Electronic device and radar apparatus

Abstract

[Problem] To provide an electronic device and a radar device having a structure capable of easily adjusting an impedance. [Solution] An electronic device of the present disclosure includes: a dielectric substrate; and a first conductor substrate arranged to face the dielectric substrate, in which the dielectric substrate includes: a first dielectric waveguide formed by first and second ground conductors and a plurality of vias; and a second dielectric waveguide formed by a plurality of electromagnetic band gap elements and electromagnetically connected to the first dielectric waveguide, a first microstrip-ridge gap waveguide electromagnetically connected to the second dielectric waveguide is formed between the dielectric substrate and the first conductor substrate.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to an electronic device and a radar device.BACKGROUND ART

[0002] Gap waveguides have attracted attention as waveguides used in antenna devices. The gap waveguide is easy to manufacture because it is not necessary to have a configuration of being completely surrounded by a conductor like a waveguide, while having a low loss. Among the gap waveguides, a microstrip-ridge gap waveguide (MS-RGW) allows an electromagnetic band gap (EBG) element to be mounted on a substrate, so that the gap waveguide can be easily achieved. Here, the MS-RGW is a low-loss transmission path using a metamaterial technology. The EBG means a band gap structure using the metamaterial technology.

[0003] In an antenna device using the MS-RGW, a compact and high-performance structure can also be achieved by using a conductor pattern having a narrow width such as a microstrip line, as a transmission line for inputting and outputting signals to and from an IC chip for signal transmission and reception. At this time, by forming the MS-RGW on one surface (front surface) side of the substrate, forming a microstrip line (MSL) on another surface (back surface) side, and feeding power from the back surface of the substrate, a loss during power feeding can be reduced. That is, since the back surface of the substrate has no or few components other than a feeder line, a line length can be shortened, and a loss from a power supply circuit to a feeding point of the antenna can be reduced.

[0004] In a configuration for performing backside feeding, impedance adjustment is required in a case where an electric field fed from the MSL at a time of transmission is propagated through a waveguide in the substrate and coupled to the MS-RGW on the front surface side, and in a case where a radio wave propagated through the MS-RGW on the front surface side is coupled to the MSL through the waveguide in the substrate at a time of reception. While an influence of a dielectric constant of a base material and design rules are limited, there has been a problem in the impedance adjustment.CITATION LISTPATENT DOCUMENT

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 2018-207487 Patent Document 2: Japanese Patent Application Laid-Open No. 2023-021725 SUMMARY OF THE INVENTIONPROBLEMS TO BE SOLVED BY THE INVENTION

[0006] The present disclosure has been made in view of the above-described problem, and an object of the present disclosure is to provide an electronic device and a radar device having a structure capable of easily adjusting an impedance.SOLUTIONS TO PROBLEMS

[0007] An electronic device of the present disclosure includes: a dielectric substrate; and a first conductor substrate arranged to face the dielectric substrate, in which the dielectric substrate includes: a first dielectric waveguide formed by first and second ground conductors and a plurality of vias; and a second dielectric waveguide formed by a plurality of electromagnetic band gap elements and electromagnetically connected to the first dielectric waveguide, a first microstrip-ridge gap waveguide electromagnetically connected to the second dielectric waveguide is formed between the dielectric substrate and the first conductor substrate.BRIEF DESCRIPTION OF DRAWINGS

[0008] Fig. 1 is a cross-sectional view of an antenna device according to a first embodiment of the present disclosure. Fig. 2(A) is a back plan view of the antenna device of Fig. 1 as viewed from a Z-axis positive direction, and Fig. 2(B) is a top plan view of the antenna device of Fig. 1 as viewed from a Z-axis negative direction. Fig. 3(A) is a transparent perspective view of the antenna device of Fig. 1 as viewed obliquely from above in the Z-axis positive direction, and Fig. 3(B) is a transparent plan view of the antenna device 1000 of Fig. 1 as viewed from the front in the Z-axis positive direction. Fig. 4 is a diagram illustrating a flow of an electric field at a time of transmission or reception in the antenna device of Fig. 1. Fig. 5(A) is a diagram illustrating a flow of an electric field of an SIW, and Fig. 5(B) is a diagram illustrating a flow of an electric field of an EBG-SIW. Fig. 6 is a diagram illustrating a comparative example of the antenna device of Fig. 1. Fig. 7 is a diagram illustrating a comparative example of the antenna device of Fig. 1. Fig. 8 is a cross-sectional view of an antenna device according to a second embodiment of the present disclosure. Fig. 9(A) is a back plan view of the antenna device of Fig. 8 as viewed from the Z-axis positive direction, and Fig. 9(B) is a top plan view of the antenna device of Fig. 8 as viewed from the Z-axis negative direction. Fig. 10 is a cross-sectional view of an antenna device according to a third embodiment of the present disclosure. Fig. 11(A) is a back plan view of the antenna device of Fig. 10 as viewed from the Z-axis positive direction, and Fig. 11(B) is a top plan view of the antenna device of Fig. 10 as viewed from the Z-axis negative direction. Fig. 12 is a cross-sectional view of an antenna device according to a fourth embodiment of the present disclosure. Fig. 13(A) is a back plan view of the antenna device of Fig. 12 as viewed from the Z-axis positive direction, and Fig. 13(B) is a top plan view of the antenna device of Fig. 12 as viewed from the Z-axis negative direction. Fig. 14 is a cross-sectional view of an antenna device according to a fifth embodiment of the present disclosure. Fig. 15(A) is a back plan view of the antenna device of Fig. 14 as viewed from the Z-axis positive direction, and Fig. 15(B) is a top plan view of the antenna device of Fig. 14 as viewed from the Z-axis negative direction. Fig. 16 is a cross-sectional view of an antenna device according to a sixth embodiment of the present disclosure. Fig. 17(A) is a back plan view of the antenna device of Fig. 16 as viewed from the Z-axis positive direction, and Fig. 17(B) is a top plan view of the antenna device of Fig. 16 as viewed from the Z-axis negative direction. Fig. 18 is a block diagram of a radar device including an antenna device according to an embodiment of the present disclosure. Fig. 19 is a block diagram illustrating a configuration example of a vehicle control system. Fig. 20 is a view illustrating an example of a sensing area. MODE FOR CARRYING OUT THE INVENTION

[0009] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. Note that, in the present specification and the drawings, components having substantially the same functional configuration are denoted by the same reference numerals, and description thereof is appropriately omitted. Since the drawings are illustrated in a simplified manner, configurations necessary for implementation other than those illustrated in the figures are appropriately provided.

[0010] Fig. 1 is a cross-sectional view of an antenna device 1000 as an electronic device according to an embodiment of the present disclosure. Fig. 1 illustrates XYZ axes. A surface of the antenna device 1000 on a Z-axis positive direction side (a surface on an upper side on the page) is referred to as a back surface (or a bottom surface), and a surface on a Z-axis negative direction side is referred to as a top surface.

[0011] Fig. 2(A) is a back plan view of the antenna device 1000 of Fig. 1 as viewed from the Z-axis positive direction, and Fig. 2(B) is a top plan view of the antenna device 1000 of Fig. 1 as viewed from the Z-axis negative direction. However, a conductor substrate 220 is not illustrated in Fig. 2(B).

[0012] Fig. 3(A) is a transparent perspective view of the antenna device 1000 of Fig. 1 as viewed obliquely from above in the Z-axis positive direction. Fig. 3(B) is a transparent plan view of the antenna device 1000 of Fig. 1 as viewed from the front in the Z-axis positive direction.

[0013] In the present embodiment, in a structure in which power is fed from the back surface of the substrate to an antenna using a micro strip-ridge gap waveguide (MS-RGW) 350, by combining a slot 190, a substrate integrated waveguide (SIW) 330, and an SIW (EBG-SIW) 340 using a band gap, power feeding with a small area and a low loss can be achieved.

[0014] The antenna device 1000 includes a dielectric substrate 210 on which various elements are formed, and the conductor substrate 220 that is a first conductor substrate arranged to face the dielectric substrate 210 with an air layer 240 interposed therebetween. The dielectric substrate 210 has a structure in which a plurality of dielectric layers is stacked. Each dielectric layer is a glass epoxy substrate, a fluorine substrate, a glass polyimide substrate, or the like. The conductor substrate 220 is a substrate of metal such as aluminum or copper. The air layer 240 is formed between the dielectric substrate 210 and the conductor substrate 220. One or a plurality of slots (not illustrated) through which an electric field propagated through the MS-RGW 350 is emitted as a radio wave is formed on an end side in an X-axis positive direction of the conductor substrate 220. That is, the conductor substrate 220 is an antenna substrate in which a slot for radio wave emission is formed. At a time of reception, the radio wave is received through the slot, and the electric field propagates through the MS-RGW 350 in a direction opposite to that at a time of transmission. On the Z-axis negative direction side of the dielectric substrate 210, a microstrip line (MSL) 310 as a transmission line is formed, and a power supply circuit 230 is connected to the MSL 310 on an X-axis negative direction side. The power supply circuit 230 generates a signal for transmission on the basis of transmission processing, and outputs the generated signal to the MSL 310 of the antenna device 1000. Furthermore, the power supply circuit 230 receives a signal received by the antenna device 1000 from the MSL 310, and performs reception processing on the received signal. A type of the transmission line is not limited to the microstrip line (MSL), and may be other type of line such as a coplanar line.

