Laser working system and method for operating a laser working system

Abstract

The invention relates to a laser working system. The laser working system comprises: a laser working head having at least one temperature sensor; and a control device having a model. The temperature sensor is designed to measure a temperature at a first point on the laser working head in order to ascertain a temperature measurement value. The control device is designed to determine a first temperature at the first point on the laser working head using the model, in order to ascertain a first model temperature value, to compare the temperature measurement value with the first model temperature value, and to initiate and / or carry out an action on the basis of the comparison.

Description

[0001] Laser processing system and method for operating a laser processing system

[0002] The present disclosure relates to a laser processing system. Furthermore, the present disclosure relates to a method for operating a laser processing system.

[0003] Background and state of the art

[0004] In laser processing heads, e.g., as end effectors in laser cutting and laser welding systems, there are several components that are exposed to particularly high thermal stress due to their location and function. These include, primarily but not exclusively, apertures and optics (lenses, protective glass).

[0005] Apertures in laser processing heads serve the purpose of illuminating the optics downstream in the beam path with a laser beam of a defined diameter. To achieve this, the geometry of the aperture blocks the peripheral radiation of the laser beam above the desired diameter. The surface of the aperture is coated with a special, highly absorbent coating. This coating is subject to high thermal stress. It is important to ensure that the coating is not exposed to temperature peaks above a defined limit to avoid damage such as melting or burning.

[0006] Lenses in laser processing heads serve the purpose of refracting the light of the laser beam, thus giving the outer edge of the beam behind the lens a defined diameter and angle. Protective glasses serve the purpose of protecting the adjacent area inside the laser processing head from contamination by particles, gunpowder, smoke, etc. Depending on their intended use, both lenses and protective glasses (also collectively referred to as "optics") should be as transmissive as possible for light in the wavelength range of the laser used and are provided with an appropriate coating. This coating is also subject to high thermal stress. Here, too, it must be ensured that the coating is not exposed to temperature peaks beyond a defined limit to avoid damage such as melting or burning.In accordance with the requirements outlined above, there is a need to monitor the temperature of components of laser processing heads subject to high thermal stress in real time. This allows for the early detection of temperature peaks, e.g., due to contamination, which could lead to damage to the component or its coating. It also allows for the long-term thermal stress on the component and its remaining service life to be estimated over a longer period.

[0007] Metrological monitoring of components subject to the highest thermal stress is very complex. The use of invasive measurement methods, such as attaching thermocouples to the surface of optics or within apertures, is generally not possible, as this would undesirably influence the optical process. Optical measurement technology, such as thermopiles, is a possible approach. However, this is very complex and not always technically feasible, as the measurement technology must be aimed directly at the surface of interest, which is not always possible from a design perspective.

[0008] Disclosure of the invention

[0009] In many laser processing processes, real-time measurement of physical variables (temperature, pressure, flow velocity, mass flow, etc.) is desirable. On the one hand, this can be used for process monitoring, e.g., recording actual variables to adjust process parameters within a control system, as well as for timely detection of limit value violations so that the machine can be shut down in a timely manner and component damage can be avoided. On the other hand, recording process variables over time can be used to estimate the wear status of sensitive components and thus estimate their remaining service life (“predictive maintenance”).

[0010] However, the desire to monitor process parameters is often counteracted by the difficulty of measuring them. Many locations within laser processing heads are not accessible by measurement or are only accessible using complex methods during operation. In particular, the detection of temperatures at apertures and optics in laser processing heads poses a problem. Therefore, it is an object of the present disclosure to provide a laser processing system and a method for operating a laser processing system with improved process monitoring. In particular, an object of the disclosure is to provide a laser processing system and a method for operating a laser processing system with improved thermal monitoring.

[0011] A further object of the disclosure is to provide a laser processing system and a method for operating a laser processing system by means of which it is possible to detect wear, for example thermally induced aging, of components of the laser processing system.

[0012] A further object of the disclosure is to provide a laser processing system and a method for operating a laser processing system that can be operated in an improved manner.

[0013] A further object of the disclosure is to provide a laser processing system and a method for operating a laser processing system that enables real-time measurement of physical quantities, for example for process monitoring and / or for estimating a wear condition of at least one component of the laser processing system.

[0014] A further object of the disclosure is to provide a laser processing system and a method for operating a laser processing system that can determine a temporal temperature profile of a coating and / or a material of at least one optical element, for example in order to be able to predict failure due to thermal aging at an early stage.

[0015] One or more of these objects are achieved by the subject matter of the independent claims. Advantageous embodiments and further developments are defined in the dependent claims. A laser processing system is specified. The laser processing system comprises a laser processing head with at least one temperature sensor. Furthermore, the laser processing system comprises a control device with a model, in particular with a model for monitoring a laser processing process and / or a model of the laser processing head and / or a model of one or more components of the laser processing head. The temperature sensor is configured to measure a temperature at a first location on the laser processing head in order to determine a temperature measurement value.The control device is configured to determine, in particular simulate, a first temperature at the first location of the laser processing head using the model in order to determine a first model temperature value. Furthermore, the control device is configured to compare the measured temperature value with the first model temperature value. The control device is configured to initiate an action based on the comparison. Alternatively or additionally, the control device is configured to perform an action based on the comparison.

[0016] A laser processing system comprising a laser processing head with at least one temperature sensor is specified. The laser processing system further comprises a control device with a model, in particular with a model for monitoring a laser processing process and / or a model of the laser processing head and / or a model of one or more components of the laser processing head. The temperature sensor is configured to measure a temperature at a first location on the laser processing head in order to determine a temperature measurement value. The control device is configured to determine a first temperature at the first location on the laser processing head using the model and the temperature measurement value in order to determine a first model temperature value.Alternatively or additionally, the control device is configured to determine a second temperature at a second location of the laser processing head using the model and the temperature measurement value to determine a second model temperature value. The control device is configured to initiate and / or perform an action based on the first model temperature value and / or the second model temperature value.

[0017] Each of the control devices can be configured to perform any method disclosed herein. A method for operating a laser processing system is provided. The method comprises the steps of: measuring a temperature at a first location of the laser processing head to determine a temperature measurement value; determining, in particular simulating, a first temperature at the first location of the laser processing head using a model to determine a first model temperature value; comparing the temperature measurement value with the first model temperature value; and initiating and / or executing an action based on the comparison.

[0018] A method for operating a laser processing system is specified. The method comprises: measuring a temperature at a first location of the laser processing head to determine a temperature measurement value. The method comprises: determining a first temperature at the first location of the laser processing head using a model and the temperature measurement value to determine a first model temperature value. Alternatively or additionally, the method comprises: determining a second temperature at a second location of the laser processing head using the model and the temperature measurement value to determine a second model temperature value. The method comprises: initiating and / or performing an action based on the first model temperature value and / or based on the second model temperature value.

[0019] Each of the laser processing systems may be any laser processing system disclosed herein.

[0020] Determining the first temperature at the first location of the laser processing head can be carried out using a model for monitoring a laser processing process and / or a model of the laser processing head and / or a model of one or more components of the laser processing head.

