Laboratory device having a heating function

Abstract

The invention relates to a laboratory device (1) comprising a heating plate assembly (3) which has: a support plate (5) which is made of glass ceramic and on which a heatable support surface (4) for at least one container is formed; an insulating layer (6); a heating element (7), in particular a heating foil; and a thermally conductive layer (8), in particular made of aluminium sheet, wherein the heating element (7) is located between the support plate (5) and the insulating layer (6), and the insulating layer (6) is located between the heating element (7) and the thermally conductive layer (8).

Description

[0001] LABORATORY DEVICE WITH HEATING FUNCTION

[0002] The invention relates to a laboratory device with a heating function.

[0003] Such laboratory devices are already known in practice in various designs, for example as magnetic stirrers with a heatable base or as laboratory hot plates, and are used to heat media contained in containers.

[0004] The laboratory devices with high heating output known from practice are comparatively high in order to protect the electronics contained in the laboratory device from thermal overload.

[0005] Given the potential thermal overload of the electronics of such laboratory devices, the heating output of more compact laboratory devices with heating functions had to be limited accordingly.

[0006] The object of the invention is therefore to provide a laboratory device of the type mentioned above with a heating function which can have a compact design despite a comparatively high heating output.

[0007] To achieve this objective, a laboratory device with the means and features of the independent claim directed to a laboratory device is proposed. In particular, to achieve this objective, a laboratory device with a heating plate structure is proposed, comprising a glass-ceramic support plate on which a heatable support surface for at least one container is formed, an insulation layer, a heating element, in particular a heating foil, and a heat-conducting layer, in particular made of aluminum sheet. The heating element is arranged between the support plate and the insulation layer, and the insulation layer is arranged between the heating element and the heat-conducting layer.

[0008] To prevent the laboratory device from being thermally overloaded by the heating function, the heating plate assembly comprises a glass-ceramic base plate on which the support surface is formed, an insulation layer, a heating element, in particular a heating foil, and a heat-conducting layer, in particular made of aluminum sheet. The heating element is arranged between the base plate and the insulation layer, and the insulation layer is arranged between the heating element and the heat-conducting layer.

[0009] The heating element, particularly the heating foil, transfers heat not only toward the support surface, but also in the opposite direction—in this case, toward the base body of the laboratory device, which may contain temperature-sensitive electronics and / or temperature-sensitive mechanical components. The layered sequence of the heating plate assembly prevents excessive heating of the parts of the laboratory device located beneath the heating plate assembly.

[0010] The insulation layer, which is arranged below the heating element, in particular below the heating foil, reduces heat transfer from the heating element of the heating plate structure to the parts of the laboratory device located beyond the insulation layer.

[0011] The additional heat-conducting layer of the heating plate structure, which is located below the insulation layer as seen from the heating element, allows for the dissipation of heat that may penetrate the insulation layer and thus helps protect the magnetic stirrer from thermal overload. In one embodiment of the laboratory device, a tolerance compensation layer can also be arranged between the insulation layer and the heat-conducting layer. The tolerance compensation layer enables reliable contact of the insulation layer with the heat-conducting layer and can also provide additional insulation. A temperature-resistant fiber mat, for example, can be used as a tolerance compensation layer.

[0012] For reliable heat dissipation and thus for the most reliable protection possible for temperature-sensitive parts of the laboratory equipment, it can be advantageous if the heating plate structure has a heat-conducting profile. The heat-conducting profile can be made of a thermally conductive material, for example aluminum. The heat-conducting profile can be connected to the heat-conducting layer so that heat absorbed by the heat-conducting layer can be transferred to the heat-conducting profile via the connection to the heat-conducting profile. In particular, if the heat-conducting profile has a large volume and / or a large heat capacity compared to the heat-conducting layer, it is possible to transfer even larger amounts of heat to the heat-conducting profile and keep it away from temperature-sensitive parts of the laboratory equipment. The heat-conducting profile can serve as a heat sink for the heating plate structure.