[0015] On a ground conductor 90 on the top surface side of the dielectric substrate 210, an opening portion OP1 serving as a radio wave input / output part is formed between the electro-magnetic band gap-substrate integrated waveguide (EBG-SIW) 340 and the air layer 240. In the air layer 240, a portion on the X-axis positive direction side (the right side on the page) from the opening portion OP1 serves as a waveguide formed by the micro strip-ridge gap waveguide (MS-RGW) 350. In the waveguide, a slot (not illustrated) is formed in the conductor substrate 220. The MS-RGW 350 is a waveguide in which the ground conductor 90 is surrounded by the conductor substrate 220 and a plurality of EBG elements 320 arranged in a planar shape on both sides on a Y-axis positive direction side and a Y-axis negative direction side (see Fig. 2(B)). An electromagnetic band gap structure by the EBG elements 320 prevents spread of a radio wave toward the Y-axis positive direction side and the Y-axis negative direction side. Whereas, the EBG 320 elements are entirely arranged in a portion on the X-axis negative direction side (the left side on the page) from the opening portion OP1 (see Fig. 2(B)), whereby propagation of a radio wave in the X-axis negative direction is blocked. The EBG element 320 has a structure in which conductor pieces 60, 70, and 91 and a plurality of vias 140 (140A, 140B, 140C) are connected to a ground conductor 50, and has a shape similar to a mushroom (see Fig. 3(A)). Each of the conductor pieces 60, 70, and 91 is formed by patterning a ground conductor into a circular shape or a polygonal shape. Shapes and sizes of the conductor pieces 60, 70, and 91 may be the same or different.

[0016] The dielectric substrate 210 includes the MSL 310, the SIW 330, and the EBG-SIW 340 described above. The SIW 330 is a first dielectric waveguide coupled to the MSL 310 through the slot (opening portion) 190. The EBG-SIW 340 is a second dielectric waveguide electromagnetically coupled to the SIW 330 in the Z-axis negative direction. The EBG-SIW 340 is electromagnetically connected to the above-described MS-RGW 350 through the opening portion OP1 in the Z-axis negative direction.

[0017] The SIW 330, which is the first dielectric waveguide, is formed by surrounding a dielectric portion with a plurality of ground conductors 20, 30, 40, and 50 and a plurality of vias 110, 120, and 130. That is, the SIW 330 is a waveguide surrounded by metal patterns and vias, and confines an electric field. The ground conductor 20 to 50 and the vias 110 to 130 are made with metal such as copper, aluminum, or gold, for example. The ground conductors 20, 30, 40, and 50 are configured by patterning a conductor foil (copper foil or the like) on a corresponding layer in the dielectric layers. The vias 110 to 130 are formed in, for example, a columnar or prismatic shape. The vias 110 to 130 are formed, for example, by forming a via hole which is a through hole in the dielectric layer and plating copper or the like on the via hole. In this example, the vias are formed in three layers, but the number of layers in which the vias are formed may be one, two, or four or more. An end portion on the back surface side (Z-axis positive direction side) of the SIW 330 is connected to the MSL 310 through the slot 190 formed in the ground conductor 20. The top surface side (Z-axis negative direction side) of the SIW 330 is connected to the EBG-SIW 330. The SIW 330 is not limited to the illustrated configuration as long as the SIW 330 is a dielectric waveguide in which at least two are formed by a first ground conductor, a second ground conductor, and a plurality of vias.

[0018] The EBG-SIW 340, which is the second dielectric waveguide, is formed by surrounding a dielectric portion with a plurality of EBG elements 320 and a probe 360 in the dielectric substrate 210. The EBG-SIW 340 can be regarded as a ridged SIW having the probe 360 as a ridge. The EBG-SIW 340 has a pseudo wall using a band gap by the EBG element 320, and an electric field spreads as compared with the SIW 330, but a characteristic impedance is lowered by concentrating the electric field on the ridge (probe 360). The Z-axis positive direction side of the EBG-SIW 340 is coupled to the SIW 330, and the Z-axis negative direction side of the EBG-SIW 340 is coupled to the MS-RGW 350 through the opening portion OP1 of the ground conductor 90.

[0019] As described above, the MS-RGW 350 is a waveguide formed by surrounding the air layer 240 between the ground conductor 90 and the conductor substrate 220, with the EBG elements 320. These EBG elements 320 are formed in a planar shape on both sides in the Y-axis positive direction and the Y-axis negative direction of the ground conductor 90 (see Fig. 2(B), Fig. 3(A), and Fig. 3(B)). The ground conductor 90 is connected to the ground conductor 50, which is GND, by a plurality of vias 321. The via 321 includes a structure in which the conductor pieces 60 and 70 and the plurality of vias 140 (140A, 140B, 140C) are connected between the ground conductors 50 and 90. Unlike the EBG element 320, the via 321 does not include the isolated conductor piece 91. The conductor pieces 60 and 70 and the plurality of vias 140 (140A, 140B, 140C) in the via 321 can be formed in a manufacturing process same as that of the EBG element 320 described above. Since the via 321 has the same structure as the EBG element except that the conductor piece 91 is not included as described above, the via 321 can be manufactured in the same process as the EBG element.

[0020] The probe 360 includes an end portion of the ground conductor 90 on the X-axis negative direction side and the via 321 connected to the end portion (see Figs. 2(B) and 3(B)), and concentrates the electric field as the ridge in the EBG-SIW 340 to lower the characteristic impedance (see Fig. 4 described later). In the figure, the probe 360 is located on a lower side (Z-axis negative direction) side of the slot 190. With this positional relationship, the electric field input from the slot 190 is gradually expanded without rapid expansion, and impedance characteristics can be improved (see Fig. 4). Widths of the ground conductors 50 and 90 in the probe 360 portion in the Y-axis direction are narrower than those of the other portions (see Figs. 2(B) and 3(B)). However, the widths of the ground conductors 50 and 90 in the probe 360 portion in the Y-axis direction may be wider than the widths of other portions or may be the same as the widths of other portions.

[0021] The EBG element 320 has a resonance frequency based on a size of an outer shape (diameter) of the conductor piece, a height of the via, a thickness of the ground conductor 50, a dielectric constant of the dielectric layer, and the like. The resonance frequency is set to correspond to an operating band. As an example, in a case of transmitting a signal in a millimeter wave band, the conductor piece can be configured to have an outer shape having a length of approximately 1 / 4 of this wavelength or a length slightly shorter than that. In this case, the EBG elements 320 are arranged to be aligned at intervals of a length of, for example, approximately a 1 / 4 wavelength of the transmitted signal or a length shorter than that. With such a configuration, the EBG element 320 formed in a planar shape forms a wall with the electromagnetic band gap structure, and prevents leakage and spread of the electric field or the radio wave. An area where leakage of radio waves is prevented by forming such an EBG element 320 is referred to as an EBG area 370 (see Fig. 2(B)).

[0022] Fig. 4 illustrates a flow of an electric field at a time of transmission or reception in the antenna device 1000 of Fig. 1. A length of a solid line with an arrow corresponds to magnitude of the electric field. Fig. 5(A) illustrates an electric field in the SIW 330, and Fig. 5(B) illustrates an electric field in the EBG-SIW 340. As indicated by a broken line in Fig. 5(B), the electric field is wider than that of the SIW 330, but the electric field is concentrated by the probe 360 near the opening portion OP1, so that impedance matching is achieved (a characteristic impedance is reduced).

[0023] In the antenna device 1000 illustrated in Fig. 1, since a position of the slot 190 is on the right side (the side on which the probe is provided), an electric field (a length of a solid line with an arrow) flowing from the MSL 310 gradually spreads while a surface on the Z-axis direction side of the probe (ridge) functions as a reflecting surface. Since the SIW 330 is a waveguide surrounded by metal patterns and vias, the electric field is confined in the SIW 330. This electric field is propagated to the EBG-SIW 340, concentrated by the probe 360 as the ridge, and supplied to the MS-RGW 350. The characteristic impedance is reduced and impedance matching is improved. In a case where the probe 360 is not provided, the characteristic impedance may be increased as the electric field is spread due to the pseudo wall using the band gap in the EBG-SIW 340, but the characteristic impedance can be decreased by coupling the electric field by the probe 360 to the MS-RGW 350 by concentration. That is, impedance matching can be achieved, and impedance characteristics can be improved. However, a configuration may be adopted in which the EBG-SIW 340 is directly coupled to the MS-RGW 350 without the probe 360 being provided. Even with this configuration, although the impedance characteristics can be improved, power can be fed to the MS-RGW 350 directly from the MSL 310 on the back surface of the substrate, so that an effect of miniaturization or reduced area can be obtained. As a related technique, it is conceivable to adopt a conversion structure in which an MS-RGW is separately provided in a direction parallel to the substrate surface from the MSL 310 and an electric field is propagated from the MSL to the MS-RGW, but the size increases or the area increases.

