Conductive composition, electrically debonding adhesive system, and related methods

Abstract

A primer composition includes solvent, electrically conductive filler dispersed in the solvent, and a polymer at least one of dissolved or dispersed in the solvent. The polymer includes at least one of a polyurethane, polyacrylate, a polyamide, or a rubber. An adhesive system includes the electrically conductive composition and an electrically debonding adhesive including an ionic liquid. The use of the primer composition as a primer on an electrically nonconductive substrate in combination with an electrically debonding adhesive is also described. A method of making a bonded article and an article bonded with the adhesive system disclosed herein and / or made by the method disclosed herein are also described.

Description

CONDUCTIVE COMPOSITION, ELECTRICALLY DEBONDING ADHESIVE SYSTEM, ANDRELATED METHODSBACKGROUNDIn electronic devices, particularly mobile electronic devices (e.g., hand-held, or wearable electronic devices), various adhesives such as pressure-sensitive adhesives are used to bond the cover glass (or lens) to the underlying display module, bond the touch sensor to the cover glass and display, or bond the lower components of the display to the housing. The selected adhesive typically should have sufficiently high adhesive strength to properly maintain good adhesion to those components, not only when the mobile electronic devices are operating under normal conditions, but also when they are subjected to traumatic forces (e.g., when impacted and / or dropped onto a hard surface).Further, new adhesives are needed for electronic devices that can perform well during the lifetime of the devices but that can be removed (e.g., de-bonded) from the electronic components after the useful lifetime of the device or to repair the device to extend its useful lifetime. Clean removal of the adhesives is useful so that the electronic components can be reused or recycled, or so that the electronic device can be repaired.In unrelated technologies, some electrically conductive primers are reported in U.S. Pat. Nos. 4,971,727 (Takahashi et al.), 5,478,676 (Turi et al.), 6,689,457 (Chang et al.), Japanese Pat. No. JP4087888, published June 28, 2007, Chinese Pat. No. CN110591483, published September 25, 2019, and Korean Pat. No. KR10-0350079, published December 24, 1999.In further unrelated technologies, U.S. Pat. No. 10,640,656 (Moren et al.) describes a primer composition that can provide adhesion between a wide variety of substrates and double-sided tapes, for example. U.S. Pat. Nos. 5,602,202 (Groves), 5,677,376 (Groves), 9,234,122 (Schumann et al.), 9,080,083 (Schumann et al.), and 10,513,634 (Dietze et al.) and U.S. Pat. Appl. Pub. Nos. 2014 / 0113070 (Schumann et al.), 2017 / 0066947 (Dietze et al.), and 2017 / 0298230 (Schumann et al.) describe primer compositions including acrylate copolymers. U.S. Pat. No. 10,301,418 (Lu et al.) describes a primer composition including a polyurethane.SUMMARYThe present disclosure provides a composition useful, for example, to provide conductivity on a non-conductive surface. The composition can be useful, for example, in combination with an electrically debonding adhesive. The composition includes a polymer at least one of dissolved or dispersed in solvent and an electrically conductive filler dispersed in the solvent. The composition allows electrical debonding of an adhesive as shown in the Examples below. The composition can also improve adhesionof an electrically debonding adhesive to a variety of substrates including low and medium surface energy substrates.In one aspect, the present disclosure provides a primer composition including solvent, electrically conductive filler dispersed in the solvent, and a polymer at least one of dissolved or dispersed in the solvent. The polymer includes at least one of a polyurethane, polyacrylate, or a polyamide. The polyurethane is a reaction product of components including a polyisocyanate and a polyol. The polyol has a total solubility parameter ranging from 10 to 14 (cal / cm3)1 / 2and / or includes repeat units of an ortho- or meta- phthalate, and an alkylene group comprising at least 4, 5 or 6 carbon atoms. The polyacrylate includes, based on the total weight of the monomer units in the polyacrylate, at least 20 percent by weight of methyl methacrylate units, at least 15 percent by weight of acrylic monomer units comprising an alkyl group having at least four carbon atoms, and at least one monomer units comprising at least one of a secondary amine, a tertiary amine, or a tertiary amide in an amount of at least 15 percent by weight or acrylic monomer units comprising a carboxylic acid group in an amount of at least 10 percent by weight. The polyamide is a reaction product of components including a dimer acid, a diamine comprising at least one of a primary diamine or a secondary diamine.In another aspect, the present disclosure provides the use of the aforementioned primer composition as a primer on a electrically nonconductive substrate. The primer composition can be used in combination with an electrically debonding adhesive.In another aspect, the present disclosure provides a method of making an article. The method includes applying the aforementioned primer composition to a surface of a first electrically nonconductive substrate, removing at least a portion of the solvent, and applying an electrically debonding adhesive to the primer composition on the surface of the first electrically nonconductive substrate.In another aspect, the present disclosure provides an adhesive system including the aforementioned primer composition and an electrically debonding adhesive. The adhesive includes an ionic liquid.In another aspect, the present disclosure provides an electrically debonding adhesive system that includes an electrically conductive composition and an electrically debonding adhesive including an ionic liquid. The electrically conductive composition includes solvent, electrically conductive filler dispersed in the solvent, and a polymer at least one of dissolved or dispersed in the solvent. The polymer includes at least one of a polyurethane, a polyacrylate, a polyamide, or a rubber.In another aspect, the present disclosure provides an article bonded with the adhesive system disclosed herein and / or made by the method disclosed herein.As used herein:"alkyl group" and the prefix "alk-" have only C-C bonds and C-H bonds and are inclusive of both straight chain and branched chain groups and of cyclic groups. In some embodiments, alkyl groups have up to 30 carbons (in some embodiments, up to 20, 15, 12, 10, 8, 7, 6, or 5 carbons) unless otherwisespecified. Cyclic groups can be monocyclic or polycyclic and, in some embodiments, have from 3 to 10 ring carbon atoms and other alkyl substituents;"Aryl" and “aromatic” as used herein include carbocyclic aromatic rings or ring systems, for example, having 1, 2, or 3 rings and optionally containing at least one heteroatom (e.g., O, S, or N) in the ring optionally substituted by up to five substituents including one or more alkyl groups having up to 4 carbon atoms (e.g., methyl or ethyl), alkoxy having up to 4 carbon atoms, halo (i.e., fluoro, chloro, bromo or iodo), hydroxy, or nitro groups, examples of which include phenyl, naphthyl, biphenyl, fluorenyl as well as furyl, thienyl, pyridyl, quinolinyl, isoquinolinyl, indolyl, isoindolyl, triazolyl, pyrrolyl, tetrazolyl, imidazolyl, pyrazolyl, oxazolyl, and thiazolyl; the terms “acrylic” and “polyacrylate” refer to both acrylic and methacrylic polymers, oligomers, and monomers; the term "(meth)acryl" refers to acryl (also referred to in the art as acryloyl and acrylyl) and / or methacryl (also referred to in the art as methacryloyl and methacrylyl); and“cure” refers to making polymer chains from one or more monomers.The term "polymer" refers to a molecule having a structure which includes the multiple repetition of units derived, actually or conceptually, from one or more monomers. The term “monomer” refers to a molecule of low relative molecular mass that can combine with others to form a polymer. The term “polymer” includes homopolymers and copolymers, as well as homopolymers or copolymers that may be formed in a miscible blend, e.g., by coextrusion or by reaction. The term “polymer” includes random, block, graft, and star polymers. The term “polymer” encompasses oligomers.A “monomer unit” of a polymer or oligomer is a segment of a polymer or oligomer derived from a single monomer. As an example, the monomeric unit of acrylic acid (H2C=CH-(C=O)-OH) iswhere the asterisks (*) indicate the attachment site to another group such as another monomeric unit in the polymer.Terms such as "a", "an" and "the" are not intended to refer to only a singular entity but include the general class of which a specific example may be used for illustration. The terms "a", "an", and "the" are used interchangeably with the term "at least one".The phrase "comprises at least one of followed by a list refers to comprising any one of the items in the list and any combination of two or more items in the list. The phrase "at least one of followed by a list refers to any one of the items in the list or any combination of two or more items in the list.The term "crosslinking” refers to joining polymer chains together by covalent chemical bonds, usually via crosslinking molecules or groups, to form a network polymer. A crosslinked polymer isgenerally characterized by insolubility but may be swellable in the presence of an appropriate solvent. The term “crosslinked” includes partially crosslinked.The term “statistical” in reference to a (meth)acrylic-based copolymer refers to a copolymer that is formed from a polymerizable composition having a plurality of different types of monomers. Under some conditions, the statistical (meth)acrylic -based copolymer is a random copolymer. Under other conditions, however, the (meth)acrylate copolymer may not be completely random because differences in concentration and reactivity of the monomers may create conditions where the early stages of polymerization may favor polymerization of one type of monomer in the polymerizable composition. The terms “statistical” and “random” are often used interchangeably in polymeric publications. If the term “block” or “multi-block” does not appear in the description (i.e., name) of the copolymer, it is presumed to be a statistical copolymer.All numerical ranges are inclusive of their endpoints and non-integral values between the endpoints unless otherwise stated (e.g., 1 to 5 includes 1, 1.5, 2, 2.75, 3, 3.80, 4, 5, etc.).Features and advantages of the present disclosure will be further understood upon consideration of the detailed description as well as the appended claims.BRIEF DESCRIPTION OF THE DRAWINGSFIG. 1 is a schematic side view of one embodiment of an article of the present disclosure;FIG. 2 is a schematic side view of another embodiment of an article of the present dislcosure; and FIG. 3 is a diagram of the testing apparatus used for tensile push out testing described in the Examples.DETAILED DESCRIPTIONThe present disclosure provides a primer composition and / or electrically conductive composition including a polymer, in some embodiments, at least one of dissolved or dispersed in solvent. In some embodiments, the polymer comprises a polyurethane. The polyurethane comprises the reaction product of components comprising a polyisocyanate and a polyol.In some embodiments, the polyol comprises an aromatic and / or aliphatic (e.g. polyester, polycaprolactone, polycarbonate) polyol that comprises at least two hydroxyl terminal groups. When the polyol averages 2 hydroxyl groups, it may be characterized as a diol. In other embodiments, the polyol may be characterized as a triol. In yet other embodiments, the polyol may comprise a mixture of diol and triol, wherein the number of hydroxyl groups averages greater than 2, yet less than 3. Other polyols have 4, 5 or 6 hydroxyl terminal groups.Polyester polyols can be obtained by, for example, an esterification reaction between a polyol component and an acid. Examples of suitable acids include succinic acid, methylsuccinic acid, adipic acid, pimelic acid, azelaic acid, sebacic acid, 1,12-dodecanedioic acid, 1,14-tetradecanedioic acid, dimer acid, 2-methyl-l,4-cyclohexanedicarboxylic acid, 2-ethyl-l,4-cyclohexanedicarboxylic acid, terephthalicacid, isophthalic acid, phthalic acid, 1,4-naphthalenedicarboxylic acid, 4,4'-biphenyldicarboxylic acid, and acid anhydrides thereof. An aromatic polyester polyol can be produced by polymerizing an aromatic dicarboxylic acid with an aliphatic diol, as known in the art. In some embodiments, the aromatic dicarboxylic acid typically comprises a major amount of isophthalic acid or phthalic acid. The polyester polyol may optionally be produced from a minor amount of other aromatic dicarboxylic acid such as terephthalic acid. Further, the polyester polyol may optionally be produced from a minor amount of cycloaliphatic dicarboxylic acids such as 1,3 -cyclopentanedicarboxy lie acid, 1,2-cyclohexanedicarboxylic acid, 1,4-cyclohexanedicarboxylic acid, and 2,5-norbomanedicarboxylic acid. These dicarboxylic acids are typically in the form of acid anhydrides.An aliphatic diol that can be utilized to produce a polyol, which may be aromatic or aliphatic, a polyester or a polycarbonate, typically comprises a straight-chain or branched alkylene group such as ethylene glycol, diethylene glycol, propylene glycol, 1,3 -propanediol, 1,3 -butanediol, 1,4-butanediol, 1,5- pentanediol, 1,6-hexanediol, 1,7-heptanediol, 1,8 -octanediol, 1,9-nonanediol, 1,10-decanediol, 2,4- dimethyl -2 -ethylhexane- 1,3-diol, 2,2-dimethyl-l,3-propanediol (neopentyl glycol), 2-ethyl-2 -butyl- 1,3- propanediol, 2-ethyl-2-isobutyl- 1,3 -propanediol, 3-methyl-l,5-pentanediol, 2, 2, 4-trimethyl- 1,6- hexanediol, and octadecanediol. In some embodiments, at least one of the aliphatic diols utilized to product the aromatic or aliphatic polyester polyol comprises a straight-chain or branched alkylene group (e.g., R1 in the formulas below) comprising at least 4, 5 or 6 carbon atoms and typically no greater than 24 or no greater than 36 carbon atoms. In some embodiments, the straight-chain or branched alkylene group comprises no greater than 12 or 8 carbon atoms. In some embodiments, the alkylene group is a straight-chain alkylene group. In some embodiments, a single aliphatic diol comprising at least 4, 5, or 6 carbon atoms, is utilized in the preparation of the polyol. Alternatively, two or more aliphatic diols may be utilized in the preparation of the polyol wherein at least one of such diols comprises an alkylene group comprising at least 4, 5, or 6 carbon atoms. When a mixture of aliphatic diols is utilized, at least 50, 60, 70, 80, 90 or 95 weight percent (wt-%) of the total amount of diol (or total R1 alkylene groups) are alkylene groups comprising at least 4, 5, or 6 carbon atoms.In some embodiments, the polyol is a poly caprolactone polyol as can be obtained by subjecting a cyclic ester monomer such as epsilon-caprolactone or sigma-valerolactone to ring-opening polymerization. Polycaprolactone polyols comprise an alkylene group having 5 carbons atom.In some embodiments, the polyol is a polycarbonate polyol as can be obtained from the reaction of aliphatic diols such as butanediol-(l,4) and / or hexanediol-(l,6) with phosgene, diaryl -carbonates such as diphenylcarbonate or with cyclic carbonates such as ethylene or propylene carbonate. Also suitable are polyester carbonates obtained from the above-mentioned polyesters or polylactones with phosgene, diaryl carbonates or cyclic carbonates. The preparation of the polyester or polycarbonate polyol generally includes utilizing at last one aliphatic diol as previously described. The alkylene group of the aliphatic diol and polyester or polycarbonate polyol may comprise hydrophobic substituents such halogensubstituents. However, such alkylene group generally lacks hydrophilic groups, particularly ether groups such as ethylene oxide and propylene oxide (e.g. repeat) units.In some embodiments, the polyol is typically a polymer. The polymeric (in some embodiments, polyester) polyol typically has an equivalent weight (molecular weight per hydroxyl group) ranging from about 250 to about 30000 grams per equivalent as determined by titration using techniques known to those skilled in the art. In some embodiments, the equivalent weight of the polyol is no greater than 20000, 10000, 8000, 7000, 6000, 5000, 4000, 3500, 3000, 2500, or 2000; or between 500 and 30000, 2000 and 20000, 2000 and 10000, or between 2000 and 4000. In the case of diols, the molecular weight of the polyol is twice that of the equivalent weight just described. In the case of triols, the molecular weight of the (e.g. polyester) polyol is three times the equivalent weight just described.In some embodiments, the polyol is an aromatic polyester polyol comprising repeat units comprising an aromatic (e.g. phthalate) group (of the dicarboxylic acid) bonded to the (Rl) alkylene group (of the aliphatic diol) by ester linkages. In this embodiment, the ratio of six-member rings to alkylene groups having at least 4, 5, or 6 carbon atoms is about 1: 1 and may range from about 1.5: 1 to 1: 1.5. In some embodiments, the polyol comprises repeat units of an ortho- or meta- phthalate and an alkylene group comprising at least 4, 5 or 6 carbon atoms, which can be obtained by reacting ortho- or meta-phthalic acid (anhydride) and an aliphatic diol.In some embodiments, the polyol is selected to have certain solubility parameters computed employing group contribution methods as described in the paper by K.L. Hoy, J. Coated Fabrics, Volume 19, 53 (1989). The calculations were carried out employing the program Molecular Modeling Pro Plus from Norgwyn Montgomery Software, Inc. (North Wales, PA). In some embodiments, the polyol has a total solubility parameter of at least 9.8, 9.9, or 10 (cal / cm3)1 / 2. In some embodiments, the total solubility parameter is no greater than 14 13, 12.5, 12, 11.5 or 11 (cal / cm3)1 / 2.In some embodiments, the hydrogen bonding solubility parameter of the polyol is typically at least 3.0, 3.1, 3.2, 3.3, 3.4, or 3.5 (cal / cm3)1 / 2and typically no greater than 6 (cal / cm3)1 / 2. In some embodiments, the hydrogen bonding solubility parameter of the polyol is no greater than 5.5 or 5.0 (cal / cm3)1 / 2. In some embodiments, the dispersion solubility parameter can range from about 7 to 9 (cal / cm3)1 / 2. Further, the polar solubility parameter can range from about 4 to 6 (cal / cm3)1 / 2.Suitable polyols having the total solubility parameter and hydrogen bonding solubility parameter as described above include a polyester polyol having repeat units of ortho-phthalate and hexylene, available from Stepan Company, Northfield, IL, under the trade designation “PH-56”, with total, dispersion, polar, and hydrogen bonding solubility parameters in (cal / cm3)1 / 2of 10.6, 7.8, 5.5, and 4.4, respectively; a poly caprolactone polyol available from Perstorp UK Ltd., Warrington, England, under the trade designation “Capa 2200”, with total, dispersion, polar, and hydrogen bonding solubility parameters in (cal / cm3)1 / 2of 10.0, 8.1, 4.6, and 3.6, respectively; a polyester polyol having repeat units of adipate and hexylene, available from Stepan Company under the trade designation “PC-205P-56”, with total, dispersion, polar, and hydrogen bonding solubility parameters in (cal / cm3)1 / 2of 10.2, 8.0, 4.9, and 3.9,respectively; a polyester polyol having repeat units of adipate and butylene, available from Chemtura Corporation, Philadelphia, PA, under the trade designation “Fomrez 44-55”, with total, dispersion, polar, and hydrogen bonding solubility parameters in (cal / cm3)1 / 2of 10.4, 7.9, 5.3, and 4.2, respectively; a polycarbonate polyol having carbonate and hexylene repeat units, available from Bayer Materials Science LLC, Pittsburgh, PA, under the trade designation “Desmophen C2200”, with total, dispersion, polar, and hydrogen bonding solubility parameters in (cal / cm3)1 / 2of 10.5, 8.0, 5.2, and 4.3, respectively, and polypropylene glycol available from Bayer Materials Science LLC under the trade designation “PPG 2000”, with total, dispersion, polar, and hydrogen bonding solubility parameters in (cal / cm3)1 / 2of 9.6, 8.1, 4.5, and 2.8, respective!.In some embodiments, the polyester polyol, prepared from isophthalic acid, phthalic acid, or an anhydride thereof, has the following structure:wherein R1 is independently an alkylene group comprising at least 4 carbon atoms as defined above in any of its embodiments; n is at least 2, 3, 4 or 5; and the ester group substituents are bonded to the ring at an ortho- or meta- position. In some embodiments, n is no greater than 25, 20, 15, or 10.When the aromatic polyester polyol comprises ortho- or meta- aromatic ester groups, the polyester polyol tends to have a low glass transition temperature, e.g.. less than 0 °C, 5 °C, or 10 °C. Further, such aromatic polyester polyols tend to be amorphous viscous liquids at 25 °C. In some embodiments, the aromatic polyester polyols have a viscosity of less than 10,000 or 5,000 cP at 80 °C.In some embodiments, the aromatic polyester diol(s) depicted above are the primary or sole hydroxyl-functional reactant and sole polyol of the polyurethane. In other embodiments, other (e.g., aliphatic polyester, poly caprolactone, or polycarbonate) diol(s) having the previously described solubility parameter(s) are the primary or sole hydroxyl-functional reactant and sole polyol of the polyurethane.In some