Semiconductor circuit breaker having water-cooled heat dissipation system

Abstract

The present invention relates to a semiconductor circuit breaker and, more specifically, to a semiconductor circuit breaker having a water-cooled heat dissipation system. According to an embodiment of the present invention, the semiconductor circuit breaker includes a water-cooled heat dissipation system in which cooling water flows in a lower portion of a switching unit and an air gap switch, thereby effectively performing cooling.

Description

Technical Field

[0001] The disclosure relates to a semiconductor circuit breaker, and more particularly, to a semiconductor circuit breaker having a water-cooled heat dissipation system.Background Art

[0002] In general, a semiconductor circuit breaker is electric power equipment designed to break a circuit, using a semiconductor switch such as a metal oxide semiconductor field effect transistor (MOSFET), an insulated gate bipolar transistor (IGBT), or the like.

[0003] The semiconductor circuit breaker has an advantage that a semiconductor switch element is applied to a circuit breaker used in electric power equipment, thereby remarkably reducing a breaking time and simplifying a structure. In addition, since the semiconductor circuit breaker performs circuit breaking, using current breaking characteristics of the semiconductor switch, no arc is generated during circuit breaking, so an arc removal function is not required. Therefore, there is an advantage that an arc extinguishing unit is removed, so that the volume thereof can be reduced.

[0004] On the other hand, a low-capacity circuit breaker has a disadvantage that manufacturing cost increases due to the use of a semiconductor switch.

[0005] The semiconductor circuit breaker is often used in systems that require quick breaking. In the case of a general mechanical circuit breaker, a breaking speed thereof is a few to hundreds of ms, whereas a breaking speed of the semiconductor circuit breaker is tens of µs, thereby breaking a current in a much shorter time.

[0006] Accordingly, the semiconductor circuit breaker tends to be actively used in a switchboard with a large current capacity, a direct current system with a rapid increase in fault current, an energy storage system (ESS) that requires stable current supply and breaking, or the like. A battery energy storage system (BESS) has recently been widely used in electric vehicles, and the like. However, in recent years, when considering that ignition occurs in the ESS, the importance of a circuit breaker is becoming more urgent so as to achieve stable current supply, considering heat generation.

[0007] Meanwhile, a protection circuit (safety circuit) or a safety element is applied to the semiconductor circuit breaker so as to protect a semiconductor from damage caused by a voltage generated during semiconductor switching. A snubber circuit is used as an example of the protection circuit. A power semiconductor circuit breaker also requires a protection circuit such as a snubber circuit to decrease a voltage generated during switching.

[0008] In addition, there is a case where a metal oxide varistor (MOV) is additionally configured as the safety element in some systems. The MOV is one of components used for surge protection, and is applied to a portion of a circuit so as to prevent damage of electrical and electronic devices from a surge. The MOV is a varistor composed of zinc oxide and is a transient voltage suppressor in which current flows when a potential equal to or higher than a certain value is generated. As the element is applied, a fuse inside the circuit is unnecessary.

[0009] The semiconductor circuit breaker is generally configured in a hybrid structure of a mechanical circuit breaker and an electronic circuit breaker. That is, the semiconductor circuit breaker does not include only a semiconductor switch but includes an auxiliary mechanical switch (air gap switch) to mechanically (physically) cut off connection of the circuit.

[0010] Meanwhile, the semiconductor circuit breaker is mainly applied to direct current power circuits. A direct current circuit breaker has an advantage that it is easy to set positions of a power source and a load.

[0011] As illustrated in FIG. 1, when a direct current circuit breaker is arranged on a system or a circuit in an order of 'a power source 3 → the direct current circuit breaker 2 → a load 1 (case a),' current flows from the left to the right on the drawing.

[0012] In addition, when the direct current circuit breaker is arranged on the system or the circuit in an order of 'the load 3 → the direct current circuit breaker 2 → the power source (case b),' the current flows from the right to the left on the drawing.

[0013] Besides, the direct current circuit breaker may be installed on a circuit through which the current flows in both directions (case c). A first power source 4 and a second power source 5 may be arranged at front and rear ends of the direct current circuit breaker 2. Here, the first power source 4 or the second power source 5 may be configured as a battery.

[0014] A perspective view of the semiconductor circuit breaker is illustrated in FIG. 2. The semiconductor circuit breaker includes a switching unit 6 and an air gap switch 7. Here, the switching unit 6 includes a power semiconductor switch, and the air gap switch 7 refers to a mechanical switch. A heat sink 8 and a heat dissipation fan 9, which are used for cooling, are arranged below the switching unit 6 and the air gap switch 7.

[0015] However, since high heat is generated in the switching unit, it is necessary to release the heat. In addition, high heat is generated at a contact portion of the mechanical switch (air gap switch) during breaking. Therefore, since heat is released at the periphery of the contact portion, cooling for the heat is necessary, and a configuration for efficient cooling is required.

[0016] Meanwhile, such heat dissipation performance should be efficiently made within a limited space of the semiconductor circuit breaker. It is preferable to decrease the size of the semiconductor circuit breaker if possible, and therefore, it is preferably to have efficient heat dissipation performance while occupying a small occupied space.

[0017] In addition, the convenience of maintenance should be considered. The semiconductor circuit breaker should be manufactured by considering the necessity of maintenance of a component including the switching unit, the air gap switch, the heat sink, or the like.Disclosure of Invention Technical Problem

[0018] Therefore, to obviate those problems, an aspect of the detailed description is to provide a semiconductor circuit breaker having an effective cooling performance, using a water-cooled cooling system.

[0019] Another aspect of the detailed description is to reduce a space that a water-cooled cooling system occupies within a semiconductor circuit breaker.

[0020] Still another aspect of the detailed description is to provide a heat dissipation system capable of facilitate maintenance in a semiconductor circuit breaker.Solution to Problem

[0021] To achieve these and other advantages and in accordance with the purpose of the disclosure, as embodied and broadly described herein, there is provided a semiconductor circuit breaker including a switching unit arranged inside an enclosure and including a power semiconductor element; and a cooling water housing coupled to the switching unit below the switching unit and having an open upper surface, wherein a cooling water accommodation portion accommodating cooling water is arranged in the cooling water housing, and wherein a plurality of partition walls are arranged in the cooling water accommodation portion to allow a plurality of channels through which the cooling water flows to be divided.

[0022] Here, the cooling water housing may have an inflow port and an outflow port, which are respectively formed in surfaces facing each other.

[0023] In addition, a lower portion of the enclosure may be opened, so that the cooling water housing is exposed to ambient air.

[0024] In addition, the partition wall may be configured as a plate extending along a length direction of the cooling water housing.

[0025] In addition, the partition wall may have a predetermined distance from each of a front surface portion and a rear surface portion of the cooling water housing.

[0026] In addition, the partition wall may be formed to have a same height as a height of the cooling water housing.

[0027] In addition, a distribution plate having a plurality of through-holes formed therein may be arranged in a front portion of the cooling water accommodation portion.

[0028] In addition, guide portions may be arranged on left and right walls of the channel.

[0029] In addition, the channel may have a plurality of divided districts, and the districts may be divided using horizontal walls, vertical walls, and wall connectors to or from which the horizontal walls and the vertical walls are coupled or separated.

[0030] In addition, fitting grooves in which the horizontal walls and the vertical walls are fitted may be formed in a side surface portion of the wall connector.

[0031] In addition, the channel may have a plurality of divided districts, a district wall forming a wall of the district may be configured as a linear plate, and bent portions bent in directions opposite to each other may be formed at both end portions of the district wall, respectively.

[0032] In addition, the bent portion may be coupled to a ''-shaped connection portion.Advantageous Effects of Invention

[0033] According to the semiconductor circuit breaker according to the disclosure, a water-cooled heat dissipation system in which the cooling water flows is arranged below the switching unit and the air gap switch, so that cooling is effectively performed.

[0034] Further, in the water-cooled heat dissipation system, heat transference occurs while the cooling water flowing in the cooling water housing having the open upper surface is in direct contact with the switching unit, so that a cooling effect is maximized.

[0035] In addition, the cooling water housing is divided into a plurality of districts (cells) arranged in the horizontal and vertical directions to form a specific cooling water flow path, so that the cooling water can intensively flow in a specific region.

[0036] Furthermore, in the water-cooled heat dissipation system, a space that the water-cooled heat dissipation system occupies is remarkably reduced as compared with a space that an air-cooled heat dissipation system such as a cooling fan occupies.

