ELECTROFORMING PROCESS AND SYSTEM

FR3139348B1Active Publication Date: 2026-05-22UNISON INDUSTRIES LLC
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Patent Information

Authority / Receiving Office
FR · FR
Patent Type
Patents
Current Assignee / Owner
UNISON INDUSTRIES LLC
Filing Date
2022-12-08
Publication Date
2026-05-22

AI Technical Summary

Technical Problem

Existing electroforming processes are limited by material options, which restrict the application of electroformed components to lower operating temperatures and strength, making them unsuitable for advanced structural components.

Method used

Incorporation of prealloyed superalloy powder into the electrolyte solution during electroforming, followed by heat treatments to enhance metallurgical anchoring and precipitation, resulting in a composite electroformed component with improved strength and high-temperature capability.

Benefits of technology

The process enables the production of high-strength electroformed components capable of operating at temperatures up to 1200°F (650°C) with a composite structure that maintains mechanical integrity and resistance to traction.

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Abstract

The invention relates to an electroforming system and method comprising an electrode defining a mandrel within a mixing solution, and the application of a voltage to the electrode in the mixing solution to form a composite metal layer on the electrode. The composite metal layer may have particles incorporated within a metal matrix and define a composite electroformed component. Figure 2 for the abstract.
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Description

Description Title of the invention: METHOD AND SYSTEM ELECTROFORMING Technical field The present subject matter relates generally to an electroforming method and system, and more specifically to the electroforming of composite materials. Prior Art An electroforming process may create, generate, or otherwise form a metal layer of a desired component. In one example, a mold or base for the desired component may be immersed in an electrolytic liquid and electrically charged. The electrical charge of the mold may attract an oppositely charged electroforming material through the electrolytic solution. The electrical attraction of the electroforming material to the mold ultimately deposits the electroforming material onto exposed surfaces of the mold, creating an outer metal layer. Brief description of the drawings A complete and enabling disclosure of this disclosure, including the best mode thereof, addressed to those skilled in the art, is set forth in the specification, which refers to the appended Figures, in which: [Fig.1] is a schematic perspective view of a prior art electroplating tank for forming a component. [Fig.2] is a schematic perspective view of a system for electroforming a component according to various aspects described herein. [Fig.3] is a schematic cross-sectional view of an electroformed component formed in the system of [Fig.2]. [Fig.4] is a schematic cross-sectional view of a portion of the electroformed component of [Fig.3]. [Fig.5] is a schematic cross-sectional view of the portion of [Fig.4] illustrating a first exemplary heat treatment. [Fig.6] is a schematic cross-sectional view of the portion of [Fig.4] after an exemplary aging heat treatment following the first exemplary heat treatment of [Fig.5]. [Fig.7] is a schematic cross-sectional view of the portion of [Fig.4] illustrating another first exemplary heat treatment. [Fig.8] is a schematic cross-sectional view of the portion of [Fig.4] after a further exemplary aging heat treatment following the first heat treatment as an example of [Fig.7]. [Fig.9] is a schematic view of another system for electroforming a component according to various aspects described herein. [Fig.10] is a flowchart illustrating a process for electroforming a component according to various aspects described herein. Statement of the invention Aspects of the present disclosure relate to a system and method for electroforming a component. It will be understood that the disclosure may have general applicability in a variety of applications, including that the electroformed component may be used in any suitable mobile and non-mobile industrial, commercial, and residential applications. Electroforming is an additive manufacturing process where metal parts are formed through the electrolytic reduction of metal ions on the surface of a mandrel or cathode. In a typical electroforming process, a mandrel (cathode) and an anode are immersed in an electrolyte solution. A metal layer forming a part thickness builds up on the mandrel surface over time when a current is established between the electrodes. Once the desired part thickness is achieved, the mandrel can be removed by mechanical, chemical, or thermal processing, resulting in a freestanding metal part. In one example, the mandrel can be a low-melting-point material (also known as a "fusible alloy") that can be cast to achieve the mandrel shape and subsequently molten for reuse following electroforming.Other mandrel options include conductive waxes and metallized plastic that can be formed by injection molding, additive manufacturing, or the like. In some cases, a reusable mandrel can also be used. Electroforming is used to manufacture products across a range of industries, including medical care, electronics, and aerospace. The electroforming manufacturing process offers several advantages, including being efficient, precise, scalable, and economical. However, challenges due to limited material options may limit wider application of this technology for advanced structural components. As such, there remains a need for improved manufacturing processes for electroformed components, particularly high-performance structural components. As used herein, the term "electrodeposition" shall include any process for building, forming, growing or otherwise creating a metal layer on another substrate or base. Non-limiting examples Electroplating processes may include electroforming, electroless forming, electroplating, or a combination thereof. While one electroforming process is generally described herein, it will be understood that aspects of the disclosure are applicable to all electroplating processes. As used herein, the term "non-sacrificial anode" will refer to an inert or insoluble anode that does not dissolve in an electrolytic fluid when supplied with a current from an energy source, while the term "sacrificial anode" will refer to an active or soluble anode that can dissolve in an electrolytic fluid when supplied with a current from an energy source. Non-limiting examples of non-sacrificial anode materials may include titanium, gold, silver, platinum, and rhodium. Non-limiting examples of sacrificial anode materials may include nickel, cobalt, copper, iron, tungsten, zinc, and lead. It will be understood that various alloys of the metals listed