embodiments, polyols (e.g. diols) having the previously described solubility parameter(s) are the primary polyol of the polyurethane, such polyols are present in an amount of at least 50, 55, 60, 65, 70, 75, 80, 85, 90, 95 or 99 wt-% of the total amount of polyol repeat units. In some embodiments, aromatic polyester diol(s) comprising repeat units of an ortho- or meta- phthalate and an alkylene group comprising at least 4, 5 or 6 carbon atoms are the primary polyol of the polyurethane and are present in an amount of at least 50, 55, 60, 65, 70, 75, 80, 85, 90, 95 or 99 wt-% of the total amount of polyol repeat units. The polyol component may further comprise 1, 5, 10, 15, 20, 25, 30, 35, 40, 45 or 50 wt-% of another polyol or other polyols, such as chain extenders and crosslinkers.In some embodiments, the hydroxyl number of the aromatic polyester polyol comprising repeat units of an ortho- or meta- phthalate and an alkylene group comprising at least 4, 5 or 6 carbon atoms or other polyol having the previously described solubility parameters (i.e., prior to reacting with the polyisocyanate component) is at least 5, 10, 25, 30, or 40 mg KOH / g and in some embodiments no greater than 200, 150, 100, 90, 80, or 70 mg KOH / g. In some embodiments, the water content of the aromatic polyester polyol of other polyol is no greater than 0.10 or 0.05 wt-% of the polyol. In some embodiments, the Gardner color of the aromatic polyester polyol or other polyol is no greater than 3, 2, or 1. In some embodiments, the acid number of the aromatic polyester polyol or other polyol is no greater than 5, 4, 3, 2, or 1 mg KOH / g or in other words no greater than 0.005, 0.004, 0.003, 0.002, or 0.001 wt- % of the polyol. Likewise, in these embodiments, the polyurethane polymer also comprises a low concentration of acid, as just described.The polyisocyanate useful for the polyurethane may comprise various polyfunctional isocyanate compounds. Examples of such polyfunctional isocyanate compound include polyfunctional aliphatic isocyanate compounds, polyfunctional aliphatic cyclic isocyanate compounds, and a polyfunctional aromatic isocyanate compounds. Mixtures of these isocyanates can also be useful.Examples of the polyfunctional aliphatic isocyanate compounds include trimethylene diisocyanate, tetramethylene diisocyanate, hexamethylene diisocyanate, pentamethylene diisocyanate, 1,2-propylene diisocyanate, 1,3-butylene diisocyanate, dodecamethylene diisocyanate, and 2,4,4- trimethylhexamethylene diisocyanate.Examples of the polyfunctional aliphatic cyclic isocyanate compounds include 1,3 -cyclopentene diisocyanate, 1,3 -cyclohexane diisocyanate, 1,4-cyclohexane diisocyanate, isophorone diisocyanate, hydrogenated diphenylmethane diisocyanate, hydrogenated xylylene diisocyanate, hydrogenated tolylene diisocyanate, hydrogenated tetramethylxylene diisocyanate, and bio-based polyfunctional aliphatic cyclic isocyanates, such as 2-heptyl-3,4-bis(9-isocyanatononyl)-l-pentylcyclohexane from BASF Corporation under trade designation “DDI 1410”.Examples of the polyfunctional aromatic isocyanate compounds include phenylene diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 2,2'-diphenylmethane diisocyanate, 4.4'- diphenylmethane diisocyanate, 4,4'-toluidine diisocyanate, 4,4'-diphenyl ether diisocyanate, 4,4'-diphenyl diisocyanate, 1,5 -naphthalene diisocyanate, and xylylene diisocyanate.In some embodiments, the polyfunctional isocyanate compound comprises isophorone diisocyanate (IPDI), hexamethylene diisocyanate, or mixtures thereof. In some embodiments, the polyfunctional isocyanate compound comprises a ortho- or meta-substituted aromatic isocyanate compound, such as 1,4-methylene diphenyl diisocyanate (MDI), m-tetramethylene diisocyanate (TMXDI), or mixtures thereof. Mixtures of (e.g., cyclic) aliphatic and aromatic polyfunctional isocyanate compounds may also be utilized.In some embodiments, aliphatic polyester polyols (e.g,. caprolactone polymers) or aliphatic polycarbonate polyester polyols are utilized with an aromatic or cyclic aliphatic polyisocyanate. In someembodiments, aromatic polyester or polycarbonate polyols are utilized with an aliphatic, cyclic aliphatic, or aromatic polyisocyanate.In some embodiments the polyurethane adhesive composition comprises the reaction product of the above-described polyisocyanate and polyol components, and also a functional acid containing compound represented by the formula: (HX)2R2-A; wherein A is a functional acid group selected from -CO2M, -OSO3M, -SO3M, -OPO(OM)2, -PO(OM)2, wherein M is H or a cation such as sodium, potassium, and calcium; X is O, S, NH or NR wherein R is an alkylene group comprising 1 to 10 or 1 to 4 carbon atoms; and R2 is an organic linking group having a valency of at least 3, comprising 1 to 50, 1 to 30, 1 to 15, or 1 to 7 carbon atoms, and optionally includes one or more tertirary nitrogen, ether oxygen, or ester oxygen atoms, and is free from isocyanate-reactive hydrogen containing groups. In some embodiments, A is -CO2M, X is O or NH, and R2 is a linear or branched alkylene having from 1 to 7 carbon atoms. Illustrative functional acid containing compounds include dihydroxycarboxylic acids, dihydroxysulphonic acids, dihydroxyphosphonic acids and salts thereof such as dimethylolpropionic acid (DMPA) depicted below (or its derivatives from GEO Specialty Chemicals, Inc. under trade designation such as “DMPA Polyol HA-0135”, “DMPA Polyol HA-0135LV2”, “DMPA Polyol HC-0123”, and “DMPA Polyol BA-0132”):In some embodiments, the amount of functional acid in the polyurethane may be described in terms of the number of millimoles of the functional acid group A (mmol A) per 100 grams of the polyurethane (100g PU). In this regard, the polyurethane may include between 0.001 and 37 mmol A / lOOg PU, 0. 1 and 37 mmol A / lOOg PU, 1 and 37 mmol A / lOOg PU, or between 1 and 25 mmol A / lOOg PU.In some embodiments, the polyurethane comprises at least 25, 30, 35, 40, or 45 mol% of alkylene groups comprising at least 4, 5 or 6 carbon atoms. In some embodiments, the polyurethane comprises no greater than 65 or 60 mol% of alkylene groups comprising at least 4, 5, or 6 carbon atoms, some of which are provided by use of a polyisocyanate comprising a long chain alkylene group such as hexanediisocyanate or isophorone diisocyante. In other embodiments, such as when the polyisocyanate component is primarily or solely aromatic polyisocyanate(s) the polyurethane comprises no greater than about 55 or 50 mol% of alkylene groups comprising at least 4, 5, or 6 carbon atoms. The alkylene groups typically have no greater than 24, 12, or 8 carbon atoms as previously described. The polyurethane is obtained by reacting a polyol component comprising the aromatic polyester polyol and / or other polyol have the solubility parameter(s) previously described and at least one polyfunctional isocyanate compound. Such composition may optionally comprise other components.In addition to urethane linkages, polyurethane can contain additional groups as known in the art. However, in some embodiments, the polyurethane does not contain (terminal) silyl groups. In some embodiments, the polyurethane described herein comprises little or no nonionic water solubilizing groups such as those having ethylene oxide and propylene oxide (repeat) units. Thus, the polyurethane can comprise less than 5, 4, 3, 2, 1, 0.5, 0.1, or 0.05 wt.-% of such non-ionic water solubilizing groups.In some embodiments, the aromatic polyester polyol is reacted with an isocyanate component such that the ratio of hydroxyl equivalents (OH groups) with respect to the NCO isocyanate equivalents (NCO groups) is about 1: 1. The hydroxyl content of the resulting polyurethane is typically no greater than about 0.5 wt-%.In some embodiments, the polyurethane polymers can be prepared by the reaction of a stoichiometric excess of organic polyisocyanate. The molar ratio of NCO to OH is typically about 1.3 to 1 or 1.2 to 1 or 1.1 to 1. In such embodiments, the NCO terminal groups are typically further reacted with a multi-functional polyol. Suitable multi-functional polyols may include two or more hydroxyl groups such as, for example, branched adipate glycols, trimethylolpropane, 1,2,6-hexanetriol, trimethylolethane, pentaerythritol, dipentaerythritol, and tripentaerythritol.In some embodiments, the polyurethane polymers can be prepared by the reaction of a stoichiometric excess of polyol. The molar ratio of OH to NCO is typically about 1.3 to 1 or 1.2 to 1 or 1.1 to 1. In such embodiments, the OH terminal groups are typically further reacted with a multifunctional polyisocyanate. Suitable multi-functional polyisocyanates may include two or more isocyanate groups such as, for example, those obtained under the trade designations “DESMODER N-3300”, “DESMODER N-3390”, and “DESMODER N-3400” from Bayer.When reacting the polyol(s) with the isocyanate(s), the reaction temperature is typically in the range of from about 60°C to about 90°C depending on the selection of respective reactants and selection of catalyst. The reaction time typically ranges from about 2 to about 48 hours. The polyurethane is typically prepared with a catalyst as known in the art. The amount of catalyst can range up to about 0.5 parts by weight of the polyurethane. In some embodiments, the amount of catalyst ranges from about 0.001 to about 0.05 wt.-% of the polyurethane. Examples of useful catalysts include those selected from the group consisting of tin II and IV salts such as stannous octoate and dibutyltin dilaurate, and dibutyltin diacetate; tertiary amine compounds such as triethyl amine and bis(dimethylaminoethyl) ether, morpholine compounds such as beta, beta' -dimorpholinodiethyl ether, bismuth carboxylates, zinc -bismuth carboxylates, iron (III) chloride, potassium octoate, and potassium acetate. The reaction can be carried out in organic solvent.The resulting polyurethane typically has a weight average molecular weight (Mw) of at least 30,000 or 40,000, or 50,000 g / mole as determined by the test method described in the examples of U.S. Pat. No. 10,301,418 (Lu et al.). The molecular weight (Mw) of the polyurethane is typically no greater than 500,000 g / mole, 300,000 g / mole, or in some embodiments no greater than 275,000 g / mole or250,000 g / mole. In some embodiments the polyurethane has a molecular weight (Mw) of between 30,000 and 500,000 g / mole, 50,000-300,000 g / mole, or 100,000-200,000 g / mole.In some embodiments of the primer composition and / or electrically conductive composition of the present disclosure and / or useful in the adhesive system of the present disclosure, the polymer in the primer composition and / or electrically conductive composition comprises polyacrylate composed of monomer units. In some embodiments, the polyacrylate includes at least 20 percent by weight methyl methacrylate monomer units, based on the total weight of monomer units in the polyacrylate. In some embodiments, the polyacrylate includes at least 20, 21, 22, 23, 24 or 25 percent by weight methyl methacrylate monomer units, based on the total weight of monomer units in the polyacrylate. In some embodiments, the primer composition includes 21, 22, 23, 24 or 25 weight percent (wt.%) to 65 wt.%, 20 wt.% to 60 wt.%, 20 wt.% to 40 wt.%, or 40 wt.% to 60 wt.% methyl methacrylate, based on the total weight of monomer units in the polyacrylate. Methyl methacrylate is commercially available from a variety of suppliers.The polyacrylate useful in some embodiments of the primer composition and / or electrically conductive composition of the present disclosure includes at least 15 wt.% of acrylic monomer units comprising an alkyl group having at least four carbon atoms, based on the total weight of monomer units in the polyacrylate. The alkyl group of the alkyl acrylate or methacrylate may be straight-chained, branched, or cyclic (including polycyclic) and may have 4 to 24, 4 to 18, or 4 to 12 carbon atoms. Examples of suitable acrylic monomer units comprising an alkyl group having at least four carbon atoms include units of n-butyl (meth)acrylate, isobutyl (meth)acrylate, tert-butyl (meth)acrylate, n-pentyl (meth)acrylate, iso-pentyl (meth)acrylate, n-hexyl (meth)acrylate, iso-hexyl (meth)acrylate, octyl (meth)acrylate, iso-octyl (meth)acrylate, 2-octyl(meth)acrylate, 2-ethylhexyl (meth)acrylate, decyl (meth)acrylate, isodecyl acrylate, undecyl (meth)acrylate, n-dodecyl acrylate, lauryl (meth)acrylate, tridecyl (meth)acrylate, tetradecyl (meth)acrylate, pentadecyl (meth)acrylate, hexadecyl (meth)acrylate, heptadecyl (meth)acrylate, 2-propylheptyl (meth)acrylate, stearyl (meth)acrylate, n-nonyl (meth)acrylate, isononyl (meth)acrylate, isomyristyl (meth)acrylate, isostearyl (meth)acrylate, octadecyl (meth)acrylate, and behenyl (meth)acrylate. Suitable monomer units further include units of a mixture of at least two or at least three structural isomers of a secondary alkyl (meth)acrylate of formula II:wherein R4 and R5 are each independently a Ci to C30 saturated linear alkyl group; the sum of the number of carbons in R4 and R5 is 7 to 31; and R6 is H or CH3. The sum of the number of carbons in R4 and R5can be, in some embodiments, 7 to 27, 7 to 25, 7 to 21, 7 to 17, 7 to 11, 7, 11 to 27, 11 to 25, 11 to 21, 11 to 17, or 11. Methods for making and using such monomers and monomer mixtures are described in U.S. Pat. No. 9, 102,774 (Clapper et al.). In some embodiments, the acrylic monomer units comprising an alkyl group having at least four carbon atoms comprise units of at least one of 2-ethylhexyl (meth)acrylate, 2- propylheptyl (meth)acrylate, iso-octyl (meth)acrylate. In some embodiments, the acrylic monomer units comprising an alkyl group having at least four carbon atoms comprise units of 2-ethylhexyl acrylate or 2- isooctyl acrylate.In some embodiments, the primer composition includes at least 16 wt.%, 17 wt.%, 18 wt.%, 19 wt.% or 20 wt.% of the acrylic monomer units comprising an alkyl group having at least four carbon atoms, based on the total weight of monomer units in the polyacrylate. In some embodiments, the primer composition includes 15 wt.%, 20 wt.%, or 25 wt.% to 65 wt.%, 25 wt.% to 60 wt.%, 20 wt.% to 55 wt.%, or 30 wt.% to 50 wt.%, of the acrylic monomer units comprising an alkyl group having at least four carbon atoms, based on the total weight of monomer units in the polyacrylate.The polyacrylate useful in some embodiments of the primer composition and / or electrically conductive composition of the present disclosure includes at least 15 wt.% of monomer units comprising at least one of a secondary amine, a tertiary amine, or a tertiary amide, based on the total weight of monomer units in the polyacrylate. In some embodiments, these monomer units comprise at least one of a tertiary amine or tertiary amide. In some embodiments, these monomer units comprise at least one of a secondary amine or tertiary amine. In some embodiments, the monomer units comprising at least one of a secondary amine or a tertiary amine are represented by formula III:III wherein R7 is hydrogen, alkyl, or arylalkylenyl; R8 is alkyl or arylalkylenyl; or R7 and R8 together with the nitrogen atom with which they are joined form a 5-, 6-, or 7-membered ring; V is alkylene or arylalkylene; W is -O- or -N(R9)-; R9 is hydrogen, alkyl, aryl, alkylarylene, or arylalkylene; and R6 is hydrogen or methyl. In some embodiments, R7 is hydrogen, and R8 is alkyl having up to four carbon atoms. In some embodiments, each of R7 and R8 is independently alkyl having up to four carbon atoms. In some embodiments, each of R7 and R8 is methyl. In some embodiments, W is -O- or -N(H)-. In some embodiments, W is -O-. In some embodiments, V is alkylene. In some embodiments, V is ethylene, propylene, or butylene. In some embodiments, V is ethylene.In some embodiments, the monomer units comprising at least one of a secondary amine, a tertiary amine, or a tertiary amide are N-acryloyl piperidine units, N-methacryloyl piperidine units, or piperazine units represented by formula IV:IV wherein RIO is hydrogen, alkyl, arylalkylene, or alkylcarbonyl; and R6 is hydrogen or methyl. In some embodiments, the monomer units comprising a tertiary amide comprise at least one of N-vinyl-2- pyrrolidone units, N-vinylpiperidone units, or N-vinylcaprolactam units. Combinations of any of these units may be useful.In some embodiments, the monomer units comprising at least one of the secondary amine, the tertiary amine, or the tertiary amide comprise units of at least one of 2-(N,N-dimethylaminoethyl) (meth)acrylate, 2-(N,N-diethylaminoethyl) (meth)acrylate, 2-(t-butylaminoethyl) (meth)acrylate, 2-(N,N- dimethylaminoethyl) (meth)acrylamide, 2-(N,N-diethylaminoethyl) (meth)acrylamide, 2-(t- butylaminoethyl) (meth)acrylamide, N-(meth)acryloylpiperidine, N-vinylcaprolactam, and N-vinyl-2- pyrrolidone. In some embodiments, the monomer units comprising at least one of the secondary amine, the tertiary amine, or the tertiary amide comprise units of at least one of 2-(N,N-dimethylaminoethyl) (meth)acrylate or N-vinyl -2 -pyrrolidone. In some embodiments, these monomer units comprise units of at least one of 2-(N,N-dimethylaminoethyl)methacrylate or 2-(N,N-dimethylaminoethyl)acrylate.In some embodiments, the primer composition and / or electrically conductive composition includes at least 16 wt.%, 17 wt.%, 18 wt.%, 19 wt.% or 20 wt.% of the monomer units comprising at least one of the secondary amine, the tertiary amine, or the tertiary amide, based on the total weight of monomer units in the polyacrylate. In some embodiments, the primer composition includes 15 wt.%, 16 wt.%, 17 wt.%, 18 wt.%, 19 wt.% or 20 wt.% to 40 wt.% of the monomer units comprising at least one of the secondary amine, the tertiary amine, or the tertiary amide, based on the total weight of monomer units in the polyacrylate.In some embodiments, the polyacrylate useful in the primer composition and / or electrically conductive composition of the present disclosure at least 10 wt.% of acrylic monomer units comprising a carboxylic acid group. Examples of suitable acrylic monomers comprising a carboxylic acid group to provide these monomer units include methacrylic acid, acrylic acid, itaconic acid, maleic acid, fumaric acid, ethacrylic acid, crotonic acid, citraconic acid, cinnamic acid, beta-carboxy ethyl acrylate, andmethacryloyl oxyethyl hydrogen succinate. In some embodiments, the acrylic monomer units comprising a carboxylic acid group are acrylic acid monomer units or methacrylic acid monomer units, in some embodiments, acrylic acid monomer units. In some embodiments, the acrylic monomer units comprisinga carboxylic acid group is present in the polyacrylate in an amount of 10 wt.% to 25 wt.%, 10 wt.% to 20 wt.%, or 11 wt.% to 19 wt.%, or 12 wt.% to 18 wt.%, based on the total weight of monomer units in the polyacrylate.Polyacrylate polymers can be prepared using any of the methods described below in connection with adhesives.In some embodiments, the polyacrylate includes additional acrylic monomer units. In some embodiments of the primer composition of the present disclosure, the methyl methacrylate units, the monomer units comprising at least one of the secondary amine, the tertiary amine, or the tertiary amide, the acrylic monomer units comprising the alkyl group having at least four carbon atoms, and the acrylic monomer units comprising the carboxylic acid group together make up at least 95 wt.%, 96 wt.%, 97 wt.%, 98 wt.%, 99 wt.%, or 100 wt.% of monomer units in the polyacrylate. In some embodiments, the polyacrylate is free of acrylic monomer units comprising a hydroxyl group or contains not more than 0.5 wt.%, 0. 1 wt.%, 0.05 wt.%, 0.01 wt.%, or 0.005 wt.% of acrylic monomers units comprising a hydroxyl group, based on the total weight of monomer units in the polyacrylate. In some embodiments, the polyacrylate is free of N-methylolacrylamide units and N-methylolmethacrylamide units or contains not more than 0.5 wt.%, 0.1 wt.%, 0.05 wt.%, 0.01 wt.%, or 0.005 wt.% of N-methylolacrylamide units and N-methylolmethacrylamide units, based on the total weight of monomer units in the polyacrylate. In some embodiments, the polyacrylate is free of acrylic monomer units comprising a phosphate group or contains not more than 0.5 wt.%, 0. 1 wt.%, 0.05 wt.%, 0.01 wt.%, or 0.005 wt.% of acrylic monomer units comprising a phosphate group, based on the total weight of monomer units in the polyacrylate. In some embodiments, the polyacrylate is free of crosslinking monomer units or contains not more than 0.5 wt.%, 0.1 wt.%, 0.05 wt.%, 0.01 wt.%, or 0.005 wt.% of crosslinking monomer units, including any of those described below in connection with the adhesive, based on the total weight of monomer units in the polyacrylate.In some embodiments of the electrically conductive compositions in the adhesive system of the present disclosure, the polyacrylates can include other further monomeric units, including any of those described below in connection with adhesives.Polyacrylates described in U.S. Pat. Nos. 10,640,656 (Moren et al.), 5,602,202 (Groves), and 5,677,376 (Groves), incorporated herein by reference, may also be useful in the primer composition and / or electrically conductive composition of the present disclosure.In some embodiments, the primer composition and / or electrically conductive composition of the present disclosure and / or useful in the adhesive system of the present disclosure includes a polyamide. In some embodiments, the polyamide is a dimer-acid based polyamide. Dimer acids can be used alone or in combination with other diacids. Suitable acids for making polyamides include any those described in paragraphs

