Single-sided antenna module with SMD component

Abstract

The invention relates to a module with integrated circuit chip (1C), comprising: - an insulating substrate (3), - metallisations comprising conductive tracks (25) produced on one side of the substrate (12), forming an antenna (2) and comprising two connection ends (8, 9), - a coating area (16) or location of the radiofrequency integrated circuit chip (4) and of a device (14) in the form of a surface-mounted device (SMD), the radiofrequency integrated circuit chip and the device being disposed on the same face of the substrate and connected to the antenna (2). The module is characterised in that the metallisations (2) are on a single same side of the insulating substrate, the connection being made by means of perforations (17) through the insulating film (3) or directly on the surface metallisations.

Description

[0001] The invention relates to an electronic module comprising an integrated circuit chip connected to a radiofrequency antenna and to a CMS surface component, for example a capacitor.

[0002] The invention may relate in particular to the field of electronic media such as contact and / or contactless smart cards or hybrid cards, radio frequency (RFID) tickets or labels, radio frequency transponders, inserts (or inlays) integrating or constituting such a module.

[0003] Such electronic media may comply in particular with the ISO / IEC 14443 or ISO 78016 standard.

[0004] The invention is preferably used by being inserted in particular into portable electronic devices such as bracelets, watches, key rings, clothing, etc., to carry out radiofrequency, payment, identification and authentication transactions. Art antérieur.

[0005] It is known to manufacture a smart card module by the steps corresponding to the preamble of claim 1. Such antenna modules are described in patent FR 2743649 B1. According to the variants disclosed, the chip can be placed straddling the turns of an antenna and on the periphery so as to allow a connection to the chip by soldered wire.

[0006] In another variant, the chip is placed in the center of the module, the antenna has a connection end located on the periphery of the turns and the chip is connected to this end by soldered wire spanning the turns.

[0007] In another variant, the module comprises a conductive bridge made on the face opposite to that carrying the turns and conductive vias cross the support to connect the conductive bridge to the antenna.

[0008] Patent application EP2669852 describes a single-sided integrated circuit module with a deviation of the peripheral antenna turns towards the center to allow a chip to be mounted astride the turns and to directly connect an external terminal of the antenna by soldered wire.

[0009] Current contactless chip antenna modules are of the double-sided type and include conductive metallized vias through the module's support film. In these modules, it is currently proposed on the market to connect, to the etched antenna, a radio frequency integrated circuit (IC) chip and a capacitor to adjust the resonant frequency of the radio frequency communication transponder thus formed.

[0010] These modules are complex to produce and expensive.

[0011] US 2012 0050130 and JP 2011 135307 describe a radiofrequency communication device comprising an insulating substrate carrying an antenna connected to a chip and a capacitor. The capacitor is obtained by two conductive plates arranged on either side of the substrate.

[0012] Document US2003 / 184495 A1 describes a contactless communication device such as a token or tag. It comprises a substrate carrying circular antenna turns with first and second connection ends disposed inside and outside the turns.

[0013] A radio frequency chip is arranged and connected inside the turns, on the one hand to a first antenna end and on the other hand to an interconnection pad with a capacitor for series electrical connection. The capacitor has larger dimensions than the radio frequency chip and is positioned so as to span the turns to connect the second external end of the antenna.

[0014] Document FR 2 803439 A1 describes a radiofrequency communication device. It comprises an insulating substrate carrying screen-printed antenna turns and connections for a radiofrequency chip and for a capacitor. The capacitor is made in several layers by screen printing. Only the chip constitutes a surface-mounted component. Problème technique.

[0015] The above modules do not allow optimization of radio frequency performance at the best cost.

[0016] The aim of the invention is to solve the above problems and in particular to have a high-performance radiofrequency module that is simpler and more economical to manufacture. Résumé de l'invention.

[0017] The object of the invention is achieved with an integrated circuit chip module with the features of claim 1.

[0018] The invention consists firstly in adopting a single-sided type antenna module substrate, secondly in providing a capacitor in the form of a passive component or an integrated circuit, thirdly in configuring this single-sided substrate so as to allow surface mounting (SMD) of a component (capacitor, resistor, coil or other...) in the form of a passive component or an integrated circuit chip and its connection to the antenna. Finally, fourthly, the invention consists in retaining a smart card type manufacturing for mechanical reliability and amortizing the manufacturing cost.