[0037] In addition, since the water-cooled heat dissipation system is exposed to the outside of the enclosure, maintenance thereof is facilitated.Brief Description of Drawings

[0038] FIG. 1 is a configuration diagram of a direct current circuit breaker according to a conventional art. FIG. 2 is a perspective view of the semiconductor circuit breaker according to the conventional art. FIGS. 3 and 4 are perspective and side views of a semiconductor circuit breaker according to an embodiment of the disclosure. FIG. 5 is a circuit diagram of the semiconductor circuit breaker according to the embodiment of the disclosure. FIGS. 6 and 7 are perspective and plan views of a cooling water housing in the semiconductor circuit breaker according to the embodiment of the disclosure. FIG. 8 is a perspective view of a packing member applied to the cooling water housing according to the embodiment of FIG. 6. FIG. 9 is a perspective view of a distribution plate applied to the semiconductor circuit breaker according to the embodiment of the disclosure. FIG. 10 is a plan view of a cooling water housing according to another embodiment of the disclosure. FIG. 11 is a plan view of a cooling water housing according to still another embodiment of the disclosure. FIGS. 12 and 13 are plan and perspective views of district walls and a wall connector in FIG. 11. FIG. 14 is a perspective view of a packing member applied to the cooling water housing according to the embodiment of FIG. 11. FIG. 15 is a plan view of a cooling water housing according to still another embodiment of the disclosure. FIG. 16 is a plan view of district walls and wall connectors in FIG. 15. Mode for the Invention

[0039] Hereinafter, preferred embodiments of the disclosure will be described with reference to the accompanying drawings, which are intended to describe the disclosure in detail to allow a person skilled in the art to easily carry out the invention, but not to mean that the technical concept and scope of the disclosure are limited thereto.

[0040] A semiconductor circuit breaker according to each embodiment of the disclosure will be described in detail with reference to the drawings.<First Embodiment>

[0041] Perspective and side views of a semiconductor circuit breaker according to an embodiment of the disclosure are illustrated in FIGS. 3 and 4. A circuit diagram of the semiconductor circuit breaker according to the embodiment of the disclosure is illustrated in FIG. 5.

[0042] A semiconductor circuit breaker 100 according to an embodiment of the disclosure may include a switching unit 120 arranged inside an enclosure 101 and including a power semiconductor element; and a cooling water housing 200 coupled to the switching unit 120 below the switching unit 120 and having an open upper surface, and allow a plurality of channels CH 1 to CH n through which cooling water W flows to be divided in the cooling water housing 200.

[0043] The enclosure 101 may be formed in a substantially rectangular box shape. The enclosure 101 may be made of an insulating material such as a synthetic resin to be insulated from the outside. The enclosure 101 supports internal components such as the switching unit 120 and an electric circuit 130 and protects the internal components from the outside.

[0044] A lower surface of the enclosure 101 is opened. That is, the enclosure may have a shape in which upper, front, rear, left, and right surfaces thereof are closed and the lower surface thereof is opened. Therefore, a lower surface of the switching unit 120 may be exposed to the outside.

[0045] An air vent hole is formed in a front surface or a rear surface of the enclosure 101. It is shown in FIG. 3 that a first air vent hole 103 is formed in the rear surface of the enclosure. However, the air vent hole may be formed in each surface of the enclosure 101 when necessary.

[0046] Components arranged inside the enclosure 101 will be described.

[0047] The switching unit 120 is arranged in the enclosure 101. The switching unit 120 includes a power semiconductor switch. A metal oxide semiconductor field effect transistor (MOSFET), an insulated gate bipolar transistor (IGBT), or the like may be applied as the power semiconductor switch.

[0048] The power semiconductor switch is often used in systems that require quick breaking. In the case of a general mechanical circuit breaker, a breaking speed thereof is a few to hundreds of ms, whereas a breaking speed of the semiconductor circuit breaker is tens of µs, thereby breaking a current in a much shorter time.

[0049] Accordingly, the semiconductor circuit breaker may be applied to a switchboard with a large current capacity, a direct current system with a rapid increase in fault current, an energy storage system (ESS) that requires stable current supply and breaking, or the like.

[0050] A first base plate 110 is arranged below the switching unit 120.

[0051] The electric circuit 130 is arranged above the switching unit 120. Alternatively, the switching unit 120 may be installed in a portion of the electric circuit 130.

[0052] The electric circuit 130 may include a gate driver (not shown), a controller 133, a snubber 135, a metal oxide varistor (MOV) 137, a transient voltage suppressor (TVS), and the like.

[0053] The gate driver provides a voltage that the switching unit 120 requires. To this end, the gate driver may include a separate power source circuit and a separate current buffer. The gate driver is also referred to as a driving driver.

[0054] In addition, the gate driver functions to electrically insulate signals between a high-voltage power circuit and a low-voltage control circuit and transfer the signals. Accordingly, the gate driver provides safer and higher reliability so as to achieve semiconductor switch driving.

[0055] The controller 133 connects and controls components in the circuit. The controller 133 may determine whether current transferred from a current sensor 132 is overcurrent or fault current according to the magnitude of the current, and may operate the switching unit 120 and an air gap switch 140 according to the overcurrent or the fault current. The controller 133 may operate the air gap switch 140 through a first driver 134a and may operate the switching unit 120 through a second driver 134b (see FIG. 5).

[0056] Here, the current sensor 132 is installed in a portion of a main circuit. In FIG. 5, the current sensor 132 may be arranged at any one of positions ① , ②, and ③. That is, the current sensor 132 may be installed at a front or rear end of the air gap switch 140 or a front or rear end of the switching unit 120.

[0057] In the case of the semiconductor circuit breaker, a protection circuit (safety circuit) or a safety element is applied to the semiconductor circuit breaker so as to protect the semiconductor switch from damage caused by a high voltage generated during semiconductor switching. A snubber circuit is used as an example of the protection circuit. In the semiconductor circuit breaker, it is general that the protection circuit decreases a voltage generated during switching, thereby protecting the semiconductor switch.

[0058] Examples of the snubber circuit may be a capacitor (C) snubber, a resistor-capacitor (RC) snubber, a charge-discharge type resistor-capacitor-diode (RCD) snubber, a discharge-suppressing type snubber circuit, and the like.

[0059] In addition, there is a case where the metal oxide varistor (MOV) 137 is additionally configured as the safety element in some systems. The MOV is one of components used for surge protection, and is applied to a portion of the circuit so as to prevent damage occurring in the semiconductor switch from a surge voltage. The MOV is a varistor composed of zinc oxide and is a transient voltage suppressor in which current flows when a potential equal to or higher than a set value is generated. When the MOV is applied, it is unnecessary to install a separate fuse inside the circuit.

[0060] The protection circuit and the safety element, which are described above, may be provided as a protection module detachably attached to the electric circuit 130. When the safety element is independently configured as a protection module, maintenance thereof is facilitated. That is, only the protection module is replaced in damage of the protection module.

[0061] The air gap switch 140 is arranged. The air gap switch 140 is a mechanical switch. The air gap switch 140 may be configured as a conventional mechanical switch having a contact portion composed of a fixed contact and a movable contact. In the air gap switch 140, the movable contact is connected to the fixed contact in conduction, and the movable contact is separated from the fixed contact, so that connection of the circuit is mechanically cut off. Since direct current has no current zero (0 point), there may occur a case where breaking of current is rather difficult when low current flows in the circuit. In this case, in order to completely break the current, it is necessary to mechanically cut off the circuit.

[0062] The air gap switch 140 may be located at a front portion or a rear portion of the switching unit 120. Here, the air gap switch 140 is preferably located at a side of a power source 180. This is because the circuit is separated in the vicinity of the power source in breaking, thereby protecting a breaking unit, other components, and a load 190.

[0063] However, much heat is generated at the contact portion of the air gap switch 140. Therefore, an apparatus for cooling heat of the air gap switch 140 and the switching unit 120 is required.

[0064] A second base plate 145 may be arranged below of the air gap switch 140.

[0065] The cooling water housing 200 is arranged below the switching unit 120 and the air gap switch 140. The cooling water housing 200 may be formed in a rectangular shape having an open upper surface.

[0066] Perspective and plan views of the cooling water housing 200 are illustrated in FIGS. 6 and 7.

[0067] The cooling water housing 200 may be made of a synthetic resin or a metal material. When the cooling water housing 200 is made of a metal material, the cooling water housing 200 is preferably made of a material having an excellent thermal conductivity, such as aluminum (Al) or copper (Cu). Accordingly, heat of the cooling water W can be quickly released to the outside.

[0068] The cooling water housing 200 may be coupled to the first base plate 110 forming a lower portion of the switching unit 120. In addition, the cooling water housing 200 may extend to the second base plate 145 forming a lower portion of the air gap switch 140 to be coupled to the second base plate 145.

[0069] The cooling water housing 200 may be coupled to the base plates 110 and 145 by a bonding or mechanical coupling method. An example of the mechanical coupling method may be fitting coupling, screw coupling, or the like.

[0070] Surfaces on which the cooling water housing 200 and the base plates 110 and 145 are in contact with each other have shapes or sizes corresponding to each other. That is, the upper surface of the cooling water housing 200 and lower surfaces of the base plates 110 and 145 have shapes corresponding to each other.

[0071] In an example, the upper surface of the cooling water housing 200 and the lower surfaces of the base plates 110 and 145 are configured as flat surfaces. Each of the base plates 110 and 145 is formed as a flat surface. The upper surface of the cooling water housing 200 is opened, and each side surface portion 215 is exposed. An upper end of each side surface portion 215 and upper ends of a front surface portion 203 and a rear surface portion 204 are formed to have a same height.