[0038] to

[0041] of U.S. Pat. No. 2022 / 0347982 (Perez et al.), incorporated herein by reference. Suitable polyamines for making polyamides include any those described in paragraphs

[0042] to

[0043] of U.S. Pat. No. 2022 / 0347982 (Perez et al.), incorporated herein by reference. Usefulcommercially available polyamide resins include those available under the trade designation MACROMELT (e.g., MACROMELT OM 633, MACROMELT OM 641, MACROMELT OM 652, MACROMELT OM 673, MACROMELT OM 6208, MACROMELT 7001, MACROMELT 7002, MACROMELT 7003) from Henkel Corp., Rocky Hill, Conn.; those available under the trade designation UNI-REZ (e.g., UNI-REZ 2600, UNI-REZ 2620, UNI-REZ 2700, and UNI-REZ 2720) from Kraton, Houston, TX; and those available under the trade designation VERSAMID (e.g., VERSAMID 100 and VERS AMID 115x70) from Gabriel Performance Chemicals, Ashtabula, Ohio.In some embodiments, the primer composition and / or electrically conductive composition of the present disclosure and / or useful in the adhesive system of the present disclosure includes a rubber. In some embodiments, the rubber is a block copolymer. In some embodiments, the block copolymer comprises one or more polystyrene blocks. If one or two polystyrene blocks are present, the block copolymer can be designated as an AB block copolymer (containing one polystyrene block) and an ABA block copolymer (containing two polystyrene blocks), "A" designating polystyrene and "B" designating polydiene or hydrogenated polydiene. The polydiene or hydrogenated polydiene block is modified to contain an average of one or more carboxyl groups.Examples of a polydiene block or a hydrogenated polydiene block include, e.g., a polybutadiene, polyisoprene, ethylene / butylene, or ethylene / propylene block. The term "polydiene" refers to repeating units of a diene monomer. The hydrogenated polydiene block may have a residual unsaturation of less than 10%, or less than 5%, based on the original amount of ethylenic unsaturation of the polydiene block. Examples of compounds which may be reacted with the poly diene block or the hydrogenated poly diene block to provide the substituent carboxyl groups include carboxylic acids and anhydrides (e.g., maleic acid and maleic anhydride).An example of a useful block copolymer is a maleated styrene-ethylene / butylene-styrene block copolymer. The term "maleated" means that the polydiene or hydrogenated polydiene block is modified, for example, with maleic acid or maleic anhydride so that the polydiene or hydrogenated polydiene block contains an average of one or more carboxyl groups. Another example of a useful block copolymer is a styrene-ethylene / butylene-styrene triblock copolymer containing 2% by weight succinic anhydride (the source of the carboxyl groups) (commercially available from Kraton Performance Polymers, Inc., Houston, Tex., under the trade designation "Kraton FG-1901X").Rubbers described in U.S. Pat. Nos. 10,640,656 (Moren et al.), 5,602,202 (Groves), and 5,677,376 (Groves) may also be useful in the primer composition and / or electrically conductive composition of the present disclosure.The primer composition of the present disclosure and primer composition and / or electrically conductive composition useful in the adhesive system and method of the present disclosure include electrically conductive filler. A variety of electrically conductive fillers can be useful for practicing the present disclosure. The electrically conductive filler can comprise at least one of particles, fibers, or flakes. The electrically conductive filler can comprise a metal (e.g.. silver, copper, gold, aluminum, ornickel), mixed metal, alloy, metal oxide, composite metal oxide, metal coated glass, and / or organometallic complexes complexes such as phthalocyanine pigments, anthraquinone, indigoid, quinacridone, and dioxazine pigments. Further useful examples of electrically conductive filler include graphene, graphite, carbon nanotubes (CNT), and conductive carbon black. The electrically conductive filler can have any desired particle size, including in a range from 10 nanometers to 10 micrometers. In some embodiments, the electrically conductive filler comprises at least one of particles, fibers, or flakes of at least one of conductive carbon black; graphite; graphene; CNT; or metal comprising at least one of silver, copper, gold, aluminum, or nickel.“Conductive carbon black” is a term known in the art to be distinct from pigment carbon black. Conductive grades of carbon black include those from Imerys Graphite & Carbon, Bodio, Switzerland under the trade designation “Super P Conductive Carbon Black”, from Columbian Chemical Company, Atlanta, GA under the trade designation “CONDUCTEX 975 ULTRA”, from Degussa, Frankfurt, Republic of Germany under the trade designation “PRINTEX XE-2”, and from Cabot Corporation, Boston, MA, under the trade designation “BLACK PEARLS 2000”. Conductive carbon black generally has smaller particles sizes, more structure (e.g., high void volume), more porosity, and less surface functionality than pigment carbon black. Conductive carbon black can comprise 99% amorphous carbon. Typically, conductive carbon black has an oil absorption number (OAN) of at least 170 mL / 100 g, measured using techniques known in the art.In some embodiments, the weight ratio of the polymer to the electrically conductive filler is not more than 5 : 1, 4 : 1, 3 : 1, or 2 : 1. In some embodiments, the weight ratio of the polymer to the electrically conductive filler is in the range from 2 : 1 to 0.75 : 1. The weight ratio of the polymer to the electrically conductive filler can be approximately 1 : 1 (i.e., in a range from 1.1 : 1 to 0.9 : 1). When the weight ratio of the polymer to the electrically conductive filler is too high, for example, more than 5 : 1, 4 : 1, 3 : 1, or 2 : 1, the ability to provide electric debonding can be diminished.The primer composition of the present disclosure and the primer composition and / or electrically conductive composition useful in the adhesive system and method of the present disclosure include solvent, in some embodiments, organic solvent. Examples of useful solvents for the primer composition include alcohols (e.g., monohydroxy alcohols having from 1 to 8 or more carbon atoms such as methanol, ethanol, isopropanol, propanol, butanol, isooctyl alcohol, and tertiary alcohols and polyols such as ethylene glycol); ketones and esters each having up to six carbon atoms (e.g., methyl acetate, ethyl acetate, butyl acetate, acetone, or methyl ethyl ketone); aliphatic and aromatic hydrocarbons, chlorinated hydrocarbons (chloroform), N, N-dimethylformamide (DMF), N-methyl-2 -pyrrolidone (NMP), dimethylsulfoxide (DMSO), tetrahydrofuran (THF), and combinations thereof. In some embodiments, water can also be useful. In some embodiments, the solvent comprises at least one of a ketone or ester each having up to six carbon atoms. Selection of a solvent can be carried out based on, for example, the ability of the solvent to dissolve the polymer without degrading the electrically conductive filler, itsevaporation rate, and the application method. Furthermore, the selected solvent should not damage the substrate to which the composition is applied.In some embodiments, the solvent makes up at least 60 wt.%, 70 wt.%, 80 wt.%, 85 wt.%, or 90 wt.% of the primer composition or electrically conductive composition. In some embodiments, the solvent makes up not more than 96 wt.%, 95 wt.%, or 94 wt.% of the primer composition or electrically conductive composition. In some embodiments, when the solvent makes up more than 96 wt.% of the composition, the ability to provide electric debonding can be diminished. In some embodiments of the electrically conductive compositions in the adhesive system of the present disclosure, the solvent may make up not more than 50 wt.%, 60 wt.%, 70 wt.%, or 80 wt.% of the electrically conductive composition, based on its total weight.In some embodiments, the primer composition and / or electrically conductive composition of the present disclosure and / or useful in the adhesive system of the present disclosure includes a chemical crosslinker. Generally, any suitable chemical crosslinker may be used. Examples of useful chemical crosslinkers include covalent crosslinkers such as bisamides, multi-functional epoxies, melamines, multifunctional amines, and multi-functional aziridines; and ionic crosslinkers such as metal oxides and organometallic chelating agents (e.g., aluminum acetylacetonate). In some embodiments, such crosslinkers are useful with polyurethane and polyacrylate polymers in the primer and / or electrically conductive composition. Crosslinking of the polyurethane or polyacrylate using chemical crosslinkers may be initiated using any conventional technique, such as thermal initiation. In some embodiments, the primer composition and / or electrically conductive composition of the present disclosure include from 0.1 to 5 wt.% or 0.1 to 1 wt.% of an aziridine crosslinker based on the total weight of the polymer in the composition. Alternatively, or additionally, in some embodiments, the primer composition and / or electrically conductive composition of the present disclosure may include 0.1 to 5 wt.% or 0.1 to 2 wt.% of an epoxy crosslinker based on the total weight of the polymer in the composition. It is believed that the addition of a chemical crosslinking agent may further enhances the shear and cohesive strength of the adhesive, as well as the chemical and high temperature creep resistance. As an alternative to, or in addition to chemical crosslinking, the polymers may be crosslinked by subjecting them to gamma, electron beam, or ultraviolet radiation (with or without a photoinitator).Primer compositions and / or electrically conductive compositions useful in the adhesive systems and method of the present disclosure can include dispersants. Dispersants may be useful, for example, for dispersing electrically conductive particles, particularly, when the electrically conductive adhesives include not more than 80 wt.%, 70 wt.%, or 60 wt.% solvent. Examples of useful dispersants include titanate esters such as titanate chelates include acetylacetonate titanate chelate, triethanol amine titanate chelate, and those obtained from Dorfketal, Germany, under the trade designation “TYZOR”, polymer dispersants such as AB polymer dispersants as described in U.S. Pat. No. 4,656,226 and those available under the trade designation “DISPERBYK 161, 162, and 170” from Byk-Chemie, Wallingford, Conn., comb dispersants such as those available under the trade designation “SOLSPERSE 24000” from Zeneca,Wilmington, Del., and combinations thereof. A variety of surfactants may be useful including anionic, nonionic, and cationic surfactants. Examples of anionic surfactants include sulfonates, carboxylates, and phosphates. Examples of cationic surfactants include quaternary amines. Examples of nonionic surfactants include block copolymers containing ethylene oxide and silicone surfactants, such as ethoxylated alcohols, ethoxylated fatty acids, sorbitan derivatives, lanolin derivatives, ethoxylated nonyl phenols, and alkoxylated polysiloxanes. In some embodiments, the primer composition and / or electrically conductive composition includes at least 0.1 wt.%, in some embodiments, at least 0.5 wt.%, of one or more dispersants. In some embodiments, the primer composition includes not more than 5 wt.%, in some embodiments, not more than 2 wt.%, of one or more dispersants. Defoamers such as polydimethylsiloxane and rheology modifiers may also be useful.Some commercially available conductive inks are useful as electrically conductive compositions in the electrically debonding adhesive system and methods of the present disclosure. These include Conductive Silver Ink Part# SP-60 available from M.E. Taylor Engineering Inc. Rockville, MD, and EDAG 479SS E&C conductive ink from Tekra LLC, New Berlin, WI.Primer compositions of the present disclosure and electrically conductive compositions useful for practicing the present disclosure can be applied to clean substrates through the methods of brushing (e.g., using a soft-bristle brush), spraying (e.g., using a spray gun or aerosol can), jetting (e.g., using a jetting gun or nozzle), printing (e.g, screen printing or flexo printing), or dipping. Substrates can be cleaned before such methods using solvents (e.g., isopropyl alcohol). Solvent can be removed from the composition by allowing it to dry for 10, 20, or 30 minutes or longer in an ambient environment. The drying time can vary depending on factors such as temperature, humidity, and primer thickness.The present disclosure provides an adhesive system comprising the primer composition described above in any of its embodiments in combination with an electrically debonding adhesive. In general, the primer composition is not a component of the adhesive tape. For example, the primer composition is not disposed on the tape backing to improve adhesion between the adhesive and the backing. In some embodiments, the adhesive generally adheres to a primed substrate surface without the formation of covalent bonds; in other words, the adhesive tape generally does not react with the primer composition to form covalent bonds. The present disclosure further provides an adhesive system comprising the electrically conductive composition described above in any of its embodiments in combination with an electrically debonding adhesive. The adhesive system may be useful, for example, for bonding a substrate such as a electrically nonconductive substrate.In the adhesive system of the present disclosure, the electrically debonding adhesive comprises an ionic liquid. The presence of an ionic liquid may be useful in easing the peel adhesion (or peel-ability) of the adhesive when reworking or recycling an article. An ionic liquid is a unique salt, which is in a liquid state at about 100°C or less, has negligible vapor pressure, and high thermal stability. The ionic liquid is composed of a cation and an anion and has a melting point of generally about 100 °C or less (i.e., being a liquid at about 100 °C or less), about 95 °C or less, or about 80 °C or less. Certain ionic liquids exist in amolten state even at room temperature since their melting points are less than room temperature, and therefore they are sometimes referred to as ambient temperature molten salts. The cation and / or anion of the ionic liquid are relatively sterically-bulky, and typically one and / or both of these ions are an organic ion. The ionic liquid can be synthesized by known methods, for example, by a process such as anion exchange or metathesis process, or via an acid-base or neutralization process.The cation of the ionic liquid can be, for example, a nitrogen-containing cation, a phosphonium ion, a sulfonium ion, including various delocalized heteroaromatic cations. Examples of nitrogencontaining cations include alkylammonium, imidazolium, pyridinium, pyrrolidinium, pyrrolinium, pyrazinium, pyrimidinium, triazonium, triazinium, quinolinium, isoquinolinium, indolinium, quinoxalinium, piperidinium, oxazolinium, thiazolinium, morpholinium, piperazinium, and combinations thereof. Examples of the phosphonium ion include tetraalkylphosphonium, arylphosphonium, alkylarylphosphonium, and combinations thereof. Examples of the sulfonium ion include alkylsulfonium, arylsulfonium, thiophenium, tetrahydrothiophenium, and combinations thereof. The alkyl group directly bonded to nitrogen atom, phosphorus atom, or sulfur atom may be a linear, branched or cyclic alkyl group having a carbon number of at least 1, 2, or 4 and not more than 8, 10, 12, 15, or 20. The alkyl group may optionally contain heteroatoms such as O and N and S in the chain or at the end of the chain (e.g., a terminal -OH group). The aryl group directly bonded to nitrogen atom, phosphorus atom, or sulfur atom may be a monocyclic or condensed cyclic aryl group having a carbon number of at least 5, 6, or 8 and not more than 12, 15, or 20. An arbitrary site in the structure constituting such a cation may be further substituted by an alkyl group, an alkenyl group, an alkynyl group, a cycloalkyl group, an aryl group, an arylalkyl group, an alkoxy group, an aryloxy group, a hydroxyl group, a carbonyl group, a carboxyl group, an ester group, an acyl group, an amino group, a dialkylamino group, an amide group, an imino group, an imide group, a nitro group, a nitrile group, a sulfide group, a sulfoxide group, a sulfone group, or a halogen atom, and a heteroatom such as oxygen atom, nitrogen atom, sulfur atom, or silicon atom may be contained in the main chain or ring of the structure constituting the cation.Suitable examples of the cation include N-ethyl-N'-methylimidazolium, N-methyl-N'- butylimidazolium, l-butyl-3-methylimidazolium, N-methyl-N-propylpiperidinium, N,N,N-trimethyl-N- propylammonium, N-methyl-N,N,N-tripropylammonium, N,N,N-trimethyl-N-butylammoniuim, N,N,N- trimethyl-N-methoxyethylammonium, N-methyl-N,N,N-tris(methoxyethyl)ammonium, N,N-dimethyl-N- butyl-N-methoxyethylammonium, N,N-dimethyl-N,N-dibutylammonium, N-methyl-N,N-dibutyl-N- methoxyethylammonium, N-methyl-N,N,N-tributylammonium, N,N,N-trimethyl-N-hexylammonium, N,N-diethyl-N-methyl-N-(2-methoxyethyl)ammonium, 1 -propyl -tetrahydrothiophenium, 1 -butyl - tetrahydrothiophenium, 1 -pentyl -tetrahydrothiophenium, 1 -hexyl -tetrahydrothiophenium, glycidyltrimethylammonium, N-ethylacryloyl-N,N,N-trimethylammonium, N-ethyl-N- methylmorphonium, N,N,N-trioctylammonium, N-methyl-N,N,N-trioctylammonium, N,N-dimethyl-N- octyl-N-(2-hydroxyethyl)ammonium, triethylsulfonium, trimethyl ammonium ethyl acrylate, dimethylaminoethyl methyl acrylate, and mixtures thereof.Suitable examples of the anion of the ionic liquid include a sulfate (R-OSO3-); a sulfonate (R-SO3-); a carboxylate (R-CO2-); a phosphate ((RO)2P(=O)O-); a borate represented by the formula: BR4-, such as tetrafluoroborate (BF4-) and tetraalkylborate; a phosphate represented by the formula: PR , such as hexafluorophosphate (PF6-) and hexaalkylphosphate; an imide (R2N-); a sulfonylimide; a methide (R3C-); a methanide, a nitrate ion (NO3-); a nitrite ion (NO2-); and a halide such as iodide or chloride. In the formulas listed above, each R may be independently a hydrogen atom, a halogen atom (fluorine, chlorine, bromine, iodine), a substituted or unsubstituted alkyl, alkenyl, alkynyl, cycloalkyl, aryl, arylalkyl, acyl, or sulfonyl group. A heteroatom such as an oxygen atom, a nitrogen atom, or a sulfur atom may be contained in the main chain or ring of the group R, and a part or all of hydrogen atoms on the carbon atom of the group R may be replaced with fluorine atoms. In the case where a plurality of R groups is present in the anion, these R groups may be the same or different.Examples of the anion containing a perfluoroalkyl group, which can be used, include a bis(perfluoroalkylsulfonyl)imide ((RfSCE N-), a perfluoroalkylsulfonate (RfSCE-) and a tris(perfluoroalkylsulfonyl)methide ((RfSCh C-) (wherein Rf represents a perfluoroalkyl group). The carbon number of the perfluoroalkyl group can be from at least 1, 2, 3, or 4 to at most 8, 10, 12, 15, or 20. Specific examples of a bis(perfluoroalkylsulfonyl)imide include bis(trifluoromethanesulfonyl)imide, bis(pentafluoroethanesulfonyl)imide, bis(heptafluoropropanesulfonyl)imide, and bis(nonafluorobutanesulfonyl)imide. Specific examples of a perfluoroalkylsulfonate include trifluoromethane sulfonate, pentafluoroethanesulfonate, heptafluoropropanesulfonate and nonafluorobutane sulfonate. Specific examples of the tris(perfluoroalkylsulfonyl)methide include tris(trifluoromethanesulfonyl)methide, tris(pentafluoroethanesulfonyl)methide, tris(heptafluoropropanesulfonyl)methide, and tris(nonafluorobutanesulfonyl)methide. Examples of fluorinated anions not comprising a C-F bond include hexafluorophosphate and bis(fluorosulfonyl)imide.In some embodiments, the ionic liquid is l-butyl-3-methylimidazolium bis(trifluoromethanesulfonyl)imide, tri -ethyl sulfonium bis(trifluoromethanesulfonyl)imide, l-butyl-3- methylimidazolium hexafluorophosphate, l-butyl-3-methylimidazolium iodide (BMI I), ethyl pyridinium bis(trifluoromethanesulfonyl)imide, trimethyl ammonium ethyl acrylate bis(trifluoromethanesulfonyl)imide, dimethylaminoethyl acrylate methyl bis(trifluoromethanesulfonyl)imide, dimethylaminoethyl acrylate methyl bis(fluorosulfonyl)imide, dimethylaminoethyl acrylate methyl tricyano methanide (DMAEAM TCM), a tetra alkyl ammonium with hydroxy functionality with bis(trifluoromethanesulfonyl)imide counterion, available under the trade designation “FC-5000” from 3M Co., Maplewood, MN, or a combination thereof. Ionic liquids not comprising any fluorine include BMI I and DMAEAM TCM. In some embodiments, the ionic liquid comprises at least one of dimethylaminoethyl acrylate methyl bis(fluorosulfonyl)imide or l-butyl-3- methylimidazolium hexafluorophosphate .The ionic liquid in the electrically debonding adhesive may be present at at least 0.5, 1, 1.5, or 2 wt.% and at most 2.5, 3, 4, 5, 6, 7, 8, 9, 10, 15, 20, or 25 wt.%. Enough ionic liquid (e.g., at least 0.5wt.%) should be added to enable electrical debonding, while too much ionic liquid (e.g., more than 25 wt.