna of the chip module, thus powering the chip. These voltage oscillations can be detected as a signal and converted into data within the chip. This data can then be processed within the chip and translated into changes in the electromagnetic field, which in turn can be detected by the reader and converted into data.Overall, the chip, the contact structure and the antenna can therefore enable contact-based and / or contactless data transmission.

[0017] The invention has the advantage that the back-injected layer can form a kind of protective layer for the metal layer and thus provide mechanical stabilization of the metal layer. Due to the back-injection of the metal layer, no further intermediate layers, such as adhesive layers, are preferably required, and the metal layer can form a stable bond with the back-injected layer. This can particularly simplify the production of the card-shaped data carrier, as gluing or laminating processes can be eliminated.

[0018] The application also provides that at least one functional layer, or alternatively any number of further intermediate layers, can be arranged between the metal layer and the back injection layer. In other words, the back injection layer can be arranged on the metal layer via the intermediate layer(s). In particular, the back injection layer can be arranged on the metal layer via the intermediate layer(s) in such a way that the slot in the metal layer is at least partially filled with the back injection material. It is understandable to those skilled in the art that any intermediate layers have corresponding passages, for example in the form of holes or slots, so that the back injection material can flow through the intermediate layers into the slot in the metal layer for mechanical stabilization.

[0019] In addition, the back-injection of the metal layer offers the advantage that the back-injection material flows at least partially, and in particular completely, into the slot of the metal layer, thus filling the slot at least partially, and in particular completely, with the back-injection material. This provides additional mechanical stabilization of the slot in the metal layer. Overall, the back-injection layer according to the invention achieves both complete mechanical stabilization of the metal layer and additional mechanical stabilization of the slot in the metal layer.

[0020] Preferably, the back-injection layer extends at least partially, and in particular completely, along the metal layer. This has the advantage that the back-injection layer can serve as a protective layer for the metal layer. In particular, if the back-injection layer extends completely along the metal layer, complete mechanical stabilization can be achieved. For example, the back-injection layer can be transparent. Preferably, a plastic material can be used for the back-injection material of the back-injection layer. If the card body is formed from a total of two layers, the thickness of the back-injection layer and the metal layer can, for example, be a standardized card thickness of 840 µm.Alternatively, additional layers can be provided for the card body, such as another layer of plastic or wood, and accordingly the injection molding layer and / or the metal layer can be made thinner.

[0021] Preferably, the area for receiving the chip module is formed by a recess in the card body, particularly in the metal layer, in which the chip module is received. The chip module can be arranged or inserted in the recess, such as a cavity or module opening, of the card body or the metal layer. This has the advantage of a protected and space-saving arrangement of the chip module within the card body of the card-shaped data carrier. By way of example, the recess in the metal layer can be designed as a continuous module opening, with the slot in the metal layer extending from the circumferential surface of the metal layer into the area of ​​the recess and through the entire thickness of the metal layer. Preferably, the chip and the contact structure of the chip module can be arranged within the recess.It is also conceivable that the chip module's antenna is located within the assembly area or in a functional layer. By moving the antenna away from the assembly area, a larger antenna can be used for improved RFID functionality.

[0022] Alternatively or additionally, the back-injection layer can have a molded cavity for receiving electronic components of the chip module, particularly where the cavity is located below the area for receiving the chip module. For example, a cavity can be arranged in the back-injection layer below the recess or module opening for the chip module in the metal layer. Electronic components of the chip module can preferably be received and protected within the cavity. The cavity can preferably be formed during the back-injection process. This allows the cavity to be easily formed during the back-injection process, eliminating the need for additional milling operations. Overall, this further simplifies the production of the card-shaped data carrier.

[0023] In a particularly preferred embodiment, the metal layer may have at least one recess, wherein the recess in the metal layer is at least partially filled with the back-injection material. Generally, several recesses may be provided in the metal layer. The recesses may, for example, be designed as through holes in the metal layer. This has the advantage that, when the back-injection layer is arranged on the metal layer using the back-injection process, the recess(s) in the metal layer are at least partially filled with the back-injection material. In particular, this allows for improved anchoring of the back-injection material to the metal layer. Furthermore, the recesses generally improve mechanical stabilization.

