Inductive arrangement
Patent Information
- Application Number
- EP2025152181
- Authority / Receiving Office
- EP · EP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-01-29
- Filing Date
- 2025-01-16
- Publication Date
- 2025-08-27
AI Technical Summary
Inductive arrangements such as chokes and transformers experience power losses due to winding resistance and core material losses, which are exacerbated by their increasing compactness, reducing available cooling surfaces and complicating heat dissipation.
An inductive arrangement with a T-shaped cooling device design featuring orthogonal wall parts and thermal couplings between windings and wall parts, along with heat sinks and cooling channels, enhances heat dissipation and prevents hot spots.
The design ensures even heat distribution and increased power loss dissipation, maintaining operating limits and extending the service life of compact inductive components.
Smart Images

Figure IMGAF001_ABST
Abstract
Description
[0001] The invention relates to an inductive arrangement according to the features of patent claim 1.
[0002] In inductive arrangements, particularly in chokes and transformers, power losses occur during operation, partly due to the winding resistance and partly due to losses in the core material, such as hysteresis losses, eddy current losses, and excess losses. To keep the inductive arrangement within its operating limits with regard to the maximum operating temperature and thus not impair its service life, this power loss must be dissipated. At the same time, inductive components or arrangements such as chokes and transformers are becoming increasingly compact while transmitting the same, or even greater, power. This reduces the available cooling surface and thus complicates heat dissipation.
[0003] German patent application DE 10 2017 126599 A1 discloses a cooling device that uses airflow generators and guide devices to enable efficient cooling in a compact installation space. The inductors are arranged side by side, with the inductors being aligned horizontally or vertically. The problem with this arrangement is the large amount of space required in one spatial direction due to the arranging of the inductors side by side.
[0004] This problem is solved by an inductive arrangement having the features of patent claim 1.
[0005] Advantageous embodiments and further developments of the invention are specified in the dependent claims.
[0006] According to the invention, an inductive arrangement is therefore provided with at least a first and a second winding and a heat dissipation device, wherein the heat dissipation device has a first wall part and a second wall part, wherein the first wall part is arranged at least partially orthogonal to the second wall part, wherein the first winding has a thermal coupling to the first wall part and the second winding has a thermal coupling to the second wall part and / or to the first wall part.
[0007] The wall sections of the inductive arrangement are components of a cooling device. In addition to the wall sections, the cooling device preferably has heat sinks arranged on the side surfaces of the wall sections. The first wall section is preferably arranged orthogonally on the second wall section. Particularly preferably, the end face of the second wall section is arranged centrally to a side surface of the second wall section. The cooling device thus has a T-shaped floor plan. The advantage of a T-shaped floor plan is that the cooling device is constructed symmetrically. This ensures even heat distribution throughout the entire inductive arrangement. In particular, this makes it possible to avoid hot spots.
[0008] Advantageously, the first winding has a thermal coupling to the first wall part and the second wall part, and the second winding has a thermal coupling to the first wall part and the second wall part. The first winding can also have a thermal coupling only to the first wall part, and the second winding can have a thermal coupling to the first wall part or the second wall part. The thermal coupling can be achieved, for example, by the wall parts lying flat against one another, at least in sections. The thermal coupling of a winding to both wall parts is particularly advantageous when the cooling capacity of one wall part is too weak. This allows one wall part to be made smaller and more cost-effective, since the other wall part is also deliberately involved in the cooling process.
[0009] The more wall sections that are thermally coupled with a winding, the more power loss can be dissipated. The larger the surface area of the wall sections that are thermally coupled with the winding, the more power loss can be dissipated.
[0010] In an advantageous embodiment of the invention, a first winding axis of the first winding is arranged parallel to the first wall section, and a second winding axis of the second winding is arranged parallel to the second wall section or parallel to the first wall section. The winding axes do not have to run parallel to a wall section, but can also have different orientation angles to each other. This is particularly advantageous when at least one wall section has a trapezoidal or parallelogram-shaped outline.
