Camera modules including encapsulated meta optics

Abstract

The disclosure describes apparatus including a camera module that includes an optical stack attached over an image sensor In an example, at least a portion of the optical stack having no air gaps includes an aperture stop and a first substrate having an encapsulated meta-optic element (MOE) thereon. Methods of manufacturing camera modules also are disclosed.

Description

CAMERA MODULES INCLUDING ENCAPSULATED META OPTICSFIELD OF THE DISCLOSURE

[0001] The present disclosure relates to camera modules that include encapsulated meta optics.BACKGROUND

[0002] In many camera modules, multiple refractive lenses are stacked together, for example in a lens barrel or using wafer level optics. Refractive systems, however, include a change in refractive index between different optical surfaces. At each interface with changing refractive index, undesirable reflections can occur and anti-reflective coatings may need to be added at all or some of the interfaces.SUMMARY

[0003] The present disclosure describes camera modules that include encapsulated meta optics.

[0004] For example, in one aspect, the present disclosure describes an apparatus that includes a camera module. The camera module includes an optical stack attached directly or indirectly over an image sensor. At least a portion of the optical stack includes an aperture stop and a first substrate having an encapsulated meta-optic element (MOE) thereon. The portion of the optical stack has no air gaps.

[0005] Some implementations include one or more of the following features. For example, in some implementations, the MOE is encapsulated by an optically transparent glass or polymer. In some implementations, the MOE is encapsulated by a material that is optically index matched to the first substrate. In some implementations, the MOE is encapsulated by bonding glue.

[0006] In some implementations, the apparatus is configured such that light entering the camera module does not encounter internal interfaces having a high refractive index contrast. In some implementations, at least some neighboring elements and / or layers of the optical stack (i.e., elements and / or layers that are adjacent to one another) are substantially index matched to one another.

[0007] In some implementations, the aperture stop is provided on a surface of the first substrate. In some implementations, the portion of the optical stack further includes a second substrate, and the aperture stop is provided on a surface of the second substrate.

[0008] In some implementations, the portion of the optical stack includes a second substrate having an encapsulated MOE thereon. In some implementations, the portion of the optical stack includes a third substrate disposed between the first and second substrates, and the aperture stop is provided on a surface of the third substrate.

[0009] In some implementations, the portion of the optical stack includes at least one of a band pass filter or an angle-of-incidence filter. In some implementations, the portion of the optical stack includes an optically transparent spacer.

[0010] In some implementations, edge blackening is included on sidewalls of the camera module.

[0011] In some implementations, there is a second aperture on a surface of the optical stack, wherein the second aperture is defined by a layer of black chrome or black resist.

[0012] In some implementations, the camera module includes a cover glass disposed over the image sensor, wherein the optical stack is attached with index matched adhesive to the cover glass. In some implementations, the MOE has the same rectangular aspect ratio as the image sensor. In some implementations, the camera module is attached to an optically transparent glass support. In some implementations, the optically transparentglass support forms part of a windshield, a rearview mirror, an eyeglass, an augmented reality (AR) headset, a virtual reality (VR) headset, or a mixed reality (MR) headset.

[0013] The present disclosure also describes an apparatus that includes a camera module including an image sensor, and an optical stack attached over the image sensor. At least a portion of the optical stack includes an aperture stop, and a first substrate having an encapsulated meta-optic element (MOE) thereon. The portion of the optical stack has no air gaps other than voids between adjacent meta-atoms of the MOE.

[0014] The present disclosure also describes a method of manufacturing camera modules. The method includes forming a wafer-level optical stack, wherein at least a portion of the optical stack having no air gaps includes an aperture stop and a first substrate having an encapsulated meta-optic element (MOE) thereon. The wafer-level optical stack is singulated into individual modules, and at least one of the modules is attached over an image sensor.

