Semiconductor circuit breaker having water-cooling heat dissipation system

Abstract

The present invention relates to a semiconductor circuit breaker and, more specifically, to a semiconductor circuit breaker having a water-cooling heat dissipation system. A semiconductor circuit breaker according to one aspect of the present invention is provided with a cooling water plate, through which cooling water flows, below a switching unit and an air gap switch, allowing for effective cooling.

Description

Technical Field

[0001] The disclosure relates to a semiconductor circuit breaker, and more particularly, to a semiconductor circuit breaker having a water-cooling heat dissipation system.Background Art

[0002] In general, a semiconductor circuit breaker is electric power equipment designed to break a circuit, using a semiconductor switch such as a metal oxide semiconductor field effect transistor (MOSFET), an insulated gate bipolar transistor (IGBT), or the like.

[0003] The semiconductor circuit breaker has an advantage that a semiconductor switch element is applied to a circuit breaker used in electric power equipment, thereby remarkably reducing a breaking time and simplifying a structure. In addition, since the semiconductor circuit breaker performs circuit breaking, using current breaking characteristics of the semiconductor switch, no arc is generated during circuit breaking, so an arc removal function is not required. Therefore, there is an advantage that an arc extinguishing unit is removed, so that the volume thereof can be reduced.

[0004] On the other hand, a low-capacity circuit breaker has a disadvantage that manufacturing cost increases due to the use of a semiconductor switch.

[0005] The semiconductor circuit breaker is often used in systems that require quick breaking. In the case of a general mechanical circuit breaker, a breaking speed thereof is a few to hundreds of ms, whereas a breaking speed of the semiconductor circuit breaker is tens of µs, thereby breaking a current in a much shorter time.

[0006] Accordingly, the semiconductor circuit breaker tends to be actively used in a switchboard with a large current capacity, a direct current system with a rapid increase in fault current, an energy storage system (ESS) that requires stable current supply and breaking, or the like. A battery energy storage system (BESS) has recently been widely used in electric vehicles, and the like. However, in recent years, when considering that ignition occurs in the ESS, the importance of a circuit breaker is becoming more urgent so as to achieve stable current supply, considering heat generation.

[0007] Meanwhile, a protection circuit (safety circuit) or a safety element is applied to the semiconductor circuit breaker so as to protect a semiconductor from damage caused by a voltage generated during semiconductor switching. A snubber circuit is used as an example of the protection circuit. A power semiconductor circuit breaker also requires a protection circuit such as a snubber circuit to decrease a voltage generated during switching.

[0008] In addition, there is a case where a metal oxide varistor (MOV) is additionally configured as the safety element in some systems. The MOV is one of components used for surge protection, and is applied to a portion of a circuit so as to prevent damage of electrical and electronic devices from a surge. The MOV is a varistor composed of zinc oxide and is a transient voltage suppressor in which current flows when a potential equal to or higher than a certain value is generated. As the element is applied, a fuse inside the circuit is unnecessary.

[0009] The semiconductor circuit breaker is generally configured in a hybrid structure of a mechanical circuit breaker and an electronic circuit breaker. That is, the semiconductor circuit breaker does not include only a semiconductor switch but includes an auxiliary mechanical switch (air gap switch) to mechanically (physically) cut off connection of the circuit.

[0010] Meanwhile, the semiconductor circuit breaker is mainly applied to direct current power circuits. A direct current circuit breaker has an advantage that it is easy to set positions of a power source and a load.

[0011] As illustrated in FIG. 1, when a direct current circuit breaker is arranged on a system or a circuit in an order of 'a power source 3 → the direct current circuit breaker 2 → a load 1 (case a),' current flows from the left to the right on the drawing.

[0012] In addition, when the direct current circuit breaker is arranged on the system or the circuit in an order of 'the load 3 → the direct current circuit breaker 2 → the power source (case b),' the current flows from the right to the left on the drawing.

[0013] Besides, the direct current circuit breaker may be installed on a circuit through which the current flows in both directions (case c). A first power source 14 and a second power source 5 may be arranged at front and rear ends of the direct current circuit breaker 2. Here, the first power source 14 or the second power source 5 may be configured as a battery.

[0014] A perspective view of the semiconductor circuit breaker is illustrated in FIG. 2. The semiconductor circuit breaker includes a switching unit 6 and an air gap switch 7. Here, the switching unit 6 includes a power semiconductor switch, and the air gap switch 7 refers to a mechanical switch. A heat sink 8 and a heat dissipation fan 9, which are used for cooling, are arranged below the switching unit 6 and the air gap switch 7.

[0015] However, since high heat is generated in the switching unit, it is necessary to release the heat. In addition, high heat is generated at a contact portion of the mechanical switch (air gap switch) during breaking. Therefore, since heat is released at the periphery of the contact portion, cooling for the heat is necessary, and a configuration for efficient cooling is required.

[0016] Meanwhile, such heat dissipation performance should be efficiently made within a limited space of the semiconductor circuit breaker. It is preferable to decrease the size of the semiconductor circuit breaker if possible, and therefore, it is preferably to have efficient heat dissipation performance while occupying a small occupied space.

[0017] In addition, the convenience of maintenance should be considered. The semiconductor circuit breaker should be manufactured by considering the necessity of maintenance of a component including the switching unit, the air gap switch, the heat sink, or the like.Disclosure of Invention Technical Problem

[0018] Therefore, to obviate those problems, an aspect of the detailed description is to provide a semiconductor circuit breaker having an effective cooling performance, using a water-cooling type cooling system.

[0019] Another aspect of the detailed description is to improve heat dissipation properties while reducing a space that a direct current circuit breaker occupies.

[0020] Still another aspect of the detailed description is to reduce a space that a water-cooling type cooling system occupies within a semiconductor circuit breaker.

