Method and device for making electrical contact with electronic components

Abstract

A method for making electrical contact with at least one electronic component comprises: providing a pliable element which has a first main surface on which at least one first conductor track and at least one second conductor track, electrically isolated from the at least one first conductor track, is arranged; providing a first line and a second line which is electrically isolated from the first line; arranging the pliable element in relation to the at least one component such that the first main surface faces the at least one component; bending and pressing the pliable element onto the at least one component in such a way that a first contact element of the at least one component comes into contact with the at least one first and the at least one second conductor track; bringing a second contact element of the at least one component into contact with the first and the second line; applying a defined current to the at least one first conductor track and the first line; and measuring a voltage drop across the at least one component via the at least one second conductor track and the second line.

Description

[0001] METHOD AND DEVICE FOR ELECTRICALLY CONTACTING

[0002] ELECTRONIC COMPONENTS

[0003] This application claims priority from German patent application No. 10 2022 124 300 . 1 filed on September 21, 2022, the disclosure of which is hereby incorporated by reference into this application.

[0004] The present invention relates to a method and a device for electrically contacting components which are, for example, integrated into a semiconductor wafer.

[0005] Using conventional methods, semiconductor wafers, which in particular contain electronic or optoelectronic components, can only be measured with a comparatively high expenditure of time.

[0006] DE102019107138 describes a method by which components integrated into a semiconductor wafer can be electrically contacted with reduced time. The conductor tracks arranged on a flexible printed circuit board (flexboard) are designed and arranged such that one conductor track is provided on the flexboard for each component row on the wafer. The voltage drop across the components is measured via the same path through which a current is applied to the components.

[0007] However, the inventors have recognized that, above all, an undefined contact resistance between the conductor track and the contact pad of a component to be measured can severely distort the voltage drop across the components, which is measured via the same path through which a current is applied to the components. This is because, with a corresponding current flow, an undefined and undetectable additional voltage can drop across the undefined and sometimes relatively high contact resistance (for example, due to contamination on or damage to the contact pad), which is difficult or even impossible to calculate afterwards.Contact resistance on the back of the wafer, contamination on the conductor tracks, or damage to the conductor tracks cannot be taken into account using known methods, so that reliable and precise voltage measurement across the components is not possible.

[0008] Another problem identified by the inventors is that components with a recessed contact pad, one arranged in a cavity, or one offset downwards cannot be contacted using known methods. In particular, the contact pads of such components cannot be contacted with the previously used planar conductor tracks on a flex board, since these conductor tracks rest on the highest point (component surface) and do not reach into the recess of the contact pads. Thus, no electrical contact can be established between the conductor track and the component contact pad.

[0009] In addition, the alignment of components and measurement equipment has traditionally been performed manually using a camera and manually operated adjustment screws for an X and Y position, as well as a rotational position around the Z axis of a component holding device (e.g., a wafer table). This process is very time-consuming, and manual alignment correction, including the components or measurement equipment, must be performed again after each component or wafer change.

[0010] The present invention is therefore based on the object of specifying a method and a device by means of which at least one of the aforementioned problems can be solved. One object of the invention is solved by a method having the features of claim 1, and by a method having the features of claim 11. One object of the invention is further solved by a device having the features of independent claim 13, and by a device having the features of claim 16. Preferred embodiments and developments of the invention are specified in the dependent claims.

[0011] A method according to one embodiment serves for electrically contacting at least one electrical or optoelectronic component or several electrical or optoelectronic components which are, for example, integrated into a semiconductor wafer or mold wafer, or arranged on a ceramic substrate or a circuit board.

[0012] In the case of a plurality of components, these are not separated during electrical contacting, but are still located in the wafer composite or are arranged on a carrier in a corresponding grid with predefined distances from one another. The semiconductor wafer can be understood as the wafer on which the components are formed. The components are arranged in the semiconductor wafer, for example, in a matrix of rows and columns. The semiconductor wafer contains semiconductor material, but does not have to consist exclusively of semiconductor material, but can also, for example, comprise metals and / or insulators. After carrying out the method described in the present application, the components can be separated into semiconductor chips, for example by sawing.

[0013] The method provides that a flexible element is provided which has a first main surface on which at least one first conductor track and at least one second conductor track, which is electrically insulated from the at least one first conductor track, are arranged.

[0014] The flexible element is arranged with respect to the at least one component such that the first main surface of the flexible element, on which the conductor tracks are located, faces the at least one component. For example, the flexible element is arranged above the at least one component.