[0072] A fastening hole 208 may be formed in each corner portion of the cooling water housing 200 to be coupled to the base plates 110 and 145 by a fastening member.

[0073] A cooling water accommodation portion 205 is arranged in the cooling water housing 200. The cooling water accommodation portion 205 occupies most of the volume of the cooling water housing 200. The cooling water W is accommodated in the cooling water accommodation portion 205 and flows in the cooling water accommodation portion 205.

[0074] The cooling water housing 200 is made of a material having a high thermal conductivity to release heat of the switching unit 120, which is transferred through the base plate 110.

[0075] The cooling water housing 200 is located below the enclosure 101. The cooling water housing 200 is not located inside the enclosure 101 but located below of the enclosure to be exposed to ambient air. Accordingly, the factor of decrease in heat dissipation is reduced. When the lower surface of the enclosure 101 is opened, such an effect is further improved.

[0076] Since the lower surface of the enclosure 101 is opened, the cooling water housing 200 is coupled directly to the switching unit 120 or the air gap switch 140. When the base plates 110 and 145 exist, the cooling water housing 200 is coupled to the base plates 110 and 145.

[0077] The cooling water housing 200 has a sufficient size to quickly absorb heat of the base plates 110 and 145. For example, the cooling water housing 200 may be formed to have a size corresponding to an area of the base plates 110 and 145 or a size equal to or larger than the area of the base plates 110 and 145.

[0078] The cooling water accommodation portion 205 is formed in the cooling water housing 200. The cooling water W flows in and out of the cooling water accommodation portion 205. The upper surface of the cooling water housing 200 is opened. That is, an upper surface of the cooling water accommodation portion 205 is opened. Therefore, the cooling water W rises up to an upper surface portion of the cooling water housing 200. Accordingly, the cooling water W is in direct contact with the lower surfaces of the base plates 110 and 145, thereby absorbing heat of the switching unit 120 or the air gap switch 140. Since the cooling water W is in direct contact with the switching unit 120 or the air gap switch 140, heat transference is maximized.

[0079] The cooling water W is stored inside the cooling water housing 200 and flows in the cooling water housing 200. The cooling water housing 200 has an inflow port 201 and an outflow port 202. The inflow port 201 and the outflow port 202 may be arranged in one surface of the cooling water housing 200. Alternatively, the inflow port 201 and the outflow port 202 may be arranged in different surfaces of the cooling water housing 200, respectively. Preferably, the inflow port 201 and the outflow port 202 may be respectively formed in surfaces of the cooling water housing 200, which face each other, to form a flow path through the cooling water W flows straight.

[0080] According to the semiconductor circuit breaker according to the embodiment of the disclosure, the cooling water housing 20 in which the cooling water is accommodated and flows is arranged below the switching unit and the air gap switch, so that cooling is effectively performed.

[0081] Since the upper surface of the cooling water housing 200 is opened, heat is transferred while the cooling water is in direct contact with the switching unit, so that a cooling effect is maximized.

[0082] A space that such a water-cooled heat dissipation system occupies is remarkably reduced as compared with a space that an air-cooled heat dissipation system such as a cooling fan occupies.

[0083] In addition, since the cooling water housing 200 is exposed to the outside of the enclosure 101, maintenance is facilitated.

[0084] The cooling water accommodation portion 205 of the cooling water housing 200 is divided into a plurality of regions. The regions divided as described above in the cooling water accommodation portion 205 are referred to as channels. For example, it is shown in FIGS. 6 and 7 that the cooling water accommodation portion 205 is divided into four channels.

[0085] Partition walls 209 forming each channel are arranged. Here, the partition wall 209 may be configured as a plate extending along a length direction of the cooling water housing 200. Therefore, when viewed on the plan view, each channel of the cooling water accommodation portion 205 has a shape similar to a lane of a swimming pool.

[0086] Heights of the partition walls 209 are preferably formed to be the same, corresponding to a height of the cooling water accommodation portion 205. That is, an upper end of the partition wall 209 forms a same height as the upper ends of the front surface portion 203, the rear surface portion 204, and the side surface portion 215.

[0087] The partition wall 209 has a predetermined distance from the front surface portion 203 and the rear surface portion 204 of the cooling water housing 200. That is, the partition wall 209 is not arranged in a front portion 206 and a rear portion 207 of the cooling water housing 200. The cooling water W flowing in the cooling water housing 200 from the inflow port 201 is distributed to each channel through a shared space formed in the front portion 206 of the cooling water accommodation portion 205, joins together through a shared space formed in the rear portion 207 of the cooling water accommodation portion 205, and flows out of the cooling water housing 200.

[0088] Suffixes are used to distinguish the channels from each other. For example, in this embodiment in which the cooling water accommodation portion 205 is divided into four channels, the four channels may be designated by reference numerals of CH 1, CH 2, CH 3, and CH 4. Although an example is illustrated in which the cooling water accommodation portion 205 is divided into four channels so as to brief and clear expressions and distinguishment between channels on the drawings, the cooling water accommodation portion 205 may be divided into multiple channels of which number is greater than that of the four channels.

[0089] A distribution plate 210 is illustrated in FIG. 9.

[0090] The distribution plate 210 is provided to evenly distribute the cooling water W flowing in the cooling water housing 200 through the inflow port 201 of the cooling water housing 200 to each channel.

[0091] The distribution plate 210 is provided as a thin plate, and a plurality of through-holes 211 are formed in the distribution plate 210 such that the cooling water W is evenly spread along a width direction.

[0092] The distribution plate 210 is arranged in a horizontal direction in the shared space formed in the front portion of the cooling water accommodation portion 205. That is, the distribution plate 210 is arranged in a direction orthogonal to the partition wall 209.

[0093] A perspective view of a packing member 220 is shown in FIG. 8.

[0094] The packing member 220 is arranged between the cooling water housing 200 and the base plates 110 and 145 to maintain airtightness from the outside. The packing member 220 is also referred to as a gasket.

[0095] The packing member 200 may be made of a soft material such as rubber.

[0096] The packing member 220 may be formed in a shape similar to a shape corresponding to the upper surface portion of the cooling water housing 200. The packing member 220 is formed as a thin plate. Opening holes 221 are formed in the packing member 220. The opening holes 221 occupy most of the area of the packing member 220.

[0097] A width of a panel surface portion 222 of the packing member 220 may be formed larger than a thickness of the side surface portion 215 of the cooling water housing 200. Accordingly, pressing surfaces of the base plates 110 and 145 increase, so that pressing is well performed and assemblability is facilitated.

[0098] A fastening hole 223 corresponding to the fastening hole 208 of the cooling water housing 200 is formed in each corner portion of the packing member 220.

[0099] A partition wall contact portion 224 corresponding to the position of the partition wall 209 of the cooling water housing 200 may be formed in the packing member 220. The partition wall contact portion 224 is formed along a length direction of the packing member 220. A width of the partition wall contact portion 224 may be formed larger than a thickness of the partition wall 209 of the cooling water housing 200.<Second Embodiment>

[0100] A cooling water housing 200A according to another embodiment of the disclosure is illustrated in FIG. 10. The cooling water housing 200A is illustrated in a plan view.

[0101] Detailed descriptions of portions in the cooling water housing 200A of this embodiment, which are identical to those of the previous embodiment, will be omitted.

[0102] In this embodiment, guide portions 231 and 232 are arranged such that the cooling water W does not flow on a straight line but flows windingly within each of channels CH 1, CH 2, ..., and CH n.

[0103] With respect to any one channel, the guide portions 231 and 232 may be alternately formed on left and right walls (side walls or partition walls). In this case, the cooling water W flows windingly in an S-shape.

[0104] The guide portions 231 and 232 may be in contact with left and right walls of each channel, respectively. In addition, guide portions are arranged to alternately protrude from both walls. That is, the guide portions 231 and 232 are arranged such that first guide portions 231 are in contact with a left wall (partition wall or side wall) and second guide portions 232 are in contact with a right wall (partition wall or side wall).

[0105] Each of the guide portions 231 and 232 is formed smaller than a width of each channel. each of the guide portions 231 and 232 is preferably formed to have a height corresponding to the height of the cooling water accommodation portion 205.<Third Embodiment>

[0106] A plan view of a cooling water housing 200B according to still another embodiment of the disclosure is illustrated in FIG. 11.

[0107] Descriptions of portions in this embodiment, which are identical to those of the previous embodiments, will be omitted.

[0108] In this embodiment, each channel has districts divided along a length direction thereof. For example, an example is illustrated in which channel 1 is divided into five districts. For convenience of illustration, an example is depicted in which each channel is divided into five districts. However, each channel may be divided into an arbitrary number of districts.

[0109] Reference numerals of d1, d2, d3, ..., and dn will be used to distinguish districts from each other.

[0110] Meanwhile, a reference numeral such as CH n(dn) will be used to distinguish districts belonging to each channel. For example, district 3 of channel 1 is designated by CH 1(d3).

[0111] Each district may be considered as one cell. That is, in this embodiment, a cooling water accommodation portion 205 is divided into a plurality of districts (cells) arranged in horizontal and vertical directions.