[0019] The module configuration should allow easy manufacturing on an industrial scale and with classic technologies from the smart card world.

[0020] This results in a high-performance product in terms of radio frequency communication that is 75% less expensive than current products.

[0021] Thanks to the design of the module, it is possible to do without conductive vias through the insulating film, redirection tracks on a face of the substrate opposite to that supporting the antenna.

[0022] It is possible to protect the chip-to-antenna connections in a central or middle area of ​​potting while having the antenna on only one side.

[0023] Manufacturing is also simplified with single-sided etching while having a central or median position of the chip, allowing, if necessary, an optimal surface for bonding the module into the card.

[0024] The invention therefore relates to a radiofrequency integrated circuit chip module for a smart card, comprising: an insulating substrate, metallizations comprising conductive tracks, produced on the same side of the substrate and forming an antenna with two connection terminals, at least one area on the support film for coating or locating the radiofrequency integrated circuit chip and a capacitor in the form of a surface-mounted component, the radiofrequency integrated circuit chip and the component being arranged on the same face of the substrate and connected to the antenna, characterized in that the conductive tracks are on a single side of the support film, the connection being made by means of perforations through the insulating film or directly on tracks on the surface of the insulating substrate.

[0025] According to other characteristics of the module: It comprises a metallized interconnection terminal inside the spiral, said metallized interconnection terminal being connected to the antenna by an electrical connection in the sectioned or short-circuited state; Said sectioned or short-circuited state results from one of a mechanical or laser ablation, a punctual perforation of the substrate (or support film) and of said connection, a mechanical abrasion, a punching (or even a chemical etching); The connection of the chip to the antenna is carried out by means of perforations through the insulating film; The chip and the component are connected to the same pair of interconnection terminals arranged inside the antenna in the form of a spiral; The module may optimally comprise a deflection D of the turns, said deflection extending from the periphery of the support film towards the inside of the spiral; the component (14) may be a capacitor;The chip and the component (notably the capacitor) are coated with an insulating protective or coating material.

[0026] The invention also relates to a device such as a smart card comprising the above module. It may comprise a body with a cavity opening onto the surface and said module inserted and fixed in the cavity.

[0027] Thus, the invention makes it possible to economically manufacture a contactless smart card with the technology for manufacturing mini SIM cards while having good radiofrequency performance. The components and their connections are mechanically protected since they are coated with insulating resin and the module is inserted into a card body cavity like a smart card module but preferably with antenna dimensions covering approximately twice the dimensions of a smart card module in ISO 7816 format.

[0028] The mini SIM contactless card can then be detached from its holder thanks to a pre-cut around it. The contactless card can then be slipped into a bracelet or watch (or any portable object) to carry out transactions, including banking, payment, identification, and authentication. Brève description des figures.

[0029] THE figures 1-2 illustrate a prior art radio frequency smart card module; The figure 3 illustrates a current prior art module of the double-sided type with a radio frequency chip and a capacitor on the same side; The figures 4A, 4B, 4C, 4D, 4E, 4F illustrate a radiofrequency chip module according to a first embodiment of the invention; The figures 5A, 5B, 5C illustrate a radio frequency chip module according to an example not forming part of the invention; The figures 6 et 7 respectively illustrate a radio frequency chip module embedded in a device body and a section along AA of the figure 6 . Description.

[0030] In the drawings, like references indicate identical or similar elements.

[0031] On the figures 1 et 2 , we observe a module 1C with integrated circuit of the prior art (patent application EP2669852). It comprises an insulating substrate 3, conductive tracks 2, produced on the same side of the substrate 12, forming an antenna 2 and comprising two connection ends 8, 9, a coating or location zone 16 of the radiofrequency integrated circuit chip; The radiofrequency integrated circuit chip is arranged on the same face 12 of the substrate 3 and is connected to the antenna; The chip 4 is mounted partly astride a deviation (D) of the peripheral turns 25 towards a central region of the module.