[0015] Furthermore, the flexible element is bent and pressed onto the at least one component such that a first contact element of the at least one component comes into contact with the at least one first and the at least one second conductor track. The first contact element can be electrically contacted by the conductor tracks, which makes it possible to apply an electrical signal to the at least one component or to measure an electrical parameter via the at least one component.

[0016] In order to apply the electrical signal or to be able to measure an electrical characteristic via the at least one component, a first line and a second line electrically insulated from the first are also provided, which are each connected to a second contact element of the at least one component and thus contact this.

[0017] A defined, in particular constant current or a constant voltage is applied to the at least one first conductor track and the first line in order to operate the at least one component for testing purposes. At the same time, the reaction of the applied constant current or the constant voltage, for example the voltage drop across the at least one component, is measured via the at least one second conductor track and the second line in order to be able to make a statement about the functionality of the at least one component based on the measured value.

[0018] Such a measurement makes it possible to determine a voltage drop across the at least one component during operation, largely independently of any contact resistance between the conductor tracks and lines and the contact elements, and is based on the principle of a three-point method or three-wire measurement or on the principle of a four-point method or four-wire measurement. A controlled and defined current flows across the at least one first conductor track and the first line, while the potential difference or the electrical voltage dropped across the at least one component during operation is measured across the at least one second conductor track and the second line. In particular, the “current-free” voltage measurement across the at least one second conductor track and the second line is independent of any contact resistance.In the case of a three-wire measurement, the first and second lines can be brought together at a point before they contact the second contact element, resulting in a three-wire measurement as opposed to a four-wire measurement.

[0019] Corresponding electrical signals can be measured via the conductor tracks and lines, in particular in response to the electrical signals applied to the at least one component. This allows the function of the at least one component to be checked. For example, a current-voltage characteristic curve of the at least one component can be recorded. Alternatively, only one or more points on the current-voltage characteristic curve can be recorded.

[0020] The flexible element can be, for example, a printed circuit board, also

[0021] A PCB (printed circuit board) must be a printed circuit board or circuit board that has a suitable level of flexibility. A printed circuit board has a body made of electrically insulating material with conductive tracks adhered to it. Fiber-reinforced plastic can be used as the electrically insulating material. For example, glass fibers can be embedded in a polyimide, epoxy resin, or silicone resin. The desired flexibility of the printed circuit board can be achieved, in particular, by making the board sufficiently thin.

[0022] The flexible element can, however, also be formed by a thin film, such as a thin plastic film, for example a polyimide or polyethylene or polyethylene terephthalate film, on which the conductor tracks are arranged, for example printed.

[0023] The conductor tracks can be etched from a thin layer or printed onto the flexible element. For example, the conductor tracks can be made of copper, e.g., rolled copper (high flexibility) or electrolytic copper (more brittle).

[0024] The conductor tracks can extend essentially in a straight line or in a linear fashion and be aligned parallel to one another. The respective width of the conductor tracks can be in the range from 8 to 200 pm. Such a width makes it possible to contact even small contact elements or bond pads of the at least one component, which typically have widths in the range from 60 to 140 pm.

[0025] The flexible element can be bent with the aid of a tool. The tool, for example a doctor blade, which in particular has a blade geometry, can be pressed onto a second main surface of the flexible element opposite the first main surface in such a way that the flexible element is bent in the desired manner. The flexible element can be fastened at two opposite ends to a suitable holder. The tool makes it possible in a simple manner to bend the flexible element in such a way that the conductor tracks arranged on the first main surface of the board touch the first contact element of the at least one component.

[0026] According to one embodiment, the first contact element is arranged on an upper side of the at least one component, and the second contact element is arranged on an underside of the at least one component opposite the upper side. The first and second contact elements can, for example, be an anode and cathode connection via which the at least one component can be connected in the vertical direction. In this case, the first and second lines can be formed by electrical connections on the underside of the at least one component, which make contact with the second contact element.

[0027] According to an alternative embodiment, the at least one component has a so-called flip-chip configuration, i.e., all electrical contact elements are arranged on the upper side of the at least one component facing the board. In this case, the first line can be formed by at least one third conductor track on the first main surface, which is electrically insulated from at least one first and at least one second conductor track, and the second line can be formed by at least one fourth conductor track on the first main surface, which is electrically insulated from at least one first, at least one second, and at least one third conductor track.On the first main surface, in addition to the at least one first and the at least one second conductor track, at least one third and at least one fourth conductor track are arranged, wherein the at least one third and the at least one fourth conductor track also contact the second contact element of the at least one component by bending and pressing the flexible element onto the at least one component.

