CHIP-TO-MODULE CABLE ARRANGEMENT AND PCB CIRCUIT

DE602022036985T2Active Publication Date: 2026-05-13RUIJIE NETWORKS CO LTD
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Patent Information

Authority / Receiving Office
DE · DE
Patent Type
Patents
Current Assignee / Owner
RUIJIE NETWORKS CO LTD
Filing Date
2022-10-12
Publication Date
2026-05-13

AI Technical Summary

Technical Problem

Conventional PCB solutions fail to meet high-speed data transmission requirements and occupy excessive space when direct attach cables are used, making them unsuitable for high-density interconnections.

Method used

A chip-to-module cable assembly utilizing a flexible PCB with a three-layer structure, including flexible material parts and rigid material portions for support, reduces signal loss and occupies less space, enabling high-speed data transmission and flexible assembly.

Benefits of technology

The flexible PCB cable assembly achieves high-speed data transmission with reduced space requirements and facilitates assembly in high-density interconnection scenarios, overcoming the limitations of conventional PCBs and direct attach cables.

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