[0112] Guide portions 231 and 232 may be arranged in each district, which is the same as the previous embodiment.

[0113] Meanwhile, portions at which districts (cells) are in contact with each other may be separated from each other.

[0114] Such a cell connection portion is shown in FIGS. 12 and 13.

[0115] A wall portion forming each district (cell) includes a horizontal wall 238, a vertical wall 239, and a wall connector 235 (here, names of horizontal and vertical are designated with respect to the length direction of the channel).

[0116] Fitting grooves 236 are formed in a side surface portion of the wall connector 235. The fitting grooves 236 are formed in four directions of both horizontal directions and both vertical directions in the side surface portion of the wall connector 235. Therefore, the horizontal wall 238 and the vertical wall 239 are fitted in the wall connector 235 in directions orthogonal to each other, respectively.

[0117] The horizontal wall 238, the vertical wall 239, and the wall connector 235 are formed to have a height corresponding to the height of the front surface portion, the rear surface portion, and the side surface portion.

[0118] In the wall portion forming each district (cell), the horizontal wall 238 and the vertical wall 239 may be easily fitted in or separated from the wall connector 235. Therefore, the wall portion forming each district (cell) is easily opened or closed. When the horizontal wall 238 or the vertical wall 239 is separated from the wall connector 235, two adjacent districts (cells) are opened to each other. When the horizontal wall 238 or the vertical wall 239 is coupled to the wall connector 235, two adjacent districts (cells) are closed to each other.

[0119] The channel or the district is opened or closed by separating or coupling the horizontal wall 238 or the vertical wall 239 from or to the wall connector 235, so that a specific region can be made to form a flow path of the cooling water. In FIG. 11, a portion indicated by a solid line shows a place in which the horizontal wall 238 and the vertical wall 239 are coupled to the wall connector 235, and a portion indicated by a dotted line shows a place in which the horizontal wall 238 and the vertical wall 239 are separated (removed) from the wall connector 235.

[0120] In FIG. 11, it is shown that all districts are opened in the channel 1 and some districts are opened in channel 2. Therefore, the cooling water flowing in the cooling water housing flows through the channel 1, expands through the channel 1 and the channel 2, and then flows out of the cooling water housing through the outflow port.

[0121] In this embodiment, the cooling water may be arbitrarily controlled to flow through a specific region of the cooling water housing 200B.

[0122] A packing member 240 applied to this embodiment is illustrated in FIG. 14.

[0123] The packing member 240 may be formed in a shape similar to a shape corresponding to an upper surface portion of the cooling water housing 200B. The packing member 240 is formed as a thin plate. Opening holes 241 are formed in the packing member 240. The opening holes 241 occupy most of the area of the packing member 240.

[0124] A width of a panel surface portion 242 of the packing member 240 may be formed larger than a thickness of a side surface portion 215 of the cooling water housing 200B. Accordingly, pressing surfaces of the base plates 110 and 145 increase, so that pressing is well performed and assemblability is facilitated.

[0125] A fastening hole 243 corresponding to a fastening hole 208 of the cooling water housing 200B is formed in each corner portion of the packing member 240.

[0126] Partition wall contact portions 244 and 245 corresponding to the positions of the horizontal wall 238 and the vertical wall 239 of the cooling water housing 200B may be formed in the packing member 240. A width of the partition wall contact portions 244 and 245 may be formed larger than a thickness of the horizontal wall 238 or the vertical wall 239 of the cooling water housing 200B.<Fourth Embodiment>

[0127] A cooling water housing 200C according to a fourth embodiment of the disclosure is illustrated in FIG. 15.

[0128] Descriptions of portions in this embodiment, which are identical to those of the previous embodiments, will be omitted.

[0129] In this embodiment, like the third embodiment, a cooling water accommodation portion 205 is divided into a plurality of channels and a plurality of districts (cells).

[0130] The districts (cells) are divided by district walls 250 and connection portions 255. A detailed view of the district walls 250 and the connection portions 255 is illustrated in FIG. 16.

[0131] The district wall 250 is configured as a linear plate, and bent portions bent in directions opposite to each other are formed at both end portions of the district wall 250, respectively.

[0132] A first bent portion 251 extending in one direction orthogonal to a length direction of the district wall 250 is arranged at one end portion of the district wall 250, and a second bent portion 252 extending in the other direction orthogonal to the length direction of the district wall 250 is arranged at the other end portion of the district wall 250.

[0133] The connection portion 255 is configured as a '' member or a '' member. Four connection portion 255 constitute one combination. The four connection portion 255 are arranged at a predetermined distance to be formed in a '' shape. Here, the predetermined distance is formed equal to or slightly larger than a thickness of the district wall 250.

[0134] The district 250 and the connection portion 255 are formed to have a height corresponding to a height of a front surface portion, a rear surface portion, and a side surface portion.

[0135] The district wall 250 may be easily fitted to or separated from the connection portion 255. When the district wall 250 is separated from the connection portion 255, adjacent districts (cells) are opened and connected to each other. When the district wall 250 is coupled to the connection portion 255, adjacent districts (cells) are closed and blocked from each other.

[0136] In FIG. 15, it is shown that some district wall 250 are opened to form a specific cooling water flow path.

[0137] According to the semiconductor circuit breaker according to each embodiment of the disclosure, the water-cooled heat dissipation system in which the cooling water flows is arranged below the switching unit and the air gap switch, so that the cooling is effectively performed.

[0138] Further, in the water-cooled heat dissipation system, heat transference occurs while the cooling water flowing in the cooling water housing having the open upper surface is in direct contact with the switching unit, so that the cooling effect is maximized.

[0139] In addition, the cooling water housing is divided into a plurality of districts (cells) arranged in the horizontal and vertical directions to form a specific cooling water flow path, so that the cooling water can intensively flow in a specific region.

[0140] Furthermore, in the water-cooled heat dissipation system, a space that the water-cooled heat dissipation system occupies is remarkably reduced as compared with a space that an air-cooled heat dissipation system such as a cooling fan occupies.

[0141] In addition, since the water-cooled heat dissipation system is exposed to the outside of the enclosure, the maintenance thereof is facilitated.

[0142] The embodiments described above are embodiments implementing the disclosure, and it will be apparent to those skilled in this art that various changes and modifications may be made thereto without departing from the gist of the disclosure. Accordingly, it should be noted that the embodiments disclosed in the disclosure are only illustrative and not limitative to the concept of the disclosure, and the scope of the concept of the invention is not limited by those embodiments. In other words, the scope protected by the disclosure should be construed by the accompanying claims, and all the technical concept in the equivalent scope of the invention should be construed to be included in the scope of the right of the disclosure.[Explanation of Reference Numerals]

[0143] 100: Semiconductor circuit breaker 101: Enclosure 103: First air vent hole 110: Base plate 120: Switching unit 130: Electric circuit 140: Air gap switch 200: Cooling water housing 205: Cooling water accommodation portion 209: Partition wall 210: Distribution plate 220: Packing member 231, 232: Guide portions 235: Wall connector 238: Horizontal wall 239: Vertical wall 250: District wall 255: Connection portion

Examples

fourth embodiment

[0127]A cooling water housing 200C according to the disclosure is illustrated in FIG. 15.

[0128]Descriptions of portions in this embodiment, which are identical to those of the previous embodiments, will be omitted.

third embodiment

[0129]In this embodiment, like the third embodiment, a cooling water accommodation portion 205 is divided into a plurality of channels and a plurality of districts (cells).

[0130]The districts (cells) are divided by district walls 250 and connection portions 255. A detailed view of the district walls 250 and the connection portions 255 is illustrated in FIG. 16.

[0131]The district wall 250 is configured as a linear plate, and bent portions bent in directions opposite to each other are formed at both end portions of the district wall 250, respectively.

[0132]A first bent portion 251 extending in one direction orthogonal to a length direction of the district wall 250 is arranged at one end portion of the district wall 250, and a second bent portion 252 extending in the other direction orthogonal to the length direction of the district wall 250 is arranged at the other end portion of the district wall 250.

[0133]The connection portion 255 is configured as a '' member or a '' member. Four c...

Technical Field

[0001] The disclosure relates to a semiconductor circuit breaker, and more particularly, to a semiconductor circuit breaker having a water-cooled heat dissipation system.Background Art

[0002] In general, a semiconductor circuit breaker is electric power equipment designed to break a circuit, using a semiconductor switch such as a metal oxide semiconductor field effect transistor (MOSFET), an insulated gate bipolar transistor (IGBT), or the like.

[0003] The semiconductor circuit breaker has an advantage that a semiconductor switch element is applied to a circuit breaker used in electric power equipment, thereby remarkably reducing a breaking time and simplifying a structure. In addition, since the semiconductor circuit breaker performs circuit breaking, using current breaking characteristics of the semiconductor switch, no arc is generated during circuit breaking, so an arc removal function is not required. Therefore, there is an advantage that an arc extinguishing unit is removed, so that the volume thereof can be reduced.