[0032] To the figure 3 , an existing embodiment is illustrated; It comprises a double-sided support film (or substrate) 3 comprising etched metallizations on each face of the insulating support film. On a first face 12, the spiral antenna 2 and electrically conductive pads or terminals 8, 9 are produced. And on a second face 13 opposite the first face, there are second etched metallizations comprising interconnection pads 11a, 11b for connecting the integrated circuit chip 4 and a CMS (surface-mounted component) or “SMD” (Surface-mounted device) component 14. The SMD component may be, for example, a capacitor in the form of a passive component, the capacitor being formed from a multilayer of dielectric ceramics. It is mounted on the surface of the substrate 3 as opposed to a capacitor which would be formed from capacitor plates obtained in particular by etching on a substrate. The capacitor targeted by the invention has the advantage of being compact.It can provide high capacity in a volume or footprint significantly smaller or of the same order of magnitude as that of the radio frequency chip.

[0033] This makes it possible to group the components together for possible insertion. It is also possible to optionally coat the assembly.

[0034] The chip and the component are mounted on the same side of a second face 13 of the insulating substrate and connect terminals 8, 9 of the antenna 2 by means of conductive vias 10 in blind perforations of the support film. The vias 10 connect terminals 8, 9 of the antenna produced on the first face 12.

[0035] To the figure 4A , a module 1A with an integrated circuit chip 4 according to a first embodiment of the invention, comprises as previously, an insulating substrate 3, conductive tracks 25, produced on the same side of the substrate 12; These tracks form an antenna 2 with turns 25 and comprise two ends or connection terminals 8, 9.

[0036] This mode provides a zone 16 for coating or location of the radiofrequency integrated circuit chip and the component 14, in the form of a component (SMD type) in particular here a capacitor; The assembly 4, 14, 5 is substantially centered on a longitudinal mediator ML of the module (to allow coating with resin and insertion into a card body); The coating zone 16 is covered with a coating material 6 protecting these two components 4, 14 as well as their electrical connections 5. These connections can be of any known type.

[0037] The radiofrequency integrated circuit chip 4 and the component 14 are arranged on the same second face 13 of the substrate and connected to the antenna 2.

[0038] According to a characteristic of this first mode, the metallizations 8, 9 are produced on a single side of the support film. The connection 5 linking the components is made here through the perforations 17 (non-metallized) of the insulating substrate 3.

[0039] The antenna is made here by etching metal previously glued onto a substrate presented in ribbon and including perforations or connection wells.

[0040] The antenna 2 comprises current supply tracks 19A to achieve electrical continuity of the metallizations during etching. These tracks 19A can be subsequently sectioned at the same time as the extraction of the module from the substrate by punching along their dotted periphery 33. Alternatively, these tracks 19A can be sectioned at the same time as the other tracks to be short-circuited 19B, located outside the module (conventional short-circuiting of module films for smart cards).

[0041] The antenna comprises a metallized redirection terminal 20 inside the turns 25. This metallized redirection terminal is connected to the antenna initially by an electrical connection 19B to allow a current supply. These supplies 19A, 19B can subsequently be removed in particular by punching 18 or laser in particular when extracting the module 1A from its transport ribbon R.

[0042] The module is provided in a final version with the electrical current supply connections 19 in the cut or short-circuited state. The cut or short-circuited state of the electrical connection 19 may result from an operation among mechanical or laser ablation, a punctual perforation of the support film and the connection, mechanical abrasion, punching.

[0043] The antenna turns 25 extend here on the periphery of the support film 3 and the chip 4 and the component (in particular capacitive) 14 are arranged inside the spiral formed by the turns 25.

[0044] In a preferred application, module 1A ( fig. 4A ) is intended to carry out authentications and financial, banking and payment transactions and must be small in size, such as the format of a mini SIM card.

[0045] To allow good communication, the turns 25 preferably extend around the periphery of the module to have a larger coupling surface over a minimum area.

[0046] The components 4, 14 are placed substantially on a longitudinal median ML and substantially centered on the module in order to allow coating of the components and insertion of the module in a smart card body substantially like mini SIM cards in 2FF format.