[0024] Fig. 6 illustrates, as a comparative example, an example of an antenna device in which a slot 191 is provided on the X-axis negative direction side (substantially a center of the SIW) with respect to Fig. 1. Fig. 7 illustrates, as still another comparative example, an example of an antenna device in which a slot 192 is provided further on the X-axis negative direction side (a side opposite to the side where the probe is provided) with respect to Fig. 6. In Figs. 6 and 7, an electric field at a time of transmission and reception is indicated by a line with an arrow. As illustrated in the figure, an electric field (a length of the solid line with an arrow) input from the slots 191 and 192 rapidly spreads, and impedance mismatching occurs (the characteristic impedance increases). On the other hand, in the antenna device 1000 of the present embodiment, since the slot 190 is provided at a position overlapping with the probe 360 (that is, an electromagnetic connection portion between the SIW 330 and the EBG-SIW 340 does not overlap with the slot 190), the electric field input from the slot 190 gradually spreads, and the probe 360 can concentrate the electric field near the opening portion OP1. As a result, the characteristic impedance is lowered, and impedance matching is easily achieved.

[0025] As described above, according to the present embodiment, in the structure in which power is fed from the back surface of the substrate to the antenna using the MS-RGW, it is possible to feed power with a small area and a low loss, by combining the slot 190, the SIW 330, and the EBG-SIW 340 (SIW using a band gap).(Second Embodiment)

[0026] Fig. 8 is a cross-sectional view of an antenna device 2000 as an electronic device according to a second embodiment of the present disclosure.

[0027] Fig. 9(A) is a back plan view of the antenna device 2000 of Fig. 8 as viewed from the Z-axis positive direction, and Fig. 9(B) is a top plan view of the antenna device 2000 of Fig. 8 as viewed from the Z-axis negative direction. However, a conductor substrate 220A is not illustrated in Fig. 9(A), and a conductor substrate 220 is not illustrated in Fig. 9(B).

[0028] The same reference numerals are given to the same or corresponding components as those in Figs. 1 and 2 used in the description of the first embodiment, and a detailed description thereof will be omitted. Hereinafter, differences from the first embodiment will be mainly described.

[0029] In the first embodiment, the MSL, the SIW, the EBG-SIW, and the MS-RGW are arranged in order from the Z-axis direction side. In the second embodiment, an MS-RGW, an EBG-SIW, an SIW, an EBG-SIW, and an MS-RGW are arranged. That is, one of input and output sides of the SIW 330 is the MSL and another is the MS-RGW in the first embodiment, while both input and output sides of an SIW 330 are the MS-RGWs with the EBG-SIW with a ridge (probe) interposed in between in the second embodiment. More specifically, the Z-axis positive direction side of the SIW 330 is coupled to an MS-RGW 350 through an opening portion OP2 of an EBG-SIW 340A, which is a third dielectric waveguide, having a probe (ridge) 360A. Similarly to the first embodiment, the Z-axis negative direction side of the SIW 330 is coupled to an MS-RGW 350 through an opening portion OP1 of an EBG-SIW 340 with a probe (ridge).

[0030] A signal generated by the power supply circuit (see Fig. 1) is input to the MS-RGW 350A through a transmission line (MSL or the like) (not illustrated), and an electric field is transmitted in a direction of an arrow in the figure. In an air layer 240A between a dielectric substrate and the conductor substrate 220A which is a second conductor substrate, a portion on the X-axis positive direction side with respect to the opening portion OP2 serves as an EBG area, and propagation of the electric field in this direction is blocked. Therefore, the electric field is input to the EBG-SIW 340 through the opening portion OP2, and is output from the opening portion OP1 to the MS-RGW 350 through the SIW 330 and the EBG-SIW 340. This electric field is transmitted through the MS-RGW 350 in the direction of the arrow in the figure, and is emitted as a radio wave from a slot (not illustrated). Note that, similarly to the first embodiment, in the air layer 240 between the conductor substrate 220 and the dielectric substrate, a portion on the X-axis negative direction side with respect to the opening portion OP1 serves as an EBG area, and propagation of the electric field in this direction is blocked.

[0031] As described above, even in a case where both the back surface side and the top surface side of the substrate are the MS-RGWs, by providing the EBG-SIWs 340A and 340 with probes on the back surface side and the top surface side of the SIW 330, impedance adjustment is performed by electric field concentration during power feeding, and impedance characteristics are improved. Note that, similarly to the first embodiment, it is also possible to adopt a configuration in which the probes are not provided to the EBG-SIWs 340A and 340 (no ridge is provided to the EBG-SIWs 340A and 340). This similarly applies to the following other embodiments (third to sixth embodiments).(Third Embodiment)

[0032] Fig. 10 is a cross-sectional view of an antenna device 3000 as an electronic device according to a third embodiment of the present disclosure. The figure illustrates a solid line with an arrow indicating an advancing direction of an electric field.

[0033] Fig. 11(A) is a back plan view of the antenna device 3000 of Fig. 10 as viewed from the Z-axis positive direction, and Fig. 11(B) is a top plan view of the antenna device 3000 of Fig. 1 as viewed from the Z-axis negative direction. However, a conductor substrate 220 is not illustrated in Fig. 11(B).

[0034] The same reference numerals are given to the same or corresponding components as those in Figs. 1 and 2 used in the description of the first embodiment, and a detailed description thereof will be omitted. Hereinafter, differences from the first embodiment will be mainly described.

[0035] In the first embodiment described above, on the top surface side of the substrate, the MS-RGW 350 is formed on the X-axis positive direction side, and the EBG area is formed on the X-axis negative direction side. However, in the third embodiment, an MS-RGW 350 is formed on the X-axis negative direction side, and an EBG area is formed on the X-axis positive direction side. That is, a propagation direction of an electric field is opposite between the back surface side and the top surface side. As indicated by a solid line with an arrow in the figure, an electric field of a signal flowing from an MSL 310 is propagated to the MS-RGW 350 through an SIW 330 and an EBG-SIW 340, and flows in the X-axis negative direction (the left direction in the figure). Even in a case where the propagation direction of the electric field propagating through the MSL 310 is opposite to the propagation direction of the electric field propagating through the MS-RGW 350, impedance matching can be performed during power feeding from the SIW 330 to the MS-RGW 350.(Fourth Embodiment)

[0036] Fig. 12 is a cross-sectional view of an antenna device 4000 as an electronic device according to a fourth embodiment of the present disclosure.

[0037] Fig. 13(A) is a back plan view of the antenna device 4000 of Fig. 12 as viewed from the Z-axis positive direction, and Fig. 13(B) is a top plan view of the antenna device 4000 of Fig. 12 as viewed from the Z-axis negative direction. However, a conductor substrate 220 is not illustrated in Figs. 13(A) and 13(B).

[0038] The same reference numerals are given to the same or corresponding components as those in Figs. 8 and 9 used in the description of the second embodiment, and a detailed description thereof will be omitted. Hereinafter, differences from the second embodiment will be mainly described.

[0039] In the second embodiment described above, the MS-RGW 350 is provided on the X-axis positive direction side, and propagation of an electric field toward the X-axis negative direction side is prevented by the EBG area. However, in the fourth embodiment, an MS-RGW 350 is formed on the X-axis negative direction side, and propagation of an electric field toward the X-axis positive direction side is prevented by an EBG area. That is, a propagation direction of an electric field is opposite between the back surface side and the top surface side. An electric field propagated to the MS-RGW 350 through an EBG-SIW 340A, an SIW 330, and an EBG-SIW 340 propagates in the X-axis negative direction (the left direction in the figure), as indicated by a solid line with an arrow in the figure. Even in a case where the propagation direction of the electric field propagating through an MS-RGW 350A is opposite to the propagation direction of the electric field propagating through the MS-RGW 350, impedance matching can be performed during power feeding from the MS-RGW 350A to the SIW 330 and from the SIW 330 to the MS-RGW 350.(Fifth Embodiment)

[0040] Fig. 14 is a cross-sectional view of an antenna device 5000 as an electronic device according to a fifth embodiment of the present disclosure.

[0041] Fig. 15(A) is a back plan view of the antenna device 5000 of Fig. 14 as viewed from the Z-axis positive direction, and Fig. 15(B) is a top plan view of the antenna device 5000 of Fig. 14 as viewed from the Z-axis negative direction. However, a conductor substrate 220 is not illustrated in Figs. 14(A) and 14(B).

[0042] The same reference numerals are given to the same or corresponding components as those in Figs. 1 and 2 used in the description of the first embodiment, and a detailed description thereof will be omitted. Hereinafter, differences from the first embodiment will be mainly described.