[0024] Preferably, the recess may be arranged in the area of ​​the slot. This has the advantage that, particularly in the area of ​​the slot, an additional improvement in mechanical stability can be achieved via the recess. For example, several recesses may be arranged along the slot. Preferably, two recesses each may be arranged on the right and left sides of the slot.

[0025] Preferably, the cutout can be circular, or multiple cutouts can be provided, allowing for the representation of a logo. Generally, the cutout or cutouts can have any geometric shape. For example, the geometric shape of the cutout(s) can be flexibly adapted to the visual design of the card-shaped data carrier. A bank logo or a customer-specific design can be represented using the cutouts.

[0026] Advantageously, the metal layer can form an outer layer of the card-shaped data carrier, or a third outer layer can be provided that covers the metal layer. If the outer layer of the card-shaped data carrier is formed by the metal layer, the card-shaped data carrier can, for example, be designed as a Metal Face Card. Alternatively, a third outer layer, particularly a transparent one, can cover the metal layer. The third layer can be made of plastic or, alternatively, wood. If a third layer is present, the card-shaped data carrier can, for example, be designed as a Metal Core Card with an inner metal layer. Generally, depending on the application, any number of layers can be provided for the card body, for example, a printed layer with optical features or an overlay layer.Such layers can incorporate security features in the optical, IR and / or UV range, as well as design features. Furthermore, customer-specific information can be provided.

[0027] Particularly preferably, the third outer layer is formed as a second back-injection layer by means of an injection molding process, comprising a back-injection material, wherein the second back-injection layer is arranged on the metal layer such that the slot of the metal layer is at least partially filled with the back-injection material. In other words, a second back-injection layer can be provided in addition to the first back-injection layer, wherein the second back-injection layer is preferably formed analogously to the first back-injection layer. The back-injection layers are preferably arranged on both sides of the metal layer to form a metal core card with an inner metal layer. For example, the same back-injection material can be used for both the first and second back-injection layers.Alternatively, different back-injection materials can be used depending on the application. The use of a second back-injection layer has the particular advantage that the slot in the metal layer can be partially filled from both sides by the respective back-injection material, thus essentially guaranteeing complete filling of the slot. This advantageously enables complete mechanical stabilization of the slot.

[0028] It is particularly preferred that an adhesive layer be arranged between the third outer layer and the metal layer. The adhesive layer has the advantage of improved adhesion between the individual layers, which allows the metal layer to be permanently bonded to the third outer layer.

[0029] According to the invention, a functional layer is arranged between the metal layer and the injection-molded layer, on which at least one component of the chip module, in particular the antenna of the chip module, is arranged. The functional layer has a slot corresponding to the slot of the metal layer, which extends from a circumferential surface of the functional layer into the area of ​​the arrangement for the chip module and extends through the entire thickness of the functional layer. In other words, the slot of the functional layer can extend below and along the slot of the metal layer. In particular, the slot of the functional layer is designed analogously to the slot of the metal layer.This ensures that, during the back-injection process, the back-injection material flows through the slot in the functional layer into the slot in the metal layer and can at least partially fill the slot in the metal layer. For example, the functional layer can be bonded to the metal layer in a separate process step before the back-injection process, particularly by means of an adhesive layer. The functional layer can optionally include further electronic components or a ferrite layer. For example, by arranging the antenna on the functional layer, an enlarged antenna can be provided to improve RFID functionality.Following the joining of the functional layer with the metal layer, the back injection layer is arranged as an intermediate layer on the functional layer using the back injection process, whereby the back injection material can flow through the slot of the functional layer into the slot of the metal layer and fill it.