[0015] In some implementations, the method included providing edge blackening to sidewalls for the modules, wherein the edge blackening material includes a black resist, a black epoxy, or other black polymer. In some implementations, providing edge blackening includes dicing partially through the wafer-level optical stack to form grooves, and filling the grooves with an edge blackening material.

[0016] Some implementations include one or more of the following advantages. For example, MOEs can be encapsulated without losing the optical functionality of imaging objects at the sensor. Multiple substrates with encapsulated MOEs can be combined and form an optical stack. Further, in some instances, the MOEs can be integrated into an optical stack in which the MOEs are in direct contact with other flat optical elements such as filters and / or sensors. By using meta lenses, fewer MOE lenses may be needed in some cases to achieve good image quality. In some cases, when manufacturing tolerances are taken into account, the designs may be more compact compared to designs based on refractive optics.

[0017] Using encapsulated meta optics can avoid air gaps in the optical stack. Further, the optical stack can be attached, for example, with index matched glue to a cover glass over the image sensor. Thus, in some implementations, light entering the camera module does not encounter internal interfaces having a high refractive index contrast and, therefore, there may be no need for anti-reflective coatings. Providing an optical stack in which at least some neighboring optical elements and / or layers are substantially index matched to one another also can, in some implementations, help avoid or reduce issues associated with total internal reflection.

[0018] In some implementations, the lenses can be glued together completely and do not need any bond line at the edge of the lens. Additionally, in some cases, the meta lenses can be manufactured with the same rectangular aspect ratio as the image sensor, which allows the footprint of the lenses to be reduced even further. Further, gluing together the various layers in a single optical stack can help improve mechanical stability.Additionally, as the optical stack has no voids, it is dust-proof and, in some cases, also waterproof.

[0019] The details of one or more embodiments of the invention are set forth in the accompanying drawings and the description below. Other aspects, features and advantages will be readily apparent from the following detailed description, the accompanying drawings, and the claims.BRIEF DESCRIPTION OF THE DRAWINGS

[0020] FIG. 1 illustrates a first example of a camera module including encapsulated meta optics.

[0021] FIG. 2 illustrates a second example of a camera module including encapsulated meta optics.

[0022] FIG. 3 illustrates a third example of a camera module including encapsulated meta optics.

[0023] FIG. 4 illustrates a fourth example of a camera module including encapsulated meta optics.

[0024] FIG. 5 illustrates a fifth example of a camera module including encapsulated meta optics.

[0025] FIG. 6 illustrates a sixth example of a camera module including encapsulated meta optics.

[0026] FIG. 7 illustrates a seventh example of a camera module including encapsulated meta optics.

[0027] FIG. 8 illustrates an eighth example of a camera module including encapsulated meta optics.

[0028] FIG. 9 illustrates a ninth example of a camera module including encapsulated meta optics.

[0029] FIG. 10 illustrates a tenth example of a camera module including encapsulated meta optics.

[0030] FIG. 11 shows an example method of manufacturing camera modules.

[0031] FIG. 12 illustrates an example of a camera module attached to another device.

[0032] Like reference symbols in the various drawings indicate like elements.DETAILED DESCRIPTION

[0033] The present disclosure describes camera modules that include encapsulated meta optics. Meta optical elements (MOEs) employ a flat optic technology and have a metasurface that includes distributed small subwavelength structures (e.g., nanostructures or other meta-atoms) arranged to interact with light in a particular manner. The metaatoms can, individually and / or collectively, interact with light waves to change a local amplitude, a local phase, or both, of an incoming light wave. In some cases, MOEs can provide several potential advantages compared to refractive elements. For example, compared to refractive lenses, MOEs can have fewer surfaces and less performance degradation due to tolerances.

[0034] In accordance with the present disclosure, an apparatus including a camera module. The camera module includes an optical stack attached directly or indirectly over an image sensor (e.g., a CMOS image sensor). At least a portion of the optical stack that has no air gaps includes an aperture stop and a first substrate having an encapsulated meta-optic element (MOE) thereon.