[0004] On the other hand, a low-capacity circuit breaker has a disadvantage that manufacturing cost increases due to the use of a semiconductor switch.

[0005] The semiconductor circuit breaker is often used in systems that require quick breaking. In the case of a general mechanical circuit breaker, a breaking speed thereof is a few to hundreds of ms, whereas a breaking speed of the semiconductor circuit breaker is tens of µs, thereby breaking a current in a much shorter time.

[0006] Accordingly, the semiconductor circuit breaker tends to be actively used in a switchboard with a large current capacity, a direct current system with a rapid increase in fault current, an energy storage system (ESS) that requires stable current supply and breaking, or the like. A battery energy storage system (BESS) has recently been widely used in electric vehicles, and the like. However, in recent years, when considering that ignition occurs in the ESS, the importance of a circuit breaker is becoming more urgent so as to achieve stable current supply, considering heat generation.

[0007] Meanwhile, a protection circuit (safety circuit) or a safety element is applied to the semiconductor circuit breaker so as to protect a semiconductor from damage caused by a voltage generated during semiconductor switching. A snubber circuit is used as an example of the protection circuit. A power semiconductor circuit breaker also requires a protection circuit such as a snubber circuit to decrease a voltage generated during switching.

[0008] In addition, there is a case where a metal oxide varistor (MOV) is additionally configured as the safety element in some systems. The MOV is one of components used for surge protection, and is applied to a portion of a circuit so as to prevent damage of electrical and electronic devices from a surge. The MOV is a varistor composed of zinc oxide and is a transient voltage suppressor in which current flows when a potential equal to or higher than a certain value is generated. As the element is applied, a fuse inside the circuit is unnecessary.

[0009] The semiconductor circuit breaker is generally configured in a hybrid structure of a mechanical circuit breaker and an electronic circuit breaker. That is, the semiconductor circuit breaker does not include only a semiconductor switch but includes an auxiliary mechanical switch (air gap switch) to mechanically (physically) cut off connection of the circuit.

[0010] Meanwhile, the semiconductor circuit breaker is mainly applied to direct current power circuits. A direct current circuit breaker has an advantage that it is easy to set positions of a power source and a load.

[0011] As illustrated in FIG. 1, when a direct current circuit breaker is arranged on a system or a circuit in an order of 'a power source 3 → the direct current circuit breaker 2 → a load 1 (case a),' current flows from the left to the right on the drawing.

[0012] In addition, when the direct current circuit breaker is arranged on the system or the circuit in an order of 'the load 3 → the direct current circuit breaker 2 → the power source (case b),' the current flows from the right to the left on the drawing.

[0013] Besides, the direct current circuit breaker may be installed on a circuit through which the current flows in both directions (case c). A first power source 4 and a second power source 5 may be arranged at front and rear ends of the direct current circuit breaker 2. Here, the first power source 4 or the second power source 5 may be configured as a battery.

[0014] A perspective view of the semiconductor circuit breaker is illustrated in FIG. 2. The semiconductor circuit breaker includes a switching unit 6 and an air gap switch 7. Here, the switching unit 6 includes a power semiconductor switch, and the air gap switch 7 refers to a mechanical switch. A heat sink 8 and a heat dissipation fan 9, which are used for cooling, are arranged below the switching unit 6 and the air gap switch 7.

[0015] However, since high heat is generated in the switching unit, it is necessary to release the heat. In addition, high heat is generated at a contact portion of the mechanical switch (air gap switch) during breaking. Therefore, since heat is released at the periphery of the contact portion, cooling for the heat is necessary, and a configuration for efficient cooling is required.

[0016] Meanwhile, such heat dissipation performance should be efficiently made within a limited space of the semiconductor circuit breaker. It is preferable to decrease the size of the semiconductor circuit breaker if possible, and therefore, it is preferably to have efficient heat dissipation performance while occupying a small occupied space.

[0017] In addition, the convenience of maintenance should be considered. The semiconductor circuit breaker should be manufactured by considering the necessity of maintenance of a component including the switching unit, the air gap switch, the heat sink, or the like.Disclosure of Invention Technical Problem

[0018] Therefore, to obviate those problems, an aspect of the detailed description is to provide a semiconductor circuit breaker having an effective cooling performance, using a water-cooled cooling system.

[0019] Another aspect of the detailed description is to reduce a space that a water-cooled cooling system occupies within a semiconductor circuit breaker.

[0020] Still another aspect of the detailed description is to provide a heat dissipation system capable of facilitate maintenance in a semiconductor circuit breaker.Solution to Problem

[0021] To achieve these and other advantages and in accordance with the purpose of the disclosure, as embodied and broadly described herein, there is provided a semiconductor circuit breaker including a switching unit arranged inside an enclosure and including a power semiconductor element; and a cooling water housing coupled to the switching unit below the switching unit and having an open upper surface, wherein a cooling water accommodation portion accommodating cooling water is arranged in the cooling water housing, and wherein a plurality of partition walls are arranged in the cooling water accommodation portion to allow a plurality of channels through which the cooling water flows to be divided.

[0022] Here, the cooling water housing may have an inflow port and an outflow port, which are respectively formed in surfaces facing each other.

[0023] In addition, a lower portion of the enclosure may be opened, so that the cooling water housing is exposed to ambient air.

[0024] In addition, the partition wall may be configured as a plate extending along a length direction of the cooling water housing.

[0025] In addition, the partition wall may have a predetermined distance from each of a front surface portion and a rear surface portion of the cooling water housing.

[0026] In addition, the partition wall may be formed to have a same height as a height of the cooling water housing.

[0027] In addition, a distribution plate having a plurality of through-holes formed therein may be arranged in a front portion of the cooling water accommodation portion.

[0028] In addition, guide portions may be arranged on left and right walls of the channel.

[0029] In addition, the channel may have a plurality of divided districts, and the districts may be divided using horizontal walls, vertical walls, and wall connectors to or from which the horizontal walls and the vertical walls are coupled or separated.

[0030] In addition, fitting grooves in which the horizontal walls and the vertical walls are fitted may be formed in a side surface portion of the wall connector.

[0031] In addition, the channel may have a plurality of divided districts, a district wall forming a wall of the district may be configured as a linear plate, and bent portions bent in directions opposite to each other may be formed at both end portions of the district wall, respectively.

[0032] In addition, the bent portion may be coupled to a ''-shaped connection portion.Advantageous Effects of Invention

[0033] According to the semiconductor circuit breaker according to the disclosure, a water-cooled heat dissipation system in which the cooling water flows is arranged below the switching unit and the air gap switch, so that cooling is effectively performed.

[0034] Further, in the water-cooled heat dissipation system, heat transference occurs while the cooling water flowing in the cooling water housing having the open upper surface is in direct contact with the switching unit, so that a cooling effect is maximized.

[0035] In addition, the cooling water housing is divided into a plurality of districts (cells) arranged in the horizontal and vertical directions to form a specific cooling water flow path, so that the cooling water can intensively flow in a specific region.

[0036] Furthermore, in the water-cooled heat dissipation system, a space that the water-cooled heat dissipation system occupies is remarkably reduced as compared with a space that an air-cooled heat dissipation system such as a cooling fan occupies.

[0037] In addition, since the water-cooled heat dissipation system is exposed to the outside of the enclosure, maintenance thereof is facilitated.Brief Description of Drawings

[0038] FIG. 1 is a configuration diagram of a direct current circuit breaker according to a conventional art. FIG. 2 is a perspective view of the semiconductor circuit breaker according to the conventional art. FIGS. 3 and 4 are perspective and side views of a semiconductor circuit breaker according to an embodiment of the disclosure. FIG. 5 is a circuit diagram of the semiconductor circuit breaker according to the embodiment of the disclosure. FIGS. 6 and 7 are perspective and plan views of a cooling water housing in the semiconductor circuit breaker according to the embodiment of the disclosure. FIG. 8 is a perspective view of a packing member applied to the cooling water housing according to the embodiment of FIG. 6. FIG. 9 is a perspective view of a distribution plate applied to the semiconductor circuit breaker according to the embodiment of the disclosure. FIG. 10 is a plan view of a cooling water housing according to another embodiment of the disclosure. FIG. 11 is a plan view of a cooling water housing according to still another embodiment of the disclosure. FIGS. 12 and 13 are plan and perspective views of district walls and a wall connector in FIG. 11. FIG. 14 is a perspective view of a packing member applied to the cooling water housing according to the embodiment of FIG. 11. FIG. 15 is a plan view of a cooling water housing according to still another embodiment of the disclosure. FIG. 16 is a plan view of district walls and wall connectors in FIG. 15. Mode for the Invention

[0039] Hereinafter, preferred embodiments of the disclosure will be described with reference to the accompanying drawings, which are intended to describe the disclosure in detail to allow a person skilled in the art to easily carry out the invention, but not to mean that the technical concept and scope of the disclosure are limited thereto.

[0040] A semiconductor circuit breaker according to each embodiment of the disclosure will be described in detail with reference to the drawings.<First Embodiment>

[0041] Perspective and side views of a semiconductor circuit breaker according to an embodiment of the disclosure are illustrated in FIGS. 3 and 4. A circuit diagram of the semiconductor circuit breaker according to the embodiment of the disclosure is illustrated in FIG. 5.