[0030] According to a second aspect of the invention, a method for manufacturing a card-shaped data carrier, in particular a smart card, according to one of the preceding embodiments is provided, wherein the method comprises the following steps: Providing the first layer as a metal layer with a slot, arranging the chip module in the arrangement area; back-injecting the metal layer to form the second layer as a back-injection layer, wherein the back-injection layer is arranged on the metal layer such that the slot of the metal layer is at least partially filled with the back-injection material.

[0031] Preferably, further steps can be provided for the process of manufacturing the card-shaped data carrier. For example, the chip module can be arranged in a recess in the card body, particularly in the metal layer. Furthermore, a cavity for receiving electronics of the chip module can be formed in the back-injection layer. Additionally, at least one recess can be arranged in the metal layer, wherein the recess is at least partially filled with the back-injection material during the back-injection process. The recess can, for example, be arranged in the area of ​​the slot in the metal layer. Furthermore, a third outer layer can be arranged on the metal layer.This third outer layer can, for example, be formed as a second back-injection layer using a back-injection process, analogous to the back-injection layer, whereby the slot in the metal layer is at least partially filled with the back-injection material. Alternatively, an adhesive layer can be placed between the third outer layer and the metal layer.

[0032] Overall, the method according to the invention thus has the same advantages as those explained with regard to the card-shaped data carrier according to the invention.

[0033] The present invention is described below by way of example embodiments with reference to the accompanying figures. Of course, individual features of the embodiments can be freely combined with one another, provided this is technically feasible, without departing from the scope of the present invention. Elements with the same function and mode of operation are designated with the same reference numerals in the figures. The figures below show schematically: Figure 1 a top view of a card-shaped data carrier according to a non-inventive embodiment; Figure 2 a cross-sectional view of the map-shaped data carrier according to Figure 1 ; Figure 3 a cross-sectional view of a card-shaped data carrier according to an embodiment of the invention, Figure 4 a top view of a card-shaped data carrier according to an embodiment of the invention, and Figure 5a schematic view of a method for producing a card-shaped data carrier according to an embodiment of the invention.

[0034] Figure 1 Figure 1 shows a top view of a card-shaped data carrier 10. The card-shaped data carrier 10 is designed as an example of a smart card, in particular a credit card, and comprises the following components.

[0035] The card-shaped data carrier 10 has a rectangular card body 11 with a surface 11a. In particular, the card body 11 of the card-shaped data carrier 10 has a layered structure (not shown). In other words, the card body 11 is formed from several individual layers stacked on top of each other. A first layer 12 and a second layer 13 (not shown) are provided for the card body 11. Specifically, the surface 11a of the card body 11 is formed as the surface of the first layer 12. For example, the first layer 12 can be a metal layer 30. The second layer 13 (not shown) can be an injection-molded layer 40. Further details are provided in relation to Figure 2 described.

[0036] Furthermore, an electronic chip module 20 is provided, comprising at least one chip (not shown) and a contact structure 21. In particular, the contact structure 21 is coupled to the chip. This enables contact-based data transmission between the smart card and a reader. The chip module 20 also includes an antenna (in the form of a coil, not shown) for inductive contactless data transmission. For example, the antenna can be embedded in the second layer 13 as an overmolded layer 40, with the antenna being coupled to the chip of the chip module 20. Overall, the chip module 20 can therefore enable contact-based and / or contactless data transmission.

[0037] The card body 11 of the card-shaped data carrier 10 has an arrangement area 16 for receiving the chip module 20, wherein the chip module 20 is arranged in the arrangement area 16 of the card body 11. It is particularly preferred that the chip and the contact structure 21 of the chip module 20 are arranged in the arrangement area 16 of the card body 11. It can also be provided that the antenna of the chip module 20 is arranged in the arrangement area 16 or in a functional layer. By way of example, the arrangement area 16 is formed by a recess 17 in the card body 11, in which the chip module 20 is received and thus protected. In particular, it is provided that the arrangement area 16 is formed by a recess 17 in the first layer 12 as a metal layer 30. In other words, the chip module 20 is located on the surface 11a of the card body 11 in the first layer 12 within the recess 17.In other words, the recess 17 in the first layer 12 represents a module opening for the chip module 20.