above may be used as sacrificial or non-sacrificial anodes. All directional references (e.g., radial, axial, proximal, distal, upper, lower, upward, downward, left, right, lateral, front, rear, top, bottom, above, below, vertical, horizontal, clockwise, counterclockwise, upstream, downstream, behind, etc.) are used solely for identification purposes to assist the reader in understanding this disclosure, and do not create limitations, particularly regarding the position, orientation, or use of the disclosure. Linking references (e.g., fixed, coupled, connected, and joined) are to be interpreted broadly and may include intermediate members between a collection of elements and relative movement between elements, unless otherwise indicated. As such, linking references do not necessarily imply that two elements are directly connected and in a fixed relationship to each other.Additionally, as used herein, "a set" may include any number of the elements respectively described, including a single element. The example drawings are for illustrative purposes only and the dimensions, positions, order and relative sizes reflected in the drawings attached hereto may vary. [Fig. 1] is a schematic illustration of a prior art electroforming system 1. A prior art electroplating vessel 10 (or "vessel 10") may carry a single metal component solution or electrolytic solution 12 having alloying metal ions. At least one electrode may be provided in the vessel. The at least one electrode may include an anode 14 and a cathode 16. A component to be electroformed may form the cathode 16. A power source 18, which may include a controller or controller module, may electrically couple to the anode 14 and the cathode 16 by electrical conduits 20 to form a circuit through the conductive electrolytic solution 12. Optionally, a switch 22 or sub-controller may be included along the electrical conduits 20 between the power source 18, the anode 14, and the cathode 16. During operation, a current may be supplied from the anode 14 to the cathode 16 to electroform a body at the cathode 16. Supplying the current may cause metal ions from the single metal component solution 12 to form a metal layer on the component at the cathode 16. Electroforming material options have typically included nickel, copper, or a nickel-cobalt alloy. Such materials have traditionally allowed for an appropriately high deposition rate (e.g., greater than 0.001 in / hr or 0.025 mm / hr), high current efficiency (e.g., the proportion of current used to convert metal ions to solid metal, rather than other side reactions), and low residual stresses in the finished component. Such material options for structural applications are typically limited to maximum use temperatures of approximately 500°F (260°C), with strength and temperature capability limited to approximately 100 ksi (690 MPa) of ultimate tensile strength at 500°F (260°C).Additionally, electrodeposition of high-strength multi-component alloys can present challenges in incorporating all of the various alloying elements into the electrolyte bath. Aspects of the present disclosure provide an electroforming process that can be used to manufacture high strength parts capable of operating at higher temperatures than in traditional electroforming processes, including above 500°F (260°C), or even up to or above 1200°F (650°C), including between 650 and 870°C (1200 and 1600°F) in a non-limiting example. Aspects of the disclosure herein also provide a distinct thick electroform having an overall thickness of 1 to 5 mm or greater and improved material strength by means of directly incorporating a pre-alloyed superalloy powder or other alloy powder into an electrolyte solution. The electroformed metal layer forms a composite electroformed component having the dispersed powder particles embedded in a metal matrix. The disclosed aspects also provide a first heat treatment process performed at an elevated temperature to enhance metallurgical anchoring between the particles and the metal matrix, or to dissolve the particles into the metal matrix to form a homogeneous single-phase matrix. The disclosed aspects further provide a second heat treatment process in the form of an aging heat treatment, following the first heat treatment, to induce precipitation within the powder particles or homogeneous single-phase matrix for further strengthening. In this way, problems relating to the strength and high-temperature capability of electroformed components are addressed through the use of composite materials and heat treatments. In this approach, metal powder particles (e.g., metal superalloy particles) are suspended in the electrolyte and incorporated into the growing metal matrix during electroforming. Subsequent heat treatment of the electroformed component at selected temperature ranges can provide incorporation and reprecipitation of particles into the component, resulting in optimal mechanical properties with respect to material strength, tensile strength, hardness, ductility, or the like. Referring now to [Fig. 2], a system 101 for electroforming a component is illustrated in various aspects described herein. System 101 is similar to system 1; therefore, like parts of system 101 will be identified with like numbers increased by 100, it being understood that the description of like parts of system | applies to system 101 unless otherwise indicated. The system 101 includes an electroplating tank 110 (or “tank 110”), an anode 114, a cathode 116, a power source 118, electrical conduits 120, and a switch 122. An electrolytic solution 112 containing metal ions 125 may be provided in the tank 110. A difference from the system 1 is that metal powder particles 130 (also referred to herein as “metal powder 130” or “powder 130”) may be suspended in the electrolytic solution 112 to form a mixture solution 113 within the tank 110. The mixture solution 113 contains the metal ions 125 and the metal powder 130. The powder 130 may include pre-alloyed superalloys or high-strength alloys, including a nickel-cobalt-phosphorus alloy, a nickel-molybdenum alloy, nickel aluminide, Inconel, Ni3AI, Ni3Ta, Ni3Ti, Ni3Nb, Ni3Mo, NiAl, R108, or R718, in certain non-limiting examples.Additionally or alternatively, powder 130 may also comprise yttria particles, alumina particles, alumina fibers, cerium oxide particles, silica particles, silicon carbide particles, titanium particles, titanium oxide particles, titanium carbide particles, titanium nitride particles, zirconium carbide particles, carbon nanotubes, graphene, or precursors thereof, or combinations thereof, in non-examples. limiting. As used herein, a “pre-alloyed” material, e.g., a pre-alloyed powder material, may refer to particles of that material having the same alloy composition as the overall material as known in the art. Other powder metallurgy alloying processes known in the art include, but are not limited to, admixture-mixing, diffusion alloying, and hybrid alloying. Additionally, as