[0028] In addition to the first and second contact elements, the at least one component can have further contact elements, for example signal inputs and outputs or data inputs and outputs, which can also be contacted by means of further conductor tracks on the first main surface and can be supplied with a signal. Furthermore, further measurements can be made on the at least one component via the further contact elements and conductor tracks, the results of which can contribute to a statement about the functionality of the at least one component.

[0029] The at least one electronic component can, in particular, be formed by an optoelectronic component designed to emit light when exposed to a corresponding signal. For example, the at least one component can be designed as a light-emitting diode (LED), an organic light-emitting diode (OLED), or a laser diode (LD).

[0030] The light emitted by the at least one optoelectronic component can be, for example, light in the visible range, ultraviolet (UV) light and / or infrared (IR) light.

[0031] By applying electrical signals, in particular a current, to the at least one optoelectronic component, it can be stimulated to generate light. To test the functionality of the at least one optoelectronic component, in addition to measuring the voltage, the light emitted by the at least one component can be measured using a sensor. For example, the sensor can record the light emitted by the component. The sensor can be, for example, a scanner or a camera.

[0032] The at least one electronic component can also be formed by a sensor, for example a photodiode, or an integrated circuit, the functionality of which is to be checked.

[0033] According to at least one embodiment, the method is used to simultaneously electrically contact a plurality of components arranged in series by bending and pressing the flexible element onto the plurality of components arranged in series.

[0034] In particular, by bending and pressing the flexible element, a plurality of components arranged in a row are touched along a line by the flexible element or the conductor tracks located thereon. In the case of a semiconductor wafer which has components arranged in rows and columns, only the contact elements of those components which are arranged in the same row or row of the semiconductor wafer are brought into contact with the conductor tracks at the same time. By bending and pressing the flexible element, in particular the first contact elements of the components arranged in a row each come into contact with a first and a second conductor track.

[0035] The plurality of first and second conductor tracks on the main surface of the flexible element can each be isolated from one another, and the current impression or voltage measurement can be carried out separately via each component via the first and second conductor tracks connected to the first contact element. However, the first and / or second conductor tracks can each also have a common connection area, so that a total current can be connected to the first conductor tracks and / or a total voltage measurement can be connected to the second conductor tracks.

[0036] In order to successively contact all or a specific portion of the components of the semiconductor wafer, the tool can be moved along the flexible element. By moving the tool along the flexible element, in particular such that contact elements of components arranged in columns successively contact the conductor tracks, the components in different rows of the semiconductor wafer can be tested successively. The tool moves in particular in a direction parallel to the conductor tracks or perpendicular to the component rows of the semiconductor wafer.

[0037] Alternatively, it would also be conceivable to design the flexible element in a fixed manner and to move the semiconductor wafer with respect to the flexible element in order to be able to test the components line by line.

[0038] Since the components arranged in a row of the semiconductor wafer are contacted simultaneously and all rows of the semiconductor wafer are tested one after the other, the testing of the components can be carried out relatively quickly and with little effort.

[0039] Compared to other measurement methods, this reduces the measurement time to just a few seconds per semiconductor wafer. Furthermore, the method described here does not cause pin marks on the components, which are often considered a problem during further processing.

[0040] The second contact elements of the components can be electrically coupled to one another, particularly if they are arranged on the underside of the components. This can be ensured, for example, by the semiconductor wafer itself or by a carrier on which the components are arranged. The coupled second contact elements are then contacted by the first and second lines, so that the corresponding testing or measurement of the components can be carried out.

[0041] Each of the conductor tracks or lines can be connected to a corresponding test unit for testing or measuring the components.

[0042] For currentless voltage measurement across the at least one second conductor track and the second line, the second line can comprise a pin or spring contact pin, by means of which electrical contact is established with the second contact element. In particular, the pin or spring contact pin can be integrated into a carrier on which the at least one component is arranged and can establish contact with the second contact element.

[0043] According to at least one embodiment, the at least one first and the at least one second conductor track each have at least one elevation in the direction away from the first main surface. The elevations can in particular have a height such that a first contact element of the at least one component, which is set back relative to a top side of the at least one component, can be contacted by means of the at least one first and the at least one second conductor track. The elevations result in correspondingly 3D structured, bendable conductor tracks by means of which components with a recessed contact element can also be electrically contacted, in that the elevations on the conductor tracks engage in the recess in which the contact elements are arranged and the elevations come into contact with the contact elements.The bumps on the conductor tracks can be made of copper (Cu) or harder materials such as nickel (Ni) or titanium nitride (TiN) to achieve long service life. A combination of materials is also possible, with the bumps being grown from Cu onto the conductor tracks and then coated with a hard Ni or TiN plating. For good electrical contact resistance and as corrosion protection, the bumps can also be coated with a layer of gold.

