Metallized ferrite planar transformer

Abstract

A magnetic component assembly includes a first ferrite body having a first surface and a first metallized layer comprising silver and glass frit disposed on the first surface. A printed circuit board includes a coil pattern, and a second ferrite body having a second surface with a second metallized layer is provided. The first ferrite body is disposed on a first side of the printed circuit board and the second ferrite body is disposed on a second side, with the metallized layers coupled to the coil pattern through solder joints to enable power transfer between windings. The metallized layers provide both mechanical attachment and electrical conductivity, eliminating separate adhesive processes while maintaining isolation capabilities of at least 1000 volts. Methods of manufacturing include ultrasonically washing the ferrite surfaces before applying the metallized layers through screen printing.

Description

TECHNICAL FIELD

[0001] The present disclosure generally relates to magnetic components and power electronics. More specifically, the disclosure relates to transformers, magnetic components in printed circuit board assemblies, and methods of manufacturing electronic components. The field includes power conversion systems, isolation transformers, and surface mount technology for electronic assemblies. This disclosure further relates to manufacturing processes for electronic components, particularly in the field of power electronics and circuit board assembly techniques.BACKGROUND

[0002] Power electronics and electronic assemblies commonly require magnetic components for power conversion and signal isolation. In modern electronics manufacturing, printed circuit board (PCB) assemblies incorporate various magnetic components that are critical for device operation. Traditional manufacturing processes for incorporating magnetic components into PCB assemblies often involve multiple manufacturing steps and specialized assembly techniques.

[0003] The integration of magnetic components, particularly transformers, with printed circuit boards has become increasingly important in power electronics applications. Current manufacturing methods for attaching magnetic components to PCBs may involve adhesive-based processes that can introduce manufacturing complexities, including storage requirements for adhesives, development of application patterns, and additional production cycle time.

[0004] Quality control and consistency in magnetic component assembly remain important considerations in electronics manufacturing. Variations in assembly processes can affect electrical performance characteristics and may impact overall system design parameters. Additionally, the growing demand for high-voltage isolation capabilities in power electronics has created a need for reliable isolation solutions that can accommodate increasing power requirements in modern applications.

[0005] The electronics industry continues to seek improved methods for incorporating magnetic components into PCB assemblies, particularly approaches that can enhance manufacturing efficiency, reduce process complexity, and maintain consistent performance characteristics across production units.BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

[0006] To easily identify the discussion of any particular element or act, the most significant digit or digits in a reference number refer to the figure number in which that element is first introduced. FIG. 1 is a diagram depicting dimensional drawings of a ferrite disc component with metallized surfaces, including multiple cross-sectional views, according to certain examples. FIG. 2 is a diagram depicting a transformer assembly, according to certain examples. FIG. 3 is a diagram depicting a transformer assembly, according to certain examples. FIG. 4 is a diagram depicting a transformer assembly that includes metallized ferrite components, according to certain examples. DETAILED DESCRIPTION

[0007] Modern power electronics increasingly rely on planar magnetic components integrated into printed circuit board (PCB) assemblies for power conversion and signal isolation. Traditional methods of incorporating magnetic components, particularly ferrite elements, into PCB assemblies typically utilize adhesive-based attachment processes. These conventional approaches present several manufacturing challenges, including requirements for adhesive storage, development of proper application patterns, and increased production cycle times. Additionally, variations in adhesive application can lead to inconsistent electrical performance between manufactured units.

[0008] The present disclosure seeks to provide solutions to these manufacturing challenges through a magnetic component assembly that integrates specialized metallization technology with ferrite components. The assembly comprises a first ferrite body having a metallized surface on a first side of a printed circuit board and a second ferrite body having a metallized surface on a second side of the printed circuit board, with a coil pattern disposed between them.

[0009] In some example, the ferrite bodies comprise disc-shaped structures with diameters of approximately 20 millimeters. The ferrite material may comprise Siferrit or equivalent magnetic materials suitable for power electronics applications. The metallized layers may in some examples comprise silver combined with glass frit material, achieving minimum thicknesses of 5 micrometers to ensure proper electrical and mechanical characteristics.

[0010] In some examples, the metallization process includes ultrasonic washing of the ferrite surfaces followed by screen printing of the silver and glass frit material. The metallized surfaces may provide mechanical attachment points through solder joints and creating electrical paths for current from the center of the coil patterns.