[0038] The metal layer 30 of the first layer 12 has a slot 30a that extends from a circumferential surface 31 of the metal layer 30 to the area of ​​the arrangement region 16 for the chip module 20 and extends through the entire thickness of the metal layer 30. The slot 30a interrupts detrimental loops in the metal layer 30 and prevents short-circuit currents. The RFID functionality of the smart card is guaranteed by the slot 30a.

[0039] The second layer 13, not shown, is formed as an injection molding layer 40 by means of an injection molding process. The injection molding layer 40 comprises an injection molding material 41, and is arranged on the metal layer 30 such that the slot 30a of the metal layer 30 is at least partially filled with the injection molding material 41. In particular, the injection molding layer 40 extends completely along the metal layer 30. Advantageously, the injection molding layer 40 forms a kind of protective layer for the metal layer 30 and thus provides mechanical stabilization of the metal layer 30.Additionally, due to the back-injection of the metal layer 30, the advantage can be achieved that the back-injection material 41 flows at least partially, and in particular completely, into the slot 30a of the metal layer 30, and thus the slot 30a of the metal layer 30 is at least partially, and in particular completely, filled with the back-injection material 41. This is exemplified with regard to . Figure 2 shown. Consequently, mechanical stabilization of the slot 30a of the metal layer 30 can be achieved.

[0040] Furthermore, the back-injection layer 40 can have a molded cavity 18 (not shown) for receiving electronics of the chip module 20, in particular wherein the cavity 18 is arranged below the arrangement area 16 for receiving the chip module 20.

[0041] For example, the metal layer 30 forms an outer layer of the card-shaped data carrier 10. Thus, the card-shaped data carrier 10 is designed as a Metal Face Card.

[0042] Figure 2 shows a cross-sectional view of the card-shaped data carrier 10 after Figure 1 The card-shaped data carrier 10 is analogous to Figure 1 structured. In particular, in Figure 2 The layered structure of the card body 11 is visible, with the first layer 12 being the metal layer 30 and the underlying second layer 13 being the back injection layer 40. Furthermore, it is evident that the slot 30a of the metal layer 30 is completely filled by the back injection material 41 of the back injection layer 40 and is therefore mechanically stabilized.

[0043] Furthermore, in Figure 2The cavity 18, which is formed in the back-injection layer 40, is visible. For example, the cavity 18 is arranged in the back-injection layer 40 below the recess 17 or the module opening for the chip module 20 in the metal layer 30. Electronic components of the chip module 20 can preferably be accommodated and protected in the cavity 18. The formation of the cavity 18 can preferably be carried out during the application of the back-injection process for forming the back-injection layer 40.

[0044] Figure 3 Figure 1 shows a cross-sectional view of a card-shaped data carrier 10 according to an embodiment of the invention. The card-shaped data carrier 10 is essentially analogous to Figure 2 constructed. Unlike Figure 2A functional layer 15 is arranged between the metal layer 30 and the back-injection layer 40. The card body 11 therefore has three layers: the first layer 12 as the metal layer 30, the functional layer 15, and the second layer 13 as the back-injection layer 40. The functional layer 15 extends completely along the metal layer 30 and the back-injection layer 40. The antenna of the chip module 20 (not shown) is arranged on the functional layer 15. In particular, the antenna (not shown) is embedded or milled into the functional layer 15. Consequently, by relocating the antenna from the assembly area 16, a larger antenna can be used to improve RFID functionality.