[0021] Still another aspect of the detailed description is to provide a heat dissipation system capable of facilitate maintenance in a semiconductor circuit breaker.Solution to Problem

[0022] To achieve these and other advantages and in accordance with the purpose of the disclosure, as embodied and broadly described herein, there is provided a semiconductor circuit breaker including a switching unit arranged in an enclosure; an air gap switch arranged in the enclosure and located at one side of the switching unit; a base plate forming a lower portion of the switching unit; and a cooling water plate coupled to the base plate and having a cooling water flow path through which cooling water flows in the cooling water plate.

[0023] Here, an upper surface of the cooling water plate and a lower surface of the base plate may be formed as flat surfaces to be coupled to each other by a bonding or mechanical coupling method

[0024] In addition, polygonal protrusion portions or polygonal groove portions may be formed on or in the upper surface of the cooling water plate, and groove portions or protrusion portions, corresponding to the protrusion portions or the groove portions, may be formed in or on the lower surface of the base plate.

[0025] In addition, a lower surface of the enclosure may be opened.

[0026] In addition, the cooling water flow path may have an inflow port and an outflow port, and the inflow port and the outflow port may be arranged together in any one surface of the cooling water plate or may be arranged in different surfaces of the cooling water plate, respectively.

[0027] In addition, the cooling water flow path may include a water storage tank formed between the inflow port and the outflow port.

[0028] In addition, the cooling water flow path may include linear portions and curved portions connected to both ends of the linear portions, and may be formed such that a constant flow rate is maintained during approaching the outflow port from the inflow port.

[0029] In addition, an expansion portion having a diameter that becomes large as compared with other portions may be formed in the linear portion or the curved portion.

[0030] In addition, a plurality of fins may be formed below the cooling water plate to protrude therefrom.

[0031] In addition, a cooling fan may be arranged below the cooling water plate.

[0032] To achieve these and other advantages and in accordance with the purpose of the disclosure, as embodied and broadly described herein, there is provided a semiconductor circuit breaker including a switching unit arranged below an enclosure having an open lower surface and including a power semiconductor element; and a cooling water housing coupled to the switching unit below the switching unit and having an open upper surface, wherein cooling water accommodated in the cooling water housing flows while being in contact with a lower surface of the switching unit.

[0033] Here, a base plate may be arranged below the switching unit.

[0034] In addition, the cooling water housing may be coupled to the base plate by a bonding or mechanical coupling method.

[0035] In addition, a cooling water accommodation portion having the cooling water accommodated therein may be arranged in the cooling water housing.

[0036] In addition, a fastening hole may be formed in each corner portion of the cooling water housing.

[0037] In addition, the cooling water housing may have an inflow port and an outflow port, which are formed therein.

[0038] In addition, the inflow port and the outflow port may be formed in surfaces of the cooling water housing, which face each other, respectively.

[0039] In addition, the cooling water housing may be exposed to the outside of the enclosure.

[0040] In addition, a packing member having an opening hole may be located between the cooling water housing and a base plate.

[0041] In addition, the packing member may be formed as a thin plate member.

[0042] In addition, a width of a panel surface portion of the packing member may be formed larger than a thickness of a side surface portion of the cooling water housing.

[0043] In addition, a plurality of fins may be formed below the base plate to protrude therefrom.

[0044] In addition, an opening portion that is partially opened may be formed in the lower surface of the enclosure, and a portion of the switching unit may be exposed through the opening portion

[0045] In addition, the cooling water housing may be coupled to the opening portion.Advantageous Effects of Invention

[0046] According to the semiconductor circuit breaker according to one aspect of the disclosure, the cooling water plate in which the cooling water flows is arranged below the switching unit and the air gap switch, so that cooling is effectively performed.

[0047] The cooling water plate occupies a small space, thereby reducing the entire volume.

[0048] The cooling water plate is exposed to the outside, so that assemblability is excellent and maintenance is facilitated.

[0049] In addition, when the cooling fan is arranged, a cooling effect is improved, and heat is dissipated well to the outside of the device.

[0050] That is, since the semiconductor circuit breaker has a cooling device in which a water cooling device and ab air cooling device are combined, the cooling effect is maximized.

[0051] According to the semiconductor circuit breaker according to another aspect of the disclosure, a water-cooling heat dissipation system in which the cooling water flows is arranged below the switching unit and the air gap switch, so that cooling is effectively performed.

[0052] In the water-cooling heat dissipation system, heat transference occurs while the cooling water flowing in the cooling water housing having the open upper surface is in direct contact with the switching unit, so that a cooling effect is maximized.

[0053] In the water-cooling heat dissipation system, a space that the water-cooled heat dissipation system occupies is remarkably reduced as compared with a space that an air-cooled heat dissipation system such as a cooling fan occupies.

[0054] In addition, since the water-cooling heat dissipation system is exposed to the outside of the enclosure, maintenance thereof is facilitated.Brief Description of Drawings

[0055] FIG. 1 is a configuration diagram of a direct current circuit breaker according to a conventional art. FIG. 2 is a perspective view of the semiconductor circuit breaker according to the conventional art. FIGS. 3 and 4 are perspective and side views of a semiconductor circuit breaker according to an aspect of the disclosure. FIG. 5 is a circuit diagram of the semiconductor circuit breaker according to the aspect of the disclosure. FIG. 6 is an exploded view of a switching unit and a cooling water plate in the semiconductor circuit breaker according to the aspect of the disclosure. FIGS. 7 to 10 are cross-sectional views of cooling water plates according to various embodiments of the disclosure. FIGS. 11 and 12 are perspective and side views of a semiconductor circuit breaker according to another embodiment of the disclosure. FIGS. 13 and 14 are perspective and side views of a semiconductor circuit breaker according to another aspect of the disclosure. FIG. 15 is a circuit diagram of the semiconductor circuit breaker according to the another aspect of the disclosure. FIG. 16 is a perspective view of a cooling water housing in the semiconductor circuit breaker according to the another aspect of the disclosure. FIG. 17 is a perspective view of a packing member in the semiconductor circuit breaker according to the another aspect of the disclosure. FIGS. 18 and 19 are perspective and side views of a semiconductor circuit breaker according to another embodiment of the disclosure. FIGS. 20 and 21 are side and exploded perspective views of a semiconductor circuit breaker according to still another embodiment of the disclosure. Best Mode

[0056] Hereinafter, preferred embodiments of the disclosure will be described with reference to the accompanying drawings, which are intended to describe the disclosure in detail to allow a person skilled in the art to easily carry out the invention, but not to mean that the technical concept and scope of the disclosure are limited thereto.