[0011] In some examples, the assembly provides electrical isolation capabilities of at least 1000 volts, making it suitable for high-voltage applications such as power supplies in vehicles with batteries exceeding 500V. The direct solder attachment method eliminates separate gluing processes while maintaining consistent electrical performance characteristics across production units.

[0012] In some examples, the metallized surfaces may incorporate additional spiral patterns to increase inductance and improve transformer quality. For example, on top of having spirals on the PCB board, the metallization layer can include additional spiral patterns that the current traverses when escaping from the center of the coil. These additional spirals in the metallization layer increase the inductance, which can improve the overall quality and performance of the transformer.

[0013] FIG. 1 is a diagram 100 depicting dimensional drawings of a ferrite disc component with metallized surfaces, including multiple cross-sectional views, according to certain examples. The diagram 100 includes example measurements and tolerances for a disc-shaped ferrite body with a diameter of approximately 20 millimeters. Multiple cross-sectional views and detail callouts illustrate critical features, including the post-metallization surfaces where silver and glass frit material is applied. The figure provides manufacturing-level specifications for surface finishes, angles, and other dimensional requirements essential for production.

[0014] FIG. 2 is a diagram 200 depicting a transformer assembly, according to certain examples. The diagram 200 shows the coil pattern of a printed circuit board configured to receive ferrite bodies. For example, the ferrite bodies may be positioned on opposite sides of the printed circuit board, upon the coil pattern, The metallized surfaces of the ferrite bodies interface with coil patterns on the PCB to create both mechanical and electrical connections.

[0015] FIG. 3 is a diagram 300 depicting a transformer assembly, according to certain examples. The diagram 300 depicts a first ferrite disc which may be soldered upon a coil pattern (e.g., the coil pattern depicted in the diagram 200), on a first surface of a PCB. The diagram 300 also include a depiction of a second ferrite disc to show the metallized surface. In some examples, the second ferrite disc may be soldered to a second surface of the PCB, upon a coil pattern of the second surface of the PCB.

[0016] FIG. 4 is a diagram 400 depicting a transformer assembly that includes metallized ferrite components, according to certain examples. As seen in the diagram 400, a first and second ferrite body may be disposed on opposite sides of a PCB (not shown), with coil patterns sandwiched between them (not shown). The metallized surfaces of both ferrite bodies are coupled to the coil patterns through solder joints, creating a unified assembly capable of providing electrical isolation of at least 1000 volts.EXAMPLES

[0017] Example 1 is a magnetic component assembly comprising a first ferrite body comprising a first surface, a first metallized layer on the first surface of the first ferrite body, the first metallized layer comprising silver and glass frit, a printed circuit board comprising a coil pattern, a second ferrite body comprising a second surface, and a second metallized layer on the second surface of the second ferrite body, wherein the first ferrite body is disposed on a first side of the printed circuit board and the second ferrite body is disposed on a second side of the printed circuit board, and wherein the first and second metallized layers are coupled to the coil pattern through solder joints.

[0018] In Example 2, the subject matter of Example 1, wherein the first ferrite body comprises a disc having a diameter of approximately 20 millimeters.

[0019] In Example 3, the subject matter of Examples 1-2, wherein the first metallized layer has a thickness of at least 5 micrometers.

[0020] In Example 4, the subject matter of Examples 1-3, wherein the first metallized layer comprises a screen-printed layer.

[0021] In Example 5, the subject matter of Examples 1-4, wherein the first surface comprises an ultrasonically washed surface adjacent to the first metallized layer.

[0022] In Example 6, the subject matter of Examples 1-5, wherein the first metallized layer and the first ferrite body provide electrical isolation of at least 1000 volts.

[0023] In Example 7, a method of manufacturing a magnetic component assembly comprises providing a first ferrite body comprising a first surface and a second ferrite body comprising a second surface, applying a first metallized layer comprising silver and glass frit to the first surface, applying a second metallized layer to the second surface, and soldering the first metallized layer to a first coil pattern on a first side of a printed circuit board and the second metallized layer to a second coil pattern on a second side of the printed circuit board.

[0024] In Example 8, the subject matter of Example 7, wherein applying the first metallized layer comprises screen printing.

[0025] In Example 9, the subject matter of Examples 7-8, further comprising ultrasonically washing the first surface before applying the first metallized layer.

[0026] In Example 10, the subject matter of Examples 7-9, wherein the first metallized layer forms an electrical path for current from a center of the coil pattern.