[0013] In one embodiment of the heat-conducting profile, it is designed as a closed, circumferential profile. The heat-conducting profile can be frame-shaped and / or, for example, have a heat-dissipating design. As a heat-dissipating design, for example, cooling fins and / or channels and / or openings and / or bores and / or penetrations and / or recesses can be provided in the heat-conducting profile, by means of which the surface area of ​​the heat-conducting profile can be enlarged and the ability of the heat-conducting profile to dissipate heat to the environment can be improved. Furthermore, it is possible for the heat-conducting profile to form at least part of the outer contour of the heating plate structure. In this way, heat introduced into the heat-conducting profile can be dissipated to the environment via the outer side of the heat-conducting profile.This results in particularly efficient temperature management and thus particularly efficient protection of the laboratory device equipped with the hotplate assembly against thermal overload. The heat-conducting profile can act as a heat exchanger.

[0014] In a particularly advantageous embodiment of the laboratory device, the support plate is glued to the heat-conducting profile. The support plate can be connected to the heat-conducting profile, for example, using a temperature-resistant, preferably double-sided, adhesive tape, a temperature-resistant adhesive, and / or temperature-resistant silicone. This allows for a particularly compact design and simple manufacture of the heating plate assembly. Separate fastening devices such as clamps or screws for securing the support plate to the heat-conducting profile are then unnecessary.

[0015] The heating element of the heating plate structure can be arranged and / or designed such that only an inner region of the support plate, on which the support surface is formed, is heated. If a connection between the support plate and the heat-conducting profile is made by an adhesive bond in an edge region of the support plate, which, for example, surrounds the support surface on the support plate in a closed manner, the adhesive bond between the support plate and the heat-conducting profile, namely the preferably double-sided, temperature-resistant adhesive tape, can be protected from thermal overload. In a preferred embodiment of the laboratory device, provision is made for a heatable surface of the heating element to be at a distance from the heat-conducting profile. This avoids direct contact between the heatable surface and the heat-conducting profile. In this way, direct heat input into the heat-conducting profile can be avoided.

[0016] The heatable surface can be surrounded by an unheated edge area of ​​the heating element. The unheated edge area can be made of a thermally well-insulating mica material, for example. The unheated edge area of ​​the heating element can at least reduce or largely prevent heat input into the heat-conducting profile directly from the plane of the heating plate structure in which the heating element is located. If too much heat is introduced into the heat-conducting profile in this plane, it can negatively impact the efficiency of the heat-conducting profile as a heat exchanger.

[0017] Heating wires or heating tracks, for example, can be arranged within the heatable surface. The heating element can have at least one edge-side, material-free cutout. This is intended to prevent direct contact between the heating element and the heat-conducting profile. The at least one edge-side, material-free cutout can be adjacent to the heatable surface of the heating element.

[0018] In one embodiment of the laboratory device, the heating element can have contact surfaces only in its corner areas, in particular four. The contact surfaces can be made of mica material. The contact surfaces allow the heating element to contact the heat-conducting profile in the use position. The previously mentioned material-free cutouts can then be formed between the contact surfaces of the heating element formed in the corner areas. This minimizes the contact area between the heating element and the heat-conducting profile. Furthermore, the four contact surfaces formed in the corner areas promote centering of the heatable surface of the heating element within the heating plate structure.

[0019] The heat conducting profile can have a geometry such that a projection of the heat conducting profile onto the support plate completely surrounds the support surface for a container formed on the support plate.

[0020] The insulation layer can, for example, consist of a microporous insulation material, polyurethane, rock wool and / or glass wool.

[0021] As already indicated above, the heat-conducting profile can be frame-shaped. The heat-conducting profile can also define an interior space in which the heating element and / or the insulation layer and / or the tolerance compensation layer of the heating plate structure are arranged. The heat-conducting profile can then serve, on the one hand, to accommodate the aforementioned layers of the heating plate structure and to absorb heat emanating from the heating element that is not transferred to the support plate. The heat-conducting profile can be arranged between the support plate and the heat-conducting layer.

[0022] The heating plate structure can further comprise a heat shielding layer, in particular made of stainless steel sheet. The heat shielding layer can be arranged on the heat conducting layer. The heat shielding layer can be arranged in particular on a side of the heat conducting layer facing away from the heating element and / or the heat conducting profile. The heat shielding layer can serve as additional thermal protection for the laboratory device equipped with the heating plate structure against thermal overload. The use of the heat shielding layer, in particular made of stainless steel, is advantageous, for example, when the heat conducting layer is interrupted in places or its layer thickness is reduced. This can be the case in order to minimize a magnetic shielding effect of the heat conducting layer, which would impair a magnetic coupling between a stirring point of the laboratory device and a magnetic pickup, such as a stirring magnet.The heat shielding layer then serves as an additional barrier against heat, which can more easily pass through the heat conducting layer at these points.