[0057] A semiconductor circuit breaker according to each embodiment of the disclosure will be described in detail with reference to the drawings.<First Embodiment>

[0058] Perspective and side views of a semiconductor circuit breaker according to an aspect of the disclosure are illustrated in FIGS. 3 and 4. A circuit diagram of the semiconductor circuit breaker according to the aspect of the disclosure is illustrated in FIG. 5.

[0059] A semiconductor circuit breaker 100 according to an embodiment of the disclosure includes a switching unit 120 arranged in an enclosure 101; an air gap switch (mechanical switch)140 arranged in the enclosure 101 and located at a front portion or a rear portion of the switching unit 120; a base plate 110 forming a lower portion of the switching unit 120; and a cooling water plate 150 coupled to the base plate 110 and having a cooling water flow path in which cooling water flows.

[0060] The enclosure 101 may be formed in a substantially rectangular box shape. The enclosure 101 may be made of an insulating material such as a synthetic resin to be insulated from the outside. The enclosure 101 supports internal components and protect the internal components from the outside.

[0061] A lower surface of the enclosure 101 may be opened. That is, the enclosure may have a shape in which upper, front, rear, left, and right surfaces thereof are closed.

[0062] An air vent hole is formed in a front surface or a rear surface of the enclosure 101. It is shown in FIG. 3 that a first air vent hole 103 is formed in the rear surface of the enclosure. However, the air vent hole may be formed in each surface of the enclosure 101 when necessary.

[0063] Components arranged inside the enclosure 101 will be described.

[0064] The switching unit 120 is arranged in the enclosure 101. The switching unit 120 includes a power semiconductor switch. A metal oxide semiconductor field effect transistor (MOSFET), an insulated gate bipolar transistor (IGBT), or the like may be applied as the power semiconductor switch.

[0065] The power semiconductor switch is often used in systems that require quick breaking. In the case of a general mechanical circuit breaker, a breaking speed thereof is a few to hundreds of ms, whereas a breaking speed of the semiconductor circuit breaker is tens of µs, thereby breaking a current in a much shorter time.

[0066] Accordingly, the semiconductor circuit breaker may be applied to a switchboard with a large current capacity, a direct current system with a rapid increase in fault current, an energy storage system (ESS) that requires stable current supply and breaking, or the like.

[0067] An electric circuit 130 is arranged above the switching unit 120. Alternatively, the switching unit 120 may be installed in a portion of the electric circuit 130.

[0068] The electric circuit 130 may include a gate driver (not shown), a controller 133, a snubber 135, a metal oxide varistor (MOV) 137, a transient voltage suppressor (TVS), and the like.

[0069] The gate driver provides a voltage that the switching unit 120 requires. To this end, the gate driver may include a separate power source circuit and a separate current buffer. The gate driver is also referred to as a driving driver.

[0070] In addition, the gate driver functions to electrically insulate signals between a high-voltage power circuit and a low-voltage control circuit and transfer the signals. Accordingly, the gate driver provides safer and higher reliability so as to achieve semiconductor switch driving.

[0071] The controller 133 connects and controls components in the circuit. The controller 133 may determine whether current transferred from a current sensor 132 is overcurrent or fault current according to the magnitude of the current, and may operate the switching unit 120 and the air gap switch 140 according to the overcurrent or the fault current. The controller 133 may operate the air gap switch 140 through a first driver 134a and may operate the switching unit 120 through a second driver 134b (see FIG. 5).

[0072] Here, the current sensor 132 is installed in a portion of a main circuit. In FIG. 6, the current sensor 132 may be arranged at any one of positions ①, ②, and ③. That is, the current sensor 132 may be installed at a front or rear end of the air gap switch 140 or a front or rear end of the switching unit 120.

[0073] In the case of the semiconductor circuit breaker, a protection circuit (safety circuit) or a safety element is applied to the semiconductor circuit breaker so as to protect the semiconductor switch from damage caused by a high voltage generated during semiconductor switching. A snubber circuit is used as an example of the protection circuit. In the semiconductor circuit breaker, it is general that the protection circuit decreases a voltage generated during switching, thereby protecting the semiconductor switch.

[0074] Examples of the snubber circuit may be a capacitor (C) snubber, a resistor-capacitor (RC) snubber, a charge-discharge type resistor-capacitor-diode (RCD) snubber, a discharge-suppressing type snubber circuit, and the like.

[0075] In addition, there is a case where the metal oxide varistor (MOV) 137 is additionally configured as the safety element in some systems. The MOV is one of components used for surge protection, and is applied to a portion of the circuit so as to prevent damage occurring in the semiconductor switch from a surge voltage. The MOV is a varistor composed of zinc oxide and is a transient voltage suppressor in which current flows when a potential equal to or higher than a set value is generated. When the MOV is applied, it is unnecessary to install a separate fuse inside the circuit.

[0076] The protection circuit and the safety element, which are described above, may be provided as a protection module detachably attached to the electric circuit 130. When the safety element is independently configured as a protection module, maintenance thereof is facilitated. That is, only the protection module is replaced in damage of the protection module.

