AMPLIFIER MODULE WITH POWER TRANSITOR MASTER AND PERIPHERAL GROUND CONNECTIONS
DE602021055491T2Active Publication Date: 2026-06-10NXP USA INC
Patent Information
- Authority / Receiving Office
- DE · DE
- Patent Type
- Patents
- Current Assignee / Owner
- NXP USA INC
- Filing Date
- 2021-04-13
- Publication Date
- 2026-06-10
AI Technical Summary
Technical Problem
Conventional amplifier module designs face challenges in optimizing module size, thermal dissipation, and performance for current and new applications, particularly in wireless communication systems.
Method used
The integration of a power transistor die with a heat spreader that provides both thermal dissipation and electrical grounding, utilizing a conductive layer on the ground surface of the die connected to a heat spreader, which is further connected to a module substrate through ground contact structures, enhancing thermal and electrical connectivity.
Benefits of technology
This design improves thermal dissipation and electrical grounding, optimizing module performance and reducing size, while maintaining efficient signal amplification and heat management.
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