used herein, a “high strength alloy” may refer to an alloy having a material property above a predetermined threshold including, but not limited to, an ultimate tensile strength (UTS) greater than 100 ksi (690 MPa) at 1200°F (650°C), or a ductility greater than 10% at 1200°F (650°C). The anode 114 and the cathode 116 may be located within the vessel 110 and submerged in the mixing solution 113. The anode 114 may be a sacrificial or non-sacrificial anode. The cathode 116 may be spaced from the anode 114 within the mixing solution 113. The cathode 116 may include a mandrel 124, which may be removable or non-removable from the electroformed component. The anode 114 and the cathode 116 may also be electrically coupled to the power source 118 by means of electrical conduits 120 as shown. A switch 122 may be provided between the anode 114 and the power source 118. The power source 118 may include a controller module for controlling the flow of current through the electrical conduits 120. Additionally or alternatively, a separate controller may be provided and electrically coupled to the power source 118. Another difference from the system | is that a set of circulation controllers 140 may be provided for stirring, mixing, agitating, dispersing, or the like of the powder 130 in the mixing solution 113. In some examples, the set of circulation controllers 140 may be electrically coupled to the power source 118. Additionally or alternatively, the set of circulation controllers 140 may be controllably operated by a separate controller. The circulation control device assembly 140 may be fluidly coupled to the interior of the vessel 110. In the illustrated example, the circulation control device assembly 140 is shown within the vessel 110. It is also contemplated that the circulation control device assembly 140 may be positioned external to the vessel 110 and coupled thereto, e.g., by a fluid port, conduit, or the like. First, second and third exemplary circulation control devices 141, 142, 143 are shown in the set of control devices. circulation 140. Any number or type of circulation control devices may be provided. In addition, the described aspects of the first, second, and third circulation control devices 141, 142, 143 may be used in combination. For example, a single circulation control device may include multiple types of circulation mechanisms agitating the mixing solution 113. The first circulation controller 141 may include a liquid pump configured to circulate a liquid jet 144 through the mixing solution 113. In some examples, the first circulation controller 141 may include a liquid inlet 145 providing an external source of liquid to the tank 110. In some examples, the liquid inlet 145 may be located within the tank 110, drawing in surrounding mixing solution 113 to form the liquid jet 144. The second circulation control device 142 may include an air pump configured to circulate an air jet 146 through the mixing solution 113. The second circulation control device 142 may include an air inlet 147 fluidly coupled to an air source for forming the air jet 146. In some examples, the air inlet 147 may be located within the vessel 110 and fluidly coupled through a vessel wall to an air source. In some examples, the air inlet 147 may be located external to the vessel 110. The third circulation control device 142 may include a sonic device configured to emit pressure waves. In the illustrated example, the third circulation control device 142 includes an ultrasonic device having an oscillator, a transducer, and the like emitting ultrasonic pressure waves 148 into the mixing solution 113. In one example, the third circulation control device 142 may be located within the vessel 110 and directly emit the ultrasonic pressure waves 148 into the mixing solution 113. In another example, the third circulation control device 142 may be located external to the vessel 110 and transmit ultrasonic pressure waves 148 through a conduit, a transmitter, or the like into the vessel 110 and the mixing solution 113. During operation, a current may be supplied from the anode 114 to the cathode 116 to electroform a composite metal layer 150 at the cathode 116. Supplying the current into the mixing solution 113 may cause metal ions 125 as well as the metal powder particles 130 to move toward and accumulate on the cathode 116 (e.g., the mandrel 124). In addition, the circulation control device assembly 140 may be arranged to provide mixing and dispersal of the powder 130 within the mixing solution 113. The set of circulation control devices 140 may be configured or arranged to sweep powder 130 that may aggregate near the bottom or in corners of the vessel 110 in an upward direction and toward the cathode 116. In some examples, the set of circulation control devices 140 may produce turbulent flows, circular currents, or other flow characteristics within the mixing solution 113, which ensures the availability of non-agglomerated particles near the cathode 116. It is also understood that the circulation control device assembly 140 may deliver the metal powder particles 130 to the cathode 116, and the powder 130 may accumulate on a surface of the cathode 116 having any surface direction or orientation. In the example shown, a non-horizontal surface 126 of the mandrel 124 is indicated onto which the powder 130 may be delivered by the circulation control device assembly 140. The non-horizontal surface 126 may include a vertical surface, an inclined surface, or a bottom surface of the cathode 116, in non-limiting examples. In this manner, a composite metal layer 150 may be formed on any surface of the mandrel 124 and include the metal powder particles 130 and metal ions 125 from the mixing solution 113. Turning to [Fig. 3], a schematic cross-sectional view is shown of the mandrel 124 and the composite metal layer 150 after electroforming. While the mandrel 124 is illustrated as a solid component, this need not necessarily be the case and the mandrel 124 may also include a hollow portion in some examples. At least the composite metal layer 150 may define a composite electroformed component 160. In some examples, the mandrel 124 may be removed from the composite metal layer 150, e.g., a sacrificial mandrel, to form the composite electroformed component 160. In some examples, the mandrel 124 may remain in place and at least partially define the composite electroformed component 160 with the composite metal layer 150. Additionally, a layer thickness 152 is illustrated for the composite metal layer 150. The layer thickness 152 may be between 0.5 and 10 mm, including between 0.5 and 5 mm, or between 1 and 5 mm, in non-limiting examples. The layer thickness 152 may also be constant or variable over portions of the composite metal layer 150. It is contemplated that the composite metal layer 150 may form a distinct thick electroform, such that it may be used for structural applications. An enlarged portion 162 of the composite electroformed