Heating device and cooking appliance

Abstract

A heating device (100) and a cooking appliance (1000). The heating device (100) comprises a housing (30), an infrared heating assembly (10), and an electromagnetic heating assembly (20). A mounting cavity is formed in the housing (30); the infrared heating assembly (10) is mounted in the mounting cavity, and the infrared heating assembly (10) comprises an electric heating wire (11), the resistivity of the electric heating wire (11) being not less than 0.1µΩ·m; and the electromagnetic heating assembly (20) is mounted in the mounting cavity and located below the infrared heating assembly (10), and the electromagnetic heating assembly (20) and the infrared heating assembly (10) at least partially overlap in the vertical direction.

Description

CROSS-REFERENCES TO RELATED APPLICATIONS

[0001] The present invention claims priority to Chinese patent applications No. 202223411358.2 and 202223375925.3 filed December 15, 2022, and to Chinese patent application No. 202321949761.2 filed July 21, 2023, entire contents of which are incorporated herein by reference.FIELD

[0002] The present invention relates to the field of cooking appliance, and in particular to a heating device and a cooking appliance.BACKGROUND

[0003] Electromagnetic heating is to generate eddy currents at a bottom of cookware and further generate heat through coupling of a coil panel and the bottom of cookware. The electromagnetic heating is characterized by rapid heating, but poor uniformity and the presence of cold area. Furthermore, electromagnetic heating can only heat conductive cookware, such as commonly used iron cookware, graphite cookware, and the like, but cannot heat glass or ceramic cookware. Infrared heating is to generate heat by conduction and radiation. When heating starts, most of heat generated by resistance wires is absorbed by a heat insulation layer, a stove panel, and the like, and it takes a while to preheat cookware before it may be stably heated. Therefore, the cookware is heated up slowly and low in efficiency. However, after the cookware is heated to a certain temperature, the heating uniformity is good due to the effect of infrared light radiation.

[0004] Traditional hybrid solution of electromagnetic heating and infrared heating is generally a solution in which electromagnetic heating and infrared heating are arranged in inner and outer rings. Due to the limitation to the bottom area of the cookware, a heating area cannot be provided to be very large and thus an area allocated to electromagnetic heating and infrared heating is very small. In such a small area, it is difficult to provide a high-power electromagnetic heating assembly and an infrared heating device, resulting in a low heating power of traditional hybrid heating device.SUMMARY

[0005] The present invention aims to provide a heating device and a cooking appliance, and provide a hybrid electromagnetic and infrared heating device that may obtain high-power heating.

[0006] The present invention provides a heating device, including: a housing, an interior of the housing being provided with a mounting chamber; an infrared heating assembly mounted inside the mounting chamber, and including an electric heating wire, where resistivity of the electric heating wire is not less than 0.1µΩ·m; and an electromagnetic heating assembly mounted inside the mounting chamber and located below the infrared heating assembly, where the electromagnetic heating assembly and the infrared heating assembly are at least partially overlapped in an up-and-down direction; where a heat insulation cavity is formed at a position where a bottom surface of the infrared heating assembly and a top surface of the electromagnetic heating assembly are overlapped, the heating device further including a heat insulation member, the heat insulation member including a first heat insulation layer provided between the electromagnetic heating assembly and the infrared heating assembly, thermal conductivity of the first heat insulation layer being less than or equal to 0.02w / m·K.

[0007] The present invention further provides a cooking appliance including a heating device, where the heating device includes: a housing, an interior of the housing being provided with a mounting chamber; an infrared heating assembly mounted inside the mounting chamber, and including an electric heating wire, resistivity of the electric heating wire being not less than 0.1µΩ·m; and an electromagnetic heating assembly mounted inside the mounting chamber and located below the infrared heating assembly, the electromagnetic heating assembly and the infrared heating assembly being at least partially overlapped in an up-and-down direction. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] To illustrate solutions disclosed in the embodiments of the present invention or the prior art more clearly, the drawings used in the descriptions of the embodiments or the prior art will be briefly described below. The drawings in the following description are only certain embodiments of the present invention, and other drawings can be obtained according to structures shown in the drawings without any creative work for those skilled in the art. FIG. 1 is an exploded view of an embodiment of a cooking appliance according to the present invention; FIG. 2 is a three-dimensional schematic diagram of a heating device in FIG. 1; FIG. 3 is a three-dimensional schematic diagram of an infrared heating assembly in FIG. 1; FIG. 4 is a three-dimensional schematic diagram of an electromagnetic heating assembly in FIG. 1; FIG. 5 is a three-dimensional schematic diagram of a lead structure in FIG. 3; FIG. 6 is an exploded view of a front view of the cooking appliance in FIG. 1; FIG. 7 is a top view of an embodiment of a heating device according to the present invention; FIG. 8 is an exploded view of the heating device in FIG. 7; FIG. 9 is an exploded view of an infrared heating assembly in FIG. 8; FIG. 10 is a cross-sectional view of an embodiment of a cooking appliance according to the present invention; FIG. 11 is a three-dimensional schematic diagram of an embodiment of a mounting body according to the present invention; FIG. 12 is a cross-sectional view of an embodiment of a cooking appliance according to the present invention; FIG. 13 is an exploded view of an embodiment of an infrared heating assembly according to the present invention; FIG. 14 is an exploded view of an embodiment of an infrared heating assembly according to the present invention; FIG. 15 is a three-dimensional schematic diagram of an embodiment of a mounting body according to the present invention; FIG. 16 is a three-dimensional schematic diagram of an embodiment of a mounting body according to the present invention; FIG. 17 is a schematic structural diagram of an embodiment of a heating device according to the present invention; FIG. 18 is a side view of an embodiment of a heating device according to the present invention; FIG. 19 is a schematic structural diagram of an electromagnetic heating assembly in an embodiment of a heating device according to the present invention; FIG. 20 is a schematic structural diagram of an infrared heating assembly and a heat insulation member in an embodiment of a heating device according to the present invention; and FIG. 21 is an exploded view of an embodiment of a heating device according to the present invention.

[0009] Description of reference numerals: Reference numeralsNameReference numeralsName100heating device10infrared heating assembly20electromagnetic heating assembly11electric heating wire21heat insulation plate30housing12lead structure13insulation base14temperature sensing unit15electric terminal1000cooking appliance1stove panel2fan16mounting body22electromagnetic heating coil23mounting bracket24magnet structure215heat insulation cavity212second heat insulation member217through hole214third heat insulation member219mounting rack216groove221heat-dissipation passage218mounting frame222support plate220communication passage31first heat insulation layer321second mounting slot32second heat insulation layer33heat insulation base331first mounting slot34heat insulation member

[0010] Objectives, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings.DETAILED DESCRIPTION

[0011] Solutions in the embodiments of the present invention are clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present invention. These embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without any creative work fall within the protection scope of the present invention.