%) may negatively impact the physical properties of the composite adhesive, such as shear, peel adhesion, and / or ability to survive the random free fall test.The choice of the ionic liquid used in the composite adhesive can impact electrical debonding. For example, it may be advantageous to choose ionic liquids that have a high conductivity or ionic mobility. While not being limited by theory, it is believed that increased ionic liquid mobility in the adhesive is beneficial for electrical debonding. As such, it may be beneficial for the ionic liquid to be highly soluble in the adhesive matrix (i.e., the ionic liquid does not phase separate from the adhesive matrix). High mobility and high conductivity (e.g., having sheet resistance less than IxlO3ohms per square) of the ionic liquid in the adhesive matrix could help enable electrical debonding in thicker adhesives. In some embodiments the adhesive thickness could be 10, 25, 50, 60, 70, 80, 90, 100, 150, 200, 250, 300, 400, or even up to 500 microns thick. Alternatively, or additionally, it may be advantageous to choose ionic liquids that have electrochemically unstable cations or anions. While not wanting to be limited by theory, it is believed that more electrochemically unstable cations or anions could produce an increased electrical debonding response. As such, it may be beneficial to choose ionic liquids with cations comprised of imidazolium or pyridinium derivatives instead of quaternary ammonium cations.For the adhesive system, any suitable adhesive matrix can be used. In some embodiments, the electrically debonding adhesive is a single layer. In other embodiments, the electrically debonding adhesive comprises a multilayer adhesive construction such as in a double-sided adhesive tape with a film carrier layer. The electrically debonding adhesive may be a pressure-sensitive adhesive, a structural adhesive, or a semi-structural adhesive. Pressure sensitive adhesives (PSAs) are well known to one of ordinary skill in the art to possess certain properties including the following: (1) aggressive and permanent tack, (2) adherence with no more than finger pressure, (3) sufficient ability to hold onto an adherend, and (4) sufficient cohesive strength to be removable from an adherend. PSAs commonly provides overlap shear strength not exceeding 1 megaPascal (MPa) when bonding substrates at room temperature. As used herein, the term “semi-structural adhesive" refers to compositions, which may be cured or uncured, that have an overlap shear strength of at least 1.0 or at least 1.5 MPa at room temperature. Structural adhesives are cured compositions that have an overlap shear strength of at least 3.5, at least, at least 4, at least 5, at least 6, or at least 7 MPa at room temperature.In some embodiments, the electrically debonding adhesive useful in the adhesive system of the present disclosure comprises an adhesive (in some embodiments, pressure-sensitive adhesive) based on a (meth)acrylate copolymer. The (meth)acrylate copolymer typically has a glass transition temperature (Tg) that is no greater than 20°C, no greater than 10°C, no greater than 0°C, no greater than -10°C, no greater than -20°C, no greater than -30°C, no greater than -40°C, or no greater than -50°C. The glass transition temperature can be measured using techniques such as Differential Scanning Calorimetry and Dynamic Mechanical Analysis. Alternatively, the glass transition temperature can be estimated using theFox equation based on the monomers used to form the adhesive. Lists of glass transition temperatures for homopolymers are available from multiple monomer suppliers such as from BASF Corporation (Houston, TX, USA), Polyscience, Inc. (Warrington, PA, USA), and Aldrich (St. Louis, MO, USA) as well as in various publications such as, for example, Mattioni et al., J. Chem. Inf. Comput. Sci., 2002, 42, 232-240, and many are reported in the Polymer Properties Database found at polymerdatabase.com.The (meth)acrylate copolymers typically are formed from a monomer composition that contains at least one low Tg monomer. As used herein, the term “low Tg monomer” refers to a monomer having a Tg no greater than 20°C when homopolymerized (i.e., a homopolymer formed from the low Tg monomer has a Tg no greater than 20°C). Suitable low Tg monomers are often selected from an alkyl (meth)acrylates, heteroalkyl (meth)acrylates, aryl substituted alkyl acrylate, and aryloxy substituted alkyl acrylates. Examples of low Tg alkyl (meth)acrylate monomers often are non-tertiary alkyl acrylates but can be alkyl methacrylates having a linear alkyl group with at least 4 carbon atoms. Examples of alkyl (meth)acrylates include n-butyl acrylate, n-butyl methacrylate, isobutyl acrylate, sec-butyl acrylate, n- pentyl acrylate, 2-methylbutyl acrylate, n-hexyl acrylate, cyclohexyl acrylate, 4-methyl-2 -pentyl acrylate, 2 -methylhexyl acrylate, 2-ethylhexyl acrylate, n-octyl acrylate, 2-octyl acrylate, isooctyl acrylate, isononyl acrylate, isoamyl acrylate, n-decyl acrylate, isodecyl acrylate, n-decyl methacrylate, lauryl acrylate, isotridecyl acrylate, n-octadecyl acrylate, isostearyl acrylate, and n-dodecyl methacrylate. Isomers and mixture of isomers of these monomers can be used.Examples of low-Tg heteroalkyl (meth)acrylate monomers often have at least 3 carbon atoms, at least 4 carbon atoms, or at least 6 carbon atoms and can have up to 30 or more carbon atoms, up to 20 carbon atoms, up to 18 carbon atoms, up to 16 carbon atoms, up to 12 carbon atoms, or up to 10 carbon atoms. Specific examples of heteroalkyl (meth)acrylates include 2-ethoxyethyl acrylate, 2-(2- ethoxyethoxy)ethyl acrylate, 2-methoxyethyl (meth)acrylate, and tetrahydrofurfiiryl (meth)acrylate.Examples of low-Tg aryl substituted alkyl acrylates or aryloxy substituted alkyl acrylates include 2 -biphenylhexyl acrylate, benzyl acrylate, 2-phenoxyethyl acrylate, and 2-phenylethyl acrylate.Some monomer compositions for (meth)acrylate copolymers can include an optional polar monomer. The polar monomer has an ethylenically unsaturated group and a polar group such as an acidic group or a salt thereof, a hydroxyl group, a primary amido group, a secondary amido group, a tertiary amido group, or an amino group. Having a polar monomer often facilitates adherence of the pressuresensitive adhesive to a variety of substrates. Examples of polar monomers with an acidic group include ethylenically unsaturated carboxylic acids, ethylenically unsaturated sulfonic acids, ethylenically unsaturated phosphonic acids, and mixtures thereof. Examples of such compounds include acrylic acid, methacrylic acid, itaconic acid, fumaric acid, crotonic acid, citraconic acid, maleic acid, oleic acid, - carboxyethyl (meth)acrylate, 2-sulfoethyl methacrylate, styrene sulfonic acid, 2-acrylamido-2- methylpropane sulfonic acid, vinyl phosphonic acid, and mixtures thereof. Due to their availability, the acid monomer is often acrylic acid or methacrylic acid.In some embodiments, the electrically debonding adhesive comprises low amounts or is substantially free of acid. In electrically debonding applications, as will be described below, it can be advantageous to minimize the amount of acid in the composite adhesive to prevent corrosion of the electrically conductive materials. In some embodiments, the composite adhesive comprises less than 1, 2, 3, 4, or 5 wt. % of an acidic monomer (such as acrylic acid), or comprises no detectable acidic monomer.Examples of polar monomers with a hydroxyl group include hydroxyalkyl (meth)acrylates (e.g., 2 -hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3 -hydroxypropyl (meth)acrylate, 4- hydroxybutyl (meth)acrylate and 6-hydroxyhexyl (meth)acrylate), hydroxyalkyl (meth)acrylamides (e.g., 2 -hydroxyethyl (meth)acrylamide or 3 -hydroxypropyl (meth)acrylamide), ethoxylated hydroxyethyl (meth)acrylate (e.g., monomers commercially available from Sartomer (Exton, PA, USA) under the trade designation CD570, CD571, and CD572), and aryloxy substituted hydroxyalkyl (meth)acrylates (e.g., 2- hydroxy-2 -phenoxypropyl (meth)acrylate) .Examples of polar monomers with a primary amido group include (meth)acrylamide. Examples of polar monomers with secondary amido groups include N-alkyl (meth)acrylamides such as N-methyl (meth)acrylamide, N-ethyl (meth)acrylamide, N-isopropyl (meth)acrylamide, N-tert-octyl (meth)acrylamide, and N-octyl (meth)acrylamide.Examples of polar monomers with a tertiary amido group include N-vinyl caprolactam, N-vinyl- 2 -pyrrolidone, (meth)acryloyl morpholine, and N,N-dialkyl (meth)acrylamides such as N,N-dimethyl (meth)acrylamide, N,N-diethyl (meth)acrylamide, N,N-dipropyl (meth)acrylamide, and N,N-dibutyl (meth)acrylamide .Polar monomers with an amino group include various N,N-dialkylaminoalkyl (meth)acrylates and N,N-dialkylaminoalkyl (meth)acrylamides. Examples include N,N-dimethyl aminoethyl (meth)acrylate, N,N-dimethylaminoethyl (meth)acrylamide, N,N-dimethylaminopropyl (meth)acrylate, N,N- dimethylaminopropyl (meth)acrylamide, N,N-diethylaminoethyl (meth)acrylate, N,N-diethylaminoethyl (meth)acrylamide, N,N-diethylaminopropyl (meth)acrylate, and N,N-diethylaminopropyl (meth)acrylamide .A monomer composition for (meth)acrylate copolymers can optionally include a high Tg monomer. As used herein, the term “high Tg monomer” refers to a monomer that has a Tg greater than 30°C, greater than 40°C, or greater than 50°C when homopolymerized (i.e., a homopolymer formed from the monomer has a Tg greater than 30°C, greater than 40°C, or greater than 50°C). Some suitable high Tg monomers have a single (meth)acryloyl group such as methyl methacrylate, ethyl methacrylate, n-propyl methacrylate, isopropyl methacrylate, n-butyl methacrylate, isobutyl methacrylate, sec-butyl methacrylate, tert-butyl (meth)acrylate, cyclohexyl methacrylate, isobomyl (meth)acrylate, stearyl (meth)acrylate, phenyl acrylate, benzyl methacrylate, 3,3,5 trimethylcyclohexyl (meth)acrylate, 2- phenoxyethyl methacrylate, N-octyl (meth)acrylamide, and mixtures thereof. Other suitable high Tg monomers have a single vinyl group that is not a (meth)acryloyl group such as, for example, various vinyl ethers (e.g., vinyl methyl ether), vinyl esters (e.g., vinyl acetate and vinyl propionate), styrene, substitutedstyrene (e.g., a -methyl styrene), vinyl halide, and mixtures thereof. Vinyl monomers having a group characteristic of polar monomers are considered herein to be polar monomers.Overall, the pressure-sensitive adhesive can contain up to 100 weight percent (e.g., 100 weight percent) low Tg monomer units. The weight percent value is based on the total weight of monomeric units in the polymeric material. In some embodiments, the (meth)acrylate polymer contains 40 to 100 weight percent of the low Tg monomeric units, 0 to 15 weight percent polar monomeric units, 0 to 50 weight percent high Tg monomeric units, and 0 to 15 weight percent vinyl monomeric units. In some embodiments, the (meth)acrylate polymer contains 60 to 100 weight percent of the low Tg monomeric units, 0 to 10 weight percent polar monomeric units, 0 to 40 weight percent high Tg monomeric units, and 0 to 10 weight percent vinyl monomeric units. In some embodiments, the (meth)acrylate polymer contains 75 to 100 weight percent of the low Tg monomeric units, 0 to 10 weight percent polar monomeric units, 0 to 25 weight percent high Tg monomeric units, and 0 to 5 weight percent vinyl monomeric units.In some embodiments, the electrically debonding adhesive comprises: a polymer matrix comprising units of: a (meth)acrylate macromer, wherein the (meth)acrylate macromer comprises a poly(ethylene oxide) group, a polypropylene oxide) group, a polyethylene oxid -co- propylene oxide), a poly(tetrahydrofuran) group, or combinations thereof; one or more of a Cl to C12 (meth)acrylate ester monomer; a cross-linking agent; and none to at most 7 wt % of a hydroxyl group-containing (meth)acrylate monomer; and a plurality of polymeric nanoparticles wherein the polymeric nanoparticles comprise an interior region comprising a polymer having a glass transition temperature below room temperature and an outer shell comprising a polymer having a glass transition temperature of at least 50°C as described in copending application PCT / IB2023 / 055250, fded May 22, 2023.In some embodiments, the electrically debonding adhesive comprises: a polymer matrix comprising units of: a (meth)acrylate macromer, wherein the (meth)acrylate macromer comprises a poly(ethylene oxide) group, a polypropylene oxide) group, a polyethylene oxid -co- propylene oxide), a poly(tetrahydrofuran) group, or combinations thereof; one or more of a Cl to C12 (meth)acrylate ester monomer; and a cross-linking agent; and a plurality of polymeric microspheres, wherein the polymeric microspheres are derived from at least 20 to at most 99 wt % of a (meth)acrylate monomer having a Tg above room temperature and at least 1 wt% of a polar (meth)acrylate monomer as described in copending application PCT / IB2023 / 051903, filed March 1, 2023.In these embodiments, the (meth)acrylate macromer included in the polymerizable components used to form the (meth)acrylate-based polymer matrix has a (meth)acryloyloxy group plus (i) apoly(ethylene oxide) group, (ii) polypropylene oxide) group, (iii) polyethylene oxide-co-propylene oxide) group, which can also be referred to as a polyethylene glycol), polypropylene glycol), or polyethylene glycol-co-propylene glycol) groups respectively, (iv) a poly(tetrahydrofuran) group, or (v) combinations thereof. If the macromer contains a poly(ethylene oxide) group, it can be referred to as a polyethylene oxide) (meth)acrylate. If the macromer contains a polypropylene oxide) group, it can be referred to as a polypropylene oxide) (meth)acrylate. If the macromer contains a poly(ethylene oxide-co- propylene oxide) group, it can be referred to as a poly(ethylene oxide-co-propylene oxide) (meth)acrylate, which is a copolymer. If the macromer contains a poly(tetrahydrofuran) group, it can be referred to as a poly (tetrahydrofuran) (meth)acrylate .The (meth)acrylate macromer typically has a number average molecular weight in a range of 350 to 10,000 Daltons. For example, the (meth)acrylate macromer has a number average molecular weight no greater than 10,000, 8000, 6000, 4000, 2000, 1000, 800, 650, or even 500 Daltons. The number average can be determined by gel permeation chromatography using techniques known in the art.The (meth)acrylate macromer often has a Tg (as measured using a homopolymer of the macromer) that is no greater than -10°C. For example, the glass transition temperature can be no greater than -10, -20, -30, or even -40°C. In some embodiments, the Tg is less than -70 or even -80 °C. Such a low macromer Tg imparts compliance and flexibility to the (meth)acrylate copolymer and to the adhesive composition.Examples of such commercially available (meth)acrylate macromers include poly(ethylene glycol) methyl ether acrylate, such as that having a reported number average molecular weight (Mn) of 480 Daltons (available from Sigma- Aldrich) and polypropylene glycol) acrylate, such as that having a reported number average molecular weight of 475 Daltons (available from Sigma- Aldrich). Other suitable macromers are available under the trade designation BISOMER from Geo Specialty Chemicals, Ambler, PA, such as BISOMER PPA6 polypropylene glycol) acrylate reported to have a number average molecular weight of 420 Daltons), BISOMER PEM63P HD (a mixture of poly(ethylene glycol) methacrylate and polypropylene glycol) reported to have a number average molecular weight of 524 Daltons), BISOMER PPM5 LI polypropylene glycol) methacrylate reported to have a number average molecular weight of 376 Daltons), BISOMER PEM6 LD (poly(ethylene glycol) methacrylate reported to have a number average molecular weight of 350 Daltons), BISOMER MPEG350MA (methoxy poly(ethylene glycol) methacrylate) reported to have a number average molecular weight of 430 Daltons), and BISOMER MPEG550MA (methoxy poly(ethylene glycol) methacrylate reported to have a number average molecular weight of 628 Daltons). Other suitable macromers are available under the trade designation MIRAMER from Miwon Specialty Chemical Company, Gyeonggi-do, Korea, such as MIRAMER Ml 93 MPEG600MA (methoxy poly(ethylene glycol) methacrylate reported to have a number average molecular weight of 668 Daltons, MIRAMER Ml 64 (nonyl phenol poly(ethylene glycol) acrylate reported to have a number average molecular weight of 450 Daltons), MIRAMER Ml 602 (nonyl phenol poly(ethylene glycol) acrylate reported to have a number average molecular weight of 390Daltons), and MIRAMER Ml 66 (nonyl phenol poly(ethylene glycol) acrylate reported to have a number average molecular weight of 626 Daltons. Still other suitable macromers are available from Sans Esters Corporation, New York, NY such as MPEG-A400 (methoxy polyethylene glycol) acrylate reported to have a number average molecular weight of 400 Daltons), and MPEG-A550 (methoxy polyethylene glycol) acrylate reported to have a number average molecular weight of 550 Daltons. Various combinations of such macromers may be used if desired.The macromer having the poly(tetrahydrofuran) group can be prepared, for example, by polymerizing tetrahydrofuran using cationic polymerization. More specifically, the polymerization reaction can occur at room temperature (e.g., 20 to 25°C) using trifluoromethane sulfonate as the initiator to form an intermediate (A) where n is equal to the number of -CH2CH2CH2CH2O- groups. Intermediate (A) is then reacted with hydroxybutyl acrylate in the presence of N,N-diisoproylethylamine to form the poly(tetrahydrofuran) (meth)acrylate macromer. The weight average molecular weight of the poly(tetrahydrofuran) (meth)acrylate macromer is typically in a range of 350 to 10,000 Daltons, which can be determined using known methods such as gel permeation chromatography with polystyrene standards. If the molecular weight is higher, it may not be miscible with the other components in the polymerizable composition and / or it may crystallize before, during, or after polymerization of the matrix. In many embodiments, the poly(tetrahydrofuran) (meth)acrylate macromer has a weight average molecular weight of at least 500, 600, 800, 1,000, 2,000 or even 3,000 Daltons and up to 10,000, 8,000, 6,000, 5,000, or even 3,000 Daltons.The (meth)acrylate monomer used to form the polymer matrix is a Cl to C12 (meth)acrylate ester monomer. Useful Cl to C12 (meth)acrylate ester monomers include at least one monomer selected from the group consisting of a monofimctional (meth)acrylate ester of a linear, branched, and / or cyclic non- tertiary alkyl alcohol, the alkyl group of which comprises at least 1, 2, 3, 4, 5, 6, 7, or even 8 carbon atoms; and at most 10, 11, or even 12 carbon atoms. In some embodiments, the (meth)acrylate ester monomer comprises 1 to 12 carbon atoms. Examples of such (meth)acrylate monomers include, methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, 2-methylbutyl acrylate, n-butyl acrylate, isobutyl acrylate, tert-butyl (meth)acrylate, n-pentyl (meth)acrylate, iso-pentyl (meth)acrylate, n-hexyl (meth)acrylate, iso-hexyl (meth)acrylate, cyclohexyl (meth)acrylate, phenyl (meth)acrylate, n-octyl (meth)acrylate, iso-octyl (meth)acrylate, 2-octyl(meth)acrylate, 2-ethylhexyl (meth)acrylate, decyl (meth)acrylate, lauryl (meth)acrylate, 2-propylheptyl (meth)acrylate, isobomyl (meth)acrylate, benzyl (meth)acrylate, nonyl acrylate, isophoryl (meth)acrylate, dodecyl (meth)acrylate, and any combinations or mixtures thereof. In some embodiments, the Cl to C12 (meth)acrylate monomer is a Cl to Cl 2 acrylate monomer.In some embodiments, the (meth)acrylate monomer used to form the polymer matrix is copolymerized with polar copolymerizable monomers. The polar copolymerizable monomers can be acid or non-acid functional polar monomers such as acrylic acid, hydroxyethyl acrylate, N-methyl acrylamide, or any monomer having a sidechain containing at least one of the following: alcohol, carboxylic acid,amine, amide, imide, thiol, ester, phosphate, and combinations thereof. Examples of polar monomers include any of those described above.When copolymerized with strongly polar monomers, the Cl to C 12 (meth)acrylate monomer generally comprises at least about 75 wt.% of the polymerizable monomer composition for the matrix. When copolymerized with moderately polar monomers, the Cl to C 12 (meth)acrylate ester monomer generally comprises at least about 50 wt.% of the polymerizable monomer composition for the matrix. Strongly polar monomers include mono-olefinic mono- and dicarboxylic acids, hydroxy alkyl acrylate, cyanoalkyl acrylates, acrylamides or substituted acrylamides, and moderately polar monomers include N- vinyl pyrrolidone, acrylonitrile, vinyl chloride, and diallyl phthalate. In some embodiments, the strongly polar monomer comprises up to about 25 wt.% or up to about 15 wt.% of the polymerizable monomer composition for the polymer matrix. In some embodiments, the moderately polar monomer comprises up to about 30 wt.%, in some embodiments, from about 5 wt% to about 30 wt%, of the polymerizable monomer composition for the matrix.In some embodiments, the (meth)acrylate monomer used to form the polymer matrix is copolymerized with additional monomers, such as a non-polar monomer. Examples of suitable non-polar comonomers include 3,3,5-trimethylcyclohexyl acrylate, cyclohexyl acrylate, t-butyl acrylate, methyl methacrylate, ethyl methacrylate, and combinations thereof.The cross-linking agent is used to create a three-dimensional polymer network and to achieve high internal strength of the (meth)acrylate-based matrix within the electrically debonding adhesive. Useful cross-linking agents include photosensitive cross-linking agents, which are activated by ultraviolet (UV) light. Useful cross-linking agents include: multifunctional (meth)acrylates, triazines, and combinations thereof. Examples of useful cross-linking agents include substituted triazines such as 2,4,- bis(trichloromethyl)-6-(4-methoxy phenyl)-s-triazine, 2,4-bis(trichloromethyl)-6-(3,4-dimethoxyphenyl)- s-triazine, and the chromophore -substituted halo-s-triazines disclosed in U.S. Pat. Nos. 4,329,384 and 4,330,590 (Vesley). Other useful cross-linking agents include multifunctional alkyl acrylate monomers such as trimetholpropane triacrylate, pentaerythritol tetra-acrylate, 1,2-ethylene glycol diacrylate, 1,4- butanediol diacrylate, 1,6-hexanediol diacrylate, and 1,12-dodecanol diacrylate. Various other crosslinking agents with different molecular weights between (meth)acrylate functionality may also be useful.The Cl to C 12 (meth)acrylic ester monomer, the (meth)acrylate macromer, and any optional comonomers are polymerized to form the (meth)acrylate-based polymer matrix. In some embodiments, the polymer matrix should be derived from no more than 7 wt.% of a hydroxyl group-containing (meth)acrylate monomer. In some embodiments, no more than 7, 6, 5, 4, 2, 1, or even 0.5 wt.% or even no hydroxyl group-containing (meth)acrylate monomer is used in the polymerization of the (meth)acrylate matrix.In some embodiments, the polymer of the matrix comprises at least 40, 50, 60, 70, or 75 wt.%; at most 80, 85, 90, 95, 97, or 99.5 % by weight of a Cl to C12 (meth)acrylate ester monomer units based on the total weight of monomer units in the polymer. In some embodiments, the polymer of the matrixcomprises at least 0.5, 1.0, 2.5, 5, 8, or 10 wt.%; at most 15, 18, 20, 25, 30, 35, 40, 45, or 50 wt.% of a polar monomer units based on the total weight of the monomer units. In some embodiments, the polymer of the matrix contains at least 1, 1.5, 2, 5, 10, 15, 20, 25, 30, or 35 wt.% of units of the (meth)acrylate macromer; at most 60, 55, 50, 45, 40, 30, or 20 wt.%. The amount of (meth)acrylate macromer used is based on the total weight of polymerized units in the matrix. In some embodiments, a cross-linking agent may be added at a level of at least 0.01, 0.1, 0.5, 1.0, or even 1.5 part; at most 2, 3, 4, 5, 6, 8, or 10 parts per 100 parts by weight of all of the polymerizable components used in the preparation of the (meth)acrylate-based polymer matrix. In another embodiment, an initiator is used that will generate crosslinking in situ by abstracting hydrogens from the polymer in the matrix allowing cross-linking of the (meth)acrylate-based matrix. Typically, a cross-linking initiator is used in concentrations of at least 0.01, 0.1, 0.5, 1.0, 1.5, or 2 parts; at most 3, 4, 5, 6, 8, or even 10 parts per 100 parts by weight of all of the monomers used in the preparation of the (meth)acrylate-based matrix.In some embodiments, the polymer in the (meth)acrylate -based matrix has a weight average molecular weight of at least 100,000; 200,000; 300,000; 400,000; 500,000; 750,000; or 1,000,000 grams per mole; at most 20,000,000; 25,000,000; or 30,000,000 grams per mole. The molecular weight of the polymer can be determined by gel permeation chromatography as is known in the art. The polymer typically has a molecular weight dispersity that can be calculated as the weight average molecular weight versus the number average molecular weight of the polymer. The inherent viscosity is related to the molecular weight of the polymer, but also includes other factors, such as concentration of the polymer. In the present disclosure, the inherent viscosity of the polymer may be at least 0.4, 0.45, 0.5, 0.6, 0.7, or even 0.8; at most 0.7, 0.8, 1.0, 1.2, 1.4, 1.6, 1.8 or even 2,3 as measured in ethyl acetate at a concentration of 0.15 grams / deciliter (g / dL).The molecular weight of the polymer in the (meth)acrylate-based matrix may be controlled using techniques known in the art. For example, during polymerization, a chain transfer agent may be added to the monomers to control the molecular weight. Examples of useful chain transfer agents include those selected from the group consisting of carbon tetrabromide, alcohols, mercaptans, and mixtures thereof. Examples of chain transfer agents are isooctylthioglycolate and carbon tetrabromide. At least 0.01, 0.05, 0.1, 0.15, 0.2, 0.3, or even 0.4 parts by weight of a chain transfer agent may be used; at most 0.1, 0.2, 0.3, 0.4, 0.5, or even 0.6 parts by weight of a chain transfer agent may be used based upon 100 parts by weight of all of the monomers used in preparation of the (meth)acrylate-based matrix.The (meth)acrylate-based matrix used in the electrically debonding adhesive of the present disclosure may be polymerized by techniques known in the art, including, for example, the conventional techniques of solventless polymerization. The polymerization of the monomers "substantially solvent free", that less than 5%, 2%, 1% or even 0.5% by weight of solvent is used based on the weight of the monomers, and in some embodiments, no additional solvent is added during the polymerization. The term "solvent" refers both to water and to conventional organic solvents.The (meth)acrylate monomer including any of those described above and, in some embodiments, the (meth)acrylate macromer can be polymerized by various techniques, in some embodiments, photoinitiated bulk polymerization. An initiator is typically added to aid in polymerization of the monomers. The type of initiator used depends on the polymerization process. In some embodiments, a photoinitiator is used. In some embodiments, the free radical photoinitiator useful to make the electrically debonding is a type I (cleavage-type) photoinitiator. Cleavage-type photoinitiators include acetophenones, alpha-aminoalky Iphenones, benzoin ethers, benzoyl oximes, acyl (e.g., benzoyl) phosphine oxides, acyl (e.g., benzoyl) phosphinates, and mixtures thereof. Examples of useful benzoin ethers include benzoin methyl ether and benzoin butyl ether. Examples of suitable acetophenone compounds include 4-diethylaminoacetophenone, 1 -hydroxy cyclohexyl phenyl ketone, 2-benzyl-2 dimethylamino-4'-morpholinobutyrophenone, 2-hydroxy-2-methyl-l-phenylpropan-l one, 