[0023] In one embodiment of the laboratory device, the heating plate assembly has a support plate on an underside facing away from the base plate. The support plate can, for example, be made of plastic and form a closure for the heating plate assembly. The plastic design of the support plate can also provide an additional insulating effect and thus contribute to the thermal protection of the laboratory device equipped with the heating plate assembly. The support plate can be connected, in particular screwed, to the heat-conducting profile of the heating plate assembly. A screw connection between the support plate and the heat-conducting profile can press the individual layers of the heating plate assembly together and also press together the previously mentioned tolerance compensation layer.

[0024] The laboratory device can have at least one light source, for example an LED, in particular an RGB LED, for generating an illuminated display on the support plate. Using such an LED, it is then possible to generate an illuminated display for status indication on the support plate, for example, adjacent to the support surface on the support plate.

[0025] In one embodiment of the laboratory device, a light source is arranged on the hotplate assembly, for example, on the aforementioned support plate of the hotplate assembly. The light source is preferably oriented so that it radiates toward the support plate. To generate an illuminated display on the top side of the support plate, the latter can be at least partially transparent or translucent. The support plate can then be illuminated from below to generate the desired illuminated display on the top side of the support plate.

[0026] The heating plate structure can, for example on the carrier plate, have a screen for each light source to prevent lateral light emission. The screen can be used to minimize or even completely prevent lateral light emission through a gap between the carrier plate and the heat-conducting profile. A gap between the carrier plate and the heat-conducting profile can be sealed light-tight to prevent light from escaping through the gap. The screen(s) can act as reflectors and for this purpose can be provided with a reflective coating, in particular with a highly reflective lacquer, for example white. In one embodiment, the laboratory device can have a plurality of light sources for generating an illuminated display. These plurality of light sources can, for example, be LEDs, preferably RGB LEDs and / or pixel LEDs, and / or be connected to one another via a data bus.The use of pixel LEDs as light sources, which can be connected to each other via a data bus, simplifies the wiring of the light sources and also facilitates targeted control of the light sources to generate a particularly meaningful illuminated display on the base plate of the laboratory device. Multiple light sources can be arranged, for example, on a circuit board.

[0027] Particularly when the at least one light source is arranged on the previously mentioned support plate of the heating plate structure, it may be expedient for the heat-conducting profile to have at least one light passage opening through which light can be guided from the at least one light source to and through the preferably at least partially transparent or translucent support plate. The heat-conducting profile then thermally separates the at least one light source from the heating element of the heating plate structure and simultaneously enables the generation of the previously described illuminated display on the support plate.

[0028] In one embodiment of the laboratory device, the heat-conducting profile is provided with a plurality of such light passage openings, preferably arranged in a ring around the support surface. This makes it possible to create a light indicator that surrounds the support surface on the support plate of the laboratory device in a ring.

[0029] The at least one light passage opening in the heat-conducting profile can form a light segment of the illuminated display. The heat-conducting profile can reliably protect the at least one light source from thermal overload caused by heat emitted by the heating element of the heating plate structure. The heat-conducting profile thus serves as a spacer between the at least one light source and the heating element and can also absorb and dissipate heat generated by the at least one light source. The formation of a visually appealing illuminated display on the support plate can be promoted if the support plate is at least partially transparent or translucent and / or free of knobs, at least in the area of ​​the at least one light passage opening of the heat-conducting profile, and / or has a ground glass and / or a filter and / or a tint.In particular, the use of a glass cut, a filter and / or a tint can promote the formation of a uniform and therefore particularly attractive illuminated display on the surface of the display plate.

[0030] A seal can be arranged between the base plate and the heat-conducting profile. The seal can prevent the ingress of moisture. The seal can have at least one light-transmitting segment that limits the effective light exit cross-section of the at least one light-transmitting opening of the heat-conducting profile. The seal can thus function as a screen to give the light segment generated by the light-transmitting opening the desired shape in a particularly simple manner.