[0012] It should be noted that if directional indications (such as up, down, left, right, front, back...) are involved in embodiments of the present invention, these directional indications are only used to explain relative position relationship, movement, and the like between parts under a certain posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0013] In addition, if descriptions such as "first", "second" are involved in the embodiments of the present invention, the descriptions of "first", "second" and the like are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated features. Therefore, the features defined with "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" in the full text includes three parallel schemes. "A and / or B" is taken as an example, it includes scheme A, or scheme B, or a scheme that satisfy both A and B. In addition, the solutions between the various embodiments may be combined with each other, but they must be implemented by those skilled in the art. When the combination of solutions is contradictory or cannot be implemented, it should be considered that such a combination of solutions does not exist and does not fall within the scope of protection required by the present invention.

[0014] Electromagnetic heating is to generate eddy currents at a bottom of cookware and further generate heat through coupling of a coil panel and the bottom of cookware. The electromagnetic heating is characterized by rapid heating, but poor uniformity and the presence of cold area. Furthermore, electromagnetic heating can only heat conductive cookware, such as commonly used iron cookware, graphite cookware, and the like, but cannot heat glass or ceramic cookware. Infrared heating is to generate heat by conduction and radiation. When heating starts, most of heat generated by resistance wires is absorbed by a heat insulation layer, a stove panel, and the like, and it takes a while to preheat cookware before it can be stably heated. Therefore, the cookware is heated up slowly and has a low efficiency. However, after the cookware is heated to a certain temperature, the heating uniformity is good due to the effect of infrared light radiation.

[0015] Traditional hybrid solution of electromagnetic heating and infrared heating is generally a solution in which electromagnetic heating and infrared heating are arranged in inner and outer rings. Due to the limitation to the bottom area of the cookware, a heating area cannot be provided to be very large and thus an area allocated to electromagnetic heating and infrared heating is very small. In such a small area, it is difficult to provide a high-power electromagnetic heating assembly and an infrared heating device, resulting in a low heating power of traditional hybrid heating device.

[0016] In the traditional hybrid heating device, a solution of an infrared stove plate and an electromagnetic mounting rack being overlapped in an up-and-down direction is adopted, where an upper end surface of the infrared stove plate needs to be tightly close to a stove panel of a cooking appliance to reduce heat leakage, and the electromagnetic mounting rack needs to be as close to the stove panel as possible to increase electromagnetic coupling between the electromagnetic mounting rack and a bottom of cookware on the stove panel, so as to obtain electromagnetic heating with higher performance. Therefore, the electromagnetic mounting rack is generally provided tightly close to the bottom of the infrared stove plate above. When the infrared stove plate is heated, a temperature of a stove cavity is as high as 600°C. After passing through a heat insulation bottom, a temperature of the outer side of the infrared stove plate is still as high as 150°C. If the outer side of the infrared stove plate is in direct contact with the electromagnetic mounting rack below by a large area, it is easy to cause a bracket for the electromagnetic mounting rack to melt or the enameled wire insulation layer to age.

[0017] Although the temperature of the outer side of the infrared stove plate may be effectively reduced by increasing a thickness of the heat-insulating bottom of the infrared stove plate, the electromagnetic mounting rack will gradually move away from the stove panel as the thickness of the heat-insulating bottom increases, resulting in poor coupling with the bottom of the cookware. Therefore, how to reduce a thickness of a whole machine and increase the heating power of the whole machine has become an urgent problem to be solved.

[0018] In order to solve the above problems, the present invention provides a heating device 100 and a cooking appliance 1000, and FIG. 1 to FIG. 21 are specific embodiments of the heating device 100 according to the present invention.

[0019] In conjunction with FIG. 1 to FIG. 6, the heating device 100 includes a housing 30, an infrared heating assembly 10 and an electromagnetic heating assembly 20. An interior of the housing 30 is provided with a mounting chamber. The infrared heating assembly 10 is mounted inside the mounting chamber, and includes an electric heating wire 11. Resistivity of the electric heating wire 11 is not less than 0.1µΩ·m. The electromagnetic heating assembly 20 is mounted inside the mounting chamber and located below the infrared heating assembly 10. The electromagnetic heating assembly 20 and the infrared heating assembly 10 are at least partially overlapped in an up-and-down direction.

[0020] It should be emphasized that the electric heating wire 11 of the existing infrared heating assembly is mostly made of non-magnetic metal materials such as aluminum, copper, and nickel-tungsten alloy. Resistivity of the electric heating wire 11 is generally small, and a resistance of a heating member made of the electric heating wire 11 is also small. Therefore, the heating control is difficult and the heating power is also small. Furthermore, when a magnetic field acts on a material with low resistivity, it will produce a shielding effect, thereby reducing a magnetic field of electromagnetic heating reaching the bottom of the cookware on the stove panel 1, and reducing electromagnetic heating power.

[0021] In the solution of the present invention, by coupling an electromagnetic heating coil with a bottom of the appliance placed on the housing 30, the electromagnetic heating assembly 20 is to generate eddy currents at the bottom of the appliance and then generate heat at the bottom of the appliance to heat the appliance. The infrared heating assembly heats the appliance placed on the housing 30 by conducting and radiating heat generated by the electric heating wire 11. The electromagnetic heating assembly 20 is provided at a lower side of the infrared heating assembly to allow the infrared heating assembly and the electromagnetic heating assembly 20 to heat the appliance placed on the housing 30 at the same time, thereby increasing the heating power of the appliance and improving the uniformity of heating to solve problems of low infrared heating power, small electromagnetic heating area and low power in the traditional hybrid heating technology. Furthermore, the resistivity of the electric heating wire 11 is not less than 0.1µΩ·m. Compared with the traditional electric heating wire 11 made of non-magnetic metal materials such as aluminum, copper, nickel-tungsten alloy, the electric heating wire 11 in the present invention has a larger resistivity and better magnetic conductivity, and will not shield the magnetic lines of force generated by the electromagnetic heating coil, thereby solving the problem that the electric heating wire of the traditional infrared heating device 100 affects the electromagnetic heating, thereby providing a hybrid electromagnetic and infrared heating device 100 that may achieve high-power heating.

[0022] It should be emphasized that in the present invention, specific shapes of the electromagnetic heating assembly 20 and the infrared heating assembly 10 are not limited, and may be round or square, which is not limited here. The specific composition form of the electromagnetic heating assembly 20 is not limited, as long as it may emit a magnetic field to heat the cookware. In the present invention, the electromagnetic heating assembly 20 includes an electromagnetic heating coil 22, a mounting bracket 23 and a magnet structure 24. The electromagnetic heating coil 22 is mounted at an upper side of the mounting bracket 23, and the magnet structure 24 is mounted at a lower side of the mounting bracket 23.