component 160 is illustrated in schematically in [Fig. 4]. The powder 130 is shown dispersed in a metal matrix 154 within the composite electroformed layer 150. The metal matrix 154 may be formed from the metal ions 125 ([Fig. 2]) as described above. The metal matrix may comprise nickel, a nickel alloy (e.g., a nickel-cobalt, nickel-tungsten, or nickel-molybdenum alloy), copper, cobalt, or combinations thereof, in some non-limiting examples. The powder 130 may have an average particle size in a range between 1 and 1000 µm. In some non-limiting examples, the powder 130 may have an average particle size in a range between | and 1000 µm, including between 50 and 500 µm, or between 10 and 50 µm, or between 1 and 20 µm, or between 1 and 10 µm, or between 5 and 10 µm, or between 1 and 5 µm, or between 0.1 and 1 µm. It is also contemplated that the powder 130 may comprise varying particle sizes for improved packing of the powder 130 within the composite metal layer 150. In a non-limiting example, a first subset of the powder 130 may have an average particle size in a range between 500 and 1000 µm, a second subset of the powder 130 may have an average particle size in a range between 50 and 500 µm, and a third subset of the powder 130 may have an average particle size in a range between 1 and 10 µm. While the powder 130 is illustrated with generally spherical or rounded particles, the powder 130 may comprise any suitable geometric profile including fibers, tubes, flakes, sheets, or the like, or combinations thereof. Additionally, in some examples, a volume fraction of the powder 130 in the composite metal layer 150 may be in a range between 30 and 70 volume percent. In some examples, a mass fraction of the powder 130 in the composite metal layer 150 may be in a range between 30 and 70 volume percent. Another difference from the electroforming system 1 is that the metal powder particles 130 may include a coating 170. The coating 170 may include ceramic powder in a non-limiting example. A coating thickness 172 is illustrated for one of the metal powder particles 130. The coating thickness 172 may be in a range between 1 and 100 nm in some examples. The coating 170 may be separately or physically applied to the powder 130 in some examples. The coating 170 may also include a native oxide of controlled thickness grown on the powder particles 130 according to a predetermined temperature or time schedule. In a non-limiting example, the powder 130 may be heat treated in a range between 500 and 600°C for 5 to 10 hours, which grows an oxide layer on the powder 130 to form the coating 170. It is contemplated that the coating 170 may limit or prevent an in- desirable coating of the metal powder 130 with the electrolytic solution 112 ([Fig. 2]). For example, many high strength alloys typically include metals such as aluminum or titanium, which can be highly reactive in aqueous electrolytic solutions. It is recognized that the direct incorporation of aluminum, titanium, or the like into the electrolytic solution 112, e.g., as the powder 130, may generate unwanted ion production within the solution and the resulting electroformed component. The use of the coating 170 in the powder 130 may provide the inclusion of traditional metals in aqueous solution for high strength alloys while preventing unwanted reaction of the metal in solution. Additionally or alternatively, at least a portion of the powder 130 may be provided without any coating 170. In such a case, the powder 130 may comprise metals that are non-reactive or less reactive in aqueous electrolytic environments, including preformed alloys or precipitates with low activity of the active element, e.g., aluminum or titanium, such as Ni3Al or Ni3Ti in some non-limiting examples. For example, if Ni3Al is used for the powder 130, it is understood that Ni3Al is a compound and therefore less chemically reactive with electrolytic solutions compared to other superalloy powders such as MCrAlY. Additionally, at least one heat treatment may be performed on the composite electroformed component 160. The at least one heat treatment may include stress equalization, stress relief, annealing, solution annealing, tempering, age hardening, precipitation hardening, or diffusion, in some non-limiting examples. It is contemplated that the at least one heat treatment may comprise a first heat treatment performed in a first temperature range and a second aging heat treatment performed in a second aging temperature range. The aging heat treatment may be performed subsequent to the first heat treatment. In some examples, the first temperature range may be between 600 and 1200°C. In some examples, the second aging temperature range may be between 500 and 800°C. Turning to [Fig. 5], the enlarged portion 162 of the composite electroformed component 160 is illustrated in a non-limiting example of operation after completion of the first treatment. The first heat treatment may be performed in a temperature range between 600 and 850°C. The first heat treatment may also be performed for a duration of between 1 and 2 hours. In the example shown, the powder 130 remains distributed throughout the metal matrix 154, and the first heat treatment strengthens or improves a metallurgical anchor between the incorporated powder 130 and the metal matrix 154. It is also contemplated that the first high-temperature heat treatment may remove or dissolve the coating 170 (see [Fig.4]) in the metal matrix 154. Additionally or alternatively, a separate coating diffusion heat treatment may be performed on the composite electroformed component 160 for incorporation into the metal matrix 154. In an example where the coating 170 comprises a ceramic, the incorporation of ceramic into the composite metal layer 150 may provide additional strengthening of the composite electroformed component 160. It is understood that, in some examples, the metal powder particles 130 may have a uniform or non-uniform size, geometry, arrangement, distribution, or the like after performing a heat treatment on the composite electroformed component 160. [Fig. 6] illustrates the enlarged portion 162 of the composite electroformed component 160 resulting from a second aging heat treatment following the first heat treatment of [Fig. 5]. The aging heat treatment may be performed in a second aging temperature range between 500 and 800°C. The aging heat treatment may also be performed for a duration of between 5 and 20 hours. It is understood that the aging heat treatment may form precipitates 180 within the composite electroformed component 160. In the illustrated example, the formation of the precipitates 180 may be limited to that within the powder particles 130 and not within the metal matrix 154. It is understood that, in some examples, the metal matrix 154 may dilute the overall chemistry and reduce the driving force for precipitation therein. Limiting the formation of precipitates 180 to the powder particles 130 may preserve the overall