[0077] The air gap switch 140 is arranged. The air gap switch 140 is a mechanical switch. The air gap switch 140 may be configured as a conventional mechanical switch having a contact portion composed of a fixed contact and a movable contact. In the air gap switch 140, the movable contact is connected to the fixed contact in conduction, and the movable contact is separated from the fixed contact, so that connection of the circuit is mechanically cut off. Since direct current has no current zero (0 point), there may occur a case where breaking of current is rather difficult when low current flows in the circuit. In this case, in order to completely break the current, it is necessary to mechanically cut off the circuit.

[0078] The air gap switch 140 may be located at a front portion or a rear portion of the switching unit 120. Here, the air gap switch 140 is preferably located at a side of a power source 80. This is because the circuit is separated in the vicinity of the power source in breaking, thereby protecting a breaking unit, other components, and a load 90.

[0079] However, much heat is generated at the contact portion of the air gap switch 140. Therefore, an apparatus for cooling heat of the air gap switch 140 and the switching unit 120 is required.

[0080] The cooling water plate 150 is arranged below the switching unit 120 and the air gap switch 140. The cooling water plate 150 may be formed in a flat plate shape. The cooling water plate 150 may be made of a material having an excellent thermal conductivity, such as aluminum (Al) or copper (Cu).

[0081] The cooling water plate 150 may be made of a metal material having a high thermal conductance, such as aluminum (Al) or copper (Cu).

[0082] The cooling water plate 150 is coupled to the base plate 110 forming the lower portion of the switching unit 120. The cooling water plate 150 may be coupled to the base plate 110 by a bonding or mechanical coupling method. An example of the mechanical coupling method may be fitting coupling, screw coupling, or the like.

[0083] Surfaces on which the cooling water plate 150 and the base plate 110 are in contact with each other have shapes corresponding to each other. That is, an upper surface of the cooling water plate 150 and a lower surface of the base plate 110 have shapes corresponding to each other.

[0084] In an example, the upper surface of the cooling water plate 150 and the lower surface of the base plate 110 are configured as flat surfaces.

[0085] In another example, the upper surface of the cooling water plate 150 and the lower surface of the base plate 110 are configured as uneven surfaces. Such an embodiment is shown in FIG. 6. Polygonal protrusion portions 112 or polygonal groove portions are formed on or in the upper surface of the cooling water plate 150, and groove portions 152 corresponding to the protrusion portions 112 or protrusion portions are formed in or on the lower surface of the base plate 110. Accordingly, coupling surfaces of the cooling water plate 150 and the base plate 110 are increased, to improve the stability of mechanical coupling, and thermal conductivity is increased, to achieve effective heat dissipation.

[0086] The cooling water plate 150 is made of a material having a high thermal conductivity to release heat of the switching unit 120, which is transferred through the base plate 110.

[0087] The cooling water plate 150 is located below the enclosure 101. The cooling water plate 150 is not located inside the enclosure 101 but located below the enclosure 101 to be exposed to ambient air. Accordingly, the factor of decrease in heat dissipation is reduced. When the lower surface of the enclosure 101 is opened, such an effect is further improved.

[0088] The cooling water plate 150 has a sufficient size to quickly absorb heat of the base plate 110. For example, the cooling water plate 150 may be formed to have a size corresponding to an area of the base plate 110 or a size equal to or larger than the area of the base plate 110.

[0089] A cooling water flow path 160 is formed inside the cooling water plate 150. The cooling water flow path 160 has an inflow port 161 and an outflow port 162. The inflow port 161and the outflow port 162 are arranged in one surface of the cooling water plate 150. Alternatively, the inflow port 161and the outflow port 162 are arranged in different surfaces of the cooling water plate 150, respectively.

[0090] Various embodiments of the cooling water plate 160 are illustrated in FIGS. 7 to 10.

[0091] A cooling water flow path 160 having the shape of a water storage tank is illustrated in FIG. 7. In this embodiment, in the cooling water flow path 160, a water storage tank 163 that occupies most of the area of the cooling water plate 150 is formed between an inflow port 161 and an outflow port 162. A large volume of cooling water is stored in the water storage tank 163. The cooling water of the water storage tank 163 does not exist in a state in which the cooling water is stagnant but moves from the inflow port 161 to the outflow port 162. Since the large volume of cooling water is stored in the water storage tank 163, a heat exchange area is large. It is advantage to apply the cooling water flow path 160 to the switching unit 120 that does not require rapid circulation of the cooling water and has a relatively low heat increase.

[0092] A form in which the inflow port 161 and the outflow port 162 are arranged together in a same surface of the cooling water plate 150 is illustrated in FIG. 7, and a form in which the inflow port 161 and the outflow port 162 are arranged in different surfaces of the cooling water plate 150, respectively, is illustrated in FIG. 8.

[0093] A cooling water flow path 160 formed in the shape of a zigzag pipe is illustrated in FIG. 9. In this embodiment, the cooling water flow path 160 extends windingly. The cooling water flow path 160 includes linear portions 164 and curved portions 165 connected to both ends of the linear portions 164. The length of the cooling water flow path 160 is lengthened, and a constant flow rate is maintained during approaching an outflow port 162 from an inflow port 161. Accordingly, the flow velocity of the cooling water flowing in the cooling water flow path can be constantly maintained throughout the entire cooling water flow path. Meanwhile, the control of the flow velocity is facilitated.

[0094] An example in which the diameter of a cooling water flow path 160 is changed is illustrated in FIG. 10. In this embodiment, the cooling water flow path 160 includes an expansion portion 166 in addition to the linear portion 164 and the curved portion 165 of the previous embodiment. The expansion portion 166 is a portion having a diameter that becomes large as compared with other portions. That is, the expansion portion 166 has a portion in which the flow rate of the cooling water is large. The expansion portion 166 locally has a relatively wide area on a plan view. Accordingly, the cooling water can be intensively located in a specific portion.