[0027] Example 11 may include a method, technique, or process as described in or related to any of the preceding examples or portions or parts thereof.GLOSSARY

[0028] FERRITE: A magnetic material used as the core component in transformers and other magnetic devices.

[0029] PLANAR TRANSFORMER: A type of transformer that utilizes flat (planar) windings typically incorporated into printed circuit boards, with magnetic material attached to the PCB assembly.

[0030] METALLIZATION: The process of applying a metallic coating to a non-metallic surface. In this context, it refers to the application of a silver and glass frit coating to the ferrite surface.

[0031] GLASS FRIT: A component used in the metallization material along with silver to create the conductive coating.

[0032] PICK AND PLACE OPERATION: A standard manufacturing process in electronics assembly where components are automatically placed onto printed circuit boards.

Examples

example 11

[0027 may include a method, technique, or process as described in or related to any of the preceding examples or portions or parts thereof.

GLOSSARY

[0028]FERRITE: A magnetic material used as the core component in transformers and other magnetic devices.

[0029]PLANAR TRANSFORMER: A type of transformer that utilizes flat (planar) windings typically incorporated into printed circuit boards, with magnetic material attached to the PCB assembly.

[0030]METALLIZATION: The process of applying a metallic coating to a non-metallic surface. In this context, it refers to the application of a silver and glass frit coating to the ferrite surface.

[0031]GLASS FRIT: A component used in the metallization material along with silver to create the conductive coating.

[0032]PICK AND PLACE OPERATION: A standard manufacturing process in electronics assembly where components are automatically placed onto printed circuit boards.

TECHNICAL FIELD

[0001] The present disclosure generally relates to magnetic components and power electronics. More specifically, the disclosure relates to transformers, magnetic components in printed circuit board assemblies, and methods of manufacturing electronic components. The field includes power conversion systems, isolation transformers, and surface mount technology for electronic assemblies. This disclosure further relates to manufacturing processes for electronic components, particularly in the field of power electronics and circuit board assembly techniques.BACKGROUND

[0002] Power electronics and electronic assemblies commonly require magnetic components for power conversion and signal isolation. In modern electronics manufacturing, printed circuit board (PCB) assemblies incorporate various magnetic components that are critical for device operation. Traditional manufacturing processes for incorporating magnetic components into PCB assemblies often involve multiple manufacturing steps and specialized assembly techniques.

[0003] The integration of magnetic components, particularly transformers, with printed circuit boards has become increasingly important in power electronics applications. Current manufacturing methods for attaching magnetic components to PCBs may involve adhesive-based processes that can introduce manufacturing complexities, including storage requirements for adhesives, development of application patterns, and additional production cycle time.

[0004] Quality control and consistency in magnetic component assembly remain important considerations in electronics manufacturing. Variations in assembly processes can affect electrical performance characteristics and may impact overall system design parameters. Additionally, the growing demand for high-voltage isolation capabilities in power electronics has created a need for reliable isolation solutions that can accommodate increasing power requirements in modern applications.

[0005] The electronics industry continues to seek improved methods for incorporating magnetic components into PCB assemblies, particularly approaches that can enhance manufacturing efficiency, reduce process complexity, and maintain consistent performance characteristics across production units.BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

[0006] To easily identify the discussion of any particular element or act, the most significant digit or digits in a reference number refer to the figure number in which that element is first introduced. FIG. 1 is a diagram depicting dimensional drawings of a ferrite disc component with metallized surfaces, including multiple cross-sectional views, according to certain examples. FIG. 2 is a diagram depicting a transformer assembly, according to certain examples. FIG. 3 is a diagram depicting a transformer assembly, according to certain examples. FIG. 4 is a diagram depicting a transformer assembly that includes metallized ferrite components, according to certain examples. DETAILED DESCRIPTION

[0007] Modern power electronics increasingly rely on planar magnetic components integrated into printed circuit board (PCB) assemblies for power conversion and signal isolation. Traditional methods of incorporating magnetic components, particularly ferrite elements, into PCB assemblies typically utilize adhesive-based attachment processes. These conventional approaches present several manufacturing challenges, including requirements for adhesive storage, development of proper application patterns, and increased production cycle times. Additionally, variations in adhesive application can lead to inconsistent electrical performance between manufactured units.

[0008] The present disclosure seeks to provide solutions to these manufacturing challenges through a magnetic component assembly that integrates specialized metallization technology with ferrite components. The assembly comprises a first ferrite body having a metallized surface on a first side of a printed circuit board and a second ferrite body having a metallized surface on a second side of the printed circuit board, with a coil pattern disposed between them.