strength of the material while circumventing barriers to precipitation within the metal matrix 154 itself. It is further contemplated that the precipitates 180 may comprise second phase fine particles having an average particle size in a range between 10 and 1000 nm in a non-limiting example. In addition, in some examples, the aging heat treatment may be performed once, forming a one-step aging heat treatment, or performed twice to form a two-step aging heat treatment. Turning to [Fig. 7], the enlarged portion 162 of the composite electroformed component 160 is illustrated in another example of operation after completion of the first treatment. In this example, the first heat treatment may be performed in a temperature range between 850 and 1200°C. The first heat treatment may also be performed for a duration of between 1 and 2 hours. In the example shown, the powder 130 and the coating 170 are dissolved and fully incorporated into the metal matrix 154 ([Fig. 4]), which defines a matrix 156 in the form of a homogeneous single-phase matrix in solid solution. It is understood that in another example, where the metal powder particles 130 are not coated, the first heat treatment may dissolve the powder 130 alone into the metal matrix 154 to define the matrix 156. [Fig. 8] illustrates the enlarged portion 162 of the composite electroformed component 160 resulting from a second aging heat treatment following the first heat treatment of [Fig. 7]. The aging heat treatment may be performed in a temperature range between 500 and 800°C. The aging heat treatment may also be performed for a duration of between 5 and 20 hours. It is understood that the aging heat treatment may form precipitates 182 within the composite electroformed component 160. In the illustrated example, the precipitates 182 are distributed throughout the matrix 156. The precipitates 182 may be the same as or different from the precipitates 180 ([Fig. 6]). The precipitates 182 may include second phase fine particles having an average particle size in a range between 10 and 1000 nm in a non-limiting example.Additionally, in some examples, the aging heat treatment may be performed once to define a one-step aging heat treatment, or performed twice to define a two-step aging heat treatment. Referring generally to Figures 5-8, regardless of the temperature range for the first heat treatment or aging heat treatment, it is contemplated that a mean free path (λ) within the composite metal layer 150 after completion of the one or more heat treatments may be in a range between 10 and 350 nm, including between 10 and 200 nm, or between 10 and 100 nm, in certain non-limiting examples. In one example, for homogeneously dispersed particles with substantially no agglomeration, the mean free path λ may be determined by Expression 1 below: Expression 1: , _ M where r = particle size and f = volume fraction of particles. For effective reinforcement in structural applications, it may be desirable for the metal layer 150 to include dispersed layer particles having an appropriate size, volume fraction, and spacing. In a non-limiting example, the metal layer 150 may have a post-heat-treated microstructure such that a mean free path within the metal layer 150 closely conforms to that of a perfectly uniform distribution, with no agglomeration. Further, in an example where the precipitates 180, 182 have a particle size from 0.1 to 0.5 micrometers, the precipitates 180, 182 may self-distribute to form a desired interparticle spacing range, e.g., from 10 to 350 nm. In such a case, post-processing of the composite electroformed component 160 may be minimized because the spacing range is suitable for high strength applications. Still further, it is understood that direct incorporation of powder 130, which contains reinforcing particles, into the blend solution 113 may increase resulting precipitation rates during aging heat treatments. Introduction of powder 130 at concentrations forming the 30-70% volume fraction or the 30-70% mass fraction described above into the composite metal layer 150 may provide an increase in precipitation locations or an increase in driving force for precipitation in the composite metal component 160. Turning now to [Fig. 9], another system 201 for electroforming a component is illustrated in various aspects described herein. System 201 is similar to system 1, 101; therefore, like parts of system 201 will be identified with like numbers further increased by 100, it being understood that the description of like parts of system 1, 101 applies to system 201 unless otherwise indicated. The system 201 includes an electroplating tank 210 (or "tank 210"), an anode 214, a cathode 216 including a mandrel 224, a power source 218, electrical conduits 220, and a switch 222. An electrolytic solution 212 may be provided in the tank 210. A difference from the system 101 is that the system 201 may include a separate dissolution tank 205 (or "tank 205"). The anode 214 may be located in the dissolution tank 205, and the cathode 216 may be located in the tank 210. Metal powder particles 230 may also be suspended in the electrolytic solution 212 to form a mixture solution 213 within the tank 210. At least one conduit may fluidly couple the reservoir 205 and the tank 210. In the illustrated example, a first conduit 207 may provide a first fluid passage between the reservoir 205 and the tank 210, and a second conduit 209 may provide a second fluid passage between the reservoir 205 and the tank 210, although this does not necessarily have to be the case. It is contemplated that a recirculation circuit may be provided in which an electrolytic fluid may circulate between the reservoir 205 and the tank 210 by means of the first and second conduits 207, 209. In another example, a fluid may circulate in one direction from the reservoir 205 to the tank 210, and the tank 210 may have a drain or the like for removal of the fluid therein. Fluid may be supplied continuously, or in individual portions at regular or irregular time intervals, from reservoir 205 to tank 210. In some examples, a filter may be provided in the at least one conduit, e.g., the first conduit 207 or the second conduit 209, to retain the metal powder particles 230 within the electrolyte solution 212 in the tank 210. In such a case, the mixing solution 213 may be contained within the tank 210, and the electrolytic solution 212 may be contained within the reservoir 205. A set of circulation control devices 240 may be provided in the system 201. In the illustrated example, the set of circulation control devices 240 includes first, second, and third circulation control devices 241, 242, 243 that are illustrated in the system 201. Another difference is that the set of circulation control devices 240 may be fluidly coupled to one or both of the reservoir 205 or the tank 210. In the illustrated example, the first circulation control device 241 is located in the reservoir 205, and the second and third circulation