2,2- dimethoxyacetophenone, and 2,2-dimethoxy-l,2-diphenylethan-l-one. Example of suitable acyl phosphine oxide, acyl phosphinate, and acyl phosphonate compounds include bis(2,6-dimethoxybenzoyl)- 2,4,4-trimethylpentyl phosphine oxide, phenylbis(2,4,6-trimethylbenzoyl) phosphine oxide, ethyl phenyl(2,4,6-trimethylbenzoyl)phosphinate, (2,4,6-trimethylbenzoyl)diphenylphosphine oxide, dimethyl pivaloylphosphonate, and poly(oxy-l,2-ethanediyl), a,a',a"-l,2,3-propanetriyltris[co-[[phenyl(2,4,6- trimethylbenzoyl)phosphinyl]oxy]. Further suitable photoinitiators include substituted a-ketols such as 2- methyl-2-hydroxy propiophenone; aromatic sulfonyl chlorides such as 2-naphthalene -sulfonyl chloride; and photoactive oximes such as 1 -phenyl- l,2-propanedione-2-(O-ethoxy-carbonyl)oxime. Many photoinitiators are available, for example, from BASF, Vandalia, Ill. under the trade designation “IRGACURE”, from IGM Resins, Waalwijk, Netherlands, under the trade designations “OMNIRAD” and “ESACURE”. Two or more of any of these photoinitiators may also be used together in any combination. Additional photoinitiator can be added to a mixture to be coated after the copolymer has been formed, (i.e., photoinitiator can be added to the syrup polymer mixture described below). Generally, the photoinitiator is present in an amount of about 0.005 to 1 weight percent based on the weight of the monomers. In another embodiment, a thermal initiator may be used, such as for example, AIBN (azobisisobutyronitrile) and / or peroxides.In some embodiments, the components to be polymerized are partially polymerized to form a syrup. As used herein a syrup refers to a mixture that has been thickened to a coatable viscosity, i.e., between about 300 and 10,000 centipoise or higher depending upon the coating method used, and include mixtures in which the monomers are partially polymerized to form the syrup, and monomeric mixtures which have been thickened with fillers such as silicas.The components may be irradiated with activating ultraviolet (UV) radiation having a UV A maximum in the range of 280 to 425 nanometers to polymerize the monomer component(s). UV light sources can be of various types. Low light intensity sources, such as blacklights, generally provide intensities ranging from 0.1 or 0.5 mW / cm2(millwatts per square centimeter) to 10 mW / cm2(as measured in accordance with procedures approved by the United States National Institute of Standards andTechnology as, for example, with a UVIMAP UM 365 L-S radiometer manufactured by Electronic Instrumentation & Technology, Inc., in Sterling, VA). High light intensity sources generally provide intensities greater than 10, 15, or 20 mW / cm2ranging up to 450 mW / cm2or greater. In some embodiments, high intensity light sources provide intensities up to 500, 600, 700, 800, 900 or 1000 mW / cm2. UV light to polymerize the monomer component(s) can be provided by various light sources such as light emitting diodes (LEDs), blacklights, medium pressure mercury lamps, etc., or a combination thereof. The composite composition can also be polymerized with higher intensity light sources as available from Fusion UV Systems Inc., Gaithersburg, MD. The UV exposure time for polymerization and curing can vary depending on the intensity of the light source(s) used.In some instances, it may be useful to add additional monomer to the syrup, as well as further free-radical initiator and other additives such as the ionic liquid and polymeric particles described herein. The mixture can then be coated onto a substrate such as a transparent film, which may optionally be coated with a release coating, and exposed to UV radiation in a nitrogen rich atmosphere to form an adhesive. Alternatively, oxygen can be excluded by overlaying the coated adhesive with a second release coated film and exposed to UV radiation. Subsequent exposure of the adhesive to a second source of energy can be used to cross-link or further cure the adhesive. Such sources of energy include heat, electron beam, gamma radiation, and high intensity ultraviolet lamps, such as mercury arc lamps.An acrylic polymer can be analyzed by nuclear magnetic resonance spectroscopy (1H or13C NMR) to identify the monomer units in the polymer. Solid state or solution NMR may be useful depending on the level of crosslinking in the polymer. For solid state NMR the acrylic polymer can be swelled in an appropriate solvent for analysis. The degree of conversion (of monomers to copolymer) can be monitored during the irradiation by measuring the index of refraction of the polymerizing mixture.In some embodiments, the electrically debonding adhesive includes polymeric microspheres. The polymeric microspheres of the present disclosure are derived from a first (meth)acrylate monomer and a polar (meth)acrylate monomer. The first (meth)acrylate monomer is selected from those (meth)acrylate monomers, wherein a homopolymer of the first (meth)acrylate monomer has a glass transition temperature (Tg) above room temperature (e.g., 23°C), 50, 80, 100, or even 150°C. In some embodiments, the first (meth)acrylate monomer has a Tg no greater than 200, or even 250 °C. Such first (meth)acrylate monomers include alkyl(meth)acrylates comprising at least 1, 2, 4, 6, 8, 10, 12, or 14 carbon atoms; and at most 16, 18, 20, 25, or 30 carbon atoms. Examples of such first (meth)acrylate monomers include methyl methacrylate, ethyl methacrylate, n-propyl methacrylate, isopropyl methacrylate, n-butyl methacrylate, isobutyl methacrylate, sec-butyl methacrylate, tert-butyl (meth)acrylate, cyclohexyl methacrylate, isobomyl (meth)acrylate, stearyl (meth)acrylate, phenyl (meth)acrylate, benzyl methacrylate, 2-phenoxyethyl methacrylate, 3,3,5 trimethylcyclohexyl (meth)acrylate, and mixtures thereof. In some embodiments, the polymeric microspheres are derived from at least 20, 25, 30, 40, 50, 55, 60, 65, 70, or 75 wt.% and at most 70, 75, 80, 85, 90, 95, or 99 wt.% of the first (meth)acrylate monomer, which may be a mixture of monomers. The amount of the first(meth)acrylate used to make the plurality of polymeric microspheres can be adjusted based on the application.The polar (meth)acrylate monomer is acrylic acid, hydroxyethyl acrylate, N-methyl acrylamide, or any monomer having a sidechain containing at least one of the following: alcohol, carboxylic acid, amine, amide, imide, thiol, ester, phosphate, or combinations thereof. Examples of polar monomers include any of those described above. In some embodiments, the polymeric microspheres are derived from at least 1, 2, 4, or 5 wt % and at most 20, 15, or 10 wt% of the polar (meth)acrylate monomer. Although not wanting to be limited by theory, it is believed that the polar (meth)acrylate monomer, which polymerizes into the microspheres enables the microspheres to interact with the (meth)acrylate matrix, enhancing the strength (e.g., as determined by higher peak stress in dynamic shear) of the composite.In some embodiments, additional comonomers may be used in addition to the first (meth)acrylate monomer and the polar (meth)acrylate monomer to make polymeric microspheres. In one embodiment, the additional comonomers are those monomers that have a Tg lower than room temperature. These comonomers, when polymerized with the first (meth)acrylate monomers, result in a copolymer having a Tg of room temperature or above. Examples of additional comonomers include 2-ethyl hexyl (meth)acrylate and n-butyl acrylate.The polymeric microspheres may be made using techniques known in the art. In some embodiments, the polymeric microspheres can be made via suspension polymerization of a reaction mixture comprising the first (meth)acrylate monomer, the polar (meth)acrylate monomer, optional comonomers, and a stabilizer. In some embodiments, a suspension of monomers is formed, and polymerization is carried out using thermal initiation. The suspension may be a water-in-oil or an oil-in- water suspension. In some such embodiments, the suspension is an oil-in-water suspension, wherein the monomers are stabilized in a bulk water phase by employing one or more stabilizers. Stabilizers useful in embodiments of the present disclosure can include, for example, inorganic stabilizers, surfactants, polymer additives, or combinations thereof.In some embodiments, the stabilizer may be an inorganic stabilizer such as those used in Pickering emulsion polymerizations (e.g., colloidal silica). In some embodiments, the stabilizer may be a polymer additive. Polymer additives useful in embodiments of the present disclosure may include, for example, polyacrylamide, polyvinyl alcohol, partially acetylated polyvinyl alcohol, hydroxyethyl cellulose, poly (N-vinyl pyrrolidone), carboxymethyl cellulose, gum arabic, or mixtures thereof. In some embodiments, the polymer additive includes those sold under the trade designation “SUPERFLOC” (e.g., “SUPERFLOC N-300”) by Kemira Oyj, Helsinki, Finland.In some embodiments, the stabilizer may be a surfactant. In some embodiments, the surfactant may be anionic, cationic, zwitterionic, or nonionic in nature and the structure thereof not otherwise particularly limited. In some embodiments, the surfactant is a monomer and becomes incorporated within the polymer microsphere molecules. In other embodiments, the surfactant is present in the polymerization reaction vessel, but is not incorporated into the polymer microsphere. Examples of anionic surfactantsuseful in embodiments of the present disclosure include sulfonates, sulfolipids, phospholipids, stearates, laurates, or sulfates. Useful sulfates include sulfates sold under the trade designation “STEP ANOL” by the Stepan Company, Northfield IL, or “HITENOL” by the Montello, Inc., Tulsa, OK. Examples of nonionic surfactants useful in embodiments of the present disclosure include block copolymers of ethylene oxide and propylene oxide, such as those sold under the trade designations “PLURONIC”, “KOLLIPHOR”, or “TETRONIC”, by the BASF Corporation of Charlotte, NC; ethoxylates formed by the reaction of ethylene oxide with a fatty alcohol, nonylphenol, or dodecyl alcohol, including those sold under the trade designation “TRITON”, by the Dow Chemical Company of Midland, MI; oleyl alcohol; sorbitan esters; alkylpolyglycosides such as decyl glucoside; sorbitan tristearate; and combinations of one or more thereof. Examples of cationic surfactants useful in embodiments of the present disclosure include cocoalky Imethyl [polyoxyethylene (15)] ammonium chloride, benzalkonium chloride, cetrimonium bromide, demethyldioctadecylammonium chloride, lauryl methyl gluceth-10 hydroxypropyl diammonium chloride, tetramethylammonium hydroxide, monoalkyltrimethylammonium chlorides, monoalkyldimethylbenzylammonium chlorides, dialkylethylmethylammonium ethosulfates, trialkylmethylammonium chlorides, polyoxyethylenemonoalkylmethylammonium chlorides, diquatemaryammonium chlorides, the ammonium functional surfactants sold by Akzo Nobel N.V. of Amsterdam, the Netherlands, under the trade designations “ETHOQUAD”, “ARQUAD”, and “DUOQUAD”, and mixtures thereof.In some embodiments, where a stabilizer is employed in an oil-in-water suspension polymerization reaction, it is employed in an amount of at least 0.01, 0.05, 0.1, 0.5, or 1.0 wt.% and up to 4.0 or 5.0 wt%, based on the total weight of solids in the aqueous polymerizable reaction mixture.In some embodiments, a cross-linking agent may be used in the microsphere reaction mixture to modify the properties of the resultant microspheres. Examples of suitable cross-linking agents include multifunctional (meth)acrylate(s), e.g., butanediol diacrylate or hexanediol diacrylate, or other multifunctional cross-linkers such as divinylbenzene and mixtures thereof. In some embodiments, at least 0.005, 0.01, 0.02, 0.05, or even 0.08 wt.% of the cross-linker is used based on the total weight of monomers used in the polymerization to make the polymeric microspheres. In some embodiments, at most 0.1, 0.2, 0.5, 1, 2, or even 5 wt.% of the cross-linker is used based on the total weight of monomers used in the polymerization to make the polymeric microspheres.In some embodiments, an initiator is used that will generate cross-linking in situ by abstracting hydrogens from the polymer in the microspheres allowing cross-linking. Such initiators can include some peroxide initiators such as benzoyl peroxide and / or azo initiators. Typically, these cross-linking initiators are used in concentrations similar to the cross-linking agent described above (e.g., 0.005 to 5 wt.%).The polymerization of the aqueous polymerizable reaction mixture may be carried out using conventional suspension polymerization techniques familiar to those of ordinary skill in the relevant arts.In some embodiments where thermal decomposition is employed to initiate polymerization, suspension polymerization of the monomers employed to make the polymer microspheres of the presentdisclosure may be carried out by blending the stabilizer(s) with water to provide an aqueous phase and blending the monomer composition and athermal initiator to provide an oil phase. The aqueous phase and the oil phase may then be combined and stirred vigorously enough to form a suspension. The suspension may generally be formed, for example, by stirring the combined aqueous and oil phases with a 3 -blade or 4-blade stirrer at a speed of 500 to 1500 (e.g. 1000) revolutions per minute (“rpm”). In some instances, high shear mixing may be used to generate smaller particle sizes such as those less than 10 micrometers (pm). Useful speeds include those a 5000, 10,000, 20,000 or 50,000 rpm. In some embodiments, a static shear mixer may be used. The suspension may then be heated to a temperature wherein decomposition of the initiator occurs at a rate suitable to sustain a suitable rate of polymerization (e.g., 60 °C).Examples of suitable thermal initiators include organic peroxides or azo compounds conventionally employed by those skilled in the art of thermal initiation of polymerization, such a dicumyl peroxide, benzoyl peroxide, or 2,2'-azo-bis(isobutyronitrile) (“AIBN”) and thermal initiators sold under the trade designation “VAZO” by Chemours Canada Company, ON, Canada. In some embodiments an oil-soluble initiator (e.g., 2-2'-azobis(2,4-dimethylvaleronitrile)) is useful. The amount of initiator is typically in a range of 0.05 to 2 wt%, in a range of 0.05 to 1 wt%, or in a range of 0.05 to 0.5 wt% based on the total weight of monomers used to prepare the polymeric microspheres.In some embodiments, water is present in the polymerizable reaction mixture, for example, in an amount of at least 35, 40, 45, or at least 50 wt.% and / or in an amount of up to 90, 80, 70, or even 60 wt.%. In some of these embodiments, the temperature of the suspension is adjusted before and during the polymerization is 30 °C to 100 °C, or 40 °C to 80 °C, or 40 °C to 70 °C, or to 45 °C to 65 °C. In some embodiments, the peak temperature during the exotherm may reach as high as 75, 90, or 110 °C.In some embodiments, the polymerization of the microspheres may occur in an aqueous mixture that may also include an organic solvent. Examples of suitable organic solvents and solvent mixtures include, in various embodiments, one or more of ethanol, methanol, toluene, methyl ethyl ketone, ethyl acetate, isopropyl alcohol, tetrahydrofuran, l-methyl-2-pyrrolidinone, 2-butanone, acetonitrile, dimethylformamide, dimethyl sulfoxide, dimethylacetamide, dichloromethane, t-butanol, methyl isobutyl ketone, methyl t-butyl ether, and ethylene glycol. If used, between 30 to 70 wt% organic solvent is used in the microsphere reaction mixture.Agitation of the suspension at elevated temperature is carried out for a suitable amount of time to decompose substantially all of the thermal initiator and react substantially all of the monomers added to the suspension to form a polymerized suspension. In some embodiments, elevated temperature is maintained for a period of 1 hour to 48 hours, 2 hours to 24 hours, or 4 hours to 18 hours, or 8 hours to 16 hours. During polymerization, it may be necessary to add additional thermal initiator to complete the reaction of substantially all of the monomer content added to the reaction vessel to prepare the microspheres. Following polymerization, the thus obtained polymeric microspheres can be collected using conventional means such as filtering, optionally washed, and dried.The particles of the present disclosure are typically spherical-shaped particles. In some embodiments, polymeric microspheres of the present disclosure have an average particle diameter of at least 1, 5, 10, 20, 30, 40, or 50 pm. In some embodiments, the polymeric microspheres of have an average particle size at most 60, 80, 90, 100, 120, 150, 180, or 200 pm. The particle size may be measured by conventional means using, for example, a Horiba LA 910 particle size analyzer (Horiba, Ltd, Kyoto, Japan).Depending on the selection of the monomers used to synthesis the polymeric microspheres, the polymeric microspheres may or may not be tacky (i.e., sticky). Typically, the polymeric microspheres are non-tacky and behave as a powder, whereas the tacky polymeric microspheres tend to stick together more. Generally, the more high Tg monomer present, the less tacky the polymeric microsphere. In some embodiments, the polymeric microspheres disclosed herein have a Tg of at least 20, 25, or even 30°C. In some embodiments, the polymeric microspheres disclosed herein have a Tg of at most 30, 50, 70, 100, 125, or even 150°C.In some embodiments of the electrically debonding adhesive, the plurality of microspheres is dispersed in the (meth)acrylate-based polymer matrix. In some embodiments, the polymeric microspheres are added to the monomers or partially polymerized monomers (e.g., syrup) used to make the polymeric matrix of the electrically debonding adhesive.In some embodiments, the electrically debonding adhesive includes polymeric nanoparticles. The nanoparticles comprise at least two different polymer regions, an interior polymeric region and an outer shell. The interior of the particle comprises a polymer having a glass transition temperature (Tg) below room temperature, while the outer shell of the particle comprises a polymer having a high Tg. Although not wanting to be limited by theory, it is believed that the low Tg polymer interior is able to absorb impact force, while the harder outer shell enables good dispersion of the particles in the matrix. The Tg of the particles can be determined, for example, by using Differential Scanning Calorimetry (DSC). If the particles are composed of separate polymers, then a peak should appear in the analysis for each separate polymer as long as the polymer is in sufficient quantity in the matrix (e.g., greater than 10% or even 5% by weight).The polymeric nanoparticles have a largest dimension (e.g., diameter) of less than 900, 800, 750, 500, 400, 350, or 300 nanometers (nm). In some embodiments, the nanoparticles have an average particle diameter of at least 20, 50, 100, 150 or 170 nm and at most 500, 400, 350, 300, 250, or 200 nm. Particle size can be measured using techniques known in the art such as particle size analyzers (such as a Malvern Zetasizer) using calibrated standards or microscopy (e.g., scanning electron microscopy). In some embodiments, the interior polymeric region has an average size of at least 10, 20, or even 50 nm and at most 75, 100, 200, 300, 400, or even 500 nm. The size of the interior polymeric region can be measured using techniques known in the art, such as transmission electron microscopy.In some embodiments, the polymer of the outer shell of the polymeric nanoparticles has a Tg of at least 50, 60, 70, 80, 100, 120, or 150°C; and no more than 300, 250, 200 or 175°C. In some embodiments, the outer shell comprises a poly(methyl methacrylate) or a poly (glycidyl methacrylate).In some embodiments, the interior polymer of the polymeric particle has a Tg of less than 25, 23, 20, 15, 10, 5, 0, -10, -20, -25, or -40°C and more than -120, -90, -80, -75, or -50°C. Examples of polymers useful for the interior of the polymeric particles include isoprene homopolymers or butadiene homopolymers, (meth)acrylic homopolymers or copolymers derived from (meth)acrylate monomers having 1 to 18 carbons (in some embodiments, 4 to 18, 4 to 12, or 4 to 8 carbon atoms), isoprenebutadiene copolymers, copolymers of isoprene with at most 98 wt.% of a vinyl monomer, and copolymers of butadiene with at most 98 wt.% of a vinyl monomer. The vinyl monomer may be styrene, an alkylstyrene, acrylonitrile, an alkyl (meth)acrylate, or butadiene or isoprene as long as the polymer results in the requisite low Tg interior portion. Multi-functional monomers may be used either during polymerization of the interior polymer or grafted onto the interior polymer to introduce sites for partial or complete crosslinking of the polymer. Such multifunctional (e.g., difunctional or trifunctional) monomers include poly(meth)acrylic esters of polyols, such as butanediol di(meth)acrylate and trimethylolpropane trimethacrylate; divinylbenzene; trivinylbenzene; and triallyl cyanurate. Other monomers used for crosslinking of the polymer include unsaturated functional monomers such as anhydrides of unsaturated carboxylic acids, unsaturated carboxylic acids and unsaturated epoxide, maleic anhydride, (meth) acrylic acid and glycidyl methacrylate. The crosslinking may also be carried out by using the intrinsic reactivity of the monomers, for example the diene monomers.In some embodiments, reactive functional groups (such as hydroxyl, glycidyl or acid groups) present on the exterior of the nanoparticle may be functionalized, for example, by reaction with an alkyl acetoacetoxy such as tert-butyl acetoacetoxy.In some embodiments, the nanoparticles are a core-shell particle comprising a lower Tg polymer core encased by a higher Tg polymeric shell. In some embodiments, the core-shell ratio is in a range in weight between 10 / 90 and 90 / 10; 40 / 60 and 90 / 10; 60 / 40 to 90 / 10; or 70 / 30 and 85 / 15.Examples of polymers useful for the shells include styrene homopolymers, alkylstyrene homopolymers or methyl methacrylate homopolymers, or copolymers comprising at least 70 wt% of one of the above monomers and at least one comonomer, another alkyl (meth)acrylate, vinyl acetate, and / or acrylonitrile. As known in the art, the shell may be functionalized by introducing, by grafting or as a comonomer during the polymerization, unsaturated functional monomers such as anhydrides of unsaturated carboxylic acids, unsaturated carboxylic acids and unsaturated epoxides. For example, maleic anhydride, (meth)acrylic acid glycidyl methacrylate, hydroxyethyl methacrylate and alkyl (meth) acrylamides may be used. In one embodiment, the core-shell particle comprises a polystyrene shell and / or a copolymer having a polymethylmethacrylate (PMMA) shell. The shell may also contain imide functional groups, either by copolymerization with a maleimide or by chemical modification of the PMMA by a primary amine. Advantageously, the molar concentration of the imide functional groups is30 to 60% (relative to the entire shell). In some embodiments, the core-shell particle comprises more than one shell, for example, one made of polystyrene and the other, on the outside, made of PMMA. In some embodiments, the outermost shell in contact with the (meth)acrylate resin comprises a polymer having a Tg greater than 25, or 50°C.In some embodiments, the core-shell particles comprise a poly(methyl methacrylate) shell and a poly(butadiene-co-styrene) interior portion or core.Core-shell particles comprising an elastomer core can be made using techniques known in the art. See for example EP 2 465 882 Bl (Navarro et al.). Such particles are also available commercially under the trade designation “CLEASTSTRENGTH XT100” and “W300” from Arkema, Colombes, France; “KANE ACE M731” and “KANE ACE B-564” from Kaneka Corp., Belgium; and “PARALOID EXL- 2691 J” from Dow Chemical Co., Midland, MI.In some embodiments of the electrically debonding adhesive, the plurality of polymeric nanoparticles is dispersed in a (meth)acrylate-based polymer matrix. In some embodiments, the polymeric nanoparticles are added to the monomers or partially polymerized monomers (e.g., syrup) used to make the polymeric matrix of the electrically debonding adhesive.In some embodiments, the electrically debonding adhesive comprises a (meth)acrylic-based multiblock copolymer, a statistical (meth)acrylic -based copolymer, an epoxy resin, and a photoacid generator. The statistical (meth)acrylic-based copolymer can be any of those described