[0035] FIG. 1 illustrates an example of a camera module 20 that includes an optical stack 22 attached over an image sensor 25 that is disposed in or on a support substrate 24. The support substrate 24 may be, for example, a printed circuit board (PCB) that has external electrical connections (e.g., a ball grid array) 40 on its underside. The optical stack 22 includes a first substrate 26 having an aperture 28 defined, for example, by a layer of black chrome or black resist 27 at one side of the substrate 26. The first substrate 26 is optically transparent and can be composed, for example, of glass. The optical stack 22 also includes a MOE 29 on the opposite side of the substrate 26. The MOE 29 is encapsulated (e.g., embedded or buried) by an encapsulant layer 30, which can be composed, for example, of optically transparent material such as glass or a polymer. In the context of the present application optically transparent indicates that the material is optically transparent for a specified operational wavelength (e.g., in the infra-red, UV, or visible part of the spectrum). The material for the encapsulant layer 30 should besubstantially index matched optically to the substrate 26. In some implementation, an adhesive (e.g., bonding glue) can serve as the encapsulant material. In some implementations, the optical stack 22 may include one or more additional optical elements, For example, in some instances, the optical stack 22 includes an optical filter (e.g., a band pass filter or an angle-of-incidence filter) 32, which can be attached to the encapsulant layer 30 by adhesive 31 (e.g., bonding glue). In some implementations, an anti-reflective coating (ARC) layer 23 is provided between the first substrate 26 and the black chrome or resist 27 defining the aperture 28.

[0036] As illustrated in FIG. 1, there are no air gaps between the various optical elements and layers in the optical stack 22. Such an arrangement can help reduce or eliminate unwanted reflections that might otherwise occur, for example, at air / lens interfaces.

[0037] As illustrated in FIG. 1, in some implementations, a cover glass 36 is provided over the image sensor 25 and can be attached, for example, to the support substrate 24 by a spacer 38. In the illustrated example, the opposite (upper) side of the cover glass 36 is attached to the bottom of the stack 22 (e.g., to the optical filter 32) by adhesive 34 (e.g., bonding glue). Preferably, the various optical elements and layers are substantially index matched optically to one another. That is, preferably the respective refractive indices of the various optical elements and layers in the stack 22 (i.e., the substrates, encapsulants and bonding glues) do not deviate from one another by more than 0.2 in refractive index.

[0038] Various implementations may include additional and / or different elements in the optical stack. For example, some implementations include multiple MOEs on respective substrates. In some implementations, the location of the aperture may differ from the example of FIG. 1. The aperture stop may be on the same substrate as an MOE or on a separate substrate. Some implementations include a spacer as part of the optical stack. Further, in some implementations, the location of the optical filter in the stack may differ from that of FIG. 1. In some instances, there is no air gap between any of the elementsand layers in the optical stack. Examples of camera modules that incorporate one or more of the foregoing features are described below.

[0039] FIG. 2 illustrates an example of a camera module 120 that includes an optical stack 12 having a first MOE substrate 126 on which a first MOE 129A is disposed, and a second MOE substrate 126B on which a second MOE 129B is disposed. An aperture substrate 127, composed, for example, of glass, is disposed between the first and second MOE substrates 126A, 126B, and has a layer of black chrome or black resist 127A on its surface that defines an aperture stop 128. Each of the MOEs 129A, 129B is encapsulated by a respective encapsulant layer 130A, 130B. The stack 122 also includes an optical filter 132 (e.g., a band pass filter or an angle-of-incidence filter). As described above in connection with FIG. 1, the various optical elements and layers in the stack can be attached to one another, for example, by respective layers of adhesive (e.g., bonding glue) 150. Likewise, the optical stack 122 can be attached over an image sensor 25 in a manner similar to that described above in connection with FIG. 1. As illustrated in FIG.2, there are no air gaps between the various optical elements and layers in the optical stack 122. In some implementations, an ARC layer 123 can be applied on the encapsulation 130A.