control devices 242, 243 are located in the tank 210. In a non-limiting example, the first circulation control device 241 may include a liquid pump configured to circulate a liquid jet 244 through the electrolyte solution 212.The second circulation control device 242 may include an air pump configured to circulate a jet of air 246 through the mixing solution 213. The third circulation control device 243 may include a sonic device configured to emit pressure waves 248 through the mixing solution 213. Additionally or alternatively, a circulation control device having a liquid pump forming a jet of liquid may also be provided in the tank 210. In a non-limiting example of operation, a current may be supplied from the anode 214 in the dissolution tank 205 to the cathode 216 in the electroplating tank 210. The current may cause alloy metal ions 225 to dissolve in the electrolyte solution 212. The electrolyte solution 212 may flow to the tank 210, where the metal powder particles 230 may be dispersed therein to form the mixture solution 213. A composite metal layer 250 may be deposited on the cathode 216. Supplying the current to the mixture solution 213 may cause metal ions 225 as well as the metal powder particles 230 to move toward and accumulate on the cathode 216. The circulation control device assembly 240 may be arranged to provide mixing, agitation, a dispersion or the like for the electrolyte solution 212 and the mixing solution 213.For example, the first circulation control device 241 may provide a uniform dispersion of alloy metal ions 225 within the electrolyte solution 212 upstream of the electroplating tank 210. The second and third cir- control devices. culation 242, 243 may provide mixing and dispersing of the metal powder particles 230 within the mixing solution 213, providing non-agglomerated particles in the region of the cathode 216. For example, the second and third circulation control devices 242, 243 may be configured or arranged to sweep metal powder particles 230 that may aggregate near the bottom or in corners of the vessel 210 in an upward direction and toward the cathode 216. In this manner, the composite metal layer 250 at least partially defining a composite electroformed component may be formed at the cathode 216 as described above. [Fig. 10] is a flowchart illustrating a method 300 of electroforming a component, such as the composite electroformed component 160, 260, according to various aspects described herein. At block 302, the method 300 includes electroforming a composite metal layer, such as the composite metal layer 150, 250, onto a mandrel, such as the mandrel 124, 224, from a mixing solution, such as the mixing solution 113, 213. The mixing solution 113, 213 may include the electrolytic solution 112, 212 with dispersed particles of metal powder, such as the powder 130, 230, therein. The powder 130, 230 may have an average particle size between 0.1 and 1000 µm as described above. Method 300 at block 302 may further include applying a voltage to an electrode, such as cathode 116, 216, in the mixture solution to form the composite metal layer.The composite metal layer may have the metal powder particles embedded within a metal matrix, such as metal matrix 154, and defining a composite electroformed component, such as composite electroformed component 160, 260. The method 300 may include at block 304 performing at least a first heat treatment on the composite electroformed component within a first temperature range of 600 to 1200°C. Optionally, the method may include at block 306 performing an aging heat treatment on the composite electroformed component. The aging heat treatment may be performed within a temperature range of 500 to 800°C. The method 300 may further comprise wherein a coating is provided on the metal powder particles in the mixing solution. Optionally, the first heat treatment may strengthen a metallurgical anchor between the powder 130, 230 and the metal matrix 154 in the composite electroformed component 160, 260. Optionally, the first heat treatment may dissolve the powder 130, 230 in the metal matrix 154 to form a second matrix 156 as a homogeneous single-phase matrix in solid solution. Optionally, the aging heat treatment may form precipitates 180, 182 in the metal powder particles 130, 230. Optionally, the aging heat treatment may form precipitates 180, 182 in the metal matrix 154 or the second matrix 156. Aspects of the present disclosure provide a variety of advantages. Suspending powdered or particulate alloys or superalloys within the electrolyte can provide for the deposition of a composite material on the cathode, preserving the necessary alloying material within the composite material without the need to provide the various alloying elements dissolved within the electroforming bath. In this manner, direct incorporation of the particles, e.g., highly pre-alloyed powders or precipitates created ex-situ, is enabled into the composite electroformed layer. Additionally, the use of circulation control devices can provide a more uniform incorporation of alloy particles at sufficient concentrations within the electroformed layer. Ultrasonic devices and circulation jets can make an abundance of non-agglomerated particles available at the cathode surface. In addition, coating the alloy particles with ceramic powders can prevent unwanted reaction with the surrounding electrolyte and also provide additional strengthening of the finished component. One or more heat treatments of the composite electroformed component can provide dissolution and reprecipitation of the strengthening particles within it. To the extent not already described, the various features and structures of the various embodiments may be used in combination with each other as desired. The fact that a feature cannot be illustrated in all embodiments does not mean that it should be construed that it cannot, but is done for the purpose of brevity of description. Thus, the various features of the different embodiments may be mixed and matched as desired to form new embodiments, whether or not the new embodiments are expressly described. All combinations or permutations of features described herein are covered by this disclosure. This written description uses examples to disclose the disclosure, including the best mode, and also to enable any person skilled in the art to practice the disclosure, including the manufacture and use of any devices or systems and the carrying out of any methods incorporated therein. Other aspects of disclosure are defined by the following clauses: A method of forming a component, the method comprising electroforming a composite metal layer on a mandrel from a mixing solution, the mixing solution comprising an electrolytic solution with particles dispersed metal powder therein having an average particle size between 0.1 and 1000 micrometers, and the composite metal layer having the metal powder particles incorporated within a metal matrix and defining a