[0044] Not least in the case of elevations on the conductor tracks, but also for all further embodiments of the present invention, it is necessary that the flexible element is aligned with the at least one component with sufficient precision to ensure that the at least one first conductor track and the at least one second conductor track come into contact with the first contact element of the at least one component.

[0045] Therefore, a method is also proposed, in particular a method which can be combined with the already described and the further embodiments of a method of the present application, by means of which the position of at least one electrical component relative to a flexible element can be determined. The flexible element can be designed in accordance with the preceding embodiments and it has a first main surface on which at least one first conductor track and at least one second conductor track, which is electrically insulated from the at least one first conductor track, are arranged. The position of the at least one electrical component relative to the flexible element is determined by means of a camera system.For this purpose, the camera system determines an offset occurring to a target position of the at least one component relative to the flexible element for one or more reference points on the component and the flexible element, and can use this to make an overall statement about the X and Y position, as well as the rotation position about the Z axis of the at least one component relative to the flexible element.

[0046] Deliver element .

[0047] By means of this information, the at least one component can then be aligned with respect to the flexible element in such a way that the at least one first and the at least one second conductor track and a first contact element of the at least one component are opposite one another.

[0048] For this purpose, the camera system can be arranged between the at least one component and the flexible element. In particular, the camera system can comprise two miniature cameras with small external dimensions, which are mounted on a motor-driven boom and can be inserted between the at least one component and the flexible element. One of the cameras can be oriented toward the flexible element, and one of the cameras toward the at least one component.

[0049] The camera directed toward the flexible element can capture the conductor tracks and a contact line between the tool and the flexible element. For this purpose, the flexible element can be designed to be at least partially transparent, for example. The second camera, directed toward the at least one component, can capture the position of the at least one component.

[0050] However, it is also possible for the camera system to be arranged outside the flexible element and the at least one component, for example, above the flexible element. The camera system can, for example, have a camera by means of which the position of the flexible element and the conductor tracks located thereon relative to the at least one component is determined. For this purpose, the flexible element can, for example, be designed to be at least partially transparent, so that when looking at the flexible element, for example, both the conductor tracks and the at least one component are visible.At least partially transparent can in particular also be understood to mean that the flexible element is transparent at least for light in the non-visible UV or infrared spectrum, so that by means of the camera system it can be possible to determine the position of the flexible element and the conductor tracks located thereon relative to the at least one component using light in such a wavelength range.

[0051] An image processing system can then process the information obtained, and the at least one component can be aligned relative to the flexible element. The alignment can be automated using servo motors on, for example, a carrier (wafer table) on which the at least one component is arranged. Alternatively, the alignment can also be automated using servo motors on a holder for the flexible element. Such automated alignment of the components before a measurement saves enormous amounts of time and also increases the accuracy of the process. Additionally or alternatively, the tool can also be aligned relative to the flexible element using one or more servo motors.

[0052] A device according to one embodiment is used for making electrical contact with at least one electronic component, for example a component in a semiconductor wafer. The device comprises a flexible element which has a first main surface on which at least one first conductor track and at least one second conductor track, which is electrically insulated from the at least one first conductor track, are arranged. The device also comprises a first line and a second line, which is electrically insulated from the first line and which can be brought into electrical contact with a second contact element of the at least one component. The device also comprises a current or voltage source, or an analog or digital signal source, which is designed to apply a defined current, a defined voltage or a defined analog or digital signal to the at least one first conductor track and the first line.The device further comprises a measuring device, in particular a voltage measuring device, which is designed to measure a reaction to the signal applied to the at least one first conductor track and the first line, in particular a voltage drop across the at least one component, across the at least one second conductor track and the second line. The flexible element is fastened by means of a holder which is designed to hold the flexible element with respect to the at least one component in such a way that the first main surface of the flexible element points in the direction of the at least one component. The flexible element is designed to be bent and pressed onto the at least one component in such a way that a first contact element of the at least one component comes into contact with the at least one first and the at least one second conductor track.

[0053] In particular, the at least one first and the at least one second conductor track can each have at least one elevation in the direction away from the first main surface, wherein the elevations have a height such that a first contact element of the at least one component, which is set back relative to a top side of the at least one component, can be contacted by means of the at least one first and the at least one second conductor track via the elevations.