[0023] It should be noted that during the heating process of the electromagnetic heating assembly 20, the stove panel 1 will be in direct contact with the cookware. Therefore, the stove panel 1 is affected by the high temperature of the cookware and will also generate a higher temperature. In addition, the high temperature at the bottom of the cookware will pass through the stove panel 1 and be transmitted to an interior of the housing 30 of the cooking appliance 1000. At this time, once the high temperature is transmitted to the electromagnetic heating coil, the electromagnetic heating coil or a mount base may be burned. It is necessary to provide a heat insulation member above the electromagnetic heating coil. In the present invention, the heating device 100 further includes a heat insulation member provided between the electric heating wire 11 and the electromagnetic heating assembly 20. Such an arrangement may, on one hand, prevent the heat from the bottom of the cookware from penetrating through a stove surface and being transmitted to the electromagnetic heating assembly 20; and on the other hand, prevent the heat from radiating to the electromagnetic heating assembly 20 during the heating process of the heating wire, thereby avoiding the electromagnetic heating assembly 20 to be melted.

[0024] Furthermore, the heat insulation member may be provided separately or directly provided on the infrared heating assembly. The infrared heating assembly includes a mounting body 16 and an electric heating wire 11. The electric heating wire 11 is provided at the upper end of the mounting body 16. The mounting body 16 includes a heat insulation plate 21. The heat insulation plate 21 forms the heat insulation member. By providing the electric heating wire 11 at an upper end surface of the heat insulation plate 21, leakage of the heat at the bottom of the heat insulation plate 21 may be reduced, thereby decreasing the temperature rise at the heat insulation plate 21. At this time, the heat insulation plate 21 may directly constitute the heat insulation member, or the heat insulation plate 21 and the heat insulation member may be provided at the same time to further improve the heat insulation effect.

[0025] The specific composition of the heat insulation member is not limited, and may be made of any material or have any shape, as long as it may have the thermal-insulation effect. The thermal-insulation effect may also be physical thermal insulation, or may be heat absorption and thermal insulation by chemical reaction, which is not limited here. In the present invention, the heat insulation member includes: one or more of a hydrated silica member, a ceramic fiber member, a glass fiber member, or a silicate member. Through this arrangement, the thermal insulator may be one of a hydrated silica member, a ceramic fiber member, a glass fiber member, or a silicate member, or a combination thereof.

[0026] The specific form of the electric heating wire 11 is not limited, as long as its resistivity is not less than 0.1µΩ·m. In the present embodiment, the electric heating wire 11 includes one or more of an iron-chromium-aluminum alloy wire, a nickel-chromium alloy wire, a chromium-aluminum-molybdenum alloy wire, a chromium-aluminum-niobium alloy wire, or a carbon fiber wire. Through this arrangement, the electric heating wire 11 may be one of an iron-chromium-aluminum alloy wire, a nickel-chromium alloy wire, a chromium-aluminum-molybdenum alloy wire, a chromium-aluminum-niobium alloy wire, or a carbon fiber wire, or a combination thereof.

[0027] It should be noted that resistivity of the iron-chromium-aluminum alloy is generally 1.6µΩ·m, and resistivity of the nickel-chromium alloy wire is generally 1.0µΩ·m. The resistivity of the electric heating wire 11 made of the above materials is higher than the resistivity of copper, aluminum and other materials, and will not shield the magnetic field generated by the electromagnetic heating assembly 20.

[0028] Since the infrared heating assembly 10 and the electromagnetic heating assembly 20 are overlapped in an up-and-down direction, it may be understood that the larger the overlapped area, the better the effect of hybrid heating. An area of a smaller one of the electromagnetic heating assembly 20 and the infrared heating assembly 10 is m, and an area of an overlapping part between the electromagnetic heating assembly 20 and the infrared heating assembly 10 is n, where n is equal to or greater than 0.3m. Through this arrangement, the area of the overlapping part accounts for at least 30% of one of the electromagnetic heating assembly 20 and the infrared heating assembly 10. By this arrangement, at least enough area is guaranteed to perform hybrid heating. In a certain embodiment, the area of the overlapping part of the electromagnetic heating assembly 20 and the infrared heating assembly 10 is 30% of the area of the smaller one of the electromagnetic heating assembly 20 and the infrared heating assembly 10. At this time, the cooking appliance 1000 using the heating device 100 in the present invention may simultaneously perform independent infrared heating, independent electromagnetic heating and hybrid infrared and electromagnetic heating, to achieve three different heating ways for three cookware at the same time.

[0029] Furthermore, in order to improve the hybrid heating effect, n is equal to or greater than 0.6m, that is, the area of the overlapping part between the electromagnetic heating assembly 20 and the infrared heating assembly 10 accounts for at least 60% of the smaller area of the two heating assemblies. Such an arrangement ensures sufficient area for hybrid heating. The cooking appliance 1000 using the heating device 100 provided in the present embodiment may ensure that there is enough area for hybrid heating to heat the bottom of the cookware, thereby improving the hybrid heating effect.

[0030] It may be understood that when the electromagnetic heating assembly 20 and the infrared heating assembly 10 are completely overlapped, that is, the electromagnetic heating assembly 20 is provided inside a projection of the infrared heating assembly 10, or the infrared heating assembly 10 is provided inside a projection of the electromagnetic heating assembly 20, the hybrid heating effect is the best. Therefore, the cooking appliance provides the best hybrid heating effect when n is equal to m.

[0031] The electric heating wire 11 is provided with two connection ends arranged at the same side, and the infrared heating assembly further includes a lead structure 12. The lead structure 12 is provided at the mounting body 16 and electrically connected to the electric heating wire 11. The lead structure 12 includes an insulation base 13 and two electric terminals 15. The insulation base 13 is provided at the mounting body 16, and the two electric terminals 15 penetrate through the insulation base 13 and are arranged side by side apart from each other. An end of each electric terminal 15 is used to electrically connect one of the connection ends to an external power source to energize the electric heating wire 11. Through this arrangement, the electric heating wire 11 may be electrically connected to the external power source through the two electric terminals 15, and both the structure and the arrangement are simple.

[0032] At the same time, the lead structure 12 further includes a temperature sensing unit 14 provided at the insulation base 13, and the temperature sensing unit 14 is located between the two electric terminals 15, and is used to detect a temperature of the two electric terminals 15. It should be noted that during the heating process of the infrared heating assembly, if the temperature of the two electric terminals 15 of the lead structure 12 is too high, the plastic housing will be melted, which will bring safety hazards. By providing the temperature sensing unit 14 to detect the temperature of the two electric terminals 15,users may timely know the temperature of the two electric terminals 15 and when the temperature of the two electric terminals 15 is too high, users may take timely measures to stop heating so as to avoid melting the plastic housing due to the excessively high temperature of the two electric terminals 15, thereby eliminating safety hazards.

[0033] The housing 30 includes a base and an upper cover covering the base. An upper end surface of the upper cover is provided with a heating area for placing the appliance; the infrared heating assembly is provided at the base and corresponding to the heating area. The electromagnetic heating assembly 20 is provided at a lower side of the infrared heating assembly and corresponding to the heating area. By providing the base and the upper cover, the housing 30 is more convenient to disassemble and assemble, and the infrared heating assembly and the electromagnetic heating assembly 20 are also convenient to disassemble and assemble.