[0021] A computer program product includes instructions that cause a laser processing system to perform a method disclosed herein.

[0022] The laser processing system can be any laser processing system disclosed herein. Alternatively or additionally, the method can be any method disclosed herein. According to one concept of the present invention, a model, for example a so-called "digital twin," can be used to monitor the temperature of a laser processing head or components of a laser processing head and / or to predict thermally induced aging with the goal of predictive maintenance. A digital twin is a digital representation of things in the real world. According to the present disclosure, this can be a virtual model that can consist of digital lookup tables and / or system models. System models describe technical systems, for example, based on lumped elements (without spatial extension) and ordinary differential equations.System models can be solved quickly and are therefore suitable for real-time applications. The model or digital twin can be created for the entire laser processing system or for specific components of interest. The model is preferably executed during operation of the laser processing system and can include interfaces to easily measured points of the real laser processing system or the real laser processing head (referred to here as the first points). The model thus offers the possibility of determining virtual measured variables during operation from the easily recorded measurement data of the real laser processing system and the respective control parameters, as well as estimating the wear status. Furthermore, the additional use of machine learning methods can improve the accuracy of the virtual model both during the creation phase and continuously during use.

[0023] The laser processing head comprises at least one temperature sensor. The at least one temperature sensor can measure a temperature at a point on the laser processing head as the actual temperature. The model can determine a temperature at the same point. For this purpose, the model can be a model of the laser processing head that is supplied with current process variables. The model can accordingly determine a target temperature at that point. The target temperature can correspond to a temperature during normal operation. By comparing the measured temperature (actual temperature) with the determined temperature (target temperature), a deviation between the two temperature values ​​can be determined. Based on the deviation, it can be determined whether normal operation of the laser processing system can be assumed or whether a special event has occurred and, for example, a malfunction is present or is to be expected.The wear condition of components of the laser processing head can also be estimated based on the deviation.

[0024] For example, during a laser processing process, an optical element of the laser processing head may become contaminated by splashes, deposits, etc., significantly altering the transmission or absorption properties of the optical element (locally) for a processing laser beam. This can cause the optical element to heat up significantly (locally), which can lead to component failure in the laser processing head. Early detection of a deviation from normal operation enables measures to be taken to prevent component failure of the laser processing head. This also prevents downtime of the laser processing system due to major maintenance or repair work. Furthermore, the quality of the processing process is improved, as operating parameters or process parameters for laser processing are generally defined for normal operation.A deviation between an actual and setpoint value can be used as input to a control loop, for example, to deviate from normal operation within a (predefined) range to maintain an optimal machining process with the process variables. This allows, for example, a deviation between the actual and setpoint values ​​due to material aging to be taken into account.

[0025] In general, the laser processing head can be a laser welding head, a laser cutting head, a laser engraving head, a laser hardening head or a laser cladding head.

[0026] The at least one temperature sensor can measure the temperature at the first location directly or indirectly. The temperature sensor can contact the first location or be spaced from the first location. If the temperature sensor contacts the first location, a measuring probe of the temperature sensor can be applied to the first location. If the temperature sensor does not contact the first location or is spaced from it, the temperature sensor can receive electromagnetic radiation from the first location. The temperature sensor can be an optical sensor, e.g. an IR sensor, or a thermopile array sensor. Based on the electromagnetic radiation from the first location, the temperature at the first location can be measured. In particular, the temperature sensor is a temperature sensor arrangement. The temperature sensor arrangement can comprise a plurality of temperature measuring elements.

[0027] The at least one temperature sensor can be arranged in a housing of the laser processing head. Alternatively, the at least one temperature sensor can be arranged outside a housing of the laser processing head.

[0028] The temperature can be measured with spatial resolution by the at least one temperature sensor, in particular by the temperature sensor arrangement. The location can be a surface, in particular a surface of a component of the laser processing head.

[0029] The laser processing head can comprise a plurality of temperature sensors. Preferably, the laser processing head comprises at least two, more preferably at least three, more preferably at least five, temperature sensors. Each of the temperature sensors can measure a temperature at a (first) location on the laser processing head in order to determine a respective temperature measurement value. The (first) locations can be different locations. Each of the (first) locations can be located on or at a different component of the laser processing head. At each of the (first) locations, a first temperature can be determined using the model in order to determine a respective first model temperature value. Temperature measurement values ​​and model temperature values ​​can be compared. Preferably, a respective temperature measurement value and a model temperature value at the same location are compared. Based on the comparisons, an action can be initiated and / or an action can be performed.

[0030] It is also possible for a temperature sensor to measure temperatures (exactly or at most) at multiple locations on the laser processing head to determine multiple temperature readings. The temperature readings can be compared with model temperature values, and an action can be initiated and / or executed based on the comparison.

[0031] The control device can be (entirely) encompassed by the laser processing head. The control device can be directly connected or coupled to the laser processing head. The connection or coupling can be wired or wireless. At least part of the control device can be separated from the laser processing head. At least part of the control device can be spaced apart from the laser processing head. For example, the control device can comprise a server. The server can be located at a central location. Multiple laser processing systems can interact with or access the server.

[0032] The control device may comprise at least one memory. The model may be stored in the memory. The memory may be a non-volatile memory.

[0033] The control device may comprise at least one processor. The processor may be configured to determine the first temperature at the first location. The processor may be configured to compare the measured temperature value with the first model temperature value. The processor may be configured to initiate and / or execute the action.

[0034] The model can be a model for monitoring a laser processing process. The model can be a model of the laser processing head. The model can be a model of one or more components of the laser processing head. The model can be a representation of the laser processing system, the laser processing head, or a component of the laser processing head. The model can be a digital twin of the laser processing system, the laser processing head, or a component of the laser processing head.

[0035] The model can be a mathematical and / or virtual model. The model can be a simulation model.

[0036] Determining a model temperature value may involve simulating the model temperature value. Determining a temperature at a location on the laser processing head using the model may involve simulating the temperature at the location on the laser processing head.

[0037] The model can be executed during a laser processing process. The simulation can be executed during a laser processing process. The at least one temperature sensor measures a temperature at the first location of the laser processing head. The measured temperature at the first location can be understood as a temperature measurement value. The temperature measurement value can be determined through the measurement.

[0038] The first location of the laser processing head can be a location on or at a component of the laser processing head. Preferably, the first location is located on or at an optical element of the laser processing head, on or at an aperture of the laser processing head, on or at a housing of the laser processing head, on or at a mount of an optical element of the laser processing head, on or at a drive of the laser processing head, on or at a motor of the laser processing head, on or at a control device of the laser processing head, on or at a fiber coupler of the laser processing head, on or at an input of a processing laser beam into the laser processing head, on or at an output of a processing laser beam from the laser processing head, or on or at a sensor of the laser processing head.

[0039] The optical element can be a lens, a diaphragm, or a protective glass. The optical element can be a lens group, a collimating lens, a collimating optic, a focusing lens, a focusing optic, a transmissive element, a reflective element, a beam splitter, a mirror, a beam-shaping element, and / or an optical wedge.