[0095] In addition to these embodiments, the cooling water flow path 160 may be modified in various forms such that the flow rate of the cooling water is changed.<Second Embodiment>

[0096] A semiconductor circuit breaker according to another embodiment is illustrated in FIG. 11.

[0097] The semiconductor circuit breaker 100-1 of this embodiment is equipped with both a water cooling device and an air cooling device.

[0098] An enclosure 101 has an upper space S1 and a lower space S2. A switching unit 120, an electric circuit 130, an air gap switch 140, and the like are arranged in the upper space S1 of the enclosure 101. A cooling water plate 150, a cooling fan 170, and the like are arranged in the lower space S2 of the enclosure 101.

[0099] The switching unit 120, the electric circuit 130, and the air gap switch 140, which are arranged in the upper space S1 of the enclosure 101, may refer to the previous embodiment.

[0100] A fin 155 is arranged below the cooling water plate 150. The fin 155 is formed in the shape of a needle or a chip, and a plurality of fins 155 protrude on a lower surface of the cooling water plate 150.

[0101] The cooling fan 170 is arranged in one side surface of the lower space S2 of the enclosure 101, and a second air vent hole 104 is formed in an opposite side surface of the lower space S2.

[0102] Wind is formed by the cooling fan 170 to exit through the second air vent hole via the interior of the lower space S2 of the enclosure 101. Therefore, heat dissipated through the fins 155 is quickly discharged to the outside. Since the fins 155 are maintained in a room temperature state, heat of the switching unit 120 is more quickly discharged. That is, heat of the upper space S1 is quickly discharged to the lower space S2.

[0103] Heat in the enclosure 101 is discharged to the outside of the enclosure 101 by the cooling water plate 150 and the cooling fan 170, so that a cooling effect is improved.

[0104] According to the semiconductor circuit breaker according to the embodiment of the disclosure, since the cooling water plate in which the cooling water flows is arranged below the switching unit and the air gap switch, cooling is effectively performed.

[0105] Since the cooling water plate occupies a small space, the entire volume is reduced.

[0106] Since the cooling water plate is exposed to the outside, assemblability is excellent and maintenance is facilitated.

[0107] In addition, when the cooling fan is arranged, the cooling effect is improved, and heat is dissipated well to the outside of the device.

[0108] That is, since the semiconductor circuit breaker has a cooling device in which the water cooling device and the air cooling device are combined, the cooling effect is maximized.<Third Embodiment>

[0109] Perspective and side views of a semiconductor circuit breaker according to another aspect of the disclosure are illustrated in FIGS. 13 and 14. A circuit diagram of the semiconductor circuit breaker according to the another aspect of the disclosure is illustrated in FIG. 15.

[0110] The semiconductor circuit breaker 100 according to the another aspect of the disclosure may include a switching unit 120 arranged below an enclosure 101 having an open lower surface and including a power semiconductor element; and a cooling water housing 180 coupled to the switching unit 120 below the switching unit 120 and having an open upper surface, and allow cooling water W accommodated in the cooling water housing 180 to flow while being in contact with a lower surface of the switching unit.

[0111] The enclosure 101 may be formed in a substantially rectangular box shape. The enclosure 101 may be made of an insulating material such as a synthetic resin to be insulated from the outside. The enclosure 101 supports internal components such as the switching unit 120 and an electric circuit 130 and protects the internal components from the outside.

[0112] A lower surface of the enclosure 101 is opened. That is, the enclosure may have a shape in which upper, front, rear, left, and right surfaces thereof are closed and the lower surface thereof is opened. Therefore, the lower surface of the switching unit 120 may be exposed to the outside.

[0113] An air vent hole is formed in a front surface or a rear surface of the enclosure 101. It is shown in FIG. 3 that a first air vent hole 103 is formed in the rear surface of the enclosure. However, the air vent hole may be formed in each surface of the enclosure 101 when necessary.

[0114] Components arranged inside the enclosure 101 will be described.

[0115] The switching unit 120 is arranged in the enclosure 101. The switching unit 120 includes a power semiconductor switch. A metal oxide semiconductor field effect transistor (MOSFET), an insulated gate bipolar transistor (IGBT), or the like may be applied as the power semiconductor switch.

[0116] The power semiconductor switch is often used in systems that require quick breaking. In the case of a general mechanical circuit breaker, a breaking speed thereof is a few to hundreds of ms, whereas a breaking speed of the semiconductor circuit breaker is tens of µs, thereby breaking a current in a much shorter time.

[0117] Accordingly, the semiconductor circuit breaker may be applied to a switchboard with a large current capacity, a direct current system with a rapid increase in fault current, an energy storage system (ESS) that requires stable current supply and breaking, or the like.

[0118] A first base plate 110 is arranged below the switching unit 120.

[0119] The electric circuit 130 is arranged above the switching unit 120. Alternatively, the switching unit 120 may be installed in a portion of the electric circuit 130.

[0120] The electric circuit 130 may include a gate driver (not shown), a controller 133, a snubber 135, a metal oxide varistor (MOV) 137, a transient voltage suppressor (TVS), and the like.

[0121] The gate driver provides a voltage that the switching unit 120 requires. To this end, the gate driver may include a separate power source circuit and a separate current buffer. The gate driver is also referred to as a driving driver.

[0122] In addition, the gate driver functions to electrically insulate signals between a high-voltage power circuit and a low-voltage control circuit and transfer the signals. Accordingly, the gate driver provides safer and higher reliability so as to achieve semiconductor switch driving.