[0034] It should be noted that in the present invention, the heating device 100 further includes a main control board, an operation panel, a fan 2 and a stove panel 1. The main control board and the fan 2 are provided at the base, the operation panel is provided at the upper cover, and the stove panel 1 covers the upper end surface of the upper cover. The stove panel 1 is used to support the appliance to allow the heating of the appliance to be safer and more stable. The main control board and the fan 2 are arranged side by side apart from each other to generate no interference with the operation of the fan 2.

[0035] In conjunction with FIG. 7 to FIG. 16, in an embodiment, a heat insulation cavity 215 is formed at a position where a bottom surface of the infrared heating assembly 10 and a top surface of the electromagnetic heating assembly 20 are overlapped.

[0036] By coupling the electromagnetic heating coil with a bottom of the appliance placed on the housing, the electromagnetic heating assembly 20 is configured to generate eddy currents at the bottom of the appliance and then generate heat at the bottom of the appliance to heat the appliance. The infrared heating assembly heats the appliance placed on the housing by conducting and radiating heat generated by the electric heating wire 11.

[0037] In an embodiment, the specific implementation form of the heat insulation cavity is not limited, and the heat insulation cavity may be a gap between the bottom surface of the infrared heating assembly 10 and the top surface of the electromagnetic heating assembly 20, or it may also be formed by at least one of the bottom surface of the infrared heating assembly 10 and the top surface of the electromagnetic heating assembly 20 being at least partially recessed, thereby forming the heat insulation cavity 215.

[0038] It should be noted that at least one of the bottom surface of the infrared heating assembly 10 and the top surface of the electromagnetic heating assembly 20 being at least partially recessed may be that the bottom surface of the infrared heating assembly 10 is recessed inward to form the heat insulation cavity 215, or the top surface of the electromagnetic heating assembly 20 is recessed inward to form the heat insulation cavity 215, or both are recessed inward to form the heat insulation cavity 215, which is not limited here. At least partially recessed may be only partially recessed, or may be completely recessed, which is not limited here. The recessed form is also not limited, may be in the form of a groove 216, or may also be in the form of a through hole 217, and the like, which is not limited here.

[0039] In the solution according to the present invention, by providing the electromagnetic heating assembly 20 and the infrared heating assembly 10, the heating device 100 may be adapted to different cookware. The heat insulation cavity 215 is formed at the position where a bottom surface of the infrared heating assembly 10 and a top surface of the electromagnetic heating assembly 20 are overlapped. Air inside the heat insulation cavity 215 may have a better heat insulation effect. Through this arrangement, a temperature of an outer surface of the electromagnetic mounting rack may be reduced under the premise of controlling the thickness of the infrared stove plate within a certain range and without increasing the distance from the electromagnetic heating assembly 20 to the stove panel.

[0040] Further, in order to improve the heat insulation capacity of the heat insulation cavity 215, a peripheral side of the infrared heating assembly 10 is provided with a communication passage 220 communicating the heat insulation cavity 215 and the mounting chamber. By providing the communication passage 220 to communicate the mounting chamber with the heat insulation cavity 215, the air inside the mounting chamber may be introduced to the heat insulation cavity 215, the air inside the mounting chamber may exchange heat with air inside the heat insulation cavity 215, thereby cooling the heat insulation cavity 215 to keep the heat insulation cavity 215 at a low temperature and improving the heat insulation capacity of the heat insulation cavity 215.

[0041] Furthermore, the housing is provided with a heat-dissipation passage 221 communicating an interior and an exterior of the mounting chamber. By providing the heat-dissipation passage 221, the mounting chamber may exchange air with outside to cool the mounting chamber.

[0042] In addition, the number of heat insulation cavities 215 may be one or more than one, and a plurality of heat insulation cavities 215 may be independent of each other or communicate with each other, which is not limited here. Further, a plurality of the heat insulation cavities 215 are formed and arranged to communicate with each other. Such an arrangement may allow heat exchange between the plurality of heat insulation cavities 215, thereby avoiding the occurrence of local high temperature.

[0043] It should be emphasized that the peripheral side of the infrared heating assembly 10 is provided with the communication passage 220 communicating the heat insulation cavity 215 and the mounting chamber; and a plurality of heat insulation cavities 215 are formed and arranged to communicate with each other. The two solutions may be provided selectively or at the same time, which is not limited here.

[0044] Further, in conjunction with FIG. 15 and FIG. 16, the bottom surface of the infrared heating assembly 10 is at least partially recessed to form the heat insulation cavity. In order to allow the heat insulation cavity 215 to have sufficient area for heat insulation, in conjunction with FIG. 11, an area of the bottom surface of the infrared heating assembly 10 is M, and an area of the filled part in FIG. 16 is M. In addition, in conjunction with FIG. 15, an area of the partially recessed part of the bottom surface of the infrared heating assembly 10 is m, and an area of the filled part in FIG. 15 is m, where m is greater than 0.3M. It may be understood that the larger the area of the partially recessed part of the bottom surface of the infrared heating assembly 10, the larger the area of the heat insulation cavity 215, and correspondingly, the heat insulation effect of the heat insulation cavity 215 is better. Therefore, it can be ensured that the heat insulation cavity 215 has sufficient area for heat insulation when m is greater than 0.3M.

[0045] At the same time, in conjunction with FIG. 10, the heat insulation cavity 215 should also maintain a certain thickness. Otherwise, the air inside the heat insulation cavity 215 is too thin, which affects the heat insulation effect. Therefore, the maximum distance between the bottom surface of the infrared heating assembly 10 and the top surface of the electromagnetic heating assembly 20 is a, where a is greater than 0.5mm. Through this arrangement, the maximum thickness of the heat insulation cavity 215 is greater than 0.5mm, which ensures the thickness of the air layer in the heat insulation cavity 215, thereby ensuring the heat insulation effect.

[0046] Further, since it is not easy to provide the heat insulation cavity 215 at the electromagnetic heating assembly 20, the infrared heating assembly 10 includes a mounting body 16 and an electric heating wire 11, and the electric heating wire 11 is provided at the upper end of the mounting body 16, where a bottom of the mounting body 16 is provided with a groove 216, the groove 216 restricts the heat insulation cavity 215, and / or a bottom of the mounting body 16 is provided with a through hole 217 penetrating in an up-and-down direction, and the through hole 217 restricts the heat insulation cavity 215.

[0047] In this embodiment, the heat insulation cavity 215 is formed by providing a groove 216 or a through hole 217 penetrating in an up-and-down direction at the bottom of the mounting body 16. The air inside the heat insulation cavity 215 may have a better heat insulation effect. Through this arrangement, a temperature of an outer surface of the electromagnetic mounting rack may be reduced under the premise of controlling the thickness of the infrared stove plate within a certain range and without increasing the distance from the electromagnetic heating assembly 20 to the stove panel.

[0048] It should be noted that the specific implementation form of the mounting body 16 is not limited, and may be an integrally formed housing, or a combination of a mounting frame and a mounting rack, and the like, which is not limited here.