[0043] In the first embodiment described above, the MS-RGW 350 is formed only on the X-axis positive direction side, and propagation of an electric field is prevented by the EBG area on the X-axis negative direction side. That is, power has been fed from one side of the MS-RGW 350. In the fifth embodiment, an MS-RGW 350 is formed on both the X-axis positive direction side and the X-axis negative direction side, and power feeding (central power feeding) is performed to substantially a center of the MS-RGW 350. "Substantially a center" is, for example, a center of the MS-RGW 350 or a position shifted by about a 1 / 4 wavelength from the center. That is, the MS-RGW 350 includes a first portion 350_1, a second portion 350_2, and a connection portion 350_3 between the first portion and the second portion, and the MS-RGW 350 is connected to an EBG-SIW 340 at the connection portion 350_3. An electric field input from the EBG-SIW 340 to the MS-RGW 350 through the connection portion 350_3 branches into the first portion 350_1 and the second portion 350_2, and propagates inside each of the first portion 350_1 and the second portion 350_2. That is, the MS-RGW 350 has two branches. Since an impedance is low in the two branches, impedance adjustment is performed by narrowing widths of an SIW 330 and the EBG-SIW 340. In each of areas (not illustrated) on the X-axis positive direction side and the X-axis negative direction side in the MS-RGW 350, one or more slots for radio wave emission are formed in the conductor substrate 220. As indicated by a solid line with an arrow in the figure, an electric field of a signal propagated from an MSL 310 is supplied to substantially a center of the MS-RGW 350 through the SIW 330 and the EBG-SIW 340 and is branched into two, and the electric field is propagated in both the X-axis positive direction and the X-axis negative direction (the left direction in the figure). By adopting the configuration in which central power feeding is performed in this manner, impedance characteristics can be further improved.(Sixth Embodiment)

[0044] Fig. 16 is a cross-sectional view of an antenna device 6000 as an electronic device according to a sixth embodiment of the present disclosure.

[0045] Fig. 17(A) is a back plan view of the antenna device 6000 of Fig. 16 as viewed from the Z-axis positive direction, and Fig. 17(B) is a top plan view of the antenna device 6000 of Fig. 16 as viewed from the Z-axis negative direction. However, conductor substrates 220 and 220A are not illustrated in Figs. 17(A) and 17(B).

[0046] The same reference numerals are given to the same or corresponding components as those in Figs. 12 and 13 used in the description of the fourth embodiment, and a detailed description thereof will be omitted. Hereinafter, differences from the fourth embodiment will be mainly described.

[0047] In the above-described fourth embodiment, the MS-RGW 350 is formed only on the X-axis negative direction side on the top surface side of the substrate, and propagation of an electric field is prevented by the EBG area on the X-axis positive direction side. That is, power has been fed from one side of the MS-RGW 350. In the sixth embodiment, an MS-RGW 350 is formed on both the X-axis positive direction side and the X-axis negative direction side, and power feeding (central power feeding) is performed generally to a center of the MS-RGW 350. "Substantially a center" described above is, for example, a center of the MS-RGW 350 or a position shifted by about a 1 / 4 wavelength from the center. That is, the MS-RGW 350 includes a first portion 350_1, a second portion 350_2, and a connection portion 350_3 between the first portion and the second portion, and the MS-RGW 350 is connected to an EBG-SIW 340 at the connection portion 350_3. An electric field input from the EBG-SIW 340 to the MS-RGW 350 through the connection portion 350_3 branches into the first portion 350_1 and the second portion 350_2, and propagates inside each of the first portion 350_1 and the second portion 350_2. In the present embodiment, the MS-RGW 350 has two branches. Since an impedance is low in the two branches, impedance adjustment is performed by narrowing widths of an SIW 330 and the EBG-SIW 340. In each of areas (not illustrated) on the X-axis positive direction side and the X-axis negative direction side in the MS-RGW 350, one or more slots for radio wave emission are formed in the conductor substrate 220. As indicated by a solid line with an arrow in the figure, an electric field is propagated through an MS-RGW 350A on the substrate back surface side and supplied to substantially a center (connection portion) of the MS-RGW 350 through the EBG-SIW 340A, the SIW 330, and the EBG-SIW 340, and is branched into two and propagated in both the X-axis positive direction and the X-axis negative direction. By adopting the configuration in which central power feeding is performed in this manner, impedance characteristics can be further improved.(Seventh Embodiment)

[0048] Fig. 18 is a block diagram of a radar device 7000 including an antenna device according to an embodiment of the present disclosure. The radar device 7000 is, as an example, a millimeter wave radar device.

[0049] The radar device 7000 includes an antenna device 1000_1 for transmission, an antenna device 1000_2 for reception, and a transmission / reception unit 800. The antenna devices 1000_1 and 1000_2 are the antenna devices 1000 according to the first embodiment described above. However, the antenna devices of the second to sixth embodiments may be used as the antenna device for transmission and the antenna device for reception. Although the antenna devices for transmission and reception are separately provided, one antenna device may be used for both transmission and reception. As an example, the radar device 7000 can be mounted on a movable vehicle such as an automobile or a movable device. However, the radar device 7000 may be provided in a fixedly installed device or system such as a fixedly installed monitoring device.

[0050] The transmission / reception unit 800 is a circuit that performs signal transmission processing and signal reception processing. The transmission / reception unit 800 includes the power supply circuit 230 described above. The transmission / reception unit 800 generates a signal for transmission, and supplies the signal to the antenna device 1000_1. In the antenna device 1000_1, a radio wave is propagated in the substrate on the basis of the fed signal, and the radio wave is emitted through a slot provided in the conductor substrate 220. When power is fed from the SIW 330 to the MS-RGW 350, an impedance is adjusted by the ridged EBG-SIW 340, and efficient transmission with a low loss is enabled. The antenna device 1000_2 receives a reflected wave of the emitted radio wave, propagates an electric field of the received signal in the substrate, and supplies the electric field to the transmission / reception unit 800 through the MSL 310. The transmission / reception unit 800 analyzes a state of a target on which the radio wave is reflected, a distance to the target, or the like, for example, on the basis of the reception signal.[Application Example]

[0051] Hereinafter, an application example of the antenna devices 1000 to 6000 will be described. The antenna devices 1000 to 6000 can also be applied to any of the following in-vehicle control system, device, method, and the like.<<1. Configuration Example of Vehicle Control System>>

[0052] Fig. 19 is a block diagram illustrating a configuration example of a vehicle control system 11, which is an example of a mobile device control system to which the present technology is applied. The antenna device according to the above-described embodiment can be used as, for example, an antenna in a case where a communication unit 22 performs wireless communication.

[0053] The vehicle control system 11 is installed in a vehicle 1, and performs processing related to travel assistance and automated driving of the vehicle 1.

[0054] The vehicle control system 11 includes a vehicle control electronic control unit (ECU) 21, the communication unit 22, a map information accumulation unit 23, a position information acquisition unit 24, an external recognition sensor 25, an in-vehicle sensor 26, a vehicle sensor 27, a storage unit 28, a travel assistance / automated driving control unit 29, a driver monitoring system (DMS) 30, a human machine interface (HMI) 31, and a vehicle control unit 32.

[0055] The vehicle control ECU 21, the communication unit 22, the map information accumulation unit 23, the position information acquisition unit 24, the external recognition sensor 25, the in-vehicle sensor 26, the vehicle sensor 27, the storage unit 28, the travel assistance / automated driving control unit 29, the driver monitoring system (DMS) 30, the human machine interface (HMI) 31, and the vehicle control unit 32 are mutually communicatively connected via a communication network 41. The communication network 41 includes, for example, an in-vehicle communication network, a bus, or the like conforming to a digital bidirectional communication standard such as a controller area network (CAN), a local interconnect network (LIN), a local area network (LAN), FlexRay (registered trademark), or Ethernet (registered trademark). The communication network 41 may be selectively used depending on a type of data to be transmitted. For example, the CAN may be applied to data related to vehicle control, and the Ethernet may be applied to large-volume data. Note that each component of the vehicle control system 11 may be directly connected using wireless communication assuming relatively short-range communication, such as short-range wireless communication (near field communication (NFC)) or Bluetooth (registered trademark), without using the communication network 41, for example.

[0056] Note that, hereinafter, in a case where each component of the vehicle control system 11 performs communication via the communication network 41, the description of the communication network 41 will be omitted. For example, in a case where the vehicle control ECU 21 and the communication unit 22 perform communication via the communication network 41, it will be simply described that the vehicle control ECU 21 and the communication unit 22 perform communication.

[0057] The vehicle control ECU 21 includes, for example, various processors such as a central processing unit (CPU) and a micro processing unit (MPU). The vehicle control ECU 21 controls all or some of functions of the vehicle control system 11.

[0058] The communication unit 22 communicates with various devices inside and outside of the vehicle, other vehicles, servers, base stations, and the like, and transmits and receives various types of data. At that time, the communication unit 22 can perform communication using a plurality of communication methods.

[0059] Communication with the outside of the vehicle executable by the communication unit 22 will be schematically described. The communication unit 22 communicates with a server (hereinafter referred to as external server) or the like present on an external network via a base station or an access point using a wireless communication method such as fifth generation mobile communication system (5G), long term evolution (LTE), or dedicated short range communications (DSRC), for example. Examples of the external network with which the communication unit 22 performs communication include the Internet, a cloud network, a company-specific network, or the like. A communication method performed by the communication unit 22 on the external network is not particularly limited as long as the method is a wireless communication method that allows digital bidirectional communication at a communication speed equal to or higher than a predetermined speed and over a distance equal to or longer than a predetermined distance.