[0042] A semiconductor circuit breaker 100 according to an embodiment of the disclosure may include a switching unit 120 arranged inside an enclosure 101 and including a power semiconductor element; and a cooling water housing 200 coupled to the switching unit 120 below the switching unit 120 and having an open upper surface, and allow a plurality of channels CH 1 to CH n through which cooling water W flows to be divided in the cooling water housing 200.

[0043] The enclosure 101 may be formed in a substantially rectangular box shape. The enclosure 101 may be made of an insulating material such as a synthetic resin to be insulated from the outside. The enclosure 101 supports internal components such as the switching unit 120 and an electric circuit 130 and protects the internal components from the outside.

[0044] A lower surface of the enclosure 101 is opened. That is, the enclosure may have a shape in which upper, front, rear, left, and right surfaces thereof are closed and the lower surface thereof is opened. Therefore, a lower surface of the switching unit 120 may be exposed to the outside.

[0045] An air vent hole is formed in a front surface or a rear surface of the enclosure 101. It is shown in FIG. 3 that a first air vent hole 103 is formed in the rear surface of the enclosure. However, the air vent hole may be formed in each surface of the enclosure 101 when necessary.

[0046] Components arranged inside the enclosure 101 will be described.

[0047] The switching unit 120 is arranged in the enclosure 101. The switching unit 120 includes a power semiconductor switch. A metal oxide semiconductor field effect transistor (MOSFET), an insulated gate bipolar transistor (IGBT), or the like may be applied as the power semiconductor switch.

[0048] The power semiconductor switch is often used in systems that require quick breaking. In the case of a general mechanical circuit breaker, a breaking speed thereof is a few to hundreds of ms, whereas a breaking speed of the semiconductor circuit breaker is tens of µs, thereby breaking a current in a much shorter time.

[0049] Accordingly, the semiconductor circuit breaker may be applied to a switchboard with a large current capacity, a direct current system with a rapid increase in fault current, an energy storage system (ESS) that requires stable current supply and breaking, or the like.

[0050] A first base plate 110 is arranged below the switching unit 120.

[0051] The electric circuit 130 is arranged above the switching unit 120. Alternatively, the switching unit 120 may be installed in a portion of the electric circuit 130.

[0052] The electric circuit 130 may include a gate driver (not shown), a controller 133, a snubber 135, a metal oxide varistor (MOV) 137, a transient voltage suppressor (TVS), and the like.

[0053] The gate driver provides a voltage that the switching unit 120 requires. To this end, the gate driver may include a separate power source circuit and a separate current buffer. The gate driver is also referred to as a driving driver.

[0054] In addition, the gate driver functions to electrically insulate signals between a high-voltage power circuit and a low-voltage control circuit and transfer the signals. Accordingly, the gate driver provides safer and higher reliability so as to achieve semiconductor switch driving.

[0055] The controller 133 connects and controls components in the circuit. The controller 133 may determine whether current transferred from a current sensor 132 is overcurrent or fault current according to the magnitude of the current, and may operate the switching unit 120 and an air gap switch 140 according to the overcurrent or the fault current. The controller 133 may operate the air gap switch 140 through a first driver 134a and may operate the switching unit 120 through a second driver 134b (see FIG. 5).

[0056] Here, the current sensor 132 is installed in a portion of a main circuit. In FIG. 5, the current sensor 132 may be arranged at any one of positions ① , ②, and ③. That is, the current sensor 132 may be installed at a front or rear end of the air gap switch 140 or a front or rear end of the switching unit 120.

[0057] In the case of the semiconductor circuit breaker, a protection circuit (safety circuit) or a safety element is applied to the semiconductor circuit breaker so as to protect the semiconductor switch from damage caused by a high voltage generated during semiconductor switching. A snubber circuit is used as an example of the protection circuit. In the semiconductor circuit breaker, it is general that the protection circuit decreases a voltage generated during switching, thereby protecting the semiconductor switch.

[0058] Examples of the snubber circuit may be a capacitor (C) snubber, a resistor-capacitor (RC) snubber, a charge-discharge type resistor-capacitor-diode (RCD) snubber, a discharge-suppressing type snubber circuit, and the like.

[0059] In addition, there is a case where the metal oxide varistor (MOV) 137 is additionally configured as the safety element in some systems. The MOV is one of components used for surge protection, and is applied to a portion of the circuit so as to prevent damage occurring in the semiconductor switch from a surge voltage. The MOV is a varistor composed of zinc oxide and is a transient voltage suppressor in which current flows when a potential equal to or higher than a set value is generated. When the MOV is applied, it is unnecessary to install a separate fuse inside the circuit.

[0060] The protection circuit and the safety element, which are described above, may be provided as a protection module detachably attached to the electric circuit 130. When the safety element is independently configured as a protection module, maintenance thereof is facilitated. That is, only the protection module is replaced in damage of the protection module.

[0061] The air gap switch 140 is arranged. The air gap switch 140 is a mechanical switch. The air gap switch 140 may be configured as a conventional mechanical switch having a contact portion composed of a fixed contact and a movable contact. In the air gap switch 140, the movable contact is connected to the fixed contact in conduction, and the movable contact is separated from the fixed contact, so that connection of the circuit is mechanically cut off. Since direct current has no current zero (0 point), there may occur a case where breaking of current is rather difficult when low current flows in the circuit. In this case, in order to completely break the current, it is necessary to mechanically cut off the circuit.

[0062] The air gap switch 140 may be located at a front portion or a rear portion of the switching unit 120. Here, the air gap switch 140 is preferably located at a side of a power source 180. This is because the circuit is separated in the vicinity of the power source in breaking, thereby protecting a breaking unit, other components, and a load 190.

[0063] However, much heat is generated at the contact portion of the air gap switch 140. Therefore, an apparatus for cooling heat of the air gap switch 140 and the switching unit 120 is required.

[0064] A second base plate 145 may be arranged below of the air gap switch 140.

[0065] The cooling water housing 200 is arranged below the switching unit 120 and the air gap switch 140. The cooling water housing 200 may be formed in a rectangular shape having an open upper surface.

[0066] Perspective and plan views of the cooling water housing 200 are illustrated in FIGS. 6 and 7.

[0067] The cooling water housing 200 may be made of a synthetic resin or a metal material. When the cooling water housing 200 is made of a metal material, the cooling water housing 200 is preferably made of a material having an excellent thermal conductivity, such as aluminum (Al) or copper (Cu). Accordingly, heat of the cooling water W can be quickly released to the outside.

[0068] The cooling water housing 200 may be coupled to the first base plate 110 forming a lower portion of the switching unit 120. In addition, the cooling water housing 200 may extend to the second base plate 145 forming a lower portion of the air gap switch 140 to be coupled to the second base plate 145.

[0069] The cooling water housing 200 may be coupled to the base plates 110 and 145 by a bonding or mechanical coupling method. An example of the mechanical coupling method may be fitting coupling, screw coupling, or the like.

[0070] Surfaces on which the cooling water housing 200 and the base plates 110 and 145 are in contact with each other have shapes or sizes corresponding to each other. That is, the upper surface of the cooling water housing 200 and lower surfaces of the base plates 110 and 145 have shapes corresponding to each other.

[0071] In an example, the upper surface of the cooling water housing 200 and the lower surfaces of the base plates 110 and 145 are configured as flat surfaces. Each of the base plates 110 and 145 is formed as a flat surface. The upper surface of the cooling water housing 200 is opened, and each side surface portion 215 is exposed. An upper end of each side surface portion 215 and upper ends of a front surface portion 203 and a rear surface portion 204 are formed to have a same height.

[0072] A fastening hole 208 may be formed in each corner portion of the cooling water housing 200 to be coupled to the base plates 110 and 145 by a fastening member.

[0073] A cooling water accommodation portion 205 is arranged in the cooling water housing 200. The cooling water accommodation portion 205 occupies most of the volume of the cooling water housing 200. The cooling water W is accommodated in the cooling water accommodation portion 205 and flows in the cooling water accommodation portion 205.

[0074] The cooling water housing 200 is made of a material having a high thermal conductivity to release heat of the switching unit 120, which is transferred through the base plate 110.

[0075] The cooling water housing 200 is located below the enclosure 101. The cooling water housing 200 is not located inside the enclosure 101 but located below of the enclosure to be exposed to ambient air. Accordingly, the factor of decrease in heat dissipation is reduced. When the lower surface of the enclosure 101 is opened, such an effect is further improved.

[0076] Since the lower surface of the enclosure 101 is opened, the cooling water housing 200 is coupled directly to the switching unit 120 or the air gap switch 140. When the base plates 110 and 145 exist, the cooling water housing 200 is coupled to the base plates 110 and 145.

[0077] The cooling water housing 200 has a sufficient size to quickly absorb heat of the base plates 110 and 145. For example, the cooling water housing 200 may be formed to have a size corresponding to an area of the base plates 110 and 145 or a size equal to or larger than the area of the base plates 110 and 145.