[0040] A coating can be provided at the first location. The coating can change the transmission properties and / or the absorption properties of a component of the laser processing head. In other words, the transmission properties and / or the absorption properties of a component provided with the coating can differ from the properties of the component without the coating. The coating can reduce the transmission and / or increase the absorption. The transmission and / or absorption can relate to the processing laser beam. Preferably, the coating causes a change in the transmission and / or the absorption of light at the wavelength of the processing laser beam. The first location can lie outside an optical path of a processing laser beam and / or an optical measuring beam.The first location may be spaced from an optical path of a processing laser beam and / or an optical measuring beam.

[0041] The first temperature is determined at the first location using the model. Specifically, the first temperature at the first location can be determined using the model and the measured temperature. The temperature value determined in this way can be understood as the model temperature value.

[0042] A second temperature can be determined at a second location on the laser processing head using the model. In particular, the second temperature at the second location can be determined using the model and the temperature measurement.

[0043] For the determination, at least one (current) process variable and / or at least one (current) operating variable of the laser processing process can be fed to the model. The at least one process variable or the at least one operating variable can be a temperature, a pressure, a volume flow, in particular a volume flow of a gas and / or a liquid, a velocity, in particular a velocity of a gas, a mass flow, in particular a mass flow of a gas and / or a liquid, a laser power, a (laser) wavelength, a beam parameter product, a position of a laser beam and / or a focus position of a laser beam. The liquid can be a cooling liquid, in particular cooling water.

[0044] The model can be fed with the current or existing control parameters, physical parameters of the processing laser beam, and / or material parameters for the determination. This allows model temperature values ​​to be determined at the locations where the at least one temperature sensor measures the temperature.

[0045] The at least one process variable or the at least one operating variable can be a determined, in particular a measured or calculated, variable. The at least one process variable or the at least one operating variable can be a variable specified or predetermined for the laser processing process. The determination of (at least a first and / or at least a second) at least one model temperature value can be a calculation or a table lookup. In particular, the determination is a simulation.

[0046] The measured temperature value is compared with the first model temperature value. A comparison value or temperature comparison value can be determined through this comparison. Preferably, the comparison is a difference calculation between the measured temperature value and the first model temperature value. The comparison can also be a ratio calculation of the measured temperature value with the first model temperature value.

[0047] Based on the comparison, an action is initiated and / or executed. Preferably, the action is initiated and / or executed based on the result of the comparison.

[0048] Alternatively, an action can be initiated and / or executed based on the first model temperature value and / or based on the second model temperature value. A prior comparison of temperature values, in particular a comparison of the measured temperature value with the first model temperature value, is possible but not mandatory.

[0049] If a comparison is planned, a threshold (or limit) can be provided for the comparison. The threshold can be a preset threshold or a variable threshold. The threshold can be an absolute value or a relative value. A relative threshold can be related to the temperature measurement.

[0050] If the comparison reveals that the threshold value for a difference or for a ratio of the measured temperature value to the first model temperature value has been exceeded, the action can be initiated and / or executed. Exceeding the threshold value can indicate or determine a malfunction of the laser processing system or a special event, e.g., splashing on an optical element. If the threshold value is not exceeded, this can indicate or determine normal operation. Based on the comparison of the measured temperature value with the first model temperature value and / or based on a temporal development of measured temperature values, an operating state of the laser processing system can be determined. This can be carried out, in particular, by the control device. Preferably, the operating state of the laser processing head is determined.Depending on the operating state thus determined, at least one operating parameter can be adjusted to the current state using a suitable controller, particularly before a threshold is exceeded at which the machine requires maintenance and / or parts replacement. The at least one operating parameter can be a cutting speed, laser power, beam centering, and / or a lens travel path. Adjusting multiple operating parameters is possible.

[0051] If a deviation is detected when comparing the model temperature with the measured temperature, the cause of the deviating temperatures can be output, particularly based on temperature fields or temperature values ​​stored in the model. For example, a deviation between the measured temperature value and the first model temperature value may be relatively small. This could indicate aging of a component of the laser processing head or slight contamination of an optical element. If the deviation between the measured temperature value and the first model temperature value is relatively large, this could indicate significant contamination of an optical element or a failure of a component of the laser processing head.

[0052] The temporal development of deviations between the measured temperature value and the first model temperature value can also be taken into account for determining an operating state of the laser processing system. For this purpose, a plurality of measured temperature values ​​and a plurality of first model temperature values ​​can be determined over a period of at least 10 s, preferably at least 1 min, more preferably at least 5 min, more preferably at least 30 min. The measured temperature values ​​and the first model temperature values ​​can be compared, wherein in particular temporally corresponding measured temperature values ​​and first model temperature values ​​are compared with one another. If a slight gradient in the course of the deviation between the measured temperature values ​​and the first model temperature values ​​is determined over the period (e.g. a slight increase in the deviation), this can indicate an aging process of a component of the laser processing head.If the deviation increases significantly or is very large, this may indicate severe contamination of an optical element.

[0053] Likewise, the temporal development of temperature measured values ​​can be taken into account when determining the operating state of the laser processing system. A plurality of temperature measured values ​​can be determined over a period of at least 10 s, preferably at least 1 min, more preferably at least 5 min, and even more preferably at least 30 min. The operating state can be determined based on the gradient of the temporal progression of the temperature measured values ​​(e.g., a rapid or slow increase in the temperature measured value).

[0054] Operating states can be stored or predefined for different values ​​or results of the comparison of the measured temperature value with the first model temperature value and / or for different values ​​or results of the temporal development of measured temperature values. The stored or predefined operating states can be stored in the control device.

[0055] The determined values ​​or results of the comparison of the measured temperature value with the first model temperature value and / or the determined values ​​or results of the temporal development of the measured temperature values ​​can be compared with the stored or predefined operating states. In particular, values ​​of the stored or predefined operating states can be compared with the determined values ​​of the comparison of the measured temperature value with the first model temperature value and / or the determined values ​​of the temporal development of the measured temperature values. If the values ​​match (within a tolerance), the operating state of the laser processing system can be estimated or determined based on the measured temperature values ​​and the model temperature values.

[0056] Preferably, the operating states (stored or predefined operating states) are based on at least one malfunction and / or a special event. When the operating state is determined, a malfunction and / or the special event can be identified.

[0057] An operating condition can include or represent at least one of the following scenarios (malfunction and / or special event): contamination of a component, contamination of an optical element, (structural) damage to a component, (structural) damage to an optical element, aging of a component, aging of an optical element, and / or aging of a coating. The contamination can be a deposit or splash. The optical element can be a lens or a protective glass.

[0058] An operating state can be a changed state, especially an expected changed state, of a component (e.g., an optical element) during normal operation. A temperature increase can occur due to normal changes to the component during normal operation (base material, coating) or due to events such as contamination, overheating, mechanical stress, etc.

[0059] Values, in particular temperature values, for the operating conditions can be determined, simulated and / or measured.

[0060] A second temperature can be determined, in particular simulated, at a second location on the laser processing head to determine a second model temperature value. This can be performed, in particular, by the control device. The temperature value at the second location can be referred to as the second model temperature value.