[0060] Furthermore, for example, the communication unit 22 can communicate with a terminal present in the vicinity of an own vehicle using a peer to peer (P2P) technology. Examples of the terminal present in the vicinity of the own vehicle include a terminal attached to a mobile object moving at a relatively low speed such as a pedestrian or a bicycle, a terminal installed with a fixed position in a store or the like, or a machine type communication (MTC) terminal. Moreover, the communication unit 22 can also perform V2X communication. The V2X communication refers to communication between the own vehicle and another vehicle, such as vehicle to vehicle communication with another vehicle, vehicle to infrastructure communication with a roadside device or the like, vehicle to home communication with home, and vehicle to pedestrian communication with a terminal or the like carried by a pedestrian, for example.

[0061] The communication unit 22 can receive a program for updating software that controls an operation of the vehicle control system 11 from the outside (Over The Air), for example. The communication unit 22 can further receive map information, traffic information, information regarding the surroundings of the vehicle 1, and the like from the outside. Furthermore, the communication unit 22 can transmit information regarding the vehicle 1, information regarding the surroundings of the vehicle 1, and the like to the outside, for example. Examples of the information regarding the vehicle 1 transmitted to the outside by the communication unit 22 include data indicating a state of the vehicle 1, a recognition result from a recognition unit 73, and the like. Moreover, for example, the communication unit 22 performs communication corresponding to a vehicle emergency call system such as an eCall.

[0062] For example, the communication unit 22 receives an electromagnetic wave transmitted by Vehicle Information and Communication System (VICS) (registered trademark), such as a radio beacon, an optical beacon, or FM multiplex broadcasting.

[0063] Communication with the inside of the vehicle executable by the communication unit 22 will be schematically described. The communication unit 22 can communicate with each device in the vehicle using wireless communication, for example. The communication unit 22 can perform wireless communication with a device in the vehicle using a communication method that allows digital bidirectional communication at a communication speed equal to or higher than a predetermined speed by wireless communication, such as wireless LAN, Bluetooth, NFC, or wireless USB (WUSB), for example. The present disclosure is not limited thereto, and the communication unit 22 can also communicate with each device in the vehicle using wired communication. For example, the communication unit 22 can communicate with each device in the vehicle using wired communication via a cable connected to a connection terminal which is not illustrated. The communication unit 22 can communicate with each device in the vehicle using a communication method that allows digital bidirectional communication at a communication speed equal to or higher than a predetermined speed by wired communication, such as a universal serial bus (USB), high-definition multimedia interface (HDMI) (registered trademark), or a mobile high-definition link (MHL), for example.

[0064] Here, the device in the vehicle refers to, for example, a device that is not connected to the communication network 41 in the vehicle. As the device in the vehicle, for example, a mobile device or a wearable device carried by an occupant such as a driver, an information device brought into the vehicle and temporarily installed, or the like is assumed.

[0065] The map information accumulation unit 23 accumulates either or both of a map acquired from the outside and a map created by the vehicle 1. For example, the map information accumulation unit 23 accumulates a three-dimensional high-precision map, a global map that is lower in precision but wider in covering area than the high-precision map, and the like.

[0066] Examples of the high-precision map include a dynamic map, a point cloud map, a vector map, and the like. The dynamic map is a map including four layers: dynamic information, semi-dynamic information, semistatic information, and static information, and is provided to the vehicle 1 from the external server or the like, for example. The point cloud map is a map including a point cloud (point cloud data). The vector map is, for example, a map obtained by associating traffic information such as lanes and positions of traffic lights, and the like with the point cloud map, and adapting the associated point cloud map to an advanced driver assistance system (ADAS) or autonomous driving (AD).

[0067] The point cloud map and the vector map may be provided from, for example, the external server or the like, or may be created by the vehicle 1 as a map for matching with a local map to be described later on the basis of a sensing result from a camera 51, a radar 52, a LiDAR 53, or the like, and may be accumulated in the map information accumulation unit 23. Alternatively, in a case where the high-precision map is provided from the external server or the like, to reduce the communication volume, map data covering several hundred square meters regarding a planned route that the vehicle 1 will follow is acquired from the external server or the like, for example.

[0068] The position information acquisition unit 24 receives a global navigation satellite system (GNSS) signal from a GNSS satellite, and acquires position information of the vehicle 1. The acquired position information is supplied to the travel assistance / automated driving control unit 29. Note that the position information acquisition unit 24 may acquire the position information by using a beacon, for example, without being limited to a method using the GNSS signal.

[0069] The external recognition sensor 25 includes various sensors that are used to recognize conditions outside the vehicle 1, and supplies sensor data from each sensor to each component of the vehicle control system 11. Types and the numbers of the sensors included in the external recognition sensor 25 are optionally determined.

[0070] For example, the external recognition sensor 25 includes the camera 51, the radar 52, the light detection and ranging or laser imaging detection and ranging (LiDAR) 53, and an ultrasonic sensor 54. The present disclosure is not limited thereto, the external recognition sensor 25 may include at least one of the camera 51, the radar 52, the LiDAR 53, or the ultrasonic sensor 54. The numbers of cameras 51, radars 52, LiDARs 53, and ultrasonic sensors 54 are not particularly limited as long as they can be practically installed in the vehicle 1. Furthermore, the types of sensors included in the external recognition sensor 25 are not limited to this example, and the external recognition sensor 25 may include sensors of other types. An example of a sensing area of each sensor included in the external recognition sensor 25 will be described later.

[0071] Note that an imaging method of the camera 51 is not particularly limited. For example, cameras adapted to various imaging methods such as a time of flight (ToF) camera, a stereo camera, a monocular camera, and an infrared camera, which are imaging methods capable of performing distance measurement, can be applied to the camera 51 as necessary. The present disclosure is not limited thereto, and the camera 51 may be a camera for simply acquiring a captured image without distance measurement.

[0072] Furthermore, for example, the external recognition sensor 25 can include an environment sensor for detecting the environment around the vehicle 1. The environment sensor is a sensor for detecting an environment such as weather, climate, and brightness, and can include, for example, various sensors such as a raindrop sensor, a fog sensor, a sunshine sensor, a snow sensor, and an illuminance sensor.

[0073] Moreover, for example, the external recognition sensor 25 includes a microphone used for detecting sounds around the vehicle 1, the location of sound sources, and the like.

[0074] The in-vehicle sensor 26 includes various sensors for detecting information regarding the inside of the vehicle, and supplies sensor data from each sensor to each component of the vehicle control system 11. The type and number of the various sensors included in the in-vehicle sensor 26 are not particularly limited as long as they can be practically installed in the vehicle 1.

[0075] For example, the in-vehicle sensor 26 can include one or more types of sensors among a camera, a radar, a seating sensor, a steering wheel sensor, a microphone, and a biometric sensor. As the camera included in the in-vehicle sensor 26, for example, cameras adapted to various imaging methods that allow distance measurement, such as a ToF camera, a stereo camera, a monocular camera, and an infrared camera, can be used. The present disclosure is not limited thereto, and the camera included in the in-vehicle sensor 26 may be a camera for simply acquiring a captured image without distance measurement. For example, the biometric sensor included in the in-vehicle sensor 26 is provided to a seat, a steering wheel, or the like, and detects various types of biometric information regarding an occupant such as a driver.

[0076] The vehicle sensor 27 includes various sensors for detecting the state of the vehicle 1, and supplies sensor data from each sensor to each component of the vehicle control system 11. The type and number of the various sensors included in the vehicle sensor 27 are not particularly limited as long as they can be practically installed in the vehicle 1.

[0077] For example, the vehicle sensor 27 includes a speed sensor, an acceleration sensor, an angular velocity sensor (gyro sensor), and an inertial measurement unit (IMU) obtained by integrating these sensors. For example, the vehicle sensor 27 includes a steering angle sensor that detects a steering angle of a steering wheel, a yaw rate sensor, an accelerator sensor that detects an operation amount of an accelerator pedal, and a brake sensor that detects an operation amount of a brake pedal. For example, the vehicle sensor 27 includes a rotation sensor that detects the number of rotations of an engine or a motor, an air pressure sensor that detects an air pressure of a tire, a slip rate sensor that detects a slip rate of the tire, and a wheel speed sensor that detects a rotation speed of a wheel. For example, the vehicle sensor 27 includes a battery sensor that detects a battery level and a battery temperature, and an impact sensor that detects external impact.

[0078] The storage unit 28 includes at least one of a nonvolatile storage medium or a volatile storage medium, and stores data and a program. The storage unit 28 is used as, for example, an electrically erasable programmable read only memory (EEPROM) and a random access memory (RAM), and a magnetic storage device such as a hard disc drive (HDD), a semiconductor storage device, an optical storage device, and a magneto-optical storage device can be applied as a storage medium. The storage unit 28 stores various programs and data to be used by each component of the vehicle control system 11. For example, the storage unit 28 includes an event data recorder (EDR) and a data storage system for automated driving (DSSAD), and stores information regarding the vehicle 1 before and after an event such as an accident, and information acquired by the in-vehicle sensor 26.