[0123] The controller 133 connects and controls components in the circuit. The controller 133 may determine whether current transferred from a current sensor 132 is overcurrent or fault current according to the magnitude of the current, and may operate the switching unit 120 and an air gap switch 140 according to the overcurrent or the fault current. The controller 133 may operate the air gap switch 140 through a first driver 134a and may operate the switching unit 120 through a second driver 134b (see FIG. 5).

[0124] Here, the current sensor 132 is installed in a portion of a main circuit. In FIG. 6, the current sensor 132 may be arranged at any one of positions ①, ②, and ③. That is, the current sensor 132 may be installed at a front or rear end of the air gap switch 140 or a front or rear end of the switching unit 120.

[0125] In the case of the semiconductor circuit breaker, a protection circuit (safety circuit) or a safety element is applied to the semiconductor circuit breaker so as to protect the semiconductor switch from damage caused by a high voltage generated during semiconductor switching. A snubber circuit is used as an example of the protection circuit. In the semiconductor circuit breaker, it is general that the protection circuit decreases a voltage generated during switching, thereby protecting the semiconductor switch.

[0126] Examples of the snubber circuit may be a capacitor (C) snubber, a resistor-capacitor (RC) snubber, a charge-discharge type resistor-capacitor-diode (RCD) snubber, a discharge-suppressing type snubber circuit, and the like.

[0127] In addition, there is a case where the metal oxide varistor (MOV) 137 is additionally configured as the safety element in some systems. The MOV is one of components used for surge protection, and is applied to a portion of the circuit so as to prevent damage occurring in the semiconductor switch from a surge voltage. The MOV is a varistor composed of zinc oxide and is a transient voltage suppressor in which current flows when a potential equal to or higher than a set value is generated. When the MOV is applied, it is unnecessary to install a separate fuse inside the circuit.

[0128] The protection circuit and the safety element, which are described above, may be provided as a protection module detachably attached to the electric circuit 130. When the safety element is independently configured as a protection module, maintenance thereof is facilitated. That is, only the protection module is replaced in damage of the protection module.

[0129] The air gap switch 140 is arranged. The air gap switch 140 is a mechanical switch. The air gap switch 140 may be configured as a conventional mechanical switch having a contact portion composed of a fixed contact and a movable contact. In the air gap switch 140, the movable contact is connected to the fixed contact in conduction, and the movable contact is separated from the fixed contact, so that connection of the circuit is mechanically cut off. Since direct current has no current zero (0 point), there may occur a case where breaking of current is rather difficult when low current flows in the circuit. In this case, in order to completely break the current, it is necessary to mechanically cut off the circuit.

[0130] The air gap switch 140 may be located at a front portion or a rear portion of the switching unit 120. Here, the air gap switch 140 is preferably located at a side of a power source 80. This is because the circuit is separated in the vicinity of the power source in breaking, thereby protecting a breaking unit, other components, and a load 90.

[0131] However, much heat is generated at the contact portion of the air gap switch 140. Therefore, a device for cooling heat of the air gap switch 140 and the switching unit 120 is required.

[0132] A second base plate 145 may be arranged below of the air gap switch 140.

[0133] The cooling water housing 180 is arranged below the switching unit 120 and the air gap switch 140. The cooling water housing 180 may be formed in a rectangular shape having an open upper surface. A perspective view of the cooling water housing 180 is illustrated in FIG. 6.

[0134] The cooling water housing 180 may be made of a synthetic resin or a metal material. When the cooling water housing 180 is made of a metal material, the cooling water housing 180 is preferably made of a material having an excellent thermal conductivity, such as aluminum (Al) or copper (Cu). Accordingly, heat of the cooling water W can be quickly released to the outside.

[0135] The cooling water housing 180 may be coupled to the first base plate 110 forming a lower portion of the switching unit 120. In addition, the cooling water housing 180 may extend to the second base plate 145 forming a lower portion of the air gap switch 140 to be coupled to the second base plate 145.

[0136] The cooling water housing 180 may be coupled to the base plates 110 and 145 by a bonding or mechanical coupling method. An example of the mechanical coupling method may be fitting coupling, screw coupling, or the like.

[0137] Surfaces on which the cooling water housing 180 and the base plates 110 and 145 are in contact with each other have shapes or sizes corresponding to each other. That is, the upper surface of the cooling water housing 180 and lower surfaces of the base plates 110 and 145 have shapes corresponding to each other.

[0138] In an example, the upper surface of the cooling water housing 180 and the lower surfaces of the base plates 110 and 145 are configured as flat surfaces. Each of the base plates 110 and 145 is formed as a flat surface. The upper surface of the cooling water housing 180 is opened, and each side surface portion 184 is exposed. Upper ends of the side surface portions 184 are formed to have a same height.

[0139] A fastening hole 183 may be formed in each corner portion of the cooling water housing 180 to be coupled to the base plates 110 and 145 by a fastening member.

[0140] A cooling water accommodation portion 185 is arranged in the cooling water housing 180. The cooling water accommodation portion 185 occupies most of the volume of the cooling water housing 180. The cooling water W is accommodated in the cooling water accommodation portion 185 and flows in the cooling water accommodation portion 185.

[0141] The cooling water housing 180 is made of a material having a high thermal conductivity to release heat of the switching unit 120, which is transferred through the base plate 110.

[0142] The cooling water housing 180 is located below the enclosure 101. The cooling water housing 180 is not located inside the enclosure 101 but located below the enclosure to be exposed to ambient air. Accordingly, the factor of decrease in heat dissipation is reduced. When the lower surface of the enclosure 101 is opened, such an effect is further improved.

[0143] Since the lower surface of the enclosure 101 is opened, the cooling water housing 180 is coupled directly to the switching unit 120 or the air gap switch 140. When the base plates 110 and 145 exist, the cooling water housing 180 is coupled to the base plates 110 and 145.