[0061] The temperature at the second location can be determined using the model.

[0062] The second location may be spaced from the first location. In particular, the second location is spaced from the first location by at least 5 mm, preferably at least 10 mm, more preferably at least 20 mm, more preferably at least 50 mm, more preferably at least 100 mm.

[0063] The second location may be spaced from the first location by at most 500 mm, preferably at most 250 mm, more preferably at most 100 mm, more preferably at most 50 mm, more preferably at most 10 mm.

[0064] The second location can be a location that is difficult or impossible to access for temperature measurement. No temperature can be measured at the second location. The second location can be located on an optical path of a processing laser beam and / or an optical measurement beam. The second location can be arranged at or on at least one optical element. The second temperature at the second location can be the temperature of the optical element.

[0065] The action can be initiated and / or executed (in addition to the comparison) based on the second model temperature value.

[0066] Preferably, the second location is located on or at a component of the laser processing head. The second location can be located on or at an optical element, in particular a center of the optical element.

[0067] A second temperature can be determined at a plurality of second locations in order to obtain a plurality of second model temperature values.

[0068] The second temperature at the second location of the laser processing head can be determined based on the temperature measurement. This can be done by the control device.

[0069] Preferably, the second temperature at the second location of the laser processing head is determined based on the comparison of the measured temperature value with the first model temperature value. More preferably, the second temperature at the second location of the laser processing head is determined based on the result of the comparison of the measured temperature value with the first model temperature value.

[0070] By using a temperature measurement from a location on the laser processing head accessible to a temperature sensor to determine a model temperature value at a location on the laser processing head that is difficult or impossible to access for a temperature sensor, the result of a determination can be improved. The temperature at the second location on the laser processing head can be determined based on one or the operating state of the laser processing system. This can be performed by the control device.

[0071] The operating state can include or depict a malfunction and / or a special event of the laser processing system. The operating state, for example with the scenarios described above, can be determined based on the measured temperature value or based on the comparison of the measured temperature value with the first model temperature value. The operating state determined in this way can influence the determination of the temperature at the second location. In particular, the operating state can be included in the determination of the temperature at the second location. If, for example, an operating state with contamination on a protective glass was determined, the temperature at the second location (e.g. at the center of the protective glass) can be significantly higher than would be the case during normal operation.This ensures that the correct temperature is determined at critical positions that are difficult to access by measuring, as the model does not falsely assume ideal (normal) operating conditions.

[0072] A / the laser processing process can be regulated or controlled based on at least one of the following: the measured temperature value, the first model temperature value, the second model temperature value, and the comparison of the measured temperature value with the first model temperature value. The action can be initiated and / or performed based on the measured temperature value, the first model temperature value, the second model temperature value, and / or the comparison of the measured temperature value with the first model temperature value. Aging of at least one component of the laser processing system can be estimated or determined based on the measured temperature value, the first model temperature value, the second model temperature value, and / or the comparison of the measured temperature value with the first model temperature value.

[0073] In principle, any measurement signal can be integrated into a control loop. For example, the focus position (i.e., a laser head parameter) can be adjusted by a certain amount based on a temperature value (temperature measurement, first model temperature value, and / or second model temperature value), or the cutting / welding parameters can be adapted. Thus, contamination, wear, aging, etc., can lead to a change in the optical or thermal properties before failure, which can be counteracted appropriately, for example, to maintain the system's optimal operating point before failure for as long as possible.

[0074] Preferably, the laser processing process is regulated or controlled based on the second model temperature value if the comparison of the temperature measurement value with the first model temperature value shows that a deviation between the temperature measurement value and the first model temperature value is below the threshold value or at most at the threshold value.

[0075] The regulation or control of the laser processing process can include, based on the temperature measurement value, the first model temperature value, the second model temperature value and / or the comparison of the temperature measurement value with the first model temperature value: regulation or control of a focus position, regulation or control of a cutting or feed speed of the laser processing head, regulation or control of a laser power, regulation or control of a beam centering, regulation or control of an adjustment and / or regulation or control of a tilt.

[0076] The adjustment can be an adjustment of a fiber coupler of the laser processing head for coupling the laser beam and / or an adjustment of an optical element of the laser processing head. The tilting can be a tilting of a fiber coupler of the laser processing head for coupling the laser beam and / or a tilting of an optical element of the laser processing head.

[0077] At several initial locations, a respective temperature measurement value can be compared with a respective model temperature value. Based on these multiple comparisons, an operating state of the laser processing head or laser processing system can be determined. For example, a temperature asymmetry can be determined using these multiple comparisons.

[0078] A wear condition and / or a remaining service life and / or an aging of at least one component of the laser processing system can be determined based on the comparison of the measured temperature value with the first model temperature value. Alternatively or additionally, a wear condition and / or a remaining service life and / or an aging of at least one component of the laser processing system can be determined based on a temporal development of measured temperature values. Alternatively or additionally, a wear condition and / or a remaining service life and / or an aging of at least one component of the laser processing system can be determined using the model. This can be carried out by the control device.

[0079] The aging can be thermal material aging.

[0080] If a deviation between the temperature measurement value and the first model temperature value exceeds a threshold, it can be determined that the remaining service life of a component of the laser processing head is low and / or the wear condition is advanced and / or the aging is advanced.

[0081] If the gradient of the temperature readings over time exceeds a threshold, it can be determined that the remaining service life of a component of the laser processing head is low and / or that the wear and tear is advanced and / or that the aging process is advanced. A user can be prompted to replace the component.

[0082] The wear condition and / or remaining service life and / or aging of the at least one component can be determined using the model. One or more temperature measurements can be incorporated into the model for the determination. Material aging due to thermal influences can be determined using the model. In particular, the model includes a model for material aging due to thermal influences. This allows the remaining service life of a component to be predicted.

[0083] Based on the wear condition and / or remaining service life and / or aging of the at least one component, a user, in particular operating personnel, can be reminded to replace the component in a timely manner. The component can be an optic, an optical element, or a diaphragm. In particular, the component is a coating of an optic, a coating of an optical element, or a coating of a diaphragm.

[0084] The wear condition and / or remaining service life and / or aging can be determined for a variety of components of the laser processing head. The model allows temperatures to be determined at a variety of locations on components. The components can be subject to thermal material aging, particularly in critical areas. The model temperature values ​​can be stored over time.

[0085] The model can be adapted and / or created using a machine learning algorithm. To adapt and / or create the model, data from multiple temperature measurements by the temperature sensor and / or multiple determinations of the operating state of the laser processing system and / or multiple determinations of the temperature at the second location of the laser processing head and / or multiple determinations of the wear state, the remaining service life, and / or the aging of at least one component of the laser processing system can be processed by the machine learning algorithm.

[0086] The machine learning algorithm can be based on or be an algorithm of supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning.

[0087] Over an extended period, a collection of data on the occurrence of damage events and aging phenomena, the duration until the respective event occurs, and / or the associated temperature fields over time can be collected. This data can be stored in the model. This data can be collected, in particular, for a large number of laser processing heads of the same type and then consolidated and stored on an (external) processing unit.