[0040] FIG. 3 illustrates an example of a camera module 220 that is similar to the camera module 120 of FIG. 2, except that the camera module 220 also includes another layer of black chrome or black resist 230 that defines an aperture stop 240 at the outer (upper) surface of the module.

[0041] FIG. 4 illustrates another example of a camera module 320. Like the example of FIG. 2, the module 320 includes an optical stack 322 having a first MOE substrate 126A on which a first MOE 129 A is disposed, and a second MOE substrate 126B on which a second MOE 129B is disposed. In this case, instead of a separate aperture substrate as in the example of FIG. 2, the optical stack 322 of FIG. 4 includes a layer of black chrome or black resist 127A on a surface of the first MOE substrate 126A to define the aperture stop 128. Here as well, the various optical elements and layers in the stack 322 can beattached to one another, for example, by respective layers of adhesive (e.g., bonding glue) 150. Likewise, the optical stack 322 can be attached over an image sensor 25 in a manner similar to that described above in connection with FIG. 1. As illustrated in FIG. 4, there are no air gaps between the various optical elements and layers in the optical stack 322.

[0042] FIG. 5 illustrates another example of a camera module 420 that is similar to the example of FIG. 4. However, instead of providing a layer of black chrome or black resist on the surface of the first MOE substrate 126A to define the aperture stop, the implementation of FIG. 5 includes a layer of black chrome or black resist 127B on the surface of the second MOE substrate 126B to define the aperture stop 128. As illustrated in FIG. 5, there are no air gaps between the various optical elements and layers in the optical stack 422.

[0043] The optical filter, if included, can be positioned at a location in the stack different from the location as shown in the foregoing examples. The thickness of the filter can be adjusted based on the optical design of the camera module. FIG. 6, for example, illustrates a camera module 520 that is similar to the module of FIG. 5, except that the optical filter 132 (e.g., a band pass and / or angle-of-incidence filter) is disposed at or near the top of the optical stack 522 rather than at or near the bottom of the stack. As illustrated in FIG. 6, there are no air gaps between the various optical elements and layers in the optical stack 522.

[0044] Some implementations of the camera module include one or more spacers, which can facilitate proper vertical alignment and focusing of the light signals onto the image sensor. The spacer can be composed, for example, of an optically transparent material (e.g., glass). FIG. 7 illustrates an example of a camera module 620 that has an optical stack 622 including a spacer 650 that has the same X and Y dimensions of the optical stack. FIG. 8 illustrates an example of a camera module 720 that has an optical stack 722 including a spacer 750 that has an opening. In the example of FIG. 8, the bottom of the optical stack 722 has an air interface. Nevertheless, even in this situation, the portion ofthe optical stack that includes the aperture stop and the substrates having the encapsulated meta-optic elements (MOEs) thereon does not have an air gap.

[0045] In some implementations, edge blackening can be applied, for example, to the edge of the optical stack to reduce stray light. FIG. 9 illustrates an example of a camera module 820 that is similar to the module of FIG. 5, but also includes edge blackening 850. The edge blackening 850 can be composed, for example, of a black resist, a black polymer, black chrome, or black paint. In some implementations, a black housing can be overmolded over the full module. Edge blackening can be applied to any of the other implementations described in this disclosure.

[0046] The camera module 820 includes an optical stack 822 having a first MOE substrate 126A on which a first MOE 129A is disposed, and a second MOE substrate 126B on which a second MOE 129B is disposed. Each of the MOEs 129A, 129B is encapsulated by a respective encapsulant layer 130A, 130B. The encapsulant layers 130A, 130B, can be composed, for example, of optically transparent material such as glass or a polymer. The material for the encapsulant layers 130A, 130B should be substantially index matched optically to the respective substrates 126A, 126B. In some implementation, an adhesive (e.g., bonding glue) can serve as the encapsulant material and can be applied in the stacking process.

