DEVICE, ARRANGEMENT AND METHOD FOR AUTOMATED REMOVAL OF A THERMAL CONDUCTIVITY PAD FROM A CARRIER FILM
DE502023004187D1Active Publication Date: 2026-06-11METALL UND KUNSTSTOFFWAREN ERZEUGUNGSGESELLSCHAFT MBH
Patent Information
- Authority / Receiving Office
- DE · DE
- Patent Type
- Patents
- Current Assignee / Owner
- METALL UND KUNSTSTOFFWAREN ERZEUGUNGSGESELLSCHAFT MBH
- Filing Date
- 2023-01-24
- Publication Date
- 2026-06-11
AI Technical Summary
Technical Problem
Automated handling of thermally conductive pads with pasty or putty-like consistency is hindered by their flexibility and lack of dimensional stability, making it difficult to detach them from flexible carrier films efficiently.
Method used
A device comprising a clamping device with holding and clamping grippers, a peeling device with a peeling edge, and a peeling drive is used to automate the removal of thermally conductive pads from a flexible carrier film, allowing for precise gripping, peeling, and tensioning of the film to detach the pads.
Benefits of technology
Enables efficient, automated, and precise removal of thermally conductive pads from carrier films, facilitating their application to components without damage, with minimal handling force and high precision.
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