[0144] The cooling water housing 180 has a sufficient size to quickly absorb heat of the base plates 110 and 145. For example, the cooling water housing 180 may be formed to have a size corresponding to an area of the base plates 110 and 145 or a size equal to or larger than the area of the base plates 110 and 145.

[0145] The cooling water accommodation portion 185 is formed in the cooling water housing 180. The cooling water W flows in and out of the cooling water accommodation portion 185. The upper surface of the cooling water housing 185 is opened. That is, an upper surface of the cooling water accommodation portion 185 is opened. Therefore, the cooling water W rises up to an upper surface portion of the cooling water housing 180. Accordingly, the cooling water W is in direct contact with the lower surfaces of the base plates 110 and 145, thereby absorbing heat of the switching unit 120 or the air gap switch 140. Since the cooling water W is in direct contact with the switching unit 120 or the air gap switch 140, heat transference is maximized.

[0146] The cooling water W is stored inside the cooling water housing 180 and flows in the cooling water housing 180. The cooling water housing 180 has an inflow port 181 and an outflow port 182. The inflow port 181 and the outflow port 182 may be arranged in one surface of the cooling water housing 180. Alternatively, the inflow port 181 and the outflow port 182 may be arranged in different surfaces of the cooling water housing 180, respectively. Preferably, the inflow port 181 and the outflow port 182 may be respectively formed in surfaces of the cooling water housing 180, which face each other, to form a flow path through the cooling water W flows straight.

[0147] According to the semiconductor circuit breaker according to the another aspect of the disclosure, the cooling water housing 180 in which the cooling water is accommodated and flows is arranged below the switching unit and the air gap switch, so that cooling is effectively performed.

[0148] Since the upper surface of the cooling water housing 180 is opened, heat is transferred while the cooling water is in direct contact with the switching unit, so that a cooling effect is maximized.

[0149] A space that such a water-cooling heat dissipation system occupies is remarkably reduced as compared with a space that an air-cooling heat dissipation system such as a cooling fan occupies.

[0150] In addition, since the cooling water housing 180 is exposed to the outside of the enclosure 101, maintenance is facilitated.

[0151] A perspective view of a packing member 190 is illustrated in FIG. 17.

[0152] The packing member 190 is arranged between the cooling water housing 180 and the base plates 110 and 145 to maintain airtightness from the outside. The packing member 190 is also referred to as a gasket.

[0153] The packing member 190 may be made of a soft material such as rubber.

[0154] The packing member 190 may be formed in a shape similar to a shape corresponding to the upper surface portion of the cooling water housing 180. The packing member 190 is formed as a thin plate. An opening holes 192 are formed in the packing member 190. The opening hole 192 occupy most of the area of the packing member 190.

[0155] A width of a panel surface portion 191 of the packing member 190 may be formed larger than a thickness of the side surface portion 184 of the cooling water housing 180. Accordingly, pressing surfaces of the base plates 110 and 145 increase, so that pressing is well performed and assemblability is facilitated.

[0156] A fastening hole 193 corresponding to the fastening hole 183 of the cooling water housing 180 is formed in each corner portion of the packing member 190.<Fourth Embodiment>

[0157] A semiconductor circuit breaker having a water-cooling heat dissipation system according to another embodiment of the disclosure is illustrated in FIGS. 18 and 19. FIG. 8 is a perspective view and FIG. 9 is a side view.

[0158] A switching unit 120, an electric circuit 130, an air gap switch 140, and the like are arranged in an enclosure 101. The switching unit 120, the electric circuit 130, and the air gap switch 140, which are arranged in the enclosure 101, may refer to the previous embodiment.

[0159] A fin 115 is arranged below each of base plates 110 and 145. The fin 115 is formed in the shape of a needle or a chip, and a plurality of fins 155 are formed to protrude on lower surfaces of the base plates 110 and 145.

[0160] Since the fins 115 are formed below the base plates 110 and 145 such that an area in which the base plates 110 and 145 are in contact with the cooling water W is increased, heat transference between the switching unit 120 and the cooling water W more effectively occurs.

[0161] According to the semiconductor circuit breaker according to this embodiment, the cooling water housing 180 in which the cooling water is accommodated and flows is arranged below the switching unit and the air gap switch, so that cooling is effectively performed.

[0162] Since the upper surface of the cooling water housing 180 is opened, heat transference occurs while the cooling water is in direct contact with the switching unit, so that a cooling effect is maximized.

[0163] A space that such a water-cooling heat dissipation system occupies is remarkably reduced as compared with a space that an air-cooling heat dissipation system such as a cooling fan occupies.

[0164] Particularly, in this embodiment, since the area in which the base plates 110 and 145 are in contact with the cooling water W is increased as the fins 115 are formed below the base plates 110 and 145, heat transference between the switching unit 120 and the cooling water W more effectively occurs.<Fifth Embodiment>

[0165] A semiconductor circuit breaker according to still another embodiment of the disclosure is illustrated in FIGS. 20 and 21.

[0166] A switching unit 120, an electric circuit 130, an air gap switch 140, and the like are arranged in an enclosure 101. The switching unit 120, the electric circuit 130, and the air gap switch 140, which are arranged in the enclosure 101, may refer to the previous embodiment.

[0167] In this embodiment, a lower surface of the enclosure 101 is partially opened. An opening portion 102 that is partially opened is formed in the lower surface of the enclosure 101. Here, the opening portion 102 is arranged in a specific portion of the switching unit 120. The opening portion 102 is arranged corresponding to a portion in which a power semiconductor element 125 of the switching unit 120 is arranged.

[0168] A portion of a base plate 110 is exposed through the opening portion 102. Here, an example is illustrated in which a first base plate 110 of the switching unit 120 is exposed.

[0169] The portion in which the power semiconductor element 125 is arranged may be exposed to the base plate 110.