[0031] The seal may further comprise a sealing lip, preferably a closed, circumferential one, which is formed on a side of the seal facing the mounting plate of the heating plate assembly when the seal is in the use position. The sealing lip may enhance the sealing effect of the seal. The seal may preferably be made of rubber or silicone.

[0032] In one embodiment of the laboratory device, the heat-conducting layer of the heating plate structure can be interrupted in at least one area, in particular at least in the area of ​​a stirring point of the laboratory device, and / or filled with a non-magnetically shielding inlay, for example a stainless steel inlay, and / or reduced in thickness, for example from 2 mm to 0.5 mm or 0.4 mm or 0.3 mm. Thus, magnetic shielding by the heat-conducting layer between the stirring point and a magnetic pickup, for example a stirring magnet, can be minimized or completely avoided.

[0033] In one embodiment of the laboratory device, it is designed as a magnetic stirrer with a heating function and at least one stirring point. In another embodiment of the laboratory device, it is designed as a laboratory hotplate.

[0034] The invention is described in more detail below using an exemplary embodiment, but is not limited to this exemplary embodiment. Further exemplary embodiments result from combining the features of individual or multiple claims with one another and / or by combining individual or multiple features of the exemplary embodiment. They show:

[0035] It shows :

[0036] Fig. 1 is a sectional side view of a laboratory device designed as a heatable magnetic stirrer with a hotplate structure according to the invention,

[0037] Fig. 2 is an exploded view of the heating plate assembly to illustrate the components and the layer sequence of the heating plate assembly of the laboratory device shown in Figure 1, and

[0038] Fig. 3 is a sectional side view of the heating plate assembly with the frame-shaped heat conducting profile made of aluminum to illustrate light passage openings formed in the heat conducting profile, which enable the generation of a light display on the top side of the mounting plate of the heating plate assembly, and

[0039] Fig. 4 is an isometric view of the heating plate assembly to illustrate the illuminated display comprising several illuminated segments on the surface of the mounting plate.

[0040] All figures show at least parts of a laboratory device designated as a whole by 1, which is designed as a magnetic stirrer 2 with heating function.

[0041] To provide the heating function, the laboratory device 1 comprises a heating plate structure 3 with a heatable base 4 for at least one container.

[0042] According to Fig. 2, the heating plate assembly 3 comprises a glass-ceramic support plate 5 that is at least partially transparent or translucent at least on its edge, on which the support surface 4 is formed. Furthermore, the heating plate assembly 3 comprises an insulation layer 6, a heating element 7 in the form of a heating foil, and a heat-conducting layer 8 formed from an aluminum sheet.

[0043] The heating element 7 is arranged below the support plate 5 and thus between the support plate 5 and the insulation layer 6. The insulation layer 6 is in turn arranged below the heating element 7 and thus between the heating element 7 and the heat-conducting layer 8. Between the insulation layer 6 and the heat-conducting layer 8, the heating plate structure 3 comprises a tolerance compensation layer 9, which is formed from a temperature-resistant fiber mat.

[0044] The heating plate assembly 3 further comprises a heat-conducting profile 10 made of aluminum and serving as a heat sink. The heat-conducting profile 10 is connected to the heat-conducting layer 8 in such a way that heat transfer from the heat-conducting layer 8 to the heat-conducting profile 10 is facilitated.

[0045] Figure 2 shows that the heat conducting profile 10 is a closed, circumferential, frame-shaped profile and forms part of the outer contour of the heating plate structure 3.

[0046] According to Figure 2, the heat-conducting profile 10 is arranged between the support plate 5 and the heat-conducting layer 8 of the heating plate assembly 3. The support plate 5 of the heating plate assembly 3 is connected, namely glued, to the heat-conducting profile 10 by a temperature-resistant double-sided adhesive tape 11, which is shown below the support plate 5 in Figure 2. The adhesive tape 11 is arranged in an edge region of the support plate 5 and on an underside of the support plate 5. The support surface 4 on the support plate 5 is arranged within a projection of the adhesive tape 11 onto the support plate 5.

[0047] The heating element 7 is arranged and / or configured such that only an inner region of the support plate 5, where the support surface 4 is formed, is heated. In this way, the adhesive bond between the glass-ceramic support plate 5 and the aluminum heat-conducting profile 10 is protected from thermal overload.

[0048] The insulation layer 6 of the heating plate structure 3 consists of a microporous insulation material.