[0047] A layer of black chrome or black resist 127A is provided on a surface of the first MOE substrate 126A to define an aperture stop 128 for imaging. Thus, the aperture 128 is sandwiched between the first and second MOE substrates 126 A, 126B. The camera module 820 also includes another layer of black chrome or black resist 230 that defines another aperture stop 240 at the outer (top) surface of the module. In some cases, this aperture 240 can help control the stray light in the module. This feature also can be included in any of the other implementations described in this disclosure. The stack 822 further can include an optical filter 132 (e.g., a band pass filter and / or an angle-of- incidence filter) between the meta-lens stack and the image sensor. The various optical elements and layers in the stack can be attached to one another, for example, byrespective layers of adhesive (e.g., bonding glue) 150. The optical stack 822 can be attached, for example, by adhesive (e.g., bonding glue) 34 to the image sensor cover glass 36.

[0048] Preferably, the various optical elements and layers in the stack 822 are substantially index matched optically to one another. That is, preferably the respective refractive indices of the various optical elements and layers in the stack 822 (i.e., the substrates, encapsulants and bonding glues) do not deviate from one another by more than 0.2 in refractive index. As illustrated in FIG. 9, there are no air gaps between the various optical elements and layers in the optical stack 822.

[0049] In some implementations, the MOE is encapsulated by adding a layer of optically transparent material (e.g., glass, polymer) on top of the meta surface such voids (e.g., air gaps) are present between adjacent meta-atoms. For example, in some instances, a piece of glass can be bonded over the MOE. In some instances, a layer can be deposited on the top surface of the MOE such that voids (e.g., air gaps) remain between adjacent meta- atoms. FIG. 10 illustrates an example of a camera module 1020 that is similar to the camera module of FIG. 4, except that there are voids (e.g., air gaps) 1021 between adjacent ones of the meta-atoms 1023 of the encapsulated MOE 129C. In this case, the camera module 1020 includes an optical stack 1022 attached over the image sensor 25, wherein at least a portion of the optical stack has no air gaps (other than the voids between adjacent meta-atoms) and includes an aperture stop 127A and a first substrate 126A having an encapsulated meta-optic element (MOE) 129C thereon. In this case, the height of the air gaps 1021 is no greater than the height of the meta- atoms 1023.

[0050] In some instances, the camera module has alignment marks to facilitate alignment of the lenses over the sensor. In some cases, self-aligning occurs due to capillary forces (e.g., when the cover glass and optical stack have the same lateral dimensions). In some instances, the camera module may include one or more anti-reflection coatings (ARCs). In some instances, the cover glass may be placed directly on the light-sensitive surface ofthe image sensor. In some instances, the optical stack is directly glued onto the image sensor without any cover glass.

[0051] As indicated by FIG. 11, as part of a manufacturing or assembly process for camera modules, the various layers for the optical stack (e.g., one or more wafers including, respectively, the meta-optics, aperture stop(s), and filter(s)) are attached to one another (e.g., by an adhesive such as bonding glue) (1000). Glass wafers for the meta- optics can be stacked, for example, on a wafer level during the manufacturing process. In some instances, the wafers can have fiducials to align the full wafers. In some cases, the optical filters (e.g., band pass filters or AOI filters) can be added on wafer level. The wafer level stack then can be singulated (e.g., diced) into individual modules (1002). In some instances, the optical filters can be added on unit level instead of wafer level. Next, the modules are aligned and attached over the image sensors (1004). Edge blackening also can be provided to the sidewalls for each camera module (1006).