above. The (meth)acrylic -based multiblock copolymer, the statistical (meth)acrylic-based copolymer, the epoxy resin, and the photoacid generator can be any of those described in co-pending U.S. provisional application serial number 63 / 378923, fded October 10, 2022, incorporated herein by reference in its entirety. In some of these embodiments, the ionic liquid that has a melting point less than 100 degrees Celsius and that has an anion selected from SbFg’, PFg’, or a mixture thereof.Further examples of adhesives into which an ionic liquid can be incorporated to make an electrically debonding adhesive are described in International Pat. Appl. Pub. Nos. WO 2022 / 043784 (Schneiderman et al.), WO 2022 / 123341 (Maher et al.), and WO 2022 / 144734 (Janoski et al.).The electrically debonding adhesive of the adhesive system of the present disclosure (e.g., the pressure-sensitive adhesive or the semi-structural adhesive) may comprise, as optional ingredients, tackifying resins, in particular hydrogenated hydrocarbon tackifiers. Examples of hydrogenated hydrocarbon tackifiers include C9 and C5 hydrogenated hydrocarbon tackifiers. Examples of C9 hydrogenated hydrocarbon tackifiers include those sold under the trade designation: "REGALITE S- 5100", "REGALITE R-7100", "REGALITE R- 9100", "REGALITE R-1125", "REGALITE S-7125", "REGALITE S-1100", "REGALITE R-1090", "REGALREZ 6108", "REGALREZ 1085", "REGALREZ 1094", "REGALREZ 1126", "REGALREZ 1139", and "REGALREZ 3103", sold by Eastman Chemical Co., Middelburg, Netherlands; "PICCOTAC" and EASTOTAC" sold by Eastman Chemical Co.; "ARKON P-140", "ARKON P-125", "ARKON P-115", "ARKON P-100", "ARKON P-90", "ARKON M- 135", "ARKON M-115", "ARKON M-100", and "ARKON M-90" sold by Arakawa Chemical Inc.,Chicago, IL; and "ESCOREZ 5000 series" sold by Exxon Mobil Corp., Irving, TX. In some embodiments, the tackifier is a partially hydrogenated C9 hydrogenated tackifier, a fully hydrogenated C9 hydrogenated tackifier, or a combination thereof. In some embodiments, the adhesive useful in the adhesive system of the present disclosure is substantially free of tackifying resins, in particular free of hydrocarbon tackifying resins.Other additives can be added to the electrically debonding adhesive of the adhesive system of the present disclosure (e.g., to the pressure-sensitive adhesive or to the semi-structural adhesive), if desired. For example, leveling agents, ultraviolet light absorbers, hindered amine light stabilizers (HALS), oxygen inhibitors, antioxidants, wetting agents, rheology modifiers, defoamers, biocides, flame retardants, and dyes can be included. All these additives and the use thereof are known to those skilled in the art and may be used as long as they do not deleteriously affect the adhesive and electrical debonding properties.In some embodiments, the electrically debonding adhesive disclosed herein is not a foam, meaning that the (meth)acrylate-based matrix comprises less than 5% by volume of voids, where the voids may be obtained by cells formed by gas, or due to the incorporation of hollow fillers, such as hollow polymeric particles, hollow glass microspheres or hollow ceramic microspheres.If optional components are added to the electrically debonding adhesive after it is polymerized, they may be incorporated by simple blending of the (meth)acrylate copolymer with the optional ingredients such as the filler material and the tackifying resin. The copolymer(s) can be blended using several conventional methods, such as melt blending, solvent blending, or any suitable physical means.Physical blending devices that provide dispersive mixing, distributive mixing, or a combination of dispersive and distributive mixing are useful in preparing homogenous blends. Both batch and continuous methods of physical blending can be used. Examples of batch methods include BRAB ENDER (using a BRAB ENDER PREP CENTER, available from C. W. Brabender Instruments, Inc.; South Hackensack, NJ) or BANBURY internal mixing and roll milling (using equipment available from FARREL COMPANY, Ansonia, CT). Examples of continuous methods include single screw extruding, twin screw extruding, disk extruding, reciprocating single screw extruding, and pin barrel single screw extruding. The continuous methods can include utilizing both distributive elements, such as cavity transfer elements (e.g., CTM, available from RAPRA Technology, Ltd., Shrewsbury, England) and pin mixing elements, static mixing elements and dispersive elements (e.g., MADDOCK mixing elements or SAXTON mixing elements as described in "Mixing in Single-Screw Extruders," Mixing in Polymer Processing, edited by Chris Rauwendaal (Marcel Dekker Inc., New York (1991), pp. 129, 176-177, and 185-186).The electrically debonding adhesive useful in the electrically debonding adhesive system and method of the present disclosure may be in the form of a tape having at least one layer of adhesive. The tape can contain a backing, carrier, or release liner as a support for the layer of adhesive. As used herein a backing or carrier is a permanent support intended for final use of the adhesive tape. A liner, on the other hand, is a temporary support that is not intended for final use of the adhesive article and is used during themanufacture or storage to support and / or protect the adhesive tape. A liner is removed from the adhesive article prior to final use. To facilitate easy removal from the adhesive layer, the liner is typically coated with a release coating comprising a release agent. Such release agents are known in the art and are described, for example in "Handbook of Pressure Sensitive Adhesive Technology," D. Satas, editor, Van Nostrand Reinhold, New York, N.Y., 1989, pp. 585-600. In some embodiments, the release agent migrates to the surface (on the liner or release coating) to provide the appropriate release properties. Examples of release agents include carbamates, silicones, and fluorocarbons. Illustrative examples of surface applied (i.e., topical) release agents include polyvinyl carbamates such as disclosed in U.S. Pat. No. 2,532,011 (Dahlquist et al.), reactive silicones, fluorochemical polymers, epoxy silicones such as are disclosed in U.S. Pat. Nos. 4,313,988 (Bany et al.) and 4,482,687 (Kessel et al.), and polyorganosiloxane- polyurea block copolymers such as are disclosed in EP Pat. No. 0250248 Bl (Leir et al.).In some embodiments of the electrically debonding adhesive, the adhesive tape is a double-sided tape, featuring adhesive on opposite sides of a carrier layer. The adhesives (i.e., a first adhesive layer and a second adhesive layer) on the two sides may be the same or different, with at least one side of the double-sided tape featuring an electrically debonding adhesive. The carrier layer may be a film, a nonwoven web, a mesh, paper, or a foam as further described below. The double-sided tape may comprise one or two release liners protecting the adhesive surface not in contact with the carrier layer. In some embodiments, the electrically debonding adhesive is disposed between two release liners, which may be the same or different. In another embodiment, the electrically debonding adhesive is disposed on a backing and the opposing side of the backing comprises a release agent. The adhesive article is wound upon itself such that the exposed surface of the adhesive (opposite the backing) contacts the release- coated backing forming, for example, a roll of tape. In yet another embodiment, the adhesive is disposed between a backing and release liner. Transfer adhesive tapes, also called transfer tapes, have an adhesive layer delivered on one or more release liners. The adhesive layer has no carrier within it so once delivered to the target substrate and the liner is removed, there is only adhesive. Some transfer tapes are multi-layer transfer tapes with at least two adhesive layers that may be the same or different with at least one layer featuring an electrically debonding adhesive.Examples of materials useful as a tape backing or carrier for the electrically debonding adhesive include polyolefins such as polyethylene, polypropylene (including isotactic polypropylene and high impact polypropylene), polystyrene, polyester, including polyethylene terephthalate), polyvinyl chloride, poly(butylene terephthalate), poly(caprolactam), polyvinyl alcohol, polyurethane, poly(vinylidene fluoride), cellulose and cellulose derivatives, such as cellulose acetate and cellophane, wovens, and nonwovens. Further examples of backings and carriers include kraft paper (available from Monadnock Paper, Inc.); spun-bond poly(ethylene) and poly(propylene), such as those available under the trade designations “TYVEK” and “TYPAR” (available from The Chemours Co.); and porous films obtained from poly(ethylene) and poly (propylene), such as those available under the trade designations “TESLIN” (available from PPG Industries, Inc.), and “CELLGUARD” (available from Hoechst-Celanese). Thebacking or carrier can also be a metal foil, a polymeric film (e.g., any of those described above) with a metallic coating on the surface, or a conductive (e.g., metal) mesh.The thickness of the electrically debonding adhesive useful in the electrically debonding adhesive and method of the present disclosure is typically at least 10, 15, 20, 25, 30, 40, or 50 micrometers (1 mil) and at most 100, 200, 300, 400, 500, 1000, 1500, or 2000 micrometers (80 mils) thick. The adhesive can be coated in single or multiple layers.The primer composition and / or electrically conductive composition and electrically debonding adhesive of the adhesive system of the present disclosure, as described above in any of its embodiments, can be applied to a variety of substrates. The substrates can be flexible or inflexible and be formed of a polymeric material, glass or ceramic material, metal, or combinations thereof. Suitable polymeric substrates include polypropylene, polyethylene, polyvinyl chloride, polyester (polyethylene terephthalate or polyethylene naphthalate), polycarbonate, polymethyl(meth)acrylate (PMMA), cellulose acetate, cellulose triacetate, ethyl cellulose, and others described below. The polymeric substrate can be in the form of a film or three-dimensional article. Foam substrates may be used. Examples of other substrates include metals such as stainless steel, metal or metal oxide coated polymeric material, and metal or metal oxide coated glass.In the context of the present disclosure, the expression “low surface energy substrates” is meant to refer to those substrates having a surface energy of less than 34 dynes per centimeter. The expression “medium surface energy substrates” is meant to refer to those substrates having a surface energy comprised between 34 and 70 dynes per centimeter, typically between 34 and 60 dynes per centimeter, and more typically between 34 and 50 dynes per centimeter. The expression “high surface energy substrates” is meant to refer to those substrates having a surface energy of more than 350 dynes per centimeter, typically more than 400 dynes per centimeter, and more typically to those substrates having a surface energy comprised between 400 and 1100 dynes per centimeter. The surface energy is typically determined from contact angle measurements as described, for example, in ASTM D7490-08.The electrically debonding adhesive system of the present disclosure may be useful for forming adhesive bonds to low surface energy (LSE) substrates. Included among such materials are polypropylene, polyethylene (e.g., high density polyethylene or HDPE), blends of polypropylene (e.g., PP / EPDM, TPO), or even some clear coat surfaces. Other substrates may also have properties of low surface energy due to a residue, such as an oil residue or a film, such as paint, being on the surface of the substrate.The electrically debonding adhesive system of the present disclosure may also be useful for bonding to medium surface energy (MSE) substrates such as, for example, polyamide 6 (PA6), acrylonitrile butadiene styrene (ABS), polycarbonate (PQ / ABS blends, PC, PVC, polyurethane (PUR), thermoplastic elastomers (TPE), polyoxymethylene (POM) polystyrene, poly(methyl methacrylate) (PMMA), and composite materials like fiber reinforced plastics.The electrically debonding adhesive system of the present disclosure may also be useful for bonding higher surface energy (HSE) substrates such as, for example, ceramics, glasses, and metals.Advantageously, the electrically debonding adhesive system of the present disclosure can be used on a electrically nonconductive substrate such as any of the polymers described above.A method of making an article according to the present disclosure can include applying the primer composition and / or electrically conductive composition to a surface of a first electrically nonconductive substrate and then applying the electrically debonding adhesive to the primer composition and / or electrically conductive composition on the surface of the first electrically nonconductive substrate. The primer composition and / or electrically conductive composition may be applied to the surface using any of the methods described above and may be allowed to stand on the substrate for at least 5, 10, 15, 30, or 60 minutes before the electrically debonding adhesive is applied. Solvent may be removed during this time under ambient conditions, or heat or reduced pressure may be applied. In some embodiments, the electrically debonding adhesive is a double-sided tape or a transfer tape. In some embodiments, the method further comprises applying the primer composition and / or electrically conductive composition to a surface of a second electrically nonconductive substrate and applying the electrically debonding adhesive to the composition on the surface of the second electrically nonconductive substrate, thereby adhering the first electrically nonconductive substrate to the second electrically nonconductive substrate. In some embodiments, only the first substrate is electrically nonconductive, and the primer composition and / or electrically conductive composition need not be applied to the second substrate.In some embodiments, electrically debonding adhesive system of the present disclosure is suitable for bonding internal components or external components of illuminated display devices such as liquid crystal displays ("LCDs") and light emitting diode ("LEDs") displays such as cell phones (including Smart phones), wearable (e.g. wrist) devices, car navigation systems, global positioning systems, depth finders, computer monitors, notebook and tablet computer displays or bonding items (e.g., handles, display holders) to the exterior of electronic devices.The present disclosure provides an adhesively bonded article comprising: a first electrically nonconductive substrate; an electrically conductive composition disposed on a surface the first electrically nonconductive substrate, the composition comprising an electrically conductive filler and a polymer comprising at least one of a polyurethane, a polyacrylate, a polyamide, or a rubber; a second substrate, which may be electrically conductive or not electrically conductive; and at least one layer of an electro-debonding adhesive between the composition disposed on the surface of the first electrically nonconductive substrate and the second substrate, wherein the electrically debonding adhesive comprises an ionic liquid. In some embodiments, the electrically debonding adhesive is at least partially crosslinked. The electrically debonding adhesive, the ionic liquid, the polymer comprising at least one of a polyurethane, a polyacrylate, a polyamide, or a rubber, theelectrically conductive filler, and the electrically nonconductive substrate can be any of those described above in any of their embodiments. Furthermore, solventless ink-jet or screen printable / UV curable and extrudable electrically conductive compositions can be useful.In some embodiments of the method and article of the present disclosure, the electrically conductive composition is in the form of a layer disposed on the surface of the first electrically nonconductive substrate, and wherein the layer has a thickness of not more than 25, 20, 15, 20, or 5 micrometers. In some embodiments of the method and article of the present disclosure, the electrically conductive composition has a resistivity of not more than 1, 0.5, 0.25, 0. 1, or 0.05 megaohm centimeter. In these embodiments, the electrically conductive composition is in dried form (that is, without the solvent or with less than 10, 5, 4, 3, 2, 1, or 0.5 wt.% solvent, based on the total weight of the composition.In some embodiments of the method and article of the present disclosure, the second substrate is electrically conductive. Suitable conductive substrates include a metal, a mixed metal, an alloy, a metal oxide, a composite metal, a metal -coated plastic, a conductive plastic, a conductive polymer.To facilitate the separation of components (e.g., substrates) joined together by the cured composition (i.e., electrically debonding adhesive), a direct current (DC) electric potential is applied across the electrically debonding adhesive before separation of the substrates. For example, the electric potential may be applied across two electrically conductive substrates on opposite sides of the adhesive composition, such that the surface of one substrate serves as a negative electrode (or negative adhesive interface) and the surface of the other substrate serves as the positive electrode (or positive adhesive interface). Alternatively, the electric potential may be applied across one electrically conductive substrate and an electrically conductive adhesive carrier of a double-sided tape, where the surface of the conductive substrate or the conductive adhesive carrier serves as the negative adhesive interface and the other of the surface of the conductive substrate or conductive adhesive carrier serves as the positive adhesive interface. Application of a DC current typically weakens the adhesive bond at the negative electrodeadhesive interface, thus reducing the amount of force required to separate components in the article. The location of debonding can be reversed by simply changing the polarity of the electric potential.With reference to FIG. 1, the first substrate 12 comprises a first nonconductive material 16 and a first electrically conductive composition 18 (e.g., primer composition) disclosed above in any of its embodiments applied thereon to provide the first electrically conductive surface 14. Similarly, the second substrate 22 comprises a second nonconductive material 26 and a second electrically conductive composition 28 (e.g., primer composition) disclosed above in any of its embodiments applied thereon to provide the second electrically conductive surface 24. Alternatively (not shown), one of the substrates could be made entirely of electrically conducting material(s) and the other substrate could be made of nonconducting material(s) coated with the electrically conductive composition disclosed herein. The conductive composition may only partially coat the component or completely coat the outside surface of the component. For purposes of this disclosure, it is only necessary that the surface of the component indirect contact with the electrically debonding adhesive be sufficiently coated to weaken the adhesive bond at the negative adhesive interface when a DC electric potential is applied across the adhesive. In some embodiments, the conductive composition is a solid layer. In other embodiments, the conductive composition is pattern coated onto the surface of the component.The electrically debonding adhesive composition 30 in FIG. 1 joins the first and second substrates 12 and 22 together. The first conductive surface 14 serves as the positive adhesive interface and the second conductive surface 24 serves as the negative adhesive interface. Application of a DC electric potential 40 across the adhesive composition 30 results in a weakening of the adhesive bond at the negative adhesive interface (i.e., second electrically conductive surface 24), as measured, for example, according to the work of adhesion per surface area, thus making it easier to separate the second component 22 from the first component 12.Advantageously, little-to-no adhesive residue may remain on the second conductive surface 24 after separation. In some embodiments, less than 10%, less than 5%, or less than 1% of the electrically debonding adhesive (by weight) remains on the second substrate 22 after separation. In some embodiments, no adhesive remains on the second substrate 22 after separation. In some embodiments, it is possible to reuse the electrically debonding adhesive allowing the first substrate 12 to be rejoined to the second substrate 22 or adhered to a completely different substrates or article. If it is desirable that the electrically debonding adhesive remain predominately on the second substrate, the polarity of the DC electric potential can be reversed so that the first electrically conducting surface serves as the negative adhesive interface.FIG. 2 illustrates another embodiment of an article 110 of the present application where the adhesive composition is a double-sided tape that joins the first and second substrates together.With reference to FIG. 2, the article 110 comprises a first substrate 112 having a first electrically conductive surface 114 and a second substrate 122 having a surface 124. The first substrate 112 comprises a first nonconductive material and a first electrically conductive composition 118 (e.g., primer composition) disclosed above in any of its embodiments applied thereon to provide the first electrically conductive surface 114. The second substrate can be made of conductive material(s), a nonconductive material, or it can be made of nonconductive material(s) and at least partially coated with an electrically conductive composition disclosed above in any of its embodiments (not shown). The adhesive composition 130 is disposed between the first electrically conductive surface 114 and the second surface 124 and joins the first substrate 112 to the second substrate 122.The electrically debonding adhesive tape 130 is a double-sided tape further comprising a carrier 170 having a first major surface 172 and a second major surface 174 opposite the first major surface. A first electrically debonding adhesive 132 is on the first major surface 172 of the carrier 170. Similarly, a second adhesive composition 134 is on the second major surface 174 of the carrier 170. In some embodiments, the composition of the first electrically debonding adhesive is the same as the second adhesive composition. In other embodiments, the composition of the first electrically debonding adhesiveis different than the second adhesive composition. A surface 136 of the first electrically debonding adhesive 132 opposite the carrier 170 is in contact with the first conductive surface 114 of the first substrate 112. A surface 138 of the second adhesive composition 134 opposite the carrier 170 is in contact with the second surface 124 of the second substrate 122.In some embodiments, the carrier 170 is a porous material that allows for physical contact between the first electrically debonding adhesive and the second adhesive compositions. Examples of carrier include paper, woven or nonwoven fabrics, a porous film, a metal mesh, a metal grid, or combinations thereof. In some embodiments, the carrier is electrically conductive. Such conductive carriers may be porous or nonporous and include a metal mesh, a metal grid, a metal foil, a metal plate, a conductive polymer, a conductive foam, a conductive tissue, or combinations thereof.When the carrier 170 is made from a porous material and surface 124 is an electrically conductive surface, either by application of an electrically conductive composition described herein or made of a conductive material throughout, DC electric potential 140 across the adhesive composition 130 (not shown) results in a weakening of the adhesive bond at the negative adhesive interface (i.e., second electrically conductive surface 124), as measured, for example, according to the work of adhesion per surface area, thus making it easier to separate the second substrate 122 from the first substrate 112. If it is desirable to separate the adhesive composition from the first substrate, the polarity of the DC electric potential can be reversed so that the first electrically conducting surface serves as the negative adhesive interface.In another embodiment, the carrier 170 is a conductive material that serves as either the positive