[0049] Furthermore, the mounting body 16 includes a mounting frame 218 and a mounting rack 219 arranged separately. The mounting frame 218 is used to mount the electric heating wire 11, the mounting rack 219 is provided below the electric heating wire 11, and the mounting rack 219 is provided with the groove 216 and / or the through hole 217, and the groove 216 and / or the through hole 217 restricts the heat insulation cavity 215.

[0050] Through this arrangement, the mounting frame 218 may play a mounting role for the electric heating wire 11, the mounting rack 219 may play a support role for the mounting frame 218 and the electric heating wire 11. The groove 216 and / or the through hole 217 provided at the mounting rack 219 may restrict the heat insulation cavity 215 to reduce a temperature of an outer surface of the electromagnetic mounting rack without increasing the distance from the electromagnetic heating assembly 20 to the stove panel.

[0051] In addition, in order to insulate the electric heating wire 11, the infrared heating assembly 10 is generally provided with a heat insulation member. At this time, the heat insulation member may directly play the role of the mounting body 16. Therefore, in this embodiment, the mounting body 16 includes a first heat insulation member, and the bottom surface of the first heat insulation member is provided with a groove 216, and the groove 216 restricts the heat insulation cavity 215. Through this arrangement, the groove 216 is directly provided at the bottom surface of the first heat insulation member to form the heat insulation cavity 215, and the structure is simple.

[0052] In another embodiment, since the strength of the heat insulation member used is low and it is difficult to serve as the mounting body 16, the infrared heating assembly 10 further includes a second heat insulation member 212 provided between the mounting body 16 and the electric heating wire 11. The second heat insulation member 212 may play the role of insulating heat from the electric heating wire 11 to prevent the high temperature generated by the electric heating wire 11 from damaging the electromagnetic mounting rack.

[0053] The first heat insulation member and / or the second heat insulation member 212 include a heat insulation bottom for placing the electric heating wire 11 and a heat insulation ring surrounding the electric heating wire 11. Through this arrangement, the heat insulation bottom may insulate the bottom of the electric heating wire 11, and the heat insulation ring surrounds the periphery of the electric heating wire 11, which may insulate the circumference of the electric heating wire 11, so that the heat generated by the electric heating wire 11 is more focused to avoid heat diffusion.

[0054] It should be emphasized that the heat insulation bottom and the heat insulation ring may be integrally formed or separately arranged. When both are separately arranged, the heat insulation ring may be made of a material with better insulation performance, and the heat insulation bottom may be made of white carbon black material and the like, which is not limited here. Since the strength of the white carbon black material is relatively low, if an independent heat insulation ring is used, the heat insulation bottom is easily deformed or crushed. Therefore, the heat insulation bottom and the heat insulation ring are integrally formed.

[0055] The specific material of the first heat insulation member and the second heat insulation member 212 is that of the heat insulation member described above, which is not limited here. It should be noted that the heat insulation member made of white carbon black in combination with the fan may control the temperature inside the stove plate between 120°C and 200°C, and good heat insulation effect is obtained. Therefore, in an embodiment, the first heat insulation member and the second heat insulation member 212 are made of white carbon black.

[0056] At the same time, there are many scenarios that need to consider reducing the thickness of the stove plate; including reducing the thickness of a machine body to make the product appearance lighter and thinner, or a hybrid heating cooking appliance 1000, which needs to provide an electromagnetic mounting rack below the stove plate to increase the coupling between the electromagnetic mounting rack and the cookware and the thickness of the infrared stove plate needs to be reduced as much as possible.

[0057] In conjunction with FIG. 14, on the other hand, it is also necessary to further improve the heat insulation performance of the heat insulation layer and reduce the temperature of the stove plate housing while maintaining a thickness of the original heat insulation layer. in the above application scenario, a third heat insulation member 214 with better heat insulation performance may be provided below the second heat insulation member 212 so as to further improve the heat insulation performance of the heat insulation layer and reduce the temperature of the stove plate housing while maintaining the thickness of the original heat insulation layer. Therefore, the infrared heating assembly 10 further includes a third heat insulation member 214 provided at a side of the second heat insulation member 212 facing away from the electric heating wire 11.

[0058] In an embodiment, the third heat insulation member 214 is made of one of aerogel, glass fiber, or ceramic fiber. In order to support the third heat insulation member 214, the infrared heating assembly 10 further includes a support plate 222.

[0059] In conjunction with FIG. 17 to FIG. 21, in an embodiment of the heating device 100 of the present invention, the heating device 100 includes an electromagnetic heating assembly 20, an infrared heating assembly 20 and a heat insulation member 34. The infrared heating assembly 20 is provided above the electromagnetic heating assembly 20; the heat insulation member 34 may include a first heat insulation layer 31, the first heat insulation layer 31 is provided between the electromagnetic heating assembly 20 and the infrared heating assembly 20, and thermal conductivity of the first heat insulation layer 31 is less than or equal to 0.02w / m·K.

[0060] It may be understood that in the heating device 100 provided in the present invention, a heat insulation member 34 including a first heat insulation layer 31 is provided between the electromagnetic heating assembly 20 and the infrared heating assembly 20, and the thermal conductivity of the first heat insulation layer 31 is less than or equal to 0.02w / m·K. Compared with the use of white carbon black material as the heat insulation layer, the present solution uses a first heat insulation layer 31 with lower thermal conductivity to replace the white carbon black heat insulation layer, which may achieve the same heat insulating effect while effectively reducing the thickness of the first heat insulation layer 31, to reduce the distance between the electromagnetic heating assembly 20 and the stove panel, decrease the thickness of the whole machine and increase the heating power of the electromagnetic heating assembly 20. In addition, the weight of the whole machine is also reduced, which may improve market competitiveness.

[0061] It should be noted that the thermal conductivity of the first heat insulation layer 31 being less than or equal to 0.02w / m·K refers to the thermal conductivity at normal temperature and pressure. The second heat insulation layer 32 also needs to be made of a non-magnetic insulation material to avoid electromagnetic shielding to the heating of the electromagnetic heating assembly 20 located below the second heat insulation layer 32 without hindering the heating of the electromagnetic heating assembly 20.

[0062] In an embodiment, by using the first heat insulation layer 31 with lower thermal conductivity to replace the white carbon black heat insulation layer, the thickness of the first heat insulation layer 31 may be set between 2mm and 3mm, thereby greatly reducing the thickness of the first heat insulation layer 31, the thickness of the whole machine may also be reduced accordingly.

[0063] In an embodiment, a peripheral side of the electromagnetic heating assembly 20 may be provided with a mounting structure and the electromagnetic heating assembly 20 may be fixedly mounted at the bottom housing of the cooking appliance 1000 through the mounting structure. In an embodiment, the mounting structure may be provided with a first screw hole, and the bottom housing of the cooking appliance 1000 may be provided with a second screw hole. The electromagnetic heating assembly 20 may be fixedly mounted at the bottom housing of the cooking appliance 1000 by penetrating a screw through the first screw hole and inserting into the second screw hole.