[0054] A device according to another embodiment for making electrical contact with at least one electronic component comprises a flexible element which has a first main surface on which at least one first conductor track is arranged. The device also comprises a first line which can be brought into electrical contact with a second contact element of the at least one component, a current source which is designed to apply a defined current to the at least one first conductor track and the first line, and a holder for the flexible element. The holder is designed to hold the flexible element with respect to the at least one component in such a way that the first main surface of the flexible element points in the direction of the at least one component.The flexible element is designed to be bent and pressed onto the at least one component in such a way that a first contact element of the at least one component comes into contact with the at least one first conductor track. And the at least one first conductor track has at least one elevation in the direction away from the first main surface, which elevation has a height such that a first contact element of the at least one component, which is set back relative to a top side of the at least one component, can be contacted by means of the at least one first conductor track.

[0055] Such a device can be particularly suitable for carrying out a two-wire or three-wire measurement via the at least one component, wherein the at least one component has a first contact element which is set back relative to a top side of the at least one component and which is difficult to contact using known methods.

[0056] The aforementioned devices for electrically contacting the at least one component can also comprise the above-described embodiments of the method for electrically contacting the at least one component. The devices can each comprise a tool designed to press onto a second main surface of the flexible element opposite the first main surface in order to bend the flexible element and press it against the at least one component.

[0057] Furthermore, the devices can each comprise a camera system designed to determine the position of the at least one component relative to the flexible element. The camera system can be designed to be arranged between the at least one component and the flexible element.

[0058] The at least one component and the flexible element can also be aligned with one another via a movable table on which the at least one component is arranged and which is designed to be movable.

[0059] In the following, embodiments of the invention are explained in more detail with reference to the accompanying drawings, which schematically show:

[0060] Fig. 1 shows a device for electrically contacting at least one electronic component according to some aspects of the proposed principle;

[0061] Fig. 2 shows a further embodiment of a device for electrically contacting at least one electronic component according to some aspects of the proposed principle;

[0062] Fig. 3 shows conductor tracks for contacting a contact element of electronic components according to some aspects of the proposed principle;

[0063] Fig. 4A and 4B show a further embodiment of a conductor track design for contacting a contact element of electronic components according to some aspects of the proposed principle and an electronic component to be contacted;

[0064] Fig. 5 is a side view of an electronic component to be contacted, which has a contact element set back from a top side of the component; and

[0065] Fig. 6A and 6B show a further embodiment of a conductor track design for contacting a contact element of electronic components according to some aspects of the proposed principle.

[0066] In the following detailed description, reference is made to the accompanying drawings which form a part of this description, and in which is shown by way of illustration specific embodiments in which the invention may be practiced. Since components of embodiments can be positioned in a number of different orientations, the directional terminology is for the purpose of illustration and is in no way limiting. It is understood that other embodiments may be utilized and structural or logical changes may be made without departing from the scope of the invention. It is to be understood that the features of the various embodiments described herein may be combined with one another unless specifically indicated otherwise. The following detailed description is therefore not to be taken in a limiting sense.In the figures, identical or similar elements are provided with identical reference numerals where appropriate.

[0067] Fig. 1 shows the schematic structure of a device 1 which is used for electrically contacting and testing at least one component or several components 2 which are integrated, for example, in a semiconductor wafer.

[0068] The device 1 comprises a table 18, which holds the at least one component 2 or the plurality of components as part of a semiconductor wafer, and a flexible element 3, for example a flexible circuit board or plastic film, with a first main surface 4a and a second main surface 4b opposite the first main surface 4a. The flexible element 3 is fastened in a holder 17 and by means of this is arranged with respect to the components 2 such that the first main surface 4a faces the components 2. A tool 11, for example a squeegee, which in particular has a blade geometry, is pressed onto the second main surface 4b, whereby the bending of the originally flat, for example, flexible element 3 in the direction of the components 2 is produced, as shown in Fig. 1, and thus contact is established between the first main surface 4a and first contact elements 9 (not shown) of the components 2.

[0069] A plurality of first conductor tracks 5 and second conductor tracks 6, which are electrically insulated from the first, are arranged on the first main surface 4a of the flexible element. The force exerted by the tool 11 on the flexible element 3 causes the first and second conductor tracks 5, 6 to come into contact with first contact elements 9 (not shown in the figure) of a plurality of components 2 arranged in a row. The first and second conductor tracks 5, 6 are arranged on the first main surface 4a in such a way and are pressed in the direction of the components 2 by means of the tool 11 in such a way that a respective first and a second conductor track contact a first contact element 9 of a plurality of components 2 arranged in a row.