[0049] The heat-conducting profile 10 is, as previously mentioned, frame-shaped. The heat-conducting profile 10 comprises an interior space 12 in which the heating element 7, namely the heating foil, and the insulation layer 6, as well as the tolerance compensation layer 9, are arranged. The heating plate structure 3 further comprises a heat-shielding layer 13 made of stainless steel sheet and arranged on the heat-conducting layer 8. The heat-shielding layer 13 is arranged on an underside of the heat-conducting layer 8, which faces away from the heating element 7 and also from the heat-conducting profile 10.

[0050] On the underside of the heating plate assembly 3 facing away from the mounting plate 5, the heating plate assembly 3 has a plastic support plate 14. The support plate 14 thus forms the lower end of the heating plate assembly 3. The support plate 14 can be screwed to the heat-conducting profile 10, for example.

[0051] Figure 2 shows that the laboratory device 1 has a series of light sources 15, which serve to generate an illuminated display 27 on the support plate 5 of the heating plate assembly 3 and are arranged on a strip-shaped circuit board. The status of the laboratory device 1, for example, a temperature of the support surface 4, can be output via the illuminated display 27.

[0052] The light sources 15 are RGB LEDs, specifically so-called pixel LEDs, which are arranged on the heating plate assembly 3, specifically on the support plate 14 of the heating plate assembly 3. The pixel LEDs are interconnected via a data bus 16. This enables simple interconnection of the light sources 15 and the generation of a particularly attractive illuminated display for indicating the status of the laboratory device 1 on the upper side of the at least partially transparent or translucent support plate 5.

[0053] In order to be able to guide the light emitted by the light sources 15 to generate the illuminated display to and through the mounting plate 5, the heat conducting profile 10 has a series of light passage openings 17. The light emitted by the light sources 15 can be guided from below through the light passage openings 17 to and ultimately through the mounting plate 5, which is at least partially transparent or translucent in this area. Figure 2 illustrates that the heat conducting profile 10 has a

[0054] On the support surface 4 on the support plate 5, there is a ring-shaped surrounding plurality of such light passage openings 17. The light passage openings 17 can, for example, widen conically from bottom to top or from top to bottom. Each light passage opening 17 enables the formation of a luminous segment on the upper side of the glass-ceramic support plate 5 of the heating plate structure 3.

[0055] The mounting plate 5 is at least partially transparent or translucent and nub-free in the area of ​​the light passage openings 17 and / or is provided with a ground glass and / or a filter and / or a tint in order to promote the formation of individual luminous segments of a luminous display to be produced on the upper side of the mounting plate 5.

[0056] The laboratory device 1 is designed as a magnetic stirrer 2 and has a stirring point 18.

[0057] In order to minimize or completely avoid magnetic shielding between the stirring point 18 of the laboratory device 1 and a magnetic pickup, for example a stirring magnet, the heat-conducting layer 8 is interrupted in at least one area, namely in the area of ​​the stirring point 18 and / or filled with a suitable inlay which does not have a magnetic shielding effect, for example a stainless steel inlay, and / or reduced in terms of its layer thickness, for example from 2 mm to 0.5 mm, 0.4 mm or even 0.3 mm.

[0058] The view of the heating element 7 in Figure 2 illustrates that the heating element 7 has a heatable surface 19 which is arranged or designed on the heating element 7 such that, in the position of use of the heating element 7, it has a distance from the heat-conducting profile 10. In this way, heat generated by the heatable surface 19 of the heating element 7 is prevented from being transferred directly to the heat-conducting profile 10.

[0059] Figure 2 further illustrates that the heatable surface 19 of the heating element 7 is surrounded by an unheated edge region 20 of the heating element 7. This edge region 20 can consist of a mica material, which has good heat-insulating properties and thus counteracts direct heat transfer to the heat-conducting profile 10. In the unheated edge region 20 of the heating element 7, the heating element 7 also has edge-side, material-free cutouts 28. The material-free cutouts 28 border the heatable surface 19 of the heating element 7. The provision of material-free cutouts 28 in the edge region 20 of the heating element 7 has the advantage that contact between the heating element 7 and the heat-conducting profile 10 in these regions can be reduced or even completely avoided.Accordingly, heat transfer from the heatable surface 19 of the heating element 7 to the heat conducting profile 10 is minimized or even completely avoided at this point.