[0009] In some example, the ferrite bodies comprise disc-shaped structures with diameters of approximately 20 millimeters. The ferrite material may comprise Siferrit or equivalent magnetic materials suitable for power electronics applications. The metallized layers may in some examples comprise silver combined with glass frit material, achieving minimum thicknesses of 5 micrometers to ensure proper electrical and mechanical characteristics.

[0010] In some examples, the metallization process includes ultrasonic washing of the ferrite surfaces followed by screen printing of the silver and glass frit material. The metallized surfaces may provide mechanical attachment points through solder joints and creating electrical paths for current from the center of the coil patterns.

[0011] In some examples, the assembly provides electrical isolation capabilities of at least 1000 volts, making it suitable for high-voltage applications such as power supplies in vehicles with batteries exceeding 500V. The direct solder attachment method eliminates separate gluing processes while maintaining consistent electrical performance characteristics across production units.

[0012] In some examples, the metallized surfaces may incorporate additional spiral patterns to increase inductance and improve transformer quality. For example, on top of having spirals on the PCB board, the metallization layer can include additional spiral patterns that the current traverses when escaping from the center of the coil. These additional spirals in the metallization layer increase the inductance, which can improve the overall quality and performance of the transformer.

[0013] FIG. 1 is a diagram 100 depicting dimensional drawings of a ferrite disc component with metallized surfaces, including multiple cross-sectional views, according to certain examples. The diagram 100 includes example measurements and tolerances for a disc-shaped ferrite body with a diameter of approximately 20 millimeters. Multiple cross-sectional views and detail callouts illustrate critical features, including the post-metallization surfaces where silver and glass frit material is applied. The figure provides manufacturing-level specifications for surface finishes, angles, and other dimensional requirements essential for production.

[0014] FIG. 2 is a diagram 200 depicting a transformer assembly, according to certain examples. The diagram 200 shows the coil pattern of a printed circuit board configured to receive ferrite bodies. For example, the ferrite bodies may be positioned on opposite sides of the printed circuit board, upon the coil pattern, The metallized surfaces of the ferrite bodies interface with coil patterns on the PCB to create both mechanical and electrical connections.

[0015] FIG. 3 is a diagram 300 depicting a transformer assembly, according to certain examples. The diagram 300 depicts a first ferrite disc which may be soldered upon a coil pattern (e.g., the coil pattern depicted in the diagram 200), on a first surface of a PCB. The diagram 300 also include a depiction of a second ferrite disc to show the metallized surface. In some examples, the second ferrite disc may be soldered to a second surface of the PCB, upon a coil pattern of the second surface of the PCB.

[0016] FIG. 4 is a diagram 400 depicting a transformer assembly that includes metallized ferrite components, according to certain examples. As seen in the diagram 400, a first and second ferrite body may be disposed on opposite sides of a PCB (not shown), with coil patterns sandwiched between them (not shown). The metallized surfaces of both ferrite bodies are coupled to the coil patterns through solder joints, creating a unified assembly capable of providing electrical isolation of at least 1000 volts.EXAMPLES

[0017] Example 1 is a magnetic component assembly comprising a first ferrite body comprising a first surface, a first metallized layer on the first surface of the first ferrite body, the first metallized layer comprising silver and glass frit, a printed circuit board comprising a coil pattern, a second ferrite body comprising a second surface, and a second metallized layer on the second surface of the second ferrite body, wherein the first ferrite body is disposed on a first side of the printed circuit board and the second ferrite body is disposed on a second side of the printed circuit board, and wherein the first and second metallized layers are coupled to the coil pattern through solder joints.

[0018] In Example 2, the subject matter of Example 1, wherein the first ferrite body comprises a disc having a diameter of approximately 20 millimeters.

[0019] In Example 3, the subject matter of Examples 1-2, wherein the first metallized layer has a thickness of at least 5 micrometers.

[0020] In Example 4, the subject matter of Examples 1-3, wherein the first metallized layer comprises a screen-printed layer.

[0021] In Example 5, the subject matter of Examples 1-4, wherein the first surface comprises an ultrasonically washed surface adjacent to the first metallized layer.

[0022] In Example 6, the subject matter of Examples 1-5, wherein the first metallized layer and the first ferrite body provide electrical isolation of at least 1000 volts.