[0070] The components 2 are arranged in rows and columns on the table 18, and the flexible element 3 is oriented relative to the components 2 such that the first and second conductor tracks 20 only come into contact with the first contact elements 9 of components 2 arranged in the same row at any one time. In Fig. 1, the rows extend perpendicular to the plane of the drawing.

[0071] The device 1 further comprises a first line 7 and a second line 8 which is electrically insulated from the first line and which is each in contact with a second contact element 10 (not shown) of the components on the underside of the components 2. In particular, the second contact elements of the components 2 can be electrically coupled to one another, for example by a semiconductor wafer into which the components are integrated, or by the table 18 on which the components are arranged. The coupled second contact elements are then contacted with the first and second lines. In the case shown, contact is made between the second line and the coupled second contact elements via a pin or spring contact pin which extends through the table 18.

[0072] A current source 15 is connected to the first conductor tracks 5 and the first line 7, by means of which current source a, in particular, constant current is impressed on the contacted components 2. One or more voltmeters 16 are connected to the second conductor tracks 6 and the second line 8, by means of which voltage drop across the contacted and energized components 2 can be measured. On the basis of the information obtained, a statement can be made about the functionality of the contacted and energized components 2. The separate and, in particular, currentless measurement of the voltage drop across the contacted and energized components 2 has the advantage that a possible contact resistance between conductor tracks and contact elements or lines and contact elements has no or only very little effect on the measurement. The meaningfulness of the measurement can be improved as a result.

[0073] Fig. 2 shows a further embodiment of the device 1. The device 1 additionally comprises a camera system 14 for detecting the position of the components 2 relative to the flexible element 3. For this purpose, the camera system 14 determines an occurring offset from a target position of the components 2 relative to the flexible element 3 for one or more reference points on the components and the flexible element 3, and can therefrom provide an overall statement about the X and Y position, as well as the rotational position about the Z axis of the components 2 relative to the flexible element 3.

[0074] Using this information, the table 18 on which the components are arranged can then be aligned with respect to the flexible element 3 in such a way that first and second conductor tracks 5, 6 and a first contact element 9 each lie opposite components 2.

[0075] In the case shown, the camera system 14 has two cameras with small external dimensions, which are mounted on a movable boom and are inserted between the components 2 and the flexible element 3. One of the cameras is oriented in the direction of the flexible element 3 and one of the cameras in the direction of the components 2. The camera directed in the direction of the flexible element can record the conductor tracks and a contact line between the tool and the flexible element. For this purpose, the flexible element can be designed to be at least partially transparent, for example. The second camera, which is directed in the direction of the at least one component, can record the position of the at least one component. An image processing system can then process the information obtained, and the table 18 with the components 2 arranged thereon can be aligned relative to the flexible element 3.The alignment can be automated by servo motors by moving the table in the X and Y directions, as well as by rotating it around the Z axis (shown by the arrows below the table 18).

[0076] Fig. 3 shows first and second conductor tracks 5, 6 and a conductor track design on the first main surface 4a of the flexible element 3 for contacting the first contact elements 9 of one or more optoelectronic components 2. As an example, the illustration shows six components arranged in a matrix, but the points to the right of and above the components 2 are intended to clarify that further components can be arranged in the corresponding direction in the same way.

[0077] A plurality of first conductor tracks 5 and second conductor tracks 6, which are electrically insulated from the first, are arranged on the first main surface 4a of the flexible element. The force exerted by the tool 11 on the flexible element 3 causes the first and second conductor tracks 5, 6 to come into contact with first contact elements 9 (not shown in the figure) of a plurality of components 2 arranged in a row. The first and second conductor tracks 5, 6 are arranged on the first main surface 4a in such a way and are pressed in the direction of the components 2 by means of the tool 11 in such a way that a respective first and a second conductor track contact a first contact element 9 of a plurality of components 2 arranged in a row.

[0078] The components 2 are arranged in rows and columns, and the first and second conductor tracks 5, 6 are arranged on the first main surface 4a of the flexible element 3 and oriented relative to the components 2 in such a way that a first and second conductor track 5, 6 is located opposite first contact elements 9 of a column of components 2. By pressing on the tool 11, for example a squeegee, which in particular has a blade geometry oriented in the direction of the rows of components, the arrangement and orientation of the components relative to one another means that at any one time the first and second conductor tracks 5, 6 only come into contact with the first contact elements 9 of components 2 that are arranged in the same row.