or the negative adhesive interface during the debonding process. For example, the first conductive surface 114 of the first substrate 112 is the positive adhesive interface and the first major surface 172 of the carrier 170 is the negative adhesive interface. Application of a DC electric potential 140 across the first electrically debonding adhesive 132 will result in separation of the first and second substrates 112, 122 at the first major surface 172 of the carrier 170. Alternatively, the first substrate 112 can be removed from the first electrically debonding adhesive 132 by reversing the polarity of the DC electric potential.In an additional embodiment (not shown), a conductive surface 124 of the second substrate 122 or the second major surface 174 of the carrier 170 can be the negative adhesive interface and the other of a conductive surface 124 of the second substrate 122 or the second major surface 174 of the carrier 170 can be the positive adhesive interface.It should be understood, with reference to FIG. 2, that when the carrier 170 serves as the negative or positive adhesive interface and the first conductive surface 114 of the first substrate 112 serves as the other of the negative or positive adhesive interface, only the first electrically debonding adhesive 132 across which the DC electric potential is applied need comprise a cured composition that includes the ionic liquid. The second adhesive composition 134 can in fact be any type of adhesive. Therefore, in such embodiments, a double-sided tape may be used to make the article which comprises a carrier havingadhesive on both sides, where only one of the adhesives comprises an electrically debonding adhesive as described herein in any of its embodiments.As shown above, a double-sided tape with a conductive carrier allows the user to strategically tailor the location of debonding within an article. This can be particularly advantageous when it is necessary to remove adhesive from a substrate prior to recycling and / or leave the adhesive on a substrate for repositioning or adherence to the same or different article.Further, by using a double-sided tape with a conductive carrier, at least one of the components need not be conductive nor have an electrically conductive composition applied thereon to separate the first substrate from the second substrate. The carrier can serve as one of the electrodes, thus increasing the types of materials that can be included in the article (i.e., adhering two conductive substates or adhering a conductive substrate to a nonconductive substrate).In a first embodiment, the present disclosure provides a primer composition comprising solvent, an electrically conductive filler dispersed in the solvent, and a polymer at least one of dissolved or dispersed in the solvent, wherein the polymer comprises at least one of: a polyurethane comprising a reaction product of components comprising a polyol and a polyisocyanate, wherein the polyol has a total solubility parameter ranging from 10 to 14 (cal / cm3)1 / 2, or is an aromatic polyester polyol comprising repeat units of an ortho- or meta- phthalate and an alkylene group comprising at least 4 carbon atoms, or is an aromatic polyester polyol comprising repeat units of an ortho- or meta- phthalate and an alkylene group comprising at least 4 carbon atoms, which has a total solubility parameter ranging from 10 to 14 (cal / cm3)1 / 2; a polyacrylate comprising, based on the total weight of the monomer units in the polyacrylate: at least 20 percent by weight of methyl methacrylate units; at least 15 percent by weight of acrylic monomer units comprising an alkyl group having at least four carbon atoms; and at least one of monomer units comprising at least one of a secondary amine, a tertiary amine, or a tertiary amide in an amount of at least 15 percent by weight or acrylic monomer units comprising a carboxylic acid group in an amount of at least 10 percent by weight; or a polyamide comprising a reaction product of components comprising a dimer acid, a diamine comprising at least one of a primary diamine or a secondary diamine. In a second embodiment, the present disclosure provides the primer composition of the first embodiment, wherein the solvent is present in an amount of at least 60, 70, 80, 85, 90 percent by weight, based on the total weight of the composition. In a third embodiment, the present disclosure provides the primer composition of the first or second embodiment, wherein the weight ratio of the polymer to the electrically conductive filler is not more than 5 : 1, 4: 1, 3: 1, or 2: 1. In a fourth embodiment, the present disclosure provides the primer composition of any one of the first to third embodiments, wherein the electrically conductive filler comprises at least one of particles, fibers, or flakes of at least one of conductive carbon black; graphite; graphene; carbon nanotubes; or metal comprising at least one of silver, copper, gold, aluminum, or nickel. In a fifthembodiment, the present disclosure provides the primer composition of any one of the first to fourth embodiments, wherein the polymer comprises at least one of the polyurethane or the polyacrylate. In a sixth embodiment, the present disclosure provides the primer composition of any one of the first to fifth embodiments, further comprising one or more crosslinkers comprising at least one of amide, epoxy, melamine, amine, or aziridine functional groups. In a seventh embodiment, the present disclosure provides the primer composition of any one of the first to sixth embodiments, wherein the polyol comprises a polyester polyol, a polycaprolactone polyol, a polycarbonate polyol, or a combination thereof. In an eighth embodiment, the present disclosure provides the primer composition of any one of the first to seventh embodiments, wherein the polyol comprises the repeat units of an ortho- or metaphthalate and the alkylene group comprising at least 4 carbon atoms. In a ninth embodiment, the present disclosure provides the primer composition of any one of the first to eighth embodiments, wherein the polyurethane comprises the reaction product of components comprising the polyisocyanate component, the polyol component, and a functional acid containing compound. In a tenth embodiment, the present disclosure provides the primer composition of any one of the first to ninth embodiments, wherein the methyl methacrylate units are present in an amount from 25 percent by weight to 65 percent by weight, wherein the acrylic monomer units comprising the alkyl group having at least four carbon atoms are present in an amount from 25 percent by weight to 65 percent by weight, and wherein the acrylic monomer units comprising the carboxylic acid group are present in an amount from 10 percent by weight to 25 percent by weight, based on the total weight of monomer units in the polyacrylate. In an eleventh embodiment, the present disclosure provides use of the primer composition of any one of the first to tenth embodiments as a primer on an electrically nonconductive substrate and in combination with an electrically debonding adhesive.In a twelfth embodiment, the present disclosure provides a method of making an article, the method comprising applying the primer composition of any one of the first to tenth embodiments to a surface of a first electrically nonconductive substrate, removing at least a portion of the solvent, and applying an electrically debonding adhesive to the composition on the surface of the first electrically nonconductive substrate. In a thirteenth embodiment, the present disclosure provides the method of the twelfth embodiment, further comprising applying the primer composition to a surface of a second electrically nonconductive substrate, removing at least a portion of the solvent, and applying the electrically debonding adhesive to the primer composition on the surface of the second electrically nonconductive substrate, thereby adhering the first electrically nonconductive substrate to the second electrically nonconductive substrate.In a fourteenth embodiment, the present disclosure provides an electrically debonding adhesive system comprising :the primer composition of any one of the first to tenth embodiments and an electrically debonding adhesive comprising an ionic liquid. In a fifteenth embodiment, the present disclosure provides an electrically debonding adhesive system comprising 1) an electrically conductive composition comprising an electrically conductive filler and a polymer comprising at least one of a polyurethane, apolyacrylate, a polyamide, or a rubber and 2) an electrically debonding adhesive comprising an ionic liquid. In a sixteenth embodiment, the present disclosure provides the electrically debonding adhesive system of the fifteenth embodiment, further comprising a solvent, wherein the electrically conductive filler is dispersed in the solvent, and wherein the polymer is at least one of dissolved or dispersed in the solvent.In a seventeenth embodiment, the present disclosure provides the electrically debonding adhesive system or method of any one of the twelfth to sixteenth embodiments, wherein the electrically debonding adhesive comprises a (meth)acrylic -based copolymer. In an eighteenth embodiment, the present disclosure provides the electrically debonding adhesive system or method of any one of the twelfth to seventeenth embodiments, wherein the electrically debonding adhesive comprises a polymer comprising units of a (meth)acrylate macromer, wherein the (meth)acrylate macromer comprises a polyethylene oxide) group, a polypropylene oxide) group, a poly(ethylene oxide-co-propylene oxide), a poly(tetrahydrofuran) group, or combinations thereof; one or more of a Cl to Cl 2 (meth)acrylate ester monomer; a cross-linking agent; and none to at most 7 wt % of a hydroxyl group-containing (meth)acrylate monomer; and a plurality of polymeric nanoparticles within a matrix of the polymer wherein the polymeric nanoparticles comprise an interior region comprising a polymer having a glass transition temperature below room temperature and an outer shell comprising a polymer having a glass transition temperature of at least 50°C. In a nineteenth embodiment, the present disclosure provides the electrically debonding adhesive system or method of any one of the twelfth to seventeenth embodiments, wherein the electrically debonding adhesive comprises: a polymer comprising units of: a (meth)acrylate macromer, wherein the (meth)acrylate macromer comprises a polyethylene oxide) group, a polypropylene oxide) group, a poly(ethylene oxide -co-propylene oxide), a poly(tetrahydrofuran) group, or combinations thereof; one or more of a Cl to C12 (meth)acrylate ester monomer; and a cross-linking agent; and a plurality of polymeric microspheres within a matrix of the polymer, wherein the polymeric microspheres are derived from at least 20 to at most 99 wt % of a (meth)acrylate monomer having a Tg above room temperature and at least 1 wt% of a polar (meth)acrylate monomer. In a twentieth embodiment, the present disclosure provides the electrically debonding adhesive system or method of any one of the twelfth to nineteenth embodiments, wherein the ionic liquid comprises at least one of a nitrogen-containing cation, a phosphonium ion, or a sulfonium ion and at least one of a sulfate, a sulfonate, a carboxylate, a phosphate, a borate, an imide, sulfonylimide, halide anion, or dicyanamide. In a twenty-first embodiment, the present disclosure provides the electrically debonding adhesive system or method of any one of the twelfth to twentieth embodiments, wherein the ionic liquid that has a melting point less than 100 degrees Celsius and that has an anion selected from SbFg", PFg", or a mixture thereof. In a twenty-second embodiment, the present disclosure provides the electrically debonding adhesive system or method of any one of the twelfth to twenty-first embodiments, wherein the ionic liquid is or dimethylaminoethyl acrylate methyl bis(fluorosulfonyl)imide or l-butyl-3-methylimidazolium hexafluorophosphate .In a twenty-third embodiment, the present disclosure provides an adhesively bonded article comprising: a first electrically nonconductive substrate; an electrically conductive composition disposed on a surface the first electrically nonconductive substrate, the electrically conductive composition comprising an electrically conductive filler and a polymer comprising at least one of a polyurethane, a polyacrylate, a polyamide, or a rubber; a second substrate, which may be electrically conductive or not electrically conductive; and at least one layer of an electrically debonding adhesive between the electrically conductive composition disposed on the surface of the first electrically nonconductive substrate and the second substrate, wherein the electrically debonding adhesive comprises an ionic liquid. In a twenty-fourth embodiment, the present disclosure provides the adhesively bonded article of the twenty-third embodiment, wherein the electrically debonding adhesive is at least partially crosslinked. In a twentyfifth embodiment, the present disclosure provides the adhesively bonded article of the twenty-third or twenty-fourth embodiment, wherein the electrically conductive filler, the polymer, the ionic liquid, and the electrically debonding adhesive are as described in any one of the first, third to tenth, or seventeenth to twenty-second embodiments. In a twenty-sixth embodiment, the present disclosure provides the adhesively bonded article of any one of the twenty-third to twenty-fifth embodiments, wherein the electrically conductive composition is in the form of a layer disposed on the surface of the first electrically nonconductive substrate, and wherein the layer has a thickness of not more than 25 micrometers. In a twenty-seventh embodiment, the present disclosure provides the adhesively bonded article of any one of the twenty-third to twenty-sixth embodiments, wherein the electrically conductive composition has a resistivity of not more than one megaohm centimeter. In a twenty-eighth embodiment, the present disclosure provides the adhesively bonded article of any one of the twenty-third to twentysixth embodiments, further comprising a double-sided tape comprising a carrier with the at least one layer of the electrically debonding adhesive disposed thereon. . In a twenty-ninth embodiment, the present disclosure provides the adhesively bonded article of the twenty-eighth embodiment, wherein the carrier is conductive.In a thirtieth embodiment, the present disclosure provides a method of debonding the adhesively bonded article of any one of the twenty-third to twenty-ninth embodiments, the method comprising: applying an electrical potential between the first electrically nonconductive substrate with the electrically conductive composition disposed thereon and the second substrate and subsequently separating the first electrically nonconductive substrate and the second substrate.Objects and advantages of this disclosure are further illustrated by the following non-limiting examples, but the particular materials and amounts thereof recited in these examples, as well as other conditions and details, should not be construed to unduly limit this disclosure.EXAMPLESUnless otherwise noted, all parts, percentages, ratios, etc. in the Examples and the rest of the specification are by weight. The following abbreviations are used in this section: in = inches, g = grams, pg = micrograms, phr = parts per hundred, wt % = weight percent, kg = kilogram, lb = pound, kN = kilo Newtons, N = Newtons, Ibr = pound force, h = hours, min = minutes, s = seconds, °C = degrees Celsius, °F = degrees Fahrenheit, RH = relative humidity, Hz = hertz, mW = milliwatts, J = Joules, ° = degree angle, m = meters, cm = centimeters, mm = millimeters, pm = micrometers, MPa = megapascals, psi = pounds per square inch, and rpm = revolutions per minute.Test MethodsPush Out StrengthReferring to FIG. 3, an electrically debonding adhesive sample with siliconized PET liners on both surfaces was cut in a circular ring geometry 220 with a 3.11 cm outer diameter, 2.61 cm inner diameter (2.5 mm bond width). All test substrates were cleaned with isopropyl alcohol (IP A). A subset of the substrates (polycarbonate frames 230) was primed with desired primer composition as indicated below. One liner was removed exposing the adhesive surface and the tape was adhered to the surface of a square polycarbonate test frame 230 (4.07 x 4.07 x 0.3 cm) with a circular hole (2.4 cm diameter) cut in the middle; wherein the tape is centered over the hole. The second liner was removed from the test tape and a stainless-steel circular puck 210 (3.3 cm diameter x 0.3 cm thick) was centered over the test tape and adhered to the polycarbonate frame surface using a 10 kg weight which was placed on the bonded stainless-steel puck, tape, polycarbonate frame article for 10 seconds. The weight was removed, and the testing fixture was allowed to dwell for 24 hr at controlled temperature and humidity (CTH) conditions of 23 °C and 50% RH.Electrically debonded samples were electrified with 50V for 60 seconds by connecting the negative output of a power supply to the stainless-steel puck and the positive output of a power supply to the polycarbonate frame. Immediately after electrification, samples were tested. Control samples were tested without electrification.An MTS Criterion Model 42 (MTS, Eden Prairie, MN) was then used to separate the puck from the frame, which was held stationary, using a probe through the hole of the frame at a rate of 10 mm / min and the total force was recorded and three replicates were completed for each sample.Peel Adhesion with conductive backingPeel adhesion was measured for electrically debonding adhesives (adhesive transfer tape, ATTs) at an angle of 180 degrees. For peel adhesion testing to rigid substrates such as polycarbonate (PC) or acrylonitrile butadiene styrene (ABS) (from Aeromat Plastics, Burnsville, MN) the adhesive tapes on backings were laminated directly to the 2-inchx5-inch (5.08 cm* 12.70 cm) rigid substrate. A subset of the substrates was primed with desired primer composition as indicated below. This method followed amodified ASTM D3330, test method E, liner side. To make the adhesive tapes with backings, ATTs were laminated to the conductive side of a 2mil conductive film (from Eastman Performance Films, Fieldale, VA) for use as a backing material. All samples and substrates were conditioned in a (CTH) room of 23 °C and 50% RH for a period of time no less than 24 hours prior to testing. Test panels were cleaned with isopropyl alcohol (IP A) solvent before and after testing. A rubberized 4.5-lb (2.04 Kg) roller was used to laminate the adhesive tapes to the panels (4x3 seconds roll downs). Peel testing was done using an MTS Criterion Model 42 (MTS, Eden Prairie, MN) in a CTH room. Peel tests were conducted at a rate of 12 inches / min (0.3 m / min) cross-head speed at a temperature of 23 °C. Each sample was peeled at least three times from the same substrate and averages of all three measurements are reported. All peel adhesion failure modes were adhesive failure from the conductive film.Electrically debonded samples were electrified with 50V for 60 seconds by connecting the negative output of a power supply to the conductive backing, and the positive output of a power supply to the peel panel. Care was taken to make sure the power supply was in contact with the primed portion of the panel. Immediately after electrification, samples were tested. Control samples were tested without electrification.Peel Adhesion with non-conductive backingPeel adhesion as described above for the Peel adhesion with conductive backing except to make the adhesive tapes with backings, ATTs were laminated to the plasma-treated side of 2 mil (50 pm) biaxially oriented polyethylene terephthalate (PET) film (3M, treatment conditions are described in U.S. Pat. No. 10,134,566) for use as a backing material. All peel adhesion failure modes were adhesive failure from the rigid substrate. No electrification was carried out.Table 1 : Material listMethod to apply conductive primer used for these tests:Test substrates were cleaned with lint-free wipe (KIMWIPE) and IPA three times. Cleaned substrates were allowed to dry completely. Then the primer compositions were brushed with foam swabs on the test substrate (PC or ABS) surface making sure the primer composition covered all the substrate during priming. Two layers of the primer were applied, allowing the substrate to dry between application. The substrate with the primer composition applied was dried in the hood (air flow 80-100FPM feet per min) at room temperature for 30 min. The adhesive tapes described above in the Test Methods were then applied to the primed substrates.Preparation of PolymersPolymer 1: PolyurethaneThis polymer was prepared according to Example 15 in U.S. Pat. No. 10,301,418 (Lu et al.)Polymer 2: PolyacrylateThe acrylate polymer was prepared by combining 84 g of IOA, 84 g of MMA, 32 g of acrylic acid, and 300 g of ethyl acetate. To the mixture was added 1.6 grams of “VAZO-67” initiator, and the resulting solution was deoxygenated for two minutes with nitrogen. After heating at 65 °C for 24 hours, a solution was obtained that was determined to have a 40% solids content.Primer Composition Example 118.0 g of Polymer 1 solution was diluted with 160.0 g of MEK. 0.09 g of PZ-28 and 0.023 g of GA-240 were added, followed by 5.92 g of Super P Carbon Black. This mixture was stirred vigorously to provide Primer Composition Example 1.Primer Composition Example 222.5 g of Polymer 2 solution was diluted with 151.7 g of ethyl acetate. 5.85 g of Super P Carbon Black was then added. This mixture was stirred vigorously to provide Primer Composition Example 2.Primer Composition Control Example18.0 g of Polymer 1 solution was diluted with 160.0 g of MEK. 0.09 g of PZ-28 and 0.023 g of GA-240 were added. This mixture was stirred vigorously to provide the Primer Composition Control Example.Electrically Debonding Adhesive preparation:A syrup was prepared from a monomer mixture of 2-EHA / NVP / BA / NNDMA (50% / 25% / 15% / 10%), HDDMA at a loading of 0.02 phr, and IRGACURE 651 at a loading of 0.04 phr with respect to the total mass of monomers. The mixture of monomers and initiator was degassed withnitrogen for 10 min, and then exposed to low intensity (0.3 mW / cm2) UV-A radiation from a 360 nm UV- LED light source, while stirring until a syrup composition having a viscosity of approximately 1000-2000 cP was obtained. IRGACURE 651 (0.5phr), HDDMA (0.125phr), PEG550-A macromer (lOphr), XT- 100 particles (15 phr), and BMI PF6 (5phr) was added to the syrup composition, and the solution was well mixed. The solution was coated between PET release liners (RF12N and RF02N from SKC Haas, Seoul, Korea, 2mil). The coated solution was cured with 1,600 mJ / cm2of total UV-A 365 nm UV-LED irradiation to produce tacky adhesive fdms.Article Examples 1 to 2 (Ex 1 to 2) and Control Examples A and B (CE A and B)Samples were prepared according to the push out test method described above either with no primer (Control Examples A and B) or with Primer Composition Examples 1 and 2 (PC Ex 1 and 2). The control and electrically debonded performance of each example is shown in Table 2.Table 2: Push out strength of samples with and without electrification.Article Examples 3 to 7 (Ex 3 to 7) and Control Examples C to E (CE C to E)Samples were prepared according to the Peel Adhesion with conductive backing test method described above either with no primer (Control Examples C and E), Primer Composition Examples 1 and 2 (PC Ex 1 and 2), Primer Composition Control Example (PCCE), or Conductive Silver Ink on PC and ABS substrates. The control and electrically debond peel adhesions were tested for each example, and the results are shown in Table 3.Table 3 : Peel strength of samples using conductive backing with and without electrificationArticle Examples 8 to 11 (Ex 8 to 11) and Control Examples F and G (CE F and G)Samples were prepared according to the Peel Adhesion with non-conductive backing test method described above either with no primer (Control Examples F and G) or Primer Composition Examples 1 and 2 (PC Ex 1 and 2) on PC and ABS substrates. The peel adhesions were tested for each example, and the results are shown in Table 4.The preceding description, given in order to enable one of ordinary skill in the art to practice the claimed disclosure, is not to be construed as limiting the scope of the disclosure, which is defined by the claims and all equivalents thereto.