[0011] In a preferred development of the invention, a first winding axis of the first winding is arranged orthogonally to the first wall part and a second winding axis of the second winding is arranged orthogonally to the second wall part.
[0012] In a further advantageous embodiment of the invention, the first winding axis of the first winding is arranged parallel to the first wall part and a second winding axis of the second winding is arranged orthogonal to the second wall part or vice versa.
[0013] In a particularly advantageous development of the invention, the inductive component has a third winding, wherein the third winding has a thermal coupling to the first wall part and / or second wall part. By providing a third winding, all three side surfaces of the cooling device are covered with a winding, which increases the utilization of the installation space. Furthermore, the additional provision of a third winding enables more application possibilities. For example, all three windings can be connected in series, all in parallel, or just two windings in series. The windings can be part of a transformer.
[0014] The transformer can be designed as a single-phase, two-phase, three-phase or higher-phase transformer by connecting the individual windings accordingly.
[0015] In a three-phase arrangement, especially in the double-digit frequency range, the transformer can be connected in a star, delta, or other configuration. The winding(s) can be part of a choke or several chokes can be used as individual components.
[0016] Advantageously, a third winding axis of the third winding is arranged orthogonally or parallel to the first wall part.
[0017] In an advantageous embodiment of the invention, a third wall part is arranged orthogonally to the second wall part and parallel to the first wall part, wherein the third wall part is thermally coupled to the first and second wall parts. The third wall part is preferably arranged relative to the other wall parts such that the cooling device has an H-shaped outline. The third wall part can also be arranged such that the cooling device has a cross-shaped outline.
[0018] In a preferred embodiment of the invention, a fourth winding axis of a fourth winding is arranged parallel or orthogonal to the third wall section. The arrangement of a third wall section provides an additional side surface on which one or more windings can be arranged.
[0019] In a particularly advantageous development of the invention, a cooling channel runs through at least one wall section, preferably through all of the wall sections. The cooling device can have just a single cooling channel winding through all of the wall sections. A single cooling channel can be formed in one wall section, or multiple cooling channels can be formed in one wall section. A separate cooling channel can be formed in each wall section. This can, for example, run in a meandering shape within the wall section. Each cooling channel has its own connection, with each connection having one or more inlets and one or more outlets. More than one cooling channel can also run within a wall section. In particular, when a cooling channel runs through all of the wall sections, it is advantageous if the cooling device is formed from a monolithic unit. This means that no or fewer leaks occur.
[0020] A wall section can also be formed from two halves, which in particular represent two fin coolers. This allows the coils to be mounted on the flat sides of the fin coolers. The fins thus face each other, forming a kind of internal cooling channel. This can then typically be flowed through by air.
[0021] The working medium through the cooling channel can be, for example, air, water, water mixtures, liquids with high thermal conductivity, refrigerant (R134a), nitrogen, or other gases. For air or other gases, it is advisable to circulate the air or other gases through the cooling channel using a fan. For water or other liquids, it is advisable to use a pump to circulate the liquid through the cooling channel.
[0022] In a particularly preferred embodiment of the invention, at least two windings are arranged in a heat-conducting manner on one side surface of a wall section. For example, three, four, or five windings can be formed on one side surface of the wall section. The windings can be connected in parallel or in series, depending on the application. The windings can be arranged one above the other, next to each other, or one behind the other.
[0023] In an advantageous embodiment of the invention, heat sinks are thermally coupled to the winding and / or core and / or wall parts. The heat sinks are arranged on one side surface or preferably on all side surfaces of the cooling device. The heat sinks are mechanically connected to the side surfaces. The wall part and heat sink can be formed from a single piece. The heat sink preferably has fins on its side surfaces, which enlarge the surface area of the heat sink and thus increase heat dissipation. An insulating material, in particular heat-conducting foils, can be applied to the heat sink.