[0079] Fig. 4A shows a further embodiment of a conductor track design for contacting a first contact element 9 of optoelectronic components 2. The first and second conductor tracks 5, 6 are arranged on the first main surface 4a in an interlocking manner and at a distance from one another, similar to a zipper arrangement. The second conductor track has two sections, each of which contacts the first contact element 9, between which a first conductor track 5 is arranged, which contacts the first contact element 9. The arrangement shown results in two contact points for the voltage measurement on the first contact element 9, such that an error rate in the voltage measurement can be reduced if one of the sections of the second conductor track 6 does not come into contact with the first contact element 9. In addition, the two sections can compensate for any possible positioning inaccuracy between the conductor track and the contact element.For this purpose, the components 2 have a first contact element 9 according to Fig. 4B on their upper side 12a, so that contacting of the first contact element 9 with the conductor track design shown in Fig. 4A is possible.

[0080] Fig. 5 shows an optoelectronic component 2 in which the first contact element 9 is offset downward relative to a top side 12a of the optoelectronic component 2. With the method and the conductor tracks shown above, it would not be possible to contact the first contact element 9 with such a configuration of the component 2, since the conductor tracks would rest on the top side 12a but would not contact the first contact element.

[0081] In order to still be able to contact the first contact elements 9, the conductor tracks have elevations 13 according to an embodiment corresponding to Figures 6A and 6B, which have a height such that a first contact element 9 set back relative to a top side 12a of the components 2 can be contacted by means of the conductor tracks.

[0082] To ensure improved alignment of the conductor tracks and in particular of the elevations 13 relative to the first contact elements 9, the conductor tracks in the illustrated case have lateral bulges, similar to a cross, in the center of which a respective elevation 13 is arranged. This bulge or the resulting cross can be used similarly to a crosshair to determine the position and subsequent alignment. LIST OF REFERENCE SYMBOLS

[0083] 1 device

[0084] 2 Component

[0085] 3 flexible element

[0086] 4a first main surface

[0087] 4b second main surface

[0088] 5 first conductor track

[0089] 6 second conductor track

[0090] 7 first line

[0091] 8 second line

[0092] 9 first contact element

[0093] 10 second contact element

[0094] 11 Tools

[0095] 12a top

[0096] 12b bottom

[0097] 13 Survey

[0098] 14 Camera system

[0099] 15 Power source

[0100] 16 Voltmeter

[0101] 17 Bracket

[0102] 18 movable table

Claims

CLAIMS Method for electrically contacting at least one electronic component (2) comprising the steps: Providing a flexible element (3) having a first main surface (4a) on which at least one first conductor track (5) and at least one second conductor track (6) are arranged, electrically insulated from the at least one first conductor track; providing a first line (7) and a second line (8); Arranging the flexible element (3) with respect to the at least one component (2) such that the first main surface (4a) faces the at least one component (2); and Bending and pressing the flexible element (3) onto the at least one component (2) such that a first contact element (9) of the at least one component (2) comes into contact with the at least one first and at least one second conductor track (5, 6); Contacting a second contact element (10) of the at least one component (2) with the first and second conductors (7, 8); Applying a defined current to the at least one first conductor track (5) and the first line (7); and Measuring a voltage drop across the at least one component (2) via the at least one second conductor track (6) and the second line (8). The method according to claim 1, wherein the flexible element (3) is bent using a tool (11) that is pressed onto a second main surface (4b) of the flexible element (3) opposite the first main surface (4a). Method according to one of the preceding claims, wherein the first contact element (9) is arranged on a top side (12a) of the at least one component (2) and the second contact element (10) is arranged on a bottom side (12b) of the at least one component (2) opposite the top side (12a). Method according to claim 1 or 2, wherein the first and second contact elements (9, 10) are arranged on a top side (12a) of the at least one component (2), and wherein the first line (7) is formed by at least one third conductor track on the first main surface, which is electrically insulated from at least one first and at least one second conductor track (5, 6), and wherein the second line (8) is formed by at least one fourth conductor track on the first main surface (4a), which is electrically insulated from at least one first, at least one second, and at least one third conductor track (5, 6, 7).Method according to one of the preceding claims, wherein, by means of the method, a plurality of components (2) arranged in series are simultaneously electrically contacted by bending and pressing the flexible element (3) onto the plurality of components (2) arranged in series. Method according to claim 5, wherein, by bending and pressing the flexible element (3), the first contact elements (9) of the components (2) arranged in series each come into contact with a first and a second conductor track (5, 6). Method according to claim 5 or 6, wherein the second contact elements (10) of the components arranged in series. (2) are electrically coupled to one another, and the coupled second contact elements (10) are contacted with the first and second lines (7, 8).