[0045] The functional layer 15 has a slot 15a corresponding to the slot 30a of the metal layer 30, which extends from the circumferential surface of the functional layer 15 into the area of ​​the arrangement region 16 for the chip module 20 and extends through the entire thickness of the functional layer 15. In other words, the slot 15a of the functional layer 15 can extend below and along the slot 30a of the metal layer 30. In particular, the slot 15a of the functional layer 15 is designed analogously to the slot 30a of the metal layer 30. This ensures that, during the back-injection process, the back-injection material 41 flows through the slot 15a of the functional layer 15 into the slot 30a of the metal layer 30 and can at least partially fill the slot 30a of the metal layer 30. Figure 3It can be seen that both the slot 15a of the functional layer 15 and the slot 30a of the metal layer 30 are filled with the back injection material 41.

[0046] For example, the functional layer 15 can be bonded to the metal layer 30 in a separate process step prior to the back injection molding process, in particular by means of an adhesive layer. Following the bonding of the functional layer 15 to the metal layer 30, the back injection molding layer 40 is applied to the functional layer 15 as an intermediate layer and thus also to the metal layer 30 by means of the back injection molding process, whereby the back injection material 41 can flow through the slot 15a of the functional layer 15 into the slot 30a of the metal layer 30.

[0047] As in Figure 3As can be seen, the arrangement area 16 for receiving the chip module 20 is formed by a recess 17, which extends through the metal layer 30 and the underlying functional layer 15. In other words, the recess 17 forms a module opening within the metal layer 30 and the functional layer 15.

[0048] Furthermore, in Figure 3 The cavity 18, which is formed in the back-injection layer 40, is visible. For example, the cavity 18 is arranged in the back-injection layer 40 below the recess 17 or the module opening for the chip module 20 in the metal layer 30 and the functional layer 15. Electronic components of the chip module 20 can preferably be accommodated and protected in the cavity 18.

[0049] Figure 4Figure 1 shows a top view of a card-shaped data carrier 10 according to a further embodiment of the invention. The card-shaped data carrier 10 can be, by way of example, Figure 2 not according to the invention or Figure 3 be designed according to the invention.

[0050] Unlike Figure 2 or Figure 3 The metal layer 30 of the card-shaped data carrier 10 exhibits according to Figure 4 Four recesses 19 are provided, which are at least partially filled with the back-injection material 41. The recesses 19 are arranged in the area of ​​the slot 30a and are, for example, circular in shape. For instance, two recesses 19 are arranged on the right and left sides of the slot 30a.

[0051] The recesses 19 can, for example, be designed as through holes in the metal layer 30. This has particular implications for Figure 2The advantage is that, when the back-injection layer 40 is arranged on the metal layer 30 using the back-injection method, the recesses 19 of the metal layer 30 are at least partially filled with the back-injection material 41. In particular, this allows for improved anchoring of the back-injection material 41 to the metal layer 30. If according to Figure 3 where a functional layer 15 is provided as an intermediate layer, the functional layer 15 has analogous recesses 19 so that the back injection material 41 can flow through the recesses of the functional layer 15 into the recesses 19 of the metal layer 30 and can at least partially fill the recesses of the metal layer 30.

[0052] Figure 5 Figure 1 shows a schematic view of a method for manufacturing a card-shaped data carrier according to an embodiment of the invention. In particular, the card-shaped data carriers can be manufactured according to the following: Figures 1 to 4 to be manufactured. The process includes, by way of example, the following steps and may, if necessary, include further process steps.

[0053] In a first step 100, the first layer 12 is provided as a metal layer 30 with the slot 30a. In a second step 110, the chip module 20 is arranged in the arrangement area 16. As an example, a functional layer 15 can be arranged on the metal layer 30 in an additional intermediate step. In a third step 120, the metal layer 30 (or, if applicable, the functional layer as an intermediate layer) is back-injected to form the second layer 13 as a back-injection layer 40, wherein the back-injection layer 40 is arranged on the metal layer 30 such that the slot 30a of the metal layer 30 is at least partially filled with the back-injection material 41. Reference symbol list