[0024] Advantageously, the first and / or, if applicable, the third wall section are at least partially in contact with the second wall section. This increases the thermal coupling between the wall sections, or even creates it in the first place. Hot spots between the wall sections can thus be better compensated.
[0025] In a particularly advantageous development of the invention, the first, second, and optionally third wall sections are formed as a single piece. Single-piece elements have the advantage of greater stability and rigidity. This is particularly important when the structural integrity and performance of the inductive arrangement must be ensured. Furthermore, manufacturing and assembly are simplified. Fewer assembly steps are required, and fewer tools and tool changes are required. This also reduces the susceptibility to errors. The components can also be screwed, glued, caulked, clipped, or similarly connected.
[0026] In a particularly preferred development of the invention, the first wall section and / or optionally third wall section is arranged so as to be displaceable relative to the second wall section. The first and optionally third wall section preferably have elongated holes for this purpose. In conjunction with screws, bolts or pins, this allows the wall sections to be aligned as required. Elongated holes also have the advantage that, under thermal loads, play is possible between the connecting elements, thus reducing stresses. In addition, rail or guide elements can be embedded in the wall sections. A rail element is embedded in one wall section, and a guide element is attached to the other wall section to be connected. Other options for the displaceable attachment of two wall sections are joints or hinges. This enables relative movement between the wall sections.Depending on the type of joint, this can be a rotating or sliding movement. Rollers or ball bearings are another mounting option. Telescopic guides can also be used. Telescopic guides have sections that can be extended and retracted.
[0027] Advantageously, a heat pipe runs through at least one wall section, preferably through all wall sections. One or more heat pipes can also run through each wall section. A heat pipe is a heat transfer element used to efficiently transfer heat from one location to another. A heat pipe comprises a closed tube or a cavity within an assembly containing a working fluid, usually a coolant, but also water. The working fluid evaporates at a high-temperature location and condenses at another low-temperature location. Gravity or capillary forces carry the condensate back to the hot spot, and the cycle begins again. In electronic components, a heat pipe is used in conjunction with cold plates as a heat conduction pipe. Heat pipes are characterized by their extremely good heat dissipation over short or medium distances.Heat pipes are particularly advantageous in applications where space is limited.
[0028] In an advantageous embodiment of the invention, the first wall part and / or optionally the third wall part has a hydraulic connection to the second wall part. The wall parts are arranged in contact with each other, thus ensuring a high thermal coupling between the wall parts. Furthermore, a hydraulic connection has some play. The wall parts can slide slightly against each other without permanently affecting stability. Furthermore, hydraulic connections are characterized by their compact design and isolation from vibrations and shocks.
[0029] The inductive arrangement can comprise one or more chokes or one or more transformers. The transformer or choke preferably has a core with a higher permeability than air. The higher permeability of the core can drastically increase the magnetic effect of the choke or transformer. In particular, materials such as ferrites, iron powder, amorphous alloys, nanocrystalline alloys, silicon steel, or permalloy are preferably used for the core of a choke or transformer. The winding is preferably made of copper or aluminum. The winding has more or fewer turns depending on the design. An insulating material can be arranged around the turns.
[0030] In the following, exemplary embodiments of the invention are explained with reference to the figures. They show: Fig. 1 Top view of the cooling device, which has a first and second wall part, Fig. 2 Cooling device from Fig. 1 with arranged heat sinks, Fig. 3A Schematic representation of the invention, with a first and second wall part and three windings, the winding axes of which run parallel to a wall part, Fig. 3B Schematic representation, with a first and second wall part and two windings, Fig. 3C Schematic representation, with a first and second wall part and two windings, Fig. 4A Schematic representation of the invention with three wall parts and four windings, Fig. 4B Schematic representation of the invention with two wall parts, wherein two windings are arranged on a side surface of a wall part, Fig. 5 Schematic representation of the invention with two wall parts and three windings, Fig. 6 Schematic representation of the cooling device with two wall parts shifted relative to one another, and Fig. 7 Schematic representation of the cooling device with three wall parts.