[0064] Further, in conjunction with FIG. 21, In an embodiment of the heating device 100 of the present invention, the first heat insulation layer 31 may include at least one of an aerogel layer, a mica sheet, or a glass fiber layer. Since the thermal conductivity of the aerogel layer, the mica sheet, or the glass fiber layer at room temperature and pressure is low, by using at least one of the aerogel layer, the mica sheet, or the glass fiber layer as the first heat insulation layer 31, the thermal conductivity of the first heat insulation layer 31 may be less than or equal to 0.02w / m·K. The first heat insulation layer 31 has a good heat insulation effect to prevent the high temperature of the infrared heating assembly 20 from affecting the normal operation of the electromagnetic heating assembly 20.

[0065] Exemplarily, the first heat insulation layer 31 may include only one of the aerogel layer, the mica sheet, and the glass fiber layer, or may include an aerogel layer and a mica sheet stacked in sequence, or may include an aerogel layer and a glass fiber layer stacked in sequence, or may include a mica sheet and a glass fiber layer stacked in sequence, or may include an aerogel layer, a mica sheet, and a glass fiber layer stacked in sequence. In an embodiment, the adjacent two-layer structure may be fixed by pasting.

[0066] Furthermore, in conjunction with FIG. 21, in an embodiment of the heating device 100 of the present invention, a projection of the infrared heating assembly 20 on the electromagnetic heating assembly 20 may fall within a projection of the first heat insulation layer 31 on the electromagnetic heating assembly 20.

[0067] Through this arrangement, the heat generated by the infrared heating assembly 20 during operation may be effectively insulated by the first heat insulation layer 31 to fully avoid the high temperature of the infrared heating assembly 20 affecting the normal operation of the electromagnetic heating assembly 20.

[0068] Further, in conjunction with FIG. 21, in an embodiment of the heating device 100 of the present invention, the heat insulation member 34 may further include a second heat insulation layer 32. The second heat insulation layer 32 is provided between the first heat insulation layer 31 and the infrared heating assembly 20, and thermal conductivity of the first heat insulation layer 31 is less than thermal conductivity of the second heat insulation layer 32.

[0069] Through this arrangement, the heat generated by the infrared heating assembly 20 during operation may be fully insulated under the double heat insulation effect of the first heat insulation layer 31 and the second heat insulation layer 32. In addition, the infrared heating assembly 20 may be mounted at the second heat insulation layer 32 to ensure the mounting stability of the infrared heating assembly 20.

[0070] In the present embodiment, although the first heat insulation layer 31 and the second heat insulation layer 32 are provided, the thickness of the first heat insulation layer 31 and the second heat insulation layer 32 may be set between 2 mm and 3 mm. Compared with the use of a single white carbon black material as the insulation layer, the solution may also achieve the effect of reducing the thickness of the heat insulation layer by using the first heat insulation layer 31 and the second heat insulation layer 32 with lower thermal conductivity to replace the white carbon black insulation layer.

[0071] It should be noted that the second heat insulation layer 32 also needs to be made of a non-magnetic insulation material to avoid electromagnetic shielding to the heating of the electromagnetic heating assembly 20 located below the second heat insulation layer 32 without hindering the heating of the electromagnetic heating assembly 20.

[0072] In actual application, the infrared heating assembly 20 and the second heat insulation layer 32 may be fixed together by extrusion molding; or the infrared heating assembly 20 and the second heat insulation layer 32 may also be fixed together by bonding, screw fastening, and the like. In some embodiments, the second heat insulation layer 32 and the infrared heating assembly 20 may be an integral structure molded by extrusion. That is, during the mounting process, the infrared heating assembly 20 may be firstly extruded at a side of the second heat insulation layer 32, and then a side of the second heat insulation layer 32 facing away from the infrared heating assembly 20 may be connected to the first heat insulation layer 31.

[0073] It should be noted that when a single white carbon black material is used as the heat insulation layer, the infrared heating assembly 20 may be fixed to the heat insulation layer in an extrusion manner, and a thickness of the heat insulation layer required for extruding and fixing the infrared heating assembly 20 is only about 2 mm. However, in order to make the heat insulation layer have sufficient heat insulation effect, the thickness of the white carbon black heat insulation layer needs to be set between 10 mm and 15 mm. The second heat insulation layer 31 in the present invention is made of white carbon black material, which may facilitate the extrusion molding of the infrared heating assembly 20 and the second heat insulation layer 32. The thickness of the heat insulation layer only needs to be set to about 2 mm, the first heat insulation layer 31 with lower thermal conductivity may be used to achieve the corresponding heat insulation effect, so that the thickness of the heat insulation layer including the first heat insulation layer 31 and the second heat insulation layer 32 may also be set to 4 mm to 6 mm.

[0074] Further, in conjunction with FIG. 21, in an embodiment of the heating device 100 of the present invention, the second heat insulation layer 32 may be a white carbon black layer. Since the heat insulation layer made of white carbon black is relatively soft, during the mounting process, the infrared heating assembly 20 may be better fixed to the white carbon black layer in an extrusion manner to mount and fix the infrared heating assembly 20 without the need to use an additional connection structure to fix the infrared heating assembly 20 at the second heat insulation layer 32.

[0075] Further, in conjunction with FIG. 21, in an embodiment of the heating device 100 of the present invention, the heat insulation member 34 may further include a heat insulation base 33. The heat insulation base 33 is provided between the electromagnetic heating assembly 20 and the first heat insulation layer 31, and the first heat insulation layer 31 and the second heat insulation layer 32 are stacked on the heat insulation base 33 in sequence.

[0076] Through this arrangement, during the mounting process, the first heat insulation layer 31 may be stacked on the heat insulation base 33, and a combined structure of the second heat insulation layer 32 and the infrared heating assembly 20 may then be mounted on the first heat insulation layer 31 to ensure not only the mounting stability of the first heat insulation layer 31 and the second heat insulation layer 32, but also the shape of the first heat insulation layer 31 and the second heat insulation layer 32 to prevent the first heat insulation layer 31 and the second heat insulation layer 32 from collapsing after being heated, thereby affecting the heat insulation effect.

[0077] During actual application, the heat insulation base 33 may be made of a non-magnetic-shield metal material or a high-temperature resistant non-metal material, which is not limited here. The non-metal material has no shielding effect on magnetic lines of force and will not hinder the heating of the electromagnetic heating assembly 20.

[0078] Further, in order to further improve the mounting stability of the first heat insulation layer 31 and the second heat insulation layer 32, in conjunction with FIG. 21, in an embodiment of the heating device 100 of the present invention, a side of the heat insulation base 33 facing away from the electromagnetic heating assembly 20 may be provided with a first mounting slot 331. During the mounting process, the first heat insulation layer 31 and the second heat insulation layer 32 may be mounted inside the first mounting slot 331 to prevent the first heat insulation layer 31 and the second heat insulation layer 32 from being offset and affecting the heat insulation effect. In addition, by mounting the first heat insulation layer 31 and the second heat insulation layer 32 inside the first mounting slot 331 of the heat insulation base 33, the first heat insulation layer 31 and the second heat insulation layer 32 may further be protected by the heat insulation base 33 to prevent damage to the first heat insulation layer 31 and the second heat insulation layer 32 during heating or transportation.