Claims

What is claimed is:

1. A primer composition comprising: solvent; an electrically conductive filler dispersed in the solvent; and a polymer at least one of dissolved or dispersed in the solvent, wherein the polymer comprises at least one of: a polyurethane comprising a reaction product of components comprising a polyol and a polyisocyanate, wherein the polyol has a total solubility parameter ranging from 10 to 14 (cal / cm3)1 / 2, or is an aromatic polyester polyol comprising repeat units of an ortho- or meta- phthalate and an alkylene group comprising at least 4 carbon atoms, or is an aromatic polyester polyol comprising repeat units of an ortho- or meta- phthalate and an alkylene group comprising at least 4 carbon atoms, which has a total solubility parameter ranging from 10 to 14 (cal / cm3)1 / 2; a polyacrylate comprising, based on the total weight of the monomer units in the polyacrylate: at least 20 percent by weight of methyl methacrylate units; at least 15 percent by weight of acrylic monomer units comprising an alkyl group having at least four carbon atoms; and at least one of monomer units comprising at least one of a secondary amine, a tertiary amine, or a tertiary amide in an amount of at least 15 percent by weight or acrylic monomer units comprising a carboxylic acid group in an amount of at least 10 percent by weight; or a polyamide comprising a reaction product of components comprising a dimer acid, a diamine comprising at least one of a primary diamine or a secondary diamine.

2. The primer composition of claim 1, wherein the weight ratio of the polymer to the electrically conductive filler is not more than 5 : 1.

3. The primer composition of claim 1 or 2, wherein the electrically conductive filler comprises at least one of particles, fibers, or flakes of at least one of conductive carbon black; graphite; graphene; carbon nanotubes; or metal comprising at least one of silver, copper, gold, aluminum, or nickel.

4. The primer composition of any one of claims 1 to 3, wherein the polymer comprises at least one of the polyurethane or the polyacrylate.

5. The primer composition of any one of claims 1 to 4, further comprising one or more crosslinkers comprising at least one of amide, epoxy, melamine, amine, or aziridine functional groups.

6. Use of the primer composition of any one of claims 1 to 5 as a primer on an electrically nonconductive substrate and in combination with an electrically debonding adhesive.

7. A method of making an article, the method comprising: applying the primer composition of any one of claims 1 to 5 to a surface of a first electrically nonconductive substrate; removing at least a portion of the solvent; applying an electrically debonding adhesive to the composition on the surface of the first electrically nonconductive substrate; applying the primer composition to a surface of a second electrically nonconductive substrate; removing at least a portion of the solvent; and applying the electrically debonding adhesive to the primer composition on the surface of the second electrically nonconductive substrate, thereby adhering the first electrically nonconductive substrate to the second electrically nonconductive substrate.

8. An electrically debonding adhesive system comprising: an electrically conductive composition comprising: an electrically conductive filler; and a polymer comprising at least one of a polyurethane, a polyacrylate, a polyamide, or a rubber; and an electrically debonding adhesive comprising an ionic liquid.

9. The electrically debonding adhesive system of claim 8, further comprising a solvent, wherein the electrically conductive filler is dispersed in the solvent, and wherein the polymer is at least one of dissolved or dispersed in the solvent.

10. The electrically debonding adhesive system or method of any one of claims 7 to 9, wherein the electrically debonding adhesive comprises a (meth)acrylic-based copolymer.

11. The electrically debonding adhesive system or method of any one of claims 7 to 10, wherein the ionic liquid comprises at least one of a nitrogen-containing cation, a phosphonium ion, or a sulfonium ion and at least one of a sulfate, a sulfonate, a carboxylate, a phosphate, a borate, an imide, sulfonylimide, halide anion, or dicyanamide.

12. The electrically debonding adhesive system or method of any one of claims 7 to 11, wherein the ionic liquid is or dimethylaminoethyl acrylate methyl bis(fluorosulfonyl)imide or l-butyl-3- methylimidazolium hexafluorophosphate .

13. An adhesively bonded article comprising: a first electrically nonconductive substrate; an electrically conductive composition disposed on a surface the first electrically nonconductive substrate, the electrically conductive composition comprising an electrically conductive filler and a polymer comprising at least one of a polyurethane, a polyacrylate, a polyamide, or a rubber; a second substrate, which may be electrically conductive or not electrically conductive; and at least one layer of an electrically debonding adhesive between the electrically conductive composition disposed on the surface of the first electrically nonconductive substrate and the second substrate, wherein the electrically debonding adhesive comprises an ionic liquid.

14. The adhesively bonded article of claim 13, further comprising a double-sided tape comprising a conductive carrier with the at least one layer of the electrically debonding adhesive disposed thereon.

15. A method of debonding the adhesively bonded article of claim 13 or 14, the method comprising: applying an electrical potential between the first electrically nonconductive substrate with the electrically conductive composition disposed thereon and the second substrate; and subsequently separating the first electrically nonconductive substrate and the second substrate.

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