8. Method according to one of claims 5 to 7, wherein the tool (11) is moved along the flexible element (3) such that the first contact elements (9) of components (2) arranged in columns come into contact one after the other with the conductor tracks (5, 6).

9. Method according to one of the preceding claims, wherein the at least one first and the at least one second conductor track (5, 6) each have at least one elevation (13) in the direction away from the first main surface (4a).

10. The method according to claim 9, wherein the elevations (13) have a height such that a first contact element (9) of the at least one component (2), which is set back relative to a top side (12a) of the at least one component (2), can be contacted by means of the at least one first and the at least one second conductor track (5, 6).

11. Method, in particular according to one of the preceding claims, comprising the steps: Detecting, by means of a camera system (14), the position of at least one electronic component (2) relative to a flexible element (3) having a first main surface (4a) on which at least one first conductor track (5) and at least one second conductor track (6) electrically insulated from the at least one first conductor track are arranged; and Aligning the at least one component (2) relative to the flexible element (3) such that the at least one first and at least one second conductor track (5, 6) and a first contact element (9) of the at least one component (2) are opposite one another.

12. The method according to claim 11, wherein the camera system (14) for detecting the position is arranged between the at least one component (2) and the flexible element (3).

13. Device (10) for electrically contacting at least one electronic component (2), comprising: a flexible element (3) having a first main surface (4a) on which at least one first conductor track (5) and at least one second conductor track (6) electrically insulated from the at least one first conductor track are arranged, a first line (7) and a second line (8) electrically insulated from the first line, which can be brought into electrical contact with a second contact element (10) of the at least one component (2), a current source (15) designed to apply a defined current to the at least one first conductor track (5) and the first line (7), a voltage measuring device (16) designed to measure a voltage drop across the at least one second conductor track (6) and the second line (8), and a holder (17) for the flexible element (3),wherein the holder (17) is designed to hold the flexible element (3) with respect to the at least one component (2) in such a way that the first main surface (4a) points in the direction of the at least one component (2), and wherein the flexible element (3) is designed to be bent and pressed onto the at least one component (2) in such a way that a first contact element (9), of the at least one component (2) comes into contact with the at least one first and the at least one second conductor track (5, 6). Device (10) according to claim 13, wherein the at least one first and the at least one second conductor track (5, 6) each have at least one elevation (13) in the direction away from the first main surface (4a). Device (10) according to one of claims 13 to 14, wherein the elevations (13) have a height such that a first contact element (9) of the at least one component (2), which is set back relative to a top side (12a) of the at least one component (2), can be contacted by means of the at least one first and the at least one second conductor track (5, 6).Device (10) for electrically contacting at least one electronic component (2), comprising: a flexible element (3) which has a first main surface (4a) on which at least one first conductor track (5) is arranged, a first line (7) which can be brought into electrical contact with a second contact element (7) of the at least one component (2), a current source (15) which is designed to apply a defined current to the at least one first conductor track (5) and the first line (7), and a holder (17) for the flexible element (3), wherein the holder (17) is designed to hold the flexible element (3) with respect to the at least one component (2) in such a way that the first main surface (4a) points in the direction of the at least one component (2). wherein the flexible element (3) is designed to be bent and pressed onto the at least one component (2) in such a way that a first contact element (9) of the at least one component (2) comes into contact with the at least one first conductor track (5), and wherein the at least one first conductor track (5) has at least one elevation (13) in the direction away from the first main surface (4a), which elevation has a height such that a first contact element (9) of the at least one component (2), which is set back relative to a top side (12a) of the at least one component (2), can be contacted by means of the at least one first conductor track (5). Device (10) according to one of claims 13 to 16, wherein the device (10) comprises a tool (11) designed to press onto a second main surface (4b) of the flexible element (3) opposite the first main surface (4a) in order to bend the flexible element (3).Device (10) according to one of claims 13 to 17, further comprising a camera system (14) which is designed to determine the position of the at least one electronic component (2) relative to the flexible element (3). Device (10) according to claim 18, wherein the camera system (14) is designed to be arranged between the at least one component (2) and the flexible element (3). Device (10) according to one of claims 13 to 19, further comprising a movable table (18) on which the at least one component (2) is arranged, and. which is designed to be movable in order to be able to align the at least one component (2) and the flexible element (3) with respect to one another.

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