[0079] During actual application and the mount process, after the first heat insulation layer 31 is mounted inside the first mounting slot 331, a side wall of the first heat insulation layer 31 may abut against a side wall of the first mounting slot 331 to allow the first heat insulation layer 31 to be fixed inside the first mounting slot 331 in an interference fit. In an embodiment, a bonding layer may further be provided between the first heat insulation layer 31 and a bottom wall of the first mounting slot 331 to allow the first heat insulation layer 31 to be fixed inside the second mounting slot 321 by bonding. Similarly, after the second heat insulation layer 32 is mounted inside the first mounting slot 331, a side wall of the second heat insulation layer 32 may abut against a side wall of the first mounting slot 331 to allow the second heat insulation layer 32 to be fixed inside the first mounting slot 331 in an interference fit. In an embodiment, a bonding layer may further be provided between the second heat insulation layer 32 and the first heat insulation layer 31 to allow the second heat insulation layer 32 to be fixed inside the first mounting slot 331 by bonding.

[0080] Further, in conjunction with FIG. 21, in an embodiment of the heating device 100 of the present invention, a side of the second heat insulation layer 32 facing away from the first heat insulation layer 31 may be provided with a second mounting slot 321, and the infrared heating assembly 20 may be mounted inside the second mounting slot 321 during the mounting process.

[0081] Through this arrangement, by mounting the infrared heating assembly 20 inside the second mounting slot 321 of the second heat insulation layer 32, not only the mounting stability of the infrared heating assembly 20 may be improved, but also the heat radiation emitted from the infrared heating assembly 20 to the surroundings may be isolated through the second heat insulation layer 32, so as to avoid influence of the heat radiation emitted by the infrared heating assembly 20 to the surroundings on other structures of the cooking appliance 1000 that are not resistant to high temperature, such as the circuit board in the cooking appliance 1000.

[0082] Further, in conjunction with FIG. 19 and FIG. 21, in an embodiment of the heating device 100 of the present invention, the electromagnetic heating assembly 20 may include a mounting bracket 23, an electromagnetic heating coil 22, and a magnet structure 24. The mounting bracket 23 is provided with a first side and a second side disposed opposite to each other, and the first side is disposed close to the infrared heating assembly 20. The electromagnetic heating coil 22 may be provided at the first side of the mounting bracket 23, and the first heat insulation layer 31 may be provided between the electromagnetic heating coil 22 and the infrared heating assembly 20. The magnet structure 24 may be provided at the second side of the mounting bracket 23.

[0083] Through this arrangement, when ordinary iron cookware or stainless steel cookware are heated, the electromagnetic heating assembly 20 operates and may heat the food in ordinary iron cookware or stainless steel cookware by electromagnetic heating.

[0084] Further, in conjunction with FIG. 20 and FIG. 21, in an embodiment of the heating device 100 of the present invention, the infrared heating assembly 20 may include an electric heating wire 11 and a lead structure 12. The electric heating wire 11 may be provided at a side of the first heat insulation layer 31 facing away from the electromagnetic heating assembly 20. The lead structure 12 may be mounted on the electric heating wire 11 and electrically connected to the electric heating wire 11. A connection method of the lead structure 12 in the infrared heating assembly may refer to the aforementioned embodiments, which will not be described here.

[0085] The present invention further provides a cooking appliance 1000 including a heating device 100, where the heating device 100 includes: a housing 30, an interior of the housing 30 being provided with a mounting chamber; an infrared heating assembly 10 mounted inside the mounting chamber, and including an electric heating wire 11, resistivity of the electric heating wire 11 being not less than 0.1µΩ·m; and an electromagnetic heating assembly 20 mounted inside the mounting chamber and located below the infrared heating assembly 10, the electromagnetic heating assembly 20 and the infrared heating assembly 10 being at least partially overlapped in an up-and-down direction.

[0086] In the solution of the present invention, by coupling an electromagnetic heating coil with a bottom of the appliance placed on the housing 30, the electromagnetic heating assembly 20 is to generate eddy currents at the bottom of the appliance and then generate heat at the bottom of the appliance to heat the appliance. The infrared heating assembly heats the appliance placed on the housing 30 by conducting and radiating heat generated by the electric heating wire 11. The electromagnetic heating assembly 20 is provided at a lower side of the infrared heating assembly to allow the infrared heating assembly and the electromagnetic heating assembly 20 to heat the appliance placed on the housing 30 at the same time, thereby increasing the heating power of the appliance and improving the uniformity of heating. The cooking appliance has the dual advantages of electromagnetic heating and infrared heating, and may heat both ordinary iron cookware and ceramic cookware to achieve heating without picking cooking appliance. Due to the integration of infrared heating way, low-power continuous heating may also be obtained to meet special cooking needs and broaden the cooking range. Moreover, the resistivity of the electric heating wire 11 is not less than 0.1µΩ·m. Compared with the existing electric heating wire 11 supported by non-magnetic metal materials such as aluminum, copper, and nickel-tungsten alloy, the resistivity of the electric heating wire 11 is relatively high, the magnetic conductivity is better, and the magnetic lines of force generated by the electromagnetic heating coil will not be shielded, thereby the heating wire of the infrared heating device 100 will not affect the electromagnetic heating.

[0087] Additionally, in this embodiment, the heat insulation cavity 215 is formed at a position where a bottom surface of the infrared heating assembly 10 and a top surface of the electromagnetic heating assembly 20 are overlapped, the air inside the heat insulation cavity 215 may have a better heat insulation effect. Through this arrangement, a temperature of an outer surface of the electromagnetic mounting rack may be reduced under the premise of controlling the thickness of the infrared stove plate within a certain range and without increasing the distance from the electromagnetic heating assembly 20 to the stove panel. Additionally, in the present invention, by providing a first heat insulation layer 31 with lower thermal conductivity between the electromagnetic heating assembly 20 and the infrared heating assembly 20, the heat emitted by the infrared heating assembly 20 may not only be prevented from radiating downward, but also be reflected back to reduce heat loss, which ensures the integration of the two heating ways, improves the heating efficiency, and does not affect the normal operation of the electromagnetic heating assembly 20. At the same time, the thickness of the first heat insulation layer 31 may be effectively decreased to reduce a distance between the electromagnetic heating assembly 20 and the stove panel, thereby reducing the thickness of the whole machine, increasing the heating power of the electromagnetic heating assembly 20 and increasing the heating power of the whole machine.

[0088] Above embodiments are only optional embodiments of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related fields are included in a protection scope of the present invention.

Claims

1. A heating device, comprising: a housing having a mounting chamber formed therein; an infrared heating assembly mounted inside the mounting chamber, comprising an electric heating wire, resistivity of the electric heating wire being not less than 0.1µΩ·m; and an electromagnetic heating assembly mounted inside the mounting chamber and located below the infrared heating assembly, wherein the electromagnetic heating assembly and the infrared heating assembly are at least partially overlapped in an up-and-down direction.