[0088] The data collection can be used to develop models for thermal material aging and / or damage occurrence using a machine learning algorithm, or to improve existing models, which can then be subsequently implemented in the model.

[0089] Based on the comparison of the temperature measurement value with the first model temperature value, an action can be initiated and / or performed.

[0090] In general, the action can be a control or regulation of a laser processing process, a change in the power of the processing laser beam, a change in the focus position of the processing laser beam, a termination of the laser processing process and / or an output of a message, in particular an error message and / or a request to a user.

[0091] For example, the action can be the output of a message. The message can be a warning message. The message can be directed to a user or operator. The message can prompt the user or operator to perform an action, for example, replacing a component of the laser processing head and / or interrupting a laser processing process. The message can be an error message, in particular an error message with the cause.

[0092] The action can be controlling the laser processing process. For example, the power of the processing laser can be reduced or increased. The laser processing process can also be interrupted or terminated. In particular, an emergency shutdown can be performed.

[0093] The action can be a user request, for example, through a notification or message to the user. The request can include or be an instruction to replace a component of the laser processing head. This can be used to remind the operating personnel, in particular, to replace the component in a timely manner (“predictive maintenance”).

[0094] The model may include or be a reduced-order model. In particular, the model includes at least one lookup table or a system model. A system model can describe a technical system based on lumped elements (without spatial extension) and ordinary differential equations.

[0095] The model may contain or be a multidimensional lookup table. The multidimensional lookup table may contain one dimension for each parameter of the parameter matrix, one dimension for time, and / or the temperature field associated with each combination of the aforementioned parameters at spatial resolution.

[0096] The model may contain or be a system model. The system model may be a system model of the thermal behavior of the laser processing head and / or at least one component of the laser processing head.

[0097] In particular, the model may include a combination of a multidimensional lookup table and a system model or consist of the combination.

[0098] The model can be implemented and executed on an external processing unit. The external processing unit can be a server. The server can be spaced apart from the laser processing head. The server can be part of the control device.

[0099] The model can be implemented or stored as embedded code on the control device. The control device can be the control device of the laser processing head. The model can be executed in the control device.

[0100] The determination of the first temperature at the first location of the laser processing head and / or the determination of the second temperature at the second location of the laser processing head can be performed in less than 10 s, more preferably in less than 1 s, more preferably in less than 100 ms, more preferably in less than 50 ms, more preferably in less than 10 ms. The determination can be performed in real time.

[0101] The model can be executed in less than 10 s, more preferably in less than 1 s, more preferably in less than 100 ms, more preferably in less than 50 ms, more preferably in less than 10 ms. The model can be executed in real time. The laser processing head can comprise at least one housing and at least one optical element, in particular a lens, a diaphragm, or a protective glass. The laser processing head can have at least one design property of the distance from the end of the laser fiber or from the connection of the laser fiber to the at least one optical element. The laser processing head can further comprise a connection for a laser fiber, e.g., a fiber coupler.

[0102] Brief description of the drawings

[0103] The invention is described in detail below with reference to figures.

[0104] Fig. 1 shows a laser processing system 500;

[0105] Fig. 2 shows steps of a method;

[0106] Fig. 3 shows steps of a method;

[0107] Fig. 4 shows steps of a method;

[0108] Fig. 5 shows steps of a method; and

[0109] Fig. 6 shows steps of a method.

[0110] Detailed description of the drawings

[0111] The laser processing system 500 shown in Fig. 1 includes a laser processing head 100 and a control device 300. The laser processing system 500 may include a laser source 200.

[0112] The laser source 200 can generate a processing laser beam L (laser beam). The laser source 200 can be configured as a single-mode laser, a solid-state laser, or a fiber laser.

[0113] The processing laser beam L generated by the laser source 200 can be transmitted from the laser source 200 to the laser processing head 100 via an optical fiber. The processing laser beam L can be coupled into the laser processing head 100 via a fiber coupler 140. The fiber coupler 140 can be arranged on a housing 110 of the laser processing head 100.

[0114] The laser processing head 100 may include collimation optics 121 (collimating optics). The collimation optics 121 may be arranged and configured in the laser processing head 100 such that the processing laser beam L entering the laser processing head 100 divergently is collimated. The collimation optics 121 may be arranged in the housing 110 of the laser processing head 100.

[0115] The collimation optics 121 can comprise at least one lens or two or more lenses. The distance between the two or more lenses can be adjustable, in particular by an electric motor. The collimation optics 121 can define an optical axis.

[0116] The laser processing head 100 can include at least one aperture 125. The aperture 125 can be arranged between the fiber coupler 140 and the collimation optics 121. The aperture 125 can shape the processing laser beam L so that it strikes the collimation optics 121 with a defined diameter. The diameter of the processing laser beam L can therefore be shaped or defined by the aperture 125. The aperture 125 can be provided with a coating. An aperture angle can be predetermined by the aperture 125. A defined diameter can be present or formed on the collimation optics by the aperture angle and a distance between the aperture 125 and the collimation optics 121.

[0117] Furthermore, the laser processing head 100 can include focusing optics 122. The focusing optics 122 can be arranged and configured in the laser processing head 100 such that the collimated processing laser beam L is focused. The focusing optics 122 can be arranged in the housing 110 of the laser processing head 100.

[0118] The focusing optics 122 can comprise at least one lens or two or more lenses. The distance between the two or more lenses can be adjustable, in particular by an electric motor. An optical axis can be defined by the focusing optics 122. The focusing optics 131 can be an F-theta lens. The F-theta lens can be arranged telecentrically.

[0119] The focused processing laser beam L can be emitted from the laser processing head 100 and irradiated onto a workpiece W to process the workpiece W. Preferably, the housing 110 includes a nozzle 171 from which the processing laser beam L is emitted.

[0120] For example, the workpiece W can be welded. Two workpieces W can be welded together, or a component can be welded to the workpiece W. Likewise, the workpiece W can be cut, engraved, or hardened.

[0121] The laser processing head 100 may be a laser welding head, a laser cutting head, a laser engraving head, a laser hardening head, or a laser cladding head.

[0122] The laser processing head 100 can include a protective glass 123. The protective glass 123 can be arranged at one end of the housing 110. In particular, the protective glass 123 is replaceable. The protective glass 123 can protect an interior of the laser processing head 100 against contaminants, particles, smoke, fumes, splashes, etc. The processing laser beam L can exit the laser processing head 100 through the protective glass 123, in particular to be irradiated onto the workpiece W.

[0123] Furthermore, the laser processing head 100 may comprise a lens, a transmissive element, a reflective element, a radiation shaping element, a beam splitter and / or an optical wedge.

[0124] A collimating optic 121, a focusing optic 131, a protective glass 123, an aperture 125, a beam splitter, a lens, a transmissive element, a reflective element, a beam shaping element, and an optical wedge can each be referred to as an optical element. Optical elements of the laser processing head 100 can define an optical path for the processing laser beam L through the laser processing head 100.