composite electroformed component, and performing at least a first heat treatment on the composite electroformed component within a first temperature range of 600 to 1200°C. A method of forming a component, the method comprising disposing an electrode defining a mandrel within a mixing solution comprising an electrolytic solution with dispersed particles of metal powder therein having an average particle size between 0.1 and 1000 micrometers, applying a voltage to the electrode in the mixing solution to form a composite metal layer on the electrode, the composite metal layer having the metal powder particles embedded within a metal matrix and defining a composite electroformed component, and performing a first heat treatment on the composite electroformed component within a first temperature range of 600 to 1200°C. A method according to any preceding clause, wherein the metal powder particles comprise at least one of a superalloy, a high strength alloy, nickel, aluminum, titanium, tantalum, niobium, cobalt, phosphorus, molybdenum or steel. A method according to any preceding clause, further comprising performing an aging heat treatment on the composite electroformed component, subsequent to the first heat treatment, within a second temperature range of 500 to 800°C to form precipitates in the composite electroformed component. A method according to any preceding clause, wherein the precipitates are formed within the metal powder particles. A method according to any preceding clause, wherein the first heat treatment dissolves the metal powder particles in the metal matrix to define a second matrix, and wherein the precipitates are formed within the second matrix. A method according to any preceding clause, wherein the precipitates comprise at least one of Ni3AI, Ni3Ta, Ni3Ti, Ni3Nb, Ni3Mo, NiAl, or Ni3Ti. A method according to any preceding clause, wherein the metal powder particles in the mixing solution have a coating comprising at least one of a ceramic or a native oxide of the metal powder particles. A method according to any preceding clause, further comprising forming a coating on the metal powder particles in the mixing solution. A method according to any preceding clause, further comprising growing a native oxide on the metal powder particles to form the coating. A method according to any preceding clause, further comprising heat treating the metal powder particles in a range between 500 and 600°C for 5 to 10 hours to grow the native oxide layer. A method according to any preceding clause, wherein the coating comprises at least one of a ceramic or the native oxide. A method according to any preceding clause, wherein the first heat treatment removes the coating from the metal powder particles and incorporates the coating into the metal matrix. A method according to any preceding clause, further comprising dispersing the metal powder particles within the mixing solution by at least one of: applying pressure waves to the mixing solution, circulating a jet of liquid through the mixing solution, or circulating a jet of air through the mixing solution. A method according to any preceding clause, wherein the mandrel has a non-horizontal surface. A method according to any preceding clause, wherein dispersing further comprises conveying the metal powder particles within the mixing solution to the non-horizontal surface. A method according to any preceding clause, wherein an average particle size of the metal powder particles in the mixing solution is between 0.1 and 20 micrometers. A method according to any preceding clause, wherein the metal powder particles comprise a mass fraction of between 30 and 70% for the composite electroformed component. A method according to any preceding clause, wherein the metal powder particles comprise a volume fraction of between 30 and 70% by volume for the composite electroformed component. A method according to any preceding clause, wherein the metal powder particles have an average particle size which is between 0.1 and 1 micrometer. A method according to any preceding clause, wherein the average particle size is between 1 and 10 micrometers. A method according to any preceding clause, wherein the composite electroformed component comprises a thickness between 0.5 and 10 mm. A method according to any preceding clause, wherein the composite electroformed component comprises a thickness between 0.5 and 5 mm. A method according to any preceding clause, wherein the composite electroformed component comprises a thickness between 1 and 5 mm. A system for electroforming a component, comprising: an electroforming tank; a cathode located within the electroforming tank, a power source electrically coupled to the cathode, and a mixing solution within the electroforming tank comprising an electrolytic solution with dispersed particles of metal powder therein, the metal powder particles having an average particle size between 1,000 and 1,000 micrometers. A system according to any preceding clause, further comprising a coating on at least some of the dispersed particles of metal powder. A system according to any preceding clause, wherein the coating comprises at least one of a ceramic or a native oxide of the metal powder particles. A system according to any preceding clause, wherein the metal powder particles comprise at least one of a superalloy, a high strength alloy, nickel, aluminum, titanium, tantalum, niobium, cobalt, phosphorus, molybdenum or steel. A system according to any preceding clause, further comprising a set of circulation control devices located within the electroforming tank and configured to agitate the mixing solution. A system according to any preceding clause, wherein the set of circulation control devices comprises an ultrasonic device emitting ultrasonic pressure waves into the mixing solution. A system according to any preceding clause, wherein the circulation control device assembly comprises a liquid pump emitting a jet of liquid into the mixing solution. A system according to any preceding clause, wherein the liquid pump comprises a liquid inlet fluidly coupled to at least one of the mixing solution or an external liquid source. A system according to any preceding clause, wherein the circulation control device assembly comprises an air pump emitting a jet of air into the mixing solution. A system according to any preceding clause, wherein the air pump comprises an air inlet fluidly coupled to an air source. A system according to any preceding clause, further comprising a dissolution tank having an anode electrically coupled to the energy source. A system according to any preceding clause, wherein the dissolution tank is fluidly coupled to the electroforming tank by at least one conduit of fluid. A system according to any preceding clause, wherein the mixing solution is contained in the electroforming tank. A system according to any preceding clause, further comprising an anode located within the electroforming tank and spaced from the cathode.