2. The heating device of claim 1, further comprising a heat insulation member, provided between the electric heating wire and the electromagnetic heating assembly.

3. The heating device of claim 1 or 2, wherein the infrared heating assembly comprises a mounting body and the electric heating wire, the electric heating wire being provided at an upper end of the mounting body, the mounting body comprising a heat insulation plate, the heat insulation plate forming the heat insulation member.

4. The heating device of claim 2 or 3, wherein the heat insulation member comprises one or more of a hydrated silica member, a ceramic fiber member, a glass fiber member, or a silicate member.

5. The heating device of any one of claims 1 to 4, wherein the electric heating wire comprises one or more of an iron-chromium-aluminum alloy wire, a nickel-chromium alloy wire, a chromium-aluminum-molybdenum alloy wire, a chromium-aluminum-niobium alloy wire, or a carbon fiber wire.

6. The heating device of any one of claims 1 to 5, wherein an area of a smaller one of the electromagnetic heating assembly and the infrared heating assembly is m, wherein an area of an overlapping part of the electromagnetic heating assembly and the infrared heating assembly is n, n being equal to or greater than 0.3m.

7. The heating device of claim 6, wherein n is equal to or greater than 0.6m.

8. The heating device of claim 7, wherein n is equal to m.

9. The heating device of claim 3, wherein: the electric heating wire is provided with two connection ends arranged at the same side, and the infrared heating assembly further comprises a lead structure provided at the mounting body and electrically connected to the electric heating wire; and the lead structure comprises an insulation base and two electric terminals, the insulation base being provided at the mounting body, the two electric terminals penetrating through the insulation base and being arranged side by side apart from each other, an end of each electric terminal being used to electrically connect one of the connection ends to an external power source to energize the electric heating wire.

10. The heating device of claim 9, wherein the lead structure further comprises a temperature sensing unit provided at the insulation base, the temperature sensing unit being located between the two electric terminals and being used to detect a temperature of the two electric terminals.

11. The heating device of claim 1, further comprising: a housing, having a mounting chamber formed therein; an electromagnetic heating assembly mounted inside the mounting chamber; and an infrared heating assembly mounted inside the mounting chamber and located above the electromagnetic heating assembly, wherein: the infrared heating assembly is at least partially overlapping with the electromagnetic heating assembly in an up-and-down direction; and a heat insulation cavity is formed at a position where a bottom surface of the infrared heating assembly and a top surface of the electromagnetic heating assembly are overlapped.

12. The heating device of claim 11, wherein: a communication passage communicating the heat insulation cavity and the mounting chamber is provided at a peripheral side of the infrared heating assembly; and / or a plurality of the heat insulation cavities are formed and arranged to communicate with each other.

13. The heating device of claim 11 or 12, wherein the bottom surface of the infrared heating assembly is at least partially recessed to form the heat insulation cavity, an area of the bottom surface of the infrared heating assembly being M, and an area of a partially recessed part of the bottom surface of the infrared heating assembly being m, m being greater than 0.3M.

14. The heating device of any one of claims 11 to 13, wherein a maximum distance between the bottom surface of the infrared heating assembly and the top surface of the electromagnetic heating assembly is a, a being greater than 0.5mm.

15. The heating device of any one of claims 11 to 14, wherein the infrared heating assembly comprises a mounting body and an electric heating wire, the electric heating wire being provided at an upper end of the mounting body, and wherein: a bottom of the mounting body is provided with a groove, the groove forming the heat insulation cavity; and / or a bottom of the mounting body is provided with a through hole penetrating in an up-and-down direction, the through hole forming the heat insulation cavity.

16. The heating device of claim 15, wherein the mounting body comprises a mounting frame and a mounting rack arranged separately, the mounting frame being used to mount the electric heating wire, the mounting rack being provided below the electric heating wire, the mounting rack being provided with the groove and / or the through hole, the groove and / or the through hole forming the heat insulation cavity.

17. The heating device of claim 15, wherein the mounting body comprises a first heat insulation member, a bottom surface of the first heat insulation member being provided with the groove, the groove forming the heat insulation cavity.

18. The heating device of claim 15, wherein the infrared heating assembly further comprises a second heat insulation member provided between the mounting body and the electric heating wire.

19. The heating device of claim 18, wherein the infrared heating assembly further comprises a third heat insulation member provided at a side of the second heat insulation member facing away from the electric heating wire.

20. The heating device of claim 19, wherein: the second heat insulation member is made of white carbon black; and / or the third heat insulation member is made of one of aerogel, glass fiber, or ceramic fiber.

21. The heating device of claim 11, wherein the housing is provided with a heat-dissipation passage communicating an interior and an exterior of the mounting chamber.

22. The heating device of claim 1, further comprising: an electromagnetic heating assembly; an infrared heating assembly provided above the electromagnetic heating assembly; and a heat insulation member comprising a first heat insulation layer, the first heat insulation layer being provided between the electromagnetic heating assembly and the infrared heating assembly, thermal conductivity of the first heat insulation layer being less than or equal to 0.02w / m·K.

23. The heating device of claim 22, wherein the first heat insulation layer comprises at least one of an aerogel layer, a mica sheet, or a glass fiber layer.

24. The heating device of claim 22 or 23, wherein a projection of the infrared heating assembly on the electromagnetic heating assembly falls within a projection of the first heat insulation layer on the electromagnetic heating assembly.

25. The heating device of any one of claims 22 to 24, wherein the heat insulation member further comprises a second heat insulation layer, the second heat insulation layer being provided between the first heat insulation layer and the infrared heating assembly, thermal conductivity of the first heat insulation layer being less than thermal conductivity of the second heat insulation layer.

26. The heating device of claim 25, wherein the second heat insulation layer is a white carbon black layer.

27. The heating device of claim 25, wherein the heat insulation member further comprises a heat insulation base, the heat insulation base being provided between the electromagnetic heating assembly and the first heat insulation layer, the first heat insulation layer and the second heat insulation layer being sequentially stacked on the heat insulation base.

28. The heating device of claim 27, wherein a side of the heat insulation base facing away from the electromagnetic heating assembly is provided with a first mounting slot, both the first heat insulation layer and the second heat insulation layer being provided inside the first mounting slot.

29. The heating device of claim 25, wherein a side of the second heat insulation layer facing away from the first heat insulation layer is provided with a second mounting slot, the infrared heating assembly being provided inside the second mounting slot.

30. The heating device of claim 25, wherein the second heat insulation layer and the infrared heating assembly are an integral structure molded by extrusion.

31. The heating device of any one of claims 22 to 30, wherein the electromagnetic heating assembly comprises: a mounting bracket provided with a first side and a second side disposed opposite to each other, the first side being disposed close to the infrared heating assembly; an electromagnetic heating coil provided at the first side of the mounting bracket, the first heat insulation layer being provided between the electromagnetic heating coil and the infrared heating assembly; and a magnet structure provided at the second side.

32. A cooking appliance, comprising the heating device of any one of claims 1 to 31.

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