[0060] The heating element 7 can be supplied with power via a power connection 21.

[0061] The figures further illustrate that a seal 22 is arranged between the mounting plate 5 and the heat-conducting profile 10. The seal 22 has a circumferential sealing lip 23 facing the mounting plate 5 and prevents moisture from entering between the mounting plate 5 and the heat-conducting profile 10.

[0062] The seal 22 is equipped with a series of light passage segments 24. The light passage segments 24 serve to define and shape an effective light exit cross-section of the light passage openings 17 of the heat-conducting profile 10. In this way, it is possible to create the light passage openings 17 in the heat-conducting profile 10, for example, with a milling cutter. The light passage openings 17 within the heat-conducting profile 10 are given a specific, namely rounded, shape by the use of a milling cutter. If it is desired to create light segments 25 with an angular or rectangular shape on the support plate 5, this can be done in a particularly simple manner using the appropriately shaped light passage segments 24 within the seal 22.

[0063] The seal 22 with its light passage segments 24 thus serves as a shaping aperture, which ultimately determines the shape of the light segments 25 on the mounting plate 5 of the laboratory device 1.

[0064] In order to prevent lateral escape of light from a contact plane between the support plate 14 and the heat conducting profile 10, the heating plate structure 3 has a screen 26 on the support plate 14 for each light source 15. The screens

[0065] 26 extend a little way into the light passage openings 17 of the heat conducting profile 10 and prevent the light sources 15 arranged within the screens 26 from emitting their light laterally through a gap that may be present between the support plate 14 and the heat conducting profile 10, which could disturb the appearance of the laboratory device 1.

[0066] The screens 26 may have a reflective coating, for example in the form of a white coating, and are designed in such a way that they correspond to the beam angles of the light sources 15 and thus do not impair upward light emission. This promotes the formation of powerful light segments 25 as a light display.

[0067] 27 on the top of the mounting plate 5 . List of reference symbols

[0068] 1 laboratory device

[0069] 2 magnetic stirrers

[0070] 3 Heating plate structure

[0071] 4 On footprint

[0072] 5 On base plate

[0073] 6 I insulation layer

[0074] 7 Heating element

[0075] 8 Thermal conduction layer

[0076] 9 Tolerance compensation position

[0077] 10 Thermal conduction profile

[0078] 11 Adhesive tape

[0079] 12 interior of 10

[0080] 13 Thermal shielding layer

[0081] 14 Carrier plate

[0082] 15 Light source

[0083] 16 data bus

[0084] 17 Light passage opening

[0085] 18 Stirring point on 1

[0086] 19 heated area of ​​7

[0087] 20 unheated edge area of ​​7

[0088] 21 power connection for 7

[0089] 22 Seal

[0090] 23 Sealing lip on 22

[0091] 24 light transmission segment in 22

[0092] 25 light segments

[0093] 26 screen on 14 for 15

[0094] 27 LED indicator

[0095] 28 cutout in 20

[0096] 29 support surface

Claims

Claims 1. Laboratory device (1) with heating function, wherein the laboratory device (1) has a heating plate structure (3) which A glass ceramic support plate (5) on which a heatable support surface (4) for at least one container is formed, comprising an insulation layer (6), a heating element (7), in particular a heating foil, and a heat-conducting layer (8), in particular made of aluminum sheet, wherein the heating element (7) is arranged between the support plate (5) and the insulation layer (6) and the insulation layer (6) is arranged between the heating element (7) and the heat-conducting layer (8).

2. Laboratory device (1) according to the preceding claim, wherein the heating plate structure (3) has a tolerance compensation layer (9) between the insulation layer (6) and the heat conducting layer (8), in particular a temperature-resistant fiber mat.

3. Laboratory device (1) according to one of the preceding claims, wherein the heating plate structure (3) has a heat conducting profile (10), in particular made of aluminum, which is connected to the heat conducting layer (8).

4. Laboratory device (1) according to the preceding claim, wherein the heat conducting profile (10) is a closed circumferential profile and / or has a heat-dissipating design and / or forms at least part of the outer contour of the heating plate structure (3) and / or is arranged between the mounting plate (5) and the heat conducting layer (8).