[0079] The travel assistance / automated driving control unit 29 controls travel assistance and automated driving of the vehicle 1. For example, the travel assistance / automated driving control unit 29 includes an analysis unit 61, an action planning unit 62, and an operation control unit 63.

[0080] The analysis unit 61 performs analysis processing on the vehicle 1 and conditions around the vehicle. The analysis unit 61 includes a self-position estimation unit 71, a sensor fusion unit 72, and the recognition unit 73.

[0081] The self-position estimation unit 71 estimates the self-position of the vehicle 1 on the basis of sensor data from the external recognition sensor 25 and the high-precision map accumulated in the map information accumulation unit 23. For example, the self-position estimation unit 71 generates a local map on the basis of sensor data from the external recognition sensor 25, and performs matching between the local map and the high-precision map to estimate the self-position of the vehicle 1. The position of the vehicle 1 is based on, for example, the center of an axle between rear wheels.

[0082] Examples of the local map include a three-dimensional high-precision map created by using a technology such as simultaneous localization and mapping (SLAM), an occupancy grid map, and the like. Examples of the three-dimensional high-precision map include the above-described point cloud map and the like. The occupancy grid map is a map in which a three-dimensional or two-dimensional space around the vehicle 1 is divided into grids of a predetermined size, and an occupancy state of an object is indicated in units of grids. The occupancy state of the object is indicated by the presence or absence, or existence probability of the object, for example. The local map is also used for detection processing and recognition processing performed on the conditions outside the vehicle 1 by the recognition unit 73, for example.

[0083] Note that the self-position estimation unit 71 may estimate the self-position of the vehicle 1 on the basis of the position information acquired by the position information acquisition unit 24 and the sensor data from the vehicle sensor 27.

[0084] The sensor fusion unit 72 performs sensor fusion processing of combining a plurality of different types of sensor data (for example, image data supplied from the camera 51 and sensor data supplied from the radar 52), to obtain new information. Methods for combining different types of sensor data include integration, fusion, association, and the like.

[0085] The recognition unit 73 performs the detection processing on the conditions outside the vehicle 1 and the recognition processing on the conditions outside the vehicle 1.

[0086] For example, the recognition unit 73 performs the detection processing and recognition processing on the conditions outside the vehicle 1 on the basis of information from the external recognition sensor 25, information from the self-position estimation unit 71, information from the sensor fusion unit 72, and the like.

[0087] Specifically, for example, the recognition unit 73 performs detection processing, recognition processing, and the like on an object around the vehicle 1. The object detection processing is, for example, processing of detecting the presence or absence, size, shape, position, motion, and the like of an object. The recognition processing of the object is, for example, processing of recognizing an attribute such as a type of the object or identifying a specific object. Note that the detection processing and the recognition processing are not necessarily clearly separated and may overlap.

[0088] For example, the recognition unit 73 detects an object around the vehicle 1 by performing clustering to classify point clouds based on sensor data from the radar 52, the LiDAR 53, or the like into clusters of point clouds. This allows for the detection of the presence or absence, size, shape, and position of the object around the vehicle 1.

[0089] For example, the recognition unit 73 detects the motion of the object around the vehicle 1 by performing tracking to follow the motion of the cluster of point clouds classified by clustering. This allows for the detection of the speed and traveling direction (movement vector) of the object around the vehicle 1.

[0090] For example, the recognition unit 73 detects or recognizes a vehicle, a person, a bicycle, an obstacle, a structure, a road, a traffic light, a traffic sign, a road sign, and the like, on the basis of image data supplied from the camera 51. Furthermore, the recognition unit 73 may recognize the type of the object around the vehicle 1 by performing recognition processing such as semantic segmentation.

[0091] For example, the recognition unit 73 can perform recognition processing on traffic rules around the vehicle 1 on the basis of the map accumulated in the map information accumulation unit 23, the result of estimating the self-position from the self-position estimation unit 71, and the result of recognizing the object around the vehicle 1 from the recognition unit 73. Through this processing, the recognition unit 73 can recognize positions and states of traffic lights, details of traffic signs and road signs, details of traffic regulations, travelable lanes, and the like.

[0092] For example, the recognition unit 73 can perform recognition processing on a surrounding environment of the vehicle 1. As the environment around to be recognized by the recognition unit 73, weather, temperature, humidity, brightness, a state of a road surface, and the like are assumed.

[0093] The action planning unit 62 creates an action plan of the vehicle 1. For example, the action planning unit 62 creates the action plan by performing processing of path planning and path following.

[0094] Note that the path planning (global path planning) is processing of planning a rough path from a start to a goal. This path planning further includes processing, called a local path planning, of generating, within the planned path, a local path in the vicinity of the vehicle 1 that allows the vehicle 1 to travel safely and smoothly in consideration of the motion characteristics of the vehicle 1.

[0095] The path following is processing of planning operations for safe and accurate travelling along the path planned by the path planning within a planned time. For example, the action planning unit 62 can calculate a target speed and a target angular velocity of the vehicle 1, on the basis of the result of the path following processing.

[0096] The operation control unit 63 controls operations of the vehicle 1 to achieve the action plan created by the action planning unit 62.

[0097] For example, the operation control unit 63 controls a steering control unit 81, a brake control unit 82, and a drive control unit 83 included in the vehicle control unit 32 to be described later for acceleration and deceleration control and direction control to make the vehicle 1 follow the path calculated by the local path planning. For example, the operation control unit 63 performs coordinated control to achieve ADAS functions such as collision avoidance or impact mitigation, follow driving, speed maintenance driving, collision warning for the host vehicle, lane departure warning for the host vehicle, and the like. For example, the operation control unit 63 performs coordinated control to achieve automated driving or the like for autonomous travelling without depending on an operation by a driver.

[0098] The DMS 30 performs authentication processing on a driver, recognition processing on a state of the driver, and the like on the basis of sensor data from the in-vehicle sensor 26, input data input to the HMI 31 to be described later, and the like. As the state of the driver to be recognized, for example, a physical condition, an alertness level, a concentration level, a fatigue level, a line-of-sight direction, a drunkenness level, a driving operation, a posture, and the like are assumed.

[0099] Note that the DMS 30 may perform authentication processing on an occupant other than the driver, and recognition processing on a state of the occupant. Furthermore, for example, the DMS 30 may perform recognition processing on a situation in the vehicle on the basis of the sensor data from the in-vehicle sensor 26. As the situation in the vehicle to be recognized, for example, temperature, humidity, brightness, odor, and the like are assumed.

[0100] The HMI 31 receives input of various types of data, instructions, or the like, and presents various types of data to a driver or the like.

[0101] The input of data through the HMI 31 will be schematically described. The HMI 31 includes an input device for a person to input data. The HMI 31 generates an input signal on the basis of data, an instruction, or the like that has been input through the input device, and supplies the input signal to each component of the vehicle control system 11. The HMI 31 includes, for example, an operation element such as a touch panel, a button, a switch, and a lever as the input device. The present disclosure is not limited thereto, and the HMI 31 may further include an input device capable of inputting information by a method such as sound or a gesture other than manual operation. Moreover, the HMI 31 may use, for example, a remote control device using infrared rays or radio waves, or an external connection device such as a mobile device or a wearable device adapted to an operation of the vehicle control system 11, as the input device.

[0102] The presentation of data by the HMI 31 will be schematically described. The HMI 31 generates visual information, auditory information, and haptic information for an occupant or the outside of the vehicle. Furthermore, the HMI 31 performs output control for controlling the output, output content, output timing, output method, and the like of each piece of generated information. The HMI 31 generates and outputs, as the visual information, information indicated by images or light, such as an operation screen, a display of the state of the vehicle 1, a warning display, and a monitor image indicating the conditions around the vehicle 1, for example. Furthermore, the HMI 31 generates and outputs, as the auditory information, information indicated by sounds, such as voice guidance, a warning sound, and a warning message, for example. Moreover, the HMI 31 generates and outputs, for example, information to be given to a tactile sense of the occupant by force, vibration, motion, or the like, as the haptic information.

[0103] As an output device from which the HMI 31 outputs the visual information, for example, a display device that presents the visual information by displaying an image by itself or a projector device that presents the visual information by projecting an image can be applied. Note that the display device may be a device that displays the visual information in the field of view of the occupant, such as a head-up display, a transparent display, or a wearable device having an augmented reality (AR) function, for example, other than a display device having a normal display. Furthermore, in the HMI 31, a display device included in a navigation device, an instrument panel, a camera monitoring system (CMS), an electronic mirror, a lamp, or the like provided in the vehicle 1 can also be used as the output device that outputs the visual information.

[0104] As an output device from which the HMI 31 outputs the auditory information, for example, an audio speaker, headphones, or earphones can be applied.

[0105] As an output device from which the HMI 31 outputs the haptic information, for example, a haptic element using a haptic technology can be applied. The haptic element is provided, for example, at a portion of the vehicle 1 with which the occupant comes into contact, such as the steering wheel or the seat.