[0031] In the following figures, the same reference symbols designate the same parts with the same meaning.
[0032] In Fig. 1 A cooling device 11 is depicted, which has a first wall part 5 and a second wall part 6. The first wall part 5 and the second wall part 6 are rectangular. However, the first wall part 5 and / or the second wall part 6 can also be trapezoidal or parallelogram-shaped.
[0033] The second wall part 6 is arranged orthogonally to the first wall part 5. However, the first and second wall parts 5, 6 can also be at an angle to each other that is not a right angle. The second wall part 6 is arranged centrally with respect to a side surface 9 of the first wall part 5. The second wall part 6 can also be arranged off-center with respect to a side surface 9 of the first wall part 5.
[0034] The first wall part 5 and the second wall part 6 touch each other. Preferably, the first and second wall parts 5, 6 are screwed together. The first and second wall parts 6 can also be glued, caulked, clipped, or nailed together. The first and second wall parts 5, 6 can also be arranged such that they do not directly touch each other. The first and second wall parts 5, 6 are then connected to each other via an auxiliary device. The first and second wall parts 5, 6 can also be connected to each other via a hydraulic connection.
[0035] A cooling channel 12 is formed through each of the first and second wall parts 5, 6. Each cooling channel 12 has an inlet 13 and an outlet 14. The cooling channel 12 preferably runs in a meandering shape through the first and second wall parts 5, 6. The cooling channel 12 is designed so that the heat is distributed over the entire surface of the cooling device 11. The shape of the cooling channel 12 and the surface finish are designed to optimize flow. A single cooling channel 12 can be led through the first and second wall parts 5, 6. This means that only one inlet 13 and one outlet 14 are required for the cooling device 11 of the inductive arrangement 1, thereby reducing the component complexity and costs. A disadvantage is that the demands on the mechanics increase. In particular, leaks must not occur at the connection between the wall parts 5, 6.In a cooling channel 12 designed in this way, the first and second wall parts 5, 6 are preferably formed from a monolithic unit.
[0036] In Fig. 2 the cooling device 11 is made of Fig. 1 , wherein heat sinks 10 are arranged on the side surfaces 9 of the wall sections 5, 6 of the cooling device 11. The heat sinks 10 have a flat rear side 16 and two flat side sides 15. The front side 17 of the heat sink 10 has two semicircles 18. The semicircles 18 of a heat sink 10 are each of the same size. The heat sink forms three pillars 19, 20, wherein the pillars 19, 20 protrude towards the front side 17 of the heat sink 10. The outer pillars 19 are part of the side side 15 of the heat sink 10, wherein the outer pillars 19 are larger than the middle pillar 20.
[0037] The outer pillar 19 of a heat sink 10, which is arranged closer to the second wall part 6 and is spaced apart from the first wall part 5, is spaced apart from the first wall part 5. However, this outer pillar 19 can also be directly adjacent to the first wall part 5 and have a thermal coupling with the first wall part 5, thereby increasing heat dissipation.
[0038] The rear side 16 of the heat sink 10 is directly connected to a side surface 9 of a wall part 5, 6 of the cooling device 11. In Fig. 2 A heat sink 10 is arranged on the side surfaces 9 of the first and second wall sections 5, 6. The heat sinks 10 arranged on the side surfaces 9 of the second wall section 6 are arranged axially symmetrically to one another. A cooling channel 12 is guided through each of the first and second wall sections 5, 6 of the cooling device 11. Only one continuous cooling channel 12 can also run through both wall sections 5, 6.
[0039] In the assembled state, a winding 21 is arranged in the semicircles 18 of the heat sink 10. The winding axis W is arranged parallel to the side surface 9 of a wall part 5, 6. The winding 21 has N conductors, where N is a natural number. The winding 21 can also have a number of windings 21 different from N. The semicircle 18 ensures that the winding 21 is arranged with the largest possible area as close as possible to the heat sink 10 in order to dissipate as much heat as possible. The heat sink 10 and the wall parts 5, 6 are preferably formed from a monolithic unit.