[0170] A cooling water housing 180-1 is coupled to the opening portion 102. The cooling water housing 180-1 is formed corresponding to the size and shape of the opening portion 102.

[0171] A packing member 190-1 may be located between the opening portion 102 and the cooling water housing 180-1. Here, the packing member 190 is also formed corresponding to the size and shape of the opening portion 102.

[0172] Since the cooling water housing 180-1 is formed relatively small as compared with the previous embodiments according to the size of the opening 102, weight can be reduced. Further, as the cooling water housing is intensively installed in a portion from which heat is discharged, a heat transference effect is improved, and the volume of cooling water required is reduced.

[0173] In addition, the time for which the cooling water flowing in the cooling water housing 180 stays temporarily in a cooling water accommodation portion 185 is shortened, so that the heat transference more effectively occurs.

[0174] In this embodiment, the lower surface of the enclosure 101 is not entirely opened but locally formed in a portion in which much heat is generated, so that the size of a water-cooling heat dissipation system is reduced, and a heat dissipation effect is effectively derived.

[0175] According to the semiconductor circuit breaker according to each embodiment of the disclosure, the water-cooling heat dissipation system in which the cooling water flows is arranged below the switching unit and the air gap switch, so that the cooling is effectively performed.

[0176] In the water-cooling heat dissipation system, heat transference occurs while the cooling water flowing in the cooling water housing having the open upper surface is in direct contact with the switching unit, so that the cooling effect is maximized.

[0177] In the water-cooling heat dissipation system, a space that the water-cooling heat dissipation system occupies is remarkably reduced as compared with a space that an air-cooling heat dissipation system such as a cooling fan occupies.

[0178] In addition, since the water-cooling heat dissipation system is exposed to the outside of the enclosure, the maintenance thereof is facilitated.

[0179] The embodiments described above are embodiments implementing the disclosure, and it will be apparent to those skilled in this art that various changes and modifications may be made thereto without departing from the gist of the disclosure. Accordingly, it should be noted that the embodiments disclosed in the disclosure are only illustrative and not limitative to the concept of the disclosure, and the scope of the concept of the invention is not limited by those embodiments. In other words, the scope protected by the disclosure should be construed by the accompanying claims, and all the technical concept in the equivalent scope of the invention should be construed to be included in the scope of the right of the disclosure.[Explanation of Symbols]

[0180] 100: semiconductor circuit breaker 101: enclosure 103: first air vent hole 104: second air vent hole 110: base plate 120: switching unit 130: electric circuit 140: air gap switch 150: cooling water plate 160: cooling water flow path 170: cooling fan 180: cooling water housing 190: packing member

Claims

1. A semiconductor circuit breaker comprising: a switching unit arranged in an enclosure; an air gap switch arranged in the enclosure and located at one side of the switching unit; a base plate forming a lower portion of the switching unit; and a cooling water plate coupled to the base plate and having a cooling water flow path through which cooling water flows in the cooling water plate.

2. The semiconductor circuit breaker of claim 1, wherein polygonal protrusion portions or polygonal groove portions are formed on or in an upper surface of the cooling water plate, and groove portions or protrusion portions, corresponding to the protrusion portions or the groove portions, are formed in or on a lower surface of the base plate.

3. The semiconductor circuit breaker of claim 1, wherein a lower surface of the enclosure is opened.

4. The semiconductor circuit breaker of claim 1, wherein the cooling water flow path has an inflow port and an outflow port, and wherein the inflow port and the outflow port are arranged together in any one surface of the cooling water plate or are arranged in different surfaces of the cooling water plate, respectively.

5. The semiconductor circuit breaker of claim 4, wherein the cooling water flow path comprises a water storage tank formed between the inflow port and the outflow port.

6. The semiconductor circuit breaker of claim 4, wherein the cooling water flow path comprises linear portions and curved portions connected to both ends of the linear portions, and is formed such that a constant flow rate is maintained during approaching the outflow port from the inflow port.

7. The semiconductor circuit breaker of claim 6, wherein an expansion portion having a diameter that becomes large as compared with other portions is formed in the linear portion or the curved portion.

8. The semiconductor circuit breaker of claim 1, wherein a plurality of fins are formed below the cooling water plate to protrude therefrom.

9. The semiconductor circuit breaker of claim 8, wherein a cooling fan is arranged below the cooling water plate.

10. A semiconductor circuit breaker comprising: a switching unit arranged below an enclosure having an open lower surface and comprising a power semiconductor element; and a cooling water housing coupled to the switching unit below the switching unit and having an open upper surface, wherein cooling water accommodated in the cooling water housing flows while being in contact with a lower surface of the switching unit.

11. The semiconductor circuit breaker of claim 10, wherein a base plate is arranged below the switching unit.

12. The semiconductor circuit breaker of claim 10, wherein a cooling water accommodation portion having the cooling water accommodated therein is arranged in the cooling water housing.

13. The semiconductor circuit breaker of claim 10, wherein a fastening hole is formed in each corner portion of the cooling water housing.

14. The semiconductor circuit breaker of claim 10, wherein the cooling water housing has an inflow port and an outflow port, which are formed therein.

15. The semiconductor circuit breaker of claim 14, wherein the inflow port and the outflow port are formed in surfaces of the cooling water housing, which face each other, respectively.

16. The semiconductor circuit breaker of claim 14, wherein the cooling water housing is exposed to the outside of the enclosure.

17. The semiconductor circuit breaker of claim 10, wherein a packing member having an opening hole is located between the cooling water housing and a base plate.

18. The semiconductor circuit breaker of claim 11, wherein a plurality of fins are formed below the base plate to protrude therefrom.

19. The semiconductor circuit breaker of claim 10, wherein an opening portion that is partially opened is formed in the lower surface of the enclosure, and a portion of the switching unit is exposed through the opening portion, and wherein the cooling water housing is coupled to the opening portion.

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