[0106] The vehicle control unit 32 controls each component of the vehicle 1. The vehicle control unit 32 includes the steering control unit 81, the brake control unit 82, the drive control unit 83, a body system control unit 84, a light control unit 85, and a horn control unit 86.

[0107] The steering control unit 81 performs detection, control, and the like of the state of a steering system of the vehicle 1. The steering system includes, for example, a steering mechanism including a steering wheel and the like, an electric power steering, and the like. The steering control unit 81 includes, for example, a steering ECU that controls the steering system, an actuator that drives the steering system, and the like.

[0108] The brake control unit 82 performs detection, control, and the like of the state of a brake system of the vehicle 1. The brake system includes, for example, a brake mechanism including a brake pedal and the like, an antilock brake system (ABS), a regenerative brake mechanism, and the like. The brake control unit 82 includes, for example, a brake ECU that controls the brake system, an actuator that drives the brake system, and the like.

[0109] The drive control unit 83 performs detection, control, and the like of the state of a drive system of the vehicle 1. The drive system includes, for example, an accelerator pedal, a driving force generation device for generating a driving force such as an internal combustion engine or a driving motor, a driving force transmission mechanism for transmitting the driving force to wheels, and the like. The drive control unit 83 includes, for example, a drive ECU that controls the drive system, an actuator that drives the drive system, and the like.

[0110] The body system control unit 84 performs detection, control, and the like of the state of a body system of the vehicle 1. The body system includes, for example, a keyless entry system, a smart key system, a power window device, a power seat, an HVAC system, an airbag, a seat belt, a shift lever, and the like. The body system control unit 84 includes, for example, a body system ECU that controls the body system, an actuator that drives the body system, and the like.

[0111] The light control unit 85 performs detection, control, and the like of the states of various lights of the vehicle 1. Possible examples of the lights to be controlled include a headlight, a backup light, a fog light, a turn signal, a brake light, a projection light, a bumper indicator, and the like. The light control unit 85 includes a light ECU that controls the lights, an actuator that drives the lights, and the like.

[0112] The horn control unit 86 performs detection, control, and the like of the state of a car horn of the vehicle 1. The horn control unit 86 includes, for example, a horn ECU that controls the car horn, an actuator that drives the car horn, and the like.

[0113] Fig. 20 is a view illustrating an example of a sensing area by the camera 51, the radar 52, the LiDAR 53, and the ultrasonic sensor 54 of the external recognition sensor 25 in Fig. 19. Note that Fig. 20 schematically illustrates the vehicle 1 as viewed from above, where a left end side is the front end (front) side of the vehicle 1 and a right end side is the rear end (rear) side of the vehicle 1.

[0114] A sensing area 101F and a sensing area 101B indicate examples of the sensing area of the ultrasonic sensor 54. The sensing area 101F covers an area around the front end of the vehicle 1 with a plurality of the ultrasonic sensors 54. The sensing area 101B covers an area around the rear end of the vehicle 1 with a plurality of the ultrasonic sensors 54.

[0115] Sensing results in the sensing area 101F and the sensing area 101B are used for parking assistance for the vehicle 1, and the like, for example.

[0116] Sensing areas 102F to 102B indicate examples of the sensing area of the short-range or mid-range radar 52. The sensing area 102F covers an area extending farther than the sensing area 101F in front of the vehicle 1. The sensing area 102B covers an area extending farther than the sensing area 101B behind the vehicle 1. The sensing area 102L covers an area around the rear left side of the vehicle 1. The sensing area 102R covers an area around the rear right side of the vehicle 1.

[0117] A sensing result in the sensing area 102F is used for detection of a vehicle, a pedestrian, or the like present in front of the vehicle 1, and the like, for example. A sensing result in the sensing area 102B is used for a rear collision prevention function of the vehicle 1, and the like, for example. Sensing results in the sensing area 102L and the sensing area 102R are used for detection of an object in a blind spot on the sides of the vehicle 1, and the like, for example.

[0118] Sensing areas 103F to 103B indicate examples of the sensing area by the camera 51. The sensing area 103F covers an area extending farther than the sensing area 102F in front of the vehicle 1. The sensing area 103B covers an area extending farther than the sensing area 102B behind the vehicle 1. The sensing area 103L covers an area around the left side of the vehicle 1. The sensing area 103R covers an area around the right side of the vehicle 1.

[0119] A sensing result in the sensing area 103F can be used for, for example, recognition of a traffic light or a traffic sign, a lane departure prevention assistance system, and an automated headlight control system. A sensing result in the sensing area 103B can be used for, for example, parking assistance and a surround view system. Sensing results in the sensing areas 103L and 103R can be used for, for example, the surround view system.

[0120] A sensing area 104 indicates an example of the sensing area of the LiDAR 53. The sensing area 104 covers an area extending farther than the sensing area 103F in front of the vehicle 1. On the other hand, the sensing area 104 has a narrower range in a left-right direction than that of the sensing area 103F.

[0121] A sensing result in the sensing area 104 is used for, for example, detection of an object such as a vehicle around.

[0122] A sensing area 105 indicates an example of the sensing area of the long-range radar 52.

[0123] The sensing area 105 covers an area extending farther than the sensing area 104 in front of the vehicle 1. On the other hand, the sensing area 105 has a narrower range in the left-right direction than that of the sensing area 104.

[0124] A sensing result in the sensing area 105 is used for, for example, adaptive cruise control (ACC), emergency braking, collision avoidance, or the like.

[0125] Note that the respective sensing areas of the sensors: the camera 51; the radar 52; the LiDAR 53; and the ultrasonic sensor 54, included in the external recognition sensor 25 may have various configurations other than those in Fig. 20. Specifically, the ultrasonic sensor 54 may also perform sensing on the sides of the vehicle 1, or the LiDAR 53 may perform sensing on the rear side of the vehicle 1. Furthermore, the installation position of each sensor is not limited to the above-described example. Furthermore, the number of each sensor may be one or more.

[0126] The present disclosure can be applied to the radar 52. Note that the present invention is not limited to the embodiments described above as it is, and can be embodied by modifying the components without departing from the gist thereof in the implementation stage. Furthermore, various inventions can be formed by appropriately combining the plurality of components disclosed in the embodiments described above. For example, some components may be deleted from all the components illustrated in the embodiments. Moreover, the components of different embodiments may be appropriately combined.

[0127] Furthermore, the effects of the present disclosure described in the present specification are merely an example, and other effects may be achieved.

[0128] Note that, the present disclosure can also have the following configurations.[Item 1]

[0129] An electronic device including: a dielectric substrate; and a first conductor substrate arranged to face the dielectric substrate, in which the dielectric substrate includes: a first dielectric waveguide formed by first and second ground conductors and a plurality of vias; and a second dielectric waveguide formed by a plurality of electromagnetic band gap elements and electromagnetically connected to the first dielectric waveguide, and a first microstrip-ridge gap waveguide electromagnetically connected to the second dielectric waveguide is formed between the dielectric substrate and the first conductor substrate. [Item 2]

[0130] The electronic device according to Item 1, in which the dielectric substrate includes a transmission line configured to propagate an electric field based on a signal generated by a power supply circuit, and the transmission line is electromagnetically connected to the first dielectric waveguide on a side opposite to a side of the first dielectric waveguide to which the second dielectric waveguide is connected. [Item 3]

[0131] The electronic device according to Item 2, in which the transmission line includes a slot, and is electromagnetically connected to the first dielectric waveguide at the slot, and a connection portion between the first dielectric waveguide and the second dielectric waveguide does not overlap with the slot in a direction parallel to the dielectric substrate. [Item 4]

[0132] The electronic device according to any one of Items 1 to 3, in which the dielectric substrate further includes a third dielectric waveguide formed by a plurality of electromagnetic band gap elements and electromagnetically connected to the first dielectric waveguide, on a side opposite to a side of the first dielectric waveguide to which the second dielectric waveguide is connected, the electronic device includes a second conductor substrate arranged to face the dielectric substrate on a side opposite to a side on which the first conductor substrate is arranged, and a second microstrip-ridge gap waveguide electromagnetically connected to the third dielectric waveguide is formed between the dielectric substrate and the second conductor substrate. [Item 5]

[0133] The electronic device according to any one of Items 1 to 4, in which the first microstrip-ridge gap waveguide includes a first portion, a second portion, and a connection portion between the first portion and the second portion, the first microstrip-ridge gap waveguide is connected to the second dielectric waveguide at the connection portion, and an electric field that is input from the second dielectric waveguide to the first microstrip-ridge gap waveguide through the connection portion branches into the first portion and the second portion, and propagates inside each of the first portion and the second portion. [Item 6]

[0134] The electronic device according to Item 4, in which the first microstrip-ridge gap waveguide and the second microstrip-ridge gap waveguide are arranged such that a propagation direction of an electric field in the first microstrip-ridge gap waveguide and a propagation direction of an electric field in the second microstrip-ridge gap waveguide are opposite to each other in a direction parallel to the dielectric substrate at a time of transmission or reception.[Item 7]