[0054] 10 Card-shaped data carrier 11 Card body 11a Surface 12 First layer 13 Second layer 15 Functional layer 15a Slot 16 Arrangement area 17 Recess 18 Cavity 19 Cutout 20 Chip module 21 Contact structure 30 Metal layer 30a Slot 31 Circumferential area 40 Back-injection layer 41 Back-injection material 100 First process step 110 Second process step 120 Third process step

Claims

1. Card-type data carrier (10), in particular a smart card, comprising a card body (11) with at least one arrangement region (16) for receiving a chip module (20), wherein the chip module (20) is arranged in the arrangement region (16) of the card body (11), wherein the chip module (20) comprises at least one chip, a contact structure (21) and at least one antenna, wherein the card body (11) is formed from at least two layers (12, 13), wherein a first layer (12) is in the form of a metal layer (30) with at least one slit (30a), which extends from a circumferential surface (31) of the metal layer (30) into the region of the arrangement region (16) for the chip module (20) and which extends through the entire thickness of the metal layer (30), wherein an insert moulding process is used to form a second layer (13) as an insert moulded layer (40), which comprises an insert moulding material (41), wherein the insert moulded layer (40) is arranged on the metal layer (30) in such a way that the slit (30a) in the metal layer (30) is at least partially filled with the insert moulding material (41), characterized in that a functional layer (15) on which at least one component of the chip module (20) is arranged, in particular the antenna of the chip module (20), is arranged between the metal layer (30) and the insert moulded layer (40), the functional layer (15) having a slit (15a) which corresponds to the slit (30a) in the metal layer (30), extends from a circumferential surface of the functional layer (15) into the region of the arrangement region (16) for the chip module (20), and extends through the entire thickness of the functional layer (15).

2. Card-type data carrier (10) according to Claim 1, characterized in that the insert moulded layer (40) extends at least partially, in particular completely, along the metal layer (30).

3. Card-type data carrier (10) according to either of the preceding claims, characterized in that the arrangement region (16) for receiving the chip module (20) is formed by a recess (17) in the card body (11), in particular in the metal layer (30), in which recess the chip module (20) is received.

4. Card-type data carrier (10) according to one of the preceding claims, characterized in that the insert moulded layer (40) has a moulded cavity (18) for receiving electronics of the chip module (20), in particular the cavity (18) being arranged below the arrangement region (16) for receiving the chip module (20).

5. Card-type data carrier (10) according to one of the preceding claims, characterized in that the metal layer (30) has at least one cutout (19), the cutout (19) in the metal layer (30) being at least partially filled with the insert moulding material (41).

6. Card-type data carrier (10) according to Claim 5, characterized in that the cutout (19) is arranged in the region of the slit (30a).

7. Card-type data carrier (10) according to either of Claims 5 and 6, characterized in that the cutout (19) is circular, or in that a plurality of cutouts (19) are provided so that a visual logo can be represented.

8. Card-type data carrier (10) according to one of the preceding claims, characterized in that the metal layer (30) forms an external layer of the card-type data carrier (10), or in that a third, external layer is provided, which covers the metal layer (30).

9. Card-type data carrier (10) according to Claim 8, characterized in that an insert moulding process is used to form the third, external layer as a second insert moulded layer, which comprises an insert moulding material (41), wherein the second insert moulded layer is arranged on the metal layer (30) in such a way that the slit (30a) of the metal layer (30) is at least partially filled with the insert moulding material (41).

10. Card-type data carrier (10) according to Claim 8, characterized in that an adhesive layer is arranged between the third, external layer and the metal layer (30).

11. Method for producing a card-type data carrier (10) according to one of the preceding claims, wherein the method comprises the following steps: - providing the first layer (12) as a metal layer (30) with a slit (30a), - arranging the chip module (20) in the arrangement region (16); - insert moulding the metal layer (30) in order to form the second layer (13) as an insert moulded layer (40), the insert moulded layer (40) being arranged on the metal layer (30) in such a way that the slit (30a) in the metal layer (30) is at least partially filled with the insert moulding material (41).