[0047] It is observed that the chip 4 and the component 14 are connected to the same pair of interconnection terminals 8, 9 arranged inside the antenna spiral 2. Alternatively, the antenna can be of any shape such as a UHF type antenna.

[0048] It is observed that the module comprises an external terminal 9 of the antenna brought close to the interconnection metallization 21 (or redirection terminal) by means of a deviation D of the turns; The deviation D makes a loop which extends from the periphery of the support film towards a median position inside the spiral (in fact towards the coating zone or location of the components 16); The deviation “D” also extends towards the metallized interconnection terminal 21 (or redirection terminal).

[0049] There figure 4B illustrates an enlargement of a portion of the figure 4A centered around the connections of chip 4 and capacitor 14.

[0050] The capacitor 14 and the radiofrequency chip 4 are arranged on a face 13 of the insulating substrate 3 and connected to the terminals (8, 9 via 21) of the antenna located on the face 12 of the support 3, opposite the face 13. The chip 4 is connected by soldered wire 5 through wells 17 and the capacitor is connected by conductive glue 28 through other wells 17.

[0051] There figure 4C is an approximate section along CC of the figure 4B The capacitor rests on the substrate 3 and the connection ends of the capacitor are directly above the perforations 17 or recesses filled with conductive glue to electrically connect the capacitor to the antenna. The capacitor overhangs wells 17 which correspond to it.

[0052] There figure 4D illustrates a variant of connection of the capacitor 14. It can be connected to the antenna terminals 8, 9 by being arranged in a window or cavity 17 formed in the insulating substrate 3 according to a configuration of the embodiment of the figure 4A The advantage is to reduce the overall thickness of the module. Here, the capacitor is connected with conductive glue 28. Rather than being straddling the substrate between two wells 17, the capacitor is at the bottom of a well 17.

[0053] There figure 4F illustrates an alternative connection of the components according to a configuration of the first embodiment. This alternative differs from the mode of the figure 4A in that the chip 4 and the capacitor 14 are directly connected on the one hand to the pad 9 and on the other hand to the pad 8. This embodiment has the advantage of being compact for modules with little space. Alternatively, the antenna 25 is arranged on the same side of the substrate 3 as the chip. The chip (or the component) can be mounted straddling the turns.

[0054] There figure 4E illustrates a connection variant of the figure 4D . It differs in that the capacitor 14 is glued to the bottom of a well 17 and connected to an antenna terminal 8 by conductive glue 28, the capacitor being housed at least partly in the orifice or perforation or well 17. The capacitor here comprises connection zones at its opposite ends. The other end is connected directly by soldered wire 5 to the second antenna terminal 9.

[0055] The advantage here is to compensate for the height of the capacitance and to have a compact configuration of the components. The chip 4 can also be arranged in a cavity with corresponding dimensions.

[0056] The module thus produced can be cut at its periphery 33 (dotted lines) for its extraction from a support film presented in particular in reel strip “R”.

[0057] To the figure 5A an example is illustrated which does not form part of the invention. It differs mainly from that of the figure 4A in that the antenna 2 is arranged on the same side 12 of the substrate as that carrying the components 4, 14. Thus, the connection wells 17 are avoided and the antenna is protected from the outside of the module since it is found in the cavity C2.

[0058] There figure 5B illustrates an enlargement of a portion of the figure 5A centered around the components and their connections. Chip 4 is connected to an antenna terminal 9 and redirection terminal 21. Terminal 21 is connected to antenna terminal 9 via an electrical connection 26a or printed on an insulating bridge 27 itself printed on turns 25 of the antenna deflection “D”. Preferably, the insulating bridge is not essential, the connection being made by soldered wire and flying over the turns of the antenna, in particular at the level of the deflection (if it is present).

[0059] Capacitance 14 is connected to its terminals or pads 11, 12 connected respectively to terminals 8, and 21 as to the figure 4A with conductive glue 28. Alternatively, the capacitor 14 can be connected by soldered wire 5 to these terminals 11, 12.

[0060] This example is advantageous in that it requires no perforation except for the short-circuit 18.