[0125] The laser processing head 100 includes a temperature sensor 130. The temperature sensor 130 can be arranged at least partially, in particular completely, in the housing 110 of the laser processing head 100. The temperature sensor 130 can be configured to measure a temperature at a location on the laser processing head 100.

[0126] The temperature sensor 130 can measure the temperature at the location either by contact or contactless means. For example, a sensor element of the temperature sensor 130 can contact the location. Likewise, the temperature sensor 130 can receive electromagnetic radiation from the location. The temperature sensor 130 can be an optical sensor.

[0127] The control device 300 can control the operation of the laser processing head 100. In particular, the control device 300 can control the laser power and / or the position and / or attitude of at least one optical element.

[0128] The control device 300 can be arranged entirely on the laser processing head 100. Alternatively, at least a portion of the control device 300 can be spaced apart from the laser processing head 100.

[0129] The control device 300 can comprise a model. The model can be a model for monitoring a laser processing process, a model of the laser processing head 100, or a model of one or more components of the laser processing head 100. A component of the laser processing head 100 can be an optical element or a diaphragm. The component is preferably provided with a coating that changes the transmission properties and / or the absorption properties of the components with respect to the processing laser beam. Using the model, in particular by the control device 300, a temperature at a location on the laser processing head 100 can be determined, in particular simulated. The determination can take place in real time. Fig. 2 schematically shows steps of a method. The method is in particular a method for creating the model. The model can be a reduced-order model and / or a digital twin.The control unit illustrated in the figure may be the control device 300. The term "temperature sensors" mentioned in the figure may refer to the temperature sensor 130. Multiple temperature sensors are optional.

[0130] The processing laser can have at least the physical property beam parameter product and / or wavelength.

[0131] The at least one optical element can have at least one, several, or all of the following material properties: thermal conductivity, specific heat capacity, density, transmittance, and absorptivity. Each of the at least one optical element can be provided with a coating. The coating can have at least one, several, or all of the following material properties: thermal conductivity, specific heat capacity, density, transmittance, and absorptivity.

[0132] The laser processing head can include a control device. The control device can be a computing unit. The control can be achieved by CNC (Computerized Numerical Control).

[0133] The control device can specify at least the control parameters laser power and / or position of at least one optical element within the laser processing head.

[0134] The temperature sensor can be arranged in spatial proximity to the at least one optical element. The temperature sensor can be arranged or attached to a component of the laser processing head adjacent to the optical element, for example, on a holder of the optical element or on an adjacent housing area.

[0135] The creation of the model is shown below. None of the steps are mandatory. The model can be a digital twin of the laser processing head or a component of the laser processing head, which, for example, virtually simulates the thermal behavior of the laser processing head or its components. • Creating a model, in particular a simulation model, of the laser processing head or components thereof with spatial and / or temporal resolution. This can in particular be a method in which the problem area is spatially resolved using a grid and in which partial, nonlinear differential equations are solved using numerical approximation methods. This can in particular be a simulation using the finite volume method or the finite element method.

[0136] • Validation of the model with measurement data from at least one temperature sensor.

[0137] • Creating a parameter matrix containing: the at least one structural property of the laser processing head, the distance from the entry point of the laser beam into the laser processing head to at least one optical element, the at least two physical properties of the beam parameter product and the wavelength of the processing laser, the material properties of the optical element, thermal conductivity, specific heat capacity, density, transmittance, and absorptivity, as well as a plurality of gradations of the control parameters, laser power and position of the optical element within the laser processing head. The gradations of the control parameters can be understood as different values.

[0138] • To create the model, the parameter matrix can be supplemented with material properties and control parameters that occur under foreseeable, special operating conditions. These special operating conditions can include, in particular, surface contamination and / or material aging.

[0139] • At least one simulation of the thermal behavior of the laser processing head or its components for each parameter combination from the parameter matrix.

[0140] • Creation of a reduced-order virtual model from the simulation results. This is an algorithm that can determine the temperature at a variety of positions on the laser processing head or its components from the simulation results and the associated control parameters during operation, particularly in real time.

[0141] • The reduced-order model can be validated using the sensor data from at least one temperature sensor to increase its accuracy.

[0142] • The accuracy of the reduced-order model can be further improved by a machine learning algorithm. This allows the model to be created. In particular, the model in this

[0143] In this case, a reduced-order model. Other models can also be used.

[0144] Fig. 3 schematically shows steps of a method. The control device 300 can be configured to carry out the steps of the method.

[0145] The method comprises measuring a temperature 1000. The temperature can be measured by the temperature sensor 130 at at least one first location of the laser processing head 100. The temperature can be measured at a plurality of first locations of the laser processing head 100, for example, by (exactly or at most) one temperature sensor 130 or by one temperature sensor 130 per first location of the laser processing head 100.

[0146] The first location of the laser processing head 100 can be a location on or at a component of the laser processing head 100. Preferably, the first location is located on or at an optical element of the laser processing head 100, on or at an aperture of the laser processing head 100, on or at a housing of the laser processing head 100, on or at a holder of an optical element of the laser processing head 100, on or at a drive of the laser processing head 100, on or at a motor of the laser processing head 100, on or at a control device of the laser processing head 100, on or at a fiber coupler of the laser processing head 100, on or at an input of a processing laser beam into the laser processing head 100, on or at an output of a processing laser beam from the laser processing head 100, or on or at a sensor of the laser processing head 100.

[0147] The method comprises determining, in particular simulating, at least one temperature 1010, in particular a first temperature, at a first location on the laser processing head 100. The temperature can be determined at the first location on the laser processing head 100. Preferably, the first location at which the temperature is determined is the same as the first location at which the temperature is measured. Accordingly, for the first location, a temperature measurement value (measured temperature) and a first model temperature value (determined or simulated temperature) can be present simultaneously, for example, within a period of at most 10 s, more preferably at most 1 s, more preferably at most 100 ms, more preferably at most 50 ms, more preferably at most 10 ms. This can be carried out or be present at any first location on the laser processing head 100.

[0148] The first location may be spaced apart from an optical path of the processing laser beam. The first location may not be located on an optical path of the processing laser beam.

[0149] Determining at least one temperature 1010 may also include determining a second temperature at a second location. The second location may be spaced apart from the first location. No temperature measurement may be performed at the second location. The second location may be located on an optical path of the processing laser beam.

[0150] The measured temperature at the first location of the laser processing head 100 can be used to determine the second temperature at the second location of the laser processing head 100. In particular, the measured temperature at the first location of the laser processing head 100 can be fed into a model to determine the second temperature at the second location. The second temperature at the second location of the laser processing head 100 can be determined based on the measured temperature at the first location of the laser processing head 100.

[0151] Determining the temperature 1010 can be performed using a model. In particular, the model is a model for monitoring a laser processing process and / or a model of the laser processing head 100 and / or a model of one or more components of the laser processing head 100. The model can be a reduced-order model. The model can be stored or stored in the control device 300. Thus, the method can include regulating or controlling the laser processing system based on the determined second model temperature.