[0040] The windings 21 are preferably wound around cores made of ferrite or iron powder. This significantly increases the inductance of the choke or transformer.
[0041] In Fig. 3A A schematic representation of the inductive arrangement 1 is shown. A first wall part 5 and a second wall part 6 are visible, with the first wall part 5 being arranged orthogonally on the second wall part 6. The first wall part 5 and the second wall part 6 together form a cooling device 11.
[0042] A second winding 3 and a third winding 4 are arranged on the side surfaces 9 of the second wall part 6. The first winding 2 is arranged on the side surface 9 of the first wall part 5. The first winding axis W1 of the first winding 2 is arranged parallel to the side surface 9 of the first wall part 5. The first winding axis W1 of the first winding 2 can also be arranged parallel to the side surface 9 of the first wall part 5. The first winding 2 can be thermally coupled to the first wall part 5 and / or the second wall part 6.
[0043] The second winding 3 and the third winding 4 are each arranged on a side surface 9 of the second wall part 6. The winding axes W2, W3 of the second winding 3 and the third winding 4 run parallel to the side surface 9 of the second wall part 6. The winding axis W2, W3 of the second or third winding 3, 4 can also run perpendicular to the side surface 9 of the second wall part 10. The second winding 3 and the third winding 4 are preferably thermally coupled to the second and / or first wall part 5, 6.
[0044] A second and third winding 3, 4 are arranged on both side surfaces 9 of the second wall part 6. The second and third winding 3, 4 have a second and third winding axes W2, W3. The second and third winding axes W2, W3 are each arranged parallel to the side surface 9 of the second wall part 6.
[0045] In Fig. 3B is a schematic representation of the inductive arrangement 1. The inductive arrangement 1 has the same cooling device 11 as in Fig. 3A on.
[0046] Two windings 2, 3 are thermally coupled to the cooling device 11. On the first wall part 5, the first winding axis W1 of the first winding 2 runs parallel to the side surface 9 of the first wall part 5. The second winding axis W2 of the second winding 3 runs parallel to a side surface 9 of the second wall part 6. The winding axes W1, W2 of the first winding 2 and / or second winding 3 can also run perpendicular to the first wall part 5 or the second wall part 6.
[0047] In Fig. 3C a schematic representation of the inductive arrangement 1 is shown 1. The inductive arrangement 1 has the same cooling device 11 as in Fig. 3A on.
[0048] Two windings 21 are thermally coupled to the cooling device 11. The second winding 3 and the third winding 4 are arranged on the side surfaces 9 of the second wall part 6. No winding 21 is arranged on the side surface 9 of the first wall part 5. The winding axes W2, W3 of the second winding 3 and the third winding 4 run parallel to the side surface 9 of the second wall part 6. The winding axes W2, W3 of the second winding 3 and the third winding 4 can also be aligned perpendicular to the side surface 9 of the second wall part 6.
[0049] In Fig. 4A A schematic representation of the inductive arrangement 1 is shown. The cooling device 11 has a first, second and third wall part 5, 6, 7, wherein the first wall part 5 and the third wall part 7 are aligned orthogonally to the second wall part 6. Preferably, the first wall part 5 and the third wall part 7 touch the second wall part 6. The first wall part 5 has a side surface 9, the second wall part 6 has two side surfaces 9 and the third wall part 7 has a side surface 9, on each of which a winding 2, 3, 4, 8 is arranged.
[0050] A fourth winding 8 is arranged on the side surface 9 of the third wall section 7. The first winding 2 can be thermally coupled to the first and second wall sections 5, 6. The second winding 3 and third winding 4 are arranged on the side surfaces 9 of the second wall section 6. The winding axes W1-W4 of the windings 21 all run parallel to the wall section 5-7 to which they are arranged. The winding axes W1-W4 of the windings 21 can also run perpendicular to the wall section 5-7 to which they are arranged. The first to fourth windings 2, 3, 4, 8 can be thermally coupled to each wall section 5-7. A winding 21 does not have to be arranged on all side surfaces 9.