[0023] In Example 7, a method of manufacturing a magnetic component assembly comprises providing a first ferrite body comprising a first surface and a second ferrite body comprising a second surface, applying a first metallized layer comprising silver and glass frit to the first surface, applying a second metallized layer to the second surface, and soldering the first metallized layer to a first coil pattern on a first side of a printed circuit board and the second metallized layer to a second coil pattern on a second side of the printed circuit board.

[0024] In Example 8, the subject matter of Example 7, wherein applying the first metallized layer comprises screen printing.

[0025] In Example 9, the subject matter of Examples 7-8, further comprising ultrasonically washing the first surface before applying the first metallized layer.

[0026] In Example 10, the subject matter of Examples 7-9, wherein the first metallized layer forms an electrical path for current from a center of the coil pattern.

[0027] Example 11 may include a method, technique, or process as described in or related to any of the preceding examples or portions or parts thereof.GLOSSARY

[0028] FERRITE: A magnetic material used as the core component in transformers and other magnetic devices.

[0029] PLANAR TRANSFORMER: A type of transformer that utilizes flat (planar) windings typically incorporated into printed circuit boards, with magnetic material attached to the PCB assembly.

[0030] METALLIZATION: The process of applying a metallic coating to a non-metallic surface. In this context, it refers to the application of a silver and glass frit coating to the ferrite surface.

[0031] GLASS FRIT: A component used in the metallization material along with silver to create the conductive coating.

[0032] PICK AND PLACE OPERATION: A standard manufacturing process in electronics assembly where components are automatically placed onto printed circuit boards.

Examples

example 11

[0027 may include a method, technique, or process as described in or related to any of the preceding examples or portions or parts thereof.

GLOSSARY

[0028]FERRITE: A magnetic material used as the core component in transformers and other magnetic devices.

[0029]PLANAR TRANSFORMER: A type of transformer that utilizes flat (planar) windings typically incorporated into printed circuit boards, with magnetic material attached to the PCB assembly.

[0030]METALLIZATION: The process of applying a metallic coating to a non-metallic surface. In this context, it refers to the application of a silver and glass frit coating to the ferrite surface.

[0031]GLASS FRIT: A component used in the metallization material along with silver to create the conductive coating.

[0032]PICK AND PLACE OPERATION: A standard manufacturing process in electronics assembly where components are automatically placed onto printed circuit boards.

Claims

1. A magnetic component assembly comprising: a first ferrite body comprising a first surface; a first metallized layer on the first surface of the first ferrite body; a printed circuit board having a coil pattern; a second ferrite body having a second surface; and a second metallized layer on the second surface of the second ferrite body.

2. The magnetic component assembly of claim 1, wherein the first ferrite body is disposed on a first side of the printed circuit board, and the second ferrite body is disposed on a second side of the printed circuit board.

3. The magnetic component assembly of claim 1, wherein the first and second metallized layers are coupled to the coil pattern of the printed circuit board through a first solder joint and a second solder joint.

4. The magnetic component assembly of claim 1, wherein the metallized layer comprises a silver and glass frit5. The magnetic component assembly of claim 1, wherein the first ferrite body comprises a disc having a diameter of at least 20 millimeters.

6. The magnetic component assembly of claim 1, wherein the metallized layer has a thickness of at least 5 micrometers.

7. The magnetic component assembly of claim 1, wherein the metallized layer comprises a screen-printed layer.

8. The magnetic component assembly of claim 1, wherein the first ferrite body comprises an ultrasonically washed surface adjacent to the metallized layer.

9. The magnetic component assembly of claim 1, wherein the metallized layer and the ferrite body provide electrical isolation of at least 1000 volts.

10. A method of manufacturing a magnetic component assembly comprising: providing a first ferrite body having a first surface; applying a first metallized layer to the first surface; providing a second ferrite body having a second surface; applying a second metallized layer to the second surface; and soldering the first metallized layer to a first coil pattern on a first side of a printed circuit board, and the second metallized layer to a second coil pattern on a second side of the printed circuit board.

11. The method of claim 10, wherein applying the metallized layer comprises screen printing.

12. The method of claim 10, further comprising ultrasonically washing the first surface before applying the metallized layer.

13. The method of claim 10, wherein the metallized layer comprises a silver and glass frit.

14. The method of claim 10, wherein the first ferrite body comprises a disc having a diameter of at least 20 millimeters.

15. The method of claim 10, wherein the metallized layer has a thickness of at least 5 micrometers.

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