[0152] For determining, in particular simulating, the temperature 1010, (current) operating parameters, operating variables, and / or process variables can be used. In particular, the (current) operating parameters, operating variables, and / or process variables can be fed to the model as input. Using the model and the (current) operating parameters, operating variables, and / or process variables, the temperature can be output at the first location. The operating parameters, operating variables, and / or process variables can, in particular, comprise: a beam parameter product of the processing laser and / or a wavelength of the processing laser.

[0153] The method may include comparing 1020 the measured temperature value with the first model temperature value. For this purpose, a difference between the measured temperature values ​​and the determined temperature value may be calculated. Likewise, a ratio between the measured temperature values ​​and the determined temperature value may be calculated. By comparing 1020 the measured temperature value with the first model temperature value, a deviation may be determined.

[0154] The method may include checking 1030 the comparison of the measured temperature value with the first model temperature value. In particular, it may be checked whether a deviation between the measured temperature value and the first model temperature value exceeds a threshold value.

[0155] The threshold can be a predefined value. It can also be a variable value, which can be set by a user, for example. The threshold can be an absolute value or a relative value.

[0156] The method may include initiating and / or performing an action 1050. In particular, the action may be initiated and / or performed when a deviation between the measured temperature value and the first model temperature value exceeds the threshold.

[0157] The action can be controlling a laser processing process, terminating the laser processing process, and / or outputting a message, in particular an error message and / or a request to a user. The action can be a warning message, in particular a warning message to a user, and / or an emergency shutdown, in particular an emergency shutdown of the laser processing head 100 or the laser processing system 500. The measured temperature can be understood as an actual temperature at the first location of the laser processing head 100, and the determined temperature can be understood as a target temperature at the first location. The model can represent or correspond to normal operation. The determined temperature can be understood as a temperature below normal operation. If a deviation between the actual temperature and the target temperature at the first location is detected, it can be determined that normal operation is not occurring.Based on this, an action can be initiated and / or carried out.

[0158] The first location of the laser processing head 100 can be a location that is easily accessible for a temperature sensor. The second location of the laser processing head 100 can be a location that is not (easily) accessible for a temperature sensor. A target-actual temperature comparison can be performed at the first location. This information can be used to more accurately determine the temperature at the second location. The second location can be a critical location of the laser processing head 100. A higher thermal load can be present or expected at the critical location than at the first location.

[0159] Fig. 4 schematically shows steps of a method. The control device 300 can be configured to carry out the steps of the method.

[0160] Steps 1000, 1010, 1020, 1030 and / or 1050 may be the same or similar to steps 1000, 1010, 1020, 1030 and / or 1050 described with respect to Fig. 3.

[0161] The method may comprise measuring a temperature 1000 at a first location. Furthermore, the method may comprise determining, in particular simulating, a temperature 1010, in particular a first temperature at a first location of the laser processing head 100 and a second temperature at a second location of the laser processing head 100. The method may comprise comparing 1020 the measured temperature value with the first model temperature value. The method may comprise checking 1030 the comparison of the measured temperature value with the first model temperature value. Furthermore, the method may comprise analyzing the threshold value exceeded 1040. Based on the comparison of the measured temperature value with the first model temperature value and / or based on a temporal development of measured temperature values, an operating state of the laser processing system can be determined.

[0162] In particular, if an exceedance of the threshold value has been detected, the threshold value violation can be analyzed. If an exceedance of the threshold value has been detected, a plurality of temperature measurement values ​​can be analyzed. The plurality of temperature measurement values ​​can be consecutive temperature measurement values. At least 10, preferably at least 50, more preferably at least 100 temperature measurement values ​​can be considered. The temperature measurement values ​​can be considered over a period of at least 10 s.

[0163] Alternatively or additionally, the comparison of the temperature measurement value with the first model temperature value, in particular a result and / or a deviation of the comparison of the temperature measurement value with the first model temperature value, can be analyzed.

[0164] A plurality of operating states can be predetermined; in particular, the plurality of operating states can be stored or stored in a memory, in particular a memory of the control device.

[0165] Each of the operating states can be related to or correspond to a threshold violation type. The threshold violation type can be linked to a respective operating state. By analyzing the threshold violation, the threshold violation type can be determined. An operating state can be determined by comparing the threshold violation type with threshold violation types linked to the operating states. A threshold violation type can be a size and / or height of the threshold violation.

[0166] The operating state can be any operating state disclosed herein. In particular, the operating state is contamination of a component of the laser processing head, contamination of a coating, in particular a coating of a component of the laser processing head, material aging of a component of the laser processing head, and / or material aging of a coating of a component of the laser processing head.

[0167] Likewise, a temporal development of the temperature measured values ​​can be analyzed to determine an operating state. Each of the operating states can be related to or correspond to a development of the temperature measured values. The development of the temperature measured values ​​can be linked to a respective operating state. By analyzing the development of the temperature measured values ​​with developments of the temperature measured values ​​that are linked to the operating states, an operating state can be determined. A development of the temperature measured values ​​can be a gradient of the temporal course of the temperature measured values.

[0168] The second temperature at the second location of the laser processing head 100 can be determined based on the determined operating state. The determined operating state can be used as input for determining the second temperature at the second location.

[0169] The method may include a machine learning algorithm. The machine learning algorithm may be any machine learning algorithm disclosed herein.

[0170] In general, a machine learning algorithm can be used to create, improve, modify, and / or train the model. Training can be performed after its creation. Training can be performed in addition to its creation.

[0171] The machine learning algorithm can be provided with data and / or results of the temperature measurements, the first model temperature values, the second model temperature values, the comparison of the temperature measurements with the first model temperature values, the verification of the comparison of the temperature measurements with the first model temperature value, the analysis of the threshold violation, and / or the initiation and / or execution of an action. This data and / or results can be processed by the machine learning algorithm.The results and / or an output of the machine learning algorithm can influence or be used to measure the temperature at the first location of the laser processing head, determine the first temperature at the first location of the laser processing head, determine the second temperature at the second location of the laser processing head, compare the measured temperature value with the first model temperature value, verify the comparison of the measured temperature value with the first model temperature value, analyze the threshold violation, and / or initiate and / or execute an action. In particular, the results and / or an output of the machine learning algorithm are used to create, improve, modify, and / or train the model.

[0172] Fig. 5 schematically shows steps of a method. The control device 300 can be configured to perform the steps of the method. The features shown in Fig. 5 and described with reference to Fig. 5 can be used in any method disclosed herein.

[0173] The method may include predictive maintenance 1070. In particular, a wear condition and / or a remaining service life and / or aging of at least one component of the laser processing system may be determined based on the comparison of the temperature measurement value with the first model temperature value and / or based on a temporal development of temperature measurement values.