[0061] To the figure 5C an arrangement and electrical connection of the capacitor 14 are illustrated which may be suitable for one of the modes described above. In this arrangement, the antenna 2 and the components 4, 14 are on the same side of the substrate. The capacitor 14 is fixed astride the turns 25 of the antenna 2 with insulating glue 29. The capacitor is connected to the antenna terminals 8 and 9 by soldered wires spanning the turns 25.

[0062] To the figure 7 , a main body device 30 comprising the module 1A, 1B is illustrated.

[0063] In the example, the device 30 is a radiofrequency transponder in the form of a smart card. However, the module 1A, 1B can be inserted into various supports or bodies of any product such as clothing, bracelet, watch, belt, etc.

[0064] In the example, the device 30 comprises a mini body 23 with a two-stage cavity C1, C2, opening onto the surface and the module 1A is inserted and fixed in the cavity.

[0065] The module 1A is in fact inserted into a body 23 of a mini card in mini SIM format (2FF: 25 x 15 mm). This mini-body 22 is itself detachable in a known manner by breakable straps 31 from a main body 30 of a smart card 30. Where appropriate, the other smaller 3FF and 4FF formats are covered by the invention.

[0066] Thus, the invention makes it possible to use mini-SIM chip card technology to economically manufacture, with good range, a radiofrequency transponder equipped with an economical single-sided film.

[0067] The device or module can be in different formats, notably in the 4FF format of smart cards.

[0068] In all embodiments, the capacitance of the radiofrequency transponder may have a value greater than or equal to approximately 25 pF or 35 pF, in particular for a tuning frequency of 13.56 MHz.

[0069] The capacitance may alternatively be greater than 50 or 70 pico (p) farad in possible applications to which the invention may relate.

Claims

1. Integrated circuit chip module (1C) for a smart card, comprising: - a radio-frequency integrated circuit chip (4), - a component (14), - an insulating substrate (3), - metallizations comprising conductive tracks (25) which are made on a first face (12) of the same single side of the insulating substrate (3), forming an antenna (2) and have two connection ends (8, 9), - a zone (16) for coating or placing the radio-frequency integrated circuit chip (4) and the component (14) in the form of a surface-mounted component (SMD), - the radio-frequency integrated circuit chip and the component being arranged on the same face (12 or 13) of the substrate (3) and connected to the antenna (2) by an electrical connection (28, 26), characterized in that - the radio-frequency integrated circuit chip and the component are arranged on a second face (13) of the substrate (3) opposite the first face (12) of the substrate (3) and said electrical connection (28, 26) is made via perforations (17) through the insulating substrate (3), and - wherein the module comprises a spiral which has antenna turns (25) at the periphery (33) of the substrate (3), the chip (4) and the component (14) being arranged inside the spiral, the module comprising an interconnection metallization (21) connected to the antenna (2) inside the spiral, a connection end (9) of said module being an external terminal of the antenna (9) that is brought close to the interconnection metallization (21) via a deflection (D) of the turns, said deflection (D) extending from the periphery of the support film towards the inside of the spiral and said interconnection metallization (21).

2. Module according to any of the preceding claims, characterized in that said interconnection metallization (21) is connected to the antenna (2) by an electrical link (19) in the sectionalized or short-circuited state.

3. Module according to the preceding claim, characterized in that said sectionalized or short-circuited state results from one operation from among mechanical or laser ablation, point perforation (18) of the support film and of said link, mechanical abrasion, or punching.

4. Module according to any of the preceding claims, characterized in that the chip (4) and the component (14) are connected to the same pair of interconnection terminals (8, 21) arranged inside the spiral.

5. Module according to any of the preceding claims, characterized in that the component (14) is a capacitor.

6. Module according to any of the preceding claims, characterized in that the component (14) has a volume or size substantially smaller than or of the same order of magnitude as that of the radio-frequency chip.

7. Module according to any of the preceding claims, characterized in that the component (14) and the radio-frequency integrated circuit chip are coated with the same coating material (6).

8. Device (23, 30) in the form of a smart card, comprising the module (1A, 1B) according to any of the preceding claims.

9. Device according to the preceding claim, characterized in that it comprises a body (22) that has a cavity (C1, C2) opening onto the surface and said module (1A, 1B) embedded and fixed in the cavity.

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