Claims

Demands

1. A method for forming a component, the method comprising: electroforming a composite metal layer on a mandrel from a mixing solution, the mixing solution comprising an electrolytic solution with dispersed metal powder particles within it having an average particle size between 0.1 and 1000 micrometers, and the composite metal layer having the metal powder particles incorporated within a metal matrix and defining a composite electroformed component;and the performance of at least a first heat treatment on the electroformed composite component within a first temperature range of 600 to 1200 °C, and the performance of an aging heat treatment on the electroformed composite component, following the first heat treatment, within a second temperature range of 500 to 800 °C to form precipitates in the electroformed composite component, in which the aging heat treatment forms the precipitates within the metal powder particles.

2. A method according to claim 1, wherein the metal powder particles comprise at least one of a superalloy, a high-strength alloy, nickel, aluminum, titanium, tantalum, niobium, cobalt, phosphorus, molybdenum, or steel

3. A method according to any one of claims 1 to 2, wherein the metal powder particles in the mixing solution have a coating comprising at least one of a ceramic or a native oxide of the metal powder particles.

4. A method according to claim 3, further comprising growing the native oxide on the metal powder particles to form the coating.

5. A method according to any one of claims 1 to 4, further comprising dispersing the metal powder particles within the mixing solution by at least one of: applying pressure waves to the mixing solution, circulating a liquid jet through the mixing solution, or circulating an air jet through the mixing solution. 22

6. A method according to claim 5, wherein the dispersion further comprises conveying the metal powder particles within the mixing solution to a non-horizontal surface of the mandrel.

7. A method according to any one of claims 1 to 6, wherein the electroformed composite component comprises a thickness between 0.5 and 10 mm.