[0174] For this purpose, over a longer operating period, in particular at least one week, at least one month or at least one year, a collection of data on the occurrence of damage events and / or signs of aging, the duration until the respective event occurs, the respectively assigned temperature fields over time can be collected, and the respectively assigned temperature measurements and / or the respectively assigned model temperature values ​​can be created. This data can be stored in the model. In particular, the data can be saved as part of a lookup table or a system model within the reduced-order model. This data can be collected, in particular for a large number of laser processing heads of the same type, combined on an external processing unit and / or saved.Preferably, temperature measurements, first model temperature values, second model temperature values, and / or comparisons of temperature measurements with first model temperature values ​​are used or employed for predictive maintenance. The values ​​can be collected and evaluated over a period of at least one week, at least one month, or at least one year. Based on the values, an estimate of the wear condition and / or remaining service life and / or aging of at least one component of the laser processing system can be made. If the end of the service life of a component of the laser processing head or laser processing system is imminent, a user can be prompted to replace or service the component. The service life of a component can be viewed as the maximum period of use before the component can no longer (sufficiently) fulfill its function.During its lifetime, the component can (sufficiently) fulfill its function.

[0175] The data and / or values ​​can be used to create, improve, modify, and / or train the model using a machine learning algorithm 1060. In particular, the model can include a prediction of thermal material aging and / or the occurrence of damage events.

[0176] Fig. 6 schematically shows steps of a method. The control device 300 can be configured to carry out the steps of the method.

[0177] The method includes measuring a temperature 1000. The temperature can be measured by the temperature sensor 130 at at least a first location on the laser processing head 100. By measuring the temperature, a temperature measurement value can be determined.

[0178] Using the model and the temperature measurement value, a first temperature at the first location of the laser processing head 100 can be determined. This allows a first model temperature value to be determined. Alternatively or additionally, using the model and the temperature value, a second temperature at a second location of the laser processing head 100 can be determined. This allows a second model temperature value to be determined. Based on the first model temperature value and / or the second model temperature value, an action can be initiated and / or performed. The previous disclosure applies analogously to the embodiment of Fig. 6.

[0179] According to the present disclosure, a laser processing system is provided that includes a virtual model of the laser processing system or a component thereof for outputting temperatures in real time during the ongoing process, which the model determines from sensor data and / or control parameters. Such continuous monitoring of temperatures at locations that are difficult to access during the process enables timely control or emergency shutdown, as well as for evaluating the thermal stress on components over time with the goal of predictive maintenance.

Claims

Patent claims 1. A laser processing system (500) comprising: a laser processing head (100) having at least one temperature sensor (130), and a control device (300) having a model; wherein the temperature sensor (130) is configured to measure a temperature at a first location of the laser processing head (100) to determine a temperature measurement value; and wherein the control device (300) is configured: - determining a first temperature at the first location of the laser processing head (100) using the model to determine a first model temperature value, - compare the temperature measurement with the first model temperature value, and - to initiate and / or perform an action based on the comparison.

2. Laser processing system according to claim 1, wherein the control device (300) is configured to determine an operating state of the laser processing system (500) based on the comparison of the temperature measurement value with the first model temperature value and / or based on a temporal development of temperature measurement values.

3. Laser processing system according to one of the preceding claims, wherein the control device (300) is configured to determine a second temperature at a second location of the laser processing head (100) in order to determine a second model temperature value.

4. The laser processing system according to claim 3, wherein the control device (300) is configured to determine the second temperature at the second location of the laser processing head (100) based on the temperature measurement value.

5. Laser processing system (500) comprising: a laser processing head (100) with at least one temperature sensor (130), and a control device (300) with a model; wherein the temperature sensor (130) is configured to measure a temperature at a first location of the laser processing head (100) to determine a temperature measurement value; and wherein the control device (300) is configured: - to determine a second temperature at a second location of the laser processing head (100) using the model and the temperature measurement value to determine a second model temperature value, and - to initiate and / or perform an action based on the second model temperature value.

6. Laser processing system according to one of claims 3 to 5, wherein the control device (300) is configured to determine the second temperature at the second location of the laser processing head (100) based on an operating state of the laser processing system.

7. The laser processing system according to one of claims 3 to 6, wherein the control device (300) is configured to: regulate or control a laser processing process based on the temperature measurement value, the first model temperature value, the second model temperature value, and / or the comparison of the temperature measurement value with the first model temperature value; to initiate and / or perform the action based on the temperature measurement value, the first model temperature value, the second model temperature value, and / or the comparison of the temperature measurement value with the first model temperature value; and / or to estimate aging of at least one component of the laser processing system based on the temperature measurement value, the first model temperature value, the second model temperature value, and / or the comparison of the temperature measurement value with the first model temperature value.

8. Laser processing system according to claim 7, wherein the regulation or control of the laser processing process based on the temperature measurement value, the first model temperature value, the second model temperature value and / or the comparison of the temperature measurement value with the first model temperature value comprises: regulation or control of a focus position, regulation or control of a cutting or feed speed of the laser processing head, regulation or control of a laser power, regulation or control of a beam centering, regulation or control of an adjustment and / or regulation or control of a tilt.

9. Laser processing system according to one of the preceding claims, wherein the control device (300) is configured to determine a wear condition and / or a remaining service life and / or an aging of at least one component of the laser processing system based on the comparison of the temperature measurement value with the first model temperature value and / or based on a temporal development of temperature measurement values.

10. Laser processing system according to one of the preceding claims, wherein the model is adapted and / or created using a machine learning algorithm, wherein for the adaptation and / or creation of the model, data from a plurality of temperature measurements by the temperature sensor (130) and / or a plurality of determinations of the operating state of the laser processing system and / or a plurality of determinations of the temperature at the second location of the laser processing head (100) and / or a plurality of determinations of the wear state, the remaining service life and / or the aging of the at least one component of the laser processing system were processed by the machine learning algorithm.

11. Laser processing system according to one of the preceding claims, wherein the action comprises controlling a laser processing process, terminating a laser processing process and / or outputting a message, in particular an error message and / or a request to a user.

12. Laser processing system according to one of the preceding claims, wherein the model comprises or is a reduced-order model, in particular wherein the model comprises at least one lookup table or a system model.

13. A method for operating a laser processing system (500), the method comprising the steps: - measuring a temperature at a first location of the laser processing head (100) to determine a temperature measurement value; - determining a first temperature at the first location of the laser processing head (100) using a model to determine a first model temperature value; - comparing the temperature measurement value with the first model temperature value; and - Initiate and / or perform an action based on the comparison.

14. The method according to claim 13, wherein the method further comprises: determining an operating state of the laser processing system (500) based on the comparison of the temperature measurement value with the first model temperature value and / or based on a temporal development of temperature measurement values.

15. The method of claim 13 or 14, wherein the method further comprises: determining a second temperature at a second location of the laser processing head (100) to determine a second model temperature value.

16. A method for operating a laser processing system (500), the method comprising the steps: - measuring a temperature at a first location of the laser processing head (100) to determine a temperature measurement value; - determining a second temperature at a second location of the laser processing head (100) using the model and the temperature measurement value to determine a second model temperature value; and - Initiate and / or perform an action based on the second model temperature value.

17. The method according to any one of claims 13 to 16, wherein the method further comprises: determining a wear condition and / or a remaining service life and / or an aging of at least one component of the laser processing system based on the comparison of the temperature measurement value with the first model temperature value and / or based on a temporal development of temperature measurement values.

18. A computer program product comprising instructions that cause a laser processing system to carry out the method according to any one of claims 13 to 17.

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