[0135] The electronic device according to Item 4, in which the first microstrip-ridge gap waveguide and the second microstrip-ridge gap waveguide are arranged such that a propagation direction of an electric field in the first microstrip-ridge gap waveguide and a propagation direction of an electric field in the second microstrip-ridge gap waveguide are same as each other in a direction parallel to the dielectric substrate at a time of transmission or reception.[Item 8]

[0136] The electronic device according to Item 2 or 3, in which the transmission line and the first microstrip-ridge gap waveguide are arranged such that a propagation direction of an electric field in the transmission line and a propagation direction of an electric field in the first microstrip-ridge gap waveguide are opposite to each other in a direction parallel to the dielectric substrate at a time of transmission or reception.[Item 9]

[0137] The electronic device according to Item 2 or 3, in which the transmission line and the first microstrip-ridge gap waveguide are arranged such that a propagation direction of an electric field in the transmission line and a propagation direction of an electric field in the first microstrip-ridge gap waveguide are same as each other in a direction parallel to the dielectric substrate at a time of transmission or reception.[Item 10]

[0138] The electronic device according to Item 2 or 3, in which the first microstrip-ridge gap waveguide includes a first portion, a second portion, and a connection portion between the first portion and the second portion, the first microstrip-ridge gap waveguide is connected to the second dielectric waveguide at the connection portion, and an electric field that is input from the second dielectric waveguide to the first microstrip-ridge gap waveguide through the connection portion branches into the first portion and the second portion, and propagates inside each of the first portion and the second portion. [Item 11]

[0139] The electronic device according to any one of Items 2, 3, 8, and 9, in which the transmission line is a microstrip line.[Item 12]

[0140] The electronic device according to any one of Items 1 to 11, in which the first conductor substrate is an antenna substrate including a slot that emits a radio wave based on an electric field propagated by the first microstrip-ridge gap waveguide.[Item 13]

[0141] A radar device including: an antenna device; and a transmission / reception unit configured to transmit or receive a signal by using the antenna device, in which the antenna device includes: a dielectric substrate; and a first conductor substrate arranged to face the dielectric substrate, the dielectric substrate includes: a first dielectric waveguide formed by first and second ground conductors and a plurality of vias; and a second dielectric waveguide formed by a plurality of electromagnetic band gap elements and electromagnetically connected to the first dielectric waveguide, a first microstrip-ridge gap waveguide electromagnetically connected to the second dielectric waveguide is formed between the dielectric substrate and the first conductor substrate, and the first conductor substrate includes an antenna substrate including a slot that emits a radio wave based on an electric field propagated by the first microstrip-ridge gap waveguide. REFERENCE SIGNS LIST

[0142] 1Vehicle 11Vehicle system 21Vehicle control electronic control unit (ECU) 22Communication unit 23Map information accumulation unit 24Position information acquisition unit 25External recognition sensor 26In-vehicle sensor 27Vehicle sensor 28Storage unit 29Travel assistance / automated driving control unit 30Driver monitoring system (DMS) 31Human machine interface (HMI) 32Vehicle control unit 41Communication network 50Ground conductor 51Camera 52Radar 53LiDAR 54Ultrasonic sensor 60Conductor piece 61Analysis unit 62Action planning unit 63Operation control unit 71Self-position estimation unit 72Sensor fusion unit 73Recognition unit 81Steering control unit 82Brake control unit 83Drive control unit 70Conductor piece 90Ground conductor 91Conductor piece 101BSensing area 101FSensing area 102BSensing area 102FSensing area 102LSensing area 102RSensing area 103BSensing area 103FSensing area 103LSensing area 103RSensing area 104Sensing area 105Sensing area 110Via 130Via 140Via 140AVia 140BVia 140CVia 190Slot (opening portion) 190Slot 191Slot 192Slot 210Dielectric substrate 220Conductor substrate 220AConductor substrate 230Power supply circuit 240Air layer 240AAir layer 310Transmission line 320EBG element 321Via 330EBG-SIW 340EBG-SIW 340AEBG-SIW 350MS-RGW 350AMS-RGW 360Probe 370EBG area 800Transmission / reception unit 900Transmission / reception unit 1000Antenna device 1000_1Antenna device 1000_2Antenna device 2000Antenna device 3000Antenna device 4000Antenna device 5000Antenna device 6000Antenna device 7000Radar device OP1Opening portion OP2Opening portion

Claims

1. An electronic device comprising: a dielectric substrate; and a first conductor substrate arranged to face the dielectric substrate, wherein the dielectric substrate includes: a first dielectric waveguide formed by first and second ground conductors and a plurality of vias; and a second dielectric waveguide formed by a plurality of electromagnetic band gap elements and electromagnetically connected to the first dielectric waveguide, and a first microstrip-ridge gap waveguide electromagnetically connected to the second dielectric waveguide is formed between the dielectric substrate and the first conductor substrate.

2. The electronic device according to claim 1, wherein the dielectric substrate includes a transmission line configured to propagate an electric field based on a signal generated by a power supply circuit, and the transmission line is electromagnetically connected to the first dielectric waveguide on a side opposite to a side of the first dielectric waveguide to which the second dielectric waveguide is connected.

3. The electronic device according to claim 2, wherein the transmission line includes a slot, and is electromagnetically connected to the first dielectric waveguide at the slot, and a connection portion between the first dielectric waveguide and the second dielectric waveguide does not overlap with the slot in a direction parallel to the dielectric substrate.

4. The electronic device according to claim 1, wherein the dielectric substrate further includes a third dielectric waveguide formed by a plurality of electromagnetic band gap elements and electromagnetically connected to the first dielectric waveguide, on a side opposite to a side of the first dielectric waveguide to which the second dielectric waveguide is connected, the electronic device includes a second conductor substrate arranged to face the dielectric substrate on a side opposite to a side on which the first conductor substrate is arranged, and a second microstrip-ridge gap waveguide electromagnetically connected to the third dielectric waveguide is formed between the dielectric substrate and the second conductor substrate.

5. The electronic device according to claim 1, wherein the first microstrip-ridge gap waveguide includes a first portion, a second portion, and a connection portion between the first portion and the second portion, the first microstrip-ridge gap waveguide is connected to the second dielectric waveguide at the connection portion, and an electric field that is input from the second dielectric waveguide to the first microstrip-ridge gap waveguide through the connection portion branches into the first portion and the second portion, and propagates inside each of the first portion and the second portion.

6. The electronic device according to claim 4, wherein the first microstrip-ridge gap waveguide and the second microstrip-ridge gap waveguide are arranged such that a propagation direction of an electric field in the first microstrip-ridge gap waveguide and a propagation direction of an electric field in the second microstrip-ridge gap waveguide are opposite to each other in a direction parallel to the dielectric substrate at a time of transmission or reception.

7. The electronic device according to claim 4, wherein the first microstrip-ridge gap waveguide and the second microstrip-ridge gap waveguide are arranged such that a propagation direction of an electric field in the first microstrip-ridge gap waveguide and a propagation direction of an electric field in the second microstrip-ridge gap waveguide are same as each other in a direction parallel to the dielectric substrate at a time of transmission or reception.

8. The electronic device according to claim 2, wherein the transmission line and the first microstrip-ridge gap waveguide are arranged such that a propagation direction of an electric field in the transmission line and a propagation direction of an electric field in the first microstrip-ridge gap waveguide are opposite to each other in a direction parallel to the dielectric substrate at a time of transmission or reception.

9. The electronic device according to claim 2, wherein the transmission line and the first microstrip-ridge gap waveguide are arranged such that a propagation direction of an electric field in the transmission line and a propagation direction of an electric field in the first microstrip-ridge gap waveguide are same as each other in a direction parallel to the dielectric substrate at a time of transmission or reception.

10. The electronic device according to claim 2, wherein the first microstrip-ridge gap waveguide includes a first portion, a second portion, and a connection portion between the first portion and the second portion, the first microstrip-ridge gap waveguide is connected to the second dielectric waveguide at the connection portion, and an electric field that is input from the second dielectric waveguide to the first microstrip-ridge gap waveguide through the connection portion branches into the first portion and the second portion, and propagates inside each of the first portion and the second portion.

11. The electronic device according to claim 2, wherein the transmission line includes a microstrip line.

12. The electronic device according to claim 1, wherein the first conductor substrate includes an antenna substrate including a slot that emits a radio wave based on an electric field propagated by the first microstrip-ridge gap waveguide.

13. A radar device comprising: an antenna device; and a transmission / reception unit configured to transmit or receive a signal by using the antenna device, wherein the antenna device includes: a dielectric substrate; and a first conductor substrate arranged to face the dielectric substrate, the dielectric substrate includes: a first dielectric waveguide formed by first and second ground conductors and a plurality of vias; and a second dielectric waveguide formed by a plurality of electromagnetic band gap elements and electromagnetically connected to the first dielectric waveguide, a first microstrip-ridge gap waveguide electromagnetically connected to the second dielectric waveguide is formed between the dielectric substrate and the first conductor substrate, and the first conductor substrate includes an antenna substrate including a slot that emits a radio wave based on an electric field propagated by the first microstrip-ridge gap waveguide.

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