[0078] The cooling water accommodation portion 205 is formed in the cooling water housing 200. The cooling water W flows in and out of the cooling water accommodation portion 205. The upper surface of the cooling water housing 200 is opened. That is, an upper surface of the cooling water accommodation portion 205 is opened. Therefore, the cooling water W rises up to an upper surface portion of the cooling water housing 200. Accordingly, the cooling water W is in direct contact with the lower surfaces of the base plates 110 and 145, thereby absorbing heat of the switching unit 120 or the air gap switch 140. Since the cooling water W is in direct contact with the switching unit 120 or the air gap switch 140, heat transference is maximized.

[0079] The cooling water W is stored inside the cooling water housing 200 and flows in the cooling water housing 200. The cooling water housing 200 has an inflow port 201 and an outflow port 202. The inflow port 201 and the outflow port 202 may be arranged in one surface of the cooling water housing 200. Alternatively, the inflow port 201 and the outflow port 202 may be arranged in different surfaces of the cooling water housing 200, respectively. Preferably, the inflow port 201 and the outflow port 202 may be respectively formed in surfaces of the cooling water housing 200, which face each other, to form a flow path through the cooling water W flows straight.

[0080] According to the semiconductor circuit breaker according to the embodiment of the disclosure, the cooling water housing 20 in which the cooling water is accommodated and flows is arranged below the switching unit and the air gap switch, so that cooling is effectively performed.

[0081] Since the upper surface of the cooling water housing 200 is opened, heat is transferred while the cooling water is in direct contact with the switching unit, so that a cooling effect is maximized.

[0082] A space that such a water-cooled heat dissipation system occupies is remarkably reduced as compared with a space that an air-cooled heat dissipation system such as a cooling fan occupies.

[0083] In addition, since the cooling water housing 200 is exposed to the outside of the enclosure 101, maintenance is facilitated.

[0084] The cooling water accommodation portion 205 of the cooling water housing 200 is divided into a plurality of regions. The regions divided as described above in the cooling water accommodation portion 205 are referred to as channels. For example, it is shown in FIGS. 6 and 7 that the cooling water accommodation portion 205 is divided into four channels.

[0085] Partition walls 209 forming each channel are arranged. Here, the partition wall 209 may be configured as a plate extending along a length direction of the cooling water housing 200. Therefore, when viewed on the plan view, each channel of the cooling water accommodation portion 205 has a shape similar to a lane of a swimming pool.

[0086] Heights of the partition walls 209 are preferably formed to be the same, corresponding to a height of the cooling water accommodation portion 205. That is, an upper end of the partition wall 209 forms a same height as the upper ends of the front surface portion 203, the rear surface portion 204, and the side surface portion 215.

[0087] The partition wall 209 has a predetermined distance from the front surface portion 203 and the rear surface portion 204 of the cooling water housing 200. That is, the partition wall 209 is not arranged in a front portion 206 and a rear portion 207 of the cooling water housing 200. The cooling water W flowing in the cooling water housing 200 from the inflow port 201 is distributed to each channel through a shared space formed in the front portion 206 of the cooling water accommodation portion 205, joins together through a shared space formed in the rear portion 207 of the cooling water accommodation portion 205, and flows out of the cooling water housing 200.

[0088] Suffixes are used to distinguish the channels from each other. For example, in this embodiment in which the cooling water accommodation portion 205 is divided into four channels, the four channels may be designated by reference numerals of CH 1, CH 2, CH 3, and CH 4. Although an example is illustrated in which the cooling water accommodation portion 205 is divided into four channels so as to brief and clear expressions and distinguishment between channels on the drawings, the cooling water accommodation portion 205 may be divided into multiple channels of which number is greater than that of the four channels.

[0089] A distribution plate 210 is illustrated in FIG. 9.

[0090] The distribution plate 210 is provided to evenly distribute the cooling water W flowing in the cooling water housing 200 through the inflow port 201 of the cooling water housing 200 to each channel.

[0091] The distribution plate 210 is provided as a thin plate, and a plurality of through-holes 211 are formed in the distribution plate 210 such that the cooling water W is evenly spread along a width direction.

[0092] The distribution plate 210 is arranged in a horizontal direction in the shared space formed in the front portion of the cooling water accommodation portion 205. That is, the distribution plate 210 is arranged in a direction orthogonal to the partition wall 209.

[0093] A perspective view of a packing member 220 is shown in FIG. 8.

[0094] The packing member 220 is arranged between the cooling water housing 200 and the base plates 110 and 145 to maintain airtightness from the outside. The packing member 220 is also referred to as a gasket.

[0095] The packing member 200 may be made of a soft material such as rubber.

[0096] The packing member 220 may be formed in a shape similar to a shape corresponding to the upper surface portion of the cooling water housing 200. The packing member 220 is formed as a thin plate. Opening holes 221 are formed in the packing member 220. The opening holes 221 occupy most of the area of the packing member 220.

[0097] A width of a panel surface portion 222 of the packing member 220 may be formed larger than a thickness of the side surface portion 215 of the cooling water housing 200. Accordingly, pressing surfaces of the base plates 110 and 145 increase, so that pressing is well performed and assemblability is facilitated.

[0098] A fastening hole 223 corresponding to the fastening hole 208 of the cooling water housing 200 is formed in each corner portion of the packing member 220.

[0099] A partition wall contact portion 224 corresponding to the position of the partition wall 209 of the cooling water housing 200 may be formed in the packing member 220. The partition wall contact portion 224 is formed along a length direction of the packing member 220. A width of the partition wall contact portion 224 may be formed larger than a thickness of the partition wall 209 of the cooling water housing 200.<Second Embodiment>

[0100] A cooling water housing 200A according to another embodiment of the disclosure is illustrated in FIG. 10. The cooling water housing 200A is illustrated in a plan view.

[0101] Detailed descriptions of portions in the cooling water housing 200A of this embodiment, which are identical to those of the previous embodiment, will be omitted.

[0102] In this embodiment, guide portions 231 and 232 are arranged such that the cooling water W does not flow on a straight line but flows windingly within each of channels CH 1, CH 2, ..., and CH n.

[0103] With respect to any one channel, the guide portions 231 and 232 may be alternately formed on left and right walls (side walls or partition walls). In this case, the cooling water W flows windingly in an S-shape.

[0104] The guide portions 231 and 232 may be in contact with left and right walls of each channel, respectively. In addition, guide portions are arranged to alternately protrude from both walls. That is, the guide portions 231 and 232 are arranged such that first guide portions 231 are in contact with a left wall (partition wall or side wall) and second guide portions 232 are in contact with a right wall (partition wall or side wall).

[0105] Each of the guide portions 231 and 232 is formed smaller than a width of each channel. each of the guide portions 231 and 232 is preferably formed to have a height corresponding to the height of the cooling water accommodation portion 205.<Third Embodiment>

[0106] A plan view of a cooling water housing 200B according to still another embodiment of the disclosure is illustrated in FIG. 11.

[0107] Descriptions of portions in this embodiment, which are identical to those of the previous embodiments, will be omitted.

[0108] In this embodiment, each channel has districts divided along a length direction thereof. For example, an example is illustrated in which channel 1 is divided into five districts. For convenience of illustration, an example is depicted in which each channel is divided into five districts. However, each channel may be divided into an arbitrary number of districts.

[0109] Reference numerals of d1, d2, d3, ..., and dn will be used to distinguish districts from each other.

[0110] Meanwhile, a reference numeral such as CH n(dn) will be used to distinguish districts belonging to each channel. For example, district 3 of channel 1 is designated by CH 1(d3).

[0111] Each district may be considered as one cell. That is, in this embodiment, a cooling water accommodation portion 205 is divided into a plurality of districts (cells) arranged in horizontal and vertical directions.

[0112] Guide portions 231 and 232 may be arranged in each district, which is the same as the previous embodiment.

[0113] Meanwhile, portions at which districts (cells) are in contact with each other may be separated from each other.

[0114] Such a cell connection portion is shown in FIGS. 12 and 13.

[0115] A wall portion forming each district (cell) includes a horizontal wall 238, a vertical wall 239, and a wall connector 235 (here, names of horizontal and vertical are designated with respect to the length direction of the channel).

[0116] Fitting grooves 236 are formed in a side surface portion of the wall connector 235. The fitting grooves 236 are formed in four directions of both horizontal directions and both vertical directions in the side surface portion of the wall connector 235. Therefore, the horizontal wall 238 and the vertical wall 239 are fitted in the wall connector 235 in directions orthogonal to each other, respectively.

[0117] The horizontal wall 238, the vertical wall 239, and the wall connector 235 are formed to have a height corresponding to the height of the front surface portion, the rear surface portion, and the side surface portion.

[0118] In the wall portion forming each district (cell), the horizontal wall 238 and the vertical wall 239 may be easily fitted in or separated from the wall connector 235. Therefore, the wall portion forming each district (cell) is easily opened or closed. When the horizontal wall 238 or the vertical wall 239 is separated from the wall connector 235, two adjacent districts (cells) are opened to each other. When the horizontal wall 238 or the vertical wall 239 is coupled to the wall connector 235, two adjacent districts (cells) are closed to each other.