[0051] In Fig. 4B a schematic representation of the inductive arrangement 1 is shown, wherein the same cooling device 11 as in Fig. 3A is shown.
[0052] A first winding 2 is arranged on the side surface 9 of the first wall part 5, wherein the winding axis W1 of the first winding 2 runs parallel to the side surface 9 of the first wall part 5.
[0053] Two second windings 3 are arranged on one of the side surfaces 9 of the second wall part 6. The winding axes W2 of the two second windings 3 run parallel to the side surface 9 of the second wall part 6. However, more than two second windings 3 can also be arranged on a side surface 9 of a wall part 5, 6. In particular, three, four or five windings 21 can be arranged on a single side surface 9. The winding axes W2 of the second windings 3 can be different or the same with respect to the side surface 9 of the second wall part 6. A different number of second windings 3 can also be arranged on different side surfaces 9. More than one winding 21 can also be arranged on each other side surface 9.
[0054] In Fig. 5 is a schematic representation of the inductive arrangement 1. The inductive arrangement 1 has the same cooling device 11 as in Fig. 3A on.
[0055] A first winding 2 is arranged on the first wall part 5, and a second winding 3 and a third winding 4 are arranged on the second wall part 6. The winding axes W1-W3 of the first to third windings 2-4 are perpendicular to the side surface 9 of the respective associated wall part 5, 6.
[0056] Fig. 6 shows a schematic representation of the cooling device 11 of the inductive arrangement 1. The first wall part 5 is orthogonal to the second wall part 6. The first wall part 5 and the second wall part 6 preferably touch one another and are thermally coupled. The end face 22 of the second wall part 6 is arranged offset on a side surface 9 of the first wall part 5. The second wall part 6 can be arranged at different positions on the side surface 9 of the first wall part 5. The second wall part 6 is displaceable both vertically and along the longitudinal axis of the first wall part 5.
[0057] The displacement can be achieved using a slotted hole or multiple individual holes. The slotted hole or the individual hole is formed in the first or second wall section 5, 6. The individual wall sections 5, 6 are fixed to one another using a screw or similar device. In such an arrangement, each wall section 5, 6 preferably has its own cooling channel 12. However, only one cooling channel 12 can also be run through the entire cooling device 11. In addition to a screw connection, rail and guide elements, plain bearings, joints or hinges, telescopic guides, or pneumatic or hydraulic cylinders can also be used to displaceably fix the first and second wall sections 5, 6 relative to one another.
[0058] More than two wall parts 5, 6, in particular three wall parts 5, 6, 7 can also be slidably connected to one another.
[0059] In Fig. 7a schematic representation of the cooling device 11 is shown. The cooling device 11 has a first wall part 5, a second wall part 6 and a third wall part 7. The second wall part 6 and the third wall part 7 are aligned orthogonally to the first wall part 5. The first wall part 5 and the second wall part 6 run parallel to one another. The second wall part 6 and the third wall part 7 are connected to the same side surface 9 of the first wall part 5. The second wall part 6 and the third wall part 7 can be slidably connected to the side surface 9 of the first wall part 5. The second wall part 6 and the third wall part 7 can also be arranged on different side surfaces 9 of the first wall part 5. List of reference symbols
[0060] 1Inductive arrangement 2First winding 3Second winding 4Third winding 5First wall section 6Second wall section 7Third wall section 8Fourth winding 9Side surface 10Heat sink 11Cooling device 12Cooling channel 13Inlet 14Outlet 15Side side 16Rear side 17Front side 18Semicircle 19Outer pillar 20Middle pillar 21Winding 22End face W1First winding axis W2Second winding axis W3Third winding axis W4Fourth winding axis WWanking axis
Claims
1. Inductive arrangement (1), with at least a first and a second winding (2, 3) and a heat dissipation device, characterized in that the heat dissipation device has a first wall part (5) and a second wall part (6), wherein the first wall part (5) is arranged at least partially orthogonal to the second wall part (6), wherein the first winding (2) has a thermal coupling to the first wall part (5) and the second winding (3) has a thermal coupling to the second wall part (6) and / or to the first wall part (5).