5. Laboratory device (1) according to one of the two preceding claims, wherein the mounting plate (5) is glued to the heat conducting profile (10), for example by a temperature-resistant, preferably double-sided, Adhesive tape (11) and / or a temperature-resistant adhesive and / or temperature-resistant silicone.

6. Laboratory device (1) according to one of the preceding claims, wherein the heating element (7) is arranged and / or designed such that only an inner region of the support plate (5), on which the support surface (4) is formed, can be heated.

7. Laboratory device (1) according to one of claims 3 to 6, wherein a heatable surface (19) of the heating element (7) is at a distance from the heat-conducting profile (10) and / or is surrounded by an unheated edge region (20), in particular which is formed from mica material, of the heating element (7), and / or wherein the heating element (7) has at least one edge-side, material-free cutout (28) which borders on a heatable surface (19) of the heating element (7), and / or in its corner regions in each case a support surface (29) with which the heating element (7) contacts the heat-conducting profile (10) in the position of use.

8. Laboratory device (1) according to one of the preceding claims, wherein the insulation layer (6) consists of a microporous insulation material, of polyurethane, of rock wool and / or of glass wool.

9. Laboratory device (1) according to one of the preceding claims, wherein the heat-conducting profile (10) is arranged between the support plate (5) and the heat-conducting layer (8) and / or is frame-shaped and / or defines an interior space (12) in which the heating element (7) and / or the insulation layer (6) and / or the tolerance compensation layer (9) is / are arranged.

10. Laboratory device (1) according to one of the preceding claims, wherein the heating plate structure (3) comprises a heat shielding layer (13), in particular made of stainless steel sheet, which is arranged on the heat-conducting layer (8), in particular on a side of the heat-conducting layer (8) facing away from the heating element (7) and / or the heat-conducting profile (10).

11. Laboratory device (1) according to one of the preceding claims, wherein the heating plate structure (3) has a support plate (14), in particular made of plastic, on an underside facing away from the mounting plate (5).

12. Laboratory device (1) according to one of the preceding claims, wherein the laboratory device (1) has at least one light source (15), in particular an LED, for generating a light display on the support plate (5).

13. Laboratory device (1) according to the preceding claim, wherein the at least one light source (15) is arranged on the heating plate structure (3), in particular on the support plate (14) of the heating plate structure (3), preferably wherein the heating plate structure (3), preferably on the support plate (14), has for each light source (15) a respective, preferably reflective, screen (26) against lateral light emission.

14. Laboratory device (1) according to one of the preceding claims, wherein the laboratory device (1) has a plurality of light sources (15) in the form of LEDs, in particular in the form of RGB LEDs and / or pixel LEDs, for generating the illuminated display, preferably which are connected to one another via a data bus (16).

15. Laboratory device (1) according to one of the preceding claims, wherein the heat conducting profile (10) has at least one light passage opening (17) through which light from at least one light source (15) is directed onto and through the Can be directed onto the mounting plate (5), preferably wherein the heat-conducting profile (10) has a plurality of such light passage openings (17), preferably surrounding the support surface (5) in a ring shape.

16. Laboratory device (1) according to the preceding claim, wherein the On the mounting plate (5) at least in the region of the at least one light passage opening (17) is at least partially transparent or translucent and / or free of knobs and / or has a glass cut and / or a filter and / or a tint.

17. Laboratory device (1) according to one of the two preceding claims, wherein a seal (22) is arranged between the mounting plate (5) and the heat conducting profile (10), preferably wherein the seal (22) has one of the On the mounting plate (5) facing sealing lip (23) and / or at least one light passage segment (24) which defines an effective light exit cross-section of the at least one light passage opening (17) of the heat-conducting profile (10).

18. Laboratory device (1) according to one of the preceding claims, wherein the heat-conducting layer (8) is interrupted in at least one region, in particular at least in the region of at least one stirring point (18) of the laboratory device (1), and / or filled with a magnetic inlay, for example a stainless steel inlay, and / or reduced in terms of its layer thickness, for example from 2 mm to 0.5 mm or 0.4 mm or 0.3 mm, in order to minimize or completely avoid magnetic shielding between the stirring point (18) and a magnetic pickup, for example a magnetic bar.

19. Laboratory device (1) according to one of the preceding claims, wherein the laboratory device (1) is designed as a laboratory hot plate or as Magnetic stirrer (2) with heating function and with at least one Stirring point (18) is formed.

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