[0119] The channel or the district is opened or closed by separating or coupling the horizontal wall 238 or the vertical wall 239 from or to the wall connector 235, so that a specific region can be made to form a flow path of the cooling water. In FIG. 11, a portion indicated by a solid line shows a place in which the horizontal wall 238 and the vertical wall 239 are coupled to the wall connector 235, and a portion indicated by a dotted line shows a place in which the horizontal wall 238 and the vertical wall 239 are separated (removed) from the wall connector 235.

[0120] In FIG. 11, it is shown that all districts are opened in the channel 1 and some districts are opened in channel 2. Therefore, the cooling water flowing in the cooling water housing flows through the channel 1, expands through the channel 1 and the channel 2, and then flows out of the cooling water housing through the outflow port.

[0121] In this embodiment, the cooling water may be arbitrarily controlled to flow through a specific region of the cooling water housing 200B.

[0122] A packing member 240 applied to this embodiment is illustrated in FIG. 14.

[0123] The packing member 240 may be formed in a shape similar to a shape corresponding to an upper surface portion of the cooling water housing 200B. The packing member 240 is formed as a thin plate. Opening holes 241 are formed in the packing member 240. The opening holes 241 occupy most of the area of the packing member 240.

[0124] A width of a panel surface portion 242 of the packing member 240 may be formed larger than a thickness of a side surface portion 215 of the cooling water housing 200B. Accordingly, pressing surfaces of the base plates 110 and 145 increase, so that pressing is well performed and assemblability is facilitated.

[0125] A fastening hole 243 corresponding to a fastening hole 208 of the cooling water housing 200B is formed in each corner portion of the packing member 240.

[0126] Partition wall contact portions 244 and 245 corresponding to the positions of the horizontal wall 238 and the vertical wall 239 of the cooling water housing 200B may be formed in the packing member 240. A width of the partition wall contact portions 244 and 245 may be formed larger than a thickness of the horizontal wall 238 or the vertical wall 239 of the cooling water housing 200B.<Fourth Embodiment>

[0127] A cooling water housing 200C according to a fourth embodiment of the disclosure is illustrated in FIG. 15.

[0128] Descriptions of portions in this embodiment, which are identical to those of the previous embodiments, will be omitted.

[0129] In this embodiment, like the third embodiment, a cooling water accommodation portion 205 is divided into a plurality of channels and a plurality of districts (cells).

[0130] The districts (cells) are divided by district walls 250 and connection portions 255. A detailed view of the district walls 250 and the connection portions 255 is illustrated in FIG. 16.

[0131] The district wall 250 is configured as a linear plate, and bent portions bent in directions opposite to each other are formed at both end portions of the district wall 250, respectively.

[0132] A first bent portion 251 extending in one direction orthogonal to a length direction of the district wall 250 is arranged at one end portion of the district wall 250, and a second bent portion 252 extending in the other direction orthogonal to the length direction of the district wall 250 is arranged at the other end portion of the district wall 250.

[0133] The connection portion 255 is configured as a '' member or a '' member. Four connection portion 255 constitute one combination. The four connection portion 255 are arranged at a predetermined distance to be formed in a '' shape. Here, the predetermined distance is formed equal to or slightly larger than a thickness of the district wall 250.

[0134] The district 250 and the connection portion 255 are formed to have a height corresponding to a height of a front surface portion, a rear surface portion, and a side surface portion.

[0135] The district wall 250 may be easily fitted to or separated from the connection portion 255. When the district wall 250 is separated from the connection portion 255, adjacent districts (cells) are opened and connected to each other. When the district wall 250 is coupled to the connection portion 255, adjacent districts (cells) are closed and blocked from each other.

[0136] In FIG. 15, it is shown that some district wall 250 are opened to form a specific cooling water flow path.

[0137] According to the semiconductor circuit breaker according to each embodiment of the disclosure, the water-cooled heat dissipation system in which the cooling water flows is arranged below the switching unit and the air gap switch, so that the cooling is effectively performed.

[0138] Further, in the water-cooled heat dissipation system, heat transference occurs while the cooling water flowing in the cooling water housing having the open upper surface is in direct contact with the switching unit, so that the cooling effect is maximized.

[0139] In addition, the cooling water housing is divided into a plurality of districts (cells) arranged in the horizontal and vertical directions to form a specific cooling water flow path, so that the cooling water can intensively flow in a specific region.

[0140] Furthermore, in the water-cooled heat dissipation system, a space that the water-cooled heat dissipation system occupies is remarkably reduced as compared with a space that an air-cooled heat dissipation system such as a cooling fan occupies.

[0141] In addition, since the water-cooled heat dissipation system is exposed to the outside of the enclosure, the maintenance thereof is facilitated.

[0142] The embodiments described above are embodiments implementing the disclosure, and it will be apparent to those skilled in this art that various changes and modifications may be made thereto without departing from the gist of the disclosure. Accordingly, it should be noted that the embodiments disclosed in the disclosure are only illustrative and not limitative to the concept of the disclosure, and the scope of the concept of the invention is not limited by those embodiments. In other words, the scope protected by the disclosure should be construed by the accompanying claims, and all the technical concept in the equivalent scope of the invention should be construed to be included in the scope of the right of the disclosure.[Explanation of Reference Numerals]

[0143] 100: Semiconductor circuit breaker 101: Enclosure 103: First air vent hole 110: Base plate 120: Switching unit 130: Electric circuit 140: Air gap switch 200: Cooling water housing 205: Cooling water accommodation portion 209: Partition wall 210: Distribution plate 220: Packing member 231, 232: Guide portions 235: Wall connector 238: Horizontal wall 239: Vertical wall 250: District wall 255: Connection portion

Examples

fourth embodiment

[0127]A cooling water housing 200C according to the disclosure is illustrated in FIG. 15.

[0128]Descriptions of portions in this embodiment, which are identical to those of the previous embodiments, will be omitted.

third embodiment

[0129]In this embodiment, like the third embodiment, a cooling water accommodation portion 205 is divided into a plurality of channels and a plurality of districts (cells).

[0130]The districts (cells) are divided by district walls 250 and connection portions 255. A detailed view of the district walls 250 and the connection portions 255 is illustrated in FIG. 16.

[0131]The district wall 250 is configured as a linear plate, and bent portions bent in directions opposite to each other are formed at both end portions of the district wall 250, respectively.

[0132]A first bent portion 251 extending in one direction orthogonal to a length direction of the district wall 250 is arranged at one end portion of the district wall 250, and a second bent portion 252 extending in the other direction orthogonal to the length direction of the district wall 250 is arranged at the other end portion of the district wall 250.

[0133]The connection portion 255 is configured as a '' member or a '' member. Four c...

Claims

1. A semiconductor circuit breaker having a water-cooled heat dissipation system, the semiconductor circuit breaker comprising: a switching unit arranged inside an enclosure and comprising a power semiconductor element; and a cooling water housing coupled to the switching unit below the switching unit and having an open upper surface, wherein a cooling water accommodation portion accommodating cooling water is arranged in the cooling water housing, and wherein a plurality of partition walls are arranged in the cooling water accommodation portion to allow a plurality of channels through which the cooling water flows to be divided.

2. The semiconductor circuit breaker of claim 1, wherein the cooling water housing has an inflow port and an outflow port, which are respectively formed in surfaces facing each other.

3. The semiconductor circuit breaker of claim 1, wherein a lower portion of the enclosure is opened, so that the cooling water housing is exposed to ambient air.

4. The semiconductor circuit breaker of claim 1, wherein the partition wall is configured as a plate extending along a length direction of the cooling water housing.

5. The semiconductor circuit breaker of claim 4, wherein the partition wall has a predetermined distance from each of a front surface portion and a rear surface portion of the cooling water housing.

6. The semiconductor circuit breaker of claim 4, wherein the partition wall is formed to have a same height as a height of the cooling water housing.

7. The semiconductor circuit breaker of claim 1, wherein a distribution plate having a plurality of through-holes formed therein is arranged in a front portion of the cooling water accommodation portion.

8. The semiconductor circuit breaker of claim 1, wherein guide portions are arranged on left and right walls of the channel.

9. The semiconductor circuit breaker of claim 1, wherein the channel has a plurality of divided districts, and wherein the districts are divided using horizontal walls, vertical walls, and wall connectors to or from which the horizontal walls and the vertical walls are coupled or separated.

10. The semiconductor circuit breaker of claim 9, wherein fitting grooves in which the horizontal walls and the vertical walls are fitted are formed in a side surface portion of the wall connector.

11. The semiconductor circuit breaker of claim 1, wherein the channel has a plurality of divided districts, wherein a district wall forming a wall of the district is configured as a linear plate, and wherein bent portions bent in directions opposite to each other are formed at both end portions of the district wall, respectively.

12. The semiconductor circuit breaker of claim 11, wherein the bent portion is coupled to a ''-shaped connection portion.

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