[0052] In some implementations, prior to assembly of the optical stack with the image sensor, the wafer-level optical stack is diced through partially to form grooves, which then are filled with an edge blackening material (e.g., a black resist, a black epoxy or other polymer). The wafer-level optical stack then is diced through its entire thickness to separate the stack into individual modules. In some implementations, the edge blackening may be provided (e.g., by spray painting) after the separating the stack into individual camera modules. The foregoing process can, in some cases, obviate the need to provide separate housings (e.g., barrels) for the camera modules and, in some instances, can facilitate control of stray light.

[0053] In some instances, the active area of the MOE structures can have a rectangular form factor, similar that of the image sensor. In some implementations, a dummy structure comprised, for example, of cylindrical pillars can be provided around the active area of the MOE structures. Such an arrangement can, in some cases, improve the flow of the adhesive (e.g., bonding glue).

[0054] Various advantages can be achieved in some implementations. For example, using encapsulated meta optics, there is no need for air gaps in the optical stack. The optical stack can be attached, for example, with index matched glue to a cover glass over the image sensor. Thus, in some implementations, light entering the camera module does not encounter internal interfaces having a high refractive index contrast and, therefore, there may be no need for anti-reflective coatings.

[0055] Index matching the optical elements and layers in the stack can provide other advantages in some implementations. For example, in designs having a wide field of view (FOV), some of the light rays will have relatively high ray angles of incidence, which can present a problem for designs incorporating flat optics (e.g., meta-optics) because total internal reflection (TIR) will occur for rays traveling from a higher index to a lower index at high angles. TIR, however, should be eliminated or reduced to allow more of the imaging rays to pass through the lens system and to avoid trapped rays that may create stray light. In systems using conventional optics (i.e., refractive optics), curvature of the surface of the lenses can be used to reduce or minimize the incident angle of the normal to the surface. In contrast, for systems using flat optics (e.g., metalenses), curvature of the lenses cannot be used to address TIR. Instead, providing an optical stack in which the elements and layers are substantially index matched to one another can allow the optical system to take advantage of the features of flat optics, while also avoiding or reducing the occurrence of TIR. Further, for arrangements in which the aperture stop is centered in an optical stack of lens elements, TIR can be avoided in the neighborhood of the stop by providing a stacked structure with index matching adhesive. As noted above, in some implementations, the respective refractive indices of the various optical elements and layers in the stack (i.e., the substrates, encapsulants and bonding glues) are substantially index matched such that they do not deviate from one another by more than 0.2 in refractive index.

[0056] Further, in some implementations, the lenses can be glued together completely and do not need any bond line at the edge of the lens. Additionally, in some cases, the meta lenses can be manufactured with the same rectangular aspect ratio as the imagesensor, which allows the footprint of the lenses to be reduced even further. Further, gluing together the various layers in a single optical stack can help improve mechanical stability. Using wafer-level stacking of the lenses, relatively complex optical systems can be manufactured more easily, and many lenses can be manufactured in parallel.

[0057] As described above, one end of the optical stack (e.g., 22, 122, 322, 422, 522, 622, 722, 822) can be attached (e.g., by adhesive) to a cover glass for the image sensor. In some implementations, the camera module can be embedded or otherwise integrated into a device in which the second end of the optical stack is attached to a glass or other optically transparent support. For example, in some implementations, the camera module is integrated into eyeglasses or an augmented reality headset to provide mold-in eye tracking. In some implementations, the camera module is integrated onto an automotive windshield or a solar cell. In such implementations, as shown in FIG. 12, the camera module 1100 can be glued, for example, directly onto an optically transparent glass support 1102 that forms part of the device where it is applied (e.g., windshield, rearview mirror, eyeglass, augmented reality (AR) headset, virtual reality (VR) headset, mixed reality (MR) headset).

[0058] While this specification contains many specifics, these should not be construed as limitations on the scope of the disclosure or of what may be claimed, but rather as descriptions of features specific to particular implementations. Certain features described in this specification in the context of separate implementations also may be combined in the same implementation. Conversely, various features described in the context of a single implementation also may be implemented in multiple implementations separately or in any suitable sub-combination. Various modifications can be made to the foregoing examples. Accordingly, other implementations also are within the scope of the claims.