2. Inductive arrangement (1) according to claim 1, characterized in that the first winding (2) has a thermal coupling to the first wall part (5) and the second wall part (6) and the second winding (3) has a thermal coupling to the first wall part (5) and / or the second wall part (6).
3. Inductive arrangement (1) according to claim 1 or 2, characterized in thata first winding axis (W1) of the first winding (2) is arranged parallel to the first wall part (5) and a second winding axis (W2) of the second winding (3) is arranged parallel to the second wall part (6) or parallel to the first wall part (5).
4. Inductive arrangement (1) according to claim 1 or 2, characterized in that a first winding axis (W1) of the first winding (2) is arranged orthogonally to the first wall part (5) and a second winding axis (W2) of the second winding (3) is arranged orthogonally to the second wall part (6) or orthogonally to the first wall part (5).
5. Inductive arrangement (1) according to one of the preceding claims, characterized in that the inductive component (1) has a third winding (4), wherein the third winding (4) has a thermal coupling to the first wall part (5) and / or second wall part (6).
6. Inductive arrangement (1) according to one of the preceding claims, characterized in thata third winding axis (W3) of the third winding (4) is arranged orthogonally or parallel to the first wall part (5).
7. Inductive arrangement (1) according to one of the preceding claims, characterized in that a third wall part (7) is arranged orthogonally to the second wall part (6) and parallel to the first wall part (5), wherein the third wall part (7) is thermally coupled to the first and second wall parts (5, 6).
8. Inductive arrangement (1) according to one of the preceding claims, characterized in that a fourth winding axis (W4) of a fourth winding (8) is arranged parallel or orthogonal to the third wall part (7).
9. Inductive arrangement (1) according to one of the preceding claims, characterized in that a cooling channel (12) is guided through at least one wall part (5, 6, 7), preferably through all wall parts (5, 6, 7).
10. Inductive arrangement (1) according to one of the preceding claims, characterized in thatat least two windings (2, 3, 4) are arranged in a heat-conducting manner on a side surface (9) of a wall part (5, 6, 7).
11. Inductive arrangement (1) according to one of the preceding claims, characterized in that the heat sink (10) is thermally coupled to the winding and / or core and / or wall part (5, 6, 7).
12. Inductive arrangement (1) according to one of the preceding claims, characterized in that the first wall part (5) and / or optionally the third wall part (7) and the second wall part (6) lie at least partially touching one another.
13. Inductive arrangement (1) according to one of the preceding claims, characterized in that the first, second and optionally third wall part (5, 6, 7) are formed in one piece.
14. Inductive arrangement (1) according to one of the preceding claims, characterized in that the first wall part (5) and / or optionally third wall part (7) is displaceable relative to the second wall part (6).
15. Inductive arrangement (1) according to one of the preceding claims, characterized in that a heat pipe runs through at least one wall part (5, 6, 7), preferably through all wall parts (5, 6, 7).
16. Inductive arrangement (1) according to one of the preceding claims, characterized in that the first wall part (5) and / or optionally the third wall part (7) has a hydraulic connection with the second wall part (6).
Citation Information
Patent Citations
A high-frequency inductor embedded in a heat sink
CN106571209B
Inductor for use in e.g. mobile phone, has foil-wound windings whose edge extends out at front surface of coil and forms common core gap, where electrical and heat conducting insulation layers are arranged in gap or at front surface of coil
DE102010030411A1
Inductive component
EP2801987B1
Arrangement and transformer comprising the arrangement
EP3692556B1
Cooling assembly and transformer
EP4503070A1