Claims

What is claimed is:

1. An apparatus comprising a camera module, wherein the camera module comprises: an image sensor; an optical stack attached over the image sensor, wherein at least a portion of the optical stack having no air gaps includes: an aperture stop; and a first substrate having an encapsulated meta-optic element (MOE) thereon.

2. The apparatus of claim 1 wherein the MOE is encapsulated by an optically transparent glass or polymer.

3. The apparatus of any one of claims 1-2 wherein the MOE is encapsulated by a material that is optically index matched to the first substrate.

4. The apparatus of any one of claims 1 -2 wherein the MOE is encapsulated by bonding glue.

5. The apparatus of any one of claims 1-4 wherein the aperture stop is provided on a surface of the first substrate.

6. The apparatus of any one of claims 1-4 wherein the portion of the optical stack further includes a second substrate, and wherein the aperture stop is provided on a surface of the second substrate.

7. The apparatus of claim 1 wherein the portion of the optical stack further includes a second substrate having an encapsulated MOE thereon.

8. The apparatus of any one of claims 1-7 wherein at least some neighboring elements and / or layers of the optical stack are substantially index matched to one another.

9. The apparatus of claim 8 wherein at least some neighboring elements and / or layers of the optical stack are substantially index matched such that they do not deviate from one another by more than 0.2 in refractive index10. The apparatus of claim 8 wherein the portion of the optical stack further includes a third substrate disposed between the first and second substrates, and wherein the aperture stop is provided on a surface of the third substrate.

11. The apparatus of any one of claims 1-10 wherein the portion of the optical stack further includes at least one of a band pass filter or an angle-of-incidence filter.

12. The apparatus of any one of claims 1-11 wherein the portion of the optical stack further includes an optically transparent spacer.

13. The apparatus of any one of claims 1-12 including edge blackening on sidewalls of the camera module.

14. The apparatus of any one of the claims 1-13 including a second aperture on a surface of the optical stack, wherein the second aperture is defined by a layer of black chrome or black resist.

15. The apparatus of any one of claims 1-14 configured such that light entering the camera module does not encounter internal interfaces having a high refractive index contrast.

16. The apparatus of any one of claims 1-15 wherein the MOE has a same rectangular aspect ratio as the image sensor.

17. The apparatus of claim 1 further including a cover glass disposed over the image sensor, wherein the optical stack is attached with index matched adhesive to the cover glass.

18. The apparatus of any one of claims 1-17 further including an optically transparent glass support, wherein the camera module is attached to the optically transparent glass support.

19. The apparatus of claim 18 wherein the optically transparent glass support forms part of a windshield, a rearview mirror, an eyeglass, an augmented reality (AR) headset, a virtual reality (VR) headset, or a mixed reality (MR) headset.

20. An apparatus comprising a camera module, wherein the camera module comprises: an image sensor; an optical stack attached over the image sensor, wherein at least a portion of the optical stack includes: an aperture stop; and a first substrate having an encapsulated meta-optic element (MOE) thereon, wherein the portion of the optical stack has no air gaps other than voids between adjacent meta-atoms of the MOE.

21. A method of manufacturing camera modules, the method comprising: forming a wafer-level optical stack, wherein at least a portion of the optical stack having no air gaps includes an aperture stop and a first substrate having an encapsulated meta-optic element (MOE) thereon; singulating the wafer-level optical stack into individual modules; and attaching at least one of the modules over an image sensor.

22. The method of claim 21 further including providing edge blackening to sidewalls for the modules, wherein the edge blackening material includes a black resist, a black epoxy, or other black polymer or a black overmold.

23. The method of claim 22 wherein providing edge blackening includes: dicing partially through the wafer-level optical stack